Discharging device and control method thereof

Abstract

A discharge device according to one embodiment includes: a discharger containing and discharging a polymeric material; a sensing unit that senses a characteristic of the polymer material; and a control unit that controls a discharge pressure of the discharger in accordance with a sensing signal from the sensing unit.

Description

Technical Field

[0001] The present invention relates to a discharge device, and more particularly, to a discharge device capable of changing discharge conditions by predicting a state change of a polymer material and a method for controlling the same. Background Art

[0002] Typically, adhesive components are used to bond multiple parts together.

[0003] For example, a semiconductor package includes a circuit board including a semiconductor device and a cover disposed on the circuit board. The cover is also called a lid.

[0004] The cover can protect the semiconductor device placed on the circuit board and discharge heat generated from the circuit board and the semiconductor device to the outside.

[0005] At this time, the adhesive component is contained in the discharge device. In addition, the adhesive component is applied to the circuit board according to the discharge pressure controlled by the discharge device. The discharge pressure is determined based on the amount of adhesive component applied or discharged. For example, the discharge device sets the discharge pressure based on the amount of adhesive component to be applied or discharged on the circuit board.

[0006] Meanwhile, the adhesive component is composed of a polymer material such as epoxy resin.

[0007] In addition, the viscosity or degree of solidification of the polymer material varies depending on the surrounding environment. In addition, changes in viscosity or degree of solidification also occur within the discharge device.

[0008] For example, the viscosity or curing degree of the adhesive component contained in the discharge device may change according to the surrounding environment (such as temperature or humidity). In addition, the viscosity or curing degree of the adhesive component contained in the discharge device may change over time.

[0009] At this time, if the viscosity or curing degree of the adhesive component changes, there is a problem that a certain amount of the adhesive component is not discharged from the discharge device.

[0010] For example, if the viscosity or curing degree of the adhesive component increases when discharging a first amount of the adhesive component at a first intensity of the discharge pressure, a second amount of the adhesive component less than the first amount may be discharged from the discharge device. In addition, if the discharge amount of the adhesive component decreases as the viscosity or curing degree increases, there is a problem of reduced bonding between the circuit board and the cover.

[0011] Meanwhile, the viscosity of the adhesive component can be measured using a device for measuring the viscosity of the adhesive component. For example, the characteristics of the adhesive component can be analyzed using a device for measuring the viscosity of the adhesive component, and the viscosity of the adhesive component can be measured using the device.

[0012] However, the characteristic analysis and viscosity measurement of the adhesive component require at least one hour or more. Therefore, there is a problem of being difficult to measure the viscosity of the adhesive component in real time. That is, even when the adhesive component is analyzed, the viscosity of the adhesive component will continue to change. Therefore, the viscosity measured using the device refers to the viscosity of the adhesive component at the previous time, rather than the viscosity of the adhesive component at the current time. Therefore, there is a problem of being difficult to check the viscosity or degree of cure of the polymer material in real time.

[0013] That is, generally, the viscosity of the adhesive component is measured for simple reference, and there is a problem that it is difficult to measure the viscosity of the adhesive component in real time.

[0014] Therefore, there is a need for a method that can measure the viscosity of an adhesive component contained in or discharged from a discharge device in real time. Summary of the invention

[0015] Technical issues

[0016] The embodiment provides a discharge device capable of measuring the viscosity or curing degree of an adhesive component in real time and a method for controlling the same.

[0017] Furthermore, the embodiment provides a discharge device capable of measuring the viscosity or curing degree of an adhesive component according to the state of a functional group included in the adhesive component and a method for controlling the same.

[0018] Furthermore, the embodiment provides a discharge device capable of accurately analyzing the characteristics of an adhesive component in real time and a method for controlling the same.

[0019] Furthermore, the embodiment provides a discharge device capable of improving the characteristics of a process of discharging an adhesive component and a method for controlling the same.

[0020] Furthermore, the embodiment provides a discharge device capable of quantitatively predicting a state change of an adhesive component and a method for controlling the same.

[0021] Furthermore, the embodiment provides a discharge device capable of discharging a constant amount of an adhesive component to a workpiece regardless of changes in time or temperature, and a method for controlling the same.

[0022] The technical problems to be solved by the proposed embodiments are not limited to the above-mentioned technical problems, and other unmentioned technical problems can be clearly understood by those skilled in the art to which the proposed embodiments belong when described below.

[0023] Technical Solution

[0024] A discharge device according to one embodiment includes: an discharger for containing and discharging a polymer material; a sensor for sensing a property of the polymer material; and a controller for controlling a discharge pressure of the discharger according to a signal sensed from the sensor.

[0025] Furthermore, the polymer material includes an adhesive component.

[0026] Furthermore, the property of the adhesive component sensed by the sensor is information corresponding to viscosity.

[0027] Furthermore, the information corresponding to the viscosity is information on the functional groups.

[0028] Furthermore, the information on the functional group is information on the amine group.

[0029] Furthermore, the adhesive component is a room temperature curing adhesive component.

[0030] Furthermore, the adhesive component is a two-component adhesive component.

[0031] In addition, the sensor senses the characteristics of the adhesive component discharged from the discharger.

[0032] Additionally, the sensor senses a property of the adhesive component contained in the discharger.

[0033] Furthermore, the sensor acquires information about the adhesive component which reacts to the infrared light source.

[0034] Furthermore, the sensor includes an output unit that outputs an infrared light source and a receiving unit that receives reflected light of the infrared light source reflected by the adhesive component.

[0035] In addition, the sensor receives the transmitted light of the infrared light source through the bonding component.

[0036] Furthermore, the discharger includes a first region for accommodating a first material, a second region for accommodating a second material different from the first material, and a third region in which the first material and the second material are mixed.

[0037] Additionally, the sensor senses the adhesive component of the third region.

[0038] Meanwhile, a method for controlling discharge according to one embodiment includes: discharging a polymer material; sensing a property of the polymer material; and controlling a discharge pressure based on the sensed information.

[0039] Furthermore, the discharged polymeric material includes a binding component.

[0040] Furthermore, the sensed information is information corresponding to the viscosity or curing degree of the adhesive component.

[0041] Additionally, the control of the discharge pressure includes increasing the discharge pressure as the viscosity or degree of cure is measured to be increasing.

[0042] Furthermore, the sensed information is information on the functional group of the bonding component, and the controlling of the discharge pressure includes controlling the discharge pressure according to the sensed amount of the functional group of the bonding component.

[0043] Furthermore, the control of the discharge pressure includes increasing the discharge pressure when the sense amount decreases.

[0044] Furthermore, the information on the functional group is information on the amine group contained in the adhesive component.

[0045] Beneficial Effects

[0046] Embodiments can measure the viscosity or the degree of cure of the adhesive component in real time. For example, embodiments can measure the viscosity or the degree of cure of the adhesive component according to the state of the functional group included in the adhesive component. Therefore, embodiments can accurately analyze the characteristics of the adhesive component in real time. In addition, embodiments can quantitatively predict the state change of the adhesive component.

[0047] In addition, the embodiment can control the discharge condition of the discharger according to the change of the viscosity or curing degree of the adhesive component. For example, when the viscosity or curing degree of the adhesive component increases, the embodiment can increase the discharge pressure of the discharger corresponding thereto.

[0048] Therefore, embodiments can improve the discharge process characteristics of the bonding component.

[0049] Additionally, embodiments may deliver a constant amount of bonding component to a workpiece regardless of changes in time or temperature.

[0050] Therefore, the embodiments can improve product reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 is a schematic diagram of an exhaust system according to one embodiment.

[0052] Figure 2 It is used to illustrate Figure 1 Figure 2 shows the detailed structure of the emitter.

[0053] Figure 3 It is used to illustrate Figure 1 Figure 2. Detailed structure of the sensor.

[0054] Figure 4 It is shown by Figure 3 Figure 2 is a diagram of an example of an infrared spectrum acquired by a sensor.

[0055] Figure 5is a diagram for explaining a reaction between a first material and a second material of an adhesive component according to an embodiment.

[0056] Figure 6 is a graph for explaining the change in viscosity of an adhesive component over time according to one embodiment.

[0057] Figure 7 is a graph showing the change in the state of the functional group of the adhesive component over time.

[0058] Figure 8 is a graph showing the relationship between the number of functional groups and viscosity of an adhesive component according to one embodiment.

[0059] Fig. 9 is a flowchart illustrating step by step a control method of an emission device according to an embodiment. DETAILED DESCRIPTION

[0060] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0061] However, the spirit and scope of the present disclosure are not limited to the parts of the described embodiments and may be implemented in various other forms, and one or more elements of the embodiments may be selectively combined and rearranged within the spirit and scope of the present disclosure.

[0062] In addition, unless otherwise clearly defined and described, the terms (including technical and scientific terms) used in the embodiments of the present disclosure may be interpreted as the same as the meanings commonly understood by those of ordinary skill in the art to which the present disclosure belongs, and the terms, such as those defined in commonly used dictionaries, may be interpreted as having meanings consistent with their meanings in the context of the relevant technology. In addition, the terms used in the embodiments of the present disclosure are used to describe the embodiments and are not intended to limit the present disclosure.

[0063] In the present specification, unless otherwise specified in a phrase, a singular form may also include a plural form, and when described in "at least one (or more) of A (and), B, and C", at least one of all possible combinations of A, B, and C may be included. In addition, when describing elements of the embodiments of the present disclosure, terms such as first, second, A, B, (a), and (b) may be used.

[0064] These terms are only used to distinguish an element from other elements, and the terms are not limited to the nature, order or sequence of the elements. In addition, when an element is described as being "connected", "coupled" or "in contact with" another element, it may include not only the case where the element is directly "connected", "coupled" or "in contact with" the other element, but also the case where the element is "connected", "coupled" or "in contact with" another element between the element and the other element.

[0065] In addition, when described as being formed or arranged "on (above)" or "below (below)" of each element, "on (above)" or "below (below)" may include not only a case where two elements are directly connected to each other, but also a case where one or more other elements are formed or arranged between the two elements. In addition, when expressed as "on (above)" or "below (below)", it may include not only an upper direction based on one element, but also a lower direction.

[0066] Hereinafter, a discharge apparatus and a control method thereof according to one embodiment will be described.

[0067] Figure 1 is a schematic diagram of an exhaust system according to one embodiment, Figure 2 It is used to illustrate Figure 1 Figure 1. Detailed structure of the emitter. Figure 3 It is used to illustrate Figure 1 A diagram of the detailed structure of the sensor, and Figure 4 It is shown by Figure 3 Figure 2 is a diagram of an example of an infrared spectrum acquired by a sensor.

[0068] Reference Figure 1 The discharge system includes a workbench 100, a workpiece 110 and a discharge device 200.

[0069] The workbench 100 may provide a space for placing the workpiece 110. For example, the workbench 100 may provide the workpiece 110 to an area where the discharge device 200 is placed.

[0070] The workbench 100 may include a moving portion that moves the workpiece 110 to the discharge area and a fixing portion that fixes the workpiece 110 moved to the discharge area.

[0071] The workpiece 110 may be placed on the workbench 100. The workpiece 110 may mean a circuit board to which an adhesive component is to be applied by the discharge device 200. However, the embodiment is not limited thereto. For example, the workpiece 110 may be a component of a camera module to which an adhesive component is to be applied other than a circuit board.

[0072] The discharge device 200 may apply an adhesive component on the workpiece 110 placed on the worktable 100 .

[0073] To this end, the discharge device 200 may include a discharger 220 that accommodates the adhesive component 210 and discharges the accommodated adhesive component 210 to the workpiece 110 .

[0074] The adhesive component 210 may be a polymer material. For example, the adhesive component 210 may be a polymer material including an adhesive component. As an example, the adhesive component 210 may be an epoxy resin, but is not limited thereto.

[0075] In other words, the adhesive component 210 is a polymer material including an adhesive component and may include epoxy resin. Epoxy resin is a type of thermosetting resin and may have excellent water and weather resistance properties as well as excellent curing and bonding properties.

[0076] The epoxy resin constituting the adhesive component 210 may be selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, alicyclic epoxy resin, cresol novolac type epoxy resin, and biphenyl type epoxy resin. Hereinafter, the adhesive component 210 will be described as an epoxy resin, which is one of the polymer materials having an adhesive material.

[0077] In one embodiment, the adhesive component 210 may be a single-component adhesive component. For example, the main agent and the curing agent may be contained in the discharger 220 in a mixed state. In the single-component adhesive component, the main agent and the curing agent may be difficult to react at room temperature. For example, the single-component adhesive component may be a heat-curing adhesive component or a UV-curing adhesive component.

[0078] In another embodiment, the adhesive component 210 can be a two-component adhesive component. For example, the main agent and the curing agent can be contained in the discharger 220 in a separate state. Then, the discharger 220 can mix the main agent and the curing agent and discharge them to the workpiece 110. For example, the two-component adhesive component can be a room temperature curing type adhesive component. That is, since the room temperature curing type adhesive component has a very high reactivity between the main agent and the curing agent, the rate of change of the viscosity or the degree of curing over time is high. Therefore, the main agent and the curing agent can be contained in the discharger 220 in a separate state. Then, when it is necessary to discharge the adhesive component 210 to the workpiece 110, the main agent and the curing agent can be mixed, and the mixed material can be discharged to the workpiece 100.

[0079] Meanwhile, the discharge device 200 of the embodiment may sense a property change of the adhesive component 210 contained in the discharger 220 or discharged from the discharger 220 , and control a discharge condition of the discharger 220 according to the sensed property change of the adhesive component 210 .

[0080] At this time, as described above, in the case of a single-component adhesive component, the reactivity at room temperature is very low. Therefore, if the adhesive component 210 contained in the discharger 220 is a single-component adhesive component, the characteristics of the adhesive component 210 may hardly change. Therefore, if the adhesive component 210 is a single-component adhesive component, the discharge condition control of the discharge device 200 according to the embodiment may be unnecessary. For example, if the adhesive component 210 is a single-component adhesive component, the effect exhibited by the discharge device 200 of the embodiment may be minimized. For example, in the case of a single-component adhesive component, since the reactivity at room temperature is very low, the degree of curing or viscosity may hardly change.

[0081] However, although the one-component adhesive component does not react well at room temperature, it is frozen and stored for emergency use. For example, the one-component adhesive component is stored at a temperature of about -20 degrees. In addition, in order to use the one-component adhesive component, a process of exposing the frozen one-component adhesive component to room temperature for a period of time is performed. However, during the process of melting the frozen one-component adhesive component, the viscosity or degree of solidification may change depending on the surrounding environment. In addition, although the one-component adhesive component has low reactivity at room temperature, a state change may occur depending on time or the surrounding environment.

[0082] Therefore, embodiments can control discharge conditions according to the characteristic change of the adhesive component 210 described below for the single-component adhesive component. Therefore, embodiments sense the state change of the single-component adhesive component to prevent the adhesive component 210 less than the target amount from being discharged onto the workpiece 110.

[0083] However, the discharge device 200 of the embodiment can achieve the maximum effect when applied to a two-component adhesive component. For example, since the two-component adhesive component has high reactivity at room temperature, the characteristics of the main agent and the curing agent mixed in the discharger 220 change greatly over time or in the surrounding environment. Therefore, the embodiment senses the characteristic change of the adhesive component 210 contained in the discharger 220 or the adhesive component 210 discharged from the discharger 220, and controls the discharge condition of the discharger 220 based on this.

[0084] Therefore, the following description is made on the case where the adhesive component 210 is a two-component adhesive component. However, the embodiment is not limited thereto, and the adhesive component 210 contained in and discharged by the discharger 220 may be a single-component adhesive component instead of a two-component adhesive component.

[0085] The adhesive component 210 may include a first material corresponding to the main agent and a second material corresponding to the curing agent. The first material may be referred to as an epoxy resin corresponding to the main agent. In addition, the second material may be referred to as a curing agent.

[0086] The first material may mean an epoxy resin corresponding to the main agent. The first material may allow the adhesive component 210 to have a certain level or higher adhesive strength through curing and bonding.

[0087] The type of the first material is not particularly limited as long as it contains at least two or more functional groups. Specifically, the first material may contain a functional group that meets and reacts with the second material. For example, the functional group contained in the first material may include an epoxy group or an amine group derived from an epoxy group. The functional group may also be represented as a crosslinking agent, a binder, a terminal group, a reactive group, etc.

[0088] Specifically, the first material can be any one of the following: bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A novolac type epoxy resin, bisphenol F novolac type epoxy resin, alicyclic epoxy resin, glycidyl ester type epoxy resin, glycidyl amine epoxy resin, hydantoin type epoxy resin, isocyanate type epoxy resin and aliphatic chain epoxy resin, as well as terminal amine-modified epoxy resin.

[0089] The second material may be a material for polymerizing the first material. For example, before encountering the second material, the first material may be a low molecular weight material. In addition, the first material may be polymerized by encountering and reacting with the second material. Therefore, a mixed material in which the first material is mixed with the second material may be a polymer material that is polymerized when the first material and the second material meet and react. Specifically, when the first material and the second material are mixed, the amine group and the epoxy group corresponding to the functional group meet and react. In addition, when the amine group and the epoxy group meet and react with each other, the molecular weight of the polymer material increases, and the change in the properties of the polymer material may be as much as the increase in the molecular weight.

[0090] The type of the second material is not particularly limited, and may include, for example, an amine-based curing agent, a phenol-based curing agent, an anhydride-based curing agent (also known as an anhydride, an oxide formed by dehydrating an acid from an inorganic acid or an oxide formed by separating a molecule of water from an organic acid through a condensation reaction of a carboxylic acid group), a hydrazide-based curing agent, dicyandiamide, and the like.

[0091] In addition, the example of the curing agent based on amine includes polyoxyalkylene polyamine, polyamide, amidoamine, aliphatic amine, tertiary amine, aromatic aliphatic amine, alicyclic amine, aromatic amine, isophorone diamine etc. In addition, the curing agent based on phenol includes the halogenated compound of phenol novolac, cresol novolac, bisphenol A novolac and novolac resin. These can be used alone or in combination of two or more. In addition, the example of anhydride curing agent can include at least one selected from the following: methyl hexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, methyl-5-norbornene-2,3-dicarboxylic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, dodecyl succinic anhydride, phthalic anhydride and succinic anhydride.

[0092] Preferably, the first material of the embodiment may be DGEBA (diglycidyl ether of bisphenol A, bisphenol A type liquid epoxy resin) represented by the following Chemical Formula 1, and the second material may be 1-(2-aminoethyl)piperazine represented by the following Chemical Formula 2.

[0093] [Chemical formula 1]

[0094]

[0095] [Chemical formula 2]

[0096]

[0097] Meanwhile, the adhesive component 210 may further include a filler. The filler may be added to the first material and the second material to improve the mechanical properties of the adhesive component 210. The filler may have functions such as reducing cost, reducing thermal expansion rate, reducing curing shrinkage rate, controlling heat generation during curing, improving adhesion, imparting thixotropic properties, imparting flame retardancy, imparting chemical resistance, improving thermal conductivity, improving mechanical strength, improving electrical properties, and improving wear resistance.

[0098] The adhesive component 210 may be contained in the discharger 220. Also, the adhesive component 210 may be discharged from the discharger 220 to the workpiece 110.

[0099] To this end, the discharger 220 may provide a receiving space in which the adhesive component 210 is received. At this time, if the adhesive component 210 is a single-component adhesive component, the receiving space of the discharger 220 may not be divided into a plurality of regions. However, when the adhesive component 210 is a two-component adhesive component, the receiving space of the discharger 200 may be divided into a plurality of regions.

[0100] Reference Figure 2 , the accommodation space of the discharger 220 may be divided into a plurality of areas.

[0101] For example, the discharger 220 may include a first region 221, a second region 222, and a third region 223. Specifically, the discharge device 200 may include a syringe that is divided into a plurality of regions while containing the adhesive component 210.

[0102] The first region 221 of the syringe may provide a space in which the first material of the adhesive component 210 is contained. The first region 221 may be separated from the second region 222.

[0103] The second region 222 of the syringe may provide a space in which the second material of the adhesive component 210 is contained. The second region 222 may be separated from the first region 221.

[0104] That is, the first material is contained in the first region 221, and the second material is contained in the second region 222. Further, in a state in which the first material is contained in the first region 221 and the second material is contained in the second region 222, the first material and the second material do not meet each other.

[0105] In addition, the ejector 220 further includes a third region 223 of the injector. The third region 223 may be connected to the first region 221 and the second region 222, respectively. For example, the third region 223 may be a region where the first material contained in the first region 221 and the second material contained in the second region 222 meet. For example, the third region 223 may be a region where the first material of the first region 221 and the second material of the second region 222 are mixed with each other.

[0106] That is, in the case of a two-component adhesive component, it can be separately contained in the first area 221 and the second area 222 of the discharger 220. In addition, when it is necessary to discharge the adhesive component 210 to the workpiece 110, the first material and the second material can be moved to the third area 223 and mixed with each other. In addition, the mixed material can be discharged through the needle 224 of the discharger 220.

[0107] For example, the discharger 220 of the embodiment may be a needle type dispenser for discharging the adhesive component 210, but is not limited thereto.

[0108] As described above, the two-component adhesive components may be divided into the first area 221 and the second area 222 of the discharger 220 , mixed in the third area 223 , and then discharged through the needle 224 .

[0109] Meanwhile, although not shown in the figure, the discharger 220 may include an air inlet channel disposed on the upper portion of the syringe. In addition, compressed air may be introduced through the air inlet channel. The intensity of the compressed air may be controlled by a controller described later. In addition, the discharge amount of the adhesive component 210 discharged by the needle 224 of the discharger 220 may be controlled by the intensity of the compressed air controlled by the controller.

[0110] At this time, the two-component adhesive composition is a room temperature curing adhesive composition, that is, the two-component adhesive composition can be cured at room temperature by the reaction of the first material of the main agent and the second material of the curing agent.

[0111] Here, "room temperature" may specifically mean a temperature in a state where it is not heated or cooled. For example, room temperature may mean a temperature in a range of 10°C to 30°C. Specifically, room temperature may mean a temperature of 15°C or higher, 18°C ​​or higher, 20°C or higher, or 23°C or higher, and 27°C or lower.

[0112] In addition, since the two-component adhesive component is a room temperature curing type, the first material and the second material can meet and react with each other at room temperature. In addition, the properties of the adhesive component 210 as a mixture of the first material and the second material can vary according to the degree of reaction between the first material and the second material. Here, the properties can mean the viscosity of the adhesive component 210. For example, the properties can mean the degree of curing of the adhesive component 210.

[0113] At this time, the first material and the second material may meet and react in the third region 223 of the discharger 220. In addition, the viscosity or the degree of curing as a characteristic of the adhesive component 210 mixed in the third region 223 may vary over time.

[0114] At this time, if the adhesive component 210 mixed in the third area 223 is used within a short period of time or in a continuous process, the discharge amount of the adhesive component 210 may not significantly change depending on the viscosity or the degree of curing.

[0115] However, the adhesive component 210 present in the discharger 220 is generally used for 24 hours or more. In addition, during the process of discharging the adhesive component 210, the discharging process may not be performed for a period of time due to reasons such as checking other equipment. Therefore, the viscosity or curing degree of the adhesive component 210 present in the third area 223 may change over time.

[0116] In addition, the viscosity or curing degree of not only the adhesive component 210 contained in the third area 223 but also the adhesive component 210 discharged through the needle 224 may change. For example, the needle 224 contains metal. Then, the adhesive component 210 discharged from the tip of the needle 224 containing metal may meet air, thereby increasing the reactivity of the adhesive component 210, and thus the viscosity or curing degree may change.

[0117] At this time, if the viscosity or the degree of curing of the adhesive component 210 changes, the discharge amount of the adhesive component 210 discharged from the discharger 220 under the same discharge condition may change.

[0118] For example, the discharge amount of the adhesive component 210 discharged in a state where the viscosity or the degree of curing is high is smaller than the discharge amount of the adhesive component 210 discharged in a state where the viscosity or the degree of curing is low.

[0119] Therefore, a constant discharge amount of the adhesive component 210 should always be discharged from the discharger 220, but the viscosity or curing degree of the adhesive component 210 varies according to the reaction degree between the first material and the second material of the adhesive component 210, so the discharge amount of the adhesive component 210 discharged from the discharger 220 will also vary.

[0120] Thus, the embodiment senses a change in the property of the adhesive component 210 contained in the third region 223 of the discharger 220 and / or the adhesive component 210 discharged from the needle 224 of the discharger 220 .

[0121] To this end, the discharge device 200 of the embodiment may include a sensor 230 .

[0122] The sensor 230 may sense the properties of the adhesive component 210. Specifically, the sensor 230 may sense the viscosity of the adhesive component 210. For example, the sensor 230 may sense the degree of curing of the adhesive component 210.

[0123] To this end, the sensor 230 may sense the state of the functional group provided in the adhesive component 210. For example, the sensor 230 may sense the state of the functional group provided in the adhesive component 210.

[0124] That is, the property of the adhesive component 210 may be the state of the functional group of the adhesive component 210 , and the state of the functional group of the adhesive component 210 may mean the viscosity or curing degree of the adhesive component 210 .

[0125] Furthermore, the embodiment senses the state of the functional group of the adhesive component 210 , and senses the characteristics of the adhesive component 210 , such as viscosity or a degree of curing, based on the state of the functional group.

[0126] To this end, the sensor 230 may sense the characteristics of the adhesive component 210 using an FT-IR (Fourier Transform Infrared) analysis method.

[0127] Here, the FT-IR (Fourier Transform Infrared) analysis method is a method of analyzing the characteristics of a sample by using infrared rays (IR) irradiated to the sample. When infrared rays are irradiated to the sample, the molecules in the sample absorb infrared rays of a specific frequency and vibrate due to the infrared rays. In addition, this can be expressed as a characteristic infrared spectrum corresponding to the energy of the molecular vibrations in the sample. Therefore, by analyzing the infrared spectrum, information about the molecules in the sample can be obtained, and various information contained in the spectrum can be utilized.

[0128] In addition, the sensor 230 may include a probe 230a for sensing. The probe 230a may be a sensing mechanism for sensing the characteristics of the adhesive component 210 without changing the characteristics of the adhesive component 210 as a measurement target. The probe 230a may be a non-contact sensing mechanism.

[0129] The probe 230a of the sensor 230 can sense the properties of the adhesive component 210 contained in the third area 223 of the syringe of the discharger 220. In another embodiment, the probe 230a can sense the properties of the adhesive component 210 discharged through the needle 224 of the discharger 220. In another embodiment, the probe 230a is provided in a plurality of quantities, so that the properties of the adhesive component 210 contained in the third area 223 and the properties of the adhesive component 210 discharged through the needle 224 can be sensed.

[0130] Specifically, the viscosity or curing degree of the adhesive component 210 may vary according to the degree of reaction between the first material and the second material. For example, as the degree of mutual reaction between the first material and the second material increases, the viscosity or curing degree may also increase. In addition, the degree of mutual reaction between the first material and the second material may be confirmed based on the state of the functional groups provided in the first material and the second material.

[0131] For example, when the degree of reaction between the first material and the second material is low (e.g., when no reaction occurs), a first strength of functional groups exists in the bonding component 210. In addition, when the first material and the second material react with each other, the functional groups provided in the bonding component 210 decrease to a second strength lower than the first strength.

[0132] Therefore, the embodiment senses the strength of the functional group of the adhesive component 210, and based on the strength of the functional group, senses the viscosity or curing degree of the adhesive component 210. The relationship between the strength of the functional group and the viscosity / curing degree of the adhesive component 210 is described in more detail below.

[0133] For this purpose, refer to Figure 3 The sensor 230 may include an output unit 231 , a receiving unit 232 , and an acquiring unit 233 .

[0134] The output unit 231 may include an infrared light source. That is, the output unit 231 may be referred to as an infrared light source generating unit that generates an infrared light source. The output unit 231 may irradiate the infrared light source to the sensing target.

[0135] In one embodiment, the output unit 231 may irradiate the infrared light source to the third area 223 of the syringe of the discharger 220 .

[0136] In another embodiment, the output unit 231 may irradiate an infrared light source to the adhesive component 210 discharged through the needle 224 of the discharger 220 .

[0137] At this time, the output unit 231 may irradiate an infrared light source of a specific wavelength band. The infrared light source may be near infrared rays, or alternatively, mid-infrared rays.

[0138] Preferably, the infrared light source may be near infrared light.

[0139] That is, the adhesive component 210 contains fillers. In addition, when the output unit 231 uses mid-infrared light, energy caused by the fillers may be reflected in the spectrum acquired from the sensor 230. Therefore, noise may be included in the peak corresponding to the functional group in the infrared spectrum acquired by the sensor 230.

[0140] In contrast, when the output unit 231 uses near infrared light, the energy caused by the filler may not be reflected in the infrared spectrum acquired by the sensor 230, and thus the accuracy of the peak corresponding to the functional group may be high. Specifically, when the output unit 231 uses near infrared light, the functional group provided in the adhesive component 210 can be quantitatively analyzed using the spectrum sensed by the sensor 230.

[0141] The receiving unit 232 may receive the infrared light reflected by the adhesive component 210 .

[0142] In one embodiment, the receiving unit 232 may receive reflected light reflected by the adhesive component 210 .

[0143] In another embodiment, the receiving unit 232 may receive the transmitted light transmitted through the adhesive component 210 .

[0144] The acquisition unit 233 may acquire a characteristic infrared spectrum caused by vibration of molecules in the adhesive component 210 using the reflected light or the transmitted light received by the receiving unit 232 .

[0145] For example, refer to Figure 4 , the infrared spectrum can be expressed as absorption according to wave number. In addition, the embodiment can sense the state of the functional group by utilizing the absorption of a specific frequency to be analyzed in the infrared spectrum. This will be described in more detail below.

[0146] The discharge device of the embodiment includes a storage unit 240. The storage unit 240 may store information required for the operation of the discharge device. The storage unit 240 may store information generated during the operation of the discharge device.

[0147] Preferably, the storage unit 240 may store a program for processing or controlling the controller 250 and various information for the overall operation of the discharge device by the controller 250. For example, the storage unit 240 may store information about the relationship between the infrared spectrum sensed by the sensor 230 and the characteristics of the adhesive component 210. For example, the storage unit 240 may store information about the relationship between the intensity of a specific frequency in the infrared spectrum and the viscosity or curing degree of the adhesive component 210 corresponding thereto.

[0148] In terms of hardware, the storage unit 240 may be various storage devices, such as ROM, RAM, EPROM, flash drive, hard disk drive, and the like.

[0149] The controller 250 may control the overall operation of the discharge device.

[0150] The controller 250 controls the discharge condition of the discharger 220 so that a specific amount of the bonding component 210 is discharged to the workpiece 110 .

[0151] In addition, the controller 250 periodically senses information about the characteristics of the adhesive component 210 through the sensor 230. For example, the controller 250 acquires an infrared spectrum of the adhesive component 210 through the sensor 230.

[0152] In addition, the controller 250 can control the discharge condition of the discharger 220 according to the characteristics of the adhesive component 210 sensed based on the infrared spectrum sensed by the sensor 230. Here, the discharge condition may include the discharge pressure. However, the embodiment is not limited thereto. For example, the discharge condition may include the discharge time. Hereinafter, the discharge condition will be described as the discharge pressure.

[0153] For example, the controller 250 may measure the viscosity or degree of cure of the adhesive component 210 using infrared spectroscopy.

[0154] In addition, when the measured viscosity or curing degree changes, the controller 250 may adjust the discharge pressure of the discharger 220. For example, when high viscosity or high curing degree is measured, the controller 250 may increase the discharge pressure of the discharger 220.

[0155] In other words, the controller 250 may detect information about the functional groups contained in the adhesive component 210 using infrared spectroscopy. For example, the controller 250 may detect an intensity area or an intensity height in a specific wavelength band corresponding to the functional groups contained in the adhesive component 210 based on the infrared spectroscopy. In addition, the detected information may mean the number of functional groups contained in the adhesive component 210. Thereafter, as the amount of the functional groups contained in the detected adhesive component 210 decreases, the controller 250 increases the discharge pressure of the discharger 220.

[0156] Embodiments can measure the viscosity or the degree of cure of the adhesive component in real time. For example, embodiments can measure the viscosity or the degree of cure of the adhesive component according to the state of the functional group included in the adhesive component. Therefore, embodiments can accurately analyze the characteristics of the adhesive component in real time. In addition, embodiments can quantitatively predict the state change of the adhesive component.

[0157] In addition, the embodiment can control the discharge condition of the discharger according to the change of the viscosity or curing degree of the adhesive component. For example, when the viscosity or curing degree of the adhesive component increases, the embodiment can increase the discharge pressure of the discharger corresponding thereto.

[0158] Therefore, embodiments can improve the discharge process characteristics of the bonding component.

[0159] Additionally, embodiments may deliver a constant amount of bonding component to a workpiece regardless of changes in time or temperature.

[0160] Therefore, the embodiments can improve product reliability.

[0161] Hereinafter, changes in the viscosity or curing degree of the adhesive component over time and the relationship between the viscosity or curing degree and the functional groups included in the adhesive component 210 are described.

[0162] Figure 5 is a diagram for explaining the reaction of a first material and a second material of an adhesive component according to one embodiment, Figure 6 is a graph for explaining the change in viscosity of an adhesive component over time according to one embodiment, Figure 7 is a graph showing the state change of the functional groups of the adhesive component over time, and Figure 8 is a graph showing the relationship between the number of functional groups and viscosity of an adhesive component according to one embodiment.

[0163] Reference Figure 5 , the adhesive component 210 of the embodiment may include the first material and the second material as described above. In addition, the first material and the second material may each include a functional group.

[0164] The functional group may vary depending on the types of materials constituting the first material and the second material.

[0165] For example, the first material may have an epoxy group (O, Figure 5 A), and the first material may have an amine group (NH2, Figure 5 B).

[0166] In addition, when the first material and the second material meet, the epoxy group (O, Figure 5 A) and amine (NH2, Figure 5 In addition, when the epoxy group (O, Figure 5 A) and amine (NH2, Figure 5 B) react with each other, the amine group (NH2, Figure 5 B) becomes NH( Figure 5 C) status.

[0167] In other words, the adhesive component 210 includes an amine group (NH 2 ). In addition, the amine group (NH 2 ) becomes NH according to the reaction degree of the adhesive component 210 .

[0168] Therefore, the fact that the amine group (NH2) becomes NH may mean that the mutual reaction degree between the first material and the second material in the adhesive component 210 is high. In addition, the fact that the reaction degree is high means that the viscosity or curing degree of the adhesive component 210 increases.

[0169] In summary, the fact that the amine group (NH2) as the functional group provided in the adhesive component 210 is changed to NH means that the viscosity or curing degree of the adhesive component 210 increases. In addition, the reduction in the number of amine groups (NH2) provided in the adhesive component 210 may also mean that the viscosity or curing degree of the adhesive component 210 increases.

[0170] Meanwhile, as an example, the functional group provided in the adhesive component 210 is an amine group (NH2), but is not limited thereto. For example, depending on the types of the first material and the second material, the functional group of the adhesive component 210 may be a thiol group (SH) instead of an amine group (NH2).

[0171] At the same time, refer to Figure 6 The viscosity of the adhesive component 210 may change over time. For example, the viscosity of the adhesive component 210 may also increase over time.

[0172] At the same time, refer to Figure 7 , the number of functional groups provided in the adhesive component 210 may decrease over time. That is, the viscosity of the adhesive component 210 increases over time, and in addition, the number of functional groups decreases. The number of functional groups can be expressed as absorbance in infrared spectra.

[0173] That is, in the embodiment, it is confirmed how the number of functional groups provided in the adhesive component 210 changes with time. At this time, the embodiment shows the infrared spectrum of the adhesive component 210 including the amine group (NH2) changing with time.

[0174] At this time, the amine group (NH2) can react at a wavelength of 6625 (cm-1) in the infrared spectrum.

[0175] Therefore, by analyzing information at a wavelength of 6625 (cm-1) in the infrared spectrum, information of the amine group (NH2) included in the adhesive component 210 can be confirmed.

[0176] In addition, if Figure 7 As shown, it is confirmed that the number of amine groups (NH 2 ) included in the adhesive component 210 is gradually reduced over time.

[0177] For example, it can be seen that the absorbance at a wavelength of 6625 (cm-1) in the infrared spectrum sensed for the first time (T1) is about 1.500.

[0178] For example, it can be seen that the absorbance of the 6625 (cm-1) wavelength band in the infrared spectrum sensed for the second time (T2) after the first time (T1) is about 1.475.

[0179] For example, it can be seen that the absorbance of the 6625 (cm-1) wavelength band in the infrared spectrum sensed for the third time (T3) after the second time (T2) is about 1.465.

[0180] For example, it can be seen that the absorbance of the 6625 (cm-1) wavelength band in the infrared spectrum sensed at the fourth time (T4) after the third time (T3) is about 1.455.

[0181] For example, it can be seen that the absorbance of the 6625 (cm-1) wavelength band in the infrared spectrum sensed at the fifth time (T5) after the fourth time (T4) is about 1.445.

[0182] For example, it can be seen that the absorbance of the 6625 (cm-1) wavelength band in the infrared spectrum sensed at the sixth time (T6) after the fifth time (T5) is about 1.440.

[0183] That is, as time goes by (e.g., from T1 to T6), the degree of reaction of the first material and the second material contained in the adhesive component 210 may increase. In addition, as the degree of reaction increases, the number of functional groups provided in the adhesive component 210 may decrease. Therefore, when the number of functional groups decreases, the absorbance of the wavelength band corresponding to the functional group in the sensed infrared spectrum may decrease. In addition, the embodiment can measure the viscosity or curing degree of the adhesive component 210 based on the absorbance of the wavelength band corresponding to the functional group in the infrared spectrum.

[0184] At the same time, if Figure 8 As shown, the embodiment demonstrates the relationship between the number of amine groups (NH 2 ) included in the adhesive component 210 and the viscosity of the adhesive component 210 corresponding thereto.

[0185] like Figure 8 As shown, when the number of functional groups is small, it is confirmed that the viscosity of the adhesive component 210 corresponding thereto is high. In addition, when the number of functional groups is large, it is confirmed that the viscosity corresponding thereto is low.

[0186] Therefore, the embodiment stores the relationship information between the detected amount of the functional group in the adhesive component 210 and the viscosity of the adhesive component 210 corresponding thereto in the storage unit 240. In addition, the controller 250 controls to acquire the infrared spectrum from the sensor 230 according to a specific period. Here, the period may be 3 seconds, but is not limited thereto.

[0187] In addition, the controller 250 can analyze the information of the wavelength band corresponding to the functional group of the adhesive component 210 in the acquired infrared spectrum, and measure the viscosity or curing degree of the adhesive component 210 based on the information. Therefore, the controller 250 can adjust the discharge pressure of the discharger 220 based on the viscosity or curing degree.

[0188] Fig. 9 is a flowchart illustrating step by step a control method of an emission device according to an embodiment.

[0189] Reference Fig. 9 The embodiment stores the relationship information of the strength of the functional group contained in the adhesive component 210 (e.g., the detected amount or height of the area or peak) and the characteristic of the adhesive component 210 corresponding to the strength of the functional group (S110). The characteristic of the adhesive component 210 may indicate the viscosity or curing degree of the adhesive component 210.

[0190] Next, the sensor 230 irradiates infrared rays to the adhesive component 210 contained in the discharger 220 or discharged from the discharger 220 (S120).

[0191] Thereafter, the sensor 230 acquires an infrared spectrum according to the infrared irradiation, and then the sensor 230 may transmit the acquired infrared spectrum to the controller 250.

[0192] Next, the controller 250 can analyze the infrared spectrum to measure the characteristics of the adhesive component 210 (S130). For example, the controller 250 can analyze the area of ​​a specific wavelength band or the height of a peak in the infrared spectrum. Then, the controller 250 can measure the detection amount of the functional group provided in the adhesive component 210 based on the area of ​​the specific wavelength band or the height of the peak. In addition, the controller 250 can measure the viscosity or degree of curing of the adhesive component 210 based on the detection amount of the functional group.

[0193] Next, the controller 250 may determine whether the measured viscosity or degree of curing has changed ( S140 ).

[0194] In addition, if the viscosity or curing degree has changed, the controller 250 may adjust the discharge condition of the discharger 220 corresponding to the amount of change in the viscosity or curing degree (S150). For example, the controller 250 may increase the discharge pressure of the discharger 220 in proportion to the amount of change in the viscosity or curing degree of the adhesive component 210.

[0195] Embodiments can measure the viscosity or the degree of cure of the adhesive component in real time. For example, embodiments can measure the viscosity or the degree of cure of the adhesive component according to the state of the functional group included in the adhesive component. Therefore, embodiments can accurately analyze the characteristics of the adhesive component in real time. In addition, embodiments can quantitatively predict the state change of the adhesive component.

[0196] In addition, the embodiment can control the discharge condition of the discharger according to the change of the viscosity or curing degree of the adhesive component. For example, when the viscosity or curing degree of the adhesive component increases, the embodiment can increase the discharge pressure of the discharger corresponding thereto.

[0197] Therefore, embodiments can improve the discharge process characteristics of the bonding component.

[0198] Additionally, embodiments may deliver a constant amount of bonding component to a workpiece regardless of changes in time or temperature.

[0199] Therefore, the embodiments can improve product reliability.

[0200] The features, structures, effects, etc. described in the above embodiments are included in at least one embodiment and are not necessarily limited to only one embodiment. In addition, the features, structures, effects, etc. shown in each embodiment can be combined or modified by a person of ordinary skill in the art to which the embodiment belongs for use in other embodiments. Therefore, the content related to such combinations and changes should be interpreted as being included in the scope of the embodiment.

[0201] In the above, the embodiment is mainly described, but this is only an example, and the embodiment is not limited. It will be understood by those skilled in the art that various modifications and applications not shown above are possible without departing from the basic features of the embodiment. For example, each component specifically shown in the embodiment can be implemented by modification. In addition, the differences related to these modifications and applications should be interpreted as being included in the scope of the embodiment set forth in the appended claims.

Claims

1. A discharge device, comprising: a discharger for receiving and discharging the polymeric material; A sensor for sensing a property of the polymer material; and A controller is used to control the discharge pressure of the discharger according to the signal sensed from the sensor.

2. The discharge device of claim 1, wherein the polymer material comprises a bonding component. 3 . The discharge device according to claim 2 , wherein the property of the adhesive component sensed by the sensor is information corresponding to viscosity. 4 . The discharge device according to claim 3 , wherein the information corresponding to the viscosity is information on a functional group. The discharge device according to claim 4 , wherein the information on the functional group is information on an amine group. The discharge device according to claim 2 , wherein the adhesive component is a room temperature curing adhesive component.

7. The discharge device according to claim 2, wherein the adhesive component is a two-component adhesive component.

8. The discharge device according to claim 2, wherein the sensor senses a property of the adhesive component discharged from the discharger.

9. The discharge device of claim 2, wherein the sensor senses a property of the adhesive component contained in the discharger.

10. The discharge device of claim 2, wherein the sensor acquires information of the bonding component responsive to an infrared light source.

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