Small-size packaged light beam fast axis compression laser and manufacturing method thereof

By setting an optical fiber core inside the semiconductor laser for fast-axis compression of the beam, the integration and reliability problems caused by external lens shaping in the prior art are solved, and the compact shaping and high-reliability output of the spot are achieved.

CN119324370APending Publication Date: 2025-01-17WEIFANG HUAGUANG OPTOELECTRONICS CO LTD
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Patent Information

Application Number
CN202411316289.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-20
Publication Date
2025-01-17

AI Technical Summary

Technical Problem

When existing semiconductor lasers use lenses to perform spot shaping externally, the components are not integrated and have poor reliability, making it difficult to meet application scenarios that strictly require spot shape.

Method used

An optical fiber core is installed inside the laser. The optical fiber core is used as a lens with a circular cross-section. The optical fiber core is quickly compressed through the optical fiber core to achieve spot shaping, and the position of the optical fiber core is fixed through ultraviolet glue to ensure the morphology.

Benefits of technology

It realizes internal shaping of the spot, has a compact structure and complete function, meets the application needs of high integration and high reliability, and avoids the use of external optical systems.

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Abstract

The invention provides a small-size packaged light beam fast axis compression laser, and relates to the technical field of semiconductor laser packaging. The laser comprises a tube base and a tube cap. The tube seat comprises a base plate, and a tube tongue extending forwards is arranged on the front side face of the base plate. The tube tongue is provided with a die bonding plane, and a transition heat sink and a chip are sequentially arranged on the die bonding plane of the tube tongue from bottom to top. The front side of the chip is provided with an optical fiber core, and the optical fiber core is perpendicular to the fast axis of the chip. According to the small-size packaged light beam fast axis compression laser and the manufacturing method, the optical fiber core is arranged in the laser, the optical fiber core serves as the lens with the circular section, light beams emitted by the chip are subjected to fast axis compression, and therefore light spot shaping in the laser is achieved; and an application scene with relatively high requirements on component integration level and environment reliability can be met.
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Description

Technical Field

[0001] The invention relates to the technical field of semiconductor laser packaging, in particular to a small-size packaged beam fast-axis compression laser and a manufacturing method thereof. Background Art

[0002] One of the major advantages of semiconductor lasers is their small size. After packaging, the device size can be as small as a few millimeters in diameter. Typical specifications include TO9, TO5.6, TO3.8, and TO3.3, which represent device shell diameters of 9mm, 5.6mm, 3.8mm, and 3.3mm, respectively. This feature allows semiconductor lasers to be widely used in various applications with high integration and restrictions on component size.

[0003] Normally, the fast-axis divergence angle of an edge-emitting semiconductor laser beam is greater than the slow-axis divergence angle, and the spot is elliptical. Some specific applications require the spot emitted by the laser to be close to a square or a rectangle with a specific aspect ratio. In this case, the laser spot needs to be shaped to achieve fast-axis compression.

[0004] At present, the commonly used solutions are mostly to use optical systems such as lenses outside the laser to shape the light spot, which has the problems of low component integration and poor reliability. Summary of the invention

[0005] In response to the above problems, the present application provides a small-size packaged beam fast-axis compression laser and a manufacturing method. The laser performs spot shaping inside the laser, which can meet application scenarios with high requirements for component integration and environmental reliability.

[0006] The technical solution adopted by the present invention to solve the technical problem is:

[0007] A small-size packaged beam fast axis compression laser comprises a tube holder and a tube cap;

[0008] The tube seat comprises a base plate, and a tube tongue extending forward is arranged on the front side of the base plate;

[0009] The tube tongue has a crystal-fixing plane, and a transition heat sink and a chip are sequentially arranged on the crystal-fixing plane of the tube tongue from bottom to top;

[0010] An optical fiber core is arranged on the front side of the chip, and the optical fiber core is perpendicular to the fast axis of the chip.

[0011] Furthermore, the tube cap is fixedly connected to the base plate, and the tube tongue is inserted into the tube cap.

[0012] Furthermore, optical fiber supporting feet are respectively provided on both sides of the front end of the crystal-fixing plane, and both ends of the optical fiber core are respectively fixedly connected to the optical fiber supporting feet.

[0013] Furthermore, two ends of the optical fiber core are fixedly connected to the optical fiber supporting feet through ultraviolet glue.

[0014] Furthermore, an empty slot is arranged on the front side of the substrate, and a PD chip is arranged in the empty slot.

[0015] Furthermore, the bottom surface of the empty groove is an inclined surface inclined toward the rear side in a direction away from the crystal bonding plane.

[0016] Furthermore, the tube holder is provided with a first lead, a second lead and a third lead, the third lead is fixedly connected to the substrate by sintering, the first lead and the second lead pass through the substrate and are fixedly connected to the substrate by low-temperature insulating glass.

[0017] Furthermore, an anti-reflection film is provided on the surface of the optical fiber core.

[0018] A method for manufacturing a small-size packaged beam fast axis compression laser comprises the following steps:

[0019] First, sinter the transition heat sink and chip on the tube base;

[0020] Second, conduct aging and electrical parameter tests to select qualified products;

[0021] Third, the optical fiber cladding is stripped off by soaking in a corrosive liquid, and the optical fiber core is taken out;

[0022] Fourth, apply UV glue on both sides of the tube tongue, set up the optical fiber core and align it with the chip, then power on the laser, observe the light spot morphology formed after the optical fiber core is compressed, and fine-tune the optical fiber position to obtain the required light spot aspect ratio, and finally use UV light to irradiate the UV glue to solidify it;

[0023] Fifth, cap and test the laser to complete the entire packaging process.

[0024] Furthermore, in the third step, after the optical fiber core is taken out, an anti-reflection film of a corresponding wavelength is evaporated on the surface of the optical fiber core according to the wavelength of the laser.

[0025] The beneficial effects of the present invention are:

[0026] The embodiment of the present application provides a small-size packaged beam fast axis compression laser and a manufacturing method, which provides an optical fiber core in the laser and uses the optical fiber core as a lens with a circular cross section to compress the fast axis of the beam emitted from the chip, thereby realizing spot shaping inside the laser. The laser realizes spot shaping while ensuring the integrity of the internal structure, has a compact structure, complete functions, and can meet application scenarios with high requirements for component integration and environmental reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A schematic diagram of the three-dimensional structure of a small-size packaged beam fast-axis compression laser provided in an embodiment of the present application;

[0028] Figure 2 An exploded view of a small-size packaged beam fast-axis compression laser provided in an embodiment of the present application;

[0029] Figure 3 for Figure 2 A schematic diagram of the enlarged structure of part A;

[0030] Figure 4 Schematic diagram of the three-dimensional structure of the tube holder Figure 1 ;

[0031] Figure 5 A front view of the internal structure of a small-size packaged beam fast-axis compression laser provided in an embodiment of the present application;

[0032] Figure 6 for Figure 5 AA section view in;

[0033] Figure 7 for Figure 6 A schematic diagram of the enlarged structure of part B;

[0034] Figure 8 This is the beam propagation path diagram when there is no optical fiber core;

[0035] Fig. 9 Schematic diagram of the principle of fast-axis compression of the optical fiber core.

[0036] Fig.10 Schematic diagram of the three-dimensional structure of the tube holder Figure 2 ;

[0037] Fig.11 It is a schematic diagram of the installation structure of the first lead and the second lead.

[0038] In the figure: 1, tube base; 11, substrate; 111, empty slot; 12, tube tongue; 121, crystal bonding plane; 13, optical fiber support foot; 131, ultraviolet glue;

[0039] 2. Pipe cap;

[0040] 31. Transition heat sink; 32. Chip;

[0041] 4. Optical fiber core;

[0042] 5. PD chip;

[0043] 61, first lead; 62, second lead; 63, third lead;

[0044] 7. Low temperature insulating glass;

[0045] 8. Zener diode. DETAILED DESCRIPTION

[0046] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be described in detail below in conjunction with the drawings in the embodiments of the present application, and the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by those skilled in the art without creative work on the basis of the embodiments of the present application shall belong to the protection scope of the present application.

[0047] For the convenience of description, the coordinate system is defined as Figure 1 As shown, the left-right direction is the horizontal direction, the front-back direction is the longitudinal direction, and the up-down direction is the vertical direction.

[0048] like Figure 1 , Figure 2 and Figure 3 As shown, a small-size packaged beam fast axis compression laser comprises a tube base 1 and a tube cap 2. The tube base 1 comprises a substrate 11 in a substantially circular structure, and a tube tongue 12 extending forward is provided on the front side of the substrate 11. The tube cap 2 is fixedly connected to the substrate 11 of the tube base 1 in an airtight packaging manner, and the tube tongue 12 is inserted into the tube cap 2. The tube cap 2 can seal and protect the internal structure of the laser.

[0049] like Figure 6 and Figure 7 As shown, the tube tongue 12 has a flat crystal-fixing plane 121, on which the transition heat sink 31 and the chip 32 are sintered in sequence from bottom to top, and the internal structure is interconnected by gold wire. The front side of the chip 32 is provided with an optical fiber core 4, and the optical fiber core 4 is perpendicular to the fast axis of the chip 32.

[0050] like Figure 8 As shown, if there is no optical fiber core 4, after the laser beam is emitted from the chip 32, the fast axis angle before shaping is relatively large. Fig. 9 As shown, if there is an optical fiber core 4, since the optical fiber core 4 is mainly made of SiO2, the cross section is circular, and the structure is similar to a convex lens. When the laser beam is emitted from the chip 32, it immediately enters the optical fiber core 4 and refracts. Affected by the convex lens principle, the fast axis divergence angle after shaping is small, thereby achieving fast axis compression of the light spot. By adjusting the distance from the chip 32 to the optical fiber core 4, the fast axis compression ratio can be changed.

[0051] like Figure 3As shown, optical fiber supporting feet 13 are respectively provided on both sides of the front end of the crystal fixing plane 121 , and both ends of the optical fiber core 4 are respectively fixedly connected to the optical fiber supporting feet 13 .

[0052] As a specific implementation, both ends of the optical fiber core 4 in this embodiment are fixedly connected to the optical fiber supporting feet 13 via UV adhesive 131 .

[0053] like Figure 3 As shown, a hollow groove 111 is arranged on the front side of the substrate 11, the crystal fixing plane 121 of the tube tongue 12 faces the hollow groove 111, and a PD chip 5 is arranged in the hollow groove 111 for feeding back the laser optical power.

[0054] As a specific implementation manner, the empty slot 111 described in this embodiment is located at the geometric center of the substrate 11 shown, and the tube tongue 12 is located at the lower side of the empty slot 111 .

[0055] As a specific implementation method, Figure 3 and Figure 5 As shown, the side of the tube tongue 12 facing away from the hollow groove 111 (ie, the lower side) in this embodiment is an arc-shaped structure.

[0056] Furthermore, if Figure 6 As shown, the bottom surface of the empty groove 111 is an inclined surface, and is inclined toward the rear side (ie, inclined toward the rear and upward) along a direction away from the crystal bonding plane 121 .

[0057] like Figure 4 , Fig.10 and Fig.11 As shown, the tube holder 1 is provided with a first lead 61, a second lead 62 and a third lead 63, and the first lead 61, the second lead 62 and the third lead 63 are arranged in an inverted triangle structure. That is, the first lead 61 and the second lead 62 are located above the third lead 63, and the third lead 63 is located below the first lead 61 and the second lead 62, and between the first lead 61 and the second lead 62.

[0058] The third lead 63 is directly fixed to the lower part of the substrate 11 by sintering. The first lead 61 and the second lead 62 penetrate the substrate 11 and are fixedly connected to the substrate 11 through the low-temperature insulating glass 7. The substrate 11 is provided with a first lead 61 through hole and a second lead 62 through hole for accommodating the first lead 61 and the second lead 62.

[0059] As a specific implementation manner, the first lead wire 61 through-hole and the second lead wire 62 through-hole described in this embodiment are respectively located on two sides of the empty slot 111 .

[0060] As a specific implementation, the first lead 61 described in this embodiment is located on the left, and the second lead 62 is located on the right. The first lead 61 extends forward and is flattened at the end for welding, and the second lead 62 only protrudes a small amount from the low-temperature insulating glass 7 and the substrate 11.

[0061] Furthermore, if Figure 3 As shown, a Zener diode 8 is provided on the die-bonding plane 121 of the tube tongue 12 at the rear side of the transition heat sink 31 to improve the anti-static damage capability of the laser.

[0062] The small-size packaged beam fast axis compression laser provided in the present application has a large installation space because both the tube tongue 12 and the substrate 11 have large blank areas. Therefore, the internal structure can be increased according to actual application needs, which can meet the installation requirements of lasers with complex functions.

[0063] Furthermore, the surface of the optical fiber core 4 is provided with an anti-reflection film of a corresponding wavelength by evaporation, and the evaporation process may be sputtering or chemical vapor deposition. By providing an anti-reflection film of a corresponding wavelength, the power loss caused by reflection can be reduced.

[0064] A method for manufacturing a small-size packaged beam fast axis compression laser comprises the following steps:

[0065] First, the transition heat sink 31 and the chip 32 are sintered on the tube base 1, and the internal circuit is realized by ultrasonic gold ball bonding process.

[0066] Second, perform aging and electrical parameter tests to screen out products that meet the required parameters.

[0067] Third, the optical fiber cladding is stripped by soaking in a corrosive solution to remove the optical fiber core 4. Then, according to the wavelength of the laser, an anti-reflection film of the corresponding wavelength is evaporated on the surface of the optical fiber core 4, and the evaporation process can be sputtering or chemical vapor deposition.

[0068] Fourth, apply UV glue 131 on both sides of the optical fiber support foot 13 of the tube tongue 12, set up the optical fiber core 4 and align it with the chip 32, then power on the laser, observe the light spot morphology formed after the optical fiber core 4 is compressed, and fine-tune the optical fiber position to obtain the required light spot aspect ratio, finally use UV light to irradiate the UV glue 131 to cure the UV glue 131, and complete the fixation of the optical fiber core 4.

[0069] Fifth, cap and test the laser to complete the entire packaging process.

[0070] Other embodiments obtained by those skilled in the art by combining, splitting, reorganizing, etc. the embodiments of the present application on the basis of the embodiments provided in the present application do not exceed the protection scope of the present application.

[0071] The above specific implementation methods have detailed the purpose, technical solutions and beneficial effects of the embodiments of the present application. The above are only specific implementation methods of the embodiments of the present application and are not used to limit the protection scope of the embodiments of the present application. That is, any modifications, equivalent substitutions, improvements, etc. made on the basis of the embodiments of the present application should be included in the protection scope of the embodiments of the present application.

Claims

1. A small-size packaged beam fast axis compression laser, characterized in that: It comprises a tube seat (1) and a tube cap (2); The tube seat (1) comprises a base plate (11), and a tube tongue (12) extending forward is arranged on the front side of the base plate (11); The tube tongue (12) has a crystal-fixing plane (121), and a transition heat sink (31) and a chip (32) are sequentially arranged on the crystal-fixing plane (121) of the tube tongue (12) from bottom to top; An optical fiber core (4) is arranged on the front side of the chip (32), and the optical fiber core (4) is perpendicular to the fast axis of the chip (32).

2. The small-size packaged beam fast axis compression laser according to claim 1, characterized in that: The tube cap (2) is fixedly connected to the base plate (11), and the tube tongue (12) is inserted into the tube cap (2).

3. The small-size packaged beam fast axis compression laser according to claim 1, characterized in that: Optical fiber support feet (13) are respectively provided on both sides of the front end of the crystal fixing plane (121), and both ends of the optical fiber core (4) are respectively fixedly connected to the optical fiber support feet (13).

4. The small-size packaged beam fast axis compression laser according to claim 3, characterized in that: Both ends of the optical fiber core (4) are fixedly connected to the optical fiber supporting feet (13) via ultraviolet glue (131) respectively.

5. The small-size packaged beam fast axis compression laser according to claim 1, characterized in that: An empty slot (111) is provided on the front side of the substrate (11), and a PD chip (5) is provided in the empty slot (111).

6. The small-size packaged beam fast axis compression laser according to claim 5, characterized in that: The bottom surface of the empty groove (111) is an inclined surface that is inclined toward the rear side in a direction away from the crystal-fixing plane (121).

7. The small-size packaged beam fast axis compression laser according to claim 1, characterized in that: The tube holder (1) is provided with a first lead (61), a second lead (62) and a third lead (63); the third lead (63) is fixedly connected to the substrate (11) by sintering; the first lead (61) and the second lead (62) penetrate the substrate (11) and are fixedly connected to the substrate (11) by low-temperature insulating glass (7).

8. The small-size packaged beam fast axis compression laser according to claim 1, characterized in that: The surface of the optical fiber core (4) is provided with an anti-reflection film.

9. A method for manufacturing a small-size packaged beam fast axis compression laser according to any one of claims 1 to 8, characterized in that: The following steps are included: First, a transition heat sink (31) and a chip (32) are sintered on a tube base (1); Second, conduct aging and electrical parameter tests to select qualified products; Third, the optical fiber cladding is stripped by soaking in a corrosive liquid, and the optical fiber core (4) is taken out; Fourth, apply ultraviolet glue (131) on both sides of the tube tongue (12), set up the optical fiber core (4) and align it with the chip (32), then power on the laser, observe the morphology of the light spot formed after the optical fiber core (4) is compressed, and fine-tune the position of the optical fiber to obtain the required aspect ratio of the light spot, and finally use ultraviolet light to irradiate the ultraviolet glue (131) to solidify the ultraviolet glue (131); Fifth, cap and test the laser to complete the entire packaging process.

10. The method for manufacturing a small-size packaged beam fast axis compression laser according to claim 9, characterized in that: In the third step, after the optical fiber core (4) is taken out, an anti-reflection film of a corresponding wavelength is evaporated on the surface of the optical fiber core (4) according to the wavelength of the laser.