Pumping source device and laser

By adjusting the laser chip spacing in the pump source device, the problem of temperature inhomogeneity of the laser chip is solved, the impact of temperature differences on the laser wavelength is reduced, and the stability and accuracy of the laser are improved.

CN119315385APending Publication Date: 2025-01-14MAXPHOTONICS CORP +1
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Patent Information

Application Number
CN202411268143.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-11
Publication Date
2025-01-14

AI Technical Summary

Technical Problem

In the existing pump source devices, the uneven temperature of the laser chip leads to changes in the laser wavelength, affecting the stability and accuracy of the laser. In particular, the temperature of the laser chip in the middle area is higher than the temperature of the end chip, resulting in a large difference in laser wavelength.

Method used

A pump source device is designed, in which the laser chip spacing is fixed on the pump source housing, forming a chip module, the laser chip spacing in the middle and end areas is different, and heat is evenly distributed by adjusting the spacing to reduce temperature differences.

Benefits of technology

It effectively reduces the impact of temperature differences in different regions on the laser wavelength, improves the stability and accuracy of the laser, and ensures the uniformity of the laser output.

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Abstract

The embodiment of the invention provides a pumping source device and a laser. In the embodiment of the invention, the pumping source device comprises a plurality of laser chips and a pumping source shell, the plurality of laser chips are connected in series, the plurality of laser chips are fixed on the pumping source shell at intervals and form at least one chip module, and the plurality of laser chips are fixed on the pumping source shell at intervals. The distance between every two adjacent laser chips in the middle area of the chip module is different from the distance between every two adjacent laser chips at the two ends of the chip module.
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