Laser processing device

Abstract

The invention relates to a laser processing apparatus. A laser processing apparatus according to various embodiments of the present invention preferably comprises: a laser oscillator that outputs a laser beam; a pair of Galvano mirrors that deflect the laser beam output from the laser oscillator in accordance with processing data for the workpiece; an f-[theta] lens (F-[theta] Lens) that scans the laser beam deflected by the pair of flow detection mirrors toward a workpiece; and an image acquisition unit that acquires an image of the workpiece by means of light incident from the workpiece through the f-theta lens. The image acquisition section is disposed on a movement path of light incident from the workpiece through the f-[theta] lens, and is disposed so as not to intersect a movement path of the laser beam scanned by the laser oscillator toward the pair of flow detection mirrors.

Description

Technical Field

[0001] The present invention relates to a laser processing device, and more specifically, to a laser processing device which can monitor the processing state of a workpiece more accurately and in real time with a simpler structure. Background Art

[0002] Generally speaking, a laser processing device is a device that uses laser to perform various processing techniques such as welding, cutting, drilling, and marking on a workpiece.

[0003] This laser processing device is a device that, when a user creates and inputs a processing pattern to be processed in an external input device such as a computer, drives a galvanometer-type scanning galvanometer mirror composed of a pair of galvanometer reflectors according to the laser processing data of the processing pattern, deflects and scans the laser beam in two dimensions, and controls the on / off of a laser oscillator that outputs the laser beam by synchronizing with the action of the galvanometer-type scanning galvanometer mirror, thereby processing the workpiece.

[0004] On the other hand, in order for the laser processing device to more accurately perform the processing operation on the workpiece, it is particularly important to accurately monitor the processing state of the workpiece in real time while performing the processing operation.

[0005] As described above, although there are various methods for monitoring the processing status of a workpiece by a laser processing device, most laser processing devices use a method of photographing the processing status of the workpiece using a visual camera. Here, the visual camera is generally installed on one side of a galvanometer scanning galvanometer mirror or on one side of a platform supporting the workpiece.

[0006] For example, Korean Patent Publication No. 10-2013-0073050 (Laser processing device and correction data generation method thereof) (published on July 3, 2013) discloses a technology for generating shooting data of a laser light image focused on a mask using a camera assembly disposed on one side of a platform for loading a workpiece.

[0007] However, a problem with the conventional laser processing device disclosed in the patent document is that the visual camera installed on one side of the galvanometer scanning mirror or the platform not only increases the overall size, but also cannot accurately measure the processing status of the workpiece due to the occurrence of distortion.

[0008] To solve these problems, a technology is being introduced that installs a vision camera inside a laser processing device such as a galvanometer scanner.

[0009] For example, Korean Registered Patent Gazette No. 10-1216684 (Marking image reading device and reading method for laser marking system) (published on December 31, 2012) discloses a technology in which a visual camera is arranged between a beam expander and a scanning head to capture the marking image of the marking object reflected by the X and Y galvanometric mirrors of the scanning head to determine the marking position and whether the marking quality is poor.

[0010] However, the problem with the conventional laser processing device disclosed in the patent document is that, since the visual camera captures the marking image reflected by the X and Y galvanometer mirrors of the scanning head (galvanometer scanning oscillator), only the image of a very small part of the entire marking area displayed by the X and Y galvanometer mirrors can be obtained.

[0011] Therefore, there is a need for a laser processing device that can monitor the processing status of a workpiece in real time and more accurately with a simpler structure. Summary of the invention

[0012] The present invention is created to improve the above-mentioned problem. The technical problem to be solved by the present invention is to provide a laser processing device, which arranges an image acquisition unit for acquiring an image of a workpiece by light incident on the workpiece through an f-θ lens so as not to intersect with the moving path of a laser beam scanned by a laser oscillator to a pair of galvanometer mirrors, thereby expanding the image area of ​​the workpiece acquired by the image acquisition unit, so that the processing status of the workpiece can be accurately monitored in real time with a simpler structure.

[0013] The technical problems of the present invention are not limited to the above-mentioned contents, and a person skilled in the art can clearly understand other technical problems not mentioned from the following description.

[0014] In order to solve the above problem, the technical solution adopted by the present invention is to provide a laser processing device. According to the laser processing device of multiple embodiments of the present invention, preferably, it includes: a laser oscillator, which outputs a laser beam; a pair of galvano mirrors, which deflect the laser beam output from the laser oscillator according to the processing data of the workpiece; an f-θ lens (F-θLens), which scans the laser beam deflected by the pair of galvano mirrors toward the workpiece; an image acquisition unit, which acquires an image of the workpiece through the light incident from the workpiece through the f-θ lens. The image acquisition unit is arranged on the moving path of the light incident from the workpiece through the f-θ lens, and is arranged so as not to intersect with the moving path of the laser beam scanned by the laser oscillator toward the pair of galvano mirrors.

[0015] As an example, the laser processing device also includes: a first dichroic mirror, which is arranged on the path of the laser beam scanned by the pair of galvanometer mirrors through the f-θ lens; the first dichroic mirror reflects the laser beam scanned by the laser oscillator through the pair of galvanometer mirrors, and then scanned by the f-θ lens, so that the light incident from the workpiece through the f-θ lens is transmitted and then incident on the image acquisition unit.

[0016] Here, the laser processing device further includes: a second dichroic mirror arranged on a moving path of the light incident on the first dichroic mirror through the f-θ lens; and a detection sensor measuring a processing state of the workpiece by the light incident on the workpiece through the f-θ lens. The second dichroic mirror reflects the light incident on the first dichroic mirror and makes it incident on the image acquisition unit, and makes the light incident on the first dichroic mirror be transmitted and incident on the detection sensor.

[0017] Alternatively, the laser processing device further includes: a second dichroic mirror arranged on a moving path of the light incident on the first dichroic mirror through the f-θ lens; and a detection sensor for measuring a processing state of the workpiece by the light incident on the workpiece through the f-θ lens. The second dichroic mirror allows the light incident on the first dichroic mirror to be transmitted and incident on the image acquisition unit, and reflects the light transmitted and incident on the first dichroic mirror to be incident on the detection sensor.

[0018] As another example, the laser processing device further includes: a first dichroic mirror arranged on a moving path of the laser beam scanned by the pair of galvanometric mirrors through the f-θ lens. The first dichroic mirror transmits the laser beam scanned by the laser oscillator through the pair of galvanometric mirrors, and then scans through the f-θ lens, reflects the light incident from the workpiece through the f-θ lens, and makes it incident on the image acquisition unit.

[0019] Here, the laser processing device further includes: a second dichroic mirror arranged on a moving path of the light reflected by the first dichroic mirror; and a detection sensor measuring a processing state of the workpiece by light incident from the workpiece through the f-θ lens. The second dichroic mirror reflects the light reflected and incident by the first dichroic mirror, incident on the image acquisition unit, and transmits the light reflected and incident by the first dichroic mirror, incident on the detection sensor.

[0020] Alternatively, the laser processing device further includes: a second dichroic mirror arranged on a moving path of the light reflected by the first dichroic mirror; and a detection sensor that measures a processing state of the workpiece by light incident from the workpiece through the f-θ lens. The second dichroic mirror transmits the light reflected and incident by the first dichroic mirror to the image acquisition unit, and reflects the light reflected and incident by the first dichroic mirror to the detection sensor.

[0021] For details of other embodiments, please refer to the detailed description and the accompanying drawings.

[0022] The laser processing device according to multiple embodiments of the present invention has a beneficial effect in that an image acquisition unit that acquires an image of a workpiece by light incident on the workpiece through an f-θ lens is arranged so as not to intersect with a moving path of a laser beam scanned by a laser oscillator to a pair of galvanometer mirrors, thereby expanding the image area of ​​the workpiece acquired by the image acquisition unit, and thus the processing status of the workpiece can be accurately monitored in real time with a simpler structure.

[0023] Furthermore, the laser processing device according to the first embodiment of the present invention has a beneficial effect in that a dichroic mirror arranged on the moving path of the laser beam scanned from a pair of galvanometer mirrors through an f-θ lens is used to reflect the laser beam scanned from a laser oscillator through a pair of galvanometer mirrors, and then scanned through an f-θ lens, and light incident from the workpiece through the f-θ lens is transmitted and incident on an image acquisition unit, thereby expanding the image area of ​​the workpiece acquired by the image acquisition unit.

[0024] And according to the laser processing device of the second embodiment of the present invention, its beneficial effect is that the image acquisition unit that acquires the image of the workpiece by light incident from the workpiece through the f-θ lens and the detection sensor that measures the processing status of the workpiece are arranged so as not to intersect with the moving path of the laser beam scanned from the laser oscillator to a pair of galvanometer mirrors. Therefore, not only can the image area of ​​the workpiece acquired by the image acquisition unit be expanded, but the processing status of the workpiece can also be further accurately monitored by the detection sensor.

[0025] The beneficial effects of the present invention are not limited to the above-mentioned contents, and a person skilled in the art can clearly understand other beneficial effects not mentioned from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a schematic diagram briefly showing the structure of a laser processing device according to a plurality of embodiments of the present invention;

[0027] Figure 2 is a perspective view schematically showing the structure of a laser processing device according to a first embodiment of the present invention;

[0028] Figure 3 is a schematic diagram briefly showing the structure of a laser processing device according to a first embodiment of the present invention;

[0029] Figure 4 is a schematic diagram briefly showing a modified example of the laser processing device of the first embodiment of the present invention;

[0030] Figure 5 is a schematic diagram briefly showing the structure of a laser processing device according to a second embodiment of the present invention;

[0031] Figure 6 It is a schematic diagram briefly showing a modified example of the laser processing device according to the second embodiment of the present invention. DETAILED DESCRIPTION

[0032] The technical solutions in the preferred embodiments of the present invention are described clearly and completely below in conjunction with the accompanying drawings, so that ordinary technicians in the field can easily implement them based on the embodiments of the present invention. However, all other embodiments obtained without creative work belong to the scope of protection of the present invention.

[0033] When describing the embodiments, the technical contents that are publicly known in the technical field to which the present invention belongs and are not directly related to the present invention are omitted. Omitting unnecessary descriptions can further clarify the key points of the present invention while avoiding the key points of the present invention from becoming ambiguous.

[0034] For the same reason, some of the components in the drawings are exaggerated, omitted, or simply illustrated. The size of each component does not fully reflect the actual size. The same reference numerals are given to the same or corresponding components in each figure.

[0035] Regarding the directions of devices or elements (for example, "front", "back", "up", "down", "top", "bottom", "left", "right", "lateral"), the expressions and terms used in the present invention are only used to simplify the description of the present invention and do not mean that the relevant devices or elements can only have a single specific direction.

[0036] The present invention will be described below based on an embodiment of the present invention in conjunction with the accompanying drawings for illustrating a laser processing apparatus.

[0037] Figure 1 It is a schematic diagram briefly showing the structure of the laser processing device according to multiple embodiments of the present invention.

[0038] like Figure 1As shown, the laser processing device 100 of various embodiments of the present invention may include a laser oscillator 110, a galvanometer scanning galvanometer mirror 120, an f-θ lens 130, and an image acquisition unit 140. The laser processing device 100 performs various types of processing on the workpiece W, and can monitor the state of the workpiece W in real time when the workpiece W is processed.

[0039] The laser oscillator 110 can output a laser beam L1 for performing a laser processing process on a workpiece W. The laser oscillator 110 can be divided into a solid laser oscillator such as an Nd:YAG laser, a gas laser such as a CO2 laser, a liquid laser oscillator, etc. according to the medium used. For example, in the laser processing device 100, an Nd:YAG laser widely used for laser marking is, and the laser oscillator 110 may include a laser diode (Laser diode) used as a light source, an Nd:YAG rod (Rod) that amplifies light, and a Q switch (Q-Switch) that increases the power of the laser beam L1 to release the power of the laser beam L1 through a pulse mode of an appropriate frequency, and a damper (Damper) for turning on and off the output of the laser beam L1. The laser beam L1 output from the laser oscillator 110 passes through a beam expander (Beam Expander) 111, and the size of the laser beam L1 may increase at this time.

[0040] The galvanometer scanner 120 can scan the laser beam L1 output from the laser oscillator 110 toward the workpiece W according to the laser processing data.

[0041] like Figure 1 As shown, the galvanometer scanning galvanometer mirror 120 may include a pair of galvano mirrors 121 and 122 for deflecting the laser beam L1 output from the laser oscillator 110 according to the processing data of the workpiece W. When the galvano mirrors 121 and 122 are rotated in the left and right directions by an actuator such as a motor according to a control signal input along with the processing data, the laser beam L1 can be scanned in the X-axis or Y-axis direction.

[0042] The f-θ lens (F-θLens) 130 is arranged at the bottom of the galvanometer scanning galvanometer mirror 120, and can scan the laser beam L1 deflected by a pair of galvanometer reflectors 121 and 122 onto the workpiece W. Although not shown in the figure, when the area to be laser processed is wide, a beam splitter (BeamSplitter) that can split the laser beam L1 can be set using the transmittance of the mirror (Mirror), and the galvanometer scanning galvanometer mirror and f-θ lens are added accordingly according to the number of split laser beams L1. For example, using a 50% beam splitter, it can be split into two laser beams L1, expanding the laser processing area by about 2 times.

[0043] The image acquisition unit 140 is disposed on a moving path of the light L2 incident from the workpiece W through the f-θ lens 130 and can acquire an image of the workpiece W by the light L2 incident from the workpiece W through the f-θ lens 130. Here, the image acquired by the image acquisition unit 140 is a broad concept including pictures and videos.

[0044] For the convenience of explanation, Figure 1 2 shows an example in which the workpiece W has a thin plate shape and the operation surface of the workpiece W is a flat plane, but the present invention is not limited thereto, and the operation surface of the workpiece W may also be a curved surface.

[0045] Preferably, the image acquisition unit 140 is a sensor that converts light into electrical signals to obtain an image, and a visual camera including a charge coupled device (CCD) type image sensor may be used.

[0046] On the other hand, although not shown in the figure, the workpiece W is supported in a state of being placed on a workpiece W support portion (not shown), and can be moved in the X-axis, Y-axis and Z-axis directions or rotated around the X-axis, Y-axis and Z-axis as required by the workpiece W support portion. In addition, the image acquisition portion 140 can be moved in the X-axis, Y-axis and Z-axis directions or rotated around the X-axis, Y-axis and Z-axis as required by a separate driving device.

[0047] Preferably, according to multiple embodiments of the present invention, the image acquisition unit 140 constituting the laser processing device 100 is arranged on the moving path of the light L2 incident from the workpiece W through the f-θ lens 130, and can be arranged so as not to intersect with the moving path of the laser beam L1 scanned from the laser oscillator 110 through a pair of galvanometer mirrors 121 and 122.

[0048] As described above, the laser processing device 100 according to multiple embodiments of the present invention is that the image acquisition unit 140 that acquires the image of the workpiece W by the light L2 incident from the workpiece W through the f-θ lens 130 is arranged so as not to intersect with the moving path of the laser beam L1 scanned from the laser oscillator 110 through a pair of galvanometer mirrors 121 and 122, thereby expanding the image area of ​​the workpiece W acquired by the image acquisition unit 140, so that the processing status of the workpiece W can be monitored in real time and more accurately with a simpler structure.

[0049] Combine the following Figures 2 to 6 Various embodiments of the laser processing device 100 according to various embodiments of the present invention are described. First, according to Figures 2 to 4 The structure of a laser processing apparatus 100 according to a first embodiment of the present invention will be described.

[0050] Figure 2 is a perspective view schematically showing the structure of a laser processing device according to a first embodiment of the present invention, Figure 3 It is a schematic diagram briefly showing the structure of the laser processing device according to the first embodiment of the present invention.

[0051] like Figure 2 As shown, the laser processing device 100 according to the first embodiment of the present invention may include a laser oscillator 110 , a galvanometer scanning mirror 120 , an f-θ lens 130 , an image acquisition unit 140 and a first dichroic mirror 150 .

[0052] like Figure 2 and Figure 3 As shown, the first dichroic mirror 150 can be arranged on the moving path of the laser beam L1 scanned from the pair of galvanometric mirrors 121 and 122 through the f-θ lens 130. A dichroic mirror is a mirror composed of a plurality of thin layers of materials with different refractive indices, and has the property of reflecting light of a certain color and transmitting light of all other colors.

[0053] Preferably, the first dichroic mirror 150 constituting the laser processing device 100 of the first embodiment of the present invention reflects the laser beam L1 scanned from the laser oscillator 110 through a pair of galvanometer mirrors 121 and 122, and then scans it through the f-θ lens 130, so that the light L2 incident from the workpiece W through the f-θ lens 130 is transmitted and then incident on the image acquisition unit 140.

[0054] Further, if Figure 2 and Figure 3 As shown, according to the laser processing device 100 of the first embodiment of the present invention, the laser oscillator 110 and the galvanometer scanning galvanometer mirror 120 are arranged on one side with the first dichroic mirror 150 as the reference, and the f-θ lens 130 and the image acquisition unit 140 are arranged at the lower part and the upper part respectively with the first dichroic mirror 150 as the reference.

[0055] Therefore, Figure 3 As shown in (a) of FIG. 1 , the first dichroic mirror 150 reflects the laser beam L1 scanned from the laser oscillator 110 through a pair of galvanometric mirrors 121 and 122, and then scans through the f-θ lens 130, as shown in FIG. Figure 3 As shown in FIG. 1 ( b ), the light L2 incident from the workpiece W through the f-θ lens 130 can be transmitted and then incident on the image acquisition unit 140 .

[0056] Figure 4 It is a schematic diagram briefly showing a modified example of the laser processing device according to the first embodiment of the present invention.

[0057] like Figure 4 As shown, the first dichroic mirror 150 and Figure 3 Similarly to the example shown in FIG. 1 , the laser beam L1 may be arranged on the moving path of the laser beam L1 scanned from the pair of galvanometric mirrors 121 and 122 through the f-θ lens 130 .

[0058] But if Figure 4 As shown in the figure, a modified example of the laser processing device 100 of the first embodiment of the present invention is that the laser oscillator 110 and the galvanometer scanning galvanometer mirror 120 are arranged at the upper part with the first dichroic mirror 150 as the reference, and the f-θ lens 130 is arranged at the lower part with the first dichroic mirror 150 as the reference, and the image acquisition unit 140 is arranged on one side with the first dichroic mirror 150 as the reference. Figure 3 The examples shown have differences.

[0059] Therefore, a modified example of the laser processing device 100 of the first embodiment of the present invention is as follows: Figure 4 As shown in (a), the first dichroic mirror 150 transmits the laser beam L1 scanned from the laser oscillator 110 through a pair of galvanometric mirrors 121 and 122, and then scans through the f-θ lens 130. Figure 4 As shown in FIG. 2 ( b ), the light L2 incident from the workpiece W through the f-θ lens 130 is reflected and then incident on the image acquisition unit 140 .

[0060] As described above, the laser processing device 100 of the first embodiment of the present invention uses a dichroic mirror arranged on the moving path of the laser beam L1 scanned from a pair of galvanometer mirrors 121 and 122 through the f-θ lens 130 to reflect the laser beam L1 scanned from the laser oscillator 110 through a pair of galvanometer mirrors 121 and 122, and then scans it through the f-θ lens 130, and allows the light L2 incident from the workpiece W through the f-θ lens 130 to be transmitted and incident on the image acquisition unit 140, thereby expanding the image area of ​​the workpiece W acquired by the image acquisition unit 140.

[0061] Combine the following Figure 5 and Figure 6 The laser processing device according to the second embodiment of the present invention is described. Figures 2 to 4 The same structures and processes as those of the first embodiment shown in the figure are described below, and the differences between them are mainly explained below.

[0062] In the second embodiment of the present invention, the laser processing device 100 includes a detection sensor 170 for measuring the processing state of the workpiece W in addition to the image acquisition unit 140 for acquiring the processing state of the workpiece W to check the processing state of the workpiece W. Figures 2 to 4 The first embodiment shown has differences.

[0063] Figure 5 It is a schematic diagram briefly showing the structure of a laser processing device according to a second embodiment of the present invention.

[0064] like Figure 5 As shown, the laser processing device 100 of the second embodiment of the present invention may include a laser oscillator 110, a galvanometer scanning galvanometer 120, an f-θ lens 130, an image acquisition unit 140, a first dichroic mirror 150, a second dichroic mirror 160 and a detection sensor 170.

[0065] and Figure 3 Similarly to the first embodiment shown in FIG. Figure 5 The first dichroic mirror 150 shown in FIG. 1 may be arranged on a moving path of the laser beam L1 scanned from the pair of galvanometric mirrors 121 and 122 through the f-θ lens 130. Therefore, the first dichroic mirror 150 may reflect the laser beam L1 scanned from the laser oscillator 110 through the pair of galvanometric mirrors 121 and 122, and further scanned through the f-θ lens 130, and allow the light L2 incident on the workpiece W through the f-θ lens 130 to be transmitted and incident on the image acquisition unit 140.

[0066] In addition, if Figure 5 As shown in FIG. 1 , the second dichroic mirror 160 may be arranged on a moving path of the light L2 incident from the f-θ lens 130 through the first dichroic mirror 150. Further, in Figure 5 In the example, when the f-θ lens 130 and the image acquisition unit 140 are respectively arranged at the lower part and the upper part with respect to the first dichroic mirror 150 , the second dichroic mirror 160 may be arranged at the upper part of the first dichroic mirror 150 .

[0067] The detection sensor 170 is arranged at a position adjacent to the second dichroic mirror 160, and measures the processing state of the workpiece W by the light L2 incident from the workpiece W through the f-θ lens 130. This detection sensor 170 can use an optical sensor such as a photodiode sensor, and can determine the processing state of the workpiece W such as the welding state by measuring the wavelength, frequency, etc. of the light L2 incident from the workpiece W through the f-θ lens 130.

[0068] exist Figure 5 In the example (a) of FIG. 1 , the detection sensor 170 is arranged on one side of the second dichroic mirror 160. Figure 5 The example (b) of FIG. 1 illustrates an example in which the detection sensor 170 is arranged on the upper portion of the second dichroic mirror 160 .

[0069] Therefore, if Figure 5 As shown in (a) of FIG. 1 , the second dichroic mirror 160 allows the light L2 incident through the first dichroic mirror 150 to pass through and enter the image acquisition unit 140, and reflects the light L2 incident through the first dichroic mirror 150 to enter the detection sensor 170. Figure 5 As shown in FIG. 2 ( b ), the second dichroic mirror 160 reflects the light L2 incident from the first dichroic mirror 150 to be incident on the image acquisition unit 140 , and allows the light L2 incident from the first dichroic mirror 150 to be transmitted and incident on the detection sensor 170 .

[0070] Figure 6 It is a schematic diagram briefly showing a modified example of the laser processing device according to the second embodiment of the present invention.

[0071] and Figure 4 Similarly, the modified example of the first embodiment shown in FIG. Figure 5 The first dichroic mirror 150 shown in the figure is arranged on the moving path of the laser beam L1 scanned from a pair of galvanometer mirrors 121, 122 through the f-θ lens 130, and allows the laser beam L1 scanned from the laser oscillator 110 through a pair of galvanometer mirrors 121, 122 to be transmitted, and then scanned by the f-θ lens 130, so that the light L2 incident from the workpiece W through the f-θ lens 130 is reflected and then incident on the image acquisition unit 140.

[0072] In addition, if Figure 6 As shown in FIG. 1 , the second dichroic mirror 160 may be arranged on a moving path of the light L2 reflected by the first dichroic mirror 150. Further, in Figure 6 In the example, when the image acquisition unit 140 is arranged on one side with respect to the first dichroic mirror 150 , the second dichroic mirror 160 may be arranged between the first dichroic mirror 150 and the image acquisition unit 140 on one side of the first dichroic mirror 150 .

[0073] The detection sensor 170 is disposed at a position adjacent to the second dichroic mirror 160 , and can measure a processing state of the workpiece W by the light L2 incident from the workpiece W through the f-θ lens 130 . Figure 6 In the example (a) of FIG. 1 , the detection sensor 170 is arranged at the lower part of the second dichroic mirror 160 . Figure 6 The example (b) of FIG. 1 illustrates an example in which the detection sensor 170 is arranged on one side of the second dichroic mirror 160 .

[0074] Therefore, if Figure 6 As shown in (a) of FIG. 1 , the second dichroic mirror 160 can transmit the light reflected and incident by the first dichroic mirror 150 to enter the image acquisition unit 140, and reflect the light reflected and incident by the first dichroic mirror 150 to enter the detection sensor 170. Alternatively, as Figure 6 As shown in (b) of FIG. 1 , the second dichroic mirror 160 reflects the light reflected by the first dichroic mirror 150 and incident thereon, and the light is incident on the image acquisition unit 140 , and the light reflected by the first dichroic mirror 150 is transmitted therethrough and incident on the detection sensor 170 .

[0075] As described above, in the laser processing device 100 of the second embodiment of the present invention, the image acquisition unit 140 for acquiring the image of the workpiece W by means of the light L2 incident from the workpiece W through the f-θ lens 130 and the detection sensor 170 for measuring the processing state of the workpiece W are arranged so as not to intersect with the moving path of the laser beam L1 scanned from the laser oscillator 110 to a pair of galvanometric mirrors 121 and 122. Therefore, not only can the image area of ​​the workpiece W acquired by the image acquisition unit 140 be expanded, but the processing state of the workpiece W can also be further accurately monitored by the detection sensor 170.

[0076] On the other hand, this specification and the accompanying drawings disclose preferred embodiments of the present invention. Although specific terms are used, this is not intended to limit the scope of the present invention, but is used to facilitate the description of the technical content of the present invention and to help understand the general significance of the present invention. A person of ordinary skill in the art should understand that, in addition to the embodiments disclosed herein, various modifications may be made on the basis of the technical solution of the present invention, but it goes without saying that such modifications still fall within the scope of protection of the present invention.

[0077] Industrial Applications

[0078] The present invention relates to a laser processing device, and more specifically, can be applied to the technical field related to laser processing devices, which technology can monitor the processing status of a processing object in real time and more accurately with a simpler structure.

Claims

1. A laser processing device, characterized in that: The invention comprises: a laser oscillator which outputs a laser beam; a pair of galvano mirrors which deflect the laser beam output from the laser oscillator according to processing data of a workpiece; an f-θ lens which scans the laser beam deflected by the pair of galvano mirrors toward the workpiece; and an image acquisition unit which acquires an image of the workpiece by light incident from the workpiece through the f-θ lens; the image acquisition unit is arranged on a moving path of light incident from the workpiece through the f-θ lens, and is arranged so as not to intersect with a moving path of the laser beam scanned by the laser oscillator toward the pair of galvano mirrors.

2. The laser processing device according to claim 1, characterized in that: The laser processing device also includes: a first dichroic mirror, which is arranged on the path of the laser beam scanned by the pair of galvanometer mirrors through the f-θ lens; the first dichroic mirror reflects the laser beam scanned by the laser oscillator through the pair of galvanometer mirrors, scans through the f-θ lens, and allows the light incident from the workpiece through the f-θ lens to be transmitted and incident on the image acquisition unit.

3. The laser processing device according to claim 2, characterized in that: The laser processing device also includes: a second dichroic mirror, which is arranged on the moving path of the light incident on the first dichroic mirror through the f-θ lens; a detection sensor, which measures the processing state of the workpiece by the light incident on the workpiece through the f-θ lens; the second dichroic mirror reflects the light incident on the first dichroic mirror and makes it incident on the image acquisition unit, so that the light incident on the first dichroic mirror is transmitted and incident on the detection sensor.

4. The laser processing device according to claim 2, characterized in that: The laser processing device also includes: a second dichroic mirror, which is arranged on the moving path of the light incident on the first dichroic mirror through the f-θ lens; a detection sensor, which measures the processing state of the workpiece by the light incident on the workpiece through the f-θ lens; the second dichroic mirror allows the light incident on the first dichroic mirror to be transmitted and incident on the image acquisition unit, and reflects the light transmitted and incident on the first dichroic mirror to be incident on the detection sensor.

5. A laser processing device, characterized in that: The laser processing device also includes: a first dichroic mirror, which is arranged on the moving path of the laser beam scanned by the pair of galvanometer mirrors through the f-θ lens; the first dichroic mirror allows the laser beam scanned by the laser oscillator through the pair of galvanometer mirrors to pass through the f-θ lens, scan through the f-θ lens, reflect the light incident from the workpiece through the f-θ lens, and be incident on the image acquisition unit.

6. The laser processing device according to claim 5, characterized in that: The laser processing device also includes: a second dichroic mirror, which is arranged on the moving path of the light reflected by the first dichroic mirror; a detection sensor, which measures the processing state of the workpiece by the light incident on the workpiece through the f-θ lens; the second dichroic mirror reflects the light reflected and incident on the first dichroic mirror, and is incident on the image acquisition unit, so that the light reflected and incident on the first dichroic mirror is transmitted and incident on the detection sensor.

7. The laser processing device according to claim 5, characterized in that: The laser processing device also includes: a second dichroic mirror, which is arranged on the moving path of the light reflected by the first dichroic mirror; a detection sensor, which measures the processing state of the workpiece by the light incident on the workpiece through the f-θ lens; the second dichroic mirror allows the light reflected and incident on the first dichroic mirror to transmit and be incident on the image acquisition unit, and reflects the light reflected and incident on the first dichroic mirror and be incident on the detection sensor.

Images