Module MIPI eye pattern test method

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By setting up a test section and testing PAD on the module FPC, the existing MIPI eye diagram testing methods are solved, and simple and effective MIPI testing is realized, ensuring data quality and cost savings.

CN119316333APending Publication Date: 2025-01-14GANZHOU TXO TECH CO LTD

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Patent Information

Application Number: CN202411424665.5
Authority / Receiving Office: CN · China
Patent Type: Applications(China)
Current Assignee / Owner
Filing Date: 2024-10-12
Publication Date: 2025-01-14

AI Technical Summary

Technical Problem

The existing MIPI eye diagram testing methods have the problem of complex production process and high cost, especially when external gold wires are tested on PCB test boards, and adding test PAD to the MIPI network results in unstable impedance matching, resulting in poor test results. Stable and inaccurate.

Method used

Set the test section of the epitaxial position on the module FPC, close to the MIPI binding PIN, set the test PAD and connection lines, each connection line has a length of less than or equal to 2cm, all connection lines are surrounded by grounding lines, and test it through the test PAD and grounding PAD .

Benefits of technology

It achieves simple design and convenient testing. The quality of MIPI test eye diagram data is the same as that of gold wire test boards, saving costs.

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Abstract

The invention discloses a module MIPI eye pattern test method, which is characterized in that an epitaxial test part is arranged on each binding end on a module FPC, the test part is arranged close to a binding PIN of an MIPI at the binding end of the module FPC, a test PAD and a connection line are formed on the test part corresponding to the binding PIN of each MIPI, each connection line is connected with the binding PIN of the corresponding MIPI and the test PAD, and the test PAD is connected with the binding end of the corresponding MIPI. The test part comprises a plurality of connecting lines and a plurality of test lines, the sum of the lengths of each test PAD and the corresponding test line is smaller than or equal to 2 cm, all the connecting lines and the test PAD are surrounded by the grounding line, the test part at least comprises one grounding PAD connected with the grounding line, and the test is performed through the test PAD and the grounding PAD connected with the test part when the MIPI eye pattern test is performed. The method has the beneficial effects that the design is simple, the test is convenient, the quality of the MIPI test eye pattern data is the same as the effect of the gold thread test board test eye pattern data, and the cost is saved.

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Description

Technical Field

[0001] The present invention relates to the technical field of display modules, and in particular to a module MIPI eye diagram testing method. Background Art

[0002] At present, the mobile phone and tablet industry has higher and higher requirements for the quality of MIPI communication, and at the same time, the speed of MIPI communication is getting faster and faster. The speed of many products has reached more than 1GHZ, so customers have higher requirements for MIPI eye diagram data. The current MIPI eye diagram test methods are: 1. At the module FPC binding glass ITO, pull the gold wire to the PCB test board, and test the MIPI eye diagram data through the PCB test board. The production process of pulling the gold wire to the module PCB test board is complicated. Generally, only Taiwan can produce it, the cost is very high, the cycle is long, and the production cost is high. 2: Add a test PAD in the FPC MIPI network. Due to the fast MIPI communication speed and large data volume, adding a test PAD in the MIPI network will cause the MIPI network impedance matching to be unstable, and the eye diagram test effect is poor, unstable and inaccurate.

[0003] Therefore, the prior art has defects and needs to be improved. Summary of the invention

[0004] The purpose of the present invention is to overcome at least some of the deficiencies of the prior art and provide a module MIPI eye diagram testing method.

[0005] The technical solution of the present invention is as follows: The present invention provides a module MIPI eye diagram test method, comprising: an extended test part is set on each binding end of the module FPC, the test part is set close to the MIPI binding PIN of the binding end of the module FPC, and a test PAD and a connecting line are formed on the test part corresponding to each MIPI binding PIN, each connecting line connects the corresponding MIPI binding PIN and the test PAD, the sum of the lengths of each test PAD and the corresponding test line is less than or equal to 2 cm, all of the connecting lines and test PADs are surrounded by grounding lines, and at least one grounding PAD connected to the grounding line is included in the test part, and when performing the MIPI eye diagram test, the test is performed by connecting the test PAD and the grounding PAD of the test part.

[0006] Optionally, the module FPC includes a binding end and a testing portion.

[0007] Optionally, the module FPC includes two binding ends and two testing parts.

[0008] Furthermore, the sum of the lengths of each test PAD and the corresponding test line is less than or equal to 1.5 cm.

[0009] Furthermore, the diameters of the test PAD and the ground PAD are both greater than or equal to 0.5 mm.

[0010] Furthermore, the diameters of the test PAD and the ground PAD are both 0.6 mm.

[0011] By adopting the above scheme, the beneficial effects of the present invention are: simple design, convenient testing, the quality of MIPI test eye diagram data is the same as that of gold wire test board test eye diagram data, and cost is saved. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a structural schematic diagram of a testing portion of a module FPC according to an embodiment of the present invention. DETAILED DESCRIPTION

[0013] The present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0014] Please refer to Figure 1 In this embodiment, the present invention provides a module MIPI eye diagram test method, wherein an extended test section 2 is arranged on each binding end of the module FPC 1, and the test section 2 is an integral structure with the module FPC 1, and is manufactured together during the manufacturing process of the module FPC 1. The test section 2 is arranged near the MIPI binding PIN (needle) of the binding end of the module FPC 1, and a test PAD (pad) 3 and a connecting line are formed on the test section 2 corresponding to each MIPI binding PIN, and each connecting line connects the corresponding MIPI binding PIN and the test PAD 3, and the sum of the lengths of each test PAD 3 and the corresponding test line is less than or equal to 1.5 cm, which can ensure high-quality signal quality and will not affect the test. All of the connecting lines and the test PAD 3 are surrounded by a grounding line, and at least one grounding PAD connected to the grounding line is included in the test section 2, and the grounding line is also connected to the grounding PIN of the binding end. When performing the MIPI eye diagram test, the test is performed by connecting the test PAD 3 of the test section 2 and the grounding PAD.

[0015] Furthermore, the diameters of the test PAD 3 and the ground PAD are both 0.6 mm, which can ensure a good contact effect.

[0016] Please continue to refer to Figure 1In this embodiment, the MIPI line is 4Lane (channel), and the test part 2 includes two rows and seven columns of pads, wherein the pads in the upper row correspond to the GND line, D0_N line, D1_N line, CLK_P line, D2_P line, D3_P line, and GND line from left to right, and the pads in the lower row correspond to the GND line, D0_P line, D1_P line, CLK_N line, D2_N line, D3_N line, and GND line from left to right.

[0017] In summary, the beneficial effects of this solution are: simple design, convenient testing, the quality of MIPI test eye diagram data is the same as that of gold wire test board test eye diagram data, and cost saving.

[0018] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A module MIPI eye diagram test method, characterized in that: An extended test section is set on each binding end of the module FPC, and the test section is set close to the MIPI binding PIN of the binding end of the module FPC. A test PAD and a connecting line are formed on the test section corresponding to each MIPI binding PIN, and each connecting line connects the corresponding MIPI binding PIN and the test PAD. The sum of the lengths of each test PAD and the corresponding test line is less than or equal to 2 cm. All of the connecting lines and test PADs are surrounded by grounding lines, and at least one grounding PAD connected to the grounding line is included in the test section. When performing a MIPI eye diagram test, the test is performed by connecting the test PAD and the grounding PAD of the test section.

2. The module MIPI eye diagram testing method according to claim 1, characterized in that: The module FPC includes a binding end and a testing portion.

3. The module MIPI eye diagram testing method according to claim 1, characterized in that: The module FPC includes two binding ends and two testing parts.

4. The module MIPI eye diagram testing method according to any one of claims 1 to 3, characterized in that: The sum of the lengths of each test PAD and the corresponding test line is less than or equal to 1.5 cm.

5. The module MIPI eye diagram testing method according to any one of claims 1 to 3, characterized in that: The diameters of the test PAD and the ground PAD are both greater than or equal to 0.5 mm.

6. The module MIPI eye diagram testing method according to claim 5, characterized in that: The diameters of the test PAD and the ground PAD are both 0.6 mm.