Electrocaloric refrigeration chip and electrocaloric refrigeration chip assembly

Abstract

The invention relates to the technical field of electronic equipment refrigeration, and discloses an electric card refrigeration chip. The electrocaloric refrigeration chip comprises an electrocaloric element, a clamping framework, a heat receiving end and a cold receiving end. The electrocaloric element comprises a first electrode layer, a second electrode layer and a piezoelectric functional film layer, the piezoelectric functional film layer comprises a piezoelectric refrigeration area and a piezoelectric displacement area which are formed by partitioning of the piezoelectric film layer, and the piezoelectric displacement area is used for driving the piezoelectric refrigeration area to generate displacement. The heat receiving end is used for receiving heat of the electric card element. The cooling capacity receiving end is used for receiving the cooling capacity of the electric card element. A piezoelectric film layer of an electrocaloric element of the electrocaloric refrigeration chip is directly partitioned to form a piezoelectric displacement area, and the electrocaloric element is driven to move through the piezoelectric displacement area. The clamping framework clamps the electric card element so that the electric card element can release heat to be attached to the heat receiving end and absorb heat to be attached to the cold receiving end, the electric card refrigeration chip is of a self-integrated cold-hot separation structure, and stability is enhanced. The invention further discloses an electrocaloric refrigeration chip assembly.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment refrigeration, for example, to an electric card refrigeration chip and an electric card refrigeration chip assembly. Background Art

[0002] Based on the concept of environmental protection, the current research is to replace the traditional fluorine-containing refrigeration system with a new solid-state refrigeration technology based on the electrocaloric effect to achieve pollution-free refrigeration. In addition, the new solid-state refrigeration technology based on the electrocaloric effect has more than 2 times the compressor energy efficiency, anti-subversion and flipping, anti-gravity, compact size, strong weight, low cost and other advantages, and can be used in the fields of earth, aerospace, space station, deep-sea submarine, military equipment, etc.

[0003] In the process of implementing the embodiments of the present disclosure, it is found that there are at least the following problems in the related art:

[0004] Ferroelectric materials require the design of an electrocardioid recycling system to achieve hot and cold separation, and then realize refrigeration applications. Generally speaking, an electrocardioid refrigeration system includes: a hot end, a cold end, an electrocardioid material module, a fluid / solid pumping system, an electric field generator, and a shell. The pumping system can transfer heat in one direction to achieve hot and cold separation. One-way heat transfer can be achieved by periodically moving the electrocardioid material or by transferring heat through solid or fluid media. At present, electrocardioid devices all contain movable parts, and the electrocardioid recycling system has poor stability, which in turn affects the service life.

[0005] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present application, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0006] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical components or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0007] The disclosed embodiment provides an electric card cooling chip and an electric card cooling chip assembly. The piezoelectric film layer of the electric card element is directly partitioned to form a piezoelectric displacement zone, and the electric card element is driven to move through the piezoelectric displacement zone. The clamping frame clamps the electric card element so that the electric card element releases heat and fits the heat receiving end, and absorbs heat and fits the cold receiving end. The electric card cooling chip has a self-integrated hot and cold separation structure, and the stability is enhanced.

[0008] In some embodiments, the electric card refrigeration chip includes an electric card element, a clamping frame, a heat receiving end and a cold receiving end. The electric card element includes a first electrode layer, a second electrode layer, and a piezoelectric functional film layer, the piezoelectric functional film layer is arranged between the first electrode layer and the second electrode layer, and the piezoelectric functional film layer includes a piezoelectric refrigeration zone and a piezoelectric displacement zone formed by partitioning the piezoelectric film layer, wherein the piezoelectric displacement zone is used to drive the piezoelectric refrigeration zone to generate displacement. The clamping frame includes a first clamping frame clamped on the first side of the first end of the electric card element, and a second clamping frame clamped on the second side of the first end of the electric card element. The heat receiving end is arranged on the side of the first clamping frame for receiving the heat of the electric card element. The cold receiving end is arranged on the side of the second clamping frame for receiving the cold of the electric card element.

[0009] Optionally, the electric card element further comprises a base layer, which is arranged below the second electrode layer. The first clamping frame is arranged on the first electrode layer of the electric card element, and the second clamping frame is arranged on the base layer of the electric card element.

[0010] Optionally, a first bending gap is provided between the first side of the electric card element and the heat receiving end. The first bending gap is used to bend the first side of the electric card element toward the heat receiving end and fit the heat receiving end. And / or, a second bending gap is provided between the second side of the electric card element and the cold receiving end. The second bending gap is used to bend the second side of the electric card element toward the cold receiving end and fit the cold receiving end.

[0011] Optionally, the first electrode layer includes a first clamping portion disposed at the end and used to clamp the first clamping frame, and a first fitting portion extending along the first clamping portion. The first bending gap is disposed between the first fitting portion and the heat receiving end. And / or, the base layer includes a second clamping portion disposed at the end and used to clamp the second clamping frame, and a second fitting portion extending along the second clamping portion. The second bending gap is disposed between the second fitting portion and the cold receiving end.

[0012] Optionally, the first bending gap is less than or equal to a preset gap threshold; and / or the second bending gap is less than or equal to a preset gap threshold.

[0013] Optionally, the first clamping frame forms a first support thickness between the first side of the first end of the electric card element and the heat receiving end, and the second clamping frame forms a second support thickness between the second side of the first end of the electric card element and the cold receiving end. The first support thickness is less than or equal to a preset thickness threshold; and / or the second support thickness is less than or equal to a preset thickness threshold.

[0014] Optionally, the first support thickness is equal to the second support thickness.

[0015] Optionally, the electric card refrigeration chip further includes a support frame. The support frame is supported between the heat receiving end and the cold receiving end, and the support frame is arranged at the second end of the electric card element.

[0016] Optionally, the second end of the electric card element abuts against the supporting frame; or, a gap is provided between the second end of the electric card element and the supporting frame.

[0017] Optionally, the support frame enables the heat receiving end and the cold receiving end of the second end of the electric card element to form a third support thickness, wherein the sum of the first support thickness, the second support thickness and the thickness of the electric card element is greater than or equal to the third support thickness.

[0018] Optionally, the piezoelectric refrigeration zone includes one or more piezoelectric refrigeration units; and the piezoelectric displacement zone includes one or more piezoelectric displacement units.

[0019] Optionally, the piezoelectric refrigeration area includes a plurality of piezoelectric refrigeration units, and the plurality of piezoelectric refrigeration units are arranged in an array. And / or, the piezoelectric displacement area includes a plurality of piezoelectric displacement units, and the plurality of piezoelectric displacement units are arranged in an array.

[0020] Optionally, the piezoelectric refrigeration zone includes a plurality of piezoelectric refrigeration units, and two adjacent piezoelectric refrigeration units are arranged at intervals; the piezoelectric displacement zone includes a plurality of piezoelectric displacement units, and two adjacent piezoelectric displacement units are arranged at intervals.

[0021] Optionally, the piezoelectric refrigeration units and the piezoelectric displacement units are arranged alternately and spaced apart from each other.

[0022] In some embodiments, the electric card cooling chip assembly includes one or more of the aforementioned electric card cooling chips.

[0023] Optionally, it includes a plurality of electric card cooling chips arranged in an array.

[0024] Optionally, the first electrode layer is provided with an electrode gap, and the electrode gap divides the first electrode layer into an electric card cooling electrode area and a piezoelectric driving electrode area, wherein the electric card cooling electrode area corresponds to the piezoelectric cooling area, and the piezoelectric driving electrode area corresponds to the piezoelectric displacement area. The electric card cooling chip assembly also includes an external power supply, wherein the external power supply is used to: apply a positive electric field to the electric card cooling electrode area and the piezoelectric driving electrode area, so that the piezoelectric displacement area and the piezoelectric cooling area produce displacement in a first direction; or, remove the electric field of the electric card cooling motor area, and the piezoelectric cooling area of ​​the piezoelectric functional film layer absorbs heat, and at the same time, apply a reverse electric field to the piezoelectric driving electrode area, so that the piezoelectric displacement area drives the heat-absorbing piezoelectric cooling area to produce displacement in a second direction.

[0025] The electric card cooling chip and the electric card cooling chip assembly provided in the embodiments of the present disclosure can achieve the following technical effects:

[0026] The electric card refrigeration chip includes an electric card element. The piezoelectric film layer of the electric card element is directly partitioned to form a piezoelectric displacement zone, and the piezoelectric displacement zone drives the electric card element to move. At the same time, a heat receiving end and a cold receiving end are respectively arranged on both sides of the electric card element, and the first end of the electric card element is clamped by a clamping frame. When the piezoelectric refrigeration zone and the piezoelectric displacement zone apply a positive electric field at the same time, the piezoelectric functional film layer synchronously excites the piezoelectric effect and the electrocaloric effect, and a positive displacement and heat release occur. The clamping frame clamps the electric card element so that the electric card element fits the heat receiving end. When the piezoelectric refrigeration zone stops applying the electric field and the piezoelectric displacement zone applies a reverse electric field, the piezoelectric refrigeration zone absorbs heat due to the electrocaloric effect, and the piezoelectric displacement zone undergoes a reverse displacement due to the piezoelectric effect, thereby driving the piezoelectric functional film layer to reversely displace, and the clamping frame clamps the electric card element so that the electric card element fits the cold receiving end. The electric card refrigeration chip has a self-integrated hot and cold separation structure, and its stability is enhanced.

[0027] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] One or more embodiments are exemplarily described by corresponding drawings, which do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements, and the drawings do not constitute a scale limitation, and wherein:

[0029] Figure 1 is a schematic structural diagram of a piezoelectric functional film layer in an electric card element provided in an embodiment of the present disclosure;

[0030] Figure 2 is a schematic diagram of the structure of an electric card element provided by an embodiment of the present disclosure;

[0031] Figure 3 It is a schematic flow chart of a method for preparing an electric card element provided by an embodiment of the present disclosure;

[0032] Figure 4 is a schematic structural diagram of another electric card element provided by an embodiment of the present disclosure;

[0033] Figure 5 is a schematic flow chart of another method for preparing an electric card element provided by an embodiment of the present disclosure;

[0034] Figure 6 It is a schematic diagram of the structure of the electric card refrigeration chip provided in an embodiment of the present disclosure;

[0035] Figure 7 It is a schematic diagram of the electric card element in the electric card refrigeration chip provided by the embodiment of the present disclosure being attached to the heat receiving end;

[0036] Figure 8It is a schematic diagram of the electric card element in the electric card refrigeration chip provided by the embodiment of the present disclosure being attached to the cold receiving end;

[0037] Fig. 9 is a structural schematic diagram of an electric card refrigeration cycle system provided by an embodiment of the present disclosure;

[0038] Fig.10 is a schematic diagram of the forward flow of fluid in a Tesla valve in an electric card refrigeration cycle system provided by an embodiment of the present disclosure;

[0039] Fig.11 is a schematic diagram of reverse flow of fluid in a Tesla valve in an electric card refrigeration cycle system provided by an embodiment of the present disclosure;

[0040] Fig.12 is a structural schematic diagram of another electric card refrigeration cycle system provided by an embodiment of the present disclosure;

[0041] Fig.13 is a structural schematic diagram of another electric card refrigeration cycle system provided by an embodiment of the present disclosure;

[0042] Fig.14 It is a structural schematic diagram of the electric card refrigeration device provided in an embodiment of the present disclosure.

[0043] Reference numerals:

[0044] 1: first electrode layer; 11: electric card cooling electrode area; 12: piezoelectric drive electrode area; 13: electrode gap;

[0045] 2: second electrode layer;

[0046] 3: the third electrode layer;

[0047] 4: piezoelectric functional film layer; 41: piezoelectric displacement unit; 42: piezoelectric refrigeration unit; 431: first through-division gap; 432: first through-division piezoelectric displacement unit; 433: second through-division gap; 441: first inlay division gap; 442: first inlay piezoelectric displacement unit; 443: second inlay division gap;

[0048] 5: basal layer;

[0049] 100: electric card components;

[0050] 201: first clamping frame; 202: second clamping frame; 203: first bending gap; 204: second bending gap; 205: supporting frame;

[0051] 300: heat receiving end;

[0052] 400: cold receiving end;

[0053] 500: loop heat dissipation flow path; 501: evaporation end; 502: gas circulation pipeline; 503: condensation end; 504: liquid circulation pipeline; 505: Tesla valve; 506: first loop heat dissipation flow path; 5061: first heat conduction end; 5062: first radiator; 507: second loop heat dissipation flow path; 5071: second heat conduction end; 5072: second radiator; 600: electric card refrigeration chip;

[0054] 601: Evaporation end electric card refrigeration chip; 602: Condensation end electric card refrigeration chip;

[0055] 701: a first fan; 702: a second fan. DETAILED DESCRIPTION

[0056] In order to be able to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0057] The terms "first", "second", etc. in the specification and claims of the disclosed embodiments and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate to describe the disclosed embodiments here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0058] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0059] In addition, the terms "disposed", "connected", and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to the specific circumstances.

[0060] Unless otherwise stated, the term "plurality" means two or more.

[0061] The term "and / or" is a description of the association relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or, A and B.

[0062] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

[0063] At present, the existing electric card refrigeration system needs to design a movable heat transfer structure to move between the cold end and the hot end in coordination with the application / release of the electric field, so as to achieve the separation of cold and heat. The heat transfer structure cannot be integrated with the electric card refrigeration medium, has a large thermal resistance, and has low heat exchange efficiency.

[0064] The present disclosure discloses an electric card element 100 and a method for preparing the same. The piezoelectric film layer of the electric card element 100 is directly partitioned to form a piezoelectric displacement zone, and the piezoelectric displacement zone drives the electric card element 100 to move for heat transfer. The electric card element 100 has an integrated thermal switch to improve heat exchange efficiency.

[0065] Combination Figures 1 to 5 As shown, the embodiment of the present disclosure provides an electric card element 100, including a first electrode layer 1, a second electrode layer 2 and a piezoelectric functional film layer 4. The piezoelectric functional film layer 4 is arranged between the first electrode layer 1 and the second electrode layer 2. The piezoelectric functional film layer 4 includes a piezoelectric cooling area and a piezoelectric displacement area formed by partitioning the piezoelectric film layer, wherein the piezoelectric displacement area is used to drive the piezoelectric cooling area to generate displacement.

[0066] The electrocaloric element 100 includes a first electrode layer 1, a second electrode layer 2, and a piezoelectric functional film layer 4 disposed between the first electrode layer 1 and the second electrode layer 2. The piezoelectric functional film layer 4 includes a piezoelectric refrigeration zone and a piezoelectric displacement zone. By applying a voltage to the first electrode layer 1 and the second electrode layer 2, an electric field is formed between the first electrode layer 1 and the second electrode layer 2, and different functional zones of the piezoelectric functional film layer 4 correspondingly realize different functional effects. When a positive electric field is applied to the piezoelectric refrigeration zone and the piezoelectric displacement zone at the same time, the piezoelectric functional film layer 4 simultaneously excites the piezoelectric effect and the electrocaloric effect, and a positive displacement and heat release occur; when the piezoelectric refrigeration zone stops applying an electric field and the piezoelectric displacement zone applies a reverse electric field, the piezoelectric refrigeration zone absorbs heat due to the electrocaloric effect, and the piezoelectric displacement zone reversely displaces due to the piezoelectric effect, thereby driving the piezoelectric functional film layer 4 to reversely displace. Through the different functional partitions of the piezoelectric functional film layer 4, the electrocaloric effect releases heat and absorbs heat in opposite directions, effectively realizing the separation of heat and improving the heat exchange efficiency. The piezoelectric functional film layer 4 of the electric card element 100 includes a piezoelectric displacement zone, so that the electric card element 100 integrates a thermal switch form, avoiding a large resistance caused by a movable heat transfer structure of an external device.

[0067] Optionally, a square wave periodic electric field is applied to the piezoelectric displacement region.

[0068] Optionally, the first electrode layer 1 includes a platinum electrode, and / or the second electrode layer 2 includes a platinum electrode, and / or the third electrode layer 3 includes a platinum electrode.

[0069] Optionally, the piezoelectric refrigeration area includes one or more piezoelectric refrigeration units 42 ; and the piezoelectric displacement area includes one or more piezoelectric displacement units 41 .

[0070] When the piezoelectric refrigeration zone includes one piezoelectric refrigeration unit 42 and the piezoelectric displacement zone includes one piezoelectric displacement unit 41, the piezoelectric refrigeration unit 42 and the piezoelectric displacement unit 41 are arranged adjacent to each other, and when the piezoelectric refrigeration zone absorbs heat, the piezoelectric displacement zone drives the piezoelectric refrigeration zone to shift in the opposite direction. When the piezoelectric refrigeration zone includes multiple piezoelectric refrigeration units 42 and the piezoelectric displacement zone includes multiple piezoelectric displacement units 41, the piezoelectric displacement zone can better drive the piezoelectric functional film layer 4 to shift in the opposite direction when the piezoelectric refrigeration zone absorbs heat by setting the relative positions of the multiple piezoelectric refrigeration units 42 and the piezoelectric displacement units 41, thereby achieving the separation of the positions of heat release and heat absorption of the electric card element 100.

[0071] Optionally, the piezoelectric refrigeration area includes a plurality of piezoelectric refrigeration units 42, and the plurality of piezoelectric refrigeration units 42 are arranged in an array. And / or, the piezoelectric displacement area includes a plurality of piezoelectric displacement units 41, and the plurality of piezoelectric displacement units 41 are arranged in an array.

[0072] The multiple piezoelectric cooling units 42 are arranged in an array so that each part of the electric card element 100 can release or absorb heat in a balanced manner, which is convenient for heat to be dissipated during heat release or heat to be absorbed during heat absorption. The multiple piezoelectric displacement units 41 are arranged in an array so that when the electric card element 100 absorbs heat in the piezoelectric cooling area, the force of the piezoelectric displacement area driving the electric card element 100 to displace in the opposite direction is evenly applied to the electric card element 100, so that each part of the electric card element 100 is synchronously displaced in the opposite direction, which is convenient for the electric card element 100 to fit the heat transfer medium.

[0073] Optionally, the piezoelectric refrigeration area includes a plurality of piezoelectric refrigeration units 42, and two adjacent piezoelectric refrigeration units 42 are arranged at intervals. The piezoelectric displacement area includes a plurality of piezoelectric displacement units 41, and two adjacent piezoelectric displacement units 41 are arranged at intervals.

[0074] Two adjacent piezoelectric refrigeration units 42 among the multiple piezoelectric refrigeration units 42 are arranged at intervals, and other functional modules, such as piezoelectric displacement units 41, can be arranged between the two adjacent piezoelectric refrigeration units 42 on the basis of balanced heat release or heat absorption of various parts of the electric card element 100, which is convenient for heat dissipation during heat release or heat entry during heat absorption. Similarly, two adjacent piezoelectric displacement units 41 among the multiple piezoelectric displacement units 41 are arranged at intervals, and other functional modules, such as piezoelectric refrigeration units 42, can be arranged between the two adjacent piezoelectric displacement units 41 on the basis of balanced application of the force of the piezoelectric displacement zone to drive the electric card element 100 to reverse displacement when the electric card element 100 absorbs heat in the piezoelectric refrigeration zone.

[0075] Optionally, the piezoelectric refrigeration units 42 and the piezoelectric displacement units 41 are arranged alternately and spaced apart from each other.

[0076] Multiple piezoelectric refrigeration units 42 and multiple piezoelectric displacement units 41 are alternately arranged with each other. When the piezoelectric refrigeration zone absorbs heat due to the electrocaloric effect, the piezoelectric displacement unit 41 can reversely displace to drive the adjacent piezoelectric refrigeration unit 42 to reversely displace, thereby causing the electrocaloric element 100 to reversely displace and have a high degree of flatness after displacement, which facilitates the electrocaloric element 100 to fit with the heat transfer medium for heat transfer.

[0077] Optionally, the piezoelectric refrigeration area includes a first piezoelectric refrigeration unit 42, and the piezoelectric displacement area includes a first piezoelectric displacement unit 41 adjacent to the first piezoelectric refrigeration unit 42. The length of the first piezoelectric refrigeration unit 42 is greater than or equal to the length of the first piezoelectric displacement unit 41; or, the width of the first piezoelectric refrigeration unit 42 is greater than or equal to the width of the first piezoelectric displacement unit 41; or, the area of ​​the first piezoelectric refrigeration unit 42 is greater than or equal to the area of ​​the first piezoelectric displacement unit 41.

[0078] The piezoelectric functional film layer 4 is a thin film layer structure, and the length, width or area can be understood as size. Therefore, it can be understood that the adjacent first piezoelectric refrigeration unit 42 is larger than the first piezoelectric displacement unit 41, thereby increasing the heat release or heat absorption of the electric card element 100.

[0079] Optionally, a ratio between a width of the first piezoelectric refrigeration unit 42 and a width of the first piezoelectric displacement unit 41 is greater than or equal to 2.

[0080] Optionally, a ratio of an area of ​​the first piezoelectric refrigeration unit 42 to an area of ​​the first piezoelectric displacement unit 41 is greater than or equal to 10.

[0081] The ratio between the width of the first piezoelectric refrigeration unit 42 and the width of the first piezoelectric displacement unit 41 is set to be greater than or equal to 2, or the ratio between the area of ​​the first piezoelectric refrigeration unit 42 and the area of ​​the first piezoelectric displacement unit 41 is set to be greater than or equal to 10, so that the size of the first piezoelectric refrigeration unit 42 is increased, and then the size of the piezoelectric refrigeration area is increased, which can ensure the heat release or heat absorption of the electric card element 100. Specifically, the ratio between the width of the first piezoelectric refrigeration unit 42 and the width of the first piezoelectric displacement unit 41 can be 2, 3, 4 or 5, etc.; the ratio between the area of ​​the first piezoelectric refrigeration unit 42 and the area of ​​the first piezoelectric displacement unit 41 can be 10, 11, 12, 13, 14 or 15, etc.

[0082] Optionally, the piezoelectric functional film layer 4 includes a first piezoelectric functional surface and a second piezoelectric functional surface opposite to the first piezoelectric functional surface, wherein the first piezoelectric functional surface includes a piezoelectric refrigeration area and a piezoelectric displacement area, and the second piezoelectric functional surface only includes a piezoelectric refrigeration area.

[0083] The piezoelectric functional film layer 4 is a thin film layer structure with a thickness, and the thin film layer includes a first sub-film layer and a second sub-film layer that are bonded to each other. The first piezoelectric functional surface corresponds to the first sub-film layer, including a piezoelectric refrigeration area and a piezoelectric displacement area; the second piezoelectric functional surface corresponds to the second sub-film layer, including only a piezoelectric refrigeration area, without a piezoelectric displacement area. The first sub-film layer and the second sub-film layer are understood as a whole, that is, the piezoelectric functional film layer 4 forms a piezoelectric displacement area embedded structure, such as the following embedded piezoelectric displacement unit 41, as shown in Figure 4 The piezoelectric displacement region embedded structure increases the size of the piezoelectric cooling region in the piezoelectric functional film layer 4, thereby increasing the heat release or heat absorption of the electric card element 100.

[0084] Optionally, a separation gap for separating the two functional unit areas is provided between adjacent piezoelectric cooling units 42 and piezoelectric displacement units 41. Providing the separation gap can partition the functional unit area so that the piezoelectric cooling unit 42 can excite the electrocaloric effect and the piezoelectric displacement unit 41 can excite the piezoelectric effect without affecting each other.

[0085] Optionally, the width of the partition gap is smaller than the width of the piezoelectric refrigeration unit 42 ; or, the width of the partition gap is smaller than the width of the piezoelectric displacement unit 41 .

[0086] Different functional unit areas can be distinguished by setting a distinguishing gap between adjacent piezoelectric refrigeration units 42 and piezoelectric displacement units 41. To ensure the size of the functional unit area, the size of the distinguishing gap is limited to a width smaller than the width of the piezoelectric refrigeration unit 42, or a width smaller than the width of the piezoelectric displacement unit 41.

[0087] Optionally, the ratio of the width of the piezoelectric refrigeration unit 42 to the width of the partition gap is greater than or equal to 10; or, the ratio of the width of the piezoelectric displacement unit 41 to the width of the partition gap is greater than or equal to 5.

[0088] The size of the separation gap is further limited so as to ensure the size of the piezoelectric cooling unit 42 and the piezoelectric displacement unit 41 in the piezoelectric functional film layer 4 while realizing the partitioning of different functional units by the separation gap, thereby ensuring the heat release or heat absorption of the electric card element 100. Specifically, the ratio between the width of the piezoelectric cooling unit 42 and the width of the separation gap can be 10, 12, 14, 16, 18 or 20, etc.; the ratio between the width of the piezoelectric displacement unit 41 and the width of the separation gap can be 5, 6, 7, 8, 9 or 10, etc.

[0089] Optionally, the distinguishing gap is in a strip shape, a grid shape or an irregular shape. It can be understood that the shape of the distinguishing gap is not specifically limited, and the two functional units on both sides of the distinguishing gap can be separated to realize different functional unit partitions.

[0090] Optionally, the distinguishing gap is an air gap.

[0091] Optionally, the segmented gaps include a first segmented gap, a second segmented gap and a third segmented gap which are sequentially arranged, wherein a first piezoelectric refrigeration unit 42 is arranged between the first segmented gap and the second segmented gap, and a first piezoelectric displacement unit 41 is arranged between the second segmented gap and the third segmented gap.

[0092] It can be understood that the first dividing gap, the first piezoelectric refrigeration unit 42, the second dividing gap, the first piezoelectric displacement unit 41 and the third dividing gap are arranged in sequence, that is, dividing gaps are arranged between adjacent piezoelectric refrigeration units 42 and piezoelectric displacement units 41 to avoid mutual influence between different functional units.

[0093] Optionally, the partitioning gap includes an etched partitioning gap formed by etching. The partitioning gap is formed by etching, which has a simple process and enables the electrocaloric element 100 to simultaneously integrate different functional units of the electrocaloric effect and the piezoelectric effect.

[0094] Optionally, the piezoelectric displacement zone includes a through-type piezoelectric displacement unit 41, wherein the through-type piezoelectric displacement unit 41 includes a first through-type partition gap 431 and a second through-type partition gap 433, wherein the first through-type partition gap 431 and the second through-type partition gap 433 both penetrate the piezoelectric film layer; and, a first through-type piezoelectric displacement unit 432 is arranged between the first through-type partition gap 431 and the second through-type partition gap 433.

[0095] Figure 2 FIG. 1 shows an electric card element 100 including a through-type piezoelectric displacement unit 41. The through-type piezoelectric displacement unit 41 includes a first through-type partition gap 431, a first through-type piezoelectric displacement unit 432, and a second through-type partition gap 433, which are arranged in sequence. Figure 2 As shown in , the first through-division gap 431 and the second through-division gap 433 are at the same height as the first through-division gap 432, that is, the first through-division gap 431 and the second through-division gap 433 both penetrate the piezoelectric film layer. This arrangement can avoid the first through-division gap 432 from interfering with the piezoelectric refrigeration units 42 adjacent on both sides. In addition, by setting the piezoelectric displacement zone as the through-type piezoelectric displacement unit 41, the piezoelectric displacement zone and the piezoelectric refrigeration zone can share the second electrode layer 2. In the preparation method, the preparation of the electrode layer only requires etching the first electrode layer 1, and no secondary etching of the electrode layer is required.

[0096] Specifically, a forward voltage is applied to the first electrode layer 1 and the second electrode layer 2, and a forward electric field is formed between the first electrode layer 1 and the second electrode layer 2. At this time, the piezoelectric displacement zone and the piezoelectric refrigeration zone of the piezoelectric functional film layer 4 simultaneously stimulate the electrocaloric effect and the piezoelectric effect, and the electrocaloric element 100 displaces forward and releases heat. Afterwards, the electrocaloric refrigeration electrode zone 11 in the first electrode layer 1 is powered off, that is, the electric field corresponding to the piezoelectric refrigeration zone is removed, and the piezoelectric refrigeration zone stimulates the electrocaloric effect to absorb heat; a reverse voltage is applied to the piezoelectric driving electrode zone 12 in the first electrode layer 1 and the second electrode layer 2, and a reverse electric field is formed between the first electrode layer 1 and the second electrode layer 2, and the piezoelectric displacement zone stimulates the piezoelectric effect to reversely displace. The electrocaloric element 100 releases heat and displaces forward, and absorbs heat and displaces reversely, achieving heat separation.

[0097] Optionally, the electric card element 100 further includes a base layer 5 . The base layer 5 is disposed below the second electrode layer 2 .

[0098] The piezoelectric functional film layer 4, the first electrode layer 1 and the second electrode layer 2 are combined to form a thin film structure. A base layer 5 is provided under the second electrode layer 2 of the electric card element 100 to support the thin film structure and provide an operating platform during preparation. The provision of the base layer 5 can also maintain the flatness of the electric card element 100, so that the electric card element 100 can be close to the heat transfer medium when transferring heat.

[0099] Optionally, the first electrode layer 1 is provided with an electrode gap 13, and the electrode gap 13 divides the first electrode layer 1 into an electric card cooling electrode area 11 and a piezoelectric driving electrode area 12. Among them, the electric card cooling electrode area 11 corresponds to the piezoelectric cooling area, and the piezoelectric driving electrode area 12 corresponds to the piezoelectric displacement area. A positive electric field is applied to the electric card cooling electrode area 11 and the piezoelectric driving electrode area 12, so that the piezoelectric displacement area and the piezoelectric cooling area produce displacement in the first direction; or, the electric field of the electric card cooling motor area is removed, and the piezoelectric cooling area of ​​the piezoelectric functional film layer 4 absorbs heat. At the same time, a reverse electric field is applied to the piezoelectric driving electrode area 12, so that the piezoelectric displacement area drives the heat-absorbing piezoelectric cooling area to produce displacement in the second direction.

[0100] Corresponding to the two different functional units of the piezoelectric refrigeration area and the piezoelectric displacement area, different electric fields need to be applied to the electrodes to stimulate different functional effects. Therefore, the first electrode layer 1 is provided with an electrode gap 13, so that the first electrode layer 1 is separated to form an electric card refrigeration electrode area 11 corresponding to the piezoelectric refrigeration area and a piezoelectric driving electrode area 12 corresponding to the piezoelectric displacement area, and different electric fields are applied to the electric card refrigeration electrode area 11 and the second electrode layer 2 and the piezoelectric driving electrode area 12 and the second electrode layer 2 to achieve the stimulation of different functional effects.

[0101] Optionally, the electrode gap 13 is arranged corresponding to the partition gap.

[0102] Optionally, the electrode gap 13 is connected to the partition gap to form a through gap. The electrode gap 13 corresponds to the partition gap, and when different electric fields are applied to different areas of the first electrode layer 1, different functional effects can be stimulated in the functional areas corresponding to the electrode areas. Furthermore, the electrode gap 13 is connected to the partition gap so that adjacent different functional units do not affect each other.

[0103] In some embodiments, in combination Figure 3 As shown, the preparation method of the electric card element 100 includes:

[0104] S301, depositing a second electrode layer 2 on the substrate layer 5;

[0105] S302, depositing a piezoelectric film layer on the second electrode layer 2;

[0106] S303, depositing a first electrode layer 1 on the piezoelectric film layer;

[0107] S304, etching the first electrode layer 1 and the piezoelectric film layer to obtain the electric card element 100. The electric card element 100 is the electric card element 100 mentioned above.

[0108] Optionally, the piezoelectric film layer includes a piezoelectric ceramic film layer.

[0109] The electrocaloric effect is a hot and cold effect of ferroelectric materials under an electric field, which releases heat when an electric field is applied and absorbs heat when the electric field is removed. The ferroelectric film applies a high electric field through electrodes on both sides to stimulate the periodic electrocaloric effect. The research on solid-state electrocaloric refrigeration materials can be divided into three categories: inorganic, organic, and inorganic-organic composite materials. Among them, inorganic materials are mainly concentrated in the lead-containing benchmark system based on lead zirconate titanate piezoelectric ceramics (PZT), and their geometric forms mainly include bulk ceramics, thin films, thick films and multi-layer thick films. The piezoelectric film layer disclosed in the embodiment of the present disclosure includes a piezoelectric ceramic film layer, that is, an inorganic ferroelectric material.

[0110] On the one hand, compared with organic ferroelectric materials that require high voltage (e.g., kilovolts) to stimulate the electrocaloric effect, inorganic ferroelectric materials require a smaller voltage (e.g., hundreds of volts) to stimulate the electrocaloric effect. In addition, high voltages can easily break through the film, shortening the service life of the electrocaloric element 100, while low voltages can extend the service life of the electrocaloric element 100.

[0111] On the other hand, inorganic thin film ferroelectric materials have a large adiabatic temperature change and a wide ferroelectric phase transition temperature range, so they can be used for refrigeration applications with a wide temperature range and a large temperature difference. At the same time, the low-temperature crystallized ferroelectric thin film synthesis process can be compatible with semiconductor microelectromechanical (CMOS / MEMs) processes to achieve the integration of the piezoelectric functional film layer 4 in the electric card element 100 on the base layer 5 (such as a silicon wafer), and the substrate can be removed by means of photolithography to achieve a larger self-temperature change.

[0112] Optionally, the piezoelectric ceramic film layer includes a lead zirconate titanate piezoelectric ceramic film layer.

[0113] Optionally, the piezoelectric ceramic film layer includes a lead lanthanum zirconate titanate ceramic film layer.

[0114] Ferroelectric dielectrics such as lead zirconate titanate piezoelectric ceramic film layers (PZT) or lead lanthanum zirconate titanate ceramic film layers (PLZT) have both piezoelectricity and electrocaloric effect. Therefore, the piezoelectric displacement zone and the piezoelectric refrigeration zone can be made of the same material and deposited on the same layer. The functions can be differentiated by simply applying different electric fields through the control electrode layer.

[0115] Optionally, the thickness of the deposited piezoelectric film layer is greater than or equal to 8 μm and less than or equal to 20 μm. Specifically, the thickness of the piezoelectric film layer can be 8 μm, 10 μm, 12 μm, 14 μm, 16 μm, 18 μm or 20 μm.

[0116] Optionally, the first electrode layer 1 and the piezoelectric film layer are etched, including: etching the first electrode layer to obtain an electrode gap 13; performing penetrating etching on the piezoelectric film layer to obtain a penetrating partition gap, and a piezoelectric refrigeration unit 42 and a penetrating piezoelectric displacement unit 41 located between the penetrating partition gaps.

[0117] Optionally, the base layer 5 includes a silicon wafer.

[0118] Optionally, before depositing the second electrode layer 2 on the base layer 5, the process also includes: oxidizing the surface of the silicon wafer to obtain a silicon-on-insulator base; implanting hydrogen into the silicon-on-insulator base to reduce the thickness of the silicon-on-insulator base; and bonding the oxide layer of the silicon-on-insulator base to the substrate silicon.

[0119] The thickness of the substrate silicon is large, and its function is to provide mechanical support for the silicon-on-insulator substrate, so as to facilitate subsequent operations on the substrate layer 5 .

[0120] Optionally, after etching the first electrode layer 1 and the piezoelectric film layer, the process further includes: removing the substrate silicon and the oxide layer, and thinning the silicon wafer. The substrate silicon and the oxide layer are removed by mechanical thinning, and the thickness of the silicon wafer after thinning is greater than or equal to 8 μm and less than or equal to 13 μm.

[0121] Optionally, depositing the piezoelectric film layer is achieved by a sol-gel method.

[0122] In some embodiments, the electric card element 100 includes a first electrode layer 1, a second electrode layer 2 and a piezoelectric functional film layer 4. The piezoelectric functional film layer 4 is disposed between the first electrode layer 1 and the second electrode layer 2. The piezoelectric functional film layer 4 includes a piezoelectric refrigeration zone and a piezoelectric displacement zone formed by partitioning the piezoelectric film layer. The piezoelectric displacement zone is used to drive the piezoelectric refrigeration zone to generate displacement. A distinction gap is provided between adjacent piezoelectric refrigeration units 42 and piezoelectric displacement units 41 for distinguishing the two functional unit areas. Among them, the piezoelectric displacement zone includes an inlaid piezoelectric displacement unit 41, and the inlaid piezoelectric displacement unit 41 includes: a first inlaid distinction gap 441 and a second inlaid distinction gap 443, wherein the gap depths of the first inlaid distinction gap 441 and the second inlaid distinction gap 443 are both less than the thickness of the piezoelectric film layer; and, a first inlaid piezoelectric displacement unit 442 is disposed between the first inlaid distinction gap 441 and the second inlaid distinction gap 443.

[0123] Combination Figure 4 As shown, the embodiment of the present disclosure further provides an electric card component 100, wherein the piezoelectric displacement region includes an embedded piezoelectric displacement unit 41. The electric card component 100 including the embedded piezoelectric displacement unit 41 has a larger electric card refrigeration medium volume and a higher refrigeration density, that is, has a larger heat release or heat absorption.

[0124] Optionally, a third electrode layer 3 is further disposed at the lower portion of the first embedded piezoelectric displacement unit 442 .

[0125] The third electrode layer 3 is disposed at the lower part of the first embedded piezoelectric displacement unit 442, and a voltage is applied to the first electrode layer 1 and the third electrode layer 3 to form an electric field to stimulate the functional effect of the first embedded piezoelectric displacement unit 442. A voltage is applied to the first electrode layer 1 and the second electrode layer 2 to form an electric field to stimulate the functional effect of the piezoelectric refrigeration unit 42.

[0126] Specifically, a forward voltage is applied to the first electrode layer 1 and the second electrode layer 2, and the first electrode layer 1 and the third electrode layer 3, and a forward electric field is formed between the first electrode layer 1 and the second electrode layer 2, and between the first electrode layer 1 and the third electrode layer 3. At this time, the piezoelectric displacement zone and the piezoelectric refrigeration zone of the piezoelectric functional film layer 4 simultaneously stimulate the electrocaloric effect and the piezoelectric effect, and the electrocaloric element 100 displaces forward and releases heat. Afterwards, the electrocaloric refrigeration electrode zone 11 in the first electrode layer 1 and the second electrode layer 2 are powered off, that is, the corresponding electric field of the piezoelectric refrigeration zone is removed, and the piezoelectric refrigeration zone stimulates the electrocaloric effect to absorb heat; a reverse voltage is applied to the piezoelectric driving electrode zone 12 in the first electrode layer 1 and the third electrode layer 3, and a reverse electric field is formed between the first electrode layer 1 and the third electrode layer 3, and the piezoelectric displacement zone stimulates the piezoelectric effect to reversely displace. The electrocaloric element 100 releases heat and displaces forward, and absorbs heat and displaces reversely, realizing heat separation.

[0127] In some embodiments, in combination Figure 5 As shown, the preparation method of the electric card element 100 includes:

[0128] S501, depositing a second electrode layer 2 on the substrate layer 5;

[0129] S502, depositing a piezoelectric film layer on the second electrode layer 2;

[0130] S503, depositing a first electrode layer 1 on the piezoelectric film layer;

[0131] S504, etching the first electrode layer 1 and the piezoelectric film layer, and the etching depth of the piezoelectric film layer is less than the thickness of the piezoelectric film layer, to obtain a piezoelectric refrigeration area and a groove-shaped recessed area after the first etching;

[0132] S505, depositing a third electrode layer 3 in the groove-shaped recessed area;

[0133] S506, depositing a dielectric film layer and a first electrode on the upper part of the third electrode layer 3 to obtain a mosaic-type piezoelectric displacement unit 41. The electric card element 100 is the electric card element 100 mentioned above.

[0134] Optionally, the deposited embedded piezoelectric displacement unit 41 is flush with the piezoelectric cooling area. This arrangement allows the various regions of the first electrode layer 1 to be in the same plane, and the electric card element 100 is flatter, and can be in contact with the heat transfer medium for heat transfer when moving upward.

[0135] Optionally, the deposited width of the mosaic piezoelectric displacement unit 41 is smaller than the width of the groove-shaped concave area. It can be understood that the portion where the deposited width of the mosaic piezoelectric displacement unit 41 is smaller than the width of the groove-shaped concave area forms a distinguishing gap that distinguishes the mosaic piezoelectric displacement unit 41 from the piezoelectric refrigeration unit 42.

[0136] At present, electric card devices all contain movable parts, and the electric card recycling system has poor stability, which in turn affects the service life.

[0137] The disclosed embodiment also discloses an electric card cooling chip 600 and an electric card cooling chip 600 assembly. The piezoelectric film layer of the electric card element 100 is directly partitioned to form a piezoelectric displacement zone, and the electric card element 100 is driven to move through the piezoelectric displacement zone. The clamping frame clamps the electric card element 100 so that the electric card element 100 releases heat and fits the heat receiving end 300, and absorbs heat and fits the cold receiving end 400. The electric card cooling chip 600 has a self-integrated hot and cold separation structure, and its stability is enhanced.

[0138] Combination Figures 6 to 8 As shown, the embodiment of the present disclosure provides an electric card cooling chip 600, including an electric card element 100, a clamping frame, a heat receiving end 300 and a cold receiving end 400. The electric card element 100 includes a first electrode layer 1, a second electrode layer 2, and a piezoelectric functional film layer 4. The piezoelectric functional film layer 4 is arranged between the first electrode layer 1 and the second electrode layer 2. The piezoelectric functional film layer 4 includes a piezoelectric cooling zone and a piezoelectric displacement zone formed by partitioning the piezoelectric film layer, wherein the piezoelectric displacement zone is used to drive the piezoelectric cooling zone to generate displacement. The clamping frame includes a first clamping frame 201 clamped on the first side of the first end of the electric card element 100, and a second clamping frame 202 clamped on the second side of the first end of the electric card element 100. The heat receiving end 300 is arranged on the side of the first clamping frame 201, and is used to receive the heat of the electric card element 100. The cold receiving end 400 is arranged on the side of the second clamping frame 202, and is used to receive the cold of the electric card element 100.

[0139] The electric card refrigeration chip 600 includes an electric card element 100. The piezoelectric film layer of the electric card element 100 is directly partitioned to form a piezoelectric displacement zone, and the piezoelectric displacement zone drives the electric card element 100 to move. At the same time, a heat receiving end 300 and a cold receiving end 400 are respectively arranged on both sides of the electric card element 100, and the first end of the electric card element 100 is clamped by a clamping frame. When a positive electric field is applied to the piezoelectric refrigeration zone and the piezoelectric displacement zone at the same time, the piezoelectric functional film layer 4 synchronously excites the piezoelectric effect and the electrocaloric effect, and a positive displacement and heat release occur. The clamping frame clamps the electric card element 100 so that the electric card element 100 fits the heat receiving end 300, as shown in FIG. Figure 7When the piezoelectric cooling area stops applying the electric field and the piezoelectric displacement area applies the reverse electric field, the piezoelectric cooling area absorbs heat due to the electrocaloric effect, and the piezoelectric displacement area reversely displaces due to the piezoelectric effect, thereby driving the piezoelectric functional film layer 4 to reversely displace, and the clamping frame clamps the electrocaloric element 100 so that the electrocaloric element 100 fits the cold receiving end 400. Figure 8 The electric card cooling chip 600 has a self-integrated hot and cold separation structure, which enhances stability.

[0140] It can be understood that the electric card component 100 in the electric card cooling chip 600 is the electric card component 100 in the form of the aforementioned internal integrated thermal switch.

[0141] Optionally, the electric card element 100 further includes a base layer 5 disposed below the second electrode layer 2 . The first clamping frame 201 is disposed on the first electrode layer 1 of the electric card element 100 , and the second clamping frame 202 is disposed on the base layer 5 of the electric card element 100 .

[0142] The piezoelectric functional film layer 4, the first electrode layer 1 and the second electrode layer 2 are combined to form a thin film structure, and a base layer 5 is provided under the second electrode layer 2 of the electric card element 100 to support the thin film structure. The provision of the base layer 5 can also maintain the flatness of the electric card element 100, so that the electric card element 100 can be close to the heat transfer medium when transferring heat. Correspondingly, the first clamping frame 201 is provided above the first electrode layer 1 of the electric card element 100, and the second clamping frame 202 is provided below the base layer 5 of the electric card element 100.

[0143] Optionally, a first bending gap 203 is provided between the first side of the electric card element 100 and the heat receiving end 300. The first bending gap 203 is used to bend the first side of the electric card element 100 toward the heat receiving end 300 and fit the heat receiving end 300. And / or, a second bending gap 204 is provided between the second side of the electric card element 100 and the cold receiving end 400. The second bending gap 204 is used to bend the second side of the electric card element 100 toward the cold receiving end 400 and fit the cold receiving end 400.

[0144] The setting of the first bending gap 203 and the second bending gap 204 increases the volume of the electric card refrigeration chip 600. The thickness of the first bending gap 203, the thickness of the electric card element 100 and the thickness of the second bending gap 204 are the distance between the heat receiving end 300 and the cold receiving end 400, which increases the cold and heat separation distance of the electric card element 100, making it easier for the electric card refrigeration chip 600 to be actually used in household appliances.

[0145] Optionally, the first electrode layer 1 includes a first clamping portion disposed at the end and used to clamp the first clamping frame 201, and a first fitting portion extending along the first clamping portion. The first bending gap 203 is disposed between the first fitting portion and the heat receiving end 300. And / or, the base layer 5 includes a second clamping portion disposed at the end and used to clamp the second clamping frame 202, and a second fitting portion extending along the second clamping portion. The second bending gap 204 is disposed between the second fitting portion and the cold receiving end 400.

[0146] The first electrode layer 1 includes a first clamping portion and a first fitting portion extending along the first clamping portion, wherein the first clamping portion is located at the end of the first electrode layer 1. The first clamping portion is used to fit with the first clamping frame 201. The first clamping frame 201 is set between the first clamping portion and the heat receiving end 300. The first clamping frame 201 plays the role of clamping the first side of the end of the electric card element 100 and supporting the electric card element 100 to construct the first bending gap 203. Similarly, the base layer 5 includes a second clamping portion and a second fitting portion extending along the second clamping portion, wherein the second clamping portion is located at the end of the base layer 5. The second clamping portion is used to fit with the second clamping frame 202. The second clamping portion and the cold receiving end 400 are set at the second clamping frame 202. The second clamping frame 202 plays the role of clamping the second side of the end of the electric card element 100 and supporting the electric card element 100 to construct the second bending gap 204.

[0147] Optionally, the first bending gap 203 is smaller than or equal to a preset gap threshold; and / or the second bending gap 204 is smaller than or equal to a preset gap threshold.

[0148] The electric card element 100 is a thin film layer structure as a whole. To ensure the heat and coldness of the electric card element 100, the piezoelectric cooling area of ​​the piezoelectric functional film layer 4 is larger than the piezoelectric displacement area. Therefore, the displacement distance of the electric card element 100 is limited, so it is necessary to set the size of the first bending gap 203 or the second bending gap 204. For example, the first bending gap 203 is less than or equal to the preset gap threshold, and / or the second bending gap 204 is less than or equal to the preset gap threshold.

[0149] Optionally, the first clamping frame 201 forms a first support thickness between the first side of the first end of the electric card element 100 and the heat receiving end 300, and the second clamping frame 202 forms a second support thickness between the second side of the first end of the electric card element 100 and the cold receiving end 400. The first support thickness is less than or equal to a preset thickness threshold; and / or the second support thickness is less than or equal to a preset thickness threshold.

[0150] The first support thickness is defined as the distance between the first side of the first end of the electric card element 100 and the heat receiving end 300 caused by the first clamping frame 201, which can be understood as the thickness of the first bending gap 203; the second support thickness is defined as the distance between the second side of the first end of the electric card element 100 and the cold receiving end 400 caused by the second clamping frame 202, which can be understood as the thickness of the second bending gap 204. Since the displacement distance of the electric card element 100 is limited, it is necessary to set the first support thickness to be less than or equal to the preset thickness threshold; and / or, the second support thickness to be less than or equal to the preset thickness threshold.

[0151] Optionally, the first support thickness is equal to the second support thickness. The first support thickness is equal to the second support thickness, and the electric card element 100 is displaced the same toward the heat receiving end 300 and the cold receiving end 400, which facilitates the hot and cold separation of the electric card element 100.

[0152] Optionally, the electric card refrigeration chip 600 further includes a support frame 205. The support frame 205 is supported between the heat receiving end 300 and the cold receiving end 400, and the support frame 205 is disposed at the second end of the electric card element 100.

[0153] The first end of the electric card element 100 is clamped by the first clamping frame 201 and the second clamping frame 202, and the first clamping frame 201 and the second clamping frame 202 simultaneously support the first end of the electric card refrigeration chip 600. At the same time, the second end of the electric card refrigeration chip 600 also needs to be provided with a supporting frame 205 for support. One end of the supporting frame 205 abuts against the heat receiving end 300, and the other end abuts against the cold receiving end 400, thereby supporting the second end of the electric card refrigeration chip 600.

[0154] Optionally, the second end of the electric card element 100 abuts against the support frame 205 ; or, a gap is provided between the second end of the electric card element 100 and the support frame 205 .

[0155] The second end of the electric card element 100 may abut against the support frame 205, or a gap may be left. Figure 7 and Figure 8 As shown, the second end of the electric card element 100 in the electric card cooling chip 600 is not fixedly arranged, and the electric card element 100 is displaced to fit with the heat receiving end 300 when releasing heat, and is displaced to fit with the cold receiving end 400 when absorbing heat, forming a cantilever beam structure. Compared with the arrangement of the electric card element 100 with both ends clamped, the cantilever beam structure has a larger fitting area between the electric card element 100 and the heat receiving end 300 or the cold receiving end 400, and the heat transfer efficiency is improved.

[0156] Optionally, the support skeleton 205 forms a third support thickness between the heat receiving end 300 and the cold receiving end 400 at the second end of the electric card element 100. The sum of the first support thickness, the second support thickness and the thickness of the electric card element 100 is greater than or equal to the third support thickness.

[0157] The place where the heat receiving end 300 abuts against the first clamping frame 201 is defined as the first end of the heat receiving end 300, and the place where the heat receiving end abuts against the support frame 205 is defined as the second end of the heat receiving end 300; the place where the cold receiving end 400 abuts against the second clamping frame 202 is defined as the first end of the cold receiving end 400, and the place where the cold receiving end 400 abuts against the support frame 205 is defined as the second end of the cold receiving end 400. The sum of the first support thickness, the second support thickness and the thickness of the electric card element 100 can be understood as the distance between the first end of the heat receiving end 300 and the first end of the cold receiving end 400; the third support thickness can be understood as the distance between the second end of the heat receiving end 300 and the second end of the cold receiving end 400. Combined Figure 7 and Figure 8 As shown, when the electric card element 100 is attached to the heat receiving end 300 or the cold receiving end 400, since the first end of the electric card element 100 is clamped, the electric card element 100 moves toward the first end of the heat receiving end 300 or the first end of the cold receiving end 400 after attachment, and the distance between the first end of the heat receiving end 300 and the first end of the cold receiving end 400 is set to be greater than or equal to the distance between the second end of the heat receiving end 300 and the second end of the cold receiving end 400, so that the hot and cold separation of the electric card element 100 is more complete, thereby making the hot and cold separation efficiency higher.

[0158] Optionally, the piezoelectric refrigeration area includes one or more piezoelectric refrigeration units 42 ; and the piezoelectric displacement area includes one or more piezoelectric displacement units 41 .

[0159] When the piezoelectric refrigeration zone includes one piezoelectric refrigeration unit 42 and the piezoelectric displacement zone includes one piezoelectric displacement unit 41, the piezoelectric refrigeration unit 42 and the piezoelectric displacement unit 41 are arranged adjacent to each other, and when the piezoelectric refrigeration zone absorbs heat, the piezoelectric displacement zone drives the piezoelectric refrigeration zone to shift in the opposite direction. When the piezoelectric refrigeration zone includes multiple piezoelectric refrigeration units 42 and the piezoelectric displacement zone includes multiple piezoelectric displacement units 41, the piezoelectric displacement zone can better drive the piezoelectric functional film layer 4 to shift in the opposite direction when the piezoelectric refrigeration zone absorbs heat by setting the relative positions of the multiple piezoelectric refrigeration units 42 and the piezoelectric displacement units 41, thereby achieving the separation of the positions of heat release and heat absorption of the electric card element 100.

[0160] Optionally, the piezoelectric refrigeration area includes a plurality of piezoelectric refrigeration units 42, and the plurality of piezoelectric refrigeration units 42 are arranged in an array. And / or, the piezoelectric displacement area includes a plurality of piezoelectric displacement units 41, and the plurality of piezoelectric displacement units 41 are arranged in an array.

[0161] The multiple piezoelectric cooling units 42 are arranged in an array so that each part of the electric card element 100 can release or absorb heat in a balanced manner, which is convenient for heat to be dissipated during heat release or heat to be absorbed during heat absorption. The multiple piezoelectric displacement units 41 are arranged in an array so that when the electric card element 100 absorbs heat in the piezoelectric cooling area, the force of the piezoelectric displacement area driving the electric card element 100 to displace in the opposite direction is evenly applied to the electric card element 100, so that each part of the electric card element 100 is synchronously displaced in the opposite direction, which is convenient for the electric card element 100 to fit the heat transfer medium.

[0162] Optionally, the piezoelectric refrigeration area includes a plurality of piezoelectric refrigeration units 42, and two adjacent piezoelectric refrigeration units 42 are arranged at intervals; the piezoelectric displacement area includes a plurality of piezoelectric displacement units 41, and two adjacent piezoelectric displacement units 41 are arranged at intervals.

[0163] Two adjacent piezoelectric refrigeration units 42 among the multiple piezoelectric refrigeration units 42 are arranged at intervals, and other functional modules, such as piezoelectric displacement units 41, can be arranged between the two adjacent piezoelectric refrigeration units 42 on the basis of balanced heat release or heat absorption of various parts of the electric card element 100, which is convenient for heat dissipation during heat release or heat entry during heat absorption. Similarly, two adjacent piezoelectric displacement units 41 among the multiple piezoelectric displacement units 41 are arranged at intervals, and other functional modules, such as piezoelectric refrigeration units 42, can be arranged between the two adjacent piezoelectric displacement units 41 on the basis of balanced application of the force of the piezoelectric displacement zone to drive the electric card element 100 to reverse displacement when the electric card element 100 absorbs heat in the piezoelectric refrigeration zone.

[0164] Optionally, the piezoelectric refrigeration units 42 and the piezoelectric displacement units 41 are arranged alternately and spaced apart from each other.

[0165] Multiple piezoelectric refrigeration units 42 and multiple piezoelectric displacement units 41 are alternately arranged with each other. When the piezoelectric refrigeration zone absorbs heat due to the electrocaloric effect, the piezoelectric displacement unit 41 can reversely displace to drive the adjacent piezoelectric refrigeration unit 42 to reversely displace, thereby causing the electrocaloric element 100 to reversely displace and have a high degree of flatness after displacement, which facilitates the electrocaloric element 100 to fit with the heat transfer medium for heat transfer.

[0166] Optionally, the heat receiving end 300 includes an insulating heat conductive layer, and / or the cold receiving end 400 includes an insulating heat conductive layer. The heat receiving end 300 and / or the cold receiving end 400 are insulated to prevent the current leakage of the first electrode layer 1 or the second electrode layer 2 from causing loss. The heat receiving end 300 and / or the cold receiving end 400 are heat conductive and can export the heat or cold of the electric card element 100.

[0167] Optionally, the insulating heat-conducting layer includes aluminum nitride / silicon carbide (AlN / SiC) composite ceramic.

[0168] Optionally, the first clamping frame 201, the second clamping frame 202, and / or the supporting frame 205 include an insulating frame. The insulation of each frame can allow energy to be extracted from the heat receiving end 300 or the cold receiving end 400, thereby improving the heat and cold separation efficiency of the electric card refrigeration chip 600.

[0169] Optionally, the insulating and heat-insulating skeleton comprises an alumina skeleton.

[0170] In some embodiments, the electric card cooling chip 600 assembly includes one or more of the aforementioned electric card cooling chips 600. Multiple electric card cooling chips 600 can increase the heat or cold capacity of the electric card cooling chip 600 assembly, making it easier for the electric card cooling chip 600 assembly to be used in large equipment.

[0171] Optionally, multiple electric card cooling chips 600 are included in an array arrangement. When the electric card cooling chip 600 assembly includes multiple electric card cooling chips 600, the multiple electric card cooling chips 600 can be arranged in an array. In this way, each part of the electric card cooling chip 600 assembly can release or absorb heat evenly, and the electric card cooling chip 600 assembly forms a square structure, which is convenient for the electric card cooling chip 600 assembly to be used in large equipment.

[0172] Optionally, the first electrode layer 1 is provided with an electrode gap 13, and the electrode gap 13 divides the first electrode layer 1 into an electric card cooling electrode area 11 and a piezoelectric driving electrode area 12, wherein the electric card cooling electrode area 11 corresponds to the piezoelectric cooling area, and the piezoelectric driving electrode area 12 corresponds to the piezoelectric displacement area. The electric card cooling chip 600 component also includes an external power supply, wherein the external power supply is used to: apply a positive electric field to the electric card cooling electrode area 11 and the piezoelectric driving electrode area 12, so that the piezoelectric displacement area and the piezoelectric cooling area produce displacement in a first direction; or, remove the electric field of the electric card cooling motor area, and the piezoelectric cooling area of ​​the piezoelectric functional film layer 4 absorbs heat, and at the same time, apply a reverse electric field to the piezoelectric driving electrode area 12, so that the piezoelectric displacement area drives the heat-absorbing piezoelectric cooling area to produce displacement in a second direction.

[0173] Corresponding to the two different functional units of the piezoelectric cooling area and the piezoelectric displacement area, different electric fields need to be applied to the electrodes to stimulate different functional effects. Therefore, the first electrode layer 1 is provided with an electrode gap 13, so that the first electrode layer 1 is separated to form an electric card cooling electrode area 11 corresponding to the piezoelectric cooling area and a piezoelectric driving electrode area 12 corresponding to the piezoelectric displacement area, and different electric fields are applied to the electric card cooling electrode area 11 and the second electrode layer 2 and the piezoelectric driving electrode area 12 and the second electrode layer 2 to achieve the stimulation of different functional effects. Figures 6 to 8 As shown, a positive electric field is applied to the electric card cooling electrode area 11 and the piezoelectric driving electrode area 12, so that the piezoelectric displacement area and the piezoelectric cooling area generate displacement in a first direction, that is, Figure 7The electric card element 100 releases heat and fits the heat receiving end 300; the electric field of the electric card refrigeration motor area is removed, and the piezoelectric refrigeration area of ​​the piezoelectric functional film layer 4 absorbs heat. At the same time, a reverse electric field is applied to the piezoelectric driving electrode area 12, so that the piezoelectric displacement area drives the heat-absorbing piezoelectric refrigeration area to generate a displacement in the second direction, that is, Figure 8 Moving downward, the electric card element 100 absorbs heat and fits the cold receiving end 400 .

[0174] At present, the existing electric card refrigeration system is affected by volume or size, the hot and cold separation distance of the electric card refrigeration system is short, and the full utilization of the cooling capacity cannot be achieved, and it is difficult to apply it to large space refrigeration.

[0175] The disclosed embodiment also discloses an electric card refrigeration cycle system and household appliances. By setting a loop heat dissipation flow path 500, the heat and cold of the electric card refrigeration chip 600 can be separated over a long distance. The electric card refrigeration chip 600 can be applied to household appliances to meet the refrigeration needs of large spaces.

[0176] Combination Figures 9 to 13 As shown, the embodiment of the present disclosure provides an electric card refrigeration cycle system, including a loop heat dissipation flow path 500. The loop heat dissipation flow path 500 includes an evaporation end 501, a gas circulation pipeline 502, a condensation end 503 and a liquid circulation pipeline 504 connected in sequence. Among them, the loop heat dissipation flow path 500 also includes an electric card refrigeration chip 600. The electric card refrigeration chip 600 includes an evaporation end electric card refrigeration chip 601 attached to the evaporation end 501, which is used to transfer the heat of the evaporation end electric card refrigeration chip 601 to the evaporation end 501.

[0177] The electric card refrigeration cycle system includes an electric card refrigeration chip 600, which periodically releases heat or absorbs heat under the stimulation of an external electric field. The electric card refrigeration cycle system also includes a loop heat dissipation flow path 500, and the electric card refrigeration chip 600 includes an evaporation end electric card refrigeration chip 601 attached to the evaporation end 501. The electric card refrigeration chip 600 releases heat, and the refrigerant in the evaporation end 501 of the loop heat dissipation flow path 500 absorbs heat and vaporizes and flows to the condensation end 503 through the gas circulation pipeline 502. The gaseous refrigerant releases heat and liquefies at the condensation end 503, and flows back to the evaporation end 501 through the liquid circulation pipeline 504 to form a refrigerant cycle. Therefore, the heat is dissipated when the electric card refrigeration chip 600 releases heat and moves to the condensation end 503, thereby realizing the cold and heat separation of the electric card refrigeration chip 600. Among them, the gas circulation pipeline 502 and the liquid circulation pipeline 504 can be set according to needs, so that the heat and cold of the electric card refrigeration chip 600 can be separated at a long distance. The electric card refrigeration chip 600 can be applied to household appliances to meet the refrigeration needs of large spaces.

[0178] Optionally, the evaporation end 501 includes a heat exchanger having an S-shaped flow path or a parallel flow heat exchanger.

[0179] The heat exchange tubes in the heat exchanger with S-shaped flow path are S-shaped. When the length is the same, the S-shaped heat exchange tube has a long tube path and a larger heat exchange area, so that the refrigerant can fully exchange heat in the evaporation end 501. The parallel flow heat exchanger is mainly composed of porous flat tubes and corrugated louver fins. There are headers at both ends, and according to whether the headers are segmented or not, it can be divided into multi-element parallel flow type and unit parallel flow type. The unit-type header is not interrupted, and the refrigerant flows in the same direction; the multi-element header is interrupted by partitions, and the number of tubes in each section is different. The parallel flow heat exchanger has high heat exchange efficiency and compact structure, so that the refrigerant can fully exchange heat in the evaporation end 501, and the volume of the evaporation end 501 is small.

[0180] Optionally, a one-way valve body is provided in the loop heat dissipation flow path 500. The one-way valve body is provided in the loop heat dissipation flow path 500 to allow the refrigerant to flow in one direction and circulate heat exchange.

[0181] Optionally, the one-way valve body includes a Tesla valve 505 .

[0182] like Fig.10 and Fig.11 As shown, Tesla valve 505 adopts a special circuit design. When the fluid passes through Tesla valve 505 in the forward direction, the fluid will be divided into two paths at each circuit port, and then the two paths of fluid will converge at the next intersection and accelerate. On the contrary, if the fluid flows into Tesla valve 505 in the reverse direction, the fluid will also be divided into two paths at the first intersection and converge again at the second intersection. The difference is that the flow directions of the two paths of fluid are opposite, so a great resistance is formed. Therefore, Tesla valve 505 can only pass forward, and it is difficult to reverse. The setting of Tesla valve 505 allows the refrigerant to circulate unidirectionally in the loop heat dissipation flow path 500.

[0183] Optionally, the Tesla valve 505 is disposed at the condensation end 503. The Tesla valve 505 is disposed at the condensation end 503 to promote the one-way flow of the refrigerant after condensation at the condensation end 503 to participate in the circulation.

[0184] Optionally, the electric card refrigeration chip 600 further includes a condensation end electric card refrigeration chip 602. The condensation end electric card refrigeration chip 602 is attached to the condensation end 503, and is used to transfer the cold energy of the condensation end electric card refrigeration chip 602 to the condensation end 503.

[0185] The electric card refrigeration chip 600 also includes a condensation end electric card refrigeration chip 602. When the condensation end electric card refrigeration chip 602 absorbs heat, the gaseous refrigerant in the condensation end 503 of the loop heat dissipation flow path 500 releases heat and liquefies into liquid refrigerant, and flows to the evaporation end 501 to absorb heat and vaporize, and then participate in the cycle. The evaporation end electric card refrigeration chip 601 and the condensation end electric card refrigeration chip 602 can realize that the evaporation end 501 in the loop heat dissipation flow path 500 absorbs the heat of the electric card refrigeration chip 600 and transfers it to the condensation end 503, and the condensation end 503 absorbs the cold of the electric card refrigeration chip 600 and transfers it to the evaporation end 501. The heat is transferred from the evaporation end 501 to the condensation end 503 in a unidirectional and efficient manner, that is, the loop heat dissipation flow path 500 realizes the hot and cold separation of the electric card refrigeration chip 600 as a thermal switch.

[0186] Combination Fig. 9 and Fig.12 As shown, for the evaporation end 501 circulation, when the electric card refrigeration chip 600 generates heat, the liquid refrigerant at the evaporation end 501 changes phase and turns into gaseous refrigerant, and rises to the condensation end 503 through the gas circulation pipeline 502. The radiator reduces the temperature through forced convection and turns into liquid droplets, which flow back to the evaporation end 501 through the liquid circulation pipeline 504. Since the condensation zone adopts the Tesla valve 505, which has the characteristic of unidirectional flow, it can form an effective unidirectional circulation in a microgravity or zero-gravity environment. The gas-liquid loop formed by phase change at the evaporation end 501 and the condensation end 503 can ensure that heat is transferred unidirectionally and efficiently from the evaporation end 501 to the condensation end 503. Fig.12 and Fig.13 As shown, for the condensation end 503 cycle, the electric card refrigeration chip 600 is closely attached to the condensation end 503 of the loop heat dissipation flow path 500. When the electric card refrigeration chip 600 generates heat, due to the one-way heat transfer characteristics of the loop heat dissipation flow path 500, the heat will be transferred to the condensation end 503 more quickly, and only a small amount will be transferred downward with lower efficiency. When the electric card refrigeration chip 600 absorbs heat, it will quickly conduct the cold downward. Therefore, the electric card refrigeration cycle system can be used in aerospace.

[0187] Optionally, the electric card refrigeration chip 600 includes an electric card element 100, a clamping frame, a heat receiving end 300 and a cold receiving end 400. The electric card element 100 includes a first electrode layer 1, a second electrode layer 2 and a piezoelectric functional film layer 4, the piezoelectric functional film layer 4 is arranged between the first electrode layer 1 and the second electrode layer 2, and the piezoelectric functional film layer 4 includes a piezoelectric refrigeration zone and a piezoelectric displacement zone formed by the piezoelectric film layer partition. Among them, the piezoelectric displacement zone is used to drive the piezoelectric refrigeration zone to displace. The clamping frame includes a first clamping frame 201 clamped on the first side of the first end of the electric card element 100, and a second clamping frame 202 clamped on the second side of the first end of the electric card element 100. The heat receiving end 300 is arranged on the side of the first clamping frame 201 for receiving the heat of the electric card element 100. The cold receiving end 400 is arranged on the side of the second clamping frame 202 for receiving the cold of the electric card element 100.

[0188] It should be understood that the loop heat dissipation flow path 500 in the aforementioned electric card cooling chip 600 is used as a thermal switch to achieve the hot and cold separation of the electric card cooling chip 600. Therefore, the electric card element 100 in the electric card cooling chip 600 can be a conventional electric card element 100 without an integrated thermal switch, or the electric card element 100 can be the aforementioned electric card element 100 with an integrated thermal switch.

[0189] When the electric card element 100 is the electric card element 100 in the form of the aforementioned integrated thermal switch, the electric card element 100 includes a first electrode layer 1, a second electrode layer 2 and a piezoelectric functional film layer 4, the piezoelectric functional film layer 4 is arranged between the first electrode layer 1 and the second electrode layer 2, and the piezoelectric functional film layer 4 includes a piezoelectric refrigeration zone and a piezoelectric displacement zone formed by partitioning the piezoelectric film layer. The electric card refrigeration chip 600 includes the electric card element 100, a clamping frame, a heat receiving end 300 and a cold receiving end 400. The piezoelectric film layer of the electric card element 100 is directly partitioned to form a piezoelectric displacement zone, and the electric card element 100 is driven to move through the piezoelectric displacement zone. At the same time, the heat receiving end 300 and the cold receiving end 400 are respectively arranged on both sides of the electric card element 100, and the first end of the electric card element 100 is clamped in the clamping frame. When the piezoelectric refrigeration zone and the piezoelectric displacement zone simultaneously apply a forward electric field, the piezoelectric functional film layer 4 simultaneously excites the piezoelectric effect and the electrocaloric effect, and a forward displacement and heat release occur. The clamping skeleton clamps the electrocaloric element 100 so that the electrocaloric element 100 fits the heat receiving end 300. When the piezoelectric refrigeration zone stops applying an electric field and the piezoelectric displacement zone applies a reverse electric field, the piezoelectric refrigeration zone absorbs heat due to the electrocaloric effect, and the piezoelectric displacement zone undergoes a reverse displacement due to the piezoelectric effect, thereby driving the piezoelectric functional film layer 4 to reversely displace, and the clamping skeleton clamps the electrocaloric element 100 so that the electrocaloric element 100 fits the cold receiving end 400. The integrated thermal switch form of the electrocaloric element 100 realizes the preliminary separation of cold and heat, and the loop heat dissipation flow path 500 further separates the cold and heat of the electrocaloric element 100.

[0190] Optionally, the electric card element 100 further includes a base layer 5 , which is disposed below the second electrode layer 2 .

[0191] The piezoelectric functional film layer 4, the first electrode layer 1 and the second electrode layer 2 are combined to form a thin film structure. A base layer 5 is provided under the second electrode layer 2 of the electric card element 100 to support the thin film structure and provide an operating platform during preparation. The provision of the base layer 5 can also maintain the flatness of the electric card element 100, so that the electric card element 100 can be close to the heat transfer medium when transferring heat.

[0192] In some embodiments, the household appliance includes the aforementioned electric card refrigeration cycle system.

[0193] Optionally, the household appliance further includes an evaporation end 501 fan and a condensation end 503 fan. The evaporation end 501 fan is disposed at the evaporation end 501 in the loop heat dissipation flow path 500; and / or the condensation end 503 fan is disposed at the condensation end 503 in the loop heat dissipation flow path 500.

[0194] Whether it is the heat circulation of the evaporation end electric card refrigeration chip 601 at the evaporation end 501 or the heat circulation of the condensation end electric card refrigeration chip 602 at the condensation end 503, the heat is transferred unidirectionally and efficiently from the evaporation end 501 to the condensation end 503. It can be understood that the condensation end 503 of the loop heat dissipation flow path 500 dissipates heat outward, which can achieve heating and temperature rise of the external space where the condensation end 503 is located; the evaporation end 501 of the loop heat dissipation flow path 500 absorbs heat inward, which can achieve cooling and temperature reduction of the external space where the evaporation end 501 is located. In order to quickly transfer heat, an evaporation end 501 fan and a condensation end 503 fan are respectively set at the evaporation end 501 and the condensation end 503.

[0195] Optionally, the household appliance includes an air conditioner or a refrigeration device.

[0196] In some embodiments, the electric card refrigeration cycle system includes a loop heat dissipation flow path 500. The loop heat dissipation flow path 500 includes an evaporation end 501, a gas circulation pipeline 502, a condensation end 503 and a liquid circulation pipeline 504 connected in sequence. Among them, the loop heat dissipation flow path 500 also includes an electric card refrigeration chip 600. The electric card refrigeration chip 600 includes a condensation end electric card refrigeration chip 602 attached to the condensation end 503, which is used to transfer the coldness of the condensation end electric card refrigeration chip 602 to the condensation end 503.

[0197] In the electric card refrigeration cycle system, only the condensing end electric card refrigeration chip 602 is set at the condensing end 503, and the hot and cold separation of the electric card refrigeration chip 600 can also be achieved. For the condensing end 503 cycle, the electric card refrigeration chip 600 is closely attached to the condensing end 503 of the loop heat dissipation flow path 500. When the electric card refrigeration chip 600 generates heat, due to the unidirectional heat transfer characteristics of the loop heat dissipation flow path 500, the heat will be transferred to the condensing end 503 more quickly, and only a small amount will be transferred downward with lower efficiency. When the electric card refrigeration chip 600 absorbs heat, it will quickly conduct the coolness downward.

[0198] Optionally, the electric card refrigeration cycle system further includes a one-way valve, which is arranged at the condensation end 503. The Tesla valve 505 is arranged at the condensation end 503 to promote the one-way flow of the refrigerant after condensation at the condensation end 503 to participate in the circulation.

[0199] Optionally, the one-way valve includes a Tesla valve 505. The Tesla valve 505 can be set to allow the refrigerant to circulate in the loop heat dissipation flow path 500 in one direction.

[0200] In some embodiments, the household appliance includes the aforementioned electric card refrigeration cycle system.

[0201] Optionally, the household appliance further includes an evaporation end 501 fan and a condensation end 503 fan. The evaporation end 501 fan is disposed at the evaporation end 501 in the loop heat dissipation flow path 500; and / or the condensation end 503 fan is disposed at the condensation end 503 in the loop heat dissipation flow path 500.

[0202] The heat circulation of the condensing end electric card refrigeration chip 602 of the condensing end 503 allows heat to be transferred unidirectionally and efficiently from the evaporating end 501 to the condensing end 503. It can be understood that the condensing end 503 of the loop heat dissipation flow path 500 dissipates heat outward, which can achieve heating and temperature rise of the external space where the condensing end 503 is located; the evaporating end 501 of the loop heat dissipation flow path 500 absorbs heat inward, which can achieve cooling and temperature reduction of the external space where the evaporating end 501 is located. In order to quickly transfer heat, an evaporating end 501 fan and a condensing end 503 fan are respectively set at the evaporating end 501 and the condensing end 503.

[0203] Optionally, the household appliance includes an air conditioner or a refrigeration device.

[0204] The disclosed embodiment also discloses an electric card cooling device, in which a first loop heat dissipation flow path 506 and a second loop heat dissipation flow path 507 are respectively arranged at the heat receiving end 300 and the cold receiving end 400 of the electric card cooling chip 600, so that the heat and cold of the electric card cooling chip 600 are respectively transferred to two ends separated by a distance through the first loop heat dissipation flow path 506 and the second loop heat dissipation flow path 507. Furthermore, the electric card cooling device can meet the cooling needs of a large space.

[0205] Combination Fig.14As shown, the embodiment of the present disclosure provides an electric card refrigeration device, including an electric card refrigeration chip 600, a first loop heat dissipation flow path 506, and a second loop heat dissipation flow path 507. The first loop heat dissipation flow path 506 includes a first heat conduction end 5061, a first radiator 5062, and a first circulation pipeline for connecting the first heat conduction end 5061 with the first radiator 5062, wherein the first heat conduction end 5061 is thermally connected to the heat receiving end 300 of the electric card refrigeration chip 600. The second loop heat dissipation flow path 507 includes a second heat conduction end 5071, a second radiator 5072, and a second circulation pipeline for connecting the second heat conduction end 5071 with the second radiator 5072, wherein the second heat conduction end 5071 is thermally connected to the cold receiving end 400 of the electric card refrigeration chip 600. Among them, when an electric field is applied to the electric card element 100, the electric card element 100 generates a displacement toward the heat receiving end 300, and the heat generated by the electric card element 100 is transferred to the heat receiving end 300, and the heat receiving end 300 transfers the heat to the first heat conducting end 5061, and the heat is transferred to the first radiator 5062 through the first circulation pipeline; when the electric field of the electric card element 100 is removed, the electric card element 100 generates a displacement toward the cold receiving end 400, and the cold generated by the electric card element 100 is transferred to the cold receiving end 400, and the cold receiving end 400 transfers the cold to the second heat conducting end 5071, and the cold is transferred to the second radiator 5072 through the second circulation pipeline.

[0206] The electric card refrigeration device includes an electric card refrigeration chip 600, and the electric card element 100 in the electric card refrigeration chip 600 periodically releases heat or absorbs heat under the excitation of an external electric field. The heat receiving end 300 and the cold receiving end 400 in the electric card refrigeration chip 600 preliminarily separate the heat and cold of the electric card element 100. The heat receiving end 300 and the cold receiving end 400 of the electric card refrigeration chip 600 are respectively connected by thermal conduction to the first loop heat dissipation flow path 506 and the second loop heat dissipation flow path 507, respectively, and the heat is transferred to the first radiator 5062 and the cold is transferred to the second radiator 5072, and the heat and cold of the electric card refrigeration chip 600 are separated for the second time. In addition, the first loop heat dissipation flow path 506 and the second loop heat dissipation flow path 507 can be set according to the requirements. The length and width of the first loop heat dissipation flow path 506 and the second loop heat dissipation flow path 507 can be set according to the requirements. The size of the electric card refrigeration device is increased. Further, the electric card refrigeration device can meet the refrigeration needs of a large space.

[0207] Optionally, the electric card element 100 of the electric card refrigeration chip 600 includes a first electrode layer 1, a second electrode layer 2 and a piezoelectric functional film layer 4, the piezoelectric functional film layer 4 is arranged between the first electrode layer 1 and the second electrode layer 2, and the piezoelectric functional film layer 4 includes a piezoelectric refrigeration zone and a piezoelectric displacement zone formed by partitioning the piezoelectric film layer, wherein the piezoelectric displacement zone is used to drive the piezoelectric refrigeration zone to generate displacement.

[0208] The electric card refrigeration device provided in the embodiment of the present disclosure is provided with a first loop heat dissipation flow path 506 and a second loop heat dissipation flow path 507, that is, two loop heat dissipation flow paths 500 as described above are provided to realize the hot and cold separation of the electric card refrigeration chip 600 as a thermal switch. Therefore, the electric card element 100 in the electric card refrigeration chip 600 can be a conventional electric card element 100 in the form of a non-integrated thermal switch, or the electric card element 100 can be an electric card element 100 in the form of an integrated thermal switch. Among them, when the electric card element 100 is the electric card element 100 in the form of an integrated thermal switch, the electric card element 100 includes a first electrode layer 1, a second electrode layer 2 and a piezoelectric functional film layer 4, and the piezoelectric functional film layer 4 is arranged between the first electrode layer 1 and the second electrode layer 2, and the piezoelectric functional film layer 4 includes a piezoelectric refrigeration zone and a piezoelectric displacement zone formed by partitioning the piezoelectric film layer. The piezoelectric displacement zone is used to drive the piezoelectric refrigeration zone to produce displacement, so as to realize the preliminary hot and cold separation of the electric card element 100.

[0209] Optionally, the first heat conducting end 5061 includes an S-type flow path heat exchanger, a parallel flow heat exchanger or a graphene heat conducting component; or, the second heat conducting end 5071 includes an S-type flow path heat exchanger, a parallel flow heat exchanger or a graphene heat conducting component.

[0210] The S-type flow path heat exchanger or the parallel flow heat exchanger can increase the heat exchange area and improve the heat exchange efficiency of the first heat conducting end 5061 and the second heat conducting end 5071. The graphene heat conducting component is arranged between the electric card refrigeration chip 600 and the first heat conducting end 5061 or the electric card refrigeration chip 600 and the second heat conducting end 5071, so that energy is conducted between the electric card refrigeration chip 600 and the first heat conducting end 5061 or the electric card refrigeration chip 600 and the second heat conducting end 5071.

[0211] Optionally, the first heat conducting end 5061 is disposed on an upper portion of the second heat conducting end 5071 .

[0212] The first heat conducting end 5061 is disposed on the upper part of the second heat conducting end 5071, the first heat conducting end 5061 is heat-conductingly connected to the heat receiving end 300 of the electric card cooling chip 600, and the second heat conducting end 5071 is heat-conductingly connected to the cold receiving end 400 of the electric card cooling chip 600. It can be understood that, Fig.14 The ends of the two loop heat dissipation paths 500 from top to bottom are the condensation end 503 of the first loop heat dissipation path 506, the evaporation end 501 of the first loop heat dissipation path 506, the condensation end 503 of the second loop heat dissipation path 507, and the evaporation end 501 of the second loop heat dissipation path 507. Fig.14 In the example, the upper end of the electric card refrigeration device is the heat collection end, and the lower end is the cold collection end (i.e., the heat removal end). The specific hot end cycle and cold end cycle principles have been described in detail in the aforementioned electric card refrigeration cycle system, and will not be repeated here.

[0213] Optionally, the first loop heat dissipation flow path 506 is provided with a first one-way valve body; and / or the second loop heat dissipation flow path 507 is provided with a second one-way valve body. The one-way valve body can make the refrigerant flow in one direction and circulate heat exchange.

[0214] Optionally, the first heat dissipation loop 506 is provided with a first Tesla valve 505; and / or the second heat dissipation loop 507 is provided with a second Tesla valve 505. The Tesla valve 505 can make the refrigerant circulate in the heat dissipation loop 500 in one direction due to its special structure.

[0215] Optionally, the electric card cooling device further includes a first fan 701 and a second fan 702. The first fan 701 is disposed on the first radiator 5062 side and the second fan 702 is disposed on the second radiator 5072 side.

[0216] The fan can dissipate heat as a heat dissipation device. A first fan 701 is arranged on the side of the first radiator 5062 to dissipate the heat accumulated at the condensation end 503 of the first loop heat dissipation flow path 506 outward; a second fan 702 is arranged on the side of the second radiator 5072 to dissipate the cold accumulated at the evaporation end 501 of the second loop heat dissipation flow path 507 outward.

[0217] Optionally, the electric card refrigeration device also includes a controller, which is used to: control the rotation speed of the first fan 701 to be greater than or equal to the first rotation speed, and control the rotation speed of the second fan 702 to be less than the first rotation speed; or control the rotation speed of the second fan 702 to be greater than or equal to the first rotation speed, and control the rotation speed of the first fan 701 to be less than the first rotation speed.

[0218] The controller controls the speed of the first fan 701 to be greater than or equal to the first speed, and controls the speed of the second fan 702 to be less than the first speed, that is, the speed of the first fan 701 is greater than the speed of the second fan 702; the controller controls the speed of the second fan 702 to be greater than or equal to the first speed, and controls the speed of the first fan 701 to be less than the first speed, that is, the speed of the second fan 702 is greater than the speed of the first fan 701. The speeds of the first fan 701 and the second fan 702 can be set according to the temperature values ​​of the first radiator 5062 side and the second radiator 5072 side.

[0219] Optionally, a thermal interface material is filled between the first heat conducting end 5061 and the heat receiving end 300 of the electric card refrigeration chip 600 ; and / or a thermal interface material is filled between the second heat conducting end 5071 and the cold receiving end 400 of the electric card refrigeration chip 600 .

[0220] Optionally, the thermal interface material includes silicone grease or a thermal pad to transfer energy between the first thermal conductive end 5061 and the electric card cooling chip 600 and the second thermal conductive end 5071 and the electric card cooling chip 600, thereby reducing convective heat loss caused by energy leakage.

[0221] Optionally, the electric card refrigeration device further includes a box, and the first heat conducting end 5061 and / or the second heat conducting end 5071 are arranged in the box. The arrangement of the box can protect the electric card refrigeration device and be applied to the needs of a large space in the form of a refrigeration device.

[0222] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An electric card refrigeration chip, characterized in that: include: The electric card element comprises a first electrode layer, a second electrode layer, and a piezoelectric functional film layer, wherein the piezoelectric functional film layer is arranged between the first electrode layer and the second electrode layer, and the piezoelectric functional film layer comprises a piezoelectric refrigeration area and a piezoelectric displacement area formed by partitioning the piezoelectric film layer, wherein the piezoelectric displacement area is used to drive the piezoelectric refrigeration area to generate displacement; A clamping frame, comprising a first clamping frame clamped on a first side of a first end of the electric card element, and a second clamping frame clamped on a second side of the first end of the electric card element; A heat receiving end, disposed on the first clamping frame side, for receiving heat from the electric card element; and, The cold energy receiving end is arranged on the second clamping frame side and is used to receive the cold energy of the electric card element.

2. The electric card refrigeration chip according to claim 1, characterized in that: The electric card element further includes a base layer, which is arranged below the second electrode layer. The first clamping frame is arranged on the first electrode layer of the electric card element, and the second clamping frame is arranged on the base layer of the electric card element.

3. The electric card refrigeration chip according to claim 2, characterized in that: A first bending gap is provided between the first side of the electric card element and the heat receiving end, wherein the first bending gap is used to allow the first side of the electric card element to be bent toward the heat receiving end and fit with the heat receiving end; and / or, A second bending gap is provided between the second side of the electric card element and the cold receiving end, wherein the second bending gap is used to allow the second side of the electric card element to bend toward the cold receiving end and fit with the cold receiving end.

4. The electric card refrigeration chip according to claim 3, characterized in that: The first electrode layer includes a first clamping portion disposed at an end portion and used to clamp the first clamping frame, and a first bonding portion extending along the first clamping portion, wherein the first bending gap is disposed between the first bonding portion and the heat receiving end; and / or, The base layer includes a second clamping portion arranged at the end and used for clamping the second clamping frame, and a second fitting portion extending along the second clamping portion, wherein the second bending gap is arranged between the second fitting portion and the cold receiving end.

5. The electric card refrigeration chip according to claim 4, characterized in that: The first bending gap is less than or equal to a preset gap threshold; and / or, The second bending gap is less than or equal to a preset gap threshold.

6. The electric card refrigeration chip according to any one of claims 1 to 5, characterized in that: The first clamping frame forms a first support thickness between the first side of the first end of the electric card element and the heat receiving end, and the second clamping frame forms a second support thickness between the second side of the first end of the electric card element and the cold receiving end, wherein, The first support thickness is less than or equal to a preset thickness threshold; and / or, The second support thickness is less than or equal to a preset thickness threshold.

7. The electric card refrigeration chip according to claim 6, characterized in that: The first support thickness is equal to the second support thickness.

8. The electric card refrigeration chip according to claim 6, characterized in that: Also includes: The support frame is supported between the heat receiving end and the cold receiving end, and the support frame is arranged at the second end of the electric card element.

9. The electric card refrigeration chip according to claim 8, characterized in that: The second end of the electric card element abuts against the supporting frame; or, A gap is arranged between the second end of the electric card element and the supporting frame.

10. The electric card refrigeration chip according to claim 8, characterized in that: The support skeleton enables the heat receiving end and the cold receiving end of the second end of the electric card element to form a third support thickness, wherein the sum of the first support thickness, the second support thickness and the thickness of the electric card element is greater than or equal to the third support thickness.

11. The electric card refrigeration chip according to claim 1, characterized in that: The piezoelectric refrigeration zone includes one or more piezoelectric refrigeration units; The piezoelectric displacement region includes one or more piezoelectric displacement units.

12. The electric card refrigeration chip according to claim 11, characterized in that: The piezoelectric refrigeration area includes a plurality of piezoelectric refrigeration units, and the plurality of piezoelectric refrigeration units are arranged in an array; and / or, The piezoelectric displacement region includes a plurality of piezoelectric displacement units, and the plurality of piezoelectric displacement units are arranged in an array.

13. The electric card refrigeration chip according to claim 12, characterized in that: The piezoelectric refrigeration area includes a plurality of piezoelectric refrigeration units, and two adjacent piezoelectric refrigeration units are arranged at intervals; The piezoelectric displacement area includes a plurality of piezoelectric displacement units, and two adjacent piezoelectric displacement units are arranged at intervals.

14. The electric card refrigeration chip according to claim 13, characterized in that: The piezoelectric refrigeration units and the piezoelectric displacement units are arranged alternately and at intervals.

15. An electric card refrigeration chip assembly, characterized in that: Includes one or more electric card cooling chips, Wherein, the electric card refrigeration chip is as described in any one of claims 1 to 14.

16. The electric card refrigeration chip assembly according to claim 15, characterized in that: It includes a plurality of electric card cooling chips arranged in an array.

17. The electric card refrigeration chip assembly according to claim 15, characterized in that: The first electrode layer is provided with an electrode gap, and the electrode gap divides the first electrode layer into an electric card cooling electrode area and a piezoelectric driving electrode area, wherein the electric card cooling electrode area corresponds to the piezoelectric cooling area, and the piezoelectric driving electrode area corresponds to the piezoelectric displacement area; The electric card refrigeration chip assembly also includes an external power supply, wherein the external power supply is used for: Applying a positive electric field to the electric card cooling electrode area and the piezoelectric driving electrode area to cause the piezoelectric displacement area and the piezoelectric cooling area to generate displacement in a first direction; or, The electric field in the electric card refrigeration motor area is removed, and the piezoelectric refrigeration area of ​​the piezoelectric functional film layer absorbs heat. At the same time, a reverse electric field is applied to the piezoelectric driving electrode area, so that the piezoelectric displacement area drives the heat-absorbing piezoelectric refrigeration area to produce a displacement in a second direction.

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