Packaging device for nano-silver paste IGBT (Insulated Gate Bipolar Translator) processing

Abstract

The invention discloses a packaging device for nano-silver paste IGBT processing, which comprises an outer bearing platform, a telescopic rod, an L-shaped fixing plate and a packaging base, a fixing platform is welded to the top of the upper end of the outer bearing platform, a pre-opening hole is formed in the inner wall of one side of the fixing platform, inner bearing platforms are distributed on the inner wall side of the outer bearing platform, the inner bearing platforms are distributed in a split manner, and the outer bearing platform is connected with the telescopic rod. A telescopic air cylinder is fastened to the upper end of the fixing table through a bolt, and a sliding rail is arranged on the outer wall of the upper end of the telescopic air cylinder. When the packaging device for nano-silver paste IGBT processing is used, the paste storage box is used for storing redundant nano-silver paste, meanwhile, the bearing platform and the outer bearing platform are designed in a split mode, the connection mode is easy to operate and convenient to use, the telescopic rod serves as a telescopic component and drives the lower pressing head to conduct telescopic operation, and the packaging device is convenient to use. And the pressing head presses the L-shaped fixing plate to perform synchronous pressing operation, so that the plurality of limiting heads perform synchronous pressing, and the requirement of performing multi-point synchronous pressing operation on the to-be-packaged semiconductor device plate body is met.

Description

Technical Field

[0001] The invention relates to the technical field of nano silver paste IGBT processing equipment, in particular to a packaging device for nano silver paste IGBT processing. Background Art

[0002] The insulated gate bipolar transistor combines the advantages of power transistors and power field effect transistors, has good characteristics, and has a wide range of applications. IGBT is the natural evolution of vertical power MOSFET for high current, high voltage applications and fast terminal equipment. IGBT needs to be packaged and produced through packaging equipment during the production process.

[0003] The present invention provides an IGBT module packaging device (CN221596397U), comprising: a packaging body, a packaging electric push rod is arranged on the top of the packaging body, a pressure plate placed inside the packaging body is arranged on the telescopic shaft of the packaging electric push rod, a positioning seat placed below the pressure plate is arranged on the lower side of the inner wall of the packaging body, and a positioning groove for placing an IGBT module box body is opened on the top of the positioning seat; a stop rod is arranged at the corner of the top of the positioning seat, a limiting screw is arranged at the position of the bottom of the pressure plate corresponding to the stop rod, and an avoidance groove for avoiding the limiting screw is opened through the top of the packaging body; the limiting screw comprises a threaded column which is arranged through the bottom of the pressure plate and is placed just above the stop rod, a force application disk is arranged on the top of the threaded column, and a limiting disk is arranged at the bottom of the threaded column. The present invention has reasonable structure, high packaging quality and high packaging efficiency. However, during use, excess nano-silver paste will overflow along the packaging gap, and it is necessary to collect and store the nano-silver paste through a collection component or manually, which is inconvenient for users. In addition, when packaging the IGBT module, single-point positioning and pressing are mostly used, which may make the IGBT module incompletely packaged and the yield rate cannot be guaranteed.

[0004] To this end, we propose a packaging device for nano silver paste IGBT processing. Summary of the invention

[0005] The object of the present invention is to provide a packaging device for nano silver paste IGBT processing to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a packaging device for nano silver paste IGBT processing, comprising an outer support, a telescopic rod, an L-shaped fixing plate and a packaging base, a fixing platform is welded to the top of the upper end of the outer support, and a pre-opened hole is opened on the inner wall of one side of the fixing platform, an inner support is distributed on the inner wall side of the outer support, and the outer support of the inner support is distributed in a split manner, a telescopic cylinder is bolted to the upper end of the fixing platform, and a slide rail is opened on the upper outer wall of the telescopic cylinder, a slider is slidably connected to the upper end of the slide rail, and a connecting head is mounted on one end of the slider, the telescopic cylinder, the slider, the slide rail and the connecting head constitute a pneumatic telescopic structure, and a clamp for clamping a semiconductor device plate is bolted to the end of the connecting head away from the slider, the front ends of the clamp are slidably connected with L-shaped fixing plates, the middle parts of the upper ends of the L-shaped fixing plates on both sides are bolted to cross beams, and a plurality of limit heads are arranged on the inner wall side of the L-shaped fixing plate.

[0007] Preferably, a paste storage box for storing leaked nano silver paste is mounted on the top of the upper end of the inner support, and a connecting plate is bolted to the connection between the paste storage box and the inner support.

[0008] Preferably, a telescopic rod is bolted to the outer support along one side of the pre-opening, and a limit seat is provided at the connection between the telescopic rod and the outer support, and a downward pressure head is fixedly connected to the upper end of the telescopic rod along the pre-opening.

[0009] Preferably, an upper end of one side of the L-shaped fixing plate is in contact with the pressing head, and a recessed side of the L-shaped fixing plate is connected to the pressing head.

[0010] Preferably, the limit head is in contact with the upper surface of the semiconductor device board on all sides, and the bottom of the limit head is interference-connected with a soft cushion sleeve for flexible protection.

[0011] Preferably, a sliding groove is provided on one side of the L-shaped fixing plate close to the connecting head, and a return spring is fixedly connected to the L-shaped fixing plate along the middle of the sliding groove.

[0012] Preferably, a connecting block is fixedly connected to the lower end of the return spring, and a sliding connection is formed between the connecting block and the slide groove, and a fixed connection is formed between the connecting block and the connecting head.

[0013] Preferably, a docking groove is provided at the connection between the connecting block and the reset spring, and a fixing pin is provided between the bottom inner wall of the connecting block and the reset spring.

[0014] Preferably, a packaging base for packaging a semiconductor device board is provided in the middle of the fixing platform, and a plurality of paste leakage holes are provided on the inner wall of the packaging base.

[0015] Preferably, the operation method is as follows: the IGBT semiconductor device plate to be processed is clamped by the clamp 34, and at this time, the slide block 31 is driven to slide along the upper end of the slide rail 32 by the telescopic cylinder 3. When the semiconductor device plate to be packaged moves to the packaging base 6, it is only necessary to control the telescopic rod 4 to press down, drive the pressing head 42 to move downward, and the pressing head 42 presses the L-shaped fixing plate 5 to press down synchronously, so that a plurality of limit heads 52 are pressed down synchronously. When the semiconductor device plate is in the packaging process, the excess nano silver paste flows around along the packaging gap and falls into the paste leakage hole 61. Into the paste storage box 21, when the lower pressure head 42 is subsequently pulled out, the connecting block 56 is fixedly connected to the connecting head 33, and the L-shaped fixing plate 5 is reset and raised along the connecting block 56 by the reset spring 55. At the same time, the connecting block 56 is slidably connected to the L-shaped fixing plate 5 through the slide groove 54. The slide groove 54 has a certain limiting protection function, ensuring that the L-shaped fixing plate 5 is displaced in a vertical state during the reset process. Finally, when the user needs to take the nano silver paste in the paste storage box 21 in time, he only needs to pull the inner support 2 away from the outer support 1.

[0016] Compared with the prior art, the beneficial effects of the present invention are: when the packaging device for nano silver paste IGBT processing is used, the paste storage box is used to store excess nano silver paste, and at the same time, a split design is adopted between the support platform and the outer support platform. This connection method is simple to operate and convenient to use. The telescopic rod serves as a telescopic component to drive the pressing head to perform a telescopic operation, and the pressing head presses the L-shaped fixed plate to perform a synchronous pressing operation, so that several limit heads are pressed down synchronously, which satisfies the multi-point synchronous pressing operation of the semiconductor device board to be packaged. This structure is simple to operate and sensitive in action, and meets the needs of semiconductor device board packaging operations.

[0017] The L-shaped fixing plates on both sides are fixedly connected by a pair of cross beams, which ensures the function of multi-point synchronous pressing down of the semiconductor device plate. At the same time, the slide groove plays a certain limit protection function, ensuring that the L-shaped fixing plate is displaced in a vertical state during the resetting process, thereby ensuring the stability of the entire action structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0019] Figure 2 It is a schematic diagram of the connection structure between the outer support and the inner support of the present invention;

[0020] Figure 3 This is a schematic diagram of the L-shaped fixing plate structure of the present invention;

[0021] Figure 4 It is a schematic diagram of the split structure between the L-shaped fixing plate and the telescopic rod of the present invention;

[0022] Figure 5 For the present invention Figure 1 Schematic diagram of the local enlarged structure at point A in the middle.

[0023] In the figure: 1. outer support platform; 11. fixed platform; 12. pre-opening; 2. inner support platform; 21. paste storage box; 22. connecting plate; 3. telescopic cylinder; 31. slider; 32. slide rail; 33. connector; 34. fixture; 4. telescopic rod; 41. limit seat; 42. pressure head; 5. L-shaped fixing plate; 51. crossbeam; 52. limit head; 53. cushion cover; 54. slide groove; 55. reset spring; 56. connecting block; 57. docking groove; 6. packaging base; 61. paste leakage hole. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] Example 1

[0026] See also Figure 1-5 The present invention provides a technical solution: a packaging device for nano silver paste IGBT processing, comprising an outer support 1, a telescopic rod 4, an L-shaped fixing plate 5 and a packaging base 6, a fixing platform 11 is welded to the top of the upper end of the outer support 1, and a pre-opening 12 is provided on the inner wall of one side of the fixing platform 1, an inner support 2 is distributed on the inner wall side of the outer support 1, and the outer support 1 of the inner support 2 is split, a telescopic cylinder 3 is bolted to the upper end of the fixing platform 11, and a slide rail 32 is provided on the upper end outer wall of the telescopic cylinder 3, a slider 31 is slidably connected to the upper end of the slide rail 32, and a connector 33 is mounted on one end of the slider 31, the telescopic cylinder 3, the slider 31, the slide rail 32 and the connector 33 form a pneumatic telescopic structure, and the connector 33 is far away from one end of the slider 31. A clamp 34 for clamping the semiconductor device plate is bolted, and L-shaped fixing plates 5 are slidably connected to both sides of the front end of the clamp 34. A crossbeam 51 is bolted to the middle of the upper end of the L-shaped fixing plates 5 on both sides, and a plurality of limit heads 52 are arranged on the inner wall side of the L-shaped fixing plates 5. A paste storage box 21 for storing the leaked nano silver paste is mounted on the top of the upper end of the inner support 2, and a connecting plate 22 is bolted to the connection between the paste storage box 21 and the inner support 2. The paste storage box 21 is used to store excess nano silver paste. At the same time, a split design is adopted between the support 2 and the outer support 1. When the user needs to take the nano silver paste in the paste storage box 21 in time, he only needs to pull the inner support 2 away from the outer support 1. This connection method is simple to operate and convenient to use.

[0027] Example 2

[0028] See also Figure 1-5 The present invention provides a technical solution: a packaging device for nano silver paste IGBT processing, wherein a telescopic rod 4 is bolted to a side of a pre-opening 12 of an outer support 1, and a limit seat 41 is set at the connection between the telescopic rod 4 and the outer support 1, and a pressing head 42 is fixedly connected to the upper end of the telescopic rod 4 along the pre-opening 12. The telescopic rod 4 is used as a telescopic component to drive the pressing head 42 to perform a telescopic operation. When the semiconductor device plate to be packaged moves to the packaging base 6, it is only necessary to control the telescopic rod 4 to press down to drive the pressing head 42 to move downward, and the pressing head 42 presses the L-shaped fixed plate 5 to press down synchronously, so that a plurality of limit heads 52 are simultaneously pressed down. The step-by-step downward pressing can meet the multi-point synchronous downward pressing operation on the semiconductor device board to be packaged. This structure is simple to operate and sensitive in action, which meets the needs of semiconductor device board packaging operations. The upper end of one side of the L-shaped fixing plate 5 is in contact with the downward pressing head 42, and the recessed side of the L-shaped fixing plate 5 is connected to the downward pressing head 42. The limit head 52 is in contact with the upper surface of the semiconductor device board on all sides, and the bottom of the limit head 52 is interference-connected with a flexible protective cushion sleeve 53. The cushion sleeve 53 is made of flexible material as a flexible protection and plays a certain role in flexible protection, thereby reducing the possibility of hard damage to the semiconductor device board during the packaging process.

[0029] Example 3

[0030] See also Figure 1-5The present invention provides a technical solution: a packaging device for nano silver paste IGBT processing, wherein a slide groove 54 is provided on one side of an L-shaped fixing plate 5 close to a connector 33, and a return spring 55 is fixedly connected to the L-shaped fixing plate 5 along the middle of the slide groove 54, and a connecting block 56 is fixedly connected to the lower end of the return spring 55, and a sliding connection is formed between the connecting block 56 and the slide groove 54, and a fixed connection is formed between the connecting block 56 and the connector 33, and a docking groove 57 is provided at the connection between the connecting block 56 and the return spring 55, and a fixing pin is connected between the bottom inner wall of the connecting block 56 and the return spring 55, and the L-shaped fixing plates 5 on both sides are fixedly connected by a pair of crossbeams 51, and when the L-shaped fixing plate 5 on one side is pressed down by the pressing head 42 and moved, the L-shaped fixing plate 5 on the other side moves downward synchronously, thereby ensuring the function of the semiconductor device plate body to perform a multi-point synchronous pressing operation, and at the same time When the lower pressure head 42 is pulled out, the connection block 56 is fixedly connected to the connection head 33, and the L-shaped fixing plate 5 is reset and raised along the connection block 56 by the reset spring 55. At the same time, the connection block 56 is slidably connected to the L-shaped fixing plate 5 through the slide groove 54. The slide groove 54 plays a certain limit protection function to ensure that the L-shaped fixing plate 5 is displaced in a vertical state during the reset process, thereby ensuring the stability of the entire action structure. A packaging base 6 for packaging a semiconductor device board is provided in the middle of the fixed platform 11, and a plurality of leakage holes 61 are provided on the inner wall of the packaging base 6. The leakage holes 61 are interconnected with the paste storage box 21. When the semiconductor device board is in the process of packaging, the excess nano silver paste flows around along the packaging gap and falls into the paste storage box 21 from the leakage holes 61, so that the user can store and collect the excess nano silver paste conveniently.

[0031] Working principle: For this type of nano silver paste IGBT processing packaging device, the IGBT semiconductor device plate to be processed is first clamped by the clamp 34. At this time, the slide block 31 is driven to slide along the upper end of the slide rail 32 through the telescopic cylinder 3. When the semiconductor device plate to be packaged moves to the packaging base 6, it is only necessary to control the telescopic rod 4 to press down, drive the pressing head 42 to move downward, and the pressing head 42 presses the L-shaped fixing plate 5 to press down synchronously, so that several limit heads 52 are pressed down synchronously. When the semiconductor device plate is in the packaging process, the excess nano silver paste flows around along the packaging gap. The paste falls into the paste storage box 21 from the paste leakage hole 61, and then when the lower pressure head 42 is pulled out, the connecting block 56 is fixedly connected to the connecting head 33, and the L-shaped fixing plate 5 is reset and raised along the connecting block 56 by the reset spring 55. At the same time, the connecting block 56 is slidably connected to the L-shaped fixing plate 5 through the slide groove 54, and the slide groove 54 has a certain limiting protection function, which ensures that the L-shaped fixing plate 5 is displaced in a vertical state during the reset process. Finally, when the user needs to take the nano silver paste in the paste storage box 21 in time, he only needs to pull the inner support 2 away from the outer support 1.

Claims

1. A packaging device for nano silver paste IGBT processing, comprising an outer support (1), a telescopic rod (4), an L-shaped fixing plate (5) and a packaging base (6), characterized in that: A fixing platform (11) is welded to the top of the upper end of the outer support platform (1), and a pre-opened hole (12) is opened on the inner wall of one side of the fixing platform (1), an inner support platform (2) is distributed on the inner wall side of the outer support platform (1), and the outer support platform (1) of the inner support platform (2) is distributed in a split manner, a telescopic cylinder (3) is bolted to the upper end of the fixing platform (11), and a slide rail (32) is opened on the upper outer wall of the telescopic cylinder (3), the upper end of the slide rail (32) is slidably connected to a slider (31), and one end of the slider (31) is mounted A connecting head (33) is provided. The telescopic cylinder (3), the slider (31), the slide rail (32) and the connecting head (33) form a pneumatic telescopic structure. The end of the connecting head (33) away from the slider (31) is bolted with a clamp (34) for clamping a semiconductor device plate. Both sides of the front end of the clamp (34) are slidably connected with L-shaped fixing plates (5). The middle parts of the upper ends of the L-shaped fixing plates (5) on both sides are bolted with cross beams (51), and the inner wall side of the L-shaped fixing plates (5) is provided with a plurality of limit heads (52).

2. The packaging device for nano silver paste IGBT processing according to claim 1, characterized in that: A paste storage box (21) for storing leaked nano silver paste is mounted on the top of the upper end of the inner support platform (2), and a connecting plate (22) is bolted to the connection between the paste storage box (21) and the inner support platform (2).

3. The packaging device for nano silver paste IGBT processing according to claim 2, characterized in that: The outer support platform (1) is bolted with a telescopic rod (4) at one side of the pre-opening (12), and a limit seat (41) is provided at the connection between the telescopic rod (4) and the outer support platform (1). The telescopic rod (4) is fixedly connected to a lower pressure head (42) at the upper end thereof along the pre-opening (12).

4. The packaging device for nano silver paste IGBT processing according to claim 3, characterized in that: An upper end of one side of the L-shaped fixing plate (5) contacts the lower pressing head (42), and a recessed side of the L-shaped fixing plate (5) is connected to the lower pressing head (42).

5. The packaging device for nano silver paste IGBT processing according to claim 4, characterized in that: The limiting head (52) is in contact with the upper surface of the semiconductor device board body on all sides, and the bottom of the limiting head (52) is interference-connected with a soft cushion sleeve (53) for flexible protection.

6. The packaging device for nano silver paste IGBT processing according to claim 5, characterized in that: A sliding groove (54) is provided on one side of the L-shaped fixing plate (5) close to the connecting head (33), and a return spring (55) is fixedly connected to the L-shaped fixing plate (5) along the middle of the sliding groove (54).

7. The packaging device for nano silver paste IGBT processing according to claim 6, characterized in that: The lower end of the return spring (55) is fixedly connected to a connecting block (56), and the connecting block (56) and the slide groove (54) are slidably connected, and the connecting block (56) and the connecting head (33) are fixedly connected.

8. The packaging device for nano silver paste IGBT processing according to claim 7, characterized in that: A docking groove (57) is provided at the connection point between the connection block (56) and the return spring (55), and a fixing pin is provided between the bottom inner wall of the connection block (56) and the return spring (55).

9. The packaging device for nano silver paste IGBT processing according to claim 8, characterized in that: A packaging base (6) for packaging a semiconductor device board is arranged in the middle of the fixing platform (11), and a plurality of paste leakage holes (61) are provided on the inner wall of the packaging base (6).

10. The packaging device for nano silver paste IGBT processing according to claim 9, characterized in that: The operation method is as follows: the IGBT semiconductor device plate to be processed is clamped by a clamp (34), and at this time, the slide block (31) is driven to slide along the upper end of the slide rail (32) by the telescopic cylinder (3). When the semiconductor device plate to be packaged moves to the packaging base (6), it is only necessary to control the telescopic rod (4) to press down, drive the pressing head (42) to move downward, and the pressing head (42) presses the L-shaped fixing plate (5) to press down synchronously, so that a plurality of limit heads (52) are pressed down synchronously. When the semiconductor device plate is in the process of packaging, the excess nano silver paste flows around along the packaging gap and falls into the paste storage box (2) from the paste leakage hole (61). 1), and then when the lower pressure head (42) is withdrawn, the connection block (56) and the connection head (33) are fixedly connected, and the L-shaped fixing plate (5) is reset and raised along the connection block (56) through the reset spring (55). At the same time, the connection block (56) is slidably connected to the L-shaped fixing plate (5) through the slide groove (54). The slide groove (54) plays a certain limit protection function, ensuring that the L-shaped fixing plate (5) is displaced in a vertical state during the reset process. Finally, when the user needs to take the nano silver paste in the paste storage box (21) in time, it only needs to pull the inner support platform (2) away from the outer support platform (1).

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