A cooling device and cooling method suitable for IGBT module

Abstract

The present invention relates to the field of IGBT module testing technology, and more specifically, to a cooling device and cooling method suitable for IGBT modules, comprising: a module tray, the module tray is provided with one or more cooling areas for placing IGBT modules, each cooling area is provided in cooperation with a cooling mechanism; the module tray is provided with one or more temperature monitoring mechanisms, each cooling area is provided in cooperation with a temperature monitoring mechanism, so as to monitor the temperature of the IGBT modules placed in the cooling area through the temperature monitoring mechanism. During cooling, the temperature of the IGBT modules placed in the cooling area is monitored in real time through the temperature monitoring mechanism, so that the IGBT modules can be removed when the temperature of the IGBT modules is lower than the preset temperature, which can improve the cooling efficiency of the IGBT modules, prevent the temperature of the IGBT modules from being too low due to the long cooling time, and reduce the impact on the accuracy of subsequent performance tests of the IGBT modules after cooling.

Description

Technical Field

[0001] The present invention relates to the technical field of IGBT module testing, and more particularly to a cooling device and a cooling method suitable for an IGBT module. Background Art

[0002] IGBT (Insulated Gate Bipolar Transistor) is a new type of power semiconductor field-controlled self-shutoff device that integrates the power MOS (Metal Oxide Semiconductor) field-effect transistor and the low resistance of bipolar devices. It has the characteristics of high input impedance, low voltage control power consumption, simple control circuit, high voltage resistance, and large current tolerance. It has been widely used in various power conversions.

[0003] At present, IGBT modules are widely used in new energy vehicles on the market. During the production process of IGBT modules, the modules need to be tested. The conventional tests for IGBT modules mainly include electrical performance test, temperature characteristic test, aging test, environmental adaptability test, etc. After the electrical performance test of the IGBT module, the temperature of the IGBT module will rise, affecting other subsequent test processes. The main cooling methods of IGBT are to place the IGBT module in the air for automatic cooling and to use a fan for natural wind cooling. In addition, the actual temperature of the IGBT module cannot be monitored during the cooling process, resulting in the inability to judge the actual temperature state of the IGBT module, a long cooling time, and low cooling efficiency. Summary of the invention

[0004] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a cooling device and a cooling method suitable for an IGBT module.

[0005] The technical solution adopted by the present invention is:

[0006] A cooling device suitable for an IGBT module comprises: a module tray, wherein the module tray is provided with one or more cooling areas for placing the IGBT modules, each cooling area is arranged in cooperation with a cooling mechanism, so that the cold air generated by the cooling mechanism is used to cool and dissipate the heat of the IGBT modules placed in the cooling area; and the module tray is provided with one or more temperature monitoring mechanisms, each cooling area is arranged in cooperation with a temperature monitoring mechanism, so that the temperature of the IGBT modules placed in the cooling area is monitored by the temperature monitoring mechanisms.

[0007] Furthermore, the cooling area includes interconnected supporting brackets, cooling ports and air guide ports; the supporting brackets arranged on the upper surface of the module tray are used to support the IGBT module, and the cooling ports are arranged opposite to the cooling mechanism arranged below the module tray, so that the air outlet of the cooling mechanism blows toward the IGBT module through the cooling port, and the blown airflow can be discharged through the air guide ports located on the side of the IGBT module.

[0008] Furthermore, the module tray is connected to the base plate through a vertical plate, and a sensor bracket is connected to the base plate. The sensor bracket is used to install the temperature monitoring mechanism.

[0009] Furthermore, the temperature monitoring mechanism includes: one or more optical fiber temperature sensors for monitoring the temperature of the IGBT module, and the optical fiber temperature sensors are electrically connected to the optical fiber amplifier.

[0010] Furthermore, the cooling mechanism includes: a cold air nozzle, the air outlet of the cold air nozzle is arranged toward the IGBT module placed in the cooling area, the air inlet of the cold air nozzle is connected to the output end of the vortex refrigeration tube, and the input end of the vortex refrigeration tube is connected to the air pump.

[0011] Furthermore, the cold air nozzle is a serpentine nozzle.

[0012] A cooling method is applicable to the cooling device applicable to the IGBT module described above, the method comprising the following steps:

[0013] Place the IGBT module to be cooled in the cooling area of ​​the module tray;

[0014] The cooling mechanism is started, and the IGBT module is cooled by the cold air generated by the cooling mechanism;

[0015] The temperature of the IGBT module is monitored by a temperature monitoring mechanism. When the temperature of the IGBT module is lower than a preset temperature, the IGBT module is removed to complete the cooling process of the IGBT module.

[0016] It can be seen from the above scheme that the beneficial effects of the present invention are:

[0017] In a cooling device suitable for an IGBT module of the present invention, cold air generated by a cooling mechanism is used to cool and dissipate heat of an IGBT module placed in a cooling area. Compared with traditional cooling by a fan or by cooling in the vacant atmosphere, this device has better cooling efficiency and cooling effect. During cooling, a temperature monitoring mechanism is used to perform real-time temperature monitoring of the IGBT module placed in the cooling area, so that the IGBT module can be removed when the temperature of the IGBT module is lower than a preset temperature. Cooling treatments of different lengths are performed on IGBT modules of different temperatures, which can improve the cooling efficiency of the IGBT module and prevent the IGBT module from being too low in temperature due to excessive cooling time, thereby reducing the impact on the accuracy of subsequent performance tests of the IGBT module after cooling.

[0018] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: an IGBT module to be cooled is placed in a cooling area of ​​a module tray.

[0020] Figure 1 A schematic diagram from a first angle of a cooling device applicable to an IGBT module provided in an embodiment of the present invention;

[0021] Figure 2 A second angle schematic diagram of a cooling device applicable to an IGBT module provided in an embodiment of the present invention;

[0022] Figure 3 A schematic diagram from a third angle of a cooling device applicable to an IGBT module provided in an embodiment of the present invention;

[0023] Figure 4 A schematic diagram of a module tray provided in an embodiment of the present invention;

[0024] Figure 5 A partial schematic diagram of a module tray provided in an embodiment of the present invention;

[0025] Figure 6 A schematic diagram of a first solution of a cold air nozzle provided in an embodiment of the present invention;

[0026] Figure 7 A schematic diagram of the structure of a vortex refrigeration tube provided in an embodiment of the present invention;

[0027] Figure 8 A schematic diagram from a first angle of a second solution of a cold air nozzle provided in an embodiment of the present invention;

[0028] Fig. 9 A second angle schematic diagram of a second solution of the cold air nozzle provided in an embodiment of the present invention;

[0029] Fig.10 A cross-sectional view of a second solution of a cold air nozzle provided in an embodiment of the present invention;

[0030] Fig.11 A partial schematic diagram of the second solution of the cold air nozzle provided in the embodiment of the present invention Figure 1 ;

[0031] Fig.12 A partial schematic diagram of the second solution of the cold air nozzle provided in the embodiment of the present invention Figure 2 ;

[0032] Fig.13 A schematic diagram of a nozzle housing of a second solution of a cold air nozzle provided in an embodiment of the present invention;

[0033] Fig.14 A schematic diagram of a cylindrical air duct of a second solution of a cold air nozzle provided in an embodiment of the present invention;

[0034] Fig.15 Schematic diagram of the air duct control mechanism of the second solution of the cold air nozzle provided in the embodiment of the present invention Figure 1 ;

[0035] Fig.16 A schematic diagram of a partition mechanism of a second solution of a cold air nozzle provided in an embodiment of the present invention;

[0036] Fig.17 A schematic diagram of a cylindrical filter screen of a second solution of a cold air nozzle provided in an embodiment of the present invention;

[0037] Fig.18 Schematic diagram of the air duct control mechanism of the second solution of the cold air nozzle provided in the embodiment of the present invention Figure 2 .

[0038] Icons: module tray 100; bearing bracket 101; cooling port 102; air guide port 103; vertical plate 104; bottom plate 105; sensor bracket 106; cooling mechanism 200; temperature monitoring mechanism 300; optical fiber amplifier 400; cold air nozzle 500; nozzle housing 501; air outlet cover 502; cylindrical air duct 503; auxiliary air hole 504; air duct control mechanism 505; partition mechanism 506; cylindrical filter 507; rectangular box 508; worm gear 509; worm gear Rod one 510; regulating motor 511; bidirectional screw 512; regulating slide 513; worm two 514; regulating bracket 515; rotating shaft one 516; rotating shaft two 517; bevel gear two 518; bevel gear one 519; worm gear two 520; rotating internal threaded tube 521; locking screw 522; bearing frame 523; swing drive shaft 524; gear body 525; rack 526; reciprocating electric push rod 527; locking screw 528; eddy current cooling tube 600; IGBT module 700. DETAILED DESCRIPTION

[0039] In order to clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention, it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] It should be understood that the terms such as “having”, “including” and “comprising” used herein do not exclude the existence or addition of one or more other elements or combinations thereof.

[0041] Embodiment 1

[0042] See also Figure 1-Figure 7 The present invention provides a cooling device suitable for an IGBT module, comprising: a module tray 100, wherein the module tray 100 is provided with one or more cooling areas for placing an IGBT module 700, and each cooling area is cooperated with a cooling mechanism 200 so that the cold air generated by the cooling mechanism 200 can be used to cool and dissipate the heat of the IGBT module 700 placed in the cooling area; and the module tray 100 is provided with one or more temperature monitoring mechanisms 300, and each cooling area is cooperated with a temperature monitoring mechanism 300 so that the temperature of the IGBT module 700 placed in the cooling area can be monitored by the temperature monitoring mechanism 300.

[0043] The working principle and technical effects of the above scheme are as follows:

[0044] The present invention provides a cooling device suitable for an IGBT module. When cooling an IGBT module 700, the IGBT module 700 is placed in a cooling area of ​​a module tray 100, and then a cooling mechanism 200 is started. The cold air generated by the cooling mechanism 200 cools and dissipates the heat of the IGBT module placed in the cooling area. Compared with traditional cooling by a fan or cooling in the vacant atmosphere, cooling by cold air has better cooling efficiency and cooling effect. During cooling, the temperature of the IGBT module 700 placed in the cooling area is monitored in real time by a temperature monitoring mechanism 300, so that the IGBT module can be removed when the temperature of the IGBT module 700 is lower than a preset temperature. The IGBT module 700 at different temperatures is cooled for different lengths of time, which can improve the cooling efficiency of the IGBT module 700 and prevent the temperature of the IGBT module 700 from being too low due to too long a cooling time, thereby reducing the impact on the accuracy of subsequent performance tests of the IGBT module after cooling.

[0045] The cooling area includes a connected supporting bracket 101, a cooling port 102 and a guide port 103; the supporting bracket 101 arranged on the upper surface of the module tray 100 is used to support the IGBT module 700, and the cooling port 102 is arranged opposite to the cooling mechanism 200 arranged below the module tray 100, so that the air outlet of the cooling mechanism 200 blows toward the IGBT module 700 through the cooling port 102, and the blown airflow can be discharged through the guide port 103 located on the side of the IGBT module 700.

[0046] The setting of the supporting bracket 101 makes it easier for the IGBT module 700 to be placed stably and not easy to loosen, thereby ensuring the cooling effect during air cooling. The cooling port 102 is a structure that penetrates the module tray 100 from top to bottom, so that the cold air generated by the cooling mechanism 200 below can directly blow to the heating part of the IGBT module 700. The side of the IGBT module 700 is also provided with a guide port 103, so that the blown air can be discharged through the guide port 103 located on the side of the IGBT module 700, thereby improving the airflow flow and improving the cooling effect.

[0047] The module tray 100 is connected to the base plate 105 through the vertical plate 104, and the base plate 105 is connected to a sensor bracket 106. The sensor bracket 106 is used to install the temperature monitoring mechanism 300. The temperature monitoring mechanism 300 is installed in the mounting hole of the sensor bracket 106 and fixed by bolts. When in use, it can be installed at different positions of the sensor bracket 106 according to actual needs to better monitor the temperature.

[0048] The temperature monitoring mechanism 300 includes: one or more optical fiber temperature sensors for monitoring the temperature of the IGBT module 700, and the optical fiber temperature sensors are electrically connected to the optical fiber amplifier 400. The use of optical fiber temperature sensors for temperature detection can provide high-precision temperature measurement, and the optical fiber amplifier 400 can achieve signal amplification and processing, further ensuring the quality and reliability of the signal, thereby improving the accuracy of the entire temperature monitoring system.

[0049] The cooling mechanism 200 includes: a cold air nozzle 500, the air outlet of the cold air nozzle 500 is arranged toward the IGBT module 700 placed in the cooling area, the air inlet of the cold air nozzle 500 is connected to the output end of the vortex cooling tube 600, and the input end of the vortex cooling tube 600 is connected to the air pump. The air source input by the air pump forms cold air after passing through the vortex cooling tube 600, and the cold air passes through the cold air nozzle 500 and blows onto the IGBT module 700 for cooling. The cold air is used for cooling, and the cooling efficiency is high.

[0050] like Figure 6 As shown, the first technical solution of the cold air nozzle 500 is a serpentine nozzle, which can be a serpentine nozzle purchased on the market.

[0051] Embodiment 2

[0052] See also Figure 8-Figure 18In a cooling device suitable for an IGBT module provided by the present invention, a second technical solution of a cold air nozzle 500 is as follows: the cold air nozzle 500 comprises a nozzle housing 501, an air inlet of the nozzle housing 501 is connected to an output end of a vortex cooling tube 600 through a pipeline, and an air outlet of the nozzle housing 501 is connected to an air outlet cover plate 502 with a plurality of air outlet holes; two cylindrical air ducts 503 with closed outer ends and open inner ends are sealed and slidably connected on both sides of the nozzle housing 501, the two cylindrical air ducts 503 are sealed and rotated in arc grooves on both sides of the inner wall of the nozzle housing 501, and a plurality of side-by-side auxiliary air holes 504 are provided on the side walls of the two cylindrical air ducts 503; the outer ends of the two cylindrical air ducts 503 are connected to an air duct control mechanism 505 installed outside the nozzle housing 501, so as to adjust the length of the cylindrical air duct 503 extending to the outside of the nozzle housing 501 under the control of the air duct control mechanism 505.

[0053] The working principle and technical effects of the above scheme are as follows:

[0054] In order to better adapt to the cooling of IGBT modules 700 of different sizes during the actual cooling process, a second technical solution of the cold air nozzle 500 with adjustable blowing range is specially designed. In this solution, the air inlet of the nozzle housing 501 is connected to the output end of the vortex refrigeration tube 600 through a pipeline, so that the cold air first enters the nozzle housing 501, and the air outlet of the nozzle housing 501 is connected to the air outlet cover 502 with multiple air outlet holes, so that the cold air entering the nozzle housing 501 can be evenly blown out through the multiple air outlet holes of the air outlet cover 502, and a duct control mechanism 505 is installed on the outside of the nozzle housing 501. The two cylindrical air ducts 503 are controlled to slide on both sides of the nozzle shell 501 through the air duct control mechanism 505, so that the two cylindrical air ducts 503 are retracted into the nozzle shell 501, or extended to the outside of the nozzle shell 501, and the length of the cylindrical air duct 503 extending outside the nozzle shell 501 is adjusted, and the auxiliary air holes 504 on the cylindrical air duct 503 are controlled to extend to the outside of the nozzle shell 501, so that the cold air in the nozzle shell 501 can be output through the auxiliary air holes 504 set on the cylindrical air duct 503 after entering the cylindrical air duct 503, thereby realizing the adjustment of the cooling range and meeting the usage requirements of different actual situations.

[0055] The middle of the nozzle housing 501 is sealed with a partition mechanism 506, the center hole of the partition mechanism 506 is connected to the middle of the cylindrical filter 507, and the two ends of the cylindrical filter 507 are inserted into the inner tube surface of the two cylindrical air ducts 503. When the two cylindrical air ducts 503 are received in the nozzle housing 501, the multiple auxiliary air holes 504 of one cylindrical air duct 503 are arranged toward the air outlet of the nozzle housing 501, and the multiple auxiliary air holes 504 of the other cylindrical air duct 503 are arranged toward the air outlet of the nozzle housing 501. 504 is arranged toward the air inlet of the nozzle housing 501, so that the cold air entering from the air inlet of the nozzle housing 501 enters into the cylindrical air duct 503 through multiple auxiliary air holes 504 of a cylindrical air duct 503, enters into another cylindrical air duct 503 through the center hole of the partition mechanism 506 after being filtered by the cylindrical filter 507, and is output toward the air outlet direction of the nozzle housing 501 through the multiple auxiliary air holes 504 of the other cylindrical air duct 503.

[0056] In order to reduce the impact of impurities in the cold air on the IGBT module 700, a cylindrical filter 507 is set in the nozzle housing 501. The cold air entering the nozzle housing 501 through the air inlet of the nozzle housing 501 can be filtered by the cylindrical filter 507 and then output through the air outlet of the nozzle housing 501. When it is necessary to ensure a better filtering effect, the two cylindrical air ducts 503 need to be controlled to be retracted into the nozzle housing 501, and the cylindrical filter 507 is protected and supported by the two cylindrical air ducts 503 to prevent the cylindrical filter 507 from being damaged. The cylindrical filter screen 507 is greatly deformed under the action of the airflow, which affects the service life or filtering effect, and the two cylindrical air ducts 503 are sealed and rotated in the arc grooves on both sides of the inner wall of the air nozzle shell 501, so as to block the gap between the cylindrical filter screen 507 and the inner wall of the air nozzle shell 501, and prevent the airflow from flowing through the gap, so that the airflow is filtered and the filtering effect is guaranteed; in order to make the airflow flow smoothly from the air inlet of the air nozzle shell 501 to the air outlet of the air nozzle shell 501, it is necessary to control the multiple auxiliary air holes 5 of a cylindrical air duct 503. 04 is arranged toward the air outlet of the nozzle housing 501, and the multiple auxiliary air holes 504 of the other cylindrical air duct 503 are arranged toward the air inlet of the nozzle housing 501. At this time, the cold air entering from the air inlet of the nozzle housing 501 enters the cylindrical air duct 503 through the multiple auxiliary air holes 504 of one cylindrical air duct 503, passes through the central hole of the partition mechanism 506 after being filtered by the cylindrical filter 507, and enters the other cylindrical air duct 503 through the multiple auxiliary air holes 504 of the other cylindrical air duct 503 to the nozzle housing 501. 01's air outlet direction output, the setting of this structure makes it possible for the two cylindrical air ducts 503 to be retracted into the air nozzle shell 501 without affecting the flow of airflow, and the airflow can pass through the curved filtering channel to change the direction of airflow, reduce the area of ​​airflow directly blowing on the cylindrical filter 507, and reduce the damage of airflow to the cylindrical filter 507. At the same time, it does not affect the two cylindrical air ducts 503 extending out of the air nozzle shell 501 to be used as exhaust ducts to assist in expanding the cooling range. The structure is novel and practical, and can meet the needs of various situations.

[0057] The partition mechanism 506 includes: a rectangular box 508 assembled at the rectangular hole in the middle of the nozzle housing 501, and a cylindrical filter 507 rotatably connected in the middle of the central holes of the two side plates of the rectangular box 508; the cylindrical filter 507 is passed through the rectangular box 508 and a worm gear 509 is fixed on the filter body thereof, and the worm gear 509 is meshed with a worm 510 rotatably arranged on the outer box cover of the rectangular box 508.

[0058] The structure of the partition mechanism 506 can not only be used to support and install the cylindrical filter 507, but also can control the rotation of the cylindrical filter 507 to change the contact position between the cylindrical filter 507 and the cold air to be filtered, thereby preventing the cylindrical filter 507 from being partially blocked and affecting the filtering effect. When the cylindrical filter 507 is controlled to rotate, the worm 510 is rotated to drive the worm wheel 509 to rotate. When the worm wheel 509 rotates, the cylindrical filter 507 is driven to rotate in the rectangular box 508, thereby changing the filtering position of the cylindrical filter 507, and after a part of the filter body of the cylindrical filter 507 has filtered for a period of time, , control the part of the filter body to be set toward the air outlet of the nozzle shell 501, and make the multiple auxiliary air holes 504 of the cylindrical air duct 503 connected to the part of the filter body be set toward the air outlet of the nozzle shell 501. At this time, after removing the IGBT module 700, as the air flow enters, the part of the filter body can be blown, so that the impurities filtered on the part of the filter body are discharged to the air outlet of the nozzle shell 501 through the multiple auxiliary air holes 504, thereby realizing automatic cleaning work without disassembling the cylindrical filter 507. The operation is very convenient and practical, and the influence of inspection and maintenance on the cooling efficiency is reduced.

[0059] The air duct control mechanism 505 includes: a control motor 511 arranged outside the air nozzle housing 501, the motor shaft of the control motor 511 is connected to a bidirectional screw 512 rotatably arranged outside the air nozzle housing 501, and two oppositely arranged control slides 513 are threadedly connected on the bidirectional screw 512, and the two control slides 513 are both slidably arranged on the T-shaped slide rail outside the air nozzle housing 501; the two control slides 513 are rotatably connected to one end of two worm gears 514, and the two worm gears 514 are rotatably connected to each other. The other end of 514 is rotatably connected to the regulating bracket 515. The two regulating brackets 515 are rotatably provided with a rotating shaft 1 516 and a rotating shaft 2 517. The two rotating shafts 1 516 are fixedly connected to the closed outer ends of the two cylindrical air ducts 503. The two worm gears 2 520 fixed on the two rotating shafts 2 517 are respectively meshed with the two worm gears 2 514. The two bevel gears 2 518 fixed on the two rotating shafts 2 517 are vertically meshed with the bevel gear 1 519 fixed on the two rotating shafts 1 516.

[0060] The air duct control mechanism 505 can control the two cylindrical air ducts 503 to be synchronously extended to the outside of the air nozzle housing 501 or synchronously retracted into the air nozzle housing 501. After the control motor 511 is started, it can drive the bidirectional screw 512 to rotate. One end of the bidirectional screw 512 is a left-handed thread and the other end is a right-handed thread. When the bidirectional screw 512 rotates, it can control the two relatively arranged control slides 513 to slide toward or away from each other on the T-shaped slide rail outside the air nozzle housing 501, thereby controlling the two worm gears 514 to drive the two control brackets 515 to slide toward or away from each other. The two control brackets 515 drive the two cylindrical air ducts 503 to slide toward or away from each other on the side of the air nozzle housing 501 through the two rotating shafts 1 516. The length of the two cylindrical air ducts 503 extending to the outside of the nozzle housing 501 is adjusted to change the blowing range; and the two worm wheels 520 fixed on the two rotating shafts 517 are respectively meshed with the two worm screws 514, and the direction of the multiple auxiliary air holes 504 of the cylindrical air duct 503 can be adjusted by rotating the worm screw 514. During adjustment, the worm screw 514 is rotated to engage the worm wheel 520 to rotate. When the worm wheel 520 rotates, it can drive the bevel gear 518 to rotate through the rotating shaft 517. When the bevel gear 518 rotates, it engages the bevel gear 1 519 to rotate. The bevel gear 1 519 drives the cylindrical air duct 503 to rotate on the side of the nozzle housing 501 through the rotating shaft 1 516, thereby realizing the adjustment of the direction of the multiple auxiliary air holes 504.

[0061] The two regulating slides 513 are both rotatably connected to the rotating internal threaded tubes 521, and the two rotating internal threaded tubes 521 are threadedly connected to the bidirectional screw 512. The two regulating slides 513 are both threadedly connected to the locking screws 522, and the inner ends of the two locking screws 522 can be tightly pressed against the rotating internal threaded tubes 521. The structural setting of the rotating internal threaded tubes 521 allows the position of any regulating slide 513 to be adjusted individually, so that the lengths of the two cylindrical air ducts 503 extending to the outside of the air nozzle housing 501 are different, which is better suitable for use in different situations. When adjusting, the locking screws 522 are rotated to release the tight limit of the rotating internal threaded tubes 521, and then the rotating internal threaded tubes 521 are rotated to change the contact position between the rotating internal threaded tubes 521 and the bidirectional screw 512, thereby driving the regulating slide 513 to move, and finally realizing the individual adjustment of the length of the cylindrical air duct 503 extending to the outside of the air nozzle housing 501. After adjustment, the locking screws 522 are controlled to press against the rotating internal threaded tubes 521.

[0062] The air duct control mechanism 505 also includes: a bearing frame 523 installed on the outside of the air nozzle housing 501, the bearing frame 523 is rotatably connected to the swing drive shaft 524, the gear body 525 fixed in the middle of the swing drive shaft 524 is meshed with a rack 526 slidably mounted on the bearing frame 523, and the rack 526 is connected to the output end of a reciprocating electric push rod 527 installed on the bearing frame 523, so that the rack 526 is driven by the reciprocating electric push rod 527 to move up and down on the bearing frame 523. The swing drive shaft 524 has two ends which are passed through the central channels of the two worm gears 514. The two worm gears 514 are both threaded with a plurality of locking screws 528. The inner ends of the plurality of locking screws 528 can be pressed against the swing drive shaft 524. A rubber anti-slip sleeve is glued to the outer shaft surface of the swing drive shaft 524 to improve the relative stability of the worm gear 514 and the swing drive shaft 524 when the inner ends of the locking screws 528 are pressed against the swing drive shaft 524.

[0063] The reciprocating electric push rod 527 can drive the rack 526 to perform reciprocating sliding motion in the up and down directions on the bearing frame 523. When the rack 526 moves, it can drive the gear body 525 to continuously switch between the clockwise and counterclockwise directions, thereby driving the swing drive shaft 524 to continuously rotate forward and reverse. When the inner ends of multiple locking screws 528 are tightly pressed against the swing drive shaft 524, the swing drive shaft 524 can drive the worm 2 514 to continuously switch between the forward and reverse rotations, thereby controlling the two worm gears 2 520 to continuously switch between the clockwise and counterclockwise directions, and finally controlling the two cylindrical air ducts 503 to continuously switch between the clockwise and counterclockwise directions within a certain angle range. When the two cylindrical air ducts 503 extend to the outside of the air nozzle housing 501, and the multiple auxiliary air holes 504 are all facing IGB When the T module 700 is set, the two cylindrical air ducts 503 are continuously switched and rotated in the clockwise direction and the counterclockwise direction, so that the cold air can be dissipated at different positions through the multiple continuously moving auxiliary air holes 504, thereby improving the cooling uniformity and the heat dissipation effect; and when the two cylindrical air ducts 503 are received in the air nozzle shell 501, the multiple auxiliary air holes 504 of one cylindrical air duct 503 are arranged toward the air outlet of the air nozzle shell 501, and the multiple auxiliary air holes 504 of the other cylindrical air duct 503 are arranged toward the air inlet of the air nozzle shell 501. When the airflow is guided, the multiple auxiliary air holes 504 of the two cylindrical air ducts 503 are controlled to move continuously, and the contact position of the airflow and the cylindrical filter 507 can be continuously changed, so as to ensure the filtering effect and reduce the impact damage of the airflow on the local cylindrical filter 507.

[0064] Embodiment 3

[0065] See also Figure 1-Figure 7, a cooling method, applicable to the cooling device applicable to the IGBT module, the method comprising the following steps:

[0066] Placing the IGBT module 700 to be cooled in the cooling area of ​​the module tray 100;

[0067] The cooling mechanism 200 is started, and the IGBT module 700 is cooled by the cold air generated by the cooling mechanism 200;

[0068] The temperature of the IGBT module 700 is monitored by the temperature monitoring mechanism 300 . When the temperature of the IGBT module 700 is lower than a preset temperature, the IGBT module 700 is removed to complete the cooling process of the IGBT module 700 .

[0069] The method is scientific and reasonable, with good cooling effect and high cooling efficiency.

[0070] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0071] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0072] Although the embodiments of the present invention have been disclosed as above, they are not limited to the applications listed in the specification and the implementation methods. They can be fully applied to various fields suitable for the present invention. For those familiar with the art, additional modifications can be easily implemented. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present invention is not limited to the specific details and the illustrations shown and described herein.

Claims

1. A cooling device suitable for an IGBT module, characterized in that: include: A module tray (100), wherein the module tray (100) is provided with one or more cooling areas for placing IGBT modules (700), each cooling area being arranged in cooperation with a cooling mechanism (200) so that the IGBT modules (700) placed in the cooling area are cooled and dissipated by cold air generated by the cooling mechanism (200); and the module tray (100) is provided with one or more temperature monitoring mechanisms (300), each cooling area being arranged in cooperation with a temperature monitoring mechanism (300) so that the temperature of the IGBT modules (700) placed in the cooling area is monitored by the temperature monitoring mechanism (300); The cooling area comprises a connected supporting bracket (101), a cooling port (102) and an air guide port (103); the supporting bracket (101) arranged on the upper surface of the module tray (100) is used to support the IGBT module (700), and the cooling port (102) is arranged relative to a cooling mechanism (200) arranged below the module tray (100), so that an air outlet of the cooling mechanism (200) blows toward the IGBT module (700) through the cooling port (102), and the blown airflow can be discharged through the air guide port (103) located on the side of the IGBT module (700).

2. A cooling device suitable for an IGBT module according to claim 1, characterized in that: The module tray (100) is connected to the bottom plate (105) via a vertical plate (104); a sensor bracket (106) is connected to the bottom plate (105); the sensor bracket (106) is used to install a temperature monitoring mechanism (300).

3. A cooling device suitable for an IGBT module according to claim 2, characterized in that: The temperature monitoring mechanism (300) comprises: one or more optical fiber temperature sensors for monitoring the temperature of the IGBT module (700), the optical fiber temperature sensors being electrically connected to the optical fiber amplifier (400).

4. A cooling device suitable for an IGBT module according to claim 1, characterized in that: The cooling mechanism (200) comprises: a cold air nozzle (500), the air outlet of the cold air nozzle (500) being arranged toward the IGBT module (700) placed in the cooling area, the air inlet of the cold air nozzle (500) being connected to the output end of the vortex refrigeration tube (600), and the input end of the vortex refrigeration tube (600) being connected to the air pump.

5. A cooling device suitable for an IGBT module according to claim 4, characterized in that: The cold air nozzle (500) is a serpentine nozzle.

6. A cooling device suitable for an IGBT module according to claim 4, characterized in that: The cold air nozzle (500) comprises: a nozzle shell (501); an air inlet of the nozzle shell (501) is connected to an output end of a vortex refrigeration tube (600) through a pipeline; and an air outlet of the nozzle shell (501) is connected to an air outlet cover plate (502) with a plurality of air outlet holes; two cylindrical air ducts (503) with closed outer ends and open inner ends are sealed and slidably connected on both sides of the nozzle shell (501); the two cylindrical air ducts (503) are sealed and rotated in arc grooves on both sides of the inner wall of the nozzle shell (501); and a plurality of parallel auxiliary air holes (504) are provided on the side walls of the two cylindrical air ducts (503); and the outer ends of the two cylindrical air ducts (503) are connected to an air duct control mechanism (505) installed outside the nozzle shell (501) so that the length of the cylindrical air duct (503) extending to the outside of the nozzle shell (501) can be adjusted under the control of the air duct control mechanism (505).

7. A cooling device suitable for an IGBT module according to claim 6, characterized in that: The middle part of the nozzle housing (501) is sealed with a partition mechanism (506), the center hole of the partition mechanism (506) is connected to the middle part of the cylindrical filter (507), and the two ends of the cylindrical filter (507) are inserted into the inner tube surface of the two cylindrical air ducts (503). When the two cylindrical air ducts (503) are received in the nozzle housing (501), the multiple auxiliary air holes (504) of one cylindrical air duct (503) are arranged toward the air outlet of the nozzle housing (501), and the multiple auxiliary air holes (504) of the other cylindrical air duct (503) are arranged toward the air outlet of the nozzle housing (501). (504) is arranged toward the air inlet of the nozzle housing (501), so that the cold air entering from the air inlet of the nozzle housing (501) enters into the cylindrical air duct (503) through the multiple auxiliary air holes (504) of a cylindrical air duct (503), enters into the cylindrical air duct (503) through the central hole of the partition mechanism (506) after being filtered by the cylindrical filter (507), and enters into another cylindrical air duct (503), and is output toward the air outlet of the nozzle housing (501) through the multiple auxiliary air holes (504) of the other cylindrical air duct (503).

8. A cooling device suitable for an IGBT module according to claim 7, characterized in that: The partition mechanism (506) comprises: a rectangular box (508) mounted at a rectangular hole in the middle of the nozzle housing (501); the middle of a cylindrical filter (507) is rotatably connected to the central holes of two side plates of the rectangular box (508); a worm gear (509) is fixedly arranged on the filter body of the cylindrical filter (507) passing through the rectangular box (508); the worm gear (509) is meshed with a worm (510) rotatably arranged on the outer box cover of the rectangular box (508).

9. A cooling method, applicable to a cooling device applicable to an IGBT module as claimed in any one of claims 1 to 8, characterized in that: The method comprises the following steps: Placing an IGBT module (700) to be cooled in a cooling area of ​​a module tray (100); The cooling mechanism (200) is started to cool the IGBT module (700) with cold air generated by the cooling mechanism (200); The temperature of the IGBT module (700) is monitored by a temperature monitoring mechanism (300); when the temperature of the IGBT module (700) is lower than a preset temperature, the IGBT module (700) is removed to complete the cooling process of the IGBT module (700).

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