Semiconductor wafer carrier fixing clamp and operation method thereof
By designing semiconductor wafer carrier fixing fixtures, using plug-in fixing components and high-purity graphite silicon carbide coatings, the problem of silicon carbide carrier fracture is solved, extending service life and reducing costs, and achieving simple structure and operation Convenient and low cost effect.
Patent Information
- Application Number
- CN202411270746.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-11
- Publication Date
- 2025-01-14
AI Technical Summary
In the prior art, silicon carbide-like silicon wafer carriers are prone to breakage, resulting in dropping of silicon wafers or damage to the arms, increasing production costs and product scrapping rates, and high-purity graphite fixtures are expensive to manufacture and have a long delivery time.
Design a semiconductor wafer vehicle fixing fixture, including the top plate, the bottom plate and the semicircular support column. The support column is equipped with an insert-in-mount fixing fixture assembly at the break of the support column. The support column is fixed through the groove fixing block and the insert plate, and the support column is fixed with high purity. Graphite and silicon carbide coatings are grown by CVD process to improve strength and purity.
It extends the service life of the silicon wafer boat, reduces corporate costs, and achieves the effects of simple structure, convenient operation and low cost.
Smart Images
Figure CN119314915A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of silicon wafer carrier tooling, and in particular to a semiconductor wafer carrier fixing fixture and an operating method thereof. Background Art
[0002] The silicon wafer carrier used in the vertical LPCVD furnace tube equipment is called a boat. Its material is divided into two types: quartz and silicon carbide. Our company uses silicon carbide. Silicon carbide is hard but brittle and easily breaks when hit.
[0003] The boat has three support columns. When one of the support columns breaks at a certain position, most of the time it happens at the bottom of the middle support column, it will be displaced and no longer in a vertical state. In this case, if the boat is continued to be used, the silicon wafers will easily fall off the boat during production, or be inserted obliquely and stacked, which will cause a large number of products to be scrapped. In addition, when the ceramic arm comes to take the silicon wafer in the oblique insertion state, it will collide, and in severe cases, it will cause the arm to break.
[0004] Since the semiconductor industry has strict requirements on the content of metal impurities and the use environment is high temperature and full of corrosive gases, the fixture material uses high-purity graphite as the aggregate, and then grows a layer of silicon carbide coating through the CVD process. In this way, the strength and purity of the fixture are guaranteed. Therefore, the manufacturing cost of silicon carbide boats is high, and the purchase delivery time is long. If it is scrapped after breaking, on the one hand, the direct loss is huge, and on the other hand, production is delayed. Summary of the invention
[0005] The present invention mainly solves the deficiencies in the prior art and provides a semiconductor wafer carrier fixing fixture and an operating method thereof, which has the advantages of simple structure, convenient operation, time-saving, labor-saving and low cost. By fixing the broken part of the support column in the silicon wafer boat, the silicon wafer boat that was originally prepared to be scrapped can be restored to its usable value, thereby extending the service life of the silicon wafer boat and reducing enterprise costs.
[0006] The above technical problems of the present invention are mainly solved by the following technical solutions: A semiconductor wafer carrier fixing fixture comprises a top plate and a bottom plate, both of which are provided with ventilation holes, a plurality of semicircularly distributed support columns are provided between the top plate and the bottom plate, a plurality of wafer slots are provided on the support columns at equal intervals, and a semicircular support ring is provided between adjacent support columns. A fixing fixture assembly is provided at the broken part of the support column, and the fixing fixture assembly comprises a groove fixing block.
[0007] Preferably, a pair of slots are provided on the inner side of the front end of the groove fixing block, and plugging plates are provided in the slots to be plugged and fixed to the groove fixing block.
[0008] An operating method for a semiconductor wafer carrier fixing fixture comprises the following operating steps: Step 1: When the lower end of the support column is disconnected near the bottom plate.
[0009] Step 2: Insert the groove fixing block into the broken support column, and fix the support column by inserting the plug plate into the slot.
[0010] Step 3: Place the semiconductor wafer into the repaired silicon wafer boat and insert the semiconductor wafer into the wafer slot.
[0011] Step 4: The silicon wafer boat with the semiconductor wafer is placed into the vertical LPCVD furnace tube equipment for low pressure chemical vapor deposition process.
[0012] As a preferred choice, since the semiconductor industry has strict requirements on the content of metal impurities and the operating environment is high temperature and filled with corrosive gases, high-purity graphite is used as the aggregate for the groove fixing block and the plug-in plate, and then a layer of silicon carbide coating is grown through the CVD process to ensure the strength and purity of the fixture.
[0013] Preferably, no semiconductor wafer is placed at the location where the groove fixing block fixes the support column.
[0014] The present invention can achieve the following effects: The present invention provides a semiconductor wafer carrier fixing fixture and an operation method thereof, which has the advantages of simple structure, convenient operation, time-saving, labor-saving and low cost compared with the prior art. By fixing the broken part of the support column in the silicon wafer boat, the silicon wafer boat that was originally prepared to be scrapped can be restored to its usable value, thereby extending the service life of the silicon wafer boat and reducing enterprise costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a structural schematic diagram of the present invention.
[0016] Figure 2 It is a structural schematic diagram of the fixing fixture assembly of the present invention.
[0017] In the figure: support column 1, top plate 2, wafer slot 3, semicircular support ring 4, fixing fixture assembly 5, vent 6, bottom plate 7, groove fixing block 8, slot 9, plug-in plate 10. DETAILED DESCRIPTION
[0018] The technical solution of the invention is further specifically described below through embodiments and in conjunction with the accompanying drawings.
[0019] Example: Figure 1 and Figure 2As shown, a semiconductor wafer carrier fixing fixture comprises a top plate 2 and a bottom plate 7, both of which are provided with vent holes 6, three semicircularly distributed support columns 1 are provided between the top plate 2 and the bottom plate 7, 50 wafer slots 3 are provided on the support columns 1 and are distributed at equal intervals, and a semicircular support ring 4 is provided between adjacent support columns 1. A fixing fixture assembly 5 is provided at the fracture of the support column 1, which is plugged and fixed with the support column 1, and the fixing fixture assembly 5 comprises a groove fixing block 8. A pair of slots 9 are provided on the inner side of the front end of the groove fixing block 8, and a plug-in plate 10 is provided in the slot 9 to be plugged and fixed with the groove fixing block 8. No semiconductor wafer is placed at the place where the groove fixing block 8 fixes the support column 1. Since the semiconductor industry has strict requirements on the content of impurities such as metals, and the use environment is high temperature and full of corrosive gases, the groove fixing block 8 and the plug-in plate 10 are both made of high-purity graphite as aggregate, and then a layer of silicon carbide coating is grown by CVD process to ensure the strength and purity of the fixture.
[0020] An operating method for a semiconductor wafer carrier fixing fixture comprises the following operating steps: Step 1: When the lower end of the support column 1 is disconnected near the bottom plate 7.
[0021] Step 2: Insert the groove fixing block 8 into the broken support column 1, and insert the insert plate 10 into the slot 9 to fix the support column 1.
[0022] Step 3: Place the semiconductor wafer into the repaired silicon wafer boat and insert the semiconductor wafer into the wafer slot 3.
[0023] Step 4: The silicon wafer boat with the semiconductor wafer is placed into the vertical LPCVD furnace tube equipment for low pressure chemical vapor deposition process.
[0024] In summary, the semiconductor wafer carrier fixing fixture and the operation method thereof have the advantages of simple structure, convenient operation, time-saving, labor-saving and low cost. By fixing the broken part of the support column in the silicon wafer boat, the silicon wafer boat that was originally prepared to be scrapped can be restored to its usable value, thereby extending the service life of the silicon wafer boat and reducing enterprise costs.
[0025] The above description is only a specific embodiment of the present invention, but the structural features of the present invention are not limited thereto. Any changes or modifications made by any technician in the field of the present invention are included in the patent scope of the present invention.
Claims
1. A semiconductor wafer carrier fixing fixture, characterized in that: The invention comprises a top plate (2) and a bottom plate (7), wherein the top plate (2) and the bottom plate (7) are both provided with ventilation holes (6), a plurality of support columns (1) distributed in a semicircular shape are provided between the top plate (2) and the bottom plate (7), a plurality of wafer slots (3) distributed in an equidistant manner are provided on the support columns (1), and a semicircular support ring (4) is provided between adjacent support columns (1); a fixing fixture assembly (5) which is plug-in-socket-sleeved and fixed to the support column (1) is provided at the fracture of the support column (1), and the fixing fixture assembly (5) comprises a groove fixing block (8).
2. The semiconductor wafer carrier fixing fixture according to claim 1, characterized in that: A pair of slots (9) are provided on the inner side of the front end of the groove fixing block (8), and a plug plate (10) is provided in the slot (9) and is plugged and fixed to the groove fixing block (8).
3. A method for operating a semiconductor wafer carrier fixing fixture according to claim 2, characterized in that The steps are as follows: Step 1: When the lower end of the support column (1) is disconnected near the bottom plate (7); Step 2: insert the groove fixing block (8) into the broken support column (1), and insert the insert plate (10) into the slot (9) to fix the support column (1); Step 3: placing the semiconductor wafer into the repaired silicon wafer boat and inserting the semiconductor wafer into the wafer slot (3); Step 4: The silicon wafer boat with the semiconductor wafer is placed into the vertical LPCVD furnace tube equipment for low pressure chemical vapor deposition process.
4. The method for operating the semiconductor wafer carrier fixing fixture according to claim 3, characterized in that: Since the semiconductor industry has strict requirements on the content of metal impurities and the use environment is high temperature and filled with corrosive gases, the groove fixing block (8) and the plug plate (10) are both made of high-purity graphite as aggregate, and then a layer of silicon carbide coating is grown through the CVD process to ensure the strength and purity of the fixture.
5. The method for operating the semiconductor wafer carrier fixing fixture according to claim 3, characterized in that: The semiconductor wafer is not placed at the location where the groove fixing block (8) fixes the support column (1).