Pickup equipment with angle adjusting function for chip assembly calibration

By designing chip pickup equipment with angle adjustment function, using components such as processing tables, T-plates and electric telescopic rods, the chip is automatically picked up and calibrated, solving the problem of large manual labor load in the traditional process, and improving efficiency and Adapt to different motherboard specifications.

CN119314937AInactive Publication Date: 2025-01-14恩纳基智能装备(无锡)股份有限公司
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Patent Information

Application Number
CN202411839752.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-13
Publication Date
2025-01-14
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The pick-up and calibration process of traditional chips is cumbersome, resulting in a large labor load.

Method used

A pickup device with angle adjustment function is designed, including a processing table, T-plate, electric telescopic rod, vacuum pump, isometric delivery mechanism and angle switching mechanism. Through the coordinated cooperation of these components, the automatic pickup of the chip is achieved. , position adjustment and installation to reduce manual operation.

Benefits of technology

It realizes automatic pick-up and calibration of the chip, reduces manual labor load, improves work efficiency, and supports the adaptation of different motherboard heights and specifications.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses pickup equipment with an angle adjusting function for chip assembly calibration, and relates to the technical field of chip assembly processing. The pickup equipment comprises a processing table and a T-shaped plate, and the T-shaped plate is fixedly arranged on the rear side of the processing table. According to the pick-up equipment with the angle adjusting function for chip assembly and calibration, an equidistant material delivering mechanism, an unobstructed unfolding mechanism and a corner transposition mechanism are arranged among a processing table, a T-shaped plate and a first electric telescopic rod, so that the device can synchronously pick up chips and place the chips at specified positions through double stations; a plurality of chips can be intermittently and equidistantly fed through the cooperation of an equidistant material delivering mechanism, an unimpeded unfolding mechanism and a corner transposition mechanism, and a plurality of groups of vertical supporting plates cannot influence the ordered adsorption feeding of the chips during the feeding period by automatically retracting the supporting plates; and synchronously switching the positions of the station for adsorbing the chip and the station for installing and placing the chip.
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Description

Technical Field

[0001] The invention relates to the technical field of chip assembly and processing, and in particular to a pickup device with an angle adjustment function for chip assembly calibration. Background Art

[0002] Chip, also known as microcircuit, microchip, integrated circuit, refers to a silicon wafer containing an integrated circuit. It is very small and is often a part of a computer or other electronic device. Chips are usually installed on a circuit board for collaborative work. In order to fix the chip on the circuit board, it is inevitable to pick up the chip. Traditional operators mostly use chip grabbers to manually grab the chip.

[0003] Although the existing grasping method can place the chip in a designated position on the motherboard for fixed installation, the inevitable reciprocating manual grasping and calibration position will bring a large labor burden to the human body. In order to avoid such problems, a picking device with an angle adjustment function for chip assembly calibration is proposed to solve the existing problems. Summary of the invention

[0004] In view of the deficiencies of the prior art, the present invention provides a picking device with an angle adjustment function for chip assembly calibration, which solves the problem that the pre-chip installation picking process is relatively cumbersome and causes a high manual labor load.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: a picking device with angle adjustment function for chip assembly calibration, comprising a processing table and a T-plate, wherein the T-plate is fixedly arranged on the rear side of the processing table, a first electric telescopic rod is fixedly arranged on the front side of the T-plate through a bracket, and a sleeve is rotatably arranged at the bottom of the extended end of the first electric telescopic rod through a bearing, a handle pad is fixedly connected to the bottom of the sleeve, a vacuum pump is fixedly installed on both sides of the top of the handle pad, a picking air pipe is connected to the adsorption end of the vacuum pump, a mounting table is slidably arranged on the top of the processing table, a mainboard mold frame is installed on the top of the mounting table through bolts, an equidistant material delivery mechanism is commonly arranged on the processing table and the picking air pipe, The equidistant material delivery mechanism includes a slide plate, the slide plate is fixedly arranged at the bottom of the processing table, a T-shaped slider is slidably arranged on the front side of the slide plate, a column is fixedly connected to the front side of the T-shaped slider, a placement frame is fixedly connected to the top of the column, and the top of the placement frame extends to the top of the processing table, a plurality of support plates are slidably arranged on both sides of the placement frame from top to bottom through slide slots, chips are placed together on the tops of two support plates at the same height, a first limiting sleeve is slidably arranged at the bottom of the processing table, a first limiting rod is slidably connected to the inside of the first limiting sleeve, a first return spring is fixedly connected between the first limiting rod and the first limiting sleeve, the bottom end of the first limiting rod is fixedly connected to a slide plate through a bracket, and one side of the slide plate is fixed The cam is fixedly connected to the mounting shell, and a seesaw is rotatably arranged inside the mounting shell. Several top blocks used in conjunction with the seesaw are equidistantly fixedly arranged on one side of the column. An L-shaped force-bearing rod is fixedly connected to the other side of the slide plate, and the L-shaped force-bearing rod extends to the top of the processing table. A pressure rod used in conjunction with the L-shaped force-bearing rod is fixedly connected to the surface of the pickup air pipe. A second limiting sleeve is fixedly connected to both sides of the rear side of the T-shaped slide block, and a second limiting rod is slidably connected to the inside of the second limiting sleeve. A third return spring is fixedly connected between the second limiting rod and the second limiting sleeve. Positioning grooves used in conjunction with the second limiting rod are provided on both sides of the front side of the slide plate, and several positioning grooves are equidistantly arranged vertically. The first electric telescopic rod and the T-plate The two ends of the first electric telescopic rod are provided with an angle conversion mechanism, and the angle conversion mechanism includes a storage sleeve, and the storage sleeve is fixedly arranged on one side of the extension end of the first electric telescopic rod through a U-shaped oblique frame, and the interior of the storage sleeve is slidably connected with a toothed plate, and a first spring is fixedly connected between the toothed plate and the storage sleeve, and a rotating shaft is rotatably arranged on the surface of the U-shaped oblique frame through a bracket and a bearing, and a gear meshing with the toothed plate is fixedly connected on the surface of the rotating shaft, and one end of the rotating shaft is rotatably arranged with a first bevel gear through a bearing, and a second bevel gear meshing with the first bevel gear is fixedly connected on the surface of the sleeve, and a blocking plate used in combination with the toothed plate is fixedly connected to the front side of the T-plate, and a non-return mechanism is arranged between the sleeve and the extension end of the first electric telescopic rod,A one-way linkage mechanism is provided between the rotating shaft and the first bevel gear.

[0006] Preferably, a plurality of reset sleeves used in conjunction with the support plate are fixedly connected on both sides of the placement frame from top to bottom, a reset rod is slidably connected inside the reset sleeve, a fourth reset spring is fixedly connected between the reset rod and the reset sleeve, one end of the reset rod is fixedly connected to the bottom of the support plate through a connecting block, bending limit plates are fixedly provided on both sides of the inner cavity of the processing table, and a drag reduction roller used in conjunction with the bending limit plate is provided on one side of the support plate through a slotted rotation.

[0007] Preferably, a sliding groove is provided at the bottom of the processing table, a sliding block is slidably connected inside the sliding groove, the bottom of the sliding block is fixedly connected to the top of the first limiting sleeve, and a second return spring is fixedly connected between the sliding block and the sliding groove.

[0008] Preferably, the anti-reverse mechanism includes an installation box, two of which are provided and fixedly arranged on both sides of the inner cavity of the sleeve, respectively, an anti-reverse bevel block is slidably connected inside the installation box, a second spring is fixedly connected between the anti-reverse bevel block and the installation box, and anti-reverse grooves for use with the anti-reverse bevel block are provided on both sides of the extending end of the first electric telescopic rod.

[0009] Preferably, the one-way linkage mechanism includes a short bevel block, and a plurality of the short bevel blocks are provided, and the plurality of short bevel blocks are equidistantly and fixedly arranged on the surface of the rotating shaft; a plurality of movable sliding grooves are equidistantly arranged on the inner wall of the first bevel gear; a long bevel block used in conjunction with the short bevel block is slidably connected inside the movable sliding groove; a third spring is fixedly connected between the long bevel block and the movable sliding groove.

[0010] Preferably, a displacement groove is provided on the top of the processing table, a movable plate is slidably arranged inside the displacement groove, a threaded rod is threadedly connected to the movable plate through a threaded through groove, and the top of the threaded rod is fixedly connected to the bottom of the mounting table through a bearing.

[0011] Preferably, a sliding rod is fixedly connected to the bottom of the mounting table, and one end of the sliding rod passes through and extends to the bottom of the movable plate, a sliding hole slidably adapted to the sliding rod is opened on the top of the movable plate, and a second electric telescopic rod is fixedly connected to the bottom of the processing table, and an extending end of the second electric telescopic rod is fixedly connected to one side of the movable plate.

[0012] Preferably, cameras are installed on both sides of the bottom of the handle pad.

[0013] The present invention provides a pick-up device with angle adjustment function for chip assembly calibration. Compared with the existing technology, it has the following beneficial effects: (1) The pick-up device with angle adjustment function for chip assembly calibration is provided with an equidistant material delivery mechanism, an unobstructed unfolding mechanism and an angle shifting mechanism between the processing table, the T-plate and the first electric telescopic rod, so that the device can simultaneously pick up and place the chips at the specified position through the double stations, and can also intermittently and equidistantly load a plurality of chips through the coordinated cooperation of the equidistant material delivery mechanism, the unobstructed unfolding mechanism and the angle shifting mechanism, and automatically retract the pallet to ensure that a plurality of vertical pallet groups will not affect the orderly adsorption and loading of the chips during loading, and simultaneously reset the adsorption station and synchronously switch the positions of the chip adsorption station and the chip installation and placement station, so that the chip installation and placement and material loading and adsorption can be carried out synchronously and continuously, thereby reducing the manual labor load and improving work efficiency.

[0014] (2) The pick-up device with angle adjustment function for chip assembly calibration has a sliding groove, a sliding block and a second reset spring arranged at the bottom of the processing table to be used in conjunction with the first limiting sleeve, so that the first limiting sleeve can drive the sliding plate and the seesaw to move left, so as to subsequently perform the original reset of the placement frame for reloading the chips.

[0015] (3) The picking device with angle adjustment function for chip assembly calibration has a threaded rod arranged between the mounting table and the movable plate, so that the mounting table is easy to adjust in height, so that the mounting heights of different motherboards can be adjusted to be consistent with the chip adsorption height, so that adsorption and placement installation can be performed simultaneously, and the motherboard mold frame is installed on the top of the mounting table by bolts, so that the motherboard mold frame is easy to disassemble and replace, so that motherboard mold frames of different specifications can be replaced to adapt to motherboards of different specifications.

[0016] (4) The pick-up device with angle adjustment function for chip assembly calibration is configured with a second electric telescopic rod between the processing table and the movable plate, so that the movable plate and the mounting table can be easily adjusted laterally, so as to calibrate the chip position of the motherboard placed inside the motherboard mold frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the external structure of the present invention; Figure 2 It is a rear view of the first electric telescopic rod structure of the present invention; Figure 3 is a cross-sectional view of the processing table structure of the present invention; Figure 4 For the present invention Figure 3 A partial enlarged view of the middle A; Figure 5 It is a side view of the T-shaped slider structure of the present invention; Figure 6 It is an expanded view of the internal structure of the second limiting sleeve of the present invention; Figure 7 For the present invention Figure 3 A partial enlarged view of point B in the middle; Figure 8 It is a side view of the internal structure of the storage sleeve of the present invention; Fig. 9 It is a side view of the internal structure of the first bevel gear of the present invention; Fig.10 For the present invention Fig. 9 A partial enlarged view of point C in the middle; Fig.11 is a cross-sectional view of the sleeve structure of the present invention; Fig.12 A top view of the internal structure of the sleeve of the present invention; Fig.13 It is a cross-sectional view of the movable plate structure of the present invention.

[0018] In the figure: 1, processing table; 2, T-type plate; 3, first electric telescopic rod; 4, sleeve; 5, pad with handle; 6, vacuum pump; 7, pick up air pipe; 8, equidistant material delivery mechanism; 9, corner transposition mechanism; 10, installation table; 11, main board mold frame; 12, displacement groove; 13, movable plate; 14, threaded rod; 15, slide rod; 16, slide hole; 17, second electric telescopic rod; 18, camera; 801, slide plate; 802, T-type slider; 803, column; 804, placement frame; 805, support plate; 806, first limit sleeve; 807, first limit rod; 808, first reset spring; 809, slide plate; 810, installation shell; 811, seesaw; 812, L-type force rod; 813, pressure rod; 814, third reset spring; 815, positioning groove; 816, reset sleeve; 817, second limit rod; 818, reset rod; 819, fourth reset spring; 820, bending limit plate; 821, drag reduction roller; 822, sliding groove; 823, sliding block; 824, second reset spring; 825, chip; 826, top block; 827, second limit sleeve; 901, storage sleeve; 902, U-shaped inclined frame; 903, tooth plate; 904, first spring; 905 , rotating shaft; 906, gear; 907, first bevel gear; 908, second bevel gear; 909, blocking plate; 910, anti-return mechanism; 911, one-way linkage mechanism; 9101, mounting box; 9102, anti-return inclined plane block; 9103, second spring; 9104, anti-return slot; 9111, short bevel block; 9112, movable slide slot; 9113, long bevel block; 9114, third spring. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0020] See also Figure 1-Figure 13The present invention provides a technical solution: comprising a processing table 1 and a T-plate 2, wherein the T-plate 2 is fixedly arranged on the rear side of the processing table 1, and a first electric telescopic rod 3 is fixedly arranged on the front side of the T-plate 2 through a bracket. As a detailed explanation, the stroke of the first electric telescopic rod 3 is controlled by a PLC, and a sleeve 4 is rotatably arranged at the bottom of the extension end of the first electric telescopic rod 3 through a bearing, and a handle pad 5 is fixedly connected to the bottom of the sleeve 4, and a vacuum pump 6 is fixedly installed on both sides of the top of the handle pad 5, and the suction end of the vacuum pump 6 is connected to a pickup air pipe 7, which is a hard pipe, and a rubber ring pad is arranged at the end of the pipe. A mounting table 10 is slidably arranged on the top of the processing table 1, and a mainboard mold frame 11 is installed on the top of the mounting table 10 by bolts. As a detailed explanation, the mainboard mold frame 11 is used to adapt to and place different PCB mainboards, and the mainboard mold frame 11 can be disassembled and replaced by bolts. A plurality of threaded grooves are provided on the top of the mounting table 10 for installing the mainboard mold frame 11 at different front and rear positions; Furthermore, in order to facilitate the adjustment of the mainboard installation position and the replacement of mainboard mold frames 11 of different specifications, a displacement groove 12 is provided on the top of the processing table 1, and a movable plate 13 is slidably arranged inside the displacement groove 12. A threaded rod 14 is threadedly connected to the inside of the movable plate 13 through a threaded through groove. The top of the threaded rod 14 is fixedly connected to the bottom of the mounting table 10 through a bearing. A sliding rod 15 is fixedly connected to the bottom of the mounting table 10, and one end of the sliding rod 15 passes through and extends to the bottom of the movable plate 13. A sliding hole 16 that is slidably adapted to the sliding rod 15 is provided on the top of the movable plate 13. A second electric telescopic rod 17 is fixedly connected to the bottom of the processing table 1, and an extending end of the second electric telescopic rod 17 is fixedly connected to one side of the movable plate 13.

[0021] Cameras 18 are installed on both sides of the bottom of the handle pad 5, where the cameras 18 are used for subsequent visual inspection to detect whether the installation positions of the chip and the PCB are accurate. If there is any skewness or eccentricity, it can be discovered immediately and replaced, which is convenient for the subsequent calibration of the PCB board position and the replacement of the matching mold.

[0022] As a preferred embodiment, in order to facilitate the equidistant transmission and loading of the chip 825, an equidistant material delivery mechanism 8 is provided on the processing table 1 and the picking air pipe 7. The equidistant material delivery mechanism 8 includes a slide plate 801, the slide plate 801 is fixedly arranged at the bottom of the processing table 1, and a T-shaped slider 802 is slidably arranged on the front side of the slide plate 801. The front side of the T-shaped slider 802 is fixedly connected to a column 803, and the top of the column 803 is fixedly connected to a placement frame 804, and the top of the placement frame 804 extends to the top of the processing table 1. The two sides of the placement frame 804 are self- A plurality of support plates 805 are slidably arranged from top to bottom through the opening of the slide groove, and a plurality of support plates 805 are equidistantly arranged vertically, and a chip 825 is placed on the top of two support plates 805 at the same height, and a first limiting sleeve 806 is slidably arranged at the bottom of the processing table 1, and a first limiting rod 807 is slidably connected inside the first limiting sleeve 806, and a first return spring 808 is fixedly connected between the first limiting rod 807 and the first limiting sleeve 806, and a slide plate 809 is fixedly connected to the bottom end of the first limiting rod 807 through a bracket, and one side of the slide plate 809 The side of the column 803 is fixedly connected with a mounting shell 810, and a seesaw 811 is rotatably arranged inside the mounting shell 810. A plurality of top blocks 826 used in conjunction with the seesaw 811 are fixedly arranged at equal intervals on one side of the column 803. The other side of the slide plate 809 is fixedly connected with an L-shaped force rod 812, and the L-shaped force rod 812 extends to the top of the processing table 1. The surface of the picking air pipe 7 is fixedly connected with a pressure rod 813 used in conjunction with the L-shaped force rod 812. The two sides of the rear side of the T-shaped slide block 802 are fixedly connected with a second limiting sleeve 827. The second limiting sleeve 8 27 is internally slidably connected with a second limiting rod 817, and a third return spring 814 is fixedly connected between the second limiting rod 817 and the second limiting sleeve 827. Both sides of the front side of the slide plate 801 are provided with positioning grooves 815 used in conjunction with the second limiting rod 817, and a plurality of positioning grooves 815 are vertically equidistantly arranged. As a detailed explanation: the placement frame 804 is made of lightweight plastic, the first return spring 808 is stronger than the third return spring 814, and a horizontal pull groove matching the L-shaped force rod 812 is provided on one side of the processing table 1; In order to prevent the support plate 805 from affecting the subsequent adsorption action of the chip 825, a plurality of reset sleeves 816 used in conjunction with the support plate 805 are fixedly connected on both sides of the placement frame 804 from top to bottom. A reset rod 818 is slidably connected inside the reset sleeve 816. A fourth reset spring 819 is fixedly connected between the reset rod 818 and the reset sleeve 816. One end of the reset rod 818 is fixedly connected to the bottom of the support plate 805 through a connecting block. Bending limit plates 818 are fixedly arranged on both sides of the inner cavity of the processing table 1. 20. The top of the bending limit plate 820 is arranged as an inclined surface to provide space for the lateral outward movement of the support plate 805. A drag reduction roller 821 matched with the bending limit plate 820 is arranged on one side of the support plate 805 through a slotted rotation. A sliding groove 822 is arranged at the bottom of the processing table 1. A sliding block 823 is slidably connected inside the sliding groove 822. The bottom of the sliding block 823 is fixedly connected to the top of the first limiting sleeve 806. A second return spring 824 is fixedly connected between the sliding block 823 and the sliding groove 822.

[0023] As a preferred embodiment, in order to facilitate the position interchange of the pickup air pipe 7 of the adsorption chip 825 and the pickup air pipe 7 after unloading, a rotation angle switching mechanism 9 is commonly provided on the first electric telescopic rod 3 and the T-shaped plate 2, and the rotation angle switching mechanism 9 comprises a storage sleeve 901, and the storage sleeve 901 is fixedly provided on one side of the extension end of the first electric telescopic rod 3 through a U-shaped inclined frame 902, and the interior of the storage sleeve 901 is slidably connected with a tooth plate 903, and a first spring 904 is fixedly connected between the tooth plate 903 and the storage sleeve 901, and a rotating shaft 905 is rotatably provided on the surface of the U-shaped inclined frame 902 through a bracket and a bearing. To explain in detail: the bracket connected to the rotating shaft 905 is a double L-shaped special-shaped bent bracket, the surface of the rotating shaft 905 is fixedly connected with a gear 906 meshing with the tooth plate 903, one end of the rotating shaft 905 is rotatably provided with a first bevel gear 907, the surface of the sleeve 4 is fixedly connected with a second bevel gear 908 meshing with the first bevel gear 907, the front side of the T-plate 2 is fixedly connected with a blocking plate 909 used in conjunction with the tooth plate 903, a non-return mechanism 910 is provided between the sleeve 4 and the extending end of the first electric telescopic rod 3, and a one-way linkage mechanism 911 is provided between the rotating shaft 905 and the first bevel gear 907.

[0024] As a detailed description, the anti-reverse mechanism 910 includes an installation box 9101, two installation boxes 9101 are provided, and the two installation boxes 9101 are respectively fixedly arranged on both sides of the inner cavity of the sleeve 4, and the interior of the installation box 9101 is slidably connected with an anti-reverse inclined surface block 9102, and the surface of the anti-reverse inclined surface block 9102 is provided with a single-sided inclined surface, and a second spring 9103 is fixedly connected between the anti-reverse inclined surface block 9102 and the installation box 9101, and both sides of the extending end of the first electric telescopic rod 3 are provided with a matching anti-reverse inclined surface block 9102. The anti-return slot 9104 used in the sleeve, the one-way linkage mechanism 911 includes a short bevel block 9111, and a plurality of short bevel blocks 9111 are provided, and the plurality of short bevel blocks 9111 are equidistantly fixedly arranged on the surface of the rotating shaft 905, and a plurality of movable slide grooves 9112 are equidistantly arranged on the inner wall of the first bevel gear 907, and the movable slide groove 9112 is internally slidably connected with a long bevel block 9113 used in conjunction with the short bevel block 9111, and a third spring 9114 is fixedly connected between the long bevel block 9113 and the movable slide groove 9112.

[0025] The specific implementation is as follows: Step 1: Pick up chip 825: Figure 1 , Figure 3 and Figure 4 As shown, the first electric telescopic rod 3 is started, and the extended end of the first electric telescopic rod 3 drives the sleeve 4 and the handle pad 5 to descend, and the handle pad 5 drives the two picking air pipes 7 to descend, and the picking air pipe 7 descends and drives the pressure rod 813 to descend, prompting the pressure rod 813 to press the L-shaped force rod 812 in advance, and the L-shaped force rod 812 is forced to drive the slide plate 809 and the seesaw 811 to descend, and the seesaw 811 is blocked by the top block 826 when it descends and then flips, until the seesaw 811 and the top block 826 are staggered and are at the bottom of the uppermost top block 826, when the pressure rod 813 is lowered into place, the corresponding left picking air pipe 7 is at the top of the top support plate 805, and then the vacuum pump 6 is started to prompt the left picking air pipe 7 to adsorb the chip 825; Step 2: Workstation replacement: Figure 1 , Figure 8 , Fig. 9 , Fig.10As shown, the first electric telescopic rod 3 is started, causing the extended end of the first electric telescopic rod 3 to retract, and the retraction of the first electric telescopic rod 3 drives the sleeve 4, the storage sleeve 901 and the toothed plate 903 to rise. The toothed plate 903 will be blocked by the blocking plate 909 after rising for a certain distance, and then the toothed plate 903 is squeezed, and the toothed plate 903 is gradually retracted to the inside of the storage sleeve 901 due to the meshing of the toothed plate 903 with the gear 906, the gear 906 will drive the rotating shaft 905 to rotate, and the rotating shaft 905 rotates through the fit of the plane side of the short bevel block 9111 and the long bevel block 9113, so as to cause the first bevel gear 907 to rotate synchronously, and the rotation of the first bevel gear 907 will mesh with the second bevel gear 908. After the toothed plate 903 retracts to the limit, the second bevel gear 908 drives the sleeve 4, the handle pad 5 and the picking air pipe 7 to rotate 180 degrees to complete the position conversion; After the positions of the corresponding two picking air pipes 7 are changed through the upward and retracting linkage of the extended end of the first electric telescopic rod 3, since the L-shaped force-bearing rod 812 loses the downward pressure of the pressure rod 813, the L-shaped force-bearing rod 812 is pulled up and reset through the elastic cooperation of the first limiting sleeve 806, the first limiting rod 807 and the first reset spring 808, and the sliding plate 809 rises and resets to drive the seesaw 811 to lift the bottom of the top top block 826, and the top block 826 drives the placement frame 804 to rise, so that the second-layer pallet 805 synchronously carries the chip 825 to replace the position of the chip 825 on the first-layer pallet 805; Figure 7 As shown, the pallet 805 is automatically unfolded: when the second-layer pallet 805 replaces the first-layer pallet 805 loading position, the first-layer pallet 805 will be out of the interception limit range of the two bending limit plates 820, so during the rise of the first-layer pallet 805, it will be pushed out by the elasticity of the reset rod 818 and the fourth reset spring 819, and move to the outside of the placement frame 804, thereby automatically unblocking the subsequent adsorption loading surface of the chip 825; Step 3: Adsorption of chip 825 and docking of chip 825 with the PCB mainboard installation position: Before installing the right chip 825, place the PCB mainboard into the mainboard mold frame 11 in advance, and align the chip installation position on the top of the PCB mainboard with the bottom of the right pickup air pipe 7; After the workstation is switched, the bottom end of the picking air tube 7 on the left side does not have the chip 825 adsorbed thereon, while the bottom end of the picking air tube 7 on the right side adsorbs and carries the chip 825, and then the first electric telescopic rod 3 is started, and the extended end of the first electric telescopic rod 3 drives the sleeve 4 and the handle pad 5 to descend, and the handle pad 5 drives the two picking air tubes 7 to descend, and the picking air tube 7 descends and drives the pressure rod 813 to descend at the same time, prompting the pressure rod 813 to press the L-shaped force rod 812 in advance, and the L-shaped force rod 812 is forced to drive the slide plate 809 and the rocker 811 to descend, and the rocker 811 descends and is blocked by the top block 826 and then flips over at an angle until the rocker 81 1 is staggered with the top block 826 and is at the bottom of the second-layer top block 826, preparing for the loading of the chip 825 on the third-layer support plate 805. When the pressure rod 813 drops to the limit position, the corresponding left-side picking air pipe 7 contacts the chip 825 on the top of the second-layer support plate 805, and then the vacuum pump 6 is started to cause the unloaded left-side picking air pipe 7 to adsorb it. At this moment, the right-side picking air pipe 7 adsorbs the chip 825, and the chip 825 is located on the mounting surface at the top of the PCB mainboard. Then the right-side vacuum pump 6 is turned off to cause the right-side picking air pipe 7 to release the chip 825. Subsequently, it is only necessary to perform upper and lower limit travel operation on the extension end of the first electric telescopic rod 3 to continuously and synchronously realize the chip 825 picking, automatic station conversion and chip 825 release and installation; It should be noted that when the extension end of the first electric telescopic rod 3 extends downward from the limit height, the toothed plate 903 in the corresponding retracted state will gradually extend from the inside of the storage sleeve 901 due to the loss of the passive pressure of the blocking plate 909, and the toothed plate 903 extends out and meshes with the gear 906, prompting the gear 906 to drive the rotating shaft 905 to reverse, and the rotating shaft 905 reverses to drive the inclined surface of the short bevel block 9111 to squeeze the inclined surface of the long bevel block 9113. Since the first bevel gear 907 is in meshing state with the second bevel gear 908, and the second bevel gear 908 is in meshing state, There is a non-return cooperation between the connected sleeve 4 and the first electric telescopic rod 3, namely, a non-return bevel block 9102 and a non-return groove 9104, so the first bevel gear 907 is in a limited non-return state at this moment. Therefore, the bevel of the short bevel block 9111 squeezes the bevel of the long bevel block 9113, and the long bevel block 9113 retracts into the movable slide groove 9112, so that the rotating shaft 905 carries the short bevel block 9111 to perform its own reverse idling, so that it will not rotate during the process of picking up the air pipe 7 and descending, thereby ensuring the stability of the adsorption chip 825 and the stability of the installation chip 825.

Claims

1. A pick-up device with an angle adjustment function for chip assembly calibration, comprising a processing table (1) and a T-shaped plate (2), wherein the T-shaped plate (2) is fixedly arranged on the rear side of the processing table (1), characterized in that: A first electric telescopic rod (3) is fixedly arranged on the front side of the T-shaped plate (2) via a bracket, and a sleeve (4) is rotatably arranged at the bottom of the extended end of the first electric telescopic rod (3) via a bearing, the bottom of the sleeve (4) is fixedly connected to a handle pad (5), both sides of the top of the handle pad (5) are fixedly installed with a vacuum pump (6), the suction end of the vacuum pump (6) is connected to a pickup air pipe (7), a mounting table (10) is slidably arranged on the top of the processing table (1), a mainboard mold frame (11) is installed on the top of the mounting table (10) via bolts, and an equidistant material delivery mechanism (8) is commonly arranged on the processing table (1) and the pickup air pipe (7), and the equidistant material delivery mechanism (8) comprises a slide plate (801) The slide plate (801) is fixedly arranged at the bottom of the processing table (1), the front side of the slide plate (801) is slidably provided with a T-shaped slider (802), the front side of the T-shaped slider (802) is fixedly connected with a column (803), the top of the column (803) is fixedly connected with a placement frame (804), and the top of the placement frame (804) extends to the top of the processing table (1), and the two sides of the placement frame (804) are slidably provided with a plurality of support plates (805) from top to bottom through the slide groove openings, and the tops of the two support plates (805) at the same height are jointly placed with a chip (825), and the bottom of the processing table (1) is slidably provided with a first limiting sleeve (806), and the inner portion of the first limiting sleeve (806) is A first limit rod (807) is slidably connected to the upper part of the column (803); a first return spring (808) is fixedly connected between the first limit rod (807) and the first limit sleeve (806); a slide plate (809) is fixedly connected to the bottom end of the first limit rod (807) via a bracket; a mounting shell (810) is fixedly connected to one side of the slide plate (809); a seesaw (811) is rotatably arranged inside the mounting shell (810); a plurality of top blocks (826) matched with the seesaw (811) are fixedly arranged at equal intervals on one side of the column (803); an L-shaped force-bearing rod (812) is fixedly connected to the other side of the slide plate (809); the L-shaped force-bearing rod (812) extends to the top of the processing table (1); the pick-up air A pressure rod (813) matched with the L-shaped force-bearing rod (812) is fixedly connected to the surface of the tube (7); a second limiting sleeve (827) is fixedly connected to both sides of the rear side of the T-shaped sliding block (802); a second limiting rod (817) is slidably connected inside the second limiting sleeve (827); a third return spring (814) is fixedly connected between the second limiting rod (817) and the second limiting sleeve (827); positioning grooves (815) matched with the second limiting rod (817) are provided on both sides of the front side of the slide plate (801); and a plurality of positioning grooves (815) are arranged at equal intervals vertically; an angle shifting mechanism (9) is provided on the first electric telescopic rod (3) and the T-shaped plate (2);The rotation angle change mechanism (9) comprises a storage sleeve (901), the storage sleeve (901) being fixedly arranged on one side of the extended end of the first electric telescopic rod (3) via a U-shaped inclined frame (902), a toothed plate (903) being slidably connected inside the storage sleeve (901), a first spring (904) being fixedly connected between the toothed plate (903) and the storage sleeve (901), a rotating shaft (905) being rotatably arranged on the surface of the U-shaped inclined frame (902) via a bracket and a bearing, and a surface of the rotating shaft (905) being fixedly connected to a toothed plate (903) meshing with the toothed plate (903). A gear (906) is provided at one end of the rotating shaft (905) for rotation via a bearing and provided with a first bevel gear (907); a second bevel gear (908) meshing with the first bevel gear (907) is fixedly connected to the surface of the sleeve (4); a blocking plate (909) matched with the tooth plate (903) is fixedly connected to the front side of the T-shaped plate (2); a non-return mechanism (910) is provided between the sleeve (4) and the extended end of the first electric telescopic rod (3); and a one-way linkage mechanism (911) is provided between the rotating shaft (905) and the first bevel gear (907).

2. A pick-up device with angle adjustment function for chip assembly calibration according to claim 1, characterized in that: A plurality of reset sleeves (816) matched with the support plate (805) are fixedly connected from top to bottom on both sides of the placement frame (804); a reset rod (818) is slidably connected inside the reset sleeve (816); a fourth reset spring (819) is fixedly connected between the reset rod (818) and the reset sleeve (816); one end of the reset rod (818) is fixedly connected to the bottom of the support plate (805) via a connecting block; bending limit plates (820) are fixedly provided on both sides of the inner cavity of the processing table (1); and a drag reduction roller (821) matched with the bending limit plate (820) is rotatably provided on one side of the support plate (805) via a slotted opening.

3. The pick-up device with angle adjustment function for chip assembly calibration according to claim 1, characterized in that: A sliding groove (822) is provided at the bottom of the processing table (1), a sliding block (823) is slidably connected inside the sliding groove (822), the bottom of the sliding block (823) is fixedly connected to the top of the first limiting sleeve (806), and a second return spring (824) is fixedly connected between the sliding block (823) and the sliding groove (822).

4. The pick-up device with angle adjustment function for chip assembly calibration according to claim 1, characterized in that: The anti-return mechanism (910) comprises a mounting box (9101), two mounting boxes (9101) are provided, and the two mounting boxes (9101) are respectively fixedly arranged on both sides of the inner cavity of the sleeve (4), a anti-return inclined surface block (9102) is slidably connected inside the mounting box (9101), a second spring (9103) is fixedly connected between the anti-return inclined surface block (9102) and the mounting box (9101), and anti-return grooves (9104) used in conjunction with the anti-return inclined surface block (9102) are provided on both sides of the extending end of the first electric telescopic rod (3).

5. The pick-up device with angle adjustment function for chip assembly calibration according to claim 1, characterized in that: The one-way linkage mechanism (911) comprises a short oblique block (9111), wherein a plurality of the short oblique blocks (9111) are provided and the plurality of short oblique blocks (9111) are equidistantly arranged around the surface of the rotating shaft (905); a plurality of movable slide grooves (9112) are equidistantly arranged around the inner wall of the first bevel gear (907); a long oblique block (9113) matched with the short oblique block (9111) is slidably connected inside the movable slide groove (9112); and a third spring (9114) is fixedly connected between the long oblique block (9113) and the movable slide groove (9112).

6. The pick-up device with angle adjustment function for chip assembly calibration according to claim 1, characterized in that: A displacement groove (12) is provided on the top of the processing table (1), a movable plate (13) is slidably provided inside the displacement groove (12), a threaded rod (14) is threadedly connected to the movable plate (13) via a threaded through groove, and the top of the threaded rod (14) is fixedly connected to the bottom of the mounting table (10) via a bearing.

7. The pick-up device with angle adjustment function for chip assembly calibration according to claim 6, characterized in that: The bottom of the mounting platform (10) is fixedly connected to a sliding rod (15), and one end of the sliding rod (15) passes through and extends to the bottom of the movable plate (13); the top of the movable plate (13) is provided with a sliding hole (16) slidably matched with the sliding rod (15); the bottom of the processing platform (1) is fixedly connected to a second electric telescopic rod (17), and the extended end of the second electric telescopic rod (17) is fixedly connected to one side of the movable plate (13).

8. The pick-up device with angle adjustment function for chip assembly calibration according to claim 1, characterized in that: Cameras (18) are installed on both sides of the bottom of the handle pad (5).

Citation Information

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