Semiconductor device

Abstract

The semiconductor device includes: a power module; a first frame body and a second frame body which are bonded to each other through bonding surfaces to form a refrigerant flow path; and a sealing material having a sealing material coating part on which the sealing material is coated on the adhesive surface of either the first frame or the second frame, and a sealing material pressing part for pressing the sealing material at a position corresponding to the sealing material coating part on the adhesive surface of the other frame. The adhesive surface of either the first frame body or the second frame body is provided with a sealing material inflow suppression part which suppresses the inflow of the sealing material into the refrigerant flow path at a position closer to the refrigerant flow path than the sealing material coating part.

Description

Technical Field

[0001] The present invention relates to a semiconductor device. Background Art

[0002] A cooling flow path for cooling a semiconductor device is formed by joining frames together, and high reliability is required for the assembly of frames together when forming the cooling flow path.

[0003] For example, Patent Document 1 listed below discloses a power conversion device having a structure in which a double groove is provided on a surface coated with a sealing material and a protrusion is provided at a joint portion between frame bodies. Prior art literature Patent Literature

[0004] Patent Document 1: Japanese Patent Application Publication No. 2016-92209 Summary of the invention Problem that the invention aims to solve

[0005] In the structure of Patent Document 1, there is no problem with the seal itself, but there is a possibility that the seal material contacts the refrigerant flow path and corrodes, resulting in assembly degradation. In view of this, an object of the present invention is to provide a semiconductor device that simultaneously prevents a decrease in bonding strength and prevents an adhesive from flowing into the refrigerant flow path. Technical means of solving problems

[0006] The semiconductor device comprises: a power module which uses a semiconductor output to drive the motor; a first frame and a second frame which respectively have a bonding surface, and the bonding surfaces are bonded to each other to form a refrigerant flow path for cooling the power module; and a sealing material which seals the bonding surfaces of the first frame and the second frame, and has a sealing material coating portion for coating the sealing material on the bonding surface of either the first frame or the second frame, and has a sealing material pressing portion for pressing the sealing material at a position corresponding to the sealing material coating portion on the bonding surface of the other frame, and has a sealing material inflow inhibiting portion for inhibiting the sealing material from flowing into the refrigerant flow path at a position closer to the refrigerant flow path than the sealing material coating portion on the bonding surface of either the first frame or the second frame. Effects of the Invention

[0007] According to the present invention, it is possible to provide a semiconductor device which can simultaneously prevent a decrease in bonding strength and prevent an adhesive from flowing into a refrigerant flow path. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is an exploded perspective view of the power conversion device. Figure 2 One embodiment of the present invention Figure 1 AA cross-sectional view of a power conversion device. Figure 3 is an embodiment of the present invention Figure 2 An illustration of the bonding portion between the frames. Figure 4 This is an explanatory diagram of the relationship between a sealing material and an adhesive surface according to one embodiment of the present invention. Figure 5 It is the shape pattern of the pressing part and the applying part. Figure 6 These are first to fourth modified examples of the pressing portion, the applying portion, and the storage portion. Figure 7 The present invention relates to the fifth and sixth modified examples of the pressing portion, the applying portion, and the storage portion. DETAILED DESCRIPTION

[0009] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The following description and drawings are examples for illustrating the present invention, and appropriate omissions and simplifications have been made for clarity of the description. The present invention may also be implemented in various other ways. Unless otherwise specified, each component may be single or multiple.

[0010] The positions, sizes, shapes, and ranges of the components shown in the drawings may not represent actual positions, sizes, shapes, and ranges in order to facilitate understanding of the invention. Therefore, the present invention is not necessarily limited to the positions, sizes, shapes, and ranges disclosed in the drawings.

[0011] (One embodiment of the present invention and overall structure of the device) ( Figure 1 ) Figure 1 (a) is an illustration of a power module housed in a housing. Figure 1 (b) is an explanatory diagram of a lower cover mounted on a frame. The semiconductor device 1 inserts a power module 3 that uses semiconductors to output power to drive a motor into a housing 5, and assembles a power module board 13 to the housing 5 to accommodate and hold the power module 3 in a clamping manner.

[0012] The lower cover 4 has a water conduit 14. The water conduit 14 is press-fitted into the lower cover 4. A sealing material (described later) is applied to the groove of the housing 5, and the lower cover 4 is assembled to the housing 5 with the sealing material interposed therebetween.

[0013] ( Figure 2 ) Figure 2 (a) is Figure 1 (b) AA cross-sectional view, Figure 2(b) is Figure 2 (a) is an enlarged view of the frame connection portion. The semiconductor device 1 has a power module 3, and the lower cover 4 is mounted on the housing 5 in order to accommodate the power module 3 in the housing 5. Thus, a refrigerant flow path 2 for cooling the power module 3 is formed. In the following description, the lower cover 4 is described as the first frame 4 and the housing 5 is described as the second frame 5.

[0014] In the frame connecting portion 6, when the first frame 4 and the second frame 5 are bonded to each other by bonding surfaces respectively provided thereto to form the refrigerant flow path 2, a sealing material 7 is used on the bonding surface. The sealing material 7 is, for example, a silicone-based adhesive, which bonds and seals the bonding surfaces of the first frame 4 and the second frame 5. In the frame connecting portion 6, two grooves, a groove formed by a sealing material pressing portion 9 and a sealing material coating portion 10 and a groove formed by a sealing material inflow suppression portion 8, are formed on the connecting portion by connecting the first frame 4 and the second frame 5. Of the two grooves, the groove located on the peripheral side of the first frame 4 and the second frame 5 is the sealing material pressing portion 9 on the first frame 4 and the sealing material coating portion 10 on the second frame 5.

[0015] The sealing material coating portion 10 is in a concave shape, and the sealing material pressing portion 9 is in a convex shape with a protrusion. In addition, the sealing material coating portion 10 and the sealing material pressing portion 9 are bonded in a manner of surrounding the refrigerant flow path 2. In addition, considering the ease of flow of the sealing material 7, the sealing material coating portion 10 may also be a trapezoid.

[0016] On the other hand, on the bonding surface of either the first frame 4 or the second frame 5, the second frame 5 has a concave-shaped sealing material inflow suppression portion 8 as a groove formed at a position closer to the refrigerant flow path 2 than the sealing material coating portion 10. The sealing material inflow suppression portion 8 is formed in a manner surrounding the refrigerant flow path 2. In addition, a sealing material storage portion 12 is provided outside the refrigerant flow path 2 of the first frame 4 and the second frame 5.

[0017] In addition, not limited to Figure 2 In the manner shown, the sealing material coating portion 10 is formed on the bonding surface of either the first frame 4 or the second frame 5, and the sealing material 7 is coated thereon. In addition, in this case, the sealing material pressing portion 9 is formed on the other bonding surface, and the sealing material 7 arranged on the sealing material coating portion 10 is pressed at a position corresponding to the sealing material coating portion 10.

[0018] ( Figure 3 ) The sealing material coating portion 10 and the sealing material inflow suppression portion 8 are configurations for controlling the expansion mode of the sealing material 7 when bonding the first frame body 4 and the second frame body 5. The sealing material coating portion 10 is configured at a position closer to the peripheral side than the refrigerant flow path 2 on the bonding surface of the first frame body 4 and the second frame body 5. On the other hand, the sealing material inflow suppression portion 8 is configured at a position closer to the refrigerant flow path 2 than the peripheral side on the bonding surface of the first frame body 4 and the second frame body 5.

[0019] On the bonding surface, when the length from the position of the sealing material coating portion 10 to the position of the sealing material inflow suppression portion 8 is defined as the first length 11a, and the length from the periphery of the bonding surface to the position of the sealing material coating portion 10 is defined as the second length 11b, the first length 11a is longer than the second length 11b. That is, with the sealing material coating portion 10 as a reference, the bonding area close to the refrigerant flow path 2 becomes larger than the peripheral side of the bonding surface. This is because the refrigerant in the refrigerant flow path 2 applies internal pressure to the bonding surface, so the first frame 4 expands due to the internal pressure. At this time, since it is necessary to effectively transfer the load generated by the internal pressure to the sealing material 7, the configuration of the part with a large bonding area (the first length 11a) is close to the refrigerant flow path 2 to deal with it. In addition, when the frames are bonded to each other, since the sealing material 7 overflows to the sealing material inflow suppression portion 8, it is dealt with in a way that a wide range of bonding surfaces is ensured on the first length 11a to prevent the sealing material 7 from overflowing excessively.

[0020] ( Figure 4 ) Figure 4 (a) is a diagram showing a sealing material 7 applied to a sealing material application portion 10. Figure 4 (b) is a diagram showing a state in which the first frame body 4 and the second frame body 5 are being bonded together. Figure 4 (c) is a diagram showing a state where the first frame body 4 and the second frame body 5 are bonded together. Figure 4 (a)~ Figure 4 (c) represents a series of processes of connection between frames.

[0021] First, the sealing material 7 is applied to the sealing material application portion 10 of the second frame 5. The application amount of the sealing material 7 is managed by a coating machine or the like to be a predetermined application amount, and is adjusted in such a manner that the sealing material 7 that expands in the left-right direction when the frames are bonded to each other is retained in the sealing material inflow suppression portion 8, thereby suppressing the inflow of the sealing material 7 into the refrigerant flow path 2. In addition, the width of the sealing material application portion 10 is a width that can fully bear the application amount of the sealing material 7.

[0022] Next, in the process of installing the first frame body 4 on the second frame body 5, the sealing material pressing portion 9 of the first frame body 4 contacts the sealing material 7 coated on the sealing material coating portion 10 and starts to press the sealing material 7. When bonding the first frame body 4 and the second frame body 5, the sealing material pressing portion 9 eats into the sealing material 7 while flattening the sealing material 7 and spreading it out. In addition, the concave sealing material coating portion 10 and the convex sealing material pressing portion 9 have equal bonding areas and are arranged without bonding difference, so that the sealing material 7 will not undergo interface peeling and can have sufficient bonding strength.

[0023] When the first frame 4 is assembled on the second frame 5, the sealing material 7 is spread in the left and right directions of the bonding surface. As a result, a part of the sealing material 7 is stored in the groove of the sealing material inflow suppression part 8 on the refrigerant flow path 2 side, and on the other hand, when spread to the peripheral side, a part of the sealing material 7 is stored in the sealing material storage part 12.

[0024] Since such a structure is used to perform the bonding process between the frames, the sealing material pressing portion 9 of the first frame 4 cuts off the air involved in the sealing material 7 and discharges it to both ends of the bonding surface, so that the bonding area in the sealing material coating portion 10 can be ensured. In addition, by making the bonding strength uniform, the bonding force of the bonding surface is stabilized. In addition, since the sealing material 7 is applied and pressed using only one groove instead of the double groove structure shown in the prior art, it is possible to improve the reliability of bonding by preventing air from being involved.

[0025] On the bonding surface between the frames, the end of the refrigerant flow path 2 side of the first frame 4 is defined as the first end 4a, the end of the peripheral side of the first frame 4 is defined as the second end 4b, the end of the refrigerant flow path 2 side of the second frame 5 is defined as the third end 5a, and the end of the peripheral side of the second frame 5 is defined as the fourth end 5b. The first frame 4 and the second frame 5 are bonded in a manner that the first end 4a and the third end 5a are in contact, and the second end 4b and the fourth end 5b are in contact.

[0026] When the frames overlap each other, the sealing material 7 has the property of being easily bonded to the frame side having a large surface area, which causes a problem in the reliability of the bonding surface, so this problem can be prevented by bonding the ends of the first frame 4 and the second frame 5 so that the lengths thereof are consistent. In addition, by overlapping the first end 4a and the third end 5a, there is an effect that the sealing material 7 will not flow into the refrigerant flow path 2 even if it is separated from the sealing material inflow suppression portion 8.

[0027] In addition, the first frame 4 and the second frame 5 are provided with a sealing material storage part 12 for pre-storing the sealing material 7 at the periphery of the bonding surface of each frame. Thus, the sealing material 7 can be prevented from overflowing excessively to the periphery of the bonding surface, and the corrosion of the sealing material 7 can be suppressed without salt accumulation in the overflowed part.

[0028] ( Figure 5 ) The two ends of the application part of the sealing material application part 10 are set to be inclined instead of right angles, so that when the sealing material 7 is applied and the first frame 4 is installed on the second frame 5, the sealing material pressing part 9 can spread the sealing material 7 while exhausting air. As a result, the sealing material 7 is easy to flow when the frames are bonded to each other. Since the sealing material pressing part 9 becomes the center of the left and right expansion of the sealing material 7 during assembly, the expansion mode of the sealing material 7 can be controlled by the position and shape of the pressing part 9.

[0029] At least one of the sealing material pressing portion 9 and the sealing material applying portion 10 included in the first frame body 4 may be trapezoidal. Figure 5 (a) shows an example in which the sealing material pressing portion 9 is a trapezoid. Figure 5 In (a), the sealing material pressing portion 9 and the sealing material applying portion 10 are located at left-right symmetrical positions with respect to the center line 16 .

[0030] In addition, the shape of the sealing material pressing portion 9 can be bilaterally symmetrical or asymmetrical. Figure 5 As shown in (b), the position of the sealing material pressing portion 9 relative to the width of the sealing material coating portion 10 may be configured in such a manner that the length 15a of the groove from the sealing material pressing portion 9 to one end of the sealing material coating portion 10 is different from the length 15b of the groove from the sealing material pressing portion 9 to the other end of the sealing material coating portion 10. Figure 5 As shown in (c) of FIG. 1 , the sealing material pressing portion 9 may be a sealing material pressing portion 9 a having an asymmetrical shape with respect to the center line 16 .

[0031] In addition, although the sealing material pressing portion 9 is a trapezoidal shape in the above-mentioned illustration, it may be another shape as long as it can press the sealing material 7 and ensure the bonding reliability of the bonding surfaces between the frame bodies.

[0032] (First to Fourth Modifications) ( Figure 6 ) The sealing material inflow suppressing portion 8 may be provided on either the first frame body 4 or the second frame body 5. In addition, the sealing material pressing portion 9 and the sealing material applying portion 10 can be configured regardless of whether the sealing material inflow suppressing portion 8 is located in the first frame body 4 or the second frame body 5, as long as the sealing material pressing portion 9 is accommodated in the sealing material applying portion 10 during bonding.

[0033] In addition, Figure 6 In (a), the sealing material inflow suppressing portion 8 and the sealing material applying portion 10 are arranged on the second frame 5, and the sealing material pressing portion 9 is arranged on the first frame 4. Figure 6 In (b), the sealing material inflow suppressing portion 8 and the sealing material pressing portion 9 are arranged on the first frame 4, and the sealing material applying portion 10 is arranged on the second frame 5. Figure 6 In (c), the sealing material inflow suppressing portion 8 and the sealing material applying portion 10 are arranged on the first frame 4, and the sealing material pressing portion 9 is arranged on the second frame 5. Figure 6 In (d), the sealing material applying portion 10 is disposed on the first frame body 4 , and the sealing material inflow suppressing portion 8 and the sealing material pressing portion 9 are disposed on the second frame body 5 .

[0034] (Fifth Modification, Sixth Modification) ( Figure 7 ) like Figure 7 As shown in (a), the sealing material pressing portion 9b having a groove around the pressing portion can also achieve the same effect, thereby, compared with the sealing material pressing portion 9 without a groove, the sealing material pressing portion 9 can be formed by simple processing. Figure 7 As shown in (b), the sealing material application portion 10 may not have a bonding area corresponding to the sealing material pressing portion 9, and the sealing material pressing portion 9 may not be arranged at the center of the sealing material application portion 10.

[0035] According to one embodiment of the present invention described above, the following effects are achieved.

[0036] (1) A semiconductor device 1 includes: a power module 3 that uses a semiconductor to output power for driving a motor; a first frame 4 and a second frame 5 that each have an adhesive surface, and the adhesive surfaces are bonded to each other to form a refrigerant flow path 2 for cooling the power module 3; and a sealing material 7 that seals the adhesive surfaces of the first frame 4 and the second frame 5, wherein a sealing material coating portion 10 for coating the sealing material 7 is provided on the adhesive surface of either the first frame 4 or the second frame 5, and a sealing material pressing portion 9 for pressing the sealing material 7 at a position corresponding to the sealing material coating portion 10 is provided on the other adhesive surface, and a sealing material inflow suppressing portion 8 for suppressing the sealing material 7 from flowing into the refrigerant flow path 2 is provided at a position closer to the refrigerant flow path 2 than the sealing material coating portion 10 on the adhesive surface of either the first frame 4 or the second frame 5. Thus, a semiconductor device 1 that can simultaneously prevent a decrease in bonding strength and prevent the adhesive from flowing into the refrigerant flow path can be provided.

[0037] (2) The sealing material applying portion 10 is concave, the sealing material pressing portion 9 is convex, and the sealing material applying portion 10 and the sealing material pressing portion 9 are bonded to surround the refrigerant flow path 2. Thus, the refrigerant flow path 2 is formed by a frame with a stable bonding surface.

[0038] (3) At least one of the sealing material applying portion 10 and the sealing material pressing portion 9 is trapezoidal. This makes it easier for the sealing material 7 to flow.

[0039] (4) The sealing material inflow suppressing portion 8 is a concave portion formed to surround the refrigerant flow path 2. Thus, while ensuring the reliability of the bonding surface, the spreading mode of the sealing material 7 is controlled so that the sealing material 7 does not flow into the refrigerant flow path 2.

[0040] (5) On the bonding surface, the length from the position of the sealing material coating portion 10 to the position of the sealing material inflow suppression portion 8 is greater than the length from the outer periphery of the bonding surface to the position of the sealing material coating portion 10. Thus, the load generated by the internal pressure of the refrigerant flow path 2 can be effectively transmitted to the sealing material 7.

[0041] (6) The bonding surface of the first frame 4 has a first end 4a as an end on the refrigerant flow path 2 side and a second end 4b as an end on the peripheral side, and the bonding surface of the second frame 5 has a third end 5a as an end on the refrigerant flow path 2 side and a fourth end 5b as an end on the peripheral side, and the first frame 4 and the second frame 5 are bonded in a manner that the first end 4a contacts the third end 5a and the second end 4b contacts the fourth end 5b. Thus, the sealing material 7 can be prevented from mixing into the refrigerant flow path 2.

[0042] (7) The first frame 4 and the second frame 5 have sealing material storage parts 12 storing sealing material 7 on the outer peripheries of the bonding surfaces of the frames. This can suppress corrosion of the sealing material 7 without causing salt accumulation in the overflowed portion.

[0043] In addition, the present invention is not limited to the above-mentioned embodiments, and various modifications or other configurations can be combined within the scope of the gist thereof. In addition, the present invention is not limited to the configuration having all the configurations described in the above-mentioned embodiments, and also includes a configuration in which a part of the configuration is deleted. Explanation of symbols

[0044] 1. Semiconductor device, 2. Refrigerant flow path, 3. Power module, 4. Lower cover (first frame), 4a. First end, 4b. Second end, 5. Shell (second frame), 5a. Third end, 5b. Fourth end, 6. Frame connecting part, 7. Sealing material, 8. Sealing material inflow suppression part, 9. Sealing material pressing part, 9a. Asymmetric pressing part, 9b. Pressing part with grooves around, 10. Sealing material coating part, 11a. First length, 11b. Second length, 12. Sealing material storage part, 13. Power module board, 14. Water pipe, 15a. Length of the first groove, 15b. Length of the second groove, 16. Center line.

Claims

1. A semiconductor device, characterized in that: have: a power module, which uses semiconductors to output the power that drives the motor; The first frame and the second frame each have a bonding surface, and the bonding surfaces are bonded to each other to form a refrigerant flow path for cooling the power module; and a sealing material that seals the bonding surfaces of the first frame and the second frame, A sealing material coating portion for coating the sealing material is provided on the bonding surface of either the first frame body or the second frame body. The other bonding surface has a sealing material pressing portion for pressing the sealing material at a position corresponding to the sealing material application portion. The bonding surface of either the first frame body or the second frame body includes a sealing material inflow suppressing portion that suppresses inflow of the sealing material into the refrigerant flow path at a position closer to the refrigerant flow path than the sealing material applied portion.

2. The semiconductor device according to claim 1, wherein: The sealing material coating portion is in a concave shape, The sealing material pressing portion is in a convex shape, The sealing material applying portion and the sealing material pressing portion are bonded to each other so as to surround the refrigerant flow path.

3. The semiconductor device according to claim 1, wherein: At least one of the sealing material applying portion or the sealing material pressing portion is trapezoidal in shape.

4. The semiconductor device according to claim 1, wherein: The sealing material inflow suppressing portion has a concave shape and is formed so as to surround the refrigerant flow path.

5. The semiconductor device according to claim 1, wherein: On the bonding surface, a length from a position of the sealing material application portion to a position of the sealing material inflow suppressing portion is greater than a length from an outer peripheral portion of the bonding surface to the position of the sealing material application portion.

6. The semiconductor device according to claim 1, wherein: The bonding surface of the first frame body has a first end portion as an end portion on the refrigerant flow path side and a second end portion as an end portion on the outer peripheral side. The bonding surface of the second frame body has a third end portion as an end portion on the refrigerant flow path side and a fourth end portion as an end portion on the outer peripheral side. The first frame body and the second frame body are bonded to each other in such a manner that the first end portion contacts the third end portion and the second end portion contacts the fourth end portion.

7. The semiconductor device according to any one of claims 1 to 6, characterized in that , The first frame body and the second frame body have a sealing material storage portion in which the sealing material is stored in advance on the outer periphery of the bonding surface of each frame body.

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