Camera

Abstract

The invention relates to a camera, and the camera comprises a housing which is provided with a plurality of wall parts, the plurality of wall parts form an accommodation cavity, and the plurality of wall parts comprise a first group of wall parts and a second group of wall parts; the lens module is arranged in the accommodating cavity, and the lens module comprises an image sensor plate; the main board is arranged in the accommodating cavity; a first heat sink in heat transfer contact with the image sensor plate, and the first heat sink in heat transfer contact with the first set of wall portions; and the second heat dissipation piece is in heat transfer contact with the mainboard, and the second heat dissipation piece is in heat transfer contact with the second group of wall parts. According to the camera, the heat of the mainboard and the image sensor board can be dissipated, so that the mainboard and the image sensor board are not easy to overheat, and the camera can work with stable performance.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a camera. Background Art

[0002] As camera functions continue to expand, the heat generated by components is also gradually increasing, which is undoubtedly a major challenge for camera heat dissipation. For example, in panoramic cameras, due to the high requirements for image quality, the camera's main board and the image sensor board in the lens assembly will generate a lot of heat when working. This heat is very easy to accumulate inside the camera and cannot be dissipated in time, causing the main board and image sensor board to overheat and even malfunction. Summary of the invention

[0003] Based on this, it is necessary to provide a camera that can effectively dissipate heat from a main board and an image sensor board so that the two are not prone to overheating and can work with stable performance.

[0004] A camera comprising:

[0005] A housing having a plurality of wall portions, wherein the plurality of wall portions form a receiving cavity, and the plurality of wall portions include a first group of wall portions and a second group of wall portions;

[0006] A lens module, disposed in the accommodating cavity, wherein the lens module comprises an image sensor board;

[0007] A main board is arranged in the accommodating cavity;

[0008] a first heat sink in thermal contact with the image sensor board, and the first heat sink in thermal contact with the first set of walls;

[0009] The second heat sink is in heat transfer contact with the mainboard, and the second heat sink is in heat transfer contact with the second set of wall portions.

[0010] In one embodiment, the lens module includes two lens assemblies, each of the lens assemblies includes an image sensor board, the first heat sink includes two protruding plates spaced apart from each other, the two image sensor boards are in heat transfer contact with the two protruding plates in a one-to-one correspondence, and the two protruding plates are in heat transfer contact with the first group of wall portions.

[0011] In one embodiment, the first heat dissipation element includes a base plate, and the two protruding plates are connected to the base plate.

[0012] In one embodiment, the two protruding plates and the base plate are in heat transfer contact with different areas of the first set of wall portions respectively.

[0013] In one of the embodiments, a mounting frame connected to the shell is further provided in the accommodating cavity, the two lens assemblies are mounted on the mounting frame, and the two image sensor boards are arranged on both sides of the mounting frame, and each of the protruding plates is located between the corresponding image sensor board and the corresponding heat transfer area on the first group of wall portions.

[0014] In one embodiment, a heat conducting sheet is provided between each lens assembly and the mounting frame.

[0015] In one embodiment, a display screen of the camera is embedded in the first set of walls, and the substrate is in heat transfer contact with the display screen.

[0016] In one of the embodiments, of the two lens assemblies, the one facing away from the main board is the first lens assembly, and the one close to the main board is the second lens assembly; a metal sheet is connected between the protruding plate in heat transfer contact with the image sensor board in the second lens assembly and the first group of walls.

[0017] In one of the embodiments, thermal conductive paste is filled between the two image sensor boards and the corresponding protruding plates; and / or thermal conductive paste is filled between the protruding plate in thermal contact with the image sensor board in the first lens assembly and the first group of walls; and / or thermal conductive paste is filled between the protruding plate in thermal contact with the image sensor board in the second lens assembly and the metal sheet; and / or thermal conductive paste is filled between the metal sheet and the first group of walls; and / or thermal conductive paste is filled between the substrate and the display screen.

[0018] In one of the embodiments, the second heat dissipation element is provided with ribs protruding toward the second set of wall portions, and the second heat dissipation element is connected to the second set of wall portions through the ribs.

[0019] In one embodiment, a connecting component is provided in the accommodating cavity, and the connecting component includes an exposed part and a connecting part connected to each other, and the exposed part is exposed through the first set of wall portions, and one of the first heat dissipation part and the second heat dissipation part is in heat transfer contact with the connecting part, and the other is in heat insulating contact with the connecting part.

[0020] In one of the embodiments, a third heat sink is further disposed in the accommodating cavity and is in heat transfer contact with the mainboard. The third heat sink is located on a side of the mainboard facing away from the second heat sink, and the third heat sink is in heat transfer contact with the housing.

[0021] In one of the embodiments, a USB bracket is further provided in the accommodating cavity and is located between the lens module and the mainboard, the third heat sink is fixedly connected to the USB bracket, the USB bracket is fixedly connected to the first heat sink, and the USB bracket is made of rubber.

[0022] In one embodiment, the battery assembly of the camera is located between the third heat sink and the first heat sink, and a heat insulation pad is provided between at least one of the third heat sink and the first heat sink and the battery assembly.

[0023] In one of the embodiments, a connecting plate and a storage component are provided in the accommodating cavity, the connecting plate is connected to the third heat dissipation element, and the storage component is installed on the connecting plate.

[0024] In one of the embodiments, an antenna and an antenna heat sink are further disposed in the accommodating cavity, the antenna heat sink is in thermal contact with the antenna, and the antenna heat sink is in thermal contact with the housing.

[0025] In the above-mentioned camera, the image sensor board in the lens module is in heat transfer contact with the first heat sink, and the first heat sink is in heat transfer contact with the first set of walls, so the heat generated by the image sensor board can be conducted to the first set of walls through the first heat sink, and dissipated outward through the first set of walls to achieve heat dissipation of the image sensor board. At the same time, the mainboard is in heat transfer contact with the second heat sink, and the second heat sink is in heat transfer contact with the second set of walls, so the heat generated by the mainboard can be conducted to the second set of walls through the second heat sink, and dissipated outward through the second set of walls to achieve heat dissipation of the mainboard. Since the mainboard and the image sensor board have different overheating temperatures, the heat generated by the mainboard and the image sensor board are dissipated outward through different walls of the housing, respectively, so that different heat dissipation paths can be formed, so that the heat dissipation of the mainboard and the image sensor board is relatively independent, and it is not easy to affect the control of the temperature of the two due to mutual interference, so that which component may be overheated can be timely known according to the temperature of the two walls, so as to timely control the use time of the camera, try to avoid overheating, and enable the camera to work with stable performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 Schematic diagram of the overall structure of a camera in one embodiment of the present application.

[0027] Figure 2 Schematic diagram of the structure of a shell in one embodiment of the present application.

[0028] Figure 3 Schematic diagram of the positions of the lens module and the main board in one embodiment of the present application.

[0029] Figure 4 It is a cross-sectional view of a lens module in one embodiment of the present application.

[0030] Figure 5 It is a cross-sectional view of a camera in one embodiment of the present application.

[0031] Figure 6 Schematic diagram of the structure of the lens module, the first heat sink and other components in one embodiment of the present application.

[0032] Figure 7 Schematic diagram of the structure of the second heat dissipation element in one embodiment of the present application.

[0033] Figure 8 It is a schematic structural diagram of components such as a first heat sink, a battery assembly and a third heat sink in one embodiment of the present application.

[0034] Fig. 9 This is an exploded view of components such as a battery assembly, a mainboard, and a third heat sink in one embodiment of the present application.

[0035] Fig.10 Schematic diagram of the structure of the connection component in one embodiment of the present application.

[0036] Fig.11 Schematic diagram of the structure of two lens assemblies and a mounting frame in one embodiment of the present application.

[0037] Reference numerals:

[0038] Housing 100, first cover 110, display screen 111, second cover 120, middle frame 130, left microphone decoration 131, left microphone bracket 132, right microphone decoration 133, right microphone bracket 134;

[0039] A first lens assembly 200, a first lens 210, and a first image sensor board 220;

[0040] A second lens assembly 300, a second lens 310, and a second image sensor board 320;

[0041] Main board 400, chip 410;

[0042] A first heat sink 510, a base plate 511, a first extending plate 512, a second extending plate 513, a second heat sink 520, a rib 521, a third heat sink 530, a notch 531, a groove 532, a metal sheet 540, a connector 551, an exposed component 552, a fin 553, and an antenna heat sink 560;

[0043] Battery assembly 610, battery 611, battery frame 612, thermal insulation pad 630;

[0044] USB bracket 710, memory card holder 721, memory card 722, connecting plate 723, FPC 724, antenna 730;

[0045] The mounting frame 800 , the first mounting portion 810 , and the second mounting portion 820 . DETAILED DESCRIPTION

[0046] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0047] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0048] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0049] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0050] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0051] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0052] See also Figure 1 , Figures 3 to 6 , a camera provided in an embodiment of the present application includes a housing 100, a lens module, a main board 400, a first heat sink 510 and a second heat sink 520. The housing 100 has a plurality of walls, the plurality of walls form an accommodating cavity, and the plurality of walls include a first group of walls and a second group of walls. The lens module and the main board 400 are both disposed in the accommodating cavity, and the lens module includes an image sensor board. The first heat sink 510 is in thermal contact with the image sensor board, and the first heat sink 510 is in thermal contact with the first group of walls. The second heat sink 520 is in thermal contact with the main board 400, and the second heat sink 520 is in thermal contact with the second group of walls.

[0053] In the above-mentioned camera, the image sensor board in the lens module is in heat transfer contact with the first heat sink 510, and the first heat sink 510 is in heat transfer contact with the first set of walls, so the heat generated by the image sensor board can be conducted to the first set of walls through the first heat sink 510, and dissipated outward through the first set of walls to achieve heat dissipation of the image sensor board. At the same time, the main board 400 is in heat transfer contact with the second heat sink 520, and the second heat sink 520 is in heat transfer contact with the second set of walls, so the heat generated by the main board 400 can be conducted to the second set of walls through the second heat sink 520, and dissipated outward through the second set of walls to achieve heat dissipation of the main board 400. Since the main board 400 and the image sensor board have different overheating temperatures, the heat generated by the main board 400 and the image sensor board are respectively dissipated outward through different walls of the housing 100, so that different heat dissipation paths can be formed, so that the heat dissipation of the main board 400 and the image sensor board is relatively independent, and it is not easy to affect the control of the temperature of the two due to mutual interference, so that which component may be overheated can be known in time according to the temperature of the two walls, so as to timely control the use time of the camera, avoid overheating as much as possible, and enable the camera to work with stable performance.

[0054] From the perspective of the accompanying drawings, the front-to-back direction is the first direction, the up-down direction is the second direction, and the left-to-right direction is the third direction. The first direction, the second direction and the third direction are perpendicular to each other.

[0055] See also Figures 2 to 5 In some embodiments, the first set of walls includes a first cover plate 110 and a middle frame 130 connected to each other, and the second set of walls includes a second cover plate 120. The first cover plate 110 and the second cover plate 120 are arranged at intervals along the first direction, the middle frame 130 is located between the first cover plate 110 and the second cover plate 120, and the first cover plate 110, the second cover plate 120 and the middle frame 130 surround an accommodating cavity.

[0056] See also Figure 1 , Figures 3 to 6 In some embodiments, the lens module includes two lens assemblies (a first lens assembly 200 and a second lens assembly 300), each lens assembly includes an image sensor board, the first heat sink 510 includes two protruding plates spaced apart from each other, the two image sensor boards are in heat transfer contact with the two protruding plates in a one-to-one correspondence, and the two protruding plates are in heat transfer contact with the first set of wall portions.

[0057] Specifically, two lens assemblies (a first lens assembly 200 and a second lens assembly 300) are arranged along a first direction, and each lens assembly includes a lens and an image sensor board electrically connected to each other, wherein the first direction is the optical axis direction of the lens. The two extension plates are in heat transfer contact with two wall surfaces on the middle frame 130 that are arranged opposite to each other along the third direction in a one-to-one correspondence. One of the two lenses is exposed through the first cover plate 110, and the other is exposed through the second cover plate 120. Both image sensor boards are electrically connected to the main board 400, which is located on one side of the lens module along the second direction, the second direction is the length direction of the camera, and the second direction is perpendicular to the first direction.

[0058] In this embodiment, the two image sensor boards are in heat transfer contact with the two protruding plates in a one-to-one correspondence, and the two protruding plates are in heat transfer contact with two wall surfaces on the middle frame 130 that are oppositely arranged along the third direction in a one-to-one correspondence. Therefore, the heat generated by the two image sensor boards can be conducted toward the corresponding protruding plates, and then conducted to the middle frame 130, and dissipated outward through the middle frame 130, thereby effectively achieving heat dissipation of the two image sensor boards.

[0059] See also Figure 3 , Figure 4 and Figure 6 In some embodiments, the first heat sink 510 includes a substrate 511, and the two extended plates are connected to the substrate 511. In this way, the temperature of the area where the two extended plates are located can be made more uniform through the substrate 511, and local overheating is not likely to occur.

[0060] Preferably, in some embodiments, the two protruding plates and the base plate 511 are in heat transfer contact with different regions of the first set of wall portions, respectively.

[0061] Specifically, the two image sensor boards are arranged at intervals along the third direction, and the two lenses are located between the two image sensor boards; the two protruding plates extend from the substrate 511 along the first direction and are arranged at intervals, and the two protruding plates are in heat transfer contact with two wall surfaces on the middle frame 130 that are oppositely arranged along the third direction in a one-to-one correspondence, and the substrate 511 is in heat transfer contact with the first cover plate 110 in the first group of wall portions.

[0062] See also Figure 3 and Figure 4More specifically, the lens in the first lens assembly 200 is the first lens 210, and the image sensor board is the first image sensor board 220; the lens in the second lens assembly 300 is the second lens 310, and the image sensor board is the second image sensor board 320. The first image sensor board 220 is located outside the first lens 210 along the third direction, and the second image sensor board 320 is located outside the second lens 310 along the third direction. The first image sensor board 220 and the second image sensor board 320 are arranged at intervals along the third direction. From the perspective of the accompanying drawings, the first lens 210 is located in front of the second lens 310, the first image sensor board 220 is located on the left side of the first lens 210 and the second lens 310, and the second image sensor board 320 is located on the right side of the first lens 210 and the second lens 310. The two protruding plates are the first protruding plate 512 and the second protruding plate 513, both of which are connected to one end of the substrate 511 close to the two lens assemblies along the second direction. The first extension plate 512 is connected to the first image sensor board 220, and the second extension plate 513 is connected to the second image sensor board 320. The second heat sink 520 is located on a side of the main board 400 away from the substrate 511 along the first direction, and is connected to the second cover 120.

[0063] In the above-mentioned embodiment, the heat generated by the first image sensor board 220 can be conducted to the first extension plate 512, and then to the left end wall of the middle frame 130 through the first extension plate 512, and then dissipated outwards. The heat generated by the second image sensor board 320 can be conducted to the second extension plate 513, and then to the right end wall of the middle frame 130 through the second extension plate 513, and then dissipated outwards. The heat generated by the first image sensor board 220 and the second image sensor board 320 can be conducted to the substrate 511 through the first extension plate 513, and then to the first cover plate 110 through the substrate 511, and then dissipated outwards. In this way, the heat generated by the first image sensor board 220 and the second image sensor board 320 can be transferred to different areas of the first set of walls through multiple paths and then dissipated outwards, and the heat dissipation efficiency will be higher.

[0064] From the perspective of the accompanying drawings, the first cover plate 110 is the front end of the entire camera, and the second cover plate 120 is the rear end of the entire camera. The front end of the middle frame 130 is connected to the first cover plate 110, and the rear end is connected to the second cover plate 120. In some embodiments, the middle frame 130 and the first cover plate 110 are integrally formed, and the two are connected as one. In some embodiments, the middle frame 130 includes a metal skeleton and a rubber layer wrapped around the metal skeleton. Among them, the metal skeleton has good thermal conductivity, which can accelerate the absorption of heat in the accommodating cavity and reduce the temperature in the accommodating cavity. At the same time, the rubber layer can prevent the outer surface of the middle frame 130 from overheating and scalding.

[0065] Specifically, of the two lens assemblies, the first lens assembly 200 is closer to the first cover plate 110 in the front-to-back direction, and the second lens assembly 300 is away from the first cover plate 110. Correspondingly, a through hole is provided on the first cover plate 110, so that the first lens 210 is exposed through the through hole; and a through hole is also provided on the second cover plate 120, so that the second lens 310 is exposed through the through hole. The first extension plate 512 is connected to the left end wall surface of the middle frame 130, and the second extension plate 513 is connected to the right end wall surface of the middle frame 130. The substrate 511 is located near the front end in the accommodating cavity, and the first extension plate 512 and the second extension plate 513 are both extended from the substrate 511 toward the rear end, and the first extension plate 512 and the second extension plate 513 are both connected to the area near the upper end of the substrate 511, that is, the area near the lens module. The second heat sink 520 is located near the rear end in the accommodating cavity, and the main board 400 is located between the substrate 511 and the second heat sink 520.

[0066] See also Figure 2 , Figure 5 and Figure 6 In some embodiments, the display screen 111 of the camera is embedded in the first set of walls, and the substrate 511 is in heat transfer contact with the display screen 111 .

[0067] Specifically, the display screen 111 of the camera is embedded in the first cover plate 110. Since the temperature of the display screen 111 embedded in the first cover plate 110 is usually low, the substrate 511 is in heat transfer contact with the display screen 111, and the heat can be transferred to the display screen 111 with a lower temperature as much as possible, thereby evenly distributing the heat in various areas of the camera and avoiding excessive temperatures in some areas as much as possible.

[0068] See also Figures 4 to 6 In some embodiments, of the two lens assemblies, the one facing away from the main board 400 is the first lens assembly 200, and the one close to the main board 400 is the second lens assembly 300; a metal sheet 540 is connected between the protruding plate in heat transfer contact with the image sensor board in the second lens assembly 300 and the first group of walls.

[0069] Specifically, of the two walls on the middle frame 130 that are arranged opposite to each other along the third direction, one is the first wall and the other is the second wall; the distance between the main board 400 and the second cover plate 120 along the first direction is smaller than the distance between the main board 400 and the first cover plate 110 along the first direction; the first image sensor board 220 in the first lens assembly 200 is connected to the first wall through the first extension plate 512, the second image sensor board 320 in the second lens assembly 300 is connected to the second extension plate 513, and a metal sheet 540 is connected between the second extension plate 513 and the second wall.

[0070] From the perspective of the accompanying drawings, the first wall surface is the left end wall surface in the aforementioned middle frame 130, and the second wall surface is the right end wall surface in the aforementioned middle frame 130. The spacing between the main board 400 and the second cover plate 120 along the first direction is smaller than the spacing between the main board 400 and the first cover plate 110 along the first direction, indicating that the main board 400 is located in the area near the rear end of the accommodating chamber. Since the second lens assembly 300 is also located in the area near the rear end in the accommodating chamber, the heat generated by the two is superimposed, which will cause the temperature of the area near the rear end in the accommodating chamber to be higher, and the components in the second lens assembly 300 that are more sensitive to temperature may be damaged. In this embodiment, by connecting the metal sheet 540 between the second extension plate 513 and the second wall surface, the heat conduction between the second extension plate 513 and the second wall surface can be accelerated, thereby further improving the heat dissipation efficiency of the second lens assembly 300 near the rear end, making it less likely to fail due to high temperature.

[0071] Preferably, in some embodiments, the metal sheet 540 is made of aluminum alloy or magnesium alloy, so that the heat dissipation efficiency can be improved while minimizing the increase in the weight of the camera.

[0072] See also Figures 4 to 6 In some embodiments, thermal paste is filled between the two image sensor boards and the corresponding protruding boards; and / or thermal paste is filled between the protruding board in heat transfer contact with the image sensor board in the first lens assembly 200 and the first group of walls; and / or thermal paste is filled between the protruding board in heat transfer contact with the image sensor board in the second lens assembly 300 and the metal sheet 540; and / or thermal paste is filled between the metal sheet 540 and the first group of walls; and / or thermal paste is filled between the substrate 511 and the display screen 111.

[0073] Specifically, thermal conductive paste is filled between the first image sensor board 220 and the first extending plate 512 in the first lens assembly 200; and / or, thermal conductive paste is filled between the first extending plate 512 and the left end wall in the aforementioned middle frame 130; and / or, thermal conductive paste is filled between the second image sensor board 320 and the second extending plate 513 in the second lens assembly 300; and / or, thermal conductive paste is filled between the second extending plate 513 and the metal sheet 540; and / or, thermal conductive paste is filled between the metal sheet 540 and the right end wall in the middle frame 130; and / or, thermal conductive paste is filled between the substrate 511 and the display screen 111.

[0074] By providing thermal conductive paste between the above components, the heat conduction between these components can be further accelerated, thereby further improving the heat dissipation efficiency of the first image sensor board 220 and the second image sensor board 320 .

[0075] See also Figure 4In some embodiments, the middle frame 130 includes a left microphone decoration piece 131 and a right microphone decoration piece 133 embedded in the main body thereof, the left microphone decoration piece 131 is located at the left end, and the right microphone decoration piece 133 is located at the right end. A left microphone bracket 132 connected to the first extended plate 512 is provided on the left side thereof, and the left microphone bracket 132 is connected to the left microphone decoration piece 131. A right microphone bracket 134 connected to the metal sheet 540 is provided on the right side thereof, and the right microphone bracket 134 is connected to the right microphone decoration piece 133. The heat transferred to the first extended plate 512 is transferred to the left microphone decoration piece 131 via the left microphone bracket 132, and thus transferred to other areas of the left end wall surface in the middle frame 130. The heat transferred to the metal sheet 540 is transferred to the right microphone decoration piece 133 via the right microphone bracket 134, and thus transferred to other areas of the right end wall surface in the middle frame 130.

[0076] Furthermore, thermal conductive paste is filled between the first extending plate 512 and the left microphone bracket 132 ; and / or thermal conductive paste is filled between the metal sheet 540 and the right microphone bracket 134 .

[0077] In some embodiments, thermal conductive paste is filled between the second heat sink 520 and the mainboard 400 to further improve the heat dissipation efficiency of the mainboard 400 .

[0078] See also Figure 3 and Figure 7 In some embodiments, a bump may be provided on the second heat sink 520 on the side facing the mainboard 400 , and the position of the bump corresponds to the position of the chip 410 on the mainboard 400 , thereby improving the fit between the second heat sink 520 and the chip 410 , accelerating heat conduction, and quickly reducing the temperature of the chip 410 .

[0079] See also Figure 5 and Figure 7 In some embodiments, the second heat sink 520 is provided with ribs 521 protruding toward the second set of wall portions, and the second heat sink 520 is connected to the second set of wall portions through the ribs 521.

[0080] Specifically, the ribs 521 protrude toward the second cover plate 120, and the two are against each other. Each rib 521 extends in the up-down direction, and multiple ribs 521 are arranged at intervals in the left-right direction. By the raised ribs 521 being against the second cover plate 120, a gap can be formed between the area on the second heat sink 520 where the ribs 521 are not provided and the second cover plate 120, so that the air in the gap is insulated to prevent the temperature of the second cover plate 120, which is likely to be touched by the user during use, from being too high, so as to improve the user's feeling of use. In addition, the ribs 521 can support the second cover plate 120, so that the second cover plate 120 is not easily collapsed due to pressing.

[0081] See also Figure 5 and Fig.10 In some embodiments, a connecting component is provided in the accommodating cavity, and the connecting component includes an exposed part 552 and a connecting part 551 connected to each other, and the exposed part 552 is exposed through the first set of wall portions, and one of the first heat dissipation member 510 and the second heat dissipation member 520 is in heat transfer contact with the connecting part 551, and the other is in heat insulating contact with the connecting part 551.

[0082] Specifically, the connecting component is located at one end of the accommodating cavity away from the lens module along the second direction. The exposed part 552 is exposed through the wall surface of one end of the middle frame 130 away from the lens module along the second direction. From the perspective of the attached figure, the exposed part 552 is connected to the lower end of the connecting part 551, and the lower end surface in the middle frame 130 is provided with an orifice so that the exposed part 552 can be exposed. The connecting part 551 extends in the front-to-back direction, and its front end is in heat transfer contact with the substrate 511 of the first heat sink 510, and the rear end is in heat insulation contact with the second heat sink 520; or, the front end of the connecting part 551 is in heat insulation contact with the substrate 511 of the first heat sink 510, and the rear end is in heat transfer contact with the second heat sink 520. In this way, the heat conducted to the first heat sink 510 and the second heat sink 520 can be dissipated outward through the housing 100 in independent paths without interfering with each other. In addition, the heat conducted to the connecting part 551 can be dissipated to the outside through the exposed exposed part 552, and the heat dissipation efficiency will be higher.

[0083] In some embodiments, the exposed part 552 may be a nut. Preferably, a fin 553 is provided on the outer peripheral surface of the nut, and the fin 553 is embedded in the lower end plate of the middle frame 130, and heat conduction occurs therewith. By providing the fin 553 embedded in the middle frame 130, the heat at the exposed part 552 can be dissipated to the outside through the orifice, and can also be conducted to the lower end plate of the middle frame 130 with a larger area through the fin 553, and dissipated to the outside through the lower end plate, thereby improving the heat dissipation efficiency.

[0084] In some embodiments, thermal conductive paste is filled between the connecting member 551 and the exposed member 552. In this way, the heat conduction speed between the connecting member 551 and the exposed member 552 can be accelerated, thereby improving the heat dissipation efficiency.

[0085] See also Figure 5 and Fig. 9 In some embodiments, a third heat sink 530 is further disposed in the accommodating cavity and is in heat transfer contact with the mainboard 400 . The third heat sink 530 is located on a side of the mainboard 400 away from the second heat sink 520 . The third heat sink 530 is in heat transfer contact with the housing 100 .

[0086] Specifically, from the perspective of the attached figure, the third heat sink 530 is located at the front side of the mainboard 400, and the mainboard 400 is located between the third heat sink 530 and the second heat sink 520. The third heat sink 530 can be directly connected to the housing 100, or indirectly connected to the housing 100 through other components. By providing the third heat sink 530, the heat of the mainboard 400 can be dissipated outwards through the second heat sink 520 on one side thereof, and can be dissipated outwards through the third heat sink 530 on the other side thereof, thereby increasing the heat dissipation path and making the heat dissipation efficiency higher.

[0087] Preferably, the third heat sink 530 is connected to the wall portions other than the first set of wall portions and the second set of wall portions in the housing 100 , so that the heat can be dissipated outwards through different wall portions, thereby achieving higher heat dissipation efficiency.

[0088] Preferably, thermal conductive paste is filled between the mainboard 400 and the third heat sink 530 to improve the heat transfer efficiency therebetween.

[0089] See also Figure 8 In some embodiments, a USB bracket 710 is further provided in the accommodating cavity and is located between the lens module and the mainboard 400. The third heat sink 530 is fixedly connected to the USB bracket 710. The USB bracket 710 is fixedly connected to the first heat sink 510. The material of the USB bracket 710 is rubber.

[0090] Specifically, the USB bracket 710 is fixedly connected to the substrate 511 of the first heat sink 510. When the material of the USB bracket 710 is rubber, the heat conduction between the third heat sink 530 and the first heat sink 510 can be suppressed, so that the heat dissipation paths of the image sensor board and the mainboard 400 are independent of each other.

[0091] See also Figure 8 and Fig. 9 In some embodiments, the battery assembly 610 of the camera is located between the third heat sink 530 and the first heat sink 510 , and a thermal insulation pad 630 is provided between at least one of the third heat sink 530 and the first heat sink 510 and the battery assembly 610 .

[0092] Specifically, the battery assembly 610 includes a battery frame 612 and a battery 611 installed in the battery frame 612. By providing the heat insulation pad 630, it is possible to suppress the heat reaching the third heat sink 530 and the first heat sink 510 from being mutually conducted and causing interference. It can also reduce the temperature in the battery frame 612 to prevent the battery 611 from malfunctioning due to excessive temperature.

[0093] See also Figure 8 and Fig. 9 In some embodiments, a connecting plate 723 and a storage component are provided in the accommodating cavity, the connecting plate 723 is connected to the third heat sink 530 , and the storage component is installed on the connecting plate 723 .

[0094] Specifically, the storage assembly includes a memory card holder 721, and a memory card 722 installed in the memory card holder 721 and electrically connected to the main board 400. The memory card holder 721 is installed on the connecting plate 723, and the memory card 722 is inserted into the memory card holder 721 and electrically connected to the main board 400 through the FPC 724. The third heat sink 530 is provided with a notch 531 that passes through in the front-to-back direction, and the memory card holder 721 extends into the notch 531. The rear end surface of the third heat sink 530 is also provided with a groove 532 surrounding the notch 531, and the connecting plate 723 is installed in the groove 532 and bonded to the groove wall of the groove 532. Compared with directly installing the memory card 722 on the main board 400, in this embodiment, the memory card holder 721 is installed on the third heat sink 530, and the memory card 722 is indirectly electrically connected to the main board 400 via the FPC 724, thereby avoiding direct contact between the memory card 722 and the main board 400 with a higher temperature, thereby reducing the temperature of the memory card 722 to prevent the card speed from being reduced due to excessively high temperature.

[0095] See also Figure 5 In some embodiments, an antenna 730 and an antenna heat sink 560 are further disposed in the accommodating cavity. The antenna heat sink 560 is in thermal contact with the antenna 730 , and the antenna heat sink 560 is in thermal contact with the housing 100 .

[0096] Specifically, the antenna 730 is located on the side of the lens module away from the main board 400 along the second direction, the antenna heat sink 560 is connected to the side of the antenna 730 away from the lens module along the second direction, and the antenna heat sink 560 is connected to the housing 100. From the perspective of the accompanying drawings, the antenna 730 is located on the upper side of the lens module, and the antenna heat sink 560 is connected to the upper end of the antenna 730. The material of the antenna heat sink 560 is boron nitride, which can accelerate the heat dissipation of the antenna 730 without affecting the use of the antenna 730. In addition, the metal sheet 540 in the aforementioned embodiment can also be used as an antenna.

[0097] See also Figure 4 and Fig.11 In some embodiments, a mounting frame 800 connected to the housing 100 is further provided in the accommodating cavity, two lens assemblies are mounted on the mounting frame 800, and two image sensor boards are disposed on both sides of the mounting frame 800, and each protruding board is located between the corresponding image sensor board and the corresponding heat transfer area on the first group of wall portions.

[0098] Specifically, the mounting frame 800 includes a first mounting portion 810 located at the rear end, and a second mounting portion 820 located at the front end, the first lens assembly 200 is mounted on the second mounting portion 820, and the second lens assembly 300 is mounted on the first mounting portion 810. Since both lens assemblies are mounted on one component of the mounting frame 800, during assembly, the mounting frame 800 and the two lens assemblies can be first installed in a more spacious space outside the housing 100, thereby reducing the difficulty of installation. Then, the mounting frame 800 is placed in the accommodating cavity as a whole. At this time, it is only necessary to connect the mounting frame 800 to the housing 100 to complete the installation of the two lens assemblies. Compared with connecting the two lens assemblies to the housing 100 in sequence in the narrow space inside the housing 100, the structural installation steps of this embodiment are simpler and the operation difficulty is also lower. In addition, the heat of the two lens assemblies can also be conducted to the housing 100 via the mounting frame 800.

[0099] In some embodiments, the mounting bracket 800 and the housing 100 may be directly connected or indirectly connected via other components.

[0100] See also Figure 4 and Fig.11 In some embodiments, a heat conductive sheet is provided between each lens assembly and the mounting frame 800 .

[0101] Specifically, the heat conducting sheet is a graphite sheet, and a graphite sheet is disposed between the first lens assembly 200 and the second mounting portion 820, and a graphite sheet is disposed between the second lens assembly 300 and the first mounting portion 810. In this way, the heat conduction from the two lens assemblies to the mounting frame 800 can be accelerated, thereby improving the heat dissipation efficiency.

[0102] See also Figure 4 and Fig.11 In some embodiments, the first lens assembly 200 is mounted on the second mounting portion 820 via threaded fasteners, and the second lens assembly 300 is mounted on the first mounting portion 810 via threaded fasteners.

[0103] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0104] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A camera, characterized in that: The camera comprises: A housing having a plurality of wall portions, wherein the plurality of wall portions form a receiving cavity, and the plurality of wall portions include a first group of wall portions and a second group of wall portions; A lens module, disposed in the accommodating cavity, wherein the lens module comprises an image sensor board; A main board is arranged in the accommodating cavity; a first heat sink in thermal contact with the image sensor board, and the first heat sink in thermal contact with the first set of walls; The second heat sink is in heat transfer contact with the mainboard, and the second heat sink is in heat transfer contact with the second set of wall portions.

2. The camera according to claim 1, characterized in that The lens module includes two lens assemblies, each of which includes an image sensor board. The first heat sink includes two protruding plates spaced apart from each other. The two image sensor boards are in heat transfer contact with the two protruding plates in a one-to-one correspondence, and the two protruding plates are in heat transfer contact with the first group of wall portions.

3. The camera according to claim 2, characterized in that The first heat sink comprises a base plate, and the two protruding plates are both connected to the base plate.

4. The camera according to claim 3, characterized in that The two protruding plates and the base plate are in heat transfer contact with different regions of the first set of wall portions, respectively.

5. The camera according to any one of claims 2 to 4, characterized in that A mounting frame connected to the shell is also provided in the accommodating cavity, the two lens assemblies are both mounted on the mounting frame, and the two image sensor boards are respectively arranged on both sides of the mounting frame, and each of the protruding plates is located between the corresponding image sensor board and the corresponding heat transfer area on the first group of wall portions.

6. The camera according to claim 5, characterized in that A heat conducting sheet is provided between each lens assembly and the mounting frame.

7. The camera according to claim 3 or 4, characterized in that: The display screen of the camera is embedded in the first set of wall parts, and the substrate is in heat transfer contact with the display screen.

8. The camera according to claim 7, characterized in that Of the two lens assemblies, the one facing away from the main board is a first lens assembly, and the one close to the main board is a second lens assembly; A metal sheet is connected between the extended plate in thermal contact with the image sensor board in the second lens assembly and the first set of walls.

9. The camera according to claim 8, characterized in that Thermal conductive paste is filled between the two image sensor boards and the corresponding protruding boards; and / or, thermal conductive paste is filled between the protruding board in thermal contact with the image sensor board in the first lens assembly and the first group of walls; and / or, thermal conductive paste is filled between the protruding board in thermal contact with the image sensor board in the second lens assembly and the metal sheet; And / or, thermal conductive paste is filled between the metal sheet and the first set of wall portions; and / or, thermal conductive paste is filled between the substrate and the display screen.

10. The camera according to any one of claims 1 to 4, characterized in that The second heat sink is provided with ribs protruding toward the second set of wall portions, and the second heat sink is connected to the second set of wall portions through the ribs.

11. The camera according to any one of claims 1 to 4, characterized in that A connecting component is provided in the accommodating cavity, and the connecting component includes an exposed part and a connecting part connected to each other. The exposed part is exposed through the first set of wall portions. One of the first heat sink and the second heat sink is in heat transfer contact with the connecting part, and the other is in heat insulating contact with the connecting part.

12. The camera according to any one of claims 1 to 4, characterized in that A third heat sink is also provided in the accommodating cavity and is in heat transfer contact with the mainboard. The third heat sink is located on a side of the mainboard away from the second heat sink, and is in heat transfer contact with the housing.

13. The camera according to claim 12, characterized in that A USB bracket is also provided in the accommodating cavity and is located between the lens module and the mainboard. The third heat sink is fixedly connected to the USB bracket, and the USB bracket is fixedly connected to the first heat sink. The USB bracket is made of rubber.

14. The camera according to claim 12, characterized in that The battery assembly of the camera is located between the third heat sink and the first heat sink, and a heat insulation pad is provided between at least one of the third heat sink and the first heat sink and the battery assembly.

15. The camera according to claim 12, characterized in that A connecting plate and a storage component are provided in the accommodating cavity. The connecting plate is connected to the third heat sink, and the storage component is installed on the connecting plate.

16. The camera according to any one of claims 1 to 4, characterized in that An antenna and an antenna heat sink are also provided in the accommodating cavity. The antenna heat sink is in heat transfer contact with the antenna, and the antenna heat sink is in heat transfer contact with the housing.

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