Full-automatic bonding machine

Abstract

The invention relates to the technical field of bonding machines, and particularly discloses a full-automatic bonding machine which comprises a supporting frame, a calibration assembly, a spin-coating assembly, a vacuum laminating assembly and a mechanical arm are arranged in the supporting frame, the calibration assembly is located on the left side of the mechanical arm, the spin-coating assembly is located on the rear side of the mechanical arm, and the vacuum laminating assembly is located on the right side of the mechanical arm. The vacuum attaching assembly is located on the right side of the mechanical arm, the two feeding and discharging assemblies are arranged at the front end of the supporting frame, the mechanical arm is located on the rear sides of the two feeding and discharging assemblies, the overturning assembly is arranged at the left end of the spin-coating assembly, and the curing assembly is arranged on the vacuum attaching assembly. According to the invention, automatic production of semiconductors can be fully automatically carried out, manual intervention is not needed, the production speed is improved, the detected lamination thickness value is more accurate, and the lamination quality is improved.

Description

Technical Field

[0001] The invention relates to the technical field of bonding machines, and in particular to a fully automatic bonding machine. Background Art

[0002] Bonding machine is a key equipment used to bond chips or devices to substrate materials. It plays an important role in modern microelectronics technology. Wafer bonding technology achieves three-dimensional short-distance interconnection of integrated circuits by stacking wafers, thereby increasing the speed of information transmission and reducing the size of devices. Wafer bonding technology includes temporary bonding and permanent bonding. Temporary bonding has higher flexibility, while permanent bonding uses chemical and physical methods to tightly bond wafers.

[0003] Bonding machines can complete high-precision and high-efficiency bonding processes, connecting devices of different materials together, and provide important support for the electrical interconnection, functional integration and device packaging of microelectronic materials, optoelectronic materials and their nano-scale micro-electromechanical components. Such equipment usually supports a variety of bonding processes, such as anodic bonding, glass powder bonding, solder bonding, eutectic bonding, etc.

[0004] The existing technology still has the following areas for improvement: most existing bonding machines are manually operated and require operator assistance. The operation is highly complex and has high requirements for operators. Manual operation can easily lead to poor consistency in bonding quality, a high defective rate, and high costs, which reduces product quality and reliability and reduces bonding accuracy and stability. Summary of the invention

[0005] In order to solve the above problems existing in the prior art, the present invention provides a fully automatic bonding machine that can automatically perform semiconductor automated production without manual intervention, improve production speed, detect bonding thickness values ​​more accurately, and improve bonding quality.

[0006] The purpose of the present invention can be achieved through the following technical solutions: A fully automatic bonding machine comprises a supporting frame, wherein a calibration component, a spin coating component, a vacuum bonding component and a robotic arm are arranged inside the supporting frame, wherein the calibration component is located on the left side of the robotic arm, the spin coating component is located on the rear side of the robotic arm, and the vacuum bonding component is located on the right side of the robotic arm. Two loading and unloading components are arranged at the front end of the supporting frame, the robotic arm is located on the rear side of the two loading and unloading components, a flipping component is arranged at the left end of the spin coating component, and a curing component is arranged on the vacuum bonding component.

[0007] Furthermore, the support frame includes a support bracket, a vacuum bonding base, a manipulator base, a flip spin coating base and a calibration base, and a foot is fixedly provided at the four corners of the lower end of the support bracket, the manipulator base is located on the inner front side of the support bracket, the calibration base is located on the left side of the manipulator base, the vacuum bonding base is located on the right side of the manipulator base, and the flip spin coating base is located on the rear side of the manipulator base.

[0008] Furthermore, the vacuum bonding component is fixedly connected to the vacuum bonding base, the robot arm is fixedly connected to the robot arm base, the calibration component is fixedly connected to the calibration base, and the spin coating component is fixedly connected to the flip spin coating base.

[0009] Furthermore, the loading and unloading assembly includes a loading and unloading support frame, a loading and unloading platform, a loading and unloading bottom plate and a loading and unloading stand, the loading and unloading platform is fixedly connected to one side of the loading and unloading support frame, and a mounting frame is fixedly provided on the side of the loading and unloading support frame away from the loading and unloading platform, and the mounting frame is fixedly connected to the supporting bracket; A supporting platform is fixedly provided at the upper end of the loading and unloading platform, a loading and unloading stand is fixedly connected to the lower end of the loading and unloading platform, the lower end of the loading and unloading stand is fixedly connected to the loading and unloading bottom plate, one side of the loading and unloading stand is fixedly connected to one side of the loading and unloading support frame, and a loading and unloading controller is fixedly provided on the side of the loading and unloading stand away from the loading and unloading support frame.

[0010] Furthermore, the calibration assembly includes a calibrator, a calibration support frame and a calibration platform, the calibrator and the calibration platform are both fixedly connected to the upper end of the calibration support frame, the calibrator is located at the front end of the calibration platform, and a calibration controller is disposed inside the calibration support frame.

[0011] Further, the spin coating assembly includes a weighing instrument, a weighing shell, a weighing base plate and a first fixed end, the lower end of the weighing instrument is fixedly connected to the upper end of the weighing base plate, the upper end of the weighing instrument is fixedly provided with an upper wafer carrier, and an elastic member is fixedly provided at each of the four corners of the weighing base plate, and the upper ends of the four elastic members are fixedly connected to the upper end of the weighing shell; The weighing instrument is located inside the weighing shell, the lower end of the weighing shell is fixedly connected to the upper end of the first fixed end, a placement hole is opened at the middle position of the first fixed end, a rotating moving part is fixedly arranged in the placement hole, a linear moving part is fixedly arranged at the lower end of the rotating moving part, and a lower wafer carrier is fixedly arranged above the rotating moving part; A first vacuum interface is fixedly provided on the rotating moving part, an exhaust port and a recovery interface are fixedly provided on the first fixed end, the exhaust port is located on the right side of the rotating moving part, a UV pre-curing lamp assembly is fixedly provided on the weighing shell, and the UV pre-curing lamp assembly is located between the weighing base plate and the lower wafer carrier.

[0012] Furthermore, the flip assembly includes a flip support and a rotating cylinder, the flip support is fixedly connected to the left end of the first fixed end, the inner side of the flip support is fixedly connected to the rotating cylinder, and an adsorption carrier is slidably arranged on the rotating cylinder.

[0013] Furthermore, the vacuum bonding component includes a vacuum bonding support frame, an upper cover, a connecting plate and a vacuum chamber, a maintenance lifting cylinder is fixedly provided on the upper end of the vacuum bonding support frame, a lower end of the maintenance lifting cylinder is fixedly connected to the upper end of the connecting plate, a cover opening lifting cylinder is fixedly provided on the connecting plate, a lower end of the cover opening lifting cylinder is fixedly connected to the upper end of the upper cover, and a pressing cylinder and a side clamping cylinder are fixedly provided above the upper cover.

[0014] Furthermore, the curing component includes a second fixed end and a planar irradiation lamp, the lower end of the vacuum bonding support frame is fixedly connected to the upper end of the second fixed end, the second vacuum interface and the wafer lifting cylinder are fixedly arranged in the cavity hole opened by the second fixed end, the second vacuum interface is located on the left side of the wafer lifting cylinder, the vacuum chamber is fixedly connected to the upper end of the second fixed end, the upper end of the wafer lifting cylinder is fixedly arranged with a pick-and-place seat, the pick-and-place seat is located inside the vacuum chamber, the second vacuum interface is connected to the inside of the vacuum chamber, and an auxiliary pick-and-place hand is arranged at the right end of the second fixed end.

[0015] Furthermore, a mobile cylinder is fixedly provided on the upper end of the second fixed end, the mobile cylinder and the second fixed end are parallel, the upper end of the mobile cylinder is fixedly connected to the planar irradiation lamp, a drag chain is fixedly provided on the right end of the planar irradiation lamp, a push rod is slidably provided on the mobile cylinder, a universal bearing is provided on the end of the push rod, the universal bearing is connected to the second fixed end, and the lower end of the push rod is connected to the output shaft of the mobile lifting cylinder.

[0016] The beneficial effects of the present invention are: (1) By setting up the loading and unloading assembly and the calibration assembly, the technical effect that can be achieved is that the loading and unloading platform is fixedly connected to one side of the loading and unloading support frame, a mounting frame is fixedly arranged on the side of the loading and unloading support frame away from the loading and unloading platform, the mounting frame is fixedly connected to the supporting bracket, the upper end of the loading and unloading platform is fixedly arranged with the supporting platform, the lower end of the loading and unloading platform is fixedly connected with the loading and unloading stand, the lower end of the loading and unloading stand is fixedly connected with the loading and unloading bottom plate, one side of the loading and unloading stand is fixedly connected to one side of the loading and unloading support frame, and a loading and unloading controller is fixedly arranged on the side of the loading and unloading stand away from the loading and unloading support frame; Start the robotic arm, pick up the wafer from a supporting platform, move the wafer to the calibration platform, and the calibration platform drives the wafer to rotate. At the same time, the calibrator calibrates and detects the wafer. The bonding machine as a whole can fully automatically perform semiconductor automated production without human intervention, thereby increasing production speed, detecting the bonding thickness value more accurately, and improving the bonding quality. The loading and unloading components are used for loading wafers and glass and unloading bonding sheets respectively.

[0017] (2) By setting the spin coating component and the flipping component, the technical effect that can be achieved is that the lower end of the weighing instrument is fixedly connected to the upper end of the weighing base plate, the upper end of the weighing instrument is fixedly provided with an upper wafer carrier, an elastic member is fixedly provided at each of the four corners of the weighing base plate, the upper ends of the four elastic members are fixedly connected to the upper end of the weighing shell, the weighing instrument is located inside the weighing shell, the lower end of the weighing shell is fixedly connected to the upper end of the first fixed end, the flipping support is fixedly connected to the left end of the first fixed end, a rotating cylinder is fixedly provided on the inner side of the flipping support, and an adsorption carrier is slidably provided on the rotating cylinder; The robotic arm drives the wafer to the upper wafer carrier for weighing, and then moves the wafer to the lower wafer carrier, starts the linear motion parts and the rotary motion parts for spin coating, moves the lower wafer carrier upward and rotates, and the glue applicator moves to apply the adhesive to the center area of ​​the wafer and coat the wafer with glue. After completion, the lower wafer carrier descends and rotates at different speeds in different orders to evenly spread the adhesive on the surface of the wafer. The lower wafer carrier rises, and the robotic arm drives the wafer to the upper wafer carrier for weighing, and then drives the wafer to the pick-and-place seat. The spin coating component and the flipping component can accurately control the dosage of the coating and make the glue coating on the wafer more uniform. No manual operation is required, making the operation more automated.

[0018] (3) By setting up the vacuum bonding component and the curing component, the technical effect that can be achieved is that a maintenance lifting cylinder is fixedly arranged on the upper end of the vacuum bonding support frame, the lower end of the maintenance lifting cylinder is fixedly connected to the upper end of the connecting plate, a cover opening lifting cylinder is fixedly arranged on the connecting plate, the lower end of the cover opening lifting cylinder is fixedly connected to the upper end of the upper cover, a pressing cylinder and a side clamping cylinder are fixedly arranged above the upper cover, the lower end of the vacuum bonding support frame is fixedly connected to the upper end of the second fixed end, and a second vacuum interface and a wafer lifting cylinder are fixedly arranged in the cavity hole opened at the second fixed end; Start the pressing cylinder to press the wafer and glass, start the cover lifting cylinder and close the side clamping cylinder, the pressed bond sheet is placed on the pick-and-place seat, start the plane irradiation lamp to cure the bond sheet, and then the robotic arm moves the bond sheet to the adsorption carrier for flipping. The robotic arm then moves the bond sheet to the support platform for unloading. The vacuum bonding component and the curing component can mechanically cure the wafer, reduce operating movements, increase work speed, and operate in a vacuum chamber to reduce or eliminate bubbles, thereby improving the quality of pressing and material properties. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0020] Figure 1 A top view of the present invention; Figure 2 It is a front view of the support frame in the present invention; Figure 3 A top view of the support frame of the present invention; Figure 4 is a front view of the calibration component of the present invention; Figure 5 It is a left side view of the calibration component in the present invention; Figure 6 It is a top view of the loading and unloading assembly in the present invention; Figure 7 It is a front view of the loading and unloading assembly in the present invention; Figure 8 It is a right side view of the loading and unloading assembly in the present invention; Fig. 9 A top view of the spin coating assembly and the flip assembly of the present invention; Fig.10 It is a right side view of the spin coating assembly and the flip assembly in the present invention; Fig.11 It is a rear view of the spin coating assembly and the flip assembly in the present invention; Fig.12 It is a right side view of the vacuum bonding assembly of the present invention; Fig.13It is a left side view of the vacuum bonding assembly of the present invention; Fig.14 It is a left side view of the curing assembly in the present invention; Description of main component symbols: In the figure: 1. Loading and unloading assembly; 11. Mounting frame; 12. Loading and unloading support frame; 13. Loading and unloading platform; 14. Support platform; 15. Loading and unloading stand; 16. Loading and unloading controller; 17. Loading and unloading bottom plate; 2. Robotic arm; 3. Calibration assembly; 31. Calibrator; 32. Calibration support frame; 33. Calibration controller; 34. Calibration platform; 4. Support frame; 41. Support bracket; 42. Vacuum bonding base; 43. Robot base; 44. Ground foot; 45. Calibration base; 46. Flip spin coating base; 5. Spin coating assembly; 51. Upper wafer carrier; 52. Weighing instrument; 53. Elastic member; 54. Weighing shell; 55. Weighing bottom plate; 56. UV pre-curing lamp assembly; 57. Lower wafer carrier; 58. First fixed end; 59. First vacuum interface; 510. Linear motion member; 511. Rotary motion member; 512. Exhaust port; 513. Recovery interface; 514. Glue applicator; 6. Vacuum bonding assembly; 61. Maintenance lifting cylinder; 62. Opening and lifting cylinder; 63. Pressing cylinder; 64. Side clamping cylinder; 65. Upper cover; 66. Second vacuum interface; 67. Wafer lifting cylinder; 68. Vacuum chamber; 69. Pick-and-place seat; 610. Auxiliary pick-and-place handle; 611. Vacuum bonding support frame; 612. Connecting plate; 7. Flip assembly; 71. Adsorption carrier; 72. Rotating cylinder; 73. Flip support; 8. Curing assembly; 81. Plane irradiation lamp; 82. Drag chain; 83. Moving cylinder; 84. Second fixed end; 85. Moving lifting cylinder. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application; obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application without making creative work are within the scope of protection of the present application.

[0022] In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0023] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "set / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0024] Reference Figures 1 to 12 , is a fully automatic bonding machine disclosed in the present invention, including a supporting frame 4, wherein a calibration component 3, a spin coating component 5, a vacuum bonding component 6 and a robotic arm 2 are arranged inside the supporting frame 4, wherein the calibration component 3 is located on the left side of the robotic arm 2, the spin coating component 5 is located on the rear side of the robotic arm 2, the vacuum bonding component 6 is located on the right side of the robotic arm 2, two loading and unloading components 1 are arranged at the front end of the supporting frame 4, the robotic arm 2 is located on the rear side of the two loading and unloading components 1, a flipping component 7 is arranged at the left end of the spin coating component 5, and a curing component 8 is arranged on the vacuum bonding component 6.

[0025] The support frame 4 includes a support bracket 41, a vacuum bonding base 42, a manipulator base 43, a flip spin coating base 46 and a calibration base 45. A foot 44 is fixedly provided at the four corners of the lower end of the support bracket 41. The manipulator base 43 is located on the inner front side of the support bracket 41, the calibration base 45 is located on the left side of the manipulator base 43, the vacuum bonding base 42 is located on the right side of the manipulator base 43, and the flip spin coating base 46 is located on the rear side of the manipulator base 43.

[0026] The vacuum laminating assembly 6 is fixedly connected to the vacuum laminating base 42 , the robot arm 2 is fixedly connected to the robot arm base 43 , the calibration assembly 3 is fixedly connected to the calibration base 45 , and the spin coating assembly 5 is fixedly connected to the flip spin coating base 46 .

[0027] The loading and unloading assembly 1 includes an loading and unloading support frame 12, an loading and unloading platform 13, an loading and unloading base plate 17 and an loading and unloading stand 15. The loading and unloading platform 13 is fixedly connected to one side of the loading and unloading support frame 12. A mounting frame 11 is fixedly provided on the side of the loading and unloading support frame 12 away from the loading and unloading platform 13. The mounting frame 11 is fixedly connected to the supporting bracket 41.

[0028] A supporting platform 14 is fixedly provided at the upper end of the loading and unloading platform 13, a loading and unloading stand 15 is fixedly connected to the lower end of the loading and unloading platform 13, a loading and unloading bottom plate 17 is fixedly connected to the lower end of the loading and unloading stand 15, one side of the loading and unloading stand 15 is fixedly connected to one side of the loading and unloading support frame 12, and a loading and unloading controller 16 is fixedly provided on the side of the loading and unloading stand 15 away from the loading and unloading support frame 12.

[0029] The calibration assembly 3 includes a calibrator 31, a calibration support frame 32 and a calibration platform 34. The calibrator 31 and the calibration platform 34 are both fixedly connected to the upper end of the calibration support frame 32. The calibrator 31 is located at the front end of the calibration platform 34. A calibration controller 33 is arranged inside the calibration support frame 32.

[0030] The bonding machine as a whole can fully automatically carry out semiconductor automated production without manual intervention, thereby increasing production speed, detecting bonding thickness values ​​more accurately, and improving bonding quality. The loading and unloading components 1 are respectively used for loading wafers and glass and unloading bonding sheets.

[0031] The spin coating assembly 5 includes a weighing instrument 52, a weighing shell 54, a weighing base plate 55 and a first fixed end 58. The lower end of the weighing instrument 52 is fixedly connected to the upper end of the weighing base plate 55. The upper end of the weighing instrument 52 is fixedly provided with an upper wafer carrier 51. An elastic member 53 is fixedly provided at the four corners of the weighing base plate 55 respectively. The upper ends of the four elastic members 53 are fixedly connected to the upper end of the weighing shell 54.

[0032] The weighing instrument 52 is located inside the weighing shell 54. The lower end of the weighing shell 54 is fixedly connected to the upper end of the first fixed end 58. A placement hole is opened at the middle position of the first fixed end 58. A rotating moving part 511 is fixedly arranged in the placement hole. A linear moving part 510 is fixedly arranged at the lower end of the rotating moving part 511. A lower wafer carrier 57 is fixedly arranged above the rotating moving part 511.

[0033] A first vacuum interface 59 is fixedly provided on the rotating moving part 511, an exhaust port 512 and a recovery interface 513 are fixedly provided on the first fixed end 58, the exhaust port 512 is located on the right side of the rotating moving part 511, a UV pre-curing lamp assembly 56 is fixedly provided on the weighing shell 54, and the UV pre-curing lamp assembly 56 is located between the weighing base plate 55 and the lower wafer carrier 57.

[0034] The flip assembly 7 includes a flip support 73 and a rotating cylinder 72 . The flip support 73 is fixedly connected to the left end of the first fixed end 58 . The inner side of the flip support 73 is fixedly connected to the rotating cylinder 72 . An adsorption carrier 71 is slidably provided on the rotating cylinder 72 .

[0035] The spin coating assembly 5 and the flip assembly 7 can accurately control the dosage of the coating and can make the coating on the wafer more uniform without manual operation, making the operation more automated.

[0036] The vacuum bonding component 6 includes a vacuum bonding support frame 611, an upper cover 65, a connecting plate 612 and a vacuum chamber 68. A maintenance lifting cylinder 61 is fixedly provided on the upper end of the vacuum bonding support frame 611. The lower end of the maintenance lifting cylinder 61 is fixedly connected to the upper end of the connecting plate 612. A cover opening lifting cylinder 62 is fixedly provided on the connecting plate 612. The lower end of the cover opening lifting cylinder 62 is fixedly connected to the upper end of the upper cover 65. A pressing cylinder 63 and a side clamping cylinder 64 are fixedly provided above the upper cover 65.

[0037] The curing component 8 includes a second fixed end 84 and a planar irradiation lamp 81. The lower end of the vacuum bonding support frame 611 is fixedly connected to the upper end of the second fixed end 84. The second vacuum interface 66 and the wafer lifting cylinder 67 are fixedly arranged in the cavity hole opened by the second fixed end 84. The second vacuum interface 66 is located on the left side of the wafer lifting cylinder 67. The vacuum chamber 68 is fixedly connected to the upper end of the second fixed end 84. A pick-up and placement seat 69 is fixedly arranged on the upper end of the wafer lifting cylinder 67. The pick-up and placement seat 69 is located inside the vacuum chamber 68. The second vacuum interface 66 is connected to the inside of the vacuum chamber 68. An auxiliary pick-up and placement hand 610 is arranged at the right end of the second fixed end 84.

[0038] A moving cylinder 83 is fixedly provided on the upper end of the second fixed end 84, and the moving cylinder 83 is parallel to the second fixed end 84. A planar irradiation lamp 81 is fixedly connected to the upper end of the moving cylinder 83, and a drag chain 82 is fixedly provided on the right end of the planar irradiation lamp 81. A push rod is slidably provided on the moving cylinder 83, and a universal bearing is provided at the end of the push rod. The universal bearing acts as a hinge, and the universal bearing is connected to the second fixed end 84. The lower end of the push rod is connected to the output shaft of the moving lifting cylinder 85.

[0039] The vacuum laminating assembly 6 and the curing assembly 8 can mechanically cure the wafer, reduce operating movements, increase the working speed, and operate in the vacuum chamber 68, which can reduce or eliminate bubbles and improve the quality of lamination and material properties.

[0040] The working principle and use process of the present invention are as follows: start the robot arm 2, take the wafer from a supporting platform 14, move the wafer to the calibration platform 34, the calibration platform 34 drives the wafer to rotate, and the calibrator 31 performs calibration detection on the wafer; The robot arm 2 drives the wafer to move to the upper wafer carrier 51 for weighing, and then moves the wafer to the lower wafer carrier 57, starts the linear motion part 510 and the rotary motion part 511 for spin coating, moves the lower wafer carrier 57 upward and rotates, and the glue applicator 514 moves to apply the adhesive to the central area of ​​the wafer to coat the wafer. After completion, the lower wafer carrier 57 descends and rotates at different speeds in different orders to evenly spread the adhesive on the surface of the wafer. The lower wafer carrier 57 rises, and the robot arm 2 drives the wafer to move to the upper wafer carrier 51 for weighing, and then drives the wafer to move to the pick-and-place seat 69; Take the glass from another support platform 14, and the robot arm 2 drives the glass to move to the upper cover 65, and then the side clamping cylinder 64 is started to clamp the glass; Start the pressing cylinder 63 to press the wafer and the glass, start the cover lifting cylinder 62 and close the side clamping cylinder 64, the pressed bonding sheet is placed on the pick-and-place seat 69, start the plane irradiation lamp 81 to cure the bonding sheet, and then the robot arm 2 moves the bonding sheet to the adsorption carrier 71 for flipping, and then the robot arm 2 moves the bonding sheet to the support platform 14 for unloading.

[0041] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A fully automatic bonding machine, characterized in that: The invention comprises a support frame (4), wherein a calibration component (3), a spin coating component (5), a vacuum bonding component (6) and a robot arm (2) are arranged inside the support frame (4), wherein the calibration component (3) is located on the left side of the robot arm (2), the spin coating component (5) is located on the rear side of the robot arm (2), and the vacuum bonding component (6) is located on the right side of the robot arm (2); two loading and unloading components (1) are arranged at the front end of the support frame (4), and the robot arm (2) is located on the rear side of the two loading and unloading components (1); a flipping component (7) is arranged at the left end of the spin coating component (5), and a curing component (8) is arranged on the vacuum bonding component (6).

2. A fully automatic bonding machine according to claim 1, characterized in that: The support frame (4) comprises a support bracket (41), a vacuum laminating base (42), a manipulator base (43), a flip spin coating base (46) and a calibration base (45); a foot (44) is fixedly arranged at each of the four corners of the lower end of the support bracket (41); the manipulator base (43) is located at the inner front side of the support bracket (41); the calibration base (45) is located at the left side of the manipulator base (43); the vacuum laminating base (42) is located at the right side of the manipulator base (43); and the flip spin coating base (46) is located at the rear side of the manipulator base (43).

3. A fully automatic bonding machine according to claim 2, characterized in that: The vacuum laminating component (6) is fixedly connected to the vacuum laminating base (42), the robot arm (2) is fixedly connected to the robot arm base (43), the calibration component (3) is fixedly connected to the calibration base (45), and the spin coating component (5) is fixedly connected to the flip spin coating base (46).

4. The fully automatic bonding machine according to claim 2, characterized in that: The loading and unloading assembly (1) comprises a loading and unloading support frame (12), a loading and unloading platform (13), a loading and unloading bottom plate (17) and a loading and unloading stand (15); the loading and unloading platform (13) is fixedly connected to one side of the loading and unloading support frame (12); a mounting frame (11) is fixedly provided on the side of the loading and unloading support frame (12) away from the loading and unloading platform (13); and the mounting frame (11) is fixedly connected to the supporting bracket (41); A supporting platform (14) is fixedly arranged at the upper end of the loading and unloading platform (13), a loading and unloading stand (15) is fixedly connected to the lower end of the loading and unloading platform (13), a loading and unloading bottom plate (17) is fixedly connected to the lower end of the loading and unloading stand (15), one side of the loading and unloading stand (15) is fixedly connected to one side of the loading and unloading support frame (12), and a loading and unloading controller (16) is fixedly arranged on the side of the loading and unloading stand (15) away from the loading and unloading support frame (12).

5. The fully automatic bonding machine according to claim 1, characterized in that: The calibration assembly (3) comprises a calibrator (31), a calibration support frame (32) and a calibration platform (34); the calibrator (31) and the calibration platform (34) are both fixedly connected to the upper end of the calibration support frame (32); the calibrator (31) is located at the front end of the calibration platform (34); and a calibration controller (33) is arranged inside the calibration support frame (32).

6. The fully automatic bonding machine according to claim 1, characterized in that: The spin coating assembly (5) comprises a weighing instrument (52), a weighing shell (54), a weighing base plate (55) and a first fixed end (58); the lower end of the weighing instrument (52) is fixedly connected to the upper end of the weighing base plate (55); an upper wafer carrier (51) is fixedly arranged at the upper end of the weighing instrument (52); an elastic member (53) is fixedly arranged at each of the four corners of the weighing base plate (55); and the upper ends of the four elastic members (53) are fixedly connected to the upper end of the weighing shell (54); The weighing instrument (52) is located inside the weighing shell (54); the lower end of the weighing shell (54) is fixedly connected to the upper end of the first fixed end (58); a placement hole is provided at the middle position of the first fixed end (58); a rotating moving part (511) is fixedly arranged in the placement hole; a linear moving part (510) is fixedly arranged at the lower end of the rotating moving part (511); and a lower wafer carrier (57) is fixedly arranged above the rotating moving part (511); A first vacuum interface (59) is fixedly provided on the rotating moving part (511), an exhaust port (512) and a recovery interface (513) are fixedly provided on the first fixed end (58), the exhaust port (512) is located on the right side of the rotating moving part (511), a UV pre-curing lamp assembly (56) is fixedly provided on the weighing shell (54), and the UV pre-curing lamp assembly (56) is located between the weighing base plate (55) and the lower wafer carrier (57).

7. A fully automatic bonding machine according to claim 6, characterized in that: The flip assembly (7) comprises a flip support (73) and a rotating cylinder (72); the flip support (73) is fixedly connected to the left end of the first fixed end (58); the inner side of the flip support (73) is fixedly connected to the rotating cylinder (72); and an adsorption carrier (71) is slidably arranged on the rotating cylinder (72).

8. The fully automatic bonding machine according to claim 1, characterized in that: The vacuum laminating component (6) comprises a vacuum laminating support frame (611), an upper cover (65), a connecting plate (612) and a vacuum chamber (68); a maintenance lifting cylinder (61) is fixedly arranged at the upper end of the vacuum laminating support frame (611); the lower end of the maintenance lifting cylinder (61) is fixedly connected to the upper end of the connecting plate (612); a cover opening lifting cylinder (62) is fixedly arranged on the connecting plate (612); the lower end of the cover opening lifting cylinder (62) is fixedly connected to the upper end of the upper cover (65); a pressing cylinder (63) and a side clamping cylinder (64) are fixedly arranged above the upper cover (65).

9. A fully automatic bonding machine according to claim 8, characterized in that: The curing component (8) includes a second fixed end (84) and a planar irradiation lamp (81); the lower end of the vacuum bonding support frame (611) is fixedly connected to the upper end of the second fixed end (84); a second vacuum interface (66) and a wafer lifting cylinder (67) are fixedly arranged in the cavity hole opened by the second fixed end (84); the second vacuum interface (66) is located on the left side of the wafer lifting cylinder (67); the vacuum chamber (68) is fixedly connected to the upper end of the second fixed end (84); a pick-up and placement seat (69) is fixedly arranged at the upper end of the wafer lifting cylinder (67); the pick-up and placement seat (69) is located inside the vacuum chamber (68); the second vacuum interface (66) is connected to the inside of the vacuum chamber (68); and an auxiliary pick-up and placement hand (610) is arranged at the right end of the second fixed end (84).

10. The fully automatic bonding machine according to claim 9, characterized in that: A movable cylinder (83) is fixedly arranged at the upper end of the second fixed end (84), and the movable cylinder (83) and the second fixed end (84) are parallel. The upper end of the movable cylinder (83) is fixedly connected to the planar irradiation lamp (81), and a drag chain (82) is fixedly arranged at the right end of the planar irradiation lamp (81). A push rod is slidably arranged on the movable cylinder (83), and a universal bearing is arranged at the end of the push rod. The universal bearing is connected to the second fixed end (84), and the lower end of the push rod is connected to the output shaft of the movable lifting cylinder (85).

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