Circuit module sealing method and compressor driving circuit

Abstract

The embodiment of the invention provides a circuit module sealing method and a compressor driving circuit, a first power device combination, a second power device combination, a first driving circuit and a second driving circuit are packaged in a sealing circuit module, the first driving circuit is connected with the first power device combination, and the second driving circuit is connected with the second power device combination. The first power device combination is connected with the second power device combination, and pulse width modulation pins of the first driving circuit and the second driving circuit are led out from the sealing circuit module and are used for being connected with an input / output interface of the microcontroller unit; the sealing circuit module leads out pins of the first power device combination and the second power device combination and is used for being connected with a rectifier bridge; the sealing circuit module leads out pins of the first power device combination and the second power device combination and is used for being connected with a compressor. Compared with an original traditional circuit module, the sealed circuit module provided by the embodiment of the invention has the advantage that the occupied usable area in a printed circuit board is reduced.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of circuit technology, and in particular to a method for sealing a circuit module and a compressor driving circuit. Background Art

[0002] On the air-conditioning compressor PCB (Printed Circuit Board), there is a totem pole PFC (Power Factor Correction) boost circuit (totem pole PFC circuit) consisting of an inductor, two IGBTs (Printed Circuit Board Assembly) and a rectifier bridge. After the voltage is boosted to about 380V (volts), the microcontroller will control the inverter circuit of the air-conditioning compressor composed of six IGBTs to drive the air-conditioning compressor to operate.

[0003] That is to say, 8 IGBTs are used in the entire circuit on the high-voltage side of the air-conditioning compressor, which occupies a large PCB area. At the same time, during the PCB layout process, the traces between the devices are long, the PCB layout is difficult, and the EMC (Electromagnetic Compatibility) is reduced. Summary of the invention

[0004] The purpose of the embodiment of the present invention is to provide a method for sealing a circuit module and a compressor driving circuit. The specific technical solution is as follows:

[0005] In an embodiment of the present invention, a packaged circuit module is provided, wherein the packaged circuit module encapsulates a first power device combination, a second power device combination, a first drive circuit, and a second drive circuit, wherein the first drive circuit is connected to the first power device combination, the second drive circuit is connected to the second power device combination, and the first power device combination is connected to the second power device combination, wherein:

[0006] The packaged circuit module leads out the pulse width modulation pins of the first drive circuit and the second drive circuit, which are used to connect to the input and output interface of the microcontroller unit;

[0007] The packaged circuit module leads out pins of the first power device combination and the second power device combination for connecting to a rectifier bridge;

[0008] The packaged circuit module leads out pins of the first power device combination and the second power device combination for connection with a compressor.

[0009] Optionally, the first power device combination includes 2 power devices; and the second power device combination includes 6 power devices.

[0010] Optionally, the first power device combination includes a first power device and a second power device connected in series, the gates of the first power device and the second power device are connected to the first driving circuit, the collector of the first power device is connected to the collector of the power device in the second power device combination, the emitter of the first power device is connected to the collector of the second power device and leads to a first pin, the emitter of the second power device is led out as a second pin, and the collector of the first power device is led out as a third pin.

[0011] Optionally, the second power device combination includes three parallel-connected power device sub-combinations, and each of the power device sub-combinations includes two power devices.

[0012] Optionally, the power device sub-combinations respectively include a third power device and a fourth power device connected in series, and the collector and gate of the third power device and the fourth power device in each of the power device sub-combinations are connected to the second driving circuit;

[0013] The emitter of the third power device in each of the power device sub-combinations is connected to the collector of the fourth power device and leads to respective fourth pins;

[0014] The emitter of the fourth power device in each of the power device sub-combinations is led out as a fifth pin.

[0015] Optionally, one of the AC input live wires is connected to the AC input pin of the rectifier bridge, and the other of the AC input live wires is connected to the first pin of the packaged circuit module through an inductor; the AC input neutral wire is connected to the AC input pin of the rectifier bridge;

[0016] The positive output of the rectifier bridge is connected to the third pin of the packaged circuit module and the positive electrode of the electrolytic capacitor;

[0017] The negative electrode of the rectifier bridge is connected to the second pin of the packaged circuit module, the negative electrode of the electrolytic capacitor and the fifth pin of the packaged circuit module.

[0018] Optionally, a fourth pin of the packaged circuit module is connected to the compressor.

[0019] Optionally, the AC power input by the AC input live wire and the AC input neutral wire is converted into DC power after passing through the rectifier bridge and the electrolytic capacitor, and the DC power is converted into a preset voltage through a step-down circuit and provided to the microcontroller unit and the closed circuit module.

[0020] Optionally, the step-down circuit includes a resonant converter or a flyback switching power supply.

[0021] Optionally, the microcontroller unit provides a first pulse width modulation signal to the packaged circuit module to control the first power device combination of the packaged circuit module to increase the voltage of the electrolytic capacitor;

[0022] The microcontroller unit collects the voltage of the electrolytic capacitor through a sampling circuit, and when the voltage of the electrolytic capacitor rises to a preset voltage threshold, provides a second pulse width modulation signal to the sealing circuit module to control the fourth pin of the second power device combination of the sealing circuit module to output a changed driving voltage to drive the compressor to work.

[0023] Optionally, the power device comprises an insulated gate bipolar transistor.

[0024] An embodiment of the present invention also discloses a compressor drive circuit, which includes a sealed circuit module and a peripheral circuit. The peripheral circuit includes a microcontroller unit, a rectifier bridge, an electrolytic capacitor and an inductor. The rectifier bridge is connected to the AC input live wire and the AC input neutral wire of the bus to provide power for the sealed circuit module and the microcontroller unit. The sealed circuit module is connected to the compressor.

[0025] The packaged circuit module encapsulates a first power device combination, a second power device combination, a first drive circuit, and a second drive circuit, wherein the first drive circuit is connected to the first power device combination, the second drive circuit is connected to the second power device combination, and the first power device combination is connected to the second power device combination, wherein:

[0026] The packaged circuit module leads out the pulse width modulation pins of the first drive circuit and the second drive circuit, which are used to connect to the input and output interface of the microcontroller unit;

[0027] The packaged circuit module leads out pins of the first power device combination and the second power device combination for connecting to a rectifier bridge;

[0028] The packaged circuit module leads out pins of the first power device combination and the second power device combination for connection with a compressor.

[0029] Optionally, the first power device combination includes 2 power devices; and the second power device combination includes 6 power devices.

[0030] Optionally, the first power device combination includes a first power device and a second power device connected in series, the gates of the first power device and the second power device are connected to the first driving circuit, the collector of the first power device is connected to the collector of the power device in the second power device combination, the emitter of the first power device is connected to the collector of the second power device and leads to a first pin, the emitter of the second power device is led out as a second pin, and the collector of the first power device is led out as a third pin.

[0031] Optionally, the second power device combination includes three parallel-connected power device sub-combinations, and each of the power device sub-combinations includes two power devices.

[0032] Optionally, the power device sub-combinations respectively include a third power device and a fourth power device connected in series, and the collector and gate of the third power device and the fourth power device in each of the power device sub-combinations are connected to the second driving circuit;

[0033] The emitter of the third power device in each of the power device sub-combinations is connected to the collector of the fourth power device and leads to respective fourth pins;

[0034] The emitter of the fourth power device in each of the power device sub-combinations is led out as a fifth pin.

[0035] Optionally, one of the AC input live wires is connected to the AC input pin of the rectifier bridge, and the other of the AC input live wires is connected to the first pin of the packaged circuit module through an inductor; the AC input neutral wire is connected to the AC input pin of the rectifier bridge;

[0036] The positive output of the rectifier bridge is connected to the third pin of the packaged circuit module and the positive electrode of the electrolytic capacitor;

[0037] The negative electrode of the rectifier bridge is connected to the second pin of the packaged circuit module, the negative electrode of the electrolytic capacitor and the fifth pin of the packaged circuit module.

[0038] Optionally, a fourth pin of the packaged circuit module is connected to the compressor.

[0039] Optionally, the AC power input by the AC input live wire and the AC input neutral wire is converted into DC power after passing through the rectifier bridge and the electrolytic capacitor, and the DC power is converted into a preset voltage through a step-down circuit and provided to the microcontroller unit and the closed circuit module.

[0040] Optionally, the step-down circuit includes a resonant converter or a flyback switching power supply.

[0041] Optionally, the microcontroller unit provides a first pulse width modulation signal to the packaged circuit module to control the first power device combination of the packaged circuit module to increase the voltage of the electrolytic capacitor;

[0042] The microcontroller unit collects the voltage of the electrolytic capacitor through a sampling circuit, and when the voltage of the electrolytic capacitor rises to a preset voltage threshold, provides a second pulse width modulation signal to the sealing circuit module to control the fourth pin of the second power device combination of the sealing circuit module to output a changed driving voltage to drive the compressor to work.

[0043] Optionally, the power device comprises an insulated gate bipolar transistor.

[0044] An embodiment of the present invention also discloses an electrical appliance, which includes a compressor drive circuit, which includes a sealed circuit module and a peripheral circuit, which includes a microcontroller unit, a rectifier bridge, an electrolytic capacitor and an inductor. The rectifier bridge is connected to the AC input live wire and the AC input neutral wire of the bus to provide power for the sealed circuit module and the microcontroller unit, and the sealed circuit module is connected to the compressor.

[0045] The packaged circuit module encapsulates a first power device combination, a second power device combination, a first drive circuit, and a second drive circuit, wherein the first drive circuit is connected to the first power device combination, the second drive circuit is connected to the second power device combination, and the first power device combination is connected to the second power device combination, wherein:

[0046] The packaged circuit module leads out the pulse width modulation pins of the first drive circuit and the second drive circuit, which are used to connect to the input and output interface of the microcontroller unit;

[0047] The packaged circuit module leads out pins of the first power device combination and the second power device combination for connecting to a rectifier bridge;

[0048] The packaged circuit module leads out pins of the first power device combination and the second power device combination for connection with a compressor.

[0049] Optionally, the first power device combination includes 2 power devices; and the second power device combination includes 6 power devices.

[0050] Optionally, the first power device combination includes a first power device and a second power device connected in series, the gates of the first power device and the second power device are connected to the first driving circuit, the collector of the first power device is connected to the collector of the power device in the second power device combination, the emitter of the first power device is connected to the collector of the second power device and leads to a first pin, the emitter of the second power device is led out as a second pin, and the collector of the first power device is led out as a third pin.

[0051] Optionally, the second power device combination includes three parallel-connected power device sub-combinations, and each of the power device sub-combinations includes two power devices.

[0052] Optionally, the power device sub-combinations respectively include a third power device and a fourth power device connected in series, and the collector and gate of the third power device and the fourth power device in each of the power device sub-combinations are connected to the second driving circuit;

[0053] The emitter of the third power device in each of the power device sub-combinations is connected to the collector of the fourth power device and leads to respective fourth pins;

[0054] The emitter of the fourth power device in each of the power device sub-combinations is led out as a fifth pin.

[0055] Optionally, one of the AC input live wires is connected to the AC input pin of the rectifier bridge, and the other of the AC input live wires is connected to the first pin of the packaged circuit module through an inductor; the AC input neutral wire is connected to the AC input pin of the rectifier bridge;

[0056] The positive output of the rectifier bridge is connected to the third pin of the packaged circuit module and the positive electrode of the electrolytic capacitor;

[0057] The negative electrode of the rectifier bridge is connected to the second pin of the packaged circuit module, the negative electrode of the electrolytic capacitor and the fifth pin of the packaged circuit module.

[0058] Optionally, a fourth pin of the packaged circuit module is connected to the compressor.

[0059] Optionally, the AC power input by the AC input live wire and the AC input neutral wire is converted into DC power after passing through the rectifier bridge and the electrolytic capacitor, and the DC power is converted into a preset voltage through a step-down circuit and provided to the microcontroller unit and the closed circuit module.

[0060] Optionally, the step-down circuit includes a resonant converter or a flyback switching power supply.

[0061] Optionally, the microcontroller unit provides a first pulse width modulation signal to the packaged circuit module to control the first power device combination of the packaged circuit module to increase the voltage of the electrolytic capacitor;

[0062] The microcontroller unit collects the voltage of the electrolytic capacitor through a sampling circuit, and when the voltage of the electrolytic capacitor rises to a preset voltage threshold, provides a second pulse width modulation signal to the sealing circuit module to control the fourth pin of the second power device combination of the sealing circuit module to output a changed driving voltage to drive the compressor to work.

[0063] Compared with the related art, the embodiments of the present invention have at least the following advantages:

[0064] The packaged circuit module of the embodiment of the present invention encapsulates a first power device combination, a second power device combination, a first drive circuit and a second drive circuit, wherein the first drive circuit is connected to the first power device combination, the second drive circuit is connected to the second power device combination, and the first power device combination is connected to the second power device combination, wherein the packaged circuit module leads out the pulse width modulation pins of the first drive circuit and the second drive circuit for connecting to the input and output interface of the microcontroller unit MCU; the packaged circuit module leads out the pins of the first power device combination and the second power device combination for connecting to the rectifier bridge; the packaged circuit module leads out the pins of the first power device combination and the second power device combination for connecting to the compressor. In the packaged circuit module of the embodiment of the present invention, the power devices and drive circuits of the totem pole PFC circuit and the inverter circuit in the traditional circuit module are packaged to obtain the packaged circuit module, which reduces the area occupied in the printed circuit board compared with the original traditional circuit module, saves costs by sealing the power devices and drive circuits of the totem pole PFC circuit and the inverter circuit, and facilitates wiring on the printed circuit board, improves electromagnetic compatibility EMC, and saves costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0066] Figure 1 A structural block diagram of a circuit-on-package module provided in an embodiment of the present invention;

[0067] Figure 2 A schematic diagram of a circuit structure of a packaged circuit module provided in an embodiment of the present invention;

[0068] Figure 3 A schematic diagram of the circuit structure of a traditional circuit module. DETAILED DESCRIPTION

[0069] In order to make the purpose, technical scheme and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. However, it can be understood by those skilled in the art that in the embodiments of the present invention, many technical details are proposed to enable readers to better understand the present invention. However, even without these technical details and various changes and modifications based on the following embodiments, the technical scheme claimed in the present invention can also be implemented. The division of the following embodiments is for the convenience of description and should not constitute the specific implementation of the present invention.

[0070] Reference Figure 1 , is a structural block diagram of a packaged circuit module provided in an embodiment of the present invention, such as Figure 1 As shown, the packaged circuit module encapsulates a first power device combination, a second power device combination, a first drive circuit and a second drive circuit, the first drive circuit (drive IC) is connected to the first power device combination, the second drive circuit (drive IC) is connected to the second power device combination, and the first power device combination is connected to the second power device combination, wherein,

[0071] The sealing circuit module leads out the pulse width modulation (PWM) pins of the first driving circuit and the second driving circuit, which are used to connect with the input / output interface IO (Input / Output) of the microcontroller unit MCU (Microcontroller Unit);

[0072] The packaged circuit module leads out pins of the first power device combination and the second power device combination for connecting to a rectifier bridge;

[0073] The packaged circuit module leads out pins of the first power device combination and the second power device combination for connecting to a compressor, wherein the compressor may be an air-conditioning compressor.

[0074] In one embodiment of the present invention, the first power device combination may include two power devices IGBT, and these two power devices can realize the function of a totem pole PFC circuit; the second power device combination may include six power devices IGBT, and can realize the function of an air-conditioning compressor inverter circuit, that is, the packaged circuit module of the embodiment of the present invention may have eight power devices IGBT and two driver ICs.

[0075] The packaged circuit module of the embodiment of the present invention packages eight power devices IGBT and IGBT driver IC together to form a packaged circuit module. The packaged circuit module includes two E pins (i.e., the first pin E1 and the second pin E2) of the IGBT of the totem pole FPC circuit, a drive input pin (the third pin P), and control pins (i.e., the fifth pin, UN pin, UV pin, UW pin) and output pins (i.e., the sixth pin, U pin, V pin, W pin) of the 6-way IGBT inverter circuit.

[0076] The packaged circuit module of the embodiment of the present invention encapsulates a first power device combination, a second power device combination, a first drive circuit and a second drive circuit, the first drive circuit is connected to the first power device combination, the second drive circuit is connected to the second power device combination, and the first power device combination is connected to the second power device combination, wherein the packaged circuit module leads out the pulse width modulation pins of the first drive circuit and the second drive circuit for connecting to the input and output interface of the microcontroller unit MCU; the packaged circuit module leads out the pins of the first power device combination and the second power device combination for connecting to the rectifier bridge; the packaged circuit module leads out the pins of the first power device combination and the second power device combination for connecting to the compressor. In the packaged circuit module of the embodiment of the present invention, the totem pole PFC circuit and the power devices and the drive circuit of the inverter circuit in the traditional circuit module are packaged to obtain the packaged circuit module, which reduces the occupied area in the printed circuit board compared with the original traditional circuit module, saves costs by packaging the power devices and the drive circuit of the totem pole PFC circuit and the inverter circuit, and facilitates wiring on the printed circuit board, improves electromagnetic compatibility EMC, reduces EMI (Electromagnetic Interference), and saves costs.

[0077] Reference Figure 2 , is a schematic diagram of the circuit structure of a packaged circuit module provided in an embodiment of the present invention. In one embodiment of the present invention, the first power device combination includes a first power device IGBT1 and a second power device IGBT2 connected in series, the gates of the first power device IGBT1 and the second power device IGBT2 are connected to the first drive circuit, the collector of the first power device is connected to the collector of the power device in the second power device combination, the emitter of the first power device IGBT1 is connected to the collector of the second power device IGBT2 and leads to a first pin E1, the emitter of the second power device IGBT2 is led as a second pin E2, and the collector of the first power device IGBT1 is led as a third pin P.

[0078] In an embodiment of the present invention, the second power device combination may include three parallel-connected power device sub-combinations, and the power device sub-combinations may each include two IGBT power devices.

[0079] In one embodiment of the present invention, the power device sub-combination includes a third power device IGBT and a fourth power device IGBT connected in series, respectively, and the collector and gate of the third power device IGBT and the fourth power device IGBT in each of the power device sub-combinations are connected to the second drive circuit. Figure 2 There are three power device sub-combinations of the second power device in the packaged circuit module, namely power device sub-combination 1, power device sub-combination 2 and power device sub-combination 3, wherein power device sub-combination 1 may include IGBT3 and IGBT4, power device sub-combination 2 may include IGBT5 and IGBT6, and power device sub-combination 3 may include IGBT7 and IGBT8.

[0080] The emitter of the third power device IGBT in each of the power device sub-combinations is connected to the collector of the fourth power device IGBT and leads to respective fourth pins, wherein the fourth pins may include a U pin, a V pin and a W pin.

[0081] The emitter of the fourth power device IGBT in each of the power device sub-combinations is led out as a fifth pin, wherein the fifth pin may include a UN pin, a VN pin and a WN pin.

[0082] In one embodiment of the present invention, one path of the AC input live wire (L) of the busbar is connected to the AC input pin of the rectifier bridge, and the other path of the AC input live wire (L) is connected to the first pin E1 of the packaged circuit module through an inductor; the AC input neutral wire (N) of the busbar is connected to the AC input pin of the rectifier bridge; the positive output of the rectifier bridge is connected to the third pin P of the packaged circuit module and the positive electrode of the electrolytic capacitor; the negative electrode of the rectifier bridge is connected to the second pin E2 of the packaged circuit module, the negative electrode of the electrolytic capacitor and the fifth pin of the packaged circuit module.

[0083] Among them, the rectifier bridge is used to convert AC to DC. The rectifier bridge usually consists of four diodes that are connected in a specific configuration to achieve AC to DC conversion.

[0084] In one embodiment of the present invention, the fourth pins of the packaged circuit module, namely the U pin, the V pin and the W pin, can be connected to the compressor, so that the packaged circuit module can provide controllable alternating current to the compressor through the U pin, the V pin and the W pin.

[0085] In one embodiment of the present invention, the AC power inputted by the AC input live wire (L) and the AC input neutral wire (N) is converted into DC power after passing through the rectifier bridge and the electrolytic capacitor, and the DC power can be converted into a preset voltage through a step-down circuit and provided to the microcontroller unit MCU and the packaged circuit module. In a specific example, the step-down circuit may include a resonant converter LLC (Resonant Converter) or other step-down circuits such as a flyback switching power supply.

[0086] In an embodiment of the present invention, the step-down circuit may be included in the packaged circuit module or may be a peripheral circuit of the packaged circuit module. The step-down circuit may draw power from the bus after the rectifier bridge, and then convert the preset voltage by using a resonant converter LLC or a flyback switching power supply. For example, it may be converted into preset voltages of 5V and 15V, which are provided to the microcontroller unit MCU and the driver IC of the packaged circuit module for power supply respectively.

[0087] Reference Figure 2 The packaged circuit module of the embodiment of the present invention can realize the PFC boost and inversion functions. Specifically, the pulse width modulation pins (PWM pins) of the eight power devices IGBT and two driver ICs in the packaged circuit module can be connected to the input and output IO of the microcontroller unit MCU, so that the packaged circuit module can be controlled by the microcontroller unit MCU to work. Specifically, one way of the AC input live wire (L) is connected to the AC input pin of the rectifier bridge, and the other way of the AC input live wire (L) is connected to the E1 pin of the packaged circuit module through an inductor; the AC input neutral wire (N) is connected to the AC input pin of the rectifier bridge; the positive output of the rectifier bridge is connected to the P lead of the packaged circuit module and the positive electrode of the electrolytic capacitor; the negative electrode of the rectifier bridge is connected to the E2 pin of the packaged circuit module and the negative electrode of the electrolytic capacitor as well as the UN pin, UV pin, and UW pin of the packaged circuit module, and the U pin, V pin, and W pin of the packaged circuit module are connected to the air-conditioning compressor in three phases.

[0088] In one embodiment of the present invention, the microcontroller unit MCU may provide a first pulse width modulation PWM signal to the packaged circuit module to control the first power device combination of the packaged circuit module to increase the voltage of the electrolytic capacitor;

[0089] The microcontroller unit MCU collects the voltage of the electrolytic capacitor through a sampling circuit, and when the voltage of the electrolytic capacitor rises to a preset voltage threshold, provides a second pulse width modulation PWM signal to the sealing circuit module to control the fourth pin UVW of the second power device combination of the sealing circuit module to output a changed driving voltage to drive the compressor to work.

[0090] In the embodiment of the present invention, the AC input live wire (L) and the AC input neutral wire (N) of the busbar provide AC power which is converted into a stable DC power of about 310V through a rectifier bridge and an electrolytic capacitor; then, a 5V preset voltage is generated through a step-down circuit of a printed circuit board PCB of an air-conditioning compressor to provide a microcontroller unit MCU, and a 15V preset voltage is generated to provide a low-voltage side power supply for the packaged circuit module; after pre-charging by the rectifier bridge, the microcontroller unit MCU starts to work, and the internal program of the microcontroller unit MCU controls the boost algorithm of the totem pole PFC circuit according to a given PWM signal (a first pulse width modulation PWM signal) such as Figure 2 The two IGBTs on the left side of the packaged circuit module shown are working, and the inductance of the peripheral circuit plus the diode of the rectifier bridge form a totem pole PFC circuit. According to the working principle of the totem pole PFC circuit, the voltage of the electrolytic capacitor in the packaged circuit module continues to rise until the voltage rises to a preset voltage threshold, such as about 380V. At this time, the microcontroller unit MCU collects the voltage of the electrolytic capacitor through the sampling circuit, and the voltage of the bus can be determined by the voltage of the electrolytic capacitor, and the entire circuit of the packaged circuit module is controlled to be stable at about 380V. After the microcontroller unit MCU controls the entire circuit of the packaged circuit module to be stable at the preset voltage threshold, the microcontroller unit MCU gives a PWM signal (a first pulse width modulation PWM signal) according to the control algorithm of the compressor, so as to control the 6-way power device IGBT of the inverter circuit in the packaged circuit module through the PWM signal, and drive the compressor to work by changing the drive voltage output by the U pin, the V pin, and the W pin.

[0091] Reference Figure 3 , is a traditional circuit module provided by an embodiment of the present invention. The circuit module may include a totem pole PFC circuit and a power part circuit of an inverter circuit of a compressor. The AC input is connected to a rectifier bridge for pre-charging. Two power devices IGBTs are connected in series and then connected in parallel to the positive and negative ends of the rectifier bridge. The inductor connected in series with the AC input is connected to the middle of the two power devices IGBTs to form a totem pole PFC circuit. The control signal of the microcontroller unit MCU controls the operation of the totem pole PFC circuit through the driver IC (driver circuit) of the power device IGBT. After the bus voltage is boosted to about 380V (volts), the microcontroller unit MCU will drive the inverter circuit of the air conditioner compressor to operate.

[0092] The packaged circuit module of the embodiment of the present invention packages eight power devices IGBT and the IGBT driver IC together to form a packaged circuit module. The wiring between them is sealed in the packaged circuit module according to the above-mentioned Figure 2Specifically, the packaged circuit module of the embodiment of the present invention has two E pins (i.e., the first pin E1 and the second pin E2) of the power device IGBT in the totem pole PFC circuit, a drive input pin (the third pin P), and the control pins (i.e., the fifth pin, UN / UV / UW) and output pins (i.e., the sixth pin, U\V\W) of the six IGBTs in the inverter circuit.

[0093] By comparison, it can be seen that the packaged circuit module of the embodiment of the present invention has a simpler peripheral circuit design than the traditional circuit module, and the high-voltage power side devices of the packaged circuit module only need to be composed of a rectifier bridge, an inductor and an electrolytic capacitor; the packaged circuit module is easy to layout during the layout of the printed circuit board PCB of the air-conditioning compressor, and occupies a small area of ​​the printed circuit board PCB. Therefore, the wiring loop of the entire packaged circuit module is small, so it has high electromagnetic compatibility EMC and small EMI interference.

[0094] Based on the above-mentioned closed-loop circuit module, an embodiment of the present invention further discloses a compressor drive circuit, which includes a closed-loop circuit module and a peripheral circuit. The peripheral circuit may include a microcontroller unit, a rectifier bridge, an electrolytic capacitor and an inductor. The rectifier bridge is connected to the AC input live wire and the AC input neutral wire of the bus to provide power for the closed-loop circuit module and the microcontroller unit. The closed-loop circuit module is connected to the compressor.

[0095] The packaged circuit module encapsulates a first power device combination, a second power device combination, a first drive circuit, and a second drive circuit, wherein the first drive circuit is connected to the first power device combination, the second drive circuit is connected to the second power device combination, and the first power device combination is connected to the second power device combination, wherein:

[0096] The packaged circuit module leads out the pulse width modulation pins of the first drive circuit and the second drive circuit, which are used to connect to the input and output interface of the microcontroller unit;

[0097] The packaged circuit module leads out pins of the first power device combination and the second power device combination for connecting to a rectifier bridge;

[0098] The packaged circuit module leads out pins of the first power device combination and the second power device combination for connection with a compressor.

[0099] In an embodiment of the present invention, the first power device combination includes 2 power devices; the second power device combination includes 6 power devices.

[0100] In one embodiment of the present invention, the first power device combination includes a first power device and a second power device connected in series, the gates of the first power device and the second power device are connected to the first driving circuit, the collector of the first power device is connected to the collector of the power device in the second power device combination, the emitter of the first power device is connected to the collector of the second power device and leads to a first pin, the emitter of the second power device is led out as a second pin, and the collector of the first power device is led out as a third pin.

[0101] In an embodiment of the present invention, the second power device combination includes three parallel-connected power device sub-combinations, and each of the power device sub-combinations includes two power devices.

[0102] In one embodiment of the present invention, the power device sub-combinations respectively include a third power device and a fourth power device connected in series, and the collector and gate of the third power device and the fourth power device in each of the power device sub-combinations are connected to the second driving circuit;

[0103] The emitter of the third power device in each of the power device sub-combinations is connected to the collector of the fourth power device and leads to respective fourth pins;

[0104] The emitter of the fourth power device in each of the power device sub-combinations is led out as a fifth pin.

[0105] In one embodiment of the present invention, one AC input live wire is connected to the AC input pin of the rectifier bridge, and the other AC input live wire is connected to the first pin of the packaged circuit module through an inductor; the AC input neutral wire is connected to the AC input pin of the rectifier bridge;

[0106] The positive output of the rectifier bridge is connected to the third pin of the packaged circuit module and the positive electrode of the electrolytic capacitor;

[0107] The negative electrode of the rectifier bridge is connected to the second pin of the packaged circuit module, the negative electrode of the electrolytic capacitor and the fifth pin of the packaged circuit module.

[0108] In one embodiment of the present invention, the fourth pin of the packaged circuit module is connected to the compressor.

[0109] In one embodiment of the present invention, the AC power input by the AC input live wire and the AC input neutral wire is converted into DC power after passing through the rectifier bridge and the electrolytic capacitor, and the DC power is converted into a preset voltage through a step-down circuit and provided to the microcontroller unit and the closed circuit module.

[0110] In one embodiment of the present invention, the step-down circuit includes a resonant converter or a flyback switching power supply.

[0111] In one embodiment of the present invention, the microcontroller unit provides a first pulse width modulation signal to the packaged circuit module to control the first power device combination of the packaged circuit module to increase the voltage of the electrolytic capacitor;

[0112] The microcontroller unit collects the voltage of the electrolytic capacitor through a sampling circuit, and when the voltage of the electrolytic capacitor rises to a preset voltage threshold, provides a second pulse width modulation signal to the sealing circuit module to control the fourth pin of the second power device combination of the sealing circuit module to output a changed driving voltage to drive the compressor to work.

[0113] In one embodiment of the present invention, the power device comprises an insulated gate bipolar transistor.

[0114] The compressor driving circuit of the embodiment of the present invention may include a packaged circuit module, the packaged circuit module encapsulates a first power device combination, a second power device combination, a first driving circuit and a second driving circuit, the first driving circuit is connected to the first power device combination, the second driving circuit is connected to the second power device combination, and the first power device combination is connected to the second power device combination, wherein the packaged circuit module leads out the pulse width modulation pins of the first driving circuit and the second driving circuit for connecting to the input and output interface of the microcontroller unit MCU; the packaged circuit module leads out the pins of the first power device combination and the second power device combination for connecting to the rectifier bridge; the packaged circuit module leads out the pins of the first power device combination and the second power device combination for connecting to the compressor. In the packaged circuit module of the embodiment of the present invention, the power devices and the driving circuit of the totem pole PFC circuit and the inverter circuit in the traditional circuit module are packaged to obtain the packaged circuit module, which reduces the area occupied in the printed circuit board compared with the original traditional circuit module, saves costs by sealing the power devices and the driving circuit of the totem pole PFC circuit and the inverter circuit, and facilitates wiring on the printed circuit board, improves electromagnetic compatibility EMC, and saves costs.

[0115] As for the compressor driving circuit embodiment described above, since it is basically similar to the packaged circuit module embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the packaged circuit module embodiment.

[0116] Based on the above-mentioned compressor drive circuit, an embodiment of the present invention further discloses an electrical appliance, which includes a compressor drive circuit, and the compressor drive circuit includes a closed circuit module and a peripheral circuit. The peripheral circuit may include a microcontroller unit, a rectifier bridge, an electrolytic capacitor and an inductor. The rectifier bridge is connected to the AC input live wire and the AC input neutral wire of the bus to provide power for the closed circuit module and the microcontroller unit, and the closed circuit module is connected to the compressor.

[0117] The packaged circuit module encapsulates a first power device combination, a second power device combination, a first drive circuit, and a second drive circuit, wherein the first drive circuit is connected to the first power device combination, the second drive circuit is connected to the second power device combination, and the first power device combination is connected to the second power device combination, wherein:

[0118] The packaged circuit module leads out the pulse width modulation pins of the first drive circuit and the second drive circuit, which are used to connect to the input and output interface of the microcontroller unit;

[0119] The packaged circuit module leads out pins of the first power device combination and the second power device combination for connecting to a rectifier bridge;

[0120] The packaged circuit module leads out pins of the first power device combination and the second power device combination for connection with a compressor.

[0121] In an embodiment of the present invention, the first power device combination includes 2 power devices; the second power device combination includes 6 power devices.

[0122] In one embodiment of the present invention, the first power device combination includes a first power device and a second power device connected in series, the gates of the first power device and the second power device are connected to the first driving circuit, the collector of the first power device is connected to the collector of the power device in the second power device combination, the emitter of the first power device is connected to the collector of the second power device and leads to a first pin, the emitter of the second power device is led out as a second pin, and the collector of the first power device is led out as a third pin.

[0123] In an embodiment of the present invention, the second power device combination includes three parallel-connected power device sub-combinations, and each of the power device sub-combinations includes two power devices.

[0124] In one embodiment of the present invention, the power device sub-combinations respectively include a third power device and a fourth power device connected in series, and the collector and gate of the third power device and the fourth power device in each of the power device sub-combinations are connected to the second driving circuit;

[0125] The emitter of the third power device in each of the power device sub-combinations is connected to the collector of the fourth power device and leads to respective fourth pins;

[0126] The emitter of the fourth power device in each of the power device sub-combinations is led out as a fifth pin.

[0127] In one embodiment of the present invention, one AC input live wire is connected to the AC input pin of the rectifier bridge, and the other AC input live wire is connected to the first pin of the packaged circuit module through an inductor; the AC input neutral wire is connected to the AC input pin of the rectifier bridge;

[0128] The positive output of the rectifier bridge is connected to the third pin of the packaged circuit module and the positive electrode of the electrolytic capacitor;

[0129] The negative electrode of the rectifier bridge is connected to the second pin of the packaged circuit module, the negative electrode of the electrolytic capacitor and the fifth pin of the packaged circuit module.

[0130] In one embodiment of the present invention, the fourth pin of the packaged circuit module is connected to the compressor.

[0131] In one embodiment of the present invention, the AC power input by the AC input live wire and the AC input neutral wire is converted into DC power after passing through the rectifier bridge and the electrolytic capacitor, and the DC power is converted into a preset voltage through a step-down circuit and provided to the microcontroller unit and the closed circuit module.

[0132] In an embodiment of the present invention, the step-down circuit includes a resonant converter or a flyback switching power supply.

[0133] In one embodiment of the present invention, the microcontroller unit provides a first pulse width modulation signal to the packaged circuit module to control the first power device combination of the packaged circuit module to increase the voltage of the electrolytic capacitor;

[0134] The microcontroller unit collects the voltage of the electrolytic capacitor through a sampling circuit, and when the voltage of the electrolytic capacitor rises to a preset voltage threshold, provides a second pulse width modulation signal to the sealing circuit module to control the fourth pin of the second power device combination of the sealing circuit module to output a changed driving voltage to drive the compressor to work.

[0135] In one embodiment of the present invention, the power device comprises an insulated gate bipolar transistor.

[0136] Specifically, the electrical appliances may include but are not limited to air conditioners, refrigerators and other electrical appliances.

[0137] The electrical appliance of the embodiment of the present invention may include a compressor drive circuit, and the compressor drive circuit may include a packaged circuit module, the packaged circuit module encapsulates a first power device combination, a second power device combination, a first drive circuit, and a second drive circuit, the first drive circuit is connected to the first power device combination, the second drive circuit is connected to the second power device combination, and the first power device combination is connected to the second power device combination, wherein the packaged circuit module leads out the pulse width modulation pins of the first drive circuit and the second drive circuit for connecting to the input and output interface of the microcontroller unit MCU; the packaged circuit module leads out the pins of the first power device combination and the second power device combination for connecting to the rectifier bridge; the packaged circuit module leads out the pins of the first power device combination and the second power device combination for connecting to the compressor. In the packaged circuit module of the embodiment of the present invention, the power devices and drive circuits of the totem pole PFC circuit and the inverter circuit in the traditional circuit module are packaged to obtain the packaged circuit module, which reduces the area occupied in the printed circuit board compared with the original traditional circuit module, saves costs by sealing the power devices and drive circuits of the totem pole PFC circuit and the inverter circuit, and facilitates wiring on the printed circuit board, improves electromagnetic compatibility EMC, and saves costs.

[0138] As for the above-mentioned electrical appliance embodiment, since it is basically similar to the packaged circuit module embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the packaged circuit module embodiment.

[0139] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0140] Each embodiment in this specification is described in a related manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0141] The above description is only a preferred embodiment of the present invention and is not intended to limit the protection scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention are included in the protection scope of the present invention.

Claims

1. A circuit-on-package module, characterized in that: The packaged circuit module encapsulates a first power device combination, a second power device combination, a first drive circuit, and a second drive circuit, wherein the first drive circuit is connected to the first power device combination, the second drive circuit is connected to the second power device combination, and the first power device combination is connected to the second power device combination, wherein: The packaged circuit module leads out the pulse width modulation pins of the first drive circuit and the second drive circuit, which are used to connect to the input and output interface of the microcontroller unit; The packaged circuit module leads out pins of the first power device combination and the second power device combination for connecting to a rectifier bridge; The packaged circuit module leads out pins of the first power device combination and the second power device combination for connection with a compressor.

2. The circuit-on-package module according to claim 1, wherein: The first power device combination includes 2 power devices; the second power device combination includes 6 power devices.

3. The circuit-on-package module according to claim 2, wherein: The first power device combination includes a first power device and a second power device connected in series, the gates of the first power device and the second power device are connected to the first driving circuit, the collector of the first power device is connected to the collector of the power device in the second power device combination, the emitter of the first power device is connected to the collector of the second power device and leads to a first pin, the emitter of the second power device is led out as a second pin, and the collector of the first power device is led out as a third pin.

4. The circuit-on-package module according to claim 3, wherein: The second power device combination includes three parallel-connected power device sub-combinations, and each of the power device sub-combinations includes two power devices.

5. The circuit-on-package module according to claim 4, wherein: The power device sub-combinations respectively include a third power device and a fourth power device connected in series, and the collector and the gate of the third power device and the fourth power device in each of the power device sub-combinations are connected to the second driving circuit; The emitter of the third power device in each of the power device sub-combinations is connected to the collector of the fourth power device and leads to respective fourth pins; The emitter of the fourth power device in each of the power device sub-combinations is led out as a fifth pin.

6. The circuit-on-package module according to claim 5, wherein: One of the AC input live wires is connected to the AC input pin of the rectifier bridge, and the other of the AC input live wires is connected to the first pin of the closed circuit module through an inductor; the AC input neutral wire is connected to the AC input pin of the rectifier bridge; The positive output of the rectifier bridge is connected to the third pin of the packaged circuit module and the positive electrode of the electrolytic capacitor; The negative electrode of the rectifier bridge is connected to the second pin of the packaged circuit module, the negative electrode of the electrolytic capacitor and the fifth pin of the packaged circuit module.

7. The circuit-on-package module according to claim 5, wherein: The fourth pin of the packaged circuit module is connected to the compressor.

8. The circuit-on-package module according to claim 6, wherein: The AC power input from the AC input live wire and the AC input neutral wire is converted into DC power after passing through the rectifier bridge and the electrolytic capacitor, and the DC power is converted into a preset voltage through a step-down circuit and provided to the microcontroller unit and the closed circuit module.

9. The circuit-on-package module according to claim 8, wherein: The step-down circuit includes a resonant converter or a flyback switching power supply.

10. The circuit-on-package module according to claim 6, wherein: The microcontroller unit provides a first pulse width modulation signal to the packaged circuit module to control the first power device combination of the packaged circuit module to increase the voltage of the electrolytic capacitor; The microcontroller unit collects the voltage of the electrolytic capacitor through a sampling circuit, and when the voltage of the electrolytic capacitor rises to a preset voltage threshold, provides a second pulse width modulation signal to the sealing circuit module to control the fourth pin of the second power device combination of the sealing circuit module to output a changed driving voltage to drive the compressor to work.

11. The circuit-on-package module according to claim 1, wherein: The power device includes an insulated gate bipolar transistor.

12. A compressor driving circuit, characterized in that: The compressor drive circuit includes a sealed circuit module as described in any one of claims 1-11 and a peripheral circuit, wherein the peripheral circuit includes a microcontroller unit, a rectifier bridge, an electrolytic capacitor and an inductor, and the rectifier bridge is connected to the AC input live wire and the AC input neutral wire of the bus to provide power for the sealed circuit module and the microcontroller unit, and the sealed circuit module is connected to the compressor.

13. An electrical appliance, characterized in that: The electrical appliance includes a compressor drive circuit, which includes the compressor drive circuit as described in claim 11, and the peripheral circuit includes a microcontroller unit, a rectifier bridge, an electrolytic capacitor and an inductor. The rectifier bridge is connected to the AC input live wire and the AC input neutral wire of the bus to provide power for the packaged circuit module and the microcontroller unit, and the packaged circuit module is connected to the compressor.

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