Mould pressing parameter setting method and preparation method of miniature light-emitting semiconductor chip

Abstract

The invention relates to the technical field of LED (light-emitting diode) semiconductor manufacturing, solves the problems of insufficient performance and stability of chip packaging in the prior art, and provides a mold pressing parameter setting method and a preparation method of a miniature light-emitting semiconductor chip. The method comprises the following steps: determining mold parameters according to chip size parameters, thermal performance parameters and luminescence characteristic parameters; according to the luminescence characteristic parameters, the electrical characteristic parameters and the thermal performance parameters, packaging material parameters are obtained; according to the packaging material parameters and the thermal performance parameters, a mold pressing temperature range is obtained; according to the chip size parameters and the chip material parameters, the mold pressing pressure range is determined; determining a pressure holding time range according to packaging material parameters, thermal performance parameters and the mold pressing temperature range; and setting mold pressing parameters according to the mold pressing temperature range, the mold pressing pressure range and the pressure holding time range. According to the invention, the rationality of each parameter in the mold pressing process is ensured, and the packaging defect or performance reduction caused by unreasonable parameters is avoided.

Description

Technical Field

[0001] The present invention relates to the field of LED semiconductor technology, and in particular to a method for setting molding parameters of a micro-light-emitting semiconductor chip and a method for preparing the same. Background Art

[0002] The widespread application of micro-light-emitting semiconductor chips in the field of optoelectronics has led to the continuous development of their packaging technology. With the advancement of science and technology, the size of chips has gradually decreased, and the power density has continued to increase, which has put forward higher requirements for packaging technology. Traditional packaging methods have been unable to meet the needs of micro-light-emitting semiconductor chips in terms of high brightness, high power density and reliability. Therefore, the development of a new packaging technology and optimized packaging process has become a research hotspot in the industry.

[0003] Currently, the packaging process of micro-light-emitting semiconductor chips usually involves multiple links, including molding, optical packaging, thermal management, etc. In particular, molding technology is widely used in the production of micro-light-emitting semiconductor devices such as LED chips because it can complete packaging at high efficiency and effectively control the optical, thermal and electrical properties of the chip. However, traditional molding processes often face the following problems that directly affect the performance and stability of chip packaging: Traditional molding processes often fail to take into account the complex relationship between parameters such as chip size, material properties, and luminescent properties, resulting in inconsistent parameters such as pressure, temperature, and curing time during the packaging process, which in turn affects the packaging quality and reliability of the chip. Micro-light-emitting semiconductor chips are prone to heat accumulation due to their small size and high power density. If the temperature distribution is not effectively controlled during the packaging process, the chip may overheat, performance may degrade, and even cause thermal failure. The selection and use of packaging materials have an important impact on the performance of the chip. The thermal conductivity, expansion coefficient, electrical insulation and other properties of the packaging material must match the properties of the chip itself, otherwise the material may not be effectively cured during the molding process, and may even affect the light output performance. Summary of the invention

[0004] In view of this, an embodiment of the present invention provides a method for setting molding parameters of a micro light-emitting semiconductor chip and a method for preparing the same, so as to solve the problem of insufficient performance and stability of chip packaging in the prior art.

[0005] In a first aspect, an embodiment of the present invention provides a method for setting molding parameters of a micro light-emitting semiconductor chip, the method comprising: Acquire chip parameters of the micro light-emitting semiconductor chip, wherein the chip parameters include chip size parameters, chip material parameters, light-emitting characteristic parameters, electrical characteristic parameters, and thermal performance parameters; Determining mold parameters according to the chip size parameters, thermal performance parameters, and light-emitting characteristic parameters; Acquire packaging material parameters according to the luminous characteristic parameters, electrical characteristic parameters and thermal performance parameters; Obtaining a molding temperature range according to the packaging material parameters and the thermal performance parameters; Determining a molding pressure range according to the chip size parameters and chip material parameters; Determining a pressure holding time range according to the packaging material parameters, the thermal performance parameters and the molding temperature range; The molding parameters are set according to the molding temperature range, the molding pressure range and the pressure holding time range.

[0006] Preferably, obtaining the molding temperature range according to the packaging material parameters and the thermal performance parameters includes: Determine the initial molding temperature range based on the curing temperature range of the packaging material and the preset safety temperature threshold; Adjusting the upper limit of the initial molding temperature range according to the thermal conductivity of the packaging material to obtain a first intermediate molding temperature range, wherein the thermal conductivity of the packaging material and the upper limit of the initial molding temperature range are positively correlated; According to the matching degree between the thermal expansion coefficient of the chip and the thermal expansion coefficient of the packaging material, determining the upper limit adjustment value and the lower limit adjustment value of the first intermediate molding temperature range, wherein the upper limit adjustment value and the lower limit adjustment value are both positively correlated with the matching degree; Adjusting the upper limit and the lower limit of the first intermediate molding temperature range according to the upper limit adjustment value and the lower limit adjustment value to obtain a second intermediate molding temperature range; Determining the thermal stability limit temperature of the packaging material according to the temperature resistance performance parameters of the packaging material; adjusting the upper limit of the second intermediate molding temperature range according to the thermal stability limit temperature to obtain a third intermediate molding temperature range; The upper limit and / or lower limit of the third intermediate molding temperature range is adjusted according to the thermal conductivity of the chip and the thermal conductivity of the packaging material to obtain a final molding temperature range.

[0007] Preferably, determining the molding pressure range according to the chip size parameters and chip material parameters includes: Determine the chip area according to the chip size parameters; Determining an initial molding pressure range according to the chip area and a preset molding pressure range, wherein an upper limit and a lower limit of the initial molding pressure range are both negatively correlated with the chip area; Obtaining the viscosity and fluidity of the packaging material according to the packaging material parameters; The initial molding pressure range is adjusted according to the viscosity and fluidity of the packaging material to obtain an intermediate molding pressure range; The intermediate molding pressure range is adjusted according to the matching degree between the thermal expansion coefficient of the chip and the thermal expansion coefficient of the packaging material to obtain a final molding pressure range, wherein the upper limit and the lower limit of the molding pressure range are negatively correlated with the matching degree.

[0008] Preferably, determining the pressure holding time range according to the packaging material parameters, the thermal performance parameters and the molding temperature range includes: According to the packaging material parameters, the curing temperature range and the packaging material thickness are obtained; Determining the initial pressure holding time range according to the curing temperature range and the thickness of the packaging material; According to the viscosity and the fluidity of the packaging material, the upper limit and the lower limit of the initial pressure holding time range are adjusted to obtain an intermediate pressure holding time range, wherein the upper limit and the lower limit of the intermediate pressure holding time range are positively correlated with the viscosity, and the upper limit and the lower limit of the intermediate pressure holding time range are negatively correlated with the fluidity; According to the matching degree between the thermal expansion coefficient of the chip and the thermal expansion coefficient of the packaging material, the upper and lower limits of the intermediate pressure holding time range are adjusted to obtain the final pressure holding time range, wherein the upper and lower limits of the pressure holding time range are positively correlated with the matching degree.

[0009] Preferably, the molding parameters are determined according to the molding temperature range, the molding pressure range and the pressure holding time range, including: According to a preset parameter determination strategy, a first preset number of initial molding parameter combinations are obtained within the molding temperature range, the molding pressure range, and the pressure holding time range, wherein the preset parameter determination strategy includes a uniform distribution method, an orthogonal experiment method, and a random sampling method, and different initial molding parameter combinations have different molding temperatures and / or molding pressures and / or pressure holding times; Evaluating each of the initial molding parameter combinations to obtain a first intermediate molding parameter combination; Optimizing the first intermediate molding parameters to obtain a target molding parameter combination; The molding parameters are determined according to the target molding parameter combination.

[0010] Preferably, the preset parameter determination strategy is an orthogonal experiment method, and the preset parameter determination strategy is used to obtain a preset number of initial molding parameter combinations within the molding temperature range, the molding pressure range, and the pressure holding time range, including: Determine the low temperature level of the molding temperature range based on the curing temperature range and thermal performance parameters of the packaging material; Determine the medium temperature level of the molding temperature range based on the curing temperature range of the packaging material and the matching degree between the thermal expansion coefficient of the chip and the thermal expansion coefficient of the packaging material; Determining a high temperature level in the molding temperature range according to the thermal stability of the packaging material and the upper limit of the molding temperature range; Determine the low pressure level in the molding pressure range according to the chip size parameters; Determining a medium pressure level in a molding pressure range according to the mechanical strength of the chip material and the fluidity of the packaging material, wherein the mechanical strength is obtained based on the chip material parameters; Determine the high pressure level in the molding pressure range according to the chip size parameters and the viscosity and fluidity of the packaging material; Determine the short time level in the pressure holding time range according to the curing time of the packaging material and the thermal expansion coefficient of the chip; Determine a medium level in the pressure holding time range based on the fluidity of the packaging material and the thermal expansion coefficient of the packaging material; Determine the long time level in the pressure holding time range based on the thickness of the packaging material and the thermal expansion coefficient of the chip; A preset number of initial molding parameter combinations are generated according to the preset L9 orthogonal experimental table and each level in the molding temperature range, the molding pressure range and the pressure holding time range.

[0011] Preferably, the step of evaluating each of the initial molding parameter combinations to obtain a first intermediate molding parameter combination includes: Perform a molding experiment according to each of the initial molding parameter combinations to obtain a number of experimental samples corresponding to each of the initial molding parameter combinations; Performing an evaluation test on each experimental sample to obtain an evaluation test result corresponding to each combination of the initial molding parameters, wherein the evaluation test result includes a number of evaluation indicators, including packaging quality, thermal stability and luminous efficiency; Performing a single factor impact analysis on the evaluation test results according to the variance analysis method to obtain the single factor impact result of each parameter in the initial molding parameter combination on each of the evaluation indicators; According to the two-factor interaction analysis method, the combined factor influence results between the two parameter combinations in the initial molding parameter combination are obtained; According to the single factor influence result and the combined factor influence result, the synergistic efficiency between any two parameter combinations in the initial molding parameter combination is obtained; According to the synergistic efficiency, a synergistic effect matrix is ​​constructed; The initial molding parameter combination is screened according to the synergistic effect matrix to obtain a first intermediate molding parameter combination.

[0012] Preferably, the step of optimizing the first intermediate molding parameters to obtain a target molding parameter combination includes: Performing regression analysis on the evaluation test results to obtain a molding parameter response surface model; According to the intermediate molding parameter combination and the excluded initial molding parameter combination, the molding temperature range, the molding pressure range and the pressure holding time range are limited; According to the grid search method, reacquire a second preset number of second intermediate molding parameter combinations in the limited molding temperature range, the molding pressure range, and the pressure holding time range, wherein the second preset number is greater than or equal to the first preset number; Inputting the second intermediate molding parameter combination into the molding parameter response surface model to obtain a predicted response index of each second intermediate molding parameter combination, wherein the predicted response index includes packaging quality, thermal stability and luminous efficiency; The second intermediate molding parameter combination is combined according to the predicted response index to obtain a target molding parameter combination.

[0013] In a second aspect, an embodiment of the present invention further provides a method for preparing a micro light-emitting semiconductor chip, comprising: Acquire molding parameters, wherein the molding parameters are acquired according to any method described in the first aspect; According to the mold parameters and packaging material parameters, a target mold and a target packaging material for preparing a micro light-emitting semiconductor chip are obtained; placing an initial chip and a target material in a cavity of the target mold; According to the molding temperature and molding pressure, the target mold is molded, and the temperature value and pressure value during the molding process are acquired in real time to obtain real-time production data; After the pressure holding time is over, the initial chip in the target mold is cooled and demoulded to obtain the micro light-emitting semiconductor chip.

[0014] Preferably, the method for preparing a micro-light-emitting semiconductor chip further comprises: performing subsequent processing on the micro light-emitting semiconductor chip; Performing a performance test on the micro-light-emitting semiconductor chip after subsequent processing to obtain a test result; Determining whether the micro-light-emitting semiconductor chip meets a preset quality condition according to the test result; If the conditions are met, the micro light-emitting semiconductor chip is packaged and shipped out.

[0015] If not, adjusting the molding parameters according to the test results and the real-time production data; The step of returning the molding temperature and the molding pressure according to the adjusted molding parameters, molding the target mold, and acquiring the temperature value and the pressure value during the molding process in real time to obtain real-time production data.

[0016] In summary, the beneficial effects of the present invention are as follows: The method for setting the molding parameters and the preparation method of the micro-light-emitting semiconductor chip provided by the embodiment of the present invention can accurately set the parameters of the mold and the molding process through a comprehensive analysis of the parameters such as chip size, material and luminescent characteristics, so as to ensure the stable and consistent chip packaging quality of each production batch. In particular, in the packaging process of the micro-light-emitting semiconductor chip, the matching degree between the packaging material and the chip is ensured to avoid poor packaging and quality fluctuations caused by inconsistent parameters. By comprehensively considering the thermal performance parameters, the method of the present invention can reasonably control the molding temperature and molding pressure during the molding process, effectively reduce heat accumulation, and avoid chip overheating and thermal failure. By accurately adjusting the molding parameters, it can be ensured that the chip can still maintain good heat dissipation performance at high power density and extend its service life. According to the thermal properties, electrical properties and luminescent properties of the packaging material, the parameters of the packaging material are accurately selected and optimized to ensure its performance stability during the molding process. This not only improves the physical properties of the packaging material, but also effectively avoids packaging defects, chip function failure and other problems caused by material mismatch, and ensures the optoelectronic performance and use stability of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings required for use in the embodiment of the present invention will be briefly introduced below. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work, and these are all within the protection scope of the present invention.

[0018] Figure 1 It is a flow chart of a method for setting molding parameters of a micro-light-emitting semiconductor chip according to an embodiment of the present invention.

[0019] Figure 2 It is a schematic diagram of the process of preparing a micro light-emitting semiconductor chip according to an embodiment of the present invention.

[0020] Figure 3 It is another schematic diagram of the process of preparing a micro light-emitting semiconductor chip according to an embodiment of the present invention. DETAILED DESCRIPTION

[0021] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and Examples. It should be understood that the specific embodiments described herein are only configured to explain the present invention and are not configured to limit the present invention. For those skilled in the art, the present invention can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by illustrating examples of the present invention.

[0022] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0023] It should be noted that all actions of acquiring signals, information or data in the present invention are performed in compliance with the corresponding data protection laws and policies of the location and with the authorization given by the owner of the corresponding device.

[0024] Example 1

[0025] See also Figure 1 The embodiment of the present invention provides a method for setting molding parameters of a micro-light-emitting semiconductor chip, the method comprising: S1. Obtain chip parameters of a micro-light-emitting semiconductor chip, wherein the chip parameters include chip size parameters, chip material parameters, light-emitting characteristic parameters, electrical characteristic parameters, and thermal performance parameters; Specifically, this step involves collecting and organizing the basic parameters of the chip to ensure a comprehensive understanding of the chip's characteristics. Chip size parameters (such as size and shape), chip material parameters (such as material type and thermal conductivity), luminous characteristic parameters (such as wavelength and brightness), electrical characteristic parameters (such as operating voltage, current) and thermal performance parameters (such as thermal conductivity, maximum operating temperature) all need to be obtained. These parameters provide basic data for subsequent process settings.

[0026] S2. Determine mold parameters according to the chip size parameters, chip material parameters and light emitting characteristic parameters; Design appropriate mold parameters based on the chip size, material, and luminous characteristics. This step ensures that the mold adapts to the chip requirements and provides the best packaging effect by adjusting the mold cavity size, material selection, and transparent area material selection.

[0027] S3, obtaining packaging material parameters according to the light emitting characteristic parameters, electrical characteristic parameters and thermal performance parameters; This step selects the appropriate packaging material by analyzing the chip's luminous, electrical, and thermal properties. This includes determining the transparency of the packaging material, which is related to the luminous wavelength, the light scattering properties related to the brightness and scattering properties, the electrical insulation, which is related to the operating current and voltage, and the thermal conductivity and expansion coefficient, which are related to the thermal properties, to ensure that the material is adapted to the chip's operating environment.

[0028] S4. Obtaining a molding temperature range according to the packaging material parameters and the thermal performance parameters; Specifically, packaging material parameters mainly refer to parameters related to material properties during the packaging process, such as curing temperature, thermal stability, thermal conductivity, viscosity, etc. These parameters determine the performance of the material at different temperatures. For example, the curing temperature range of the material determines the minimum and maximum temperatures of the packaging process.

[0029] The thermal performance parameters of the chip mainly include thermal expansion coefficient, thermal conductivity, etc. The thermal expansion coefficient is related to the material's ability to expand or contract when the temperature changes. Thermal conductivity affects the efficiency of heat conduction during the packaging process. Too high or too low will affect the packaging quality.

[0030] Encapsulation materials usually have a certain curing temperature range, which is usually provided by the manufacturer. During the molding process, the temperature must be within this range to ensure that the material can cure correctly.

[0031] Different materials have different thermal conductivities. Materials with high thermal conductivity require higher molding temperatures, while materials with low thermal conductivity may require lower molding temperatures. In addition, when the thermal expansion coefficients of the packaging material and the chip do not match, the temperature needs to be adjusted appropriately to avoid cracks or breakage caused by thermal stress.

[0032] The final molding temperature range is determined based on the curing temperature range and thermal performance requirements of the material, which ensures that the packaging material can fully flow and solidify during the molding process, while avoiding packaging problems caused by too high or too low temperatures. Ensuring the rationality of the molding temperature range helps to improve the packaging quality, avoid incomplete material curing or thermal stress problems caused by improper temperature, and thus improve the reliability and service life of the product.

[0033] S5. Determine a molding pressure range according to the chip size parameters and chip material parameters; First, the pressure required during the molding process needs to be estimated based on the size of the chip. Larger chip areas usually require higher pressures to ensure that the material in the mold can cover the entire surface. Hard materials require higher pressures to ensure that the material flows completely and is sealed; while flexible chip materials may achieve good packaging effects at lower pressures. By combining the size and material properties of the chip, the molding pressure range is finally determined. This step ensures that the chip is not damaged while ensuring the packaging quality, which helps to improve the production efficiency and yield of the product.

[0034] S6. Determine a pressure holding time range according to the packaging material parameters, the thermal performance parameters and the molding temperature range; Specifically, the pressure holding time refers to the time that the pressure is maintained after it is applied during the molding process. An appropriate holding time helps ensure that the packaging material fully flows and completes the solidification. The required holding time is different under different packaging materials, temperature and pressure conditions. Too long or too short a holding time will affect the packaging effect and product quality. This step determines a reasonable pressure holding time range through the packaging material parameters, the thermal performance parameters and the molding temperature range. Ensuring the rationality of the pressure holding time range helps to improve the packaging quality, avoid insufficient or excessive curing of the material, and thus improve the performance and reliability of the product.

[0035] S7. Setting molding parameters according to the molding temperature range, the molding pressure range and the pressure holding time range.

[0036] Specifically, molding parameters refer to the key parameters set during the molding process, including molding temperature, molding pressure, and pressure holding time. In this step, the molding temperature, molding pressure, and holding time are comprehensively considered to obtain a set of optimal molding parameters. This set of parameters can ensure that the packaging material achieves the best fluidity, curing, and sealing during the molding process. First, according to the molding temperature range, molding pressure range, and pressure holding time range, the preliminary value of each parameter is determined, and feedback adjustments are made based on the parameters obtained by experiments or calculations and the actual effects. If a certain parameter shows a strong influence in the experiment, it may be necessary to fine-tune it to achieve the optimal packaging effect. Through the comprehensive adjustment and optimization of the molding parameters, it can be ensured that each link in the molding process can achieve the ideal packaging effect and maximize the packaging quality and product performance.

[0037] Preferably, determining the mold parameters according to the chip size parameters, chip material parameters and light emitting characteristic parameters includes: S21, determining the mold cavity size according to the chip size parameters and the preset size; First, the size of the mold cavity is determined based on the size parameters of the micro-light-emitting semiconductor chip and the preset mold design requirements. This process requires ensuring that the mold cavity matches the size and shape of the chip so that the chip can be accurately placed in the mold and the material is evenly distributed during the molding process. The size of the mold cavity plays a decisive role in the packaging quality of the chip and must be accurately calculated.

[0038] S22. Obtain chip thermal conductivity and thermal expansion coefficient according to chip material parameters; The thermal conductivity and thermal expansion coefficient of chip materials are important parameters that affect heat transfer and material matching during the molding process. By obtaining the thermal conductivity of the chip material, its thermal conductivity can be understood, which is crucial for controlling heat accumulation during the packaging process. The thermal expansion coefficient determines the degree of deformation of the chip under thermal stress and affects the stability of the chip during the molding process. Ensuring the accuracy of these parameters helps to select suitable mold materials and design optimization.

[0039] S23, determining a mold material according to the thermal conductivity of the chip and the thermal expansion coefficient; In this step, the mold material that matches the chip is selected based on its thermal conductivity and thermal expansion coefficient. The ideal mold material should have appropriate thermal conductivity to effectively dissipate heat and prevent the chip from being damaged due to heat accumulation during the packaging process. At the same time, the thermal expansion coefficient of the mold material should be close to that of the chip material to reduce stress concentration caused by thermal differences during the molding process and ensure that the fit between the chip and the mold does not deform or damage.

[0040] S24, acquiring the luminous wavelength and target brightness according to the luminous characteristic parameters; This step provides the necessary optical performance data for mold design by analyzing the chip's luminous characteristic parameters, especially the luminous wavelength and target brightness. Different luminous wavelength and brightness requirements may affect the selection of packaging materials and the design of the transparent area of ​​the mold. By understanding these luminous characteristics, it can be ensured that the mold design can fully transmit light and optimize brightness output.

[0041] S25, determining the material of the transparent area of ​​the mold according to the light emission wavelength and the target brightness; Based on the emission wavelength and target brightness, select the appropriate transparent area material. The design of the transparent area directly affects the chip's luminous efficiency, ensuring that light can be efficiently transmitted through the mold. Different emission wavelengths and brightness require different transparency and optical properties. Therefore, selecting the appropriate transparent material can effectively improve the luminous effect and reduce light loss.

[0042] S26, obtaining the mold parameters according to the mold material, the mold transparent area material and the mold cavity size.

[0043] Finally, the specific parameters of the mold are determined based on the selected mold material, transparent area material, and cavity size. These parameters combine the mold's structure, optical performance, and thermal characteristics to ensure that the mold can efficiently and accurately complete the chip packaging task during the actual production process. By optimizing the mold design and selecting suitable materials, the packaging quality can be improved and the stability and longevity of the chip can be guaranteed.

[0044] Preferably, obtaining packaging material parameters according to the luminous characteristic parameters, electrical characteristic parameters and thermal performance parameters includes: S31, acquiring the luminous wavelength, target brightness and light scattering characteristics according to the luminous characteristic parameters; According to the luminous characteristics of the chip, the luminous wavelength is first obtained, which is the core parameter that determines the optical performance of the chip. Different wavelengths affect the optical absorption, transmittance and scattering characteristics of the material. The target brightness is the luminous intensity requirement of the chip when it is working, which will determine the optical reflection and transmittance of the packaging material. The light scattering characteristics determine how the packaging material affects the propagation direction and distribution of the emitted light. These factors combined affect the light output effect after packaging.

[0045] S32, determining the transparency of the packaging material according to the light emission wavelength; The transparency of the packaging material directly affects the luminous effect, especially in applications with high brightness requirements. According to the emission wavelength of the chip, a packaging material with appropriate optical transparency can be selected to ensure that light can efficiently pass through the packaging material and reach the outside. Different wavelengths of light have different transmittances to materials. Therefore, it is necessary to select a packaging material with appropriate transparency according to the emission wavelength to maximize the light output of the chip.

[0046] S33, determining the scattering characteristics of the packaging material according to the target brightness and the light scattering characteristics; According to the target brightness and light scattering characteristics of the chip, select the appropriate packaging material to ensure that the light is evenly scattered during the packaging process. The higher the brightness, the higher the scattering characteristics require for uniform distribution of light. The scattering characteristics of the packaging material determine the propagation effect of light. Too strong scattering may cause light loss, while too weak scattering may affect the uniformity of light. Therefore, the packaging material should have appropriate scattering characteristics to achieve the expected brightness and light effect.

[0047] S34, determining the operating current and the operating voltage according to the electrical characteristic parameters; Electrical characteristic parameters include the chip's operating current and operating voltage, which directly affect the chip's power consumption and heat generation. By understanding these electrical characteristics, it is possible to predict the voltage and current load that the packaging material will bear during operation, and thus select packaging materials with appropriate electrical insulation properties. When the operating current and voltage are high, the packaging material needs to have higher electrical insulation to ensure the normal operation of the chip and avoid electrical failures.

[0048] S35, determining electrical insulation performance parameters of packaging materials according to the operating current and the operating voltage; The electrical insulation performance that the packaging material needs to have is determined based on the operating current and operating voltage of the chip. The electrical insulation of the packaging material is the key to preventing short circuits caused by current passing through the packaging layer. For high current and high voltage applications, it is necessary to select packaging materials with high electrical insulation to ensure that they remain stable under electrical loads and avoid electrical failures caused by poor insulation.

[0049] S36. Determine the thermal conductivity and thermal expansion coefficient of the packaging material according to the thermal performance parameters, wherein the thermal performance parameters include the thermal conductivity and maximum operating temperature of the chip; Thermal performance parameters involve the thermal conductivity and maximum operating temperature of the chip. The thermal conductivity of the packaging material determines its ability to conduct heat during operation, while the thermal expansion coefficient determines the dimensional change of the material as the temperature changes. According to the thermal performance of the chip, a packaging material with appropriate thermal conductivity can be selected to ensure that the heat of the chip can be quickly dissipated to avoid overheating. At the same time, the thermal expansion coefficient of the packaging material needs to match the thermal expansion coefficient of the chip to reduce the stress caused by temperature changes and ensure the stability and long life of the chip.

[0050] S37. Determine the temperature resistance parameters of the packaging material based on the thermal and electrical properties.

[0051] The temperature resistance of the packaging material is determined based on the thermal and electrical properties of the chip. This involves the stability of the packaging material at high temperatures, especially when the chip may generate a lot of heat in a high current, high power working environment. Temperature resistance is an important characteristic of packaging materials in long-term use. Too low temperature resistance may cause the packaging material to soften, deform or degrade at high temperatures, affecting the working efficiency and life of the chip. Therefore, it is necessary to select packaging materials with high temperature resistance based on the thermal performance and electrical load of the chip.

[0052] Preferably, obtaining the molding temperature range according to the packaging material parameters and the thermal performance parameters includes: S41, determining an initial molding temperature range according to a curing temperature range of the packaging material and a preset safety temperature threshold; Specifically, the initial molding temperature range is set according to the curing temperature range of the packaging material and the preset safety temperature threshold. The curing temperature range indicates that the packaging material can be effectively cured within this temperature range, so the temperature during the molding process needs to fall within this range to ensure the smooth progress of the curing reaction. The safety temperature threshold is to prevent damage to the chip or packaging material due to excessively high or low temperatures. Therefore, the initial molding temperature range is determined by intersecting the curing temperature range with the safety temperature threshold to ensure that the temperature during the molding process can support the curing reaction without causing damage to the material or chip.

[0053] S42, adjusting the upper limit of the initial molding temperature range according to the thermal conductivity of the packaging material to obtain a first intermediate molding temperature range, wherein the thermal conductivity of the packaging material and the upper limit of the initial molding temperature range are positively correlated; Specifically, the thermal conductivity of the packaging material is used to adjust the upper limit of the initial molding temperature range. Materials with higher thermal conductivity can effectively transfer heat from local areas to other areas, so in this case, the upper limit of the molding temperature can be increased to ensure uniform heat distribution and avoid local overheating. On the contrary, for materials with lower thermal conductivity, excessively high temperatures may cause heat to be concentrated in certain areas, so the upper limit of the molding temperature needs to be lowered to prevent damage to the packaging material or chip due to uneven temperature.

[0054] S43, determining an upper limit adjustment value and a lower limit adjustment value of the first intermediate molding temperature range according to the matching degree between the thermal expansion coefficient of the chip and the thermal expansion coefficient of the packaging material, wherein the upper limit adjustment value and the lower limit adjustment value are both positively correlated with the matching degree; Specifically, the upper and lower limits of the molding temperature range will be adjusted according to the matching of the thermal expansion coefficients of the chip and the packaging material. The thermal expansion coefficients of the chip and the packaging material determine their expansion rate when heated. If the thermal expansion coefficients of the two are well matched, it means that they expand or contract at similar rates when the temperature changes, thereby reducing the generation of thermal stress and avoiding damage to the material due to excessive stress. Therefore, adjusting the upper and lower limits of the molding temperature range to match these two coefficients can better control thermal stress and improve packaging quality.

[0055] S44, adjusting the upper limit and the lower limit of the first intermediate molding temperature range according to the upper limit adjustment value and the lower limit adjustment value to obtain a second intermediate molding temperature range; According to the thermal expansion coefficient matching analysis, the upper and lower limits of the molding temperature range are adjusted to form the second intermediate molding temperature range. The purpose of this step is to make the temperature range more accurate, minimize the stress caused by temperature changes, and optimize the temperature control during the packaging process to ensure the packaging quality and long-term stability of the chip.

[0056] S45, determining the thermal stability limit temperature of the packaging material according to the temperature resistance performance parameter of the packaging material; S46, adjusting the upper limit value of the second intermediate molding temperature range according to the thermal stability limit temperature to obtain a third intermediate molding temperature range; Specifically, the thermal stability limit temperature of the packaging material is used to adjust the upper limit of the second intermediate molding temperature range. The thermal stability limit temperature is the highest temperature that the packaging material can withstand within a certain period of time. If this temperature is exceeded, the material may thermally degrade or fail. By using the thermal stability limit temperature as a reference and adjusting the upper limit of the molding temperature, the third intermediate molding temperature range is obtained to ensure that the temperature during the molding process does not exceed the thermal stability limit of the material, thereby protecting the packaging material and the chip from damage.

[0057] S47. Adjust the upper limit and / or lower limit of the third intermediate molding temperature range according to the thermal conductivity of the chip and the thermal conductivity of the packaging material to obtain a final molding temperature range.

[0058] The upper and lower limits of the molding temperature range will be further adjusted according to the thermal conductivity of the chip and the thermal conductivity of the packaging material. The difference in thermal conductivity between the chip and the packaging material will affect the distribution and conduction efficiency of heat. Therefore, the final temperature range adjustment is to ensure that the heat can be evenly distributed and will not cause local overheating or uneven cooling due to the difference in thermal conductivity, and finally obtain an optimized molding temperature range.

[0059] Preferably, determining the molding pressure according to the chip size parameters and chip material parameters includes: S51, determining the chip area according to the chip size parameters; Specifically, the chip area is determined based on the chip size parameters. The chip size directly determines the force distribution and compression effect during the molding process. Generally, the larger the chip area, the greater the molding pressure required on its surface. Therefore, the chip area is first calculated based on the length and width of the chip, which in turn affects the subsequent molding pressure setting.

[0060] S52, determining an initial molding pressure range according to the chip area and a preset molding pressure range, wherein both an upper limit and a lower limit of the initial molding pressure range are negatively correlated with the chip area; Specifically, when determining the initial molding pressure range in this step, it is set according to the area of ​​the chip and the preset molding pressure range. The relationship between the chip area and the molding pressure is negatively correlated, that is, the larger the chip area, the lower the required molding pressure is usually; conversely, the smaller the area, the higher the required molding pressure. In order to ensure the balance and effectiveness of the molding process, the initial molding pressure range should be adjusted according to the chip area. Specifically, within the preset molding pressure range, considering the size of the chip area, the upper and lower limits are appropriately set to ensure that the pressure can adapt to both large-area chips and small-area chips.

[0061] S53, obtaining the viscosity and fluidity of the packaging material according to the packaging material parameters; Specifically, the viscosity and fluidity of the packaging material are obtained through its parameters. The viscosity of the packaging material affects its fluidity during the molding process. The higher the viscosity, the worse the material fluidity, and more pressure needs to be applied during molding to ensure uniform distribution of the material. On the contrary, materials with lower viscosity flow more easily, and the corresponding molding pressure requirements are lower. In addition, fluidity also determines whether the packaging material can fully fill the small gaps in the mold during the molding process, so the molding pressure needs to be adjusted according to the viscosity and fluidity of the material.

[0062] S54, adjusting the initial molding pressure range according to the viscosity and fluidity of the packaging material to obtain an intermediate molding pressure range; Specifically, the initial molding pressure range is adjusted in combination with the viscosity and fluidity of the packaging material. Specifically, when the viscosity of the packaging material is high, in order to enable the material to flow better, it may be necessary to increase the molding pressure to overcome the flow obstacles caused by high viscosity; conversely, if the viscosity of the material is low, the molding pressure can be appropriately reduced. Fluidity will also affect the pressure adjustment: materials with poor fluidity require greater pressure to fill the mold, while materials with better fluidity require less pressure. Therefore, in this step, both viscosity and fluidity will become important bases for adjusting the molding pressure range, and finally the intermediate molding pressure range will be obtained.

[0063] S56. Adjust the intermediate molding pressure range according to the matching degree between the thermal expansion coefficient of the chip and the thermal expansion coefficient of the packaging material to obtain a final molding pressure range, wherein the upper limit and the lower limit of the molding pressure range are negatively correlated with the matching degree.

[0064] Specifically, when adjusting the intermediate molding pressure range, further optimization will be performed based on the degree of matching between the thermal expansion coefficients of the chip and the packaging material. The thermal expansion coefficients of the chip and the packaging material reflect the degree to which they expand or contract when heated. If the difference in thermal expansion coefficients between the two is too large, uneven stress may be generated during the molding process, leading to packaging quality problems. Therefore, it is necessary to adjust the molding pressure range based on the degree of matching of the thermal expansion coefficients. Generally, if the thermal expansion coefficients of the chip and the packaging material match well, the molding pressure can be reduced because the thermal stress between the materials is small. Conversely, if the matching is poor, the molding pressure needs to be increased to compensate for the stress caused by the difference in thermal expansion. Ultimately, through this adjustment, an optimized molding pressure range is obtained.

[0065] Preferably, determining the pressure holding time range according to the packaging material parameters, the thermal performance parameters and the molding temperature range includes: S61, obtaining a curing temperature range and a thickness of the packaging material according to packaging material parameters; At this stage, the first thing to do is to obtain the curing temperature range of the encapsulation material, which refers to the temperature range required for the material to go from an uncured state to a fully cured state. The curing temperature range is closely related to the chemical properties of the material, thermal stability, and the influence of external temperature. Generally, materials with a narrower curing temperature range cure more accurately and stably, but a wider temperature range may affect the performance of the material. The thickness of the encapsulation material is also a key factor, because thicker materials require more time to ensure uniform distribution of heat and complete curing. Therefore, the curing temperature range and the thickness of the encapsulation material provide preliminary guidance to help determine the temperature and time range of the curing process.

[0066] S62, determining an initial pressure holding time range according to a curing temperature range and a thickness of the packaging material; In this step, the curing temperature range and the thickness of the encapsulation material are combined to determine the initial pressure hold time. Generally speaking, the thicker the encapsulation material, the longer it takes to cure, because the heat transfer rate within the material is slower and it may take longer to complete uniform curing. On the other hand, materials with a higher curing temperature range will cure in a shorter time, so the initial pressure hold time should also be shortened appropriately. By considering the relationship between curing temperature and material thickness, a preliminary pressure hold time range can be obtained, which is the basis for further adjustments and optimizations.

[0067] S63, adjusting the upper limit and the lower limit of the initial pressure holding time range according to the viscosity and the fluidity of the packaging material to obtain an intermediate pressure holding time range, wherein the upper limit and the lower limit of the intermediate pressure holding time range are positively correlated with the viscosity, and the upper limit and the lower limit of the intermediate pressure holding time range are negatively correlated with the fluidity; Adjust the upper and lower limits of the initial pressure hold time range to obtain an intermediate pressure hold time range based on the viscosity and fluidity of the encapsulation material. The viscosity and fluidity of the encapsulation material have a significant impact on its curing process. Materials with higher viscosities have poor fluidity and generally require longer hold times to ensure uniform distribution and adequate curing of the material. Conversely, materials with better fluidity can flow into the mold more easily and fill voids, so the time required to cure can be shorter. Based on the fluidity characteristics of these materials, adjust the initial hold time range to suit the material's fluidity requirements. For example, when the viscosity is high, increase the upper limit of the hold time; when the fluidity is poor, the lower limit of the hold time will also increase accordingly. This step helps further refine the pressure hold time range to suit the curing characteristics of different materials.

[0068] S64. According to the matching degree between the thermal expansion coefficient of the chip and the thermal expansion coefficient of the packaging material, the upper limit and the lower limit of the intermediate pressure holding time range are adjusted to obtain a final pressure holding time range, wherein the upper limit and the lower limit of the pressure holding time range are positively correlated with the matching degree.

[0069] According to the matching degree between the thermal expansion coefficient of the chip and the thermal expansion coefficient of the packaging material, the upper and lower limits of the intermediate pressure holding time range are adjusted to obtain the final pressure holding time range. The thermal expansion coefficients of the chip and the packaging material are key factors affecting stress and deformation during the curing process. When the thermal expansion coefficients of the chip and the packaging material are very different, the stress during the thermal expansion process may cause deformation of the material or damage to the chip. Therefore, the pressure holding time needs to be appropriately extended to relieve this stress. When the thermal expansion coefficients match well, the thermal expansion of the two is basically synchronized during the curing process, and the curing can be completed in a shorter time. Therefore, the upper and lower limits of the intermediate holding time range are adjusted to be positively correlated with the matching degree of the thermal expansion coefficients of the chip and the packaging material. That is, when the thermal expansion matching degree is high, the holding time can be shortened, otherwise it can be extended. This ensures that the stress between the chip and the packaging material is minimized during the curing process, thereby improving the packaging quality.

[0070] Through these four steps, the pressure holding time range can be accurately adjusted according to the characteristics of the packaging material, the curing requirements, and the matching of thermal expansion, thereby optimizing the entire molding process, ensuring that the packaging material is fully cured, and avoiding potential problems caused by stress differences. These steps effectively improve production efficiency, reduce material waste, and improve the reliability and stability of the final product.

[0071] Preferably, the molding parameters are determined according to the molding temperature range, the molding pressure range and the pressure holding time range, including: S71. According to a preset parameter determination strategy, a first preset number of initial molding parameter combinations are obtained within the molding temperature range, the molding pressure range, and the pressure holding time range, wherein the preset parameter determination strategy includes a uniform distribution method, an orthogonal experiment method, and a random sampling method, and different initial molding parameter combinations have different molding temperatures and / or molding pressures and / or pressure holding times; Specifically, according to the preset parameter determination strategy, a first preset number of initial molding parameter combinations are obtained within the molding temperature range, molding pressure range, and pressure holding time range. The purpose of this step is to generate a set of initial molding parameter combinations according to the preset strategy to provide a basis for subsequent optimization. The preset parameter determination strategy includes uniform distribution method, orthogonal experiment method, and random sampling method. The advantage of the uniform distribution method is that it can ensure that the distribution of parameters is relatively uniform in the entire range, avoiding oversampling in certain areas; the orthogonal experiment method can effectively evaluate the impact of each factor on the result by systematically combining multiple factors through designing experiments; the random sampling method can provide a wider coverage of parameter space by randomly selecting different parameter combinations. According to these strategies, the first preset number of initial molding parameter combinations will be reasonably distributed and sampled within the molding temperature range, molding pressure range, and pressure holding time range to ensure the comprehensiveness and accuracy of the experimental results.

[0072] S72, evaluating each of the initial molding parameter combinations to obtain a first intermediate molding parameter combination; Specifically, each of the initial molding parameter combinations is evaluated to obtain a first intermediate molding parameter combination. At this stage, each initial molding parameter combination will undergo a series of evaluations, which will usually include multiple evaluation indicators such as luminous efficiency, thermal stability, packaging quality, and production cost. By testing and recording these indicators, it is possible to identify which parameter combinations perform better in overall performance and which ones need further optimization. Based on the evaluation results, the parameter combination with better performance can be screened out as the first intermediate molding parameter combination. The goal of this step is to select the combination with the best performance from a series of initial parameter combinations obtained in the first step, to provide a basis for subsequent optimization.

[0073] S73, optimizing the first intermediate molding parameters to obtain a target molding parameter combination; Specifically, the first intermediate molding parameters are optimized to obtain a target molding parameter combination. In this step, the first intermediate molding parameter combination is further optimized based on the evaluation result. The optimization means may include response surface method, genetic algorithm, particle swarm algorithm, etc. These methods can find a more suitable parameter combination by further exploring and adjusting the parameter space. Through multiple iterations and tuning, the energy consumption in production can be effectively reduced, the packaging quality and stability can be improved, and finally a target molding parameter combination with optimal performance can be obtained.

[0074] S74, determining molding parameters according to the target molding parameter combination.

[0075] According to the target molding parameter combination, the molding parameters are determined. In this step, the target molding parameter combination is finally determined, that is, the best parameter combination optimized in step S73. This combination will be used as the molding parameters in the subsequent production process to ensure the stability of the production process, the quality and efficiency of the product. The determination of the target molding parameter combination is based on a comprehensive consideration of the influence of various factors (such as temperature, pressure, time), and through the optimization process, it is ensured that these parameter combinations can achieve the best effect in practical applications.

[0076] In one embodiment, the preset parameter determination strategy is an orthogonal experimental method; Specifically, the orthogonal experimental design ensures that multiple combinations of each parameter are considered by setting different experimental levels, thereby comprehensively covering possible parameter combinations. Since the present invention needs to find the optimal parameter combination among multiple factors (molding temperature, molding pressure, and pressure holding time), the orthogonal design can explore the parameter space more efficiently while keeping the number of experiments low. Compared with the uniform distribution method, the orthogonal design can reduce redundant tests more systematically. For example, the uniform distribution method generates a large number of repeated parameter combinations, while the orthogonal design maintains a smaller number of experiments by reducing unnecessary combinations, while covering more key parameter combinations. If the uniform distribution method is adopted, assuming that each parameter is divided into 5 levels (5 for temperature, pressure, and time), 125 groups of experiments are required, which may be too large for experimental cost and time, especially in a complex manufacturing environment, which may result in too much repeated data. The orthogonal experimental design efficiently explores the influence of important factors through a smaller set of experiments (such as 9 groups) and can quickly obtain important results.

[0077] Moreover, in the parameter setting of the molding process, the three factors of temperature, pressure and time often have complex interactions. Orthogonal experimental design can take into account the individual effects of each factor while also considering the interaction between them (for example, the effect of the interaction between temperature and pressure on molding quality). This is very important for finding the parameter combination with the best comprehensive performance.

[0078] Finally, orthogonal experimental design has a good balance between "precision" and "efficiency", and is suitable for finding the optimal parameter combination under the influence of multiple factors, especially in the current situation where experimental costs are high. Orthogonal experimental design has higher efficiency and accuracy in this multi-parameter, multi-level optimization problem, and can quickly find the optimal parameter combination without conducting a large number of invalid experiments. Therefore, orthogonal design is the most suitable method for generating initial parameter combinations for this solution.

[0079] The strategy is determined according to the preset parameters, and a preset number of initial molding parameter combinations are obtained within the molding temperature range, the molding pressure range, and the pressure holding time range, including: S711, determining a low temperature level of a molding temperature range according to a curing temperature range and thermal performance parameters of the packaging material; The curing temperature range of the encapsulation material determines the lowest temperature at which the material can effectively cure during the molding process. The low temperature level must be set to ensure that the material begins to cure while avoiding insufficient material flow or incomplete curing due to low temperatures. Thermal performance parameters, such as thermal conductivity and thermal expansion coefficient, affect the material's fluidity and stress distribution at low temperatures.

[0080] Assume that the curing temperature range of the encapsulation material is 150°C to 180°C. To ensure that the material can begin to cure at the lowest temperature, the low temperature level is usually set at or slightly above the lower limit of the curing temperature range. For example, the low temperature level is set at 150°C.

[0081] The thermal conductivity and thermal expansion coefficient of the material determine the fluidity and stress distribution of the material at low temperatures. The low temperature level needs to ensure that the material can fully flow and adapt to the thermal expansion of the chip in the early stage of curing to avoid uneven curing of the material due to too low temperature.

[0082] Combined with the curing temperature range and thermal performance parameters, the reasonable setting of the low temperature level ensures the basic temperature conditions of the molding process, which not only meets the material curing requirements but also avoids the adverse effects of low temperature.

[0083] S712, determining a medium temperature level in the molding temperature range according to the curing temperature range of the packaging material and the matching degree between the thermal expansion coefficient of the chip and the thermal expansion coefficient of the packaging material; Specifically, the setting of the medium temperature level needs to optimize the thermal expansion matching between the chip and the packaging material while ensuring the effective curing of the material, and reduce the stress caused by temperature changes. Good thermal expansion matching can reduce the thermal stress generated during the packaging process, thereby improving the packaging quality and chip reliability. Continuing with 150°C to 180°C as an example, the medium temperature level is usually set at the middle value of the curing temperature range, such as 165°C, to balance the curing speed and material stability. Assume that the thermal expansion coefficient of the chip is 4.2e-6 / K and that of the packaging material is 6.5e-6 / K. When the degree of matching is high, the medium temperature level can be slightly higher than the middle value to promote uniform curing; when the degree of matching is low, the medium temperature level needs to be adjusted appropriately to relieve thermal stress. By combining the degree of matching of the thermal expansion coefficient, the setting of the medium temperature level not only ensures the effective curing of the material, but also optimizes the thermal stress distribution between the chip and the packaging material, thereby improving the packaging quality.

[0084] S713, determining a high temperature level in the molding temperature range according to the thermal stability of the packaging material and the upper limit of the molding temperature range; The high temperature level must be set within the thermal stability limit of the packaging material to ensure that the material can be fully cured while avoiding material degradation or chip damage due to excessive temperature. The thermal stability parameters ensure that the structure and performance of the material are not negatively affected at high temperatures.

[0085] Assuming the thermal stability limit of the packaging material is 190°C, the high temperature level needs to be set within a range that does not exceed this limit.

[0086] At the upper end of the curing temperature range of 180°C, combined with thermal stability, the high temperature level is set at 180°C. This ensures that the material can fully cure at the highest temperature while not exceeding its thermal stability limit and avoiding material degradation.

[0087] By combining the thermal stability of the packaging material, the appropriate setting of the high temperature level ensures the complete curing of the material during the molding process while protecting the structural integrity of the chip and packaging material.

[0088] S714, determining a low pressure level in a molding pressure range according to chip size parameters; The low pressure level should be set based on the chip area to ensure that large-area chips will not be damaged due to excessive pressure during the molding process. A reasonable low pressure level ensures that the packaging material can evenly cover the chip surface without exerting excessive mechanical stress on the chip.

[0089] Assume the chip area is 10 cm 2. A larger chip area requires a lower pressure to avoid local overpressure that may cause chip deformation or damage. Based on the negative correlation between chip area and molding pressure, the low pressure level is set to 500 MPa. This pressure is sufficient to ensure uniform distribution of materials while avoiding excessive pressure on large-area chips. By reasonably setting the low pressure level based on chip size parameters, it is ensured that the pressure during the packaging process can effectively cover the chip without causing mechanical damage to the chip.

[0090] S715, determining a medium pressure level in a molding pressure range according to the mechanical strength of the chip material and the fluidity of the packaging material, wherein the mechanical strength is obtained based on the chip material parameters; The setting of medium pressure level needs to consider the mechanical strength of chip material and the fluidity of packaging material. Chips with high mechanical strength need sufficient pressure to ensure the tight bonding of packaging material, while the fluidity of packaging material determines its distribution effect under pressure. Reasonable medium pressure level balances chip protection and effective flow of packaging material.

[0091] Assuming that the chip material has high mechanical strength and high compressive resistance, high pressure is required to ensure the tight bonding of the packaging material. The packaging material has moderate fluidity and can be evenly distributed under moderate pressure, but does not require excessive pressure to achieve this.

[0092] Considering the mechanical strength and fluidity, the medium pressure level is set to 700 MPa. This pressure is sufficient to ensure the protection of high mechanical strength chips, while the encapsulation material can achieve good flow and coverage under medium pressure.

[0093] S716, determining a high pressure level within a molding pressure range according to chip size parameters and viscosity and fluidity of the packaging material; The high pressure level setting needs to be based on the chip size, the viscosity and fluidity of the packaging material. Smaller chips and high-viscosity, low-fluidity materials require higher pressure to ensure that the material can fully fill the mold and cover the chip surface. Reasonable high pressure level ensures comprehensive coverage and curing quality of the packaging material.

[0094] Assume the chip size is small, with an area of ​​5 cm 2 . Smaller chips require higher pressure to ensure that the encapsulation material can fully cover and fill the space around the chip. The higher viscosity and poor fluidity of the encapsulation material mean that higher pressure is required during the molding process to push the material to flow and fill the mold. Based on the chip size and material properties, the high pressure level is set to 900MPa. This pressure can overcome the flow obstacles of high-viscosity materials and ensure that small-sized chips are fully encapsulated. By combining the chip size and the viscosity and fluidity of the encapsulation material, the reasonable setting of the high pressure level ensures full coverage of the encapsulation material and high-quality curing.

[0095] S717, determining a short-time level in the pressure holding time range according to the curing time of the packaging material and the thermal expansion coefficient of the chip; The short time level setting needs to be based on the curing time of the packaging material and the matching degree of thermal expansion coefficient between the chip and the packaging material. Fast curing materials and good thermal expansion matching allow shorter holding time to improve production efficiency while reducing the accumulation of thermal stress.

[0096] Assuming that the curing time of the packaging material is short, it only takes 30 seconds to complete basic curing. The high matching of the thermal expansion coefficients of the chip and the packaging material means that the thermal stress generated during the curing process is small and there is no need to maintain pressure for a long time to relieve the stress. Based on the matching of curing time and thermal expansion, the short time level is set to 30 seconds. This time is sufficient to complete the initial curing of the material while avoiding the accumulation of thermal stress caused by maintaining pressure for a long time.

[0097] S718, determining a medium level in the pressure holding time range according to the fluidity of the packaging material and the thermal expansion coefficient of the packaging material; The setting of the medium time level needs to be based on the fluidity of the packaging material and the matching degree of the thermal expansion coefficient. Moderate fluidity and medium matching require both ensuring sufficient flow and solidification of the material and controlling the accumulation of thermal stress to balance packaging quality and production efficiency.

[0098] Assuming that the encapsulation material has moderate fluidity, it can be well distributed under moderate pressure, but it needs appropriate time to ensure that the mold is fully filled and cured. The moderate thermal expansion coefficient match between the chip and the encapsulation material means that certain thermal stress will be generated during the curing process, which requires appropriate holding time to relieve. Based on the fluidity and thermal expansion matching, the medium time level is set to 60 seconds. This time is enough to ensure sufficient flow and filling of the encapsulation material, while controlling thermal stress through appropriate holding time to ensure packaging quality.

[0099] By combining the fluidity of the packaging material and the matching degree of the thermal expansion coefficient, the reasonable setting of the medium time level ensures the full curing of the material and the effective control of thermal stress.

[0100] S719, determining a long time level in the pressure holding time range according to the thickness of the packaging material and the thermal expansion coefficient of the chip; The setting of the long time level needs to consider the thickness of the packaging material and the matching degree of thermal expansion coefficient between the chip and the packaging material. Thicker packaging materials require longer curing time to ensure uniform internal heat distribution and complete curing, while poor matching of thermal expansion coefficients may lead to higher thermal stress and require longer holding time to relieve stress.

[0101] Assuming the packaging material thickness is 5 mm, thicker materials require longer time to ensure internal heat transfer and complete curing of the material. The low thermal expansion coefficient matching between the chip and the packaging material means that greater thermal stress will be generated during the curing process, and a longer holding time is required to relieve the stress and avoid material deformation or chip damage. Based on the thickness and thermal expansion matching, the long time level is set to 90 seconds. This time ensures that the packaging material can be fully cured in the case of a larger thickness, and the stress caused by the mismatch of thermal expansion coefficients is effectively relieved through a longer holding time.

[0102] By combining the thickness of the packaging material and the matching degree of the thermal expansion coefficient, the reasonable setting of the long-term level ensures the full curing of the thick layer material and the effective control of thermal stress, thereby improving the packaging quality and product reliability.

[0103] The orthogonal experimental method relies on different levels of each factor to design experimental combinations. If these levels are not set reasonably, the experimental results may not be representative and cannot cover all situations that may be encountered in actual production, thus affecting the validity of the results. Reasonable low, medium and high levels ensure that the experiment can cover various extreme and common situations that may occur in the production process. And reasonable level division enables the orthogonal experimental method to find the best combination within different ranges of each factor. Through the division of low, medium and high levels, the performance of each factor at different levels can be systematically evaluated, thereby providing more accurate data support for the final optimization. Reasonable level division can refine the impact of each factor on product quality, so that in the subsequent optimization process, the most suitable molding parameters can be accurately selected.

[0104] In summary, the main purpose of reasonably determining the three levels of low, medium and high is to ensure that the orthogonal experimental method can effectively cover the process space in actual production, thereby reducing the number of experiments, improving experimental efficiency, and ensuring data reliability and experimental optimization accuracy. Reasonable level division not only ensures the representativeness of the experiment, but also makes the optimization process more efficient and controllable through the simplification of experimental design and the accuracy of statistical analysis, and provides accurate data support for the improvement of production processes.

[0105] S7110. Generate a preset number of initial molding parameter combinations according to the preset L9 orthogonal experiment table and each level in the molding temperature range, the molding pressure range, and the pressure holding time range.

[0106] The L9 orthogonal experimental table is suitable for experimental designs with three factors and three levels for each factor. The L9 table contains 9 experimental combinations, which can effectively cover the main effects and partial interaction effects of each factor. According to the three levels of low, medium and high of each parameter determined in steps S711 to S719, the molding temperature range (low, medium and high), molding pressure range (low, medium and high) and pressure holding time range (short, medium and long) are arranged in the combination of the L9 orthogonal table to generate 9 groups of initial molding parameter combinations. Through the L9 orthogonal experimental table, only 9 experimental combinations are needed to systematically evaluate the main effects and partial interaction effects of the three key parameters, saving experimental time and cost.

[0107] Preferably, the step of evaluating each of the initial molding parameter combinations to obtain a first intermediate molding parameter combination includes: S721, performing a molding experiment according to each of the initial molding parameter combinations to obtain a number of experimental samples corresponding to each of the initial molding parameter combinations; In this step, the corresponding experimental samples are generated by conducting experiments on each initial molding parameter combination. The manufacturing process of each experimental sample uses a different molding parameter combination, which may include molding temperature, molding pressure, and pressure holding time. The number of experimental samples should be determined according to the number of initial combinations to ensure that samples can be obtained for each initial parameter combination. The purpose of this step is to ensure that sample data is obtained from each initial parameter combination to provide basic data for subsequent evaluation and analysis.

[0108] S722, performing an evaluation test on each experimental sample to obtain an evaluation test result corresponding to each of the initial molding parameter combinations, wherein the evaluation test result includes a plurality of evaluation indicators, and the evaluation indicators include packaging quality, thermal stability and luminous efficiency; A series of evaluation tests are conducted on each experimental sample to obtain test results corresponding to each initial molding parameter combination. The evaluation test indicators should cover multiple aspects, including but not limited to: Luminous efficiency is used to evaluate the brightness and energy efficiency of the light source after packaging, and is usually used for LED or other optoelectronic products; luminous efficiency is closely related to molding parameters, especially molding temperature and pressure. Too high or too low molding temperature may lead to poor fluidity of the packaging material, resulting in uneven packaging interface, thus affecting the optoelectronic performance of the chip. Excessive molding pressure may cause chip damage and affect its luminous efficiency. Reasonable molding temperature and pressure can ensure close contact between the chip and the packaging material and optimize the optoelectronic performance.

[0109] Thermal stability evaluates the performance of packaging materials under high temperature conditions, whether there will be problems such as thermal deformation and degradation; thermal stability is closely related to molding parameters. Molding temperature control directly determines the thermal stability of packaging materials. Too high temperature may cause material deformation or degradation, and too low temperature may cause uneven thermal expansion, which in turn affects thermal stability. In addition, the matching degree of thermal expansion coefficient between the chip and the packaging material is also very important. Reasonable molding temperature and thermal matching of materials can effectively avoid problems caused by thermal stress and improve thermal stability.

[0110] The packaging quality evaluates the quality of the combination of packaging materials and chips, including the uniformity and adhesion of the materials; the packaging quality is directly affected by the molding parameters (especially temperature and pressure). The molding pressure controls whether the packaging material can be evenly filled into the mold, thereby affecting the degree of bonding between the chip and the packaging material. If the pressure is too low, the package may be incomplete, with bubbles or gaps; if the pressure is too high, the chip may be damaged or the material may overflow. The molding temperature also affects the fluidity and curing process of the material. Too low a temperature will result in insufficient material flow, and too high a temperature will result in material degradation. The packaging quality is a very direct indicator, and improper parameter settings during the molding process can easily cause obvious packaging defects.

[0111] In one embodiment, the evaluation test indicators also include: Production cost, used to assess the impact of materials and processes used in the production process on costs, usually including the purchase cost of raw materials, processing fees, etc.; and, Reliability: assessing the stability and durability of the product under long-term use or extreme conditions; Each molding parameter will have a certain impact on the above evaluation indicators. By accurately adjusting these parameters, the luminous efficiency, thermal stability, and packaging quality of the semiconductor chip can be optimized, which also helps to reduce production costs and improve long-term reliability. Therefore, all these evaluation indicators are closely related to the molding parameters. At each step in the molding process, the molding parameters should be optimized to comprehensively improve the performance of the final product. The evaluation test results will provide data support for subsequent analysis.

[0112] S723, performing single factor impact analysis on the evaluation test results according to variance analysis method, to obtain the single factor impact result of each parameter in the initial molding parameter combination on each of the evaluation indicators; Specifically, the analysis of variance (ANOVA) is used to analyze the impact of various molding parameters on the evaluation indicators in the evaluation test results. Each initial molding parameter (for example, temperature, pressure, etc.) is considered as a factor separately, and the variance analysis can help determine which factors have the greatest impact on each evaluation indicator. Through single-factor analysis, we can understand the independent impact of different molding parameters on indicators such as luminous efficiency and thermal stability. The results of the analysis will provide a basis for subsequent optimization decisions.

[0113] Specifically, the evaluation results of the experimental samples are first grouped according to different combinations of molding parameters, and then the variance within each group and the variance between groups are calculated. By comparing these variances, the influence of each individual parameter can be determined. If a parameter (such as molding temperature) has a great influence on the luminous efficiency, its variance will be large, indicating that the luminous efficiency caused by this parameter under different settings is significantly different. For parameters with less influence, the variance is small.

[0114] S724, obtaining the combined factor influence results between the two parameter combinations in the initial molding parameter combinations according to the two-factor interaction analysis method; Specifically, in actual production, multiple parameters in the molding process are often interrelated, and the combination of certain parameters may have a greater impact on the final result than a single parameter. Therefore, in this step, a two-factor interaction analysis (Factorial Interaction Analysis) is used to analyze the interaction of two factors. Specifically, interaction analysis can help understand the comprehensive impact of two molding parameters (such as molding temperature and molding pressure) on evaluation indicators (such as packaging quality, reliability, etc.) when they act together.

[0115] For example, the two factors, mold temperature and mold pressure, may have a synergistic effect on the quality of the package when they are together. It may not be obvious when the mold temperature is increased alone, but if the mold pressure is increased at the same time, the quality of the package may be significantly improved. This interactive effect is quantified by the two-factor analysis method, which helps to identify which parameter combinations have the best synergistic effect.

[0116] Through two-factor interaction analysis, we can reveal the mutual influence between different parameter combinations and find out which factors can produce better results when combined, so that they can be given priority in the subsequent screening and optimization process.

[0117] S725, obtaining the synergistic efficiency between any two parameter combinations in the initial molding parameter combinations according to the single factor influence results and the combined factor influence results; The goal of this stage is to calculate the synergistic efficiency between various parameter combinations. Synergistic efficiency refers to the benefit increase generated when two or more parameters work together. If the synergistic effect of two parameters can significantly improve the performance of the target evaluation index, then their synergistic efficiency is high. By calculating the synergistic efficiency, it is possible to evaluate which parameters perform better when combined together, thereby helping to focus on selecting these combinations in subsequent screening.

[0118] In specific implementation, the results of variance analysis (single factor impact analysis) and two-factor interaction analysis will be combined to calculate the degree of synergy for each pair of parameter combinations. If the synergy of a pair of parameter combinations is obvious, then its synergy efficiency is high. For combinations with low synergy, it may be necessary to eliminate them in subsequent steps or further optimize the parameters.

[0119] The core purpose of calculating the synergistic efficiency is to identify which parameter combinations can produce significant performance improvements, and then select the best initial molding parameter combinations. This can maximize the evaluation index during the optimization process and achieve better molding results.

[0120] S726. Constructing a synergistic effect matrix according to the synergistic efficiency increase; The synergy matrix is ​​formed by quantifying the synergy efficiency of each parameter combination. The matrix shows the synergy between different parameter combinations and helps identify which parameter combination is the best. Each element in the matrix represents the synergy efficiency of two parameter combinations. The construction of the matrix provides a structured basis for the subsequent screening of the optimal molding parameter combination.

[0121] S727: Screen the initial molding parameter combination according to the synergy effect matrix to obtain a first intermediate molding parameter combination.

[0122] According to the synergy matrix, the initial molding parameter combination with the best synergy effect is screened out. By selecting the parameter combination with high synergy efficiency, the optimal intermediate molding parameter combination can be determined, which will be used as a reference in the subsequent parameter optimization process. The screening process can limit the screening criteria by setting a synergy threshold to ensure that the selected parameter combination performs well in synergy.

[0123] In the actual molding process, there is often a synergistic effect between multiple factors, that is, the interaction between different factors has a much greater impact on the results than the impact of a single factor. Traditional variance analysis and response surface analysis usually evaluate the contribution of each factor independently, ignoring this synergistic effect. By evaluating the synergistic effect between factors, we can identify which combinations of factors can produce advantages that exceed those of individual factors. By introducing the consideration of synergistic effects, we can optimize the selection of parameter combinations and improve the overall performance of the process.

[0124] Preferably, the step of optimizing the first intermediate molding parameters to obtain a target molding parameter combination includes: S731, performing regression analysis on the evaluation test results to obtain a molding parameter response surface model; In this stage, a molding parameter response surface model is established by performing regression analysis on the obtained evaluation test results. Regression analysis is a statistical method used to establish a mathematical relationship model through known input data (i.e., initial molding parameter combination) and output data (i.e., evaluation test results). This model can predict the expected performance of evaluation indicators (such as luminous efficiency, thermal stability, etc.) under a specific molding parameter combination. Through regression analysis, the influence of different molding parameters on the target indicators can be captured, and these influences can be converted into mathematical formulas or equations. The establishment of this model can help foresee the potential effects of different parameter combinations during the optimization process, thereby avoiding a large number of actual experiments.

[0125] S732, limiting the molding temperature range, the molding pressure range, and the pressure holding time range according to the intermediate molding parameter combination and the excluded initial molding parameter combination; Based on the selected intermediate molding parameter combinations (i.e., the optimal combination selected through the synergy matrix) and the excluded initial molding parameter combinations (i.e., the non-optimal combination excluded in the previous screening process), the ranges of molding temperature, pressure, and holding time are further narrowed. Through this process, inappropriate parameter ranges can be effectively removed to ensure that only parameter ranges that are more likely to produce good results are considered in the further optimization process. For example, certain parameter combinations may produce inefficient or unstable molding effects, and these parameter combinations can be excluded during the narrowing process. The narrowed parameter range will be more focused on those molding conditions that perform better, thereby reducing the invalid test range.

[0126] S733, according to the grid search method, reacquire a second preset number of second intermediate molding parameter combinations in the limited molding temperature range, the molding pressure range, and the pressure holding time range, wherein the second preset number is greater than or equal to the first preset number; The grid search method is used to retrieve the second batch of initial molding parameter combinations within the range of the limited molding temperature, molding pressure and pressure holding time. The grid search method is a brute force search algorithm that systematically tests every possible parameter combination by gridding the distribution within the preset range of each parameter. In this process, each dimension of the parameter (temperature, pressure, holding time) is divided into multiple levels (such as low, medium, and high), and each level is systematically combined and tested. The number of the second batch of parameter combinations is usually set to be greater than or equal to the first preset number to ensure that there is enough data for model prediction and comparison during the optimization process.

[0127] S734, inputting the second intermediate molding parameter combination into the molding parameter response surface model to obtain a predicted response index of each second intermediate molding parameter combination, wherein the predicted response index includes luminous efficiency, thermal stability, and packaging quality; The second batch of intermediate molding parameter combinations obtained by the grid search method are input into the previously established molding parameter response surface model, and the model is used to predict each parameter combination to obtain the predicted response index. These response indicators include luminous efficiency, thermal stability, packaging quality, production cost and reliability, etc., reflecting the impact of different molding parameter combinations on the final packaging performance. Through the prediction of the response surface model, the expected results of each combination can be quickly obtained without the need to conduct a large number of experiments again. This process significantly improves the optimization efficiency.

[0128] S735 , combining the second intermediate molding parameters according to the predicted response index to obtain a target molding parameter combination.

[0129] After predicting the response indicators of the second intermediate molding parameter combination, by comparing these indicators, the best performing parameter combination is selected as the target molding parameter combination. At this time, the focus of the evaluation is to select the combination with the best performance in multiple dimensions such as luminous efficiency, thermal stability, and packaging quality. If a group of parameters can perform well in multiple evaluation criteria, then this group of parameters will be determined as the final target molding parameter combination. This step usually combines weighted average, sorting selection, or multi-objective optimization methods to select the best combination.

[0130] By establishing a response surface model through regression analysis and obtaining a new initial parameter combination through grid search method, and combining the response index predicted by the model, the optimal target molding parameter combination can be finally selected. This series of steps effectively improves the accuracy and efficiency of optimization and ensures that the best molding conditions are obtained through the least experimental steps.

[0131] Example 2

[0132] Based on Example 1, see Figure 2Embodiment 2 of the present invention further provides a method for preparing a micro-light-emitting semiconductor chip, comprising: S01, obtaining molding parameters, wherein the molding parameters are obtained according to the method described in Example 1; In this step, the required molding parameters are obtained by the method of Example 1. The molding parameters include mold size, packaging material properties, molding temperature, molding pressure, and curing time. These parameters are combined with factors such as chip size, material properties, and thermoelectric properties to ensure that various conditions in the molding process meet the design requirements. By presetting these molding parameters, the subsequent production process can be ensured to proceed smoothly, and the quality of the prepared micro-light-emitting semiconductor chip can be optimized.

[0133] S02, acquiring a target mold and a target packaging material for preparing a micro light-emitting semiconductor chip according to the mold parameters and the packaging material parameters; In this step, based on the molding parameters obtained in the first step, select the appropriate target mold and target packaging material. The mold parameters determine the cavity size and material properties of the mold, while the packaging material parameters determine the transparency, thermal expansion, thermal conductivity and other properties of the material. When selecting the target mold and packaging material, it must be ensured that they can withstand the temperature and pressure changes during the molding process and meet the functional requirements of the micro-light-emitting semiconductor chip.

[0134] S03, placing the initial chip and the target material in the cavity of the target mold; In this step, the initial chip to be prepared is placed in the cavity of the target mold and the target packaging material is added. This step requires the chip to be in close contact with the packaging material to ensure that the material can be evenly coated on the chip surface during the molding process to provide appropriate protection for the chip. At this time, it is also necessary to ensure that the packaging material can completely fill the mold cavity and there are no bubbles or impurities.

[0135] S04, performing molding on the target mold according to the molding temperature and molding pressure, and acquiring the temperature value and pressure value during the molding process in real time to obtain real-time production data; During the molding process, the operation is carried out according to the preset molding temperature and molding pressure. By real-time monitoring of the changes in temperature and pressure during the molding process, the temperature and pressure can be kept stable throughout the production process to avoid production quality problems caused by parameter mismatch. The real-time production data obtained can provide the changing trends of key factors such as temperature and pressure during the production process, helping to ensure accurate control of the molding process.

[0136] S05. After the pressure holding time ends, the initial chip in the target mold is cooled and demolded to obtain the micro light-emitting semiconductor chip.

[0137] Once the set pressure holding time is reached, the encapsulation material in the target mold has been solidified. At this stage, the chip in the target mold needs to be cooled to ensure the stability of the encapsulation material. During the cooling process, the temperature gradually decreases and the solidified structure of the material becomes stronger. After cooling, the chip is removed from the mold through the demolding process to obtain a packaged micro light-emitting semiconductor chip.

[0138] Preferably, see Figure 3 The method for preparing a micro-light-emitting semiconductor chip further comprises: S06, performing subsequent processing on the micro light-emitting semiconductor chip; After the micro-light-emitting semiconductor chip is demolded, it may need a series of subsequent treatments, including cleaning, testing, trimming, etc. The purpose of the subsequent treatment is to remove any residual impurities in the production process and ensure that the chip surface is smooth and meets the requirements for further testing and use.

[0139] S07, performing a performance test on the micro-light-emitting semiconductor chip after subsequent processing to obtain a test result; A series of performance tests are conducted on the micro-light-emitting semiconductor chips that have been subsequently processed to verify whether they meet the predetermined performance standards. Common performance tests include luminous intensity, luminous wavelength, high temperature resistance, etc. These test results can provide a scientific basis for judging the quality of the chip.

[0140] S08, judging whether the micro light-emitting semiconductor chip meets a preset quality condition according to the test result; Based on the results of the performance test, the chip is evaluated to see whether it meets the design and quality requirements. If the test results show that the chip's performance meets the preset quality conditions, it can enter the next packaging process; if the chip's performance does not meet the standards, it needs to be adjusted or eliminated.

[0141] S09: If the conditions are met, the micro light-emitting semiconductor chip is packaged and shipped out.

[0142] If the chip passes the quality inspection and meets all the preset quality standards, it will be packaged. The packaging process includes protecting and packaging the chip for transportation and sale. At this point, the chip is ready to enter the market for commercial circulation.

[0143] Preferably, the method for preparing a micro-light-emitting semiconductor chip further comprises: S010, if not satisfied, adjusting the molding parameters according to the test results and the real-time production data; If the chip fails the quality test, it needs to be analyzed based on the test results and the real-time production data during the molding process. The test results provide the actual performance of the chip, while the real-time production data reflects the specific situation during the production process. By comparing the two, the root cause of the problem can be found. For example, parameters such as molding temperature, molding pressure, and curing time may need to be further optimized.

[0144] S011, returning the molding temperature and molding pressure according to the adjusted molding parameters, molding the target mold, and acquiring the temperature value and pressure value during the molding process in real time to obtain real-time production data.

[0145] According to the adjusted molding parameters, the molding process is restarted, and the changes in temperature and pressure are monitored in real time. By continuously adjusting and optimizing the molding parameters, it is ensured that the next production cycle can meet the predetermined quality standards, and finally a micro-light-emitting semiconductor chip that meets the requirements is obtained.

[0146] It should be clear that the present invention is not limited to the specific configuration and processing described above and shown in the figures. For the sake of simplicity, a detailed description of the known method is omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of the present invention is not limited to the specific steps described and shown, and those skilled in the art can make various changes, modifications and additions, or change the order between the steps after understanding the spirit of the present invention.

[0147] The functional blocks shown in the structural block diagram described above can be implemented as hardware, software, firmware or a combination thereof. When implemented in hardware, it can be, for example, an electronic circuit, an application specific integrated circuit (ASIC), appropriate firmware, a plug-in, a function card, etc. When implemented in software, the elements of the present invention are programs or code segments used to perform the required tasks. The program or code segment can be stored in a machine-readable medium, or transmitted on a transmission medium or a communication link by a data signal carried in a carrier. "Machine-readable medium" may include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROMs, flash memories, erasable ROMs (EROMs), floppy disks, CD-ROMs, optical disks, hard disks, optical fiber media, radio frequency (RF) links, etc. The code segment can be downloaded via a computer network such as the Internet, an intranet, etc.

[0148] It should also be noted that the exemplary embodiments mentioned in the present invention describe some methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the above steps, that is, the steps can be performed in the order mentioned in the embodiments, or in a different order from the embodiments, or several steps can be performed simultaneously.

[0149] The above is only a specific implementation of the present invention. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working process of the system, module and unit described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here. It should be understood that the protection scope of the present invention is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be covered within the protection scope of the present invention.

Claims

1. A method for setting molding parameters of a micro-light-emitting semiconductor chip, characterized in that: The method comprises: Acquire chip parameters of the micro light-emitting semiconductor chip, wherein the chip parameters include chip size parameters, chip material parameters, light-emitting characteristic parameters, electrical characteristic parameters, and thermal performance parameters; Determining mold parameters according to the chip size parameters, thermal performance parameters, and light-emitting characteristic parameters; Obtaining packaging material parameters according to the luminous characteristic parameters, electrical characteristic parameters and thermal performance parameters; Obtaining a molding temperature range according to the packaging material parameters and the thermal performance parameters; Determining a molding pressure range according to the chip size parameters and chip material parameters; Determining a pressure holding time range according to the packaging material parameters, the thermal performance parameters and the molding temperature range; The molding parameters are set according to the molding temperature range, the molding pressure range and the pressure holding time range.

2. The method for setting molding parameters of a micro-light-emitting semiconductor chip according to claim 1, characterized in that: The obtaining of the molding temperature range according to the packaging material parameters and the thermal performance parameters comprises: Determine the initial molding temperature range based on the curing temperature range of the packaging material and the preset safety temperature threshold; Adjusting the upper limit of the initial molding temperature range according to the thermal conductivity of the packaging material to obtain a first intermediate molding temperature range, wherein the thermal conductivity of the packaging material and the upper limit of the initial molding temperature range are positively correlated; According to the matching degree between the thermal expansion coefficient of the chip and the thermal expansion coefficient of the packaging material, determining the upper limit adjustment value and the lower limit adjustment value of the first intermediate molding temperature range, wherein the upper limit adjustment value and the lower limit adjustment value are both positively correlated with the matching degree; Adjusting the upper limit and the lower limit of the first intermediate molding temperature range according to the upper limit adjustment value and the lower limit adjustment value to obtain a second intermediate molding temperature range; Determining the thermal stability limit temperature of the packaging material according to the temperature resistance performance parameters of the packaging material; adjusting the upper limit of the second intermediate molding temperature range according to the thermal stability limit temperature to obtain a third intermediate molding temperature range; The upper limit and / or lower limit of the third intermediate molding temperature range is adjusted according to the thermal conductivity of the chip and the thermal conductivity of the packaging material to obtain a final molding temperature range.

3. The method for setting molding parameters of a micro-light-emitting semiconductor chip according to claim 2, characterized in that: Determining the molding pressure range according to the chip size parameters and chip material parameters includes: Determine the chip area according to the chip size parameters; Determining an initial molding pressure range according to the chip area and a preset molding pressure range, wherein an upper limit and a lower limit of the initial molding pressure range are both negatively correlated with the chip area; Obtaining the viscosity and fluidity of the packaging material according to the packaging material parameters; The initial molding pressure range is adjusted according to the viscosity and fluidity of the packaging material to obtain an intermediate molding pressure range; The intermediate molding pressure range is adjusted according to the matching degree between the thermal expansion coefficient of the chip and the thermal expansion coefficient of the packaging material to obtain a final molding pressure range, wherein the upper limit and the lower limit of the molding pressure range are negatively correlated with the matching degree.

4. The method for setting molding parameters of a micro-light-emitting semiconductor chip according to claim 3, characterized in that: Determining the pressure holding time range according to the packaging material parameters, the thermal performance parameters and the molding temperature range includes: According to the packaging material parameters, the curing temperature range and the packaging material thickness are obtained; Determining the initial pressure holding time range according to the curing temperature range and the thickness of the packaging material; According to the viscosity and the fluidity of the packaging material, the upper limit and the lower limit of the initial pressure holding time range are adjusted to obtain an intermediate pressure holding time range, wherein the upper limit and the lower limit of the intermediate pressure holding time range are positively correlated with the viscosity, and the upper limit and the lower limit of the intermediate pressure holding time range are negatively correlated with the fluidity; According to the matching degree between the thermal expansion coefficient of the chip and the thermal expansion coefficient of the packaging material, the upper and lower limits of the intermediate pressure holding time range are adjusted to obtain the final pressure holding time range, wherein the upper and lower limits of the pressure holding time range are positively correlated with the matching degree.

5. The method for setting molding parameters of a micro-light-emitting semiconductor chip according to any one of claims 1 to 4, characterized in that: Determining the molding parameters according to the molding temperature range, the molding pressure range and the pressure holding time range includes: According to a preset parameter determination strategy, a first preset number of initial molding parameter combinations are obtained within the molding temperature range, the molding pressure range, and the pressure holding time range, wherein the preset parameter determination strategy includes a uniform distribution method, an orthogonal experiment method, and a random sampling method, and different initial molding parameter combinations have different molding temperatures and / or molding pressures and / or pressure holding times; Evaluating each of the initial molding parameter combinations to obtain a first intermediate molding parameter combination; Optimizing the first intermediate molding parameters to obtain a target molding parameter combination; The molding parameters are determined according to the target molding parameter combination.

6. The method for setting molding parameters of a micro-light-emitting semiconductor chip according to claim 5, characterized in that: The preset parameter determination strategy is an orthogonal experiment method. According to the preset parameter determination strategy, a preset number of initial molding parameter combinations are obtained within the molding temperature range, the molding pressure range, and the pressure holding time range, including: Determine the low temperature level of the molding temperature range based on the curing temperature range and thermal performance parameters of the packaging material; Determine the medium temperature level of the molding temperature range based on the curing temperature range of the packaging material and the matching degree between the thermal expansion coefficient of the chip and the thermal expansion coefficient of the packaging material; Determining a high temperature level in the molding temperature range according to the thermal stability of the packaging material and the upper limit of the molding temperature range; Determine the low pressure level in the molding pressure range according to the chip size parameters; Determining a medium pressure level in a molding pressure range according to the mechanical strength of the chip material and the fluidity of the packaging material, wherein the mechanical strength is obtained based on the chip material parameters; Determine the high pressure level in the molding pressure range according to the chip size parameters and the viscosity and fluidity of the packaging material; Determine the short time level in the pressure holding time range according to the curing time of the packaging material and the thermal expansion coefficient of the chip; Determine a medium level in the pressure holding time range based on the fluidity of the packaging material and the thermal expansion coefficient of the packaging material; Determine the long time level in the pressure holding time range based on the thickness of the packaging material and the thermal expansion coefficient of the chip; A preset number of initial molding parameter combinations are generated according to the preset L9 orthogonal experimental table and each level in the molding temperature range, the molding pressure range and the pressure holding time range.

7. The method for setting molding parameters of a micro-light-emitting semiconductor chip according to claim 5, characterized in that: The step of evaluating each of the initial molding parameter combinations to obtain a first intermediate molding parameter combination includes: Perform a molding experiment according to each of the initial molding parameter combinations to obtain a number of experimental samples corresponding to each of the initial molding parameter combinations; Performing an evaluation test on each experimental sample to obtain an evaluation test result corresponding to each combination of the initial molding parameters, wherein the evaluation test result includes a number of evaluation indicators, including packaging quality, thermal stability and luminous efficiency; Performing a single factor impact analysis on the evaluation test results according to the variance analysis method to obtain the single factor impact result of each parameter in the initial molding parameter combination on each of the evaluation indicators; According to the two-factor interaction analysis method, the combined factor influence results between the two parameter combinations in the initial molding parameter combination are obtained; According to the single factor influence result and the combined factor influence result, the synergistic efficiency between any two parameter combinations in the initial molding parameter combination is obtained; According to the synergistic efficiency, a synergistic effect matrix is ​​constructed; The initial molding parameter combination is screened according to the synergistic effect matrix to obtain a first intermediate molding parameter combination.

8. The method for setting molding parameters of a micro-light-emitting semiconductor chip according to claim 7, characterized in that: The step of optimizing the first intermediate molding parameters to obtain a target molding parameter combination includes: Performing regression analysis on the evaluation test results to obtain a molding parameter response surface model; According to the intermediate molding parameter combination and the excluded initial molding parameter combination, the molding temperature range, the molding pressure range and the pressure holding time range are limited; According to the grid search method, reacquire a second preset number of second intermediate molding parameter combinations in the limited molding temperature range, the molding pressure range, and the pressure holding time range, wherein the second preset number is greater than or equal to the first preset number; Inputting the second intermediate molding parameter combination into the molding parameter response surface model to obtain a predicted response index of each second intermediate molding parameter combination, wherein the predicted response index includes packaging quality, thermal stability and luminous efficiency; The second intermediate molding parameters are combined according to the predicted response index to obtain a target molding parameter combination.

9. A method for preparing a micro light-emitting semiconductor chip, characterized in that: include: Acquire molding parameters, wherein the molding parameters are acquired according to the method according to any one of claims 1 to 8; According to the mold parameters and packaging material parameters, a target mold and a target packaging material for preparing a micro light-emitting semiconductor chip are obtained; placing an initial chip and a target material in a cavity of the target mold; Molding the target mold according to the molding temperature and the molding pressure, and acquiring the temperature value and the pressure value in the molding process in real time to obtain real-time production data; After the pressure holding time is over, the initial chip in the target mold is cooled and demoulded to obtain the micro light-emitting semiconductor chip.

10. The method for preparing a micro-light-emitting semiconductor chip according to claim 9, characterized in that: Also includes: performing subsequent processing on the micro light-emitting semiconductor chip; Performing a performance test on the micro-light-emitting semiconductor chip after subsequent processing to obtain a test result; Determining whether the micro-light-emitting semiconductor chip meets a preset quality condition according to the test result; If the conditions are met, the micro light-emitting semiconductor chip is packaged and shipped out; If not, adjusting the molding parameters according to the test results and the real-time production data; The step of returning the molding temperature and the molding pressure according to the adjusted molding parameters, molding the target mold, and acquiring the temperature value and the pressure value during the molding process in real time to obtain real-time production data.

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