Camera module and optical apparatus

Abstract

The present disclosure relates to a camera module and an optical apparatus including the same. The camera module includes: a fixed portion including a housing, a first circuit board portion coupled to the housing, and a magnet disposed on the housing; a movable portion disposed under the fixed portion so as to be spaced apart from the fixed portion; and a connecting portion including an upper end connected to the fixed portion and a lower end connected to the movable portion, and configured to support the movable portion. The movable portion includes: a holder spaced apart from the housing; a second circuit board portion coupled to the holder and disposed under the first circuit board portion; a coil arranged on the second circuit board to be positioned under the magnet; and an image sensor disposed on the second circuit board portion. A movable portion connected to a lower end of the connection portion is configured to move or tilt in a direction perpendicular to the optical axis by interaction between the magnet and the coil.

Description

[0001] This application is a divisional application of the patent application with international application number PCT / KR2020 / 015137 filed on November 2, 2020, application number 202080087964.8 entering the Chinese national phase, and titled "Camera Module and Optical Device". Technical Field

[0002] Embodiments relate to a camera module and an optical device including the camera module. Background Art

[0003] It is difficult to apply the technology of a voice coil motor (VCM) used in an existing general camera module to an ultra-small, low-power camera module, and thus research related thereto has been actively conducted.

[0004] The demand and production of electronic products such as smart phones and mobile phones equipped with cameras have increased. Cameras for mobile phones are developing toward high resolution and miniaturization. Therefore, actuators are also developing toward miniaturization, large aperture, and multifunctionality. In order to realize high-resolution cameras for mobile phones, it is necessary to improve the performance of cameras for mobile phones and their additional functions, such as autofocus, hand shake correction, and zoom. Summary of the invention

[0005] Technical issues

[0006] An embodiment provides a camera module and an optical device including the camera module, wherein an image sensor is coupled to an integral connection board and thus coupled to a second circuit board, thereby simplifying the process of assembling the camera, reducing the number of solder joints in a signal path of the image sensor, preventing the image sensor from becoming inoperable, and suppressing image noise.

[0007] Technical Solution

[0008] In one embodiment, a camera module includes: a housing; a first circuit board arranged on the housing; a magnet arranged on the housing; a retainer spaced apart from the housing; a second circuit board coupled to the retainer; a coil arranged on the second circuit board to align with the magnet; a connecting board including a first terminal; an image sensor arranged on the connecting board; a supporting member coupled to the first circuit board at one end thereof; and a connecting elastic member including a first coupler arranged on the retainer and coupled to the first terminal, a second coupler coupled to the other end of the supporting member, and a connector connecting the first coupler to the second coupler.

[0009] The connection elastic member may be arranged on a second surface of the holder opposite to a first surface of the holder, the first surface facing the second circuit board.

[0010] The support member may extend through the second circuit board and the holder.

[0011] The second circuit board may include a second terminal, and the connecting board may include a third terminal conductively connected to the second terminal of the second circuit board.

[0012] The second coupler may be spaced apart from the retainer.

[0013] The width of the connector may be smaller than any one of the width of the first coupler and the width of the second coupler.

[0014] The first circuit board may have a first bore hole exposing the image sensor, the second circuit board may have a second bore hole exposing the image sensor, and the holder may have a third bore hole corresponding to the connection board.

[0015] The first terminal of the connecting plate may include multiple first terminals, the connecting elastic member may include multiple connecting springs corresponding to the multiple first terminals, the supporting member may include multiple supporting members corresponding to the multiple connecting springs, and each of the multiple connecting springs may include a first coupler, a second coupler and a connector.

[0016] The connection elastic member may include a plurality of groups, and each of the plurality of groups may include a plurality of connection springs.

[0017] The connection plate may include a plurality of first terminals corresponding to the plurality of connection springs.

[0018] Each of the plurality of groups may be arranged on a corresponding one of the sides of the holder.

[0019] Each of the plurality of connecting springs may include a first coupler, a second coupler, and a connector.

[0020] The image sensor may be displaced or tilted in a direction perpendicular to an optical axis by virtue of the interaction between the magnet and the coil, and the optical axis may be perpendicular to one surface of the image sensor.

[0021] The camera module may include a lens module disposed on the image sensor and a filter disposed between the lens module and the image sensor. In addition, the camera module may include a filter holder coupled to the area around the image sensor of the connection board, and the filter may be disposed on the filter holder.

[0022] Beneficial Effects

[0023] The embodiments can simplify the process of assembling a camera, reduce the number of soldering points in a signal path of an image sensor, and prevent the image sensor from becoming inoperable and suppress image noise.

[0024] Furthermore, embodiments can simplify the assembly process and thus reduce tolerance stack-up, and have advantages in managing the alignment of the lens module.

[0025] In addition, the embodiment can have an effect of reducing material cost and manufacturing cost by reducing the number of components and the number of processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a perspective view of a camera module according to an embodiment of the present invention;

[0027] Figure 2 yes Figure 1 An exploded perspective view of the camera module is shown;

[0028] Figure 3 yes Figure 1 an assembled perspective view of the camera module shown with a cover member removed therefrom;

[0029] Figure 4 yes Figure 2 An exploded perspective view of the AF operating unit shown;

[0030] Figure 5 yes Figure 4 a perspective view of the bobbin, the sensing magnet, the balancing magnet, the first coil, the circuit board, the first position sensor, and the capacitor shown;

[0031] Figure 6 is a perspective view of the spool, housing, and circuit board;

[0032] Figure 7 is a bottom perspective view of the housing, bobbin, lower elastic member, magnet and circuit board;

[0033] Figure 8 yes Figure 2 A plan view of the image sensor unit shown;

[0034] Fig. 9 yes Figure 8 An exploded perspective view of an image sensor unit is shown;

[0035] Fig.10 yes Fig. 9 a perspective view of the first circuit board and the housing shown;

[0036] Fig.11 yes Fig. 9 a perspective view of the first circuit board, housing and magnet shown;

[0037] Fig.12 is an exploded perspective view of a second circuit board, a second coil, a second position sensor, an image sensor, a connecting plate, a supporting member, and a retainer;

[0038] Fig.13 yes Fig. 9 An exploded perspective view of the second circuit board, the image sensor, the connecting plate, the supporting member, the retainer and the connecting elastic member shown;

[0039] Fig.14 yes Figure 8 A bottom view of the image sensor unit is shown with the bottom cover removed therefrom;

[0040] Fig.15 is a partial enlarged view of the connecting elastic member;

[0041] Fig.16 is a bottom view of a single connecting spring;

[0042] Fig.17 is a view showing a connection spring connecting an elastic member;

[0043] Fig.18 yes Figure 1 A cross-sectional view of the camera module shown is taken along line AB;

[0044] Fig.19 yes Figure 1 A cross-sectional view of the camera module shown taken along line CD;

[0045] Fig. 20 yes Figure 8 A cross-sectional view of the image sensor unit shown is taken along line EF;

[0046] Fig.21 yes Figure 8 A cross-sectional view of the image sensor unit shown taken along line GH;

[0047] Fig. 22 is a perspective view of a camera module partially shown in cross-section with a bottom cover removed therefrom;

[0048] Fig.23 is a view showing a process of mounting an image sensor, a filter holder, and a filter on a connection board;

[0049] Fig.24 is a view showing a connection elastic member according to another embodiment;

[0050] Fig.25 is an exploded perspective view of a camera module according to another embodiment;

[0051] Fig.26 It is shown Fig.25 A view of an embodiment of the AF operating unit shown;

[0052] Fig. 27is a perspective view showing a portable terminal according to an embodiment; and

[0053] Fig.28 It is shown Fig. 27 A view of a configuration of a portable terminal shown in FIG. DETAILED DESCRIPTION

[0054] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0055] The technical idea of ​​the present invention can be implemented in many different forms and should not be interpreted as being limited to the following embodiments described herein. Without departing from the technical spirit and scope of the present invention, one or more components of the embodiments may be selectively combined or replaced with each other.

[0056] Unless otherwise specifically defined, the terms (including technical terms and scientific terms) used in the embodiments of the present invention have the same meanings as those commonly understood by those of ordinary skill in the art to which the present invention belongs. It will also be understood that commonly used terms, such as those defined in dictionaries, should be interpreted as having meanings consistent with their meanings in the context of the relevant technology.

[0057] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the present disclosure and the appended claims, the singular form is also intended to include the plural form, unless the context clearly indicates otherwise. The phrase "at least one (or one or more) of A, B and C" can be interpreted as including one or more of all combinations of A, B and C.

[0058] In addition, when describing the components of the present invention, terms such as "first", "second", "A", "B", "(a)", or "(b)" may be used. Since these terms are provided merely to distinguish components from one another, they do not limit the nature, sequence, or order of the components.

[0059] It will be understood that when an element is referred to as being "linked," "coupled," or "connected" to another element, the element may be directly "linked," "coupled," or "connected" to the other element, or may be "linked," "coupled," or "connected" to the other element via other elements interposed therebetween. Further, it will be understood that when an element is referred to as being formed "on" or "under" another element, it may be directly "on" or "under" the other element, or may be indirectly disposed relative to the other element with one or more intermediate elements therebetween. Further, it will also be understood that being "on" or "under" an element may mean an upward direction or a downward direction based on the element.

[0060] Hereinafter, the AF operation unit may be alternatively referred to as a "lens moving unit", "VCM (voice coil motor)", "actuator", or "lens moving device". Hereinafter, the term "coil" may be used interchangeably with a "coil unit", and the term "elastic member" may be used interchangeably with an "elastic unit" or a "spring".

[0061] In the following description, a “terminal” may be alternatively referred to as a “pad,” an “electrode,” a “conductive layer,” or a “joining portion.”

[0062] For ease of description, although the camera module according to the embodiment is described using a rectangular coordinate system (x, y, z), some other coordinate systems may be used to describe the lens moving device, and the embodiment is not limited thereto. In each figure, the X-axis direction and the Y-axis direction mean a direction perpendicular to the optical axis, that is, the Z-axis. The Z-axis direction, which is the direction of the optical axis OA, may be referred to as a "first direction", the X-axis direction may be referred to as a "second direction", and the Y-axis direction may be referred to as a "third direction".

[0063] The camera module according to the embodiment of the present invention can perform an “auto focus function.” Here, the “auto focus function” is to automatically focus the image of a subject on the image sensor surface.

[0064] In addition, the camera module according to the embodiment may perform a “hand shake correction” function. Here, the “hand shake correction” function may be used to prevent the contour of the captured image from being blurred due to vibration caused by the shaking of the user's hand when capturing a still image.

[0065] Figure 1 is a perspective view of a camera module 10 according to an embodiment of the present invention. Figure 2 yes Figure 1 An exploded perspective view of camera module 10 is shown. Figure 3 yes Figure 1 An assembled perspective view of the camera module is shown with the cover member 300 removed therefrom. Figure 4 yes Figure 2 An exploded perspective view of the AF operation unit 100 is shown. Figure 5 yes Figure 4 A perspective view of the bobbin 110 , the sensing magnet 180 , the balancing magnet 185 , the first coil 120 , the circuit board 190 , the first position sensor 170 , and the capacitor 195 is shown.

[0066] Figure 6 is a perspective view of the bobbin 110 , the housing 140 , and the circuit board 190 . Figure 7 is a bottom perspective view of the housing 140 , the bobbin 110 , the lower elastic member 160 , the magnet 130 , and the circuit board 190 .

[0067] Reference Figures 1 to 7 , the camera module 10 may include an AF operation unit 100 and an image sensor unit 350 .

[0068] The camera module 10 may further include at least one of a cover member 300, a lens module 400, and a base 210. The cover member 300 and the base 210 may define a housing.

[0069] The AF operation unit 100 may be coupled to the lens module 400 , and may move the lens module 400 in a direction of the optical axis OA or in a direction parallel to the optical axis to perform an auto focus function of the camera module 10 .

[0070] The image sensor unit 350 may include the image sensor 810, and may move the image sensor 810 in a direction perpendicular to the optical axis or may tilt or rotate the image sensor 810 with respect to the optical axis. The image sensor unit 350 may perform a hand shake correction function.

[0071] For example, image sensor 810 may be rotated about the x-axis, y-axis, and z-axis.

[0072] For example, the image sensor 810 may be movable in the x-axis direction, the y-axis direction, and the z-axis direction.

[0073] For example, image sensor 440 may be tilted relative to the x-axis, y-axis, and z-axis.

[0074] The AF operation unit 100 may alternatively be referred to as a “lens moving unit” or a “lens moving device.” Alternatively, the AF operation unit 100 may alternatively be referred to as a “first actuator” or an “AF operation driving unit.”

[0075] The image sensor unit 350 may alternatively be referred to as an “image sensor moving unit” or an “image sensor shift unit”, a “sensor moving unit” or a “sensor shift unit”. Alternatively, the image sensor unit 350 may alternatively be referred to as a “second actuator” or an “OIS driving unit”.

[0076] Reference Figure 4 , the AF operating unit 100 may include a bobbin 110 , a first coil 120 , a magnet 130 , and a housing 140 .

[0077] The AF operation unit 100 may further include an upper elastic member 150 and a lower elastic member 160 .

[0078] The AF operating unit 100 may include a first position sensor 170 , a circuit board 190 , and a sensing magnet 180 for an AF feedback operation. The AF operating unit 100 may further include at least one of a balancing magnet 185 and a capacitor 195 .

[0079] The bobbin 110 may be disposed in the housing 140 to be movable in the optical axis direction OA or the first direction (eg, the Z-axis direction) by electromagnetic interaction between the first coil 120 and the magnet 130 .

[0080] The bobbin 110 may have a bore to which the lens module 400 is coupled or mounted. For example, the bore in the bobbin 110 may be a through hole formed through the bobbin 110 in the optical axis direction and may have a circular shape, an elliptical shape, or a polygonal shape, but is not limited thereto.

[0081] The lens module 400 may include at least one lens and / or a lens barrel.

[0082] For example, the lens module 400 may include at least one lens and a lens barrel receiving the at least one lens. However, the configuration of the lens module is not limited to the lens barrel, and the lens module may have any configuration as long as the configuration can support at least one lens.

[0083] For example, the lens module 400 may be threadedly engaged with the bobbin 110. Alternatively, the lens module 400 may be coupled to the bobbin 110 using, for example, an adhesive (not shown). The light having passed through the lens module 400 may be radiated to the image sensor 810 through the filter 610.

[0084] The bobbin 110 may include a protrusion 111 provided on an outer surface thereof.

[0085] For example, although the protrusion 111 may protrude in a direction parallel to a line perpendicular to the optical axis OA, the present invention is not limited thereto.

[0086] The protrusion 111 of the bobbin 110 may correspond to the groove 25a in the housing 140 and may be arranged in the groove 25a in the housing 140 to minimize or prevent the bobbin 110 from rotating around the optical axis beyond a predetermined range. In addition, the protrusion 111 may serve as a stopper configured to move the bobbin 110 within a predetermined range in the optical axis direction (e.g., in a direction from the upper elastic member 150 toward the lower elastic member 160) in response to an external impact or the like.

[0087] The bobbin 110 may have a first avoidance groove 112a formed in its upper surface for avoiding spatial interference with the first frame connector 153 of the upper elastic member 150. The bobbin 110 may have a second avoidance groove 112b formed in its lower surface for avoiding spatial interference with the second frame connector 163 of the lower elastic member 160.

[0088] The bobbin 110 may include a first coupler 116a configured to be coupled and fixed to the upper elastic member 150. For example, although the first coupler 116a of the bobbin 110 may have a flat shape, the present disclosure is not limited thereto. In another embodiment, the first coupler 116a of the bobbin 110 may have a protrusion or groove shape.

[0089] The bobbin 110 may include a second coupler 116b configured to be coupled and fixed to the lower elastic member 160. For example, although the second coupler 116b may have a flat shape, the present disclosure is not limited thereto. In another embodiment, the second coupler 116b may have a convex or concave shape.

[0090] Reference Figure 5 The outer surface of the bobbin 110 may have a groove formed therein, in which the first coil 120 is placed, assembled or arranged. The groove in the bobbin 110 may have a shape corresponding to the shape of the first coil 120, that is, a closed curve shape (eg, a ring shape).

[0091] The bobbin 110 may be provided with a first placement groove therein, in which the sensing magnet 180 is placed, assembled, fixed or arranged. In addition, the bobbin 110 may be provided with a second placement groove in its outer surface, in which the balancing magnet 185 is placed, assembled, fixed or arranged. For example, the first placement groove and the second placement groove in the bobbin 110 may be formed in the outer surfaces of the bobbin 110 that are opposite to each other.

[0092] The first coil 120 may be disposed at the bobbin 110 or may be coupled to the bobbin 110. For example, the first coil 120 may be disposed on an outer surface of the bobbin 110.

[0093] The first coil 120 may surround the outer surface of the bobbin 110 around the optical axis OA in a winding direction, but is not limited thereto.

[0094] Although the first coil 120 may be directly wound around the outer surface of the bobbin 110, the present disclosure is not limited thereto. In another embodiment, the first coil 120 may be implemented as a coil ring wound around the bobbin 110, or as a coil block having an angled shape.

[0095] The coil 120 may be supplied with power or a driving signal.

[0096] The power or driving signal supplied to the first coil 120 may be a DC signal, an AC signal, or a signal including both a DC component and an AC component, and may be a voltage type or a current type.

[0097] When a driving signal (eg, a driving current) is supplied to the first coil 120 , an electromagnetic force generated by an electromagnetic interaction with the first magnet may be generated, thereby moving the bobbin 110 in the direction of the optical axis OA by the generated electromagnetic force.

[0098] At the initial position of the AF operation unit, the bobbin 110 may move upward or downward, which is referred to as bidirectional driving of the AF operation unit. Alternatively, at the initial position of the AF operation unit, the bobbin 110 may move upward, which is referred to as unidirectional driving.

[0099] At an initial position of the AF operation unit, the first coil 120 may be arranged to correspond to the magnet 130 arranged at the housing 140 in a direction parallel to a line perpendicular to the optical axis OA and extending through the optical axis.

[0100] For example, the AF operating unit may include the bobbin 110 and components (eg, the first coil 120 , the sensing magnet 180 , and the balancing magnet 185 ) coupled to the bobbin 110 . The AF operating unit may further include a lens module 400 .

[0101] The initial position of the AF operating unit may be an original position of the AF operating unit in a state where no power is applied to the first coil 120, or a position where the AF operating unit is located as a result of elastic deformation of the upper elastic member 150 and the lower elastic member 160 only due to the weight of the AF operating unit.

[0102] In addition, the initial position of the spool 110 may be a position where the AF operation unit is located when gravity acts in a direction from the spool 110 to the base 210 or when gravity acts in a direction from the base 210 to the spool 110 .

[0103] The sensing magnet 180 may provide a magnetic field detected by the first position sensor 170 , and the balancing magnet 185 may be used to offset the effect of the magnetic field of the sensing magnet 180 and establish a weight balance with respect to the sensing magnet 180 .

[0104] The sensing magnet 180 may alternatively be referred to as a “sensor magnet”.

[0105] The sensing magnet 180 may be disposed at the bobbin 110 or may be coupled to the bobbin 110 .

[0106] The sensing magnet 180 may be disposed to face the first position sensor 170 .

[0107] The balance magnet 185 may be disposed at the bobbin 110 or may be coupled to the bobbin 110. For example, the balance magnet 185 may be disposed opposite to the sensing magnet 180.

[0108] Although each of the sensing magnet 180 and the balancing magnet 185 may be a unipolar magnet having one N pole and one S pole, the present disclosure is not limited thereto. In another embodiment, each of the sensing magnet 180 and the balancing magnet 185 may be a bipolar magnet having two N poles and two S poles, or a quadrupole magnet.

[0109] The sensing magnet 180 may move in the optical axis direction together with the bobbin 110 , and the first position sensor 170 may detect the intensity or magnetic force of the magnetic field of the sensing magnet 180 moving in the optical axis direction and may output an output signal corresponding to the detection result.

[0110] For example, the intensity or magnetic force of the magnetic field detected by the first position sensor 170 may vary according to the displacement of the bobbin 110 in the optical axis direction. Therefore, the first position sensor 170 may output an output signal proportional to the detected magnetic field intensity, and the output signal from the first position sensor 170 may be used to detect the displacement of the bobbin 110 in the optical axis direction.

[0111] The housing 140 accommodates the bobbin 110 therein, and supports the magnet 130 , the first position sensor 170 , and the circuit board 190 .

[0112] Reference Figure 4 , Figure 6 and Figure 7 The housing 140 may be configured as a hollow cylinder as a whole. For example, the housing 140 may have a polygonal (eg, rectangular or octagonal) or circular bore, and the bore in the housing 140 may be a through hole formed through the housing 140 in the optical axis direction.

[0113] The housing 140 may include a side corresponding to or facing the side plate 302 of the cover member 300 and a corner corresponding to or facing the corner of the cover member 300 .

[0114] In order to prevent a direct collision with the inner surface of the upper plate 301 of the cover member 300 , the housing 140 may include a stopper 145 provided at an upper portion, an upper surface, or an upper end thereof.

[0115] To prevent the lower surface of the housing 140 from colliding with the circuit board 800 of the image sensor 350, the housing 140 may further include a stopper 147 protruding from the lower surface thereof. Here, the stopper 145 or 147 may alternatively be referred to as a "boss" or "bump".

[0116] Reference Figure 4 , the housing 140 may have a mounting groove (or seating groove) 14a configured to receive the circuit board 190 therein. The mounting groove 14a may have a shape corresponding to the shape of the circuit board 190.

[0117] Reference Figure 6 , the housing 140 may have an opening 141 through which the terminals B1 to B6 of the terminal member 95 of the circuit board 190 are exposed. The opening 141 may be formed in a side portion of the housing 140 .

[0118] An upper portion, an upper end or an upper surface of the housing 140 may be provided with at least one first coupler to be coupled to the first outer frame 152 of the upper elastic member 150 .

[0119] The lower portion, lower end or lower surface of the housing 140 may be provided with a second coupler to be coupled and fixed to the second outer frame 162 of the lower elastic member 160. For example, each of the first and second couplers of the housing 140 may have a shape of a protrusion, a groove or a flat surface.

[0120] The magnet 130 may be disposed at the housing 140. For example, the magnet 130 may be disposed at a side of the housing 140. The magnet 130 may be an AF operation magnet for an AF operation.

[0121] For example, although the magnet 130 may include a first magnet and a second magnet disposed at two sides located opposite to each other, the present disclosure is not limited thereto. In another embodiment, the magnet 130 may be disposed at a corner of the housing 140 .

[0122] The magnet 130 may include two or more magnets.

[0123] At an initial position of the AF operation unit, the first magnet 130 may be disposed at the housing to partially overlap the first coil 120 in a direction parallel to a line perpendicular to and extending through the optical axis OA.

[0124] Although each of the first magnet 130-1 and the second magnet 130-2 may be a single-pole magnet, the present disclosure is not limited thereto. In another embodiment, each of the first magnet 130-1 and the second magnet 130-2 may be a double-pole magnet having two N poles and two S poles, or a quadrupole magnet.

[0125] The circuit board 190 may be arranged at the housing 140, and the first position sensor 170 may be arranged at the circuit board 190 or mounted to the circuit board 190. For example, the circuit board 190 may be arranged in the mounting groove 14a in the housing 140, and the terminals of the circuit board 190 may be exposed to the outside of the housing 140 through the opening 141 in the housing 140.

[0126] The circuit board 190 may include a terminal member (or terminal unit) 95, which includes a plurality of terminals B1 to B6, which are conductively connected to external terminals or external devices, and the plurality of terminals B1 to B6 can be conductively connected to the first position sensor 170.

[0127] The first position sensor 170 may be arranged on a first surface of the circuit board 190, and the plurality of terminals B1 to B6 may be arranged on a second surface of the circuit board 190. Here, the second surface of the circuit board 190 may be a surface opposite to the first surface of the circuit board 190. For example, the first surface of the circuit board 190 may be a surface of the circuit board 190 facing the bobbin 110 or the sensing magnet 180.

[0128] For example, the circuit board 190 may be implemented as a printed circuit board or an FPCB.

[0129] The circuit board 190 may include a circuit pattern or wiring (not shown) for conductively connecting the first to sixth terminals B1 to B6 to the first position sensor 170 .

[0130] The first position sensor 170 may detect a magnetic field or an intensity of a magnetic field of a sensing magnet 180 mounted on the bobbin 110 during movement of the bobbin 110 and may output an output signal corresponding to a detection result.

[0131] The first position sensor 170 may be a Hall sensor. The first position sensor 170 may include two input terminals to which a driving signal or power is supplied and two output terminals through which a sensing voltage (or output voltage) is output.

[0132] For example, a driving signal may be supplied to the first position sensor 170 through the first and second terminals B1 and B2 of the circuit board 190 , and an output of the first position sensor 170 may be output to the outside through the third and fourth terminals B3 and B4 .

[0133] The fifth terminal B5 and the sixth terminal B6 of the circuit board 190 may be conductively connected to at least one of the upper elastic member 150 and the lower elastic member 160 to supply a driving signal to the first coil 120 .

[0134] In another embodiment, the first position sensor 170 may include a Hall sensor and a driver. Here, the first position sensor 170 may include first to fourth terminals and fifth and sixth terminals, through which data is sent to and received from the outside by data communication using a protocol such as I2C communication, and through which a drive signal is directly supplied to the first coil 120. The first to fourth terminals of the first position sensor 170 may be conductively connected to the first terminal B1 to the fourth terminal B4 of the circuit board 190. The fifth and sixth terminals of the first position sensor 170 may be conductively connected to the first coil 120 through at least one of the upper elastic member 150 and the lower elastic member 160 to supply a drive signal to the first coil 120.

[0135] The capacitor 195 may be configured to have a chip shape. Here, the chip may include a first terminal corresponding to one end of the capacitor 195 and a second terminal corresponding to the other end of the capacitor 195. The capacitor 195 may alternatively be referred to as a "capacitive element" or a "condenser".

[0136] The capacitor 195 may be conductively connected in parallel to the first terminal B1 and the second terminal B2 of the circuit board 190, and power (or a driving signal) may be supplied from the outside to the position sensor 170 through the first terminal B1 and the second terminal B2. Alternatively, the capacitor 195 may be conductively connected in parallel to the terminals of the first position sensor 170, and the first position sensor 170 may be conductively connected to the first terminal B1 and the second terminal B2 of the circuit board 190.

[0137] Since the capacitor 195 is conductively connected in parallel to the first terminal B1 and the second terminal B2 of the circuit board 190, the capacitor 195 can be used as a smoothing circuit for eliminating ripple components included in the power signals GND and VDD supplied from the outside to the first position sensor 170, and thus the capacitor 195 can supply a stable and consistent power signal to the first position sensor 170.

[0138] The upper elastic member 150 can be coupled to the upper part, upper end or upper surface of the spool 110 and the upper part, upper end or upper surface of the shell 140, and the lower elastic member 160 can be coupled to the lower part, lower end or lower surface of the spool 110 or the lower part, lower end or lower surface of the shell 140.

[0139] The upper elastic member 150 and the lower elastic member 160 may elastically support the bobbin 110 with respect to the housing 140 .

[0140] exist Figure 4 In the embodiment, although each of the upper elastic member 150 and the lower elastic member 160 is Figure 4In the embodiments, the present disclosure is not limited thereto but is implemented as a single unit or a single structure.

[0141] In another embodiment, at least one of the upper elastic member and the lower elastic member may include a plurality of elastic units or springs that are conductively isolated or spaced apart from each other.

[0142] The upper elastic member 150 may also include: a first inner frame 151 coupled to or fixed to the upper part, upper surface or upper end of the bobbin 110, a first outer frame 152 coupled to or fixed to the upper part, upper surface or upper end of the shell 140, and a first frame connector 153 connecting the first inner frame 151 to the first outer frame 152.

[0143] The lower elastic member 160 may include: a second inner frame 161 coupled to or fixed to the lower portion, lower surface or lower end of the bobbin 110, a second outer frame 162 coupled to or fixed to the lower portion, lower surface or lower end of the shell 140, and a second frame connector 163 connecting the second inner frame 161 to the second outer frame 162.

[0144] Each of the first frame connector 153 and the second frame connector 163 may be deformed or bent (or may be formed into a curve) at least once to define a predetermined pattern.

[0145] Each of the upper elastic member 150 and the lower elastic member 160 may be made of a conductive material.

[0146] Reference Figure 4 and Figure 5 , two pads 5a and 5b may be formed on the first surface of the circuit board 190 and may be conductively connected to the fifth terminal B5 and the sixth terminal B6 of the circuit board 190. The upper elastic member 150 may include a first joint portion 4a to be coupled or conductively connected to the first pad 5a, and the lower elastic member 160 may include a second joint portion 4b to be conductively connected to the second pad 5b. The first coil 120 may be coupled to the upper elastic member 150 at one end thereof and to the lower elastic member 160 at the other end thereof.

[0147] In other embodiments, the upper elastic member 150 or the lower elastic member 160 may include two elastic members, and each of the two elastic members may be coupled or conductively connected to a corresponding pad of the first pad 5a and the second pad 5b of the circuit board 190. The first coil 120 may be conductively connected to the two elastic members.

[0148] Despite Figure 4The middle coil 120 is shown as being arranged at the bobbin 110 and the first magnet 130 is shown as being arranged at the housing 140, but in another embodiment, the coil can be arranged at the housing and the first magnet can be arranged at the bobbin. In other embodiments, the sensing magnet can be arranged at the housing, and the first position sensor 170 and / or the circuit board 190 can be arranged at the bobbin.

[0149] Figure 8 is a plan view of the image sensor unit 350 . Fig. 9 is an exploded perspective view of the image sensor unit 350 . Fig.10 yes Fig. 9 A perspective view of the first circuit board 800 and the housing 450 is shown.

[0150] Fig.11 yes Fig. 9 A perspective view of the first circuit board 800 , the housing 450 , and the magnet 23 is shown. Fig.12 is an exploded perspective view of the second circuit board 250 , the second coil 230 , and the holder 270 . Fig.13 yes Fig. 9 An exploded perspective view of the second circuit board 250 , the image sensor 810 , the connection plate 260 , the support member, the holder 270 , and the connection elastic member 280 is shown. Fig.14 yes Figure 8 A bottom view of the image sensor unit 350 is shown with the bottom cover 219 removed therefrom. Fig.15 It is a partial enlarged view of the connecting elastic member 280. Fig.16 is a bottom view of a single connecting spring 281. Fig.17 2A and 2B are views showing connection springs 1A, 2A, 3A, and 4A of the connection elastic member 280 . Fig.18 yes Figure 1 The camera module 10 is shown in a cross-sectional view taken along line AB. Fig.19 yes Figure 1 The camera module 10 is shown in a cross-sectional view taken along line CD. Fig. 20 yes Figure 8 The image sensor unit 350 is shown in a cross-sectional view taken along line EF. Fig.21 yes Figure 8 The image sensor unit 350 is shown in a cross-sectional view taken along line GH. Fig. 22 is a perspective view of the camera module 10 partially shown in a cross-sectional view, from which the bottom cover 219 is removed.

[0151] Reference Figures 8 to 22 , the image sensor unit 350 may include a first circuit board 800 , a magnet 23 , a second circuit board 250 , a second coil 230 , a connection plate 260 , an image sensor 810 , a connection elastic member 280 , and a support member 220 .

[0152] The image sensor unit 350 may further include a housing 450 configured to receive at least a portion of the first circuit board 800 .

[0153] The first circuit board 800 may be used to supply a signal to the image sensor unit 350 from the outside, or to output a signal from the image sensor unit 350 to the outside.

[0154] Reference Fig. 9 and Fig.10 , the first circuit board 800 may include a first area 801 corresponding to the AF operation unit 100, a second area 802 at which a connector 840 is arranged, and a third area 803 connecting the first area 801 to the second area 802. The connector 840 may be conductively connected to the second area 802 of the first circuit board 800, and may include a port configured to be conductively connected to an external device.

[0155] Although each of the first region 801 and the second region 802 of the first circuit board 800 may include a flexible substrate and a rigid substrate, and the third region 803 may include a flexible substrate, the present disclosure is not limited thereto. In another embodiment, at least one of the first region 801 to the third region 803 of the first circuit board 800 may include at least one of a rigid substrate and a flexible substrate.

[0156] The first circuit board 800 may have a bore hole 800A corresponding to the bore hole in the bobbin 110, the lens module 400, and / or the image sensor 810. For example, the bore hole 800A in the first circuit board 800 may be formed in the first region 801.

[0157] Reference Fig.18 , at least a portion of the lens module 400 may extend through the bore hole 800A in the first circuit board 800 and may be located below the second surface 44B of the first circuit board 800 .

[0158] The lens module 400 may be located on the second circuit board 250. For example, the lens module 400 may be located above the drilled hole 501 in the second circuit board 250.

[0159] For example, a lower portion, end, or surface of a lens or barrel of the lens module 400 may extend through a bore 800A in the first circuit board 800 and may be located below the second surface 44B of the first circuit board 800 .

[0160] For example, a lower portion, a lower end, or a lower surface of a lens or a lens barrel of the lens module 400 may be located above the first surface 51A (eg, an upper surface) of the second circuit board 250 .

[0161] Furthermore, a lower portion, lower end or lower surface of the lens or lens barrel of the lens module 400 may be located above the drilled hole 501 in the second circuit board 250 .

[0162] Although the first circuit board 800 may be configured to have a polygonal shape (e.g., a quadrilateral shape, a rectangular shape, or a square shape) when viewed from above, the present disclosure is not limited thereto. In another embodiment, the first circuit board 800 may be configured to have another shape, such as a circular shape. In addition, although the drill hole 800A in the first circuit board 800 may be configured to have a polygonal shape (e.g., a quadrilateral shape, a square shape, or a rectangular shape), the present disclosure is not limited thereto. In another embodiment, the drill hole 800A may be configured to have another shape, such as a circular shape.

[0163] The first circuit board 800 may include a plurality of pads 800B. Here, the pads 800B may be alternatively referred to as "lead patterns", "lead members" or "holes".

[0164] Each of the plurality of pads 800B may have a hole formed in the optical axis direction through the first circuit board 800. In addition, each of the plurality of pads 800B may be formed to surround the hole, and may further include a lead pattern or a conductive layer.

[0165] The support member 220 may be soldered to the pad 800B in a state of extending through the hole in the pad 800B, and may be conductively connected to a lead pattern arranged around the hole in the pad 800B.

[0166] For example, the plurality of pads 800B may be spaced apart from each other at predetermined intervals to surround the drill hole 800A in the first circuit board 800. For example, the plurality of pads 800B may be arranged between the drill hole 800A in the first circuit board 800 and a side surface of the first circuit board 800.

[0167] The first circuit board 800 may have at least one coupling hole 800C configured to be coupled to the coupling protrusion 45B of the housing 450. Although the coupling hole 800C may be a through hole formed through the first circuit board 800, the present disclosure is not limited thereto. In another embodiment, the coupling hole 800C may be a groove.

[0168] For example, although the coupling hole 800C may be implemented as a plurality of coupling holes formed in diagonally opposite corners of the first circuit board 800, the present disclosure is not limited thereto. The coupling hole may be located near a side of the first circuit board 800 or between a side of the first circuit board 800 and the drill hole 800A.

[0169] The first circuit board 800 may include a plurality of terminals 80A.

[0170] A plurality of terminals 80A may be formed on a first surface (e.g., upper surface) 44A of the first circuit board 800. For example, the plurality of terminals 80A may be arranged on one side of the first circuit board 800 adjacent to one corner of the first circuit board 800 and may be conductively connected to the terminals B1 to B6 of the circuit board 190.

[0171] For example, the first circuit board 800 may include a terminal member 85 formed with a plurality of terminals 80A. The terminal member 85 may protrude from one side of the first circuit board 800 in a direction perpendicular to the optical axis.

[0172] The image sensor unit 350 may further include a housing 450 in which the first circuit board 800 is arranged, placed or received.

[0173] The housing 450 may receive at least a portion (eg, the first region 801) therein. The housing 450 may alternatively be referred to as a "magnet holder."

[0174] The housing 450 may be disposed below the housing 140 of the AF operation unit 100, and may be coupled to the housing 140 of the image sensor unit 350. For example, an upper portion, an upper end, or an upper surface of the housing 450 may also be coupled to a lower portion, a lower end, or a lower surface of the housing 140 of the AF operation unit 100 via an adhesive member or a coupling structure.

[0175] Here, the coupling structure may include a first coupling portion provided at a lower portion, a lower end, or a lower surface of the housing 140 of the AF operation unit 100, and a second coupling portion provided at an upper portion, an upper end, or an upper surface of the housing 450 of the image sensor unit 350. The first coupling portion may be a protrusion or a groove (or a hole), and the second coupling portion may be a groove (or a hole) or a protrusion.

[0176] The housing 450 may be disposed below the first circuit board 800. For example, the AF operation unit 100 may be disposed above the first circuit board 800, and the housing 450 may be disposed below the first circuit board 800.

[0177] The housing 450 may have a shape corresponding to or consistent with the first region 801 of the first circuit board 800. Although the housing 450 may be configured to have a polygonal shape (e.g., a quadrilateral shape, a square shape, or a rectangular shape) when viewed from above, the present disclosure is not limited thereto. In another embodiment, the housing 450 may be configured to have a circular shape or an elliptical shape.

[0178] The housing 450 may have a bore hole 450A formed therein. At least a portion of the bore hole 450A in the housing 450 may correspond to or overlap with the bore hole 800A in the first circuit board 800 .

[0179] Although the bore hole 450A in the housing 450 may be configured to have a polygonal shape (e.g., a quadrilateral shape or an octagonal shape), a circular shape, or a cross shape when viewed from above, the present disclosure is not limited thereto. The bore hole 450A in the housing 450 may be a through hole formed through the housing 450 in the optical axis direction.

[0180] For example, the housing 450 may include a body 42 configured to support at least a portion (eg, the first region 801 ) of the first circuit board 800 , a protrusion 43 protruding from the body 42 in the direction of the optical axis OA, and a bore 450A formed in the body 42 .

[0181] The housing 450 may include at least one coupling protrusion 45B protruding from the upper surface of the housing body 42. For example, the coupling protrusion 45B may protrude from the upper surface of the housing 450 in a direction from the upper surface of the body 42 toward the first surface (e.g., lower surface) 44B of the first circuit board 800.

[0182] The housing 450 may include a keep-away area 41 corresponding to the plurality of pads 800B. The keep-away area 41 may be formed at a position corresponding to the support member 220 to avoid spatial interference between the housing 450 and the support member 220.

[0183] The protrusion 43 of the housing 450 may have a first opening 46 through which a portion of the first region 801 of the first circuit board 800 is exposed to the outside, and a second opening 47 through which the terminal 80A formed at the terminal member 85 is exposed to the outside.

[0184] For example, the second opening 47 in the housing 450 may be formed at a position corresponding to the opening 141 in the housing 140 of the AF operation unit 100 in the direction of the optical axis OA.

[0185] Reference Figures 1 to 10 , the first circuit board 800 may include terminals 80A corresponding to the terminals B1 to B6 of the circuit board 190 of the AF operating unit 100 .

[0186] Each of the terminals 80A of the first circuit board 800 may be coupled to a corresponding terminal among the terminals B1 to B6 of the circuit board 190 of the AF operation unit 100 via solder or a conductive member.

[0187] Each of the terminals 80A of the first circuit board 800 may be conductively connected to a corresponding terminal among the terminals B1 to B6 of the circuit board 190 of the AF operating unit 100. A driving signal or power may be supplied to the first position sensor 170 through the first circuit board 800, and an output of the first position sensor 170 may be output to the first circuit board 800. In addition, a driving signal or power may be supplied to the first coil 120 through the first circuit board 800.

[0188] Reference Fig.11 , the first circuit board 800 may include a connector 840 disposed in the second region 802. For example, the connector 840 may be disposed on one surface (eg, a lower surface or an upper surface) of the second region 802 of the first circuit board 800.

[0189] The housing 450 may include a seating portion 8A in which the magnet 23 is received, arranged or seated. The seating portion 8A may be formed in the body 42 of the housing 450.

[0190] For example, the placement portion 8A may be formed in a corner of the housing 450. For example, the placement portion 8A may be a groove recessed from the lower surface of the housing 450, and may have a shape corresponding to the shape of the magnet 23. For example, although the housing 450 may include four placement portions 8A formed in four corners thereof, respectively, the present disclosure is not limited thereto. In another embodiment, the housing 450 may include a number of placement portions corresponding to the number of the magnets 23.

[0191] The magnet 23 may be disposed at the housing 450. For example, although the magnet 23 may be disposed at a corner of the housing 140, the present disclosure is not limited thereto. In another embodiment, the magnet 23 may be disposed at a side of the housing 450.

[0192] The magnet 23 may be used to provide a magnetic field that interacts with the second coil 230 to perform OIS (Optical Image Stabilization) for the purpose of hand shake correction.

[0193] For example, the magnet 23 may include a plurality of magnets 23A to 23D. Each of the magnets 23A to 23D may be arranged at a corresponding corner among the corners of the housing 450.

[0194] Although each of the magnets 23A to 23D may be a monopolar magnet having one N pole and one S pole, the present disclosure is not limited thereto. In another embodiment, each of the magnets 23A to 23D may be a bipolar magnet having two N poles and two S poles, or a quadrupole magnet.

[0195] For example, each of the four magnets 23A to 23D may be arranged at a corresponding corner among the four corners of the housing 450. For example, although two magnets (e.g., 23A and 23B) arranged at two adjacent corners of the housing 450 may be oriented perpendicular to each other, and two magnets (e.g., 23A and 23C; 23B and 23D) arranged at two corners of the housing 450 facing each other in a diagonal direction may be oriented parallel to each other, the present disclosure is not limited thereto.

[0196] For example, the insides of the magnets 23A to 23D may have the same polarity. In addition, the outsides of the magnets 23A to 23D may have the same polarity.

[0197] For example, the inside of each of the magnets 23A to 23D may be magnetized to an N pole, and the outside of each of the magnets 23A to 23D may be magnetized to an S pole. In a modified example, the inside of each of the magnets 23A to 23D may be magnetized to an S pole, and the outside of each of the magnets 23A to 23D may be magnetized to an N pole.

[0198] Reference Figures 9 to 13 , the second circuit board 250 can be arranged below the first circuit board 800 .

[0199] The second circuit board 250 may have a bore 501 therein that corresponds to a bore in the spool 110 , a bore in the housing 450 , and / or a bore 800A in the first circuit board 800 .

[0200] For example, the drill hole 501 in the second circuit board 250 may be a through hole formed through the second circuit board 250 in the optical axis direction, and may be located at the center of the second circuit board 250 .

[0201] Although the shape of the second circuit board 250 , for example, the circumferential shape thereof, may have a shape consistent with or corresponding to the upper surface of the base 210 when viewed from above, for example, a rectangular shape, the present disclosure is not limited thereto.

[0202] When viewed from above, although the shape of the drill hole 501 in the second circuit board 250 may be a polygonal shape, such as a rectangular shape, a circular shape, or an elliptical shape, the present disclosure is not limited thereto.

[0203] The second circuit board 250 may have a plurality of holes 250A corresponding to the plurality of pads 800B of the first circuit board 800. Although the plurality of holes 250A in the second circuit board 250 may be through holes formed through the second circuit board 250 in the direction of the optical axis OA, the present disclosure is not limited thereto. In another embodiment, the plurality of holes 250A may be avoidance grooves or avoidance portions configured to avoid spatial interference with the support member 220.

[0204] For example, the plurality of holes 250A in the second circuit board 250 may be spaced apart from each other at regular intervals to surround the bore hole 501 in the second circuit board 250. For example, the plurality of holes 250A may be located in an area between the bore hole 501 in the second circuit board 250 and a side surface of the second circuit board 250.

[0205] The second circuit board 250 may have at least one coupling hole 25A to be coupled to the protrusion 273 of the holder 270. Although the coupling hole 25A in the second circuit board 250 may be a through hole formed through the second circuit board 250, the present disclosure is not limited thereto. In another embodiment, the coupling hole 25A may be a groove.

[0206] For example, although the coupling hole 25A may be formed in at least one corner of the second circuit board 250 , the present disclosure is not limited thereto. Alternatively, the coupling hole 25A may be located near a side of the second circuit board 250 or between a side of the second circuit board 250 and the drill hole 501 .

[0207] Reference Fig.13 , the second circuit board 250 may include a plurality of terminals 251. For example, the plurality of terminals 251 may be arranged on a second surface 51B (eg, a lower surface) of the second circuit board 250 to be spaced apart from each other. The second surface 51B may be a surface opposite to the first surface 51A. The number of terminals 251 is not limited to Fig.13 The quantities shown may be greater or less than Fig.13 The quantity shown in .

[0208] For example, the plurality of terminals 251 may be located between the bore hole 501 in the second circuit board 250 and one side of the second circuit board 250. For example, the plurality of terminals 251 may be located closer to the bore hole 501 in the second circuit board 250 than the plurality of holes 250A.

[0209] The second circuit board 250 may include pads 9A to 9H configured to be conductively connected to the second coil 230. Here, the pads may alternatively be referred to as "terminals" or "joints". The pads 9A to 9H of the second circuit board 250 may be conductively connected to a plurality of terminals 251 of the second circuit board 250.

[0210] The second circuit board 250 may be a printed circuit board (PCB) or a flexible printed circuit board (FPCB).

[0211] The second coil 230 may be arranged or mounted on a first surface (eg, an upper surface) of the second circuit board 250 .

[0212] The second coil 230 may be disposed under the housing 450. The second coil 230 may be disposed under the magnet 23.

[0213] For example, the second coil 230 may be disposed on the circuit board 250 to correspond to, face, or overlap the magnet 23 disposed at the housing 450 in the direction of the optical axis OA.

[0214] For example, the second coil 230 may include a plurality of coil units 230-1 to 230-4. For example, the second coil 230 may include four coil units.

[0215] Each of the plurality of coil units 230 - 1 to 230 - 4 may face or overlap a corresponding magnet among the magnets 23A to 23D disposed at the housing 450 in the direction of the optical axis (OA).

[0216] Although each of the coil units 230-1 to 230-4 can be configured to have a form of a coil block with a closed curve shape or a ring shape, the present disclosure is not limited thereto. For example, each of the coil units 230-1 to 230-4 can be composed of a FP (fine pattern) coil. In another embodiment, the coil units 230-1 to 230-4 can be formed at another circuit member other than the second circuit board 250. In another embodiment, the coil unit can be directly formed at the circuit board 250.

[0217] For example, the four coil units 230 - 1 to 230 - 4 may be arranged or formed at a corner or a corner area of ​​the rectangular circuit board 250 .

[0218] The second coil 230 may be conductively connected to the second circuit board 250 so that power or a driving signal is supplied to the second coil 230 through the second circuit board 250. The power or driving signal supplied to the second coil 230 may be a DC signal, an AC signal, or a signal containing both a DC component and an AC component, and may be a voltage type or a current type.

[0219] Here, current may be independently applied to at least three coil units among the four coil units.

[0220] In the first embodiment, the second coil 230 may be controlled through three channels.

[0221] For example, only the first to third coil units among the first to fourth coil units can be conductively isolated from each other, and the fourth coil unit can be conductively connected in series to one of the first to third coil units. Here, three pairs of leads can be drawn from the second coil 230, i.e., a total of six leads.

[0222] In a second embodiment, the second coil 230 can be controlled by four separate channels. Here, the four coil units can be conductively isolated from each other. One of a forward current and a reverse current can be selectively applied to each coil unit. Here, four pairs of leads can be drawn from the second coil 230, i.e., a total of eight leads.

[0223] Although the rotation operation about the z-axis is performed by the second coil 230 and the pair of magnets 23 in the first embodiment, the rotation operation about the z-axis is performed by the second coil 230 and two pairs of magnets 23 in the second embodiment.

[0224] For example, two coil units 230-1 and 230-3 facing each other in a diagonal direction may extend or be oriented in a first axial direction (e.g., in an x-axis direction), and two other coil units 230-2 and 230-4 facing each other in a diagonal direction may extend or be oriented in a second axial direction (e.g., in a y-axis direction). Here, the first axial direction may be perpendicular to the second axial direction.

[0225] The long sides of the first coil 916-1 and the long sides of the third coil 916-3 may be arranged parallel to each other. The long sides of the second coil 916-2 and the long sides of the fourth coil 916-4 may be arranged parallel to each other. The long sides of the first coil 916-1 and the long sides of the second coil 916-2 may not be arranged parallel to each other. Here, the long sides of the first coil 916-1 and the long sides of the second coil 916-2 may be arranged so that the imaginary lines extending therefrom intersect each other. The direction in which the first coil 916-1 is oriented and the direction in which the second coil 916-2 is oriented may be perpendicular to each other.

[0226] Although the second coil 230 may include, for example, two coil units 230-1 and 230-3 for the second direction (eg, x-axis direction) and two coil units 230-2 and 230-4 for the third direction (eg, y-axis direction), the present disclosure is not limited thereto.

[0227] For example, the coil units 230-1 and 230-3 for the second direction may be arranged at two corners of the circuit board 250 opposite to each other in the first diagonal direction of the circuit board 250, and the coil units 230-2 and 230-4 for the third direction may be arranged at the other two corners of the circuit board 250 opposite to each other in the second diagonal direction of the circuit board 250. The first diagonal direction and the second diagonal direction may be perpendicular to each other.

[0228] In another embodiment, the second coil 230 may include only one coil unit for the second direction and one coil unit for the third direction, or may include four or more coil units.

[0229] For example, coil units 230-1 and 230-2 for the second direction can interact with magnets 23A and 23C - magnets 23A and 23C corresponding to corresponding coil units in coil units 230-1 and 230-3 in the direction of the optical axis OA - to provide electromagnetic force generated by the interaction in the first axial direction (e.g., the x-axis direction).

[0230] In addition, the coil units 230-2 and 230-4 for the third direction can interact with the magnets 23B and 23D - the magnets 23B and 23D corresponding to the corresponding coil units in the coil units 230-2 and 230-4 in the direction of the optical axis OA - to provide electromagnetic force generated by the interaction in the second axial direction (e.g., the y-axis direction).

[0231] For example, these four coil units may be driven separately from the remaining coil units.

[0232] For example, one end of the first coil unit 230-1 may be connected to the first pad 9A, and the other end of the first coil unit 230-1 may be connected to the second pad 9B. A first driving signal for activating the first coil unit 230-1 may be provided to the first pad 9A and the second pad 9B.

[0233] One end of the third coil unit 230-3 may be connected to the third pad 9C, and the other end of the third coil unit 230-3 may be connected to the fourth pad 9D. A second driving signal for activating the third coil unit 230-3 may be provided to the third pad 9C and the fourth pad 9D.

[0234] One end of the second coil unit 230-2 may be connected to the fifth pad 9E, and the other end of the second coil unit 230-2 may be connected to the sixth pad 9F. A third driving signal for activating the second coil unit 230-2 may be provided to the fifth pad 9E and the sixth pad 9F.

[0235] One end of the fourth coil unit 230-4 may be connected to the seventh pad 9G, and the other end of the fourth coil unit 230-4 may be connected to the eighth pad 9H. A fourth driving signal for activating the fourth coil unit 230-4 may be provided to the seventh pad 9G and the eighth pad 9H.

[0236] In another embodiment, the coil units 230-1 and 230-2 for the second direction can be connected in series with each other, and the coil units 230-2 and 230-4 for the third direction can be connected in series with each other. The second circuit board 250 may include two pads connected to two pairs of ends of the two coil units 230-1 and 230-3 for the second direction connected in series with each other and two pads connected to two pairs of ends of the other two coil units 230-2 and 230-4 for the third direction connected in series with each other. The first drive signal can be provided to the two pads, and the second drive signal can be provided to the other two pads.

[0237] The OIS movable unit including the image sensor 810 can move in the second direction and / or the third direction, for example, in the x-axis direction and / or in the y-axis direction, by interaction between the magnets 23A to 23D and the coil units 230-1 to 230-4 to which the driving signals are applied, thereby performing hand shake correction. A description of the OIS movable unit will be given later.

[0238] The image sensor unit 350 may further include a second position sensor 240 for feeding back the OIS operation.

[0239] The second position sensor 240 may be arranged, coupled or mounted to the first surface (e.g., upper surface) 51A of the second circuit board 250. The second position sensor 240 may detect a displacement of the OIS movable unit in a direction perpendicular to the optical axis OA, for example, a shift or tilt of the OIS movable unit in a direction perpendicular to the optical axis, or a rotation of the OIS movable unit around the optical axis.

[0240] Here, the first position sensor 170 may alternatively be referred to as an “AF position sensor”, and the second position sensor 240 may alternatively be referred to as an “OIS position sensor”.

[0241] The second position sensor 240 may include one or more sensors 240a, 240b, and 240c.

[0242] For example, the second position sensor 240 may include three sensors 240a, 240b, and 240c.

[0243] Each of the first to third sensors 240a, 240b, and 240c may be a Hall sensor. In another embodiment, each of the first to third sensors 240a, 240b, and 240c may be implemented as a driver IC including a Hall sensor.

[0244] Each of the first to third sensors 240a, 240b, and 240c may be conductively connected to a predetermined corresponding terminal among the terminals 251 of the second circuit board 250. For example, a corresponding driving signal may be applied to the first to third sensors 240a, 240b, and 240c via the terminals 251, and an output signal of each of the first to third sensors may be output to other predetermined terminals among the terminals 251.

[0245] For example, since four coil units 230-1 to 23-4 are controlled through three channels, each of the first to third sensors 240a, 240b, and 240c may be disposed in a corresponding coil unit among the three coil units 230-1 to 230-3, and no sensor may be provided to the remaining coil unit 230-4.

[0246] All of the movement of the image sensor 810 in the x-axis direction and the y-axis direction and the rotation of the image sensor 810 around the z-axis may be detected by the three sensors 240a, 240b, and 240c.

[0247] One of the three sensors may detect the amount of movement and / or displacement of the OIS movable unit in the x-axis direction, and another of the three sensors may detect the amount of movement and / or displacement of the OIS movable unit in the y-axis direction. The remaining one of the three sensors may detect the amount of movement and / or displacement of the OIS movable unit in the x-axis direction and / or in the y-axis direction. The outputs of two or more of the three sensors 240a, 240b, and 240c may be used to detect the rotational movement of the OIS movable unit around the z-axis.

[0248] exist Fig.12 In the illustrated embodiment, the second position sensor 240 may include three sensors 240a, 240b, and 240c.

[0249] For example, the first sensor 240a may be arranged on the first surface (e.g., upper surface) 51A of the circuit board 250 in the first coil unit 230-1, and the third sensor 240c may be arranged on the first surface (e.g., upper surface) 51A of the circuit board 250 in the third coil unit 230-3. The second sensor 240b may be arranged on the upper surface of the circuit board 250 in the second coil unit 230-2.

[0250] For example, although the first sensor 240a may not overlap with the first coil unit 230-1 in the direction of the optical axis OA, the third sensor 240c may not overlap with the third coil unit 230-3 in the direction of the optical axis OA, and the second sensor 240b may not overlap with the second coil unit 230-2 in the direction of the optical axis OA, the present disclosure is not limited thereto. In another embodiment, at least a portion of each of the first to third sensors may overlap with a corresponding coil unit in the first to third coil units in the direction of the optical axis.

[0251] Although the first sensor 240a may overlap with the magnet 130-1 in the optical axis direction, the third sensor 240c may overlap with the magnet 130-3 in the optical axis direction, and the second sensor 240b may overlap with the magnet 130-2 in the optical axis direction, the present disclosure is not limited thereto. In another embodiment, the first to third sensors 240a, 240b, and 240c may not overlap with the corresponding magnets of the magnets 130-1, 130-2, and 130-3.

[0252] In another embodiment, the second position sensor 240 may include a first sensor and a second sensor.

[0253] The image sensor unit 350 may include at least one of a motion sensor 820 , a controller 830 , a memory 512 , and a capacitor 514 .

[0254] The motion sensor 820 , the controller 830 , the memory 512 , and the capacitor 514 may be arranged or mounted to the first circuit board 800 or the second circuit board 250 .

[0255] For example, the motion sensor 820 and the memory 512 may be disposed on the second circuit board 250 .

[0256] In another embodiment, for example, the motion sensor 820 and the memory 512 may be disposed on the lower surface 44B (eg, of the first region 801 ) of the first circuit board 800 .

[0257] The motion sensor 820 may output information about a rotational angular velocity caused by the motion of the camera module 10. The motion sensor 820 may be implemented as a dual-axis or tri-axis gyro sensor or an angular velocity sensor.

[0258] The memory 512 may store a first code value according to the displacement of the spool 110 in the optical axis direction for use in the AF feedback operation. In addition, the memory 512 may store a second code value according to the displacement of the OIS movable unit in a direction perpendicular to the optical axis direction for use in the OIS feedback operation. In addition, the memory 512 may store an algorithm or program for the operation of the controller 830.

[0259] For example, the memory 512 may be, for example, an EEPROM (Electrically Erasable Programmable Read Only Memory).

[0260] The controller 830 may be conductively connected to the first position sensor 170 and the second position sensor 240 .

[0261] The controller 830 may control the output signal of the first position sensor 170 and the driving signal supplied to the first coil 120 using the first code value stored in the memory 512 , thereby performing a feedback auto focusing operation.

[0262] In addition, the controller 830 may control the output signal supplied from the second position sensor 240 and the driving signal supplied to the second coil 230 using the second code value stored in the memory 512 , thereby performing a feedback OIS operation.

[0263] Although the controller 830 may be a driver IC type, the present disclosure is not limited thereto. For example, the controller 830 may be conductively connected to the terminal 251 of the second circuit board 250 .

[0264] The connection plate 260 may be disposed under the second circuit board 250 .

[0265] When viewed from above, although the connection plate 260 may have a polygonal shape (eg, a quadrilateral shape, a square shape, or a rectangular shape), the present disclosure is not limited thereto. In another embodiment, the connection plate may have a circular shape or an elliptical shape.

[0266] The area of ​​the front surface of the connection plate 260 having a quadrilateral shape may be larger than the area of ​​the drill hole 501 in the second circuit board 250. For example, the lower side of the drill hole 501 in the second circuit board 250 may be blocked or closed by the connection plate 250.

[0267] For example, when viewed from above, an outer surface (or side) of the connection plate 260 may be located between an outer surface (or side) of the second circuit board 250 and a drill hole 501 in the second circuit board 250 .

[0268] The connection board 260 may include a placement area 260A in which the image sensor 810 is arranged. For example, a first surface (e.g., upper surface) 60A of the connection board 260 may be provided with a placement area 260A, and the image sensor 810 is arranged or coupled to the placement area 260A. For example, the placement area 260A may be positioned to correspond to the drill hole 501 in the second circuit board 250.

[0269] Reference Fig.12 , the connection board 260 may include a first terminal 261, which is conductively connected to the terminal 251 of the second circuit board 250. The first terminal 261 may alternatively be referred to as a "first terminal" or a "first terminal unit". For example, the first terminal 261 may include a plurality of first terminals.

[0270] For example, the first terminal 261 of the connection board 260 may be coupled to the terminal 251 of the second circuit board 250 .

[0271] For example, the first terminal 261 of the connection board 260 may be arranged on a first surface (eg, upper surface) 60A of the connection board 260 and may correspond to, face, or overlap the terminal 251 of the second circuit board 250 in the optical axis direction.

[0272] Reference Fig.13 , the connection plate 260 may include a second terminal 262 conductively connected to the connection elastic member 280. The second terminal 262 may alternatively be referred to as a "second terminal" or a "second terminal unit".

[0273] For example, the second terminal 262 of the connecting plate 260 may be connected to the solder 38 (see Fig.14 ) or a conductive adhesive member is coupled to the connecting elastic member 280. For example, the second terminal 262 may include a plurality of second terminals.

[0274] For example, the second terminal 262 of the connecting plate 260 may be arranged on a second surface (e.g., lower surface) 60B of the connecting plate 260 and may correspond to, face, or overlap a corresponding one of the connecting springs 281 of the connecting elastic member 280 in the optical axis direction. The second surface 60B may be a surface opposite to the first surface 60A.

[0275] Although the connection board 260 may be a printed circuit board or an FPCB, the present disclosure is not limited thereto.

[0276] The first circuit board 800 may alternatively be referred to as a “first circuit board portion” or a “first board portion.” The second circuit board 250 and the third circuit board 260 may constitute a “second circuit board portion” or a “second board portion.”

[0277] The holder 270 may be disposed under the second circuit board 250 to support the second circuit board 250. For example, the second surface 51B of the second circuit board 250 may be in contact with an upper surface of the holder 270.

[0278] For example, the holder 270 may be disposed between the second circuit board 250 and the connecting elastic member 280 .

[0279] The holder 270 may include a protrusion 276 that protrudes from an upper surface of the holder 270 in the direction of the second circuit board 250. The protrusion 276 may support a side surface of the second circuit board 250, or may serve as a guide configured to allow the second circuit board 250 to be easily arranged or placed on the holder 270. The protrusion 276 may alternatively be referred to as a "guide portion" or a "guide protrusion."

[0280] When the second circuit board 250 is placed on the holder 270, the protrusion 276 may contact the outer surface of the second circuit board 250. For example, the protrusion 276 may include a plurality of (e.g., four) protrusions, and all of the plurality of protrusions 276 may contact the four outer surfaces of the second circuit board 250.

[0281] For example, although the protrusions 276 may be formed on outer surfaces facing each other, the present disclosure is not limited thereto.

[0282] When viewed from above or below, although the outer surface of the retainer 270 may have a quadrilateral shape, such as a square shape or a rectangular shape, the present disclosure is not limited thereto. In another embodiment, the outer surface of the retainer 270 may have a circular shape or an elliptical shape.

[0283] The holder 270 may include a protrusion 273 that corresponds to or faces the coupling hole 25A in the second circuit board 250. The protrusion 273 of the holder 270 may protrude from the first surface 70A of the holder 270 and may be coupled to the coupling hole 25A in the second circuit board 250. The holder 270 and the second circuit board 250 may be coupled to each other. The first surface 70A of the holder 270 may be a surface that faces the second surface 60B of the second circuit board 250.

[0284] The retainer 270 may have a bore 71 therein corresponding to the connection plate 260 .

[0285] Although the bore hole 71 in the holder 270 may have a quadrilateral shape, such as a square shape or a rectangular shape, the present disclosure is not limited thereto. In another embodiment, the bore hole 71 may have a circular shape or an elliptical shape.

[0286] For example, although the bore hole 71 in the retainer 270 may have a shape consistent with or the same as that of the connection plate 260 , the present disclosure is not limited thereto.

[0287] The size or area of ​​the bore hole 71 in the retainer 270 may be larger than the area of ​​the first surface 60A or the second surface 60B of the connection plate 260 .

[0288] The connecting plate 260 can be arranged in a bore 71 in the holder 270 .

[0289] For example, the holder 270 may have a shape surrounding the connection plate 260 .

[0290] The holder 270 may have a plurality of holes 270A corresponding to the plurality of holes 250A in the second circuit board 250. Although the plurality of holes 270A in the holder 270 may be through holes formed through the holder 270 in the direction of the optical axis OA, the present disclosure is not limited thereto. In another embodiment, each of the plurality of holes 270A may have an escape groove or an escape portion to avoid spatial interference with the support member 220.

[0291] For example, the plurality of holes 270A in the holder 270 may be spaced apart from each other at regular intervals to surround the bore hole 71 in the holder 270. For example, the plurality of holes 270A may be located between the bore hole 71 in the holder 270 and the side surface of the holder 270.

[0292] Reference Fig.13 , a protrusion 275 may be formed on the second surface 70B of the holder 270 . The protrusion 275 of the holder 270 may protrude from the second surface 70B of the holder 270 toward the bottom of the base 210 .

[0293] The protrusion 275 of the holder 270 may protrude further toward the bottom of the base 210 than the connection elastic member 280. Alternatively, the protrusion 275 of the holder 270 may protrude further toward the bottom of the base 210 than the solder 902 coupling the connection elastic member 280 to the support member 220.

[0294] For example, a first distance between the protrusion 275 of the holder 270 and the bottom of the base 210 in the optical axis direction may be smaller than a second distance between the connecting elastic member 280 and the bottom of the base 210. For example, the first distance may be smaller than a third distance between the solder 902 and the bottom of the base 210.

[0295] The protrusion may serve as a stopper configured to prevent the second surface 70B of the holder 270 , the connection elastic member 280 , and / or the solder 902 from directly colliding with the bottom of the base 210 due to an external impact.

[0296] For example, although the protrusion 275 may be disposed at a corner of the second surface 70B of the retainer 270 , the disclosure is not limited thereto. In another embodiment, the protrusion 275 may be disposed between a side of the second surface 70B of the retainer 270 and the bore 71 in the retainer 270 .

[0297] Reference Fig.15 The holder 270 may have a groove 272 formed as a depression in the second surface 70B. The groove 272 may include a bottom 272a having a height difference with respect to the second surface 70B in the direction of the optical axis OA and a sidewall 272b connecting the bottom 272a to the second surface 70B.

[0298] The bottom 272 a of the groove 272 may be positioned closer to the first surface 70A of the retainer 270 than to the second surface 70B of the retainer 270 .

[0299] The plurality of holes 270A in the holder 270 may overlap with the groove 272 in the holder 270 in the optical axis direction. For example, each of the plurality of holes 270A may have an opening opened at the bottom 272a of the groove 270. The openings of the plurality of holes 270A opened at the bottom 272a may have a height difference relative to the second surface 70B of the holder 270 in the optical axis direction.

[0300] For example, a plurality of holes 270A may be formed through the bottom 272 a of the groove 270 .

[0301] Here, the groove 272 in the holder 270 is intended to avoid spatial interference between the connection elastic member 280 and the holder 270, thus allowing the connection elastic member 280 to be easily deformed when the connection elastic member 280 is elastically deformed due to the OIS operation.

[0302] The connection elastic member 280 may be coupled to the holder 270. The connection elastic member 280 may serve to allow the OIS movable unit to move and allow conductive transmission of a signal.

[0303] For example, the connection elastic member 280 may be disposed below the holder 270 .

[0304] For example, the connection elastic member 280 may be coupled to the second surface 70B of the holder 270 via an adhesive member.

[0305] The connection elastic member 280 may conductively connect the support member 220 to the connection plate 260 and may include an elastically deformable elastic deformation portion. The elastic deformation portion of the connection elastic member 280 may be coupled to the support member 220.

[0306] The connection elastic member 280 may include a connection spring 281 corresponding to the support member 220 .

[0307] For example, the connection elastic member 280 may include a plurality of connection springs 281. The plurality of connection springs 281 may be arranged to be conductively isolated from each other or spaced apart from each other.

[0308] The connection spring 281 may be made of a conductive material (eg, a metal such as copper or a copper alloy).

[0309] For example, the connection spring 281 may be made of at least one selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). In addition, the connection elastic member 280 may be made of a paste or solder paste including at least one selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn) having excellent bonding force.

[0310] For example, the connection spring 281 may be made of a metal material having a tensile strength of 1000 MPa or more. For example, the connection spring 281 may be made of a binary alloy or a ternary alloy including copper.

[0311] Reference Figures 15 to 17 The connection spring 281 may include a first coupler 31 coupled to the second terminal 262 of the connection plate 260 , a second coupler 32 coupled to the support member 220 , and a connector 33 connecting the first coupler 31 to the second coupler 32 .

[0312] The first coupler 31 of the connection spring 281 may be supported by the holder 270. For example, the first coupler 31 may be disposed on the second surface 70B of the holder 270 and may be supported by the second surface 70B of the holder 270.

[0313] For example, the first coupler 31 may include a first portion 31 a supported by the holder 270 and connected to the connector 33 , and a second portion 31 b connected to the first portion 31 a and coupled to the second terminal 262 of the connection plate 260 .

[0314] For example, the first portion 31a of the first coupler 31 may overlap with the second surface 70B of the holder 270 in the optical axis direction, and the second portion 31b of the first coupler 31 may not overlap with the second surface 70B of the holder 270 in the optical axis direction. For example, the second portion 31b may protrude from the inner surface of the holder 270 in a direction toward the second terminal 252 of the connection plate 260.

[0315] For example, the second portion 31 b of the first coupler 31 may be positioned opposite the portion 19A where the first coupler 31 meets the connector 33 .

[0316] The width of the first portion 31 a of the first coupler 31 may be greater than widths of the other portions 31 b and 33 to increase a coupling force with the insulating member 285 .

[0317] The width W1 of the first portion 31a of the first coupler 31 may be greater than the width W2 of the second portion 31b. In other words, the surface area of ​​the first portion 31a of the first coupler 31 may be greater than the surface area of ​​the second portion 31b. The reason for this is to relatively increase the width W1 (or surface area) of the first portion 31a, thereby increasing the surface area of ​​the first portion 31a supported by the retainer 270, so that the first portion 31a is stably supported by the retainer 270.

[0318] Here, the widths W1 and W2 may be the lengths of the first coupler 31 in a direction perpendicular to a direction toward the second terminal 252 of the connection plate 260 .

[0319] In another embodiment, the width W1 of the first portion 31 a may be equal to or smaller than the width W2 of the second portion 31 b .

[0320] The second coupler 32 may be coupled to one end (eg, a lower end) of the support member 220 via solder 902 or a conductive adhesive member.

[0321] For example, the second coupler 32 may be arranged to overlap with the hole 270A in the holder 270 in the optical axis direction.

[0322] The second coupler 32 may have a hole 32A through which the support member 220 extends.

[0323] The end of the support member 220 passing through the hole 32A in the second coupler 32 may be directly coupled to the second coupler 32 via a conductive adhesive member or solder 902 , and the second coupler 32 may be conductively connected to the support member 220 .

[0324] For example, the second coupler 32 may include a hole 32A and an area around the hole 32A, which serves as an area in which the solder 902 is arranged to couple the coupler 32 to the support member 220. Fig.16 In the embodiment, the second coupler 32 is configured to have a circular shape, but the present disclosure is not limited thereto. In another embodiment, the second coupler 32 may be configured to have a polygonal shape (eg, a quadrilateral shape) or an elliptical shape.

[0325] For example, the diameter K of the second coupler 32 may be smaller than the width W1 of the first portion 31a of the first coupler 31. In another embodiment, the diameter K of the second coupler 32 may be equal to or larger than the width W1 of the first portion 31a of the first coupler 31.

[0326] The connector 33 may connect the first portion 31 a of the first coupler 31 to the second coupler 32 , and may include at least one straight portion and at least one bent portion.

[0327] For example, the curved portion may be configured to extend curvedly to the left or right from a straight portion perpendicular to the optical axis.

[0328] For example, although the connector 33 may be configured to have a spiral shape, the present disclosure is not limited thereto.

[0329] For example, the connector 33 may include a curved portion that extends in a clockwise or counterclockwise curved manner. In other words, the connector 33 may be bent in a direction corresponding to the rotation of the image sensor along the z-axis direction. Therefore, the connector 33 can minimize damage to the connection spring 281 when the image sensor rotates along the z-axis direction, resulting in the prevention of cracks in the connection spring 281 and the prevention of separation of the connection spring 281 from the insulating member 285.

[0330] For example, the connector 33 may include a first straight portion 33-1 connected to the first coupler 31, a first curved portion 34-1 extending in a first lateral direction from the first straight portion 33-1, a second straight portion 33-2 connected to the first curved portion 34-1, a second curved portion 34-2 extending in a second lateral direction from the second straight portion 33-2, a third straight portion 33-3 connected to the second curved portion 34-2, a third curved portion 34-3 extending in a third lateral direction from the third straight portion 33-3, a fourth straight portion 33-4 connected to the third curved portion 34-3, a fourth curved portion 34-4 extending in a fourth lateral direction from the fourth straight portion 33-4, and a fifth straight portion 33-5 connecting the fourth curved portion 34-4 to the second coupler 32. For example, although each of the first to fourth lateral directions may be a leftward direction, the disclosure is not limited thereto. In another embodiment, at least one of the first to fourth lateral directions may be a rightward direction.

[0331] At least one of the bent portions 34 - 1 to 34 - 5 of the connector 33 may be configured to have an arc shape.

[0332] The width of each of the first to fifth straight line portions 33-1 to 33-5 may be different from the width of each of the first to fourth curved portions 34-1 to 34-4. For example, since stress is concentrated at the curved portion, the width of each of the first to fourth curved portions 34-1 to 34-4 may be greater than the width of each of the first to fifth straight line portions 33-1 to 33-5, thereby preventing damage to the connector 33 caused by stress applied to the connector 33.

[0333] The connection spring 281 may have different widths at different portions thereof.

[0334] The width of the connector 33 may be smaller than the width of the first portion 31 a to apply elastic force.

[0335] The width W3 of the connector 33 may be smaller than any one of the width W1 of the first portion 31a of the first coupler 31, the width W2 of the second portion 31b of the first coupler 31, and the diameter K of the second coupler 32. Therefore, the connection spring 281 can flexibly support the OIS movable unit and can allow the OIS movable unit to easily move in a direction perpendicular to the optical axis.

[0336] For example, the connector 33 may have a width of 20 μm to 1000 μm.

[0337] For example, if the width of the connector 33 is less than 20 μm, the overall stiffness of the connection spring 281 may be reduced, and thus the reliability of the connection spring 281 may be reduced. Meanwhile, if the width of the connector 33 is greater than 1000 μm, the elastic force of the connection spring 281 may be reduced, and thus the voltage required to activate the second coil 230 configured to deflect the OIS movable unit may increase, thereby increasing power consumption.

[0338] In another embodiment, the width of the connector 33 may be equal to or greater than the diameter K of the second coupler 32 .

[0339] The thickness t1 of the first coupler 31, the thickness t2 of the connector 33, and the thickness of the second coupler 32 may be the same. In another embodiment, at least one of the thickness t1 of the first coupler 31, the thickness t2 of the connector 33, and the thickness of the second coupler 32 may be different from the others. For example, the thickness t2 of the connector 33 may be smaller than the thickness of the first coupler 31 and the thickness of the second coupler 32.

[0340] Reference Fig.17, the connection elastic member 280 may include a plurality of connection springs. The plurality of connection springs may be classified into a plurality of groups. For example, the plurality of groups may alternatively be referred to as "a plurality of connectors", "a plurality of elastic portions" or "a plurality of connection elastic members".

[0341] For example, the connection elastic member 280 may include four groups 1A to 4A corresponding to four sides (four lateral side surfaces) of the connection plate 260 or four sides (or four lateral side surfaces) of the holder 270 .

[0342] Each of the plurality of groups 1A to 4A may include a plurality of connection springs 1 - 1 to 1 - 9 , 2 - 1 to 2 - 9 , 3 - 1 to 3 - 9 , or 4 - 1 to 4 - 9 .

[0343] Furthermore, the terminals 262 of the connection plate 260 may be classified into a plurality of groups corresponding to the groups 1A to 4A of the connection elastic members 280. Each of the plurality of groups of the connection plate 260 may include a plurality of terminals P1 to P9, S1 to S9, R1 to R9, or Q1 to Q9.

[0344] For example, each of the plurality of terminals P1 to P9, S1 to S9, R1 to R9, and Q1 to Q9 of the second board 260 may be coupled to a corresponding connection spring of the plurality of connection springs 1-1 to 1-9, 2-1 to 2-9, 3-1 to 3-9, and 4-1 to 4-9 via solder.

[0345] For example, the numbers of connection springs included in the plurality of groups 1A to 4A may be the same.

[0346] In another embodiment, the numbers of connecting springs included in two groups located opposite to each other may be the same.

[0347] In other embodiments, the numbers of connection springs included in two adjacent groups of the connection elastic member 280 may be different from each other. In another embodiment, the number of connection springs included in at least one of the plurality of groups 1A to 4A may be different from the number of connection springs included in each of the remaining groups.

[0348] In order to flexibly support the OIS movable unit in a balanced state during the OIS operation, the plurality of groups 1A to 4A of the connecting elastic members 280 may be arranged to be bi-radially symmetrical about the center point 403 .

[0349] In another embodiment, the plurality of groups 1A to 4A of the connecting elastic members 280 may be arranged to be radially symmetrical about the center point 403 .

[0350] For example, the retainer 270 may include four corners 30A to 30D. The first group 1A and the third group 3A may be arranged to be opposite to each other in the transverse direction, and the second group 2A and the fourth group 4A may be arranged to be opposite to each other in the longitudinal direction. The transverse direction and the longitudinal direction may intersect each other.

[0351] The first group 1A may be arranged in a first region between the first corner 30A and the second corner 30B of the second surface 70B of the holder 270, and the second group 2A may be arranged in a second region between the second corner 30B and the third corner 30C of the second surface 70B of the holder 270. The third group 3A may be arranged in a third region between the third corner 30C and the fourth corner 30D of the second surface 70B of the holder 270, and the fourth group 4A may be arranged in a fourth region between the fourth corner 30D and the first corner 30A of the second surface 70B of the holder 270.

[0352] The first corner 30A and the third corner 30C of the holder 270 may be positioned opposite to each other in a first diagonal direction, and the second corner 30B and the fourth corner 30D of the holder 270 may be positioned opposite to each other in a second diagonal direction. The first diagonal direction and the second diagonal direction may be perpendicular to each other.

[0353] The centers of the first and third groups 1A, 3A may be positioned offset in opposite directions relative to the first centerline 401 , and the centers of the second and fourth groups 2A, 4A may be positioned offset in opposite directions relative to the second centerline 402 .

[0354] Here, the center of each group may be the spatial center of the total length of each group in the direction in which the connection springs included in the group are arranged. The total length may be the distance between the first connection spring and the last connection spring of each group.

[0355] For example, the first center line 401 may be a line extending through the center 403 and parallel to a direction from a first region of the retainer 270 in which the first group 1A is arranged toward a third region of the retainer 270 in which the third group 3A is arranged. Alternatively, the first center line 401 may be a line extending through the center 403 and parallel to a first outer surface of the retainer 270.

[0356] For example, the second center line 402 may be a line extending through the center 403 and parallel to a direction from the second region of the retainer 270 in which the second group is arranged toward the fourth region of the retainer 270 in which the fourth group is arranged. Alternatively, the second center line 402 may be a line extending through the center 403 and perpendicular to the first outer surface of the retainer 270.

[0357] For example, the center 403 may be the center of the bore 71 in the retainer 270 or the center of the space where the elastic member is connected.

[0358] For example, the number of connecting springs of the first group 1A (or the third group 3A) arranged on one side (e.g., the right side) of the first center line 401 and the number of connecting springs of the first group 1A (or the third group 3A) arranged on the other side (e.g., the left side) of the first center line 401 may be different from each other.

[0359] For example, the number of connecting springs of the second group 2A (or the fourth group 4A) arranged on one side (e.g., the right side) of the second center line 402 and the number of connecting springs of the second group 2A (or the fourth group 4A) arranged on the other side (e.g., the left side) of the second center line 402 may be different from each other.

[0360] Reference Fig.14 , the connection elastic member 280 may further include an insulating member 285. The insulating member 285 may alternatively be referred to as an “insulating layer.” For example, the insulating member 285 may include polyimide.

[0361] The insulating member 285 may surround at least a portion of the connection spring 281. For example, the insulating member 285 may surround at least a portion of the first portion 31a of the connection spring 281. For example, the insulating member 285 may cover a lower surface of the first portion 31a of the connection spring 281.

[0362] Adhesive members may be inserted or arranged between the insulating member 285 and the connection spring 281 and between the insulating member 285 and the dummy members 28 - 1 to 28 - 4 so as to attach them to each other.

[0363] For example, the second portion 31 b of the first coupler 31 of the connection spring 281 , the second coupler 32 , and the connector 33 may be exposed from the insulating member 285 .

[0364] The insulating member 285 may connect the connection springs 1 - 1 to 1 - 9 , 2 - 1 to 2 - 9 , 3 - 1 to 3 - 9 , and 4 - 1 to 4 - 9 of the groups 1A to 4A to one another.

[0365] The insulating member 285 may support the connection springs 1 - 1 to 1 - 9 , 2 - 1 to 2 - 9 , 3 - 1 to 3 - 9 , and 4 - 1 to 4 - 9 of the connection elastic member 280 , and may be coupled or attached to the second surface 70B of the holder 270 .

[0366] The connecting elastic member 280 may further include one or more dummy members 28 - 1 to 28 - 4 .

[0367] For example, the dummy members 28 - 1 to 28 - 4 may be spaced apart from the connection springs 1 - 1 to 1 - 9 , 2 - 1 to 2 - 9 , 3 - 1 to 3 - 9 , and 4 - 1 to 4 - 9 , and may be arranged on the lower surface 70B of the holder 270 .

[0368] The insulating member 285 may surround or cover at least a portion of the dummy members 28 - 1 to 28 - 4 . As a result, the shape of the insulating member 285 may be firmly maintained to improve the adhesive force between the insulating member 285 and the holder 270 .

[0369] The dummy members 28 - 1 to 28 - 4 may alternatively be referred to as “reinforcement portions” or “reinforcement patterns” because they enhance the rigidity of the connection elastic member 280 .

[0370] The dummy members 28-1 to 28-4 may not be conductively connected to the connection springs 1-1 to 1-9, 2-1 to 2-9, 3-1 to 3-9, and 4-1 to 4-9. Although the dummy members 28-1 to 28-4 are not conductively connected to each other, the present disclosure is not limited thereto. In another embodiment, the dummy members may be connected to each other.

[0371] For example, the insulating member 285 may have a bore or cavity therein. The bore or cavity in the insulating member 285 may correspond, overlap or align with at least one of the bore 800A in the first circuit board 800, the bore 501 in the second circuit board 250 and the bore 71 in the holder 270 in the optical axis direction.

[0372] For example, although the connection elastic member 280 may include four dummy members 28 - 1 to 28 - 4 , the number of dummy members is not limited thereto. In another embodiment, the number of dummy members may be any number greater than or equal to one.

[0373] For example, each of the dummy members 28 - 1 to 28 - 4 may be disposed between two adjacent groups 1A and 2A, 2A and 3A, 3A and 4A, or 4A and 1A of the connecting elastic members 280 .

[0374] For example, the connecting elastic member 280 may include a dummy member 28-3 arranged at a first corner or a first corner area between the first group 1A and the second group 2A of the insulating member 285, a dummy member 28-2 arranged at a second corner or a second corner area between the second group 2A and the third group 3A of the insulating member 285, a dummy member 28-1 arranged at a third corner or a third corner area between the third group 3A and the fourth group 4A of the insulating member 285, and a dummy member 28-4 arranged at a fourth corner or a fourth corner area between the fourth group 4A and the first group 1A of the insulating member 285.

[0375] Each of the dummy members 28 - 1 to 28 - 4 may have an escape portion configured to avoid spatial interference with the protrusion 275 of the holder 270 .

[0376] The insulating member 285 may include a main body 85A and an extension portion 85B, wherein the main body 85A is arranged on the first portion 31a of the first coupler 31 connecting the springs 1-1 to 1-9, 2-1 to 2-9, 3-1 to 3-9 and 4-1 to 4-9, a portion of the second surface 70B of the retainer 270, and some portions of the dummy members 28-1 to 28-4, and the extension portion 85B extends toward other portions of the dummy members 28-1 to 28-4.

[0377] For example, the main body 85A of the insulating member 285 can be arranged on the second surface 70B of the retainer 270 adjacent to the bore 71 in the retainer 270, and can be configured to have a ring form having a closed curve shape. For example, although the main body 85A can be configured to have a quadrilateral ring form, the present disclosure is not limited thereto. In another embodiment, the main body 85A can be configured to have a circular or polygonal ring form.

[0378] For example, the body 85A may have a bore or cavity therein that corresponds to, overlaps or aligns with the bore 800A in the first circuit board 800, the bore 501 in the second circuit board 250 and the bore 71 in the holder 270 in the optical axis direction.

[0379] Although the extension 85B may be configured to have a straight line shape, the present disclosure is not limited thereto. In another embodiment, the extension 85B may be configured to have at least one of a straight line shape and a curved line shape. For example, the extension 85B may include a plurality of extensions that may be arranged to be spaced apart from each other.

[0380] The extension portion 85B may serve to increase the contact area with each of the dummy members 28 - 1 to 28 - 4 , thereby further increasing the rigidity of the connection elastic member 280 .

[0381] The supporting member 220 may conductively connect the first circuit board 800 to the connecting elastic member 280 .

[0382] The supporting member 220 may include a plurality of groups of supporting members corresponding to the groups 1A to 4A connecting the elastic members 280. Each of the plurality of groups may include a plurality of supporting members (or wirings).

[0383] For example, the support member 220 may include a plurality of support members corresponding to a plurality of connection springs. The support member may alternatively be referred to as a "wiring".

[0384] The support member 220 may be coupled to the first circuit board 800 at one end thereof and coupled to the second coupler 32 connecting the spring 281 at the other end thereof.

[0385] For example, one end of the support member 220 can be coupled to the first surface (e.g., upper surface) 44A of the first circuit board 800 via the first solder 901 through the drilled hole 800A in the first circuit board 800, and the other end of the support member 220 can be coupled to the lower portion or lower surface of the second coupler 32 connecting the spring 281 via the second solder 902 through the hole 32A in the second coupler 32.

[0386] The support member 220 may extend through the avoidance area in the housing 450 , the hole 250A in the second circuit board 250 , and the hole 270A in the holder 270 , thereby avoiding spatial interference with the housing 450 , the second circuit board 250 , and the holder 270 .

[0387] Each of the support members 220 may be implemented as a member that is conductive and provides elastic support, such as a suspension wire, a leaf spring, or a coil spring.

[0388] The image sensor unit 350 may further include a filter 610. The image sensor unit 350 may further include a filter holder 600 in which the filter 610 is arranged, placed or received. The filter holder 600 may alternatively be referred to as a "sensor base."

[0389] The filter 610 may be used to prevent light within a specific frequency band that has passed through the lens barrel 400 from being introduced into the image sensor 810 .

[0390] The filter 610 may be, for example, an infrared light blocking filter, but is not limited thereto. For example, the filter 610 may be oriented parallel to an XY plane perpendicular to the optical axis OA.

[0391] The filter 610 may be disposed under the lens module 400 .

[0392] The filter holder 600 may be disposed below the AF operation unit 100. For example, the filter holder 600 may be disposed on the connection plate 260.

[0393] The filter holder 600 may be coupled to the area of ​​the connection board surrounding the image sensor 810 and may be exposed through the drill hole 800A in the first circuit board 800 and the drill hole 501 in the second circuit board 250. For example, the filter holder 600 may be exposed through the drill hole 800A in the first circuit board 800 and the drill hole 501 in the second circuit board 250.

[0394] For example, the filter holder 600 may be coupled to an area surrounding the seating area 260A of the first surface (eg, upper surface) of the connection plate 260. Fig.12 The middle seating area 260A is the same surface as the first surface of the connection plate 260, but the present disclosure is not limited thereto. In another embodiment, the seating area 260A may be a groove or a protrusion.

[0395] In another embodiment, the filter holder 600 may be coupled to the holder 270 or the AF operating unit 100 .

[0396] The drill hole 501 in the second circuit board 250 may expose therethrough the filter holder 600 arranged at the second circuit board 250 and the filter 610 arranged at the connection board 260 .

[0397] The filter holder 600 may have a bore hole 600A therein, which is formed in a region of the filter holder 600 where the filter 610 is mounted or arranged to allow light having passed through the filter 610 to enter the image sensor 810. The bore hole 600A in the filter holder 600 may be configured to have the form of a through hole formed in the optical axis direction through the filter holder 600. For example, the bore hole 600A in the filter holder 600 may be formed through the center of the filter holder 600 and may be positioned to correspond to or face the image sensor 810.

[0398] The filter holder 600 may have a seating portion 500 in which the filter 610 is seated. The filter 610 may be arranged, seated, or installed in the seating portion 500. The seating portion 500 may be formed to surround the bore 600A. In another embodiment, the seating portion 500 of the filter holder 600 may be configured to have a protrusion protruding from the upper surface of the filter 610.

[0399] The image sensor unit 350 may further include an adhesive member 612 disposed between the filter 610 and the seating portion 500 , and the filter 610 may be coupled or attached to the filter holder 600 via the adhesive member 612 .

[0400] The image sensor unit 350 may further include an adhesive member 61 disposed between the filter holder 600 and the connection plate 260 , and the filter holder 600 may be coupled or attached to the connection plate 260 via the adhesive member 61 .

[0401] For example, the adhesive members 612 and 61 may be epoxy resin, a heat-hardening adhesive, or an ultraviolet-hardening adhesive.

[0402] The camera module 10 may further include a cover member 300 and a base 210 to accommodate the AF operation unit 100 and the image sensor unit 350 therein to protect the AF operation unit 100 and the image sensor unit 350 from external impact and to prevent the introduction of external foreign substances.

[0403] The cover member 300 may be configured to have a box form, which is open at the bottom and includes an upper plate 301 and a side plate 302. A lower portion of the side plate 302 of the cover member 300 may be coupled to the base 210. The upper plate 301 of the cover member 300 may be configured to have a polygonal shape, such as a square shape, an octagonal shape, etc.

[0404] The cover member 300 may have a bore hole therein formed through the upper plate 301 to expose a lens (not shown) coupled to the bobbin 110 to external light.

[0405] The base 210 may be disposed under the holder 270. The base 210 may be configured to have a shape that is consistent with or corresponds to the shape of the cover member 300, for example, a quadrangular shape.

[0406] For example, the bore hole C3 in the base 210 may be a through hole formed through the base 210 in the optical axis direction.

[0407] The base 210 may include a step 211 (see Fig.18 ), when the cover member 300 is adhesively fixed to the base 210, an adhesive is applied to the step 211. Here, the step 211 may guide the side plate 302 of the cover member 300 coupled to the upper side of the base 210. The lower end of the side plate 302 of the cover member 300 may be joined or fixed to the step 211 of the base 210 by an adhesive or the like.

[0408] Although the lower portion or lower side of the base 210 may be closed or blocked by the bottom cover 219, the present disclosure is not limited thereto. In another embodiment, the bottom cover 219 may be omitted.

[0409] The fixed portion and the movable portion of the image sensor unit 350 according to the embodiment will be described with respect to the OIS operation.

[0410] The image sensor unit 350 may include a fixed portion, a movable portion (or moving portion), and connecting portions 220 and 280 connecting the fixed portion to the movable portion. The movable portion may alternatively be referred to as an "OIS movable portion (or OIS moving portion)". The OIS movable portion may be movable relative to the fixed portion in a direction perpendicular to the optical axis OA.

[0411] The length of the support member 220 may be greater than the sum of the thickness of the fixed part 700 and the thickness of the movable part. Therefore, the movable part arranged below the OIS fixed part may be spaced apart from the fixed part by a predetermined distance through the elastic support members 220 and 280. Specifically, by the electromagnetic force generated by the interaction between the magnet 23 and the coil 230, the movable part may move relative to the fixed part, which is in a state of being suspended from the movable part via the support member 220 (in a flying state).

[0412] By the electromagnetic force generated by the interaction between the second coil 230 and the magnet 23 , the OIS movable part may move relative to the fixed part in a direction perpendicular to the optical axis.

[0413] For example, the image sensor 810 may be offset or tilted in a direction perpendicular to the optical axis OA, or may be rotated around the optical axis OA, through the interaction between the magnet 23 and the second coil 230. For example, the optical axis direction may be a direction perpendicular to one surface of the image sensor 810. For example, one surface of the image sensor 810 may be an upper surface of the image sensor 810. Alternatively, one surface of the image sensor 810 may be a surface corresponding to or facing the lower surface of the lens module 400 or the filter 610.

[0414] By means of the supporting member 220 and the connecting elastic member 280, the OIS movable portion may be elastically supported and may be movable in a direction perpendicular to the optical axis.

[0415] The fixing portion may include the first circuit board 800, the housing 450, and the magnet 23. In addition, the fixing portion may include the base 210 and the cover member 300.

[0416] The OIS movable part may include a second circuit board 250, a second coil 230, a connection plate 260, and an image sensor 810. The OIS movable part may further include a holder 270.

[0417] In addition, the OIS movable part may include elements coupled to the second circuit board 250, such as the second position sensor 240, the motion sensor 820, the controller 830, the memory 512, and the capacitor 514. In addition, the OIS movable part may include a filter holder 600 and a filter 610.

[0418] For example, the OIS movable part may include a connecting plate 260 coupled to a connecting elastic member 280, an image sensor 810 and a second circuit board 250 coupled to the connecting plate 260, and a retainer 270 coupled to the second circuit board 250, and may be elastically supported by a supporting member 220 and a connecting elastic member 280.

[0419] The magnet 23 may be disposed at the fixed part, and the second coil 230 may be disposed at the OIS movable part. By means of the interaction between the magnet 23 and the second coil 230, the OIS movable part may be moved or tilted relative to the fixed part.

[0420] For example, the fixing portion may include the magnet 130 and the first circuit board unit 800 .

[0421] For example, the movable portion may include a holder 270 , a second circuit board unit spaced apart from the first circuit board unit 800 and coupled to the holder 270 , and a second coil 230 disposed at the second circuit board unit to face the magnet 130 .

[0422] For example, one end of the support member 220 may be coupled to the first circuit board unit 800 .

[0423] For example, the connecting elastic member 280 can be arranged at the retainer 270 and can include a first coupler 31 coupled to the second circuit board unit, a second coupler 32 coupled to the other end of the support member 220, and a connector 33 connecting the first coupler 31 to the second coupler 32.

[0424] Reference Fig. 20 and Fig.21 In order to move and tilt the OIS movable part relative to the fixed part using the electromagnetic force generated by the interaction between the magnet 23 and the second coil 230 , the OIS movable part may be spaced apart from the housing 450 and the base 210 .

[0425] For example, at an initial position of the OIS movable portion, an outer surface of the holder 270 may be spaced apart from an inner surface of the base 210 by a predetermined distance d1.

[0426] In addition, for example, at the initial position of the OIS movable portion, the lower surface of the holder 270 and the lower surface of the connecting plate 260 may be spaced apart from the bottom of the base 210 by a predetermined distance H1. In addition, at the initial position of the OIS movable portion, the lower surface of the holder 270 and the lower surface of the connecting plate 260 may be spaced apart from the front surface (or inner surface) of the bottom cover 219.

[0427] In addition, for example, at the initial position of the OIS movable part, the solder 902 may be spaced apart from the front surface (or inner surface) of the bottom cover 219. In addition, for example, at the initial position of the OIS movable part, the solder 902 may be spaced apart from the bottom of the base 210.

[0428] The initial position of the OIS movable part may be the original position of the OIS movable part when no power is applied to the second coil 23, or the position where the OIS movable part is located as a result of elastic deformation of the support member 220 and the connecting elastic member 280 only due to the weight of the OIS movable part.

[0429] In addition, the initial position of the OIS movable portion may be a position where the OIS movable portion is located when gravity acts in a direction from the first circuit board 800 to the second circuit board 250 or when gravity acts in a direction from the second circuit board 250 to the first circuit board 800.

[0430] Fig.23 A process of mounting the image sensor 810 , the filter holder 600 , and the filter 610 to the connection board 260 is shown.

[0431] Reference Fig.23 , the image sensor 810 may first be coupled, fixed or attached to the mounting area 260A of the connection board 260 by die bonding ( S110 ).

[0432] The image sensor 810 may be any one of a charge coupled device (CCD), a metal oxide semiconductor (MOS), a CPD image sensor, and a CID image sensor, but is not limited thereto.

[0433] Subsequently, the image sensor 810 may be bonded to the connection board 260 via the wires 88 so that the image sensor 810 is conductively connected to the connection board 260 ( S120 ).

[0434] Subsequently, the filter holder 600 on which the filter 610 is mounted may be mounted on the connection plate 260 via the adhesive member 61 (S130). For example, the filter 610 may be coupled to the filter holder 600 via the adhesive member 612, and then the filter holder 600 may be coupled to the connection plate 260. In another embodiment, the filter holder 600 may be coupled to the connection plate 260, and then the filter 610 may be coupled to the filter holder 600.

[0435] In a comparative example, the image sensor may be mounted on an additional sensor board, and then the sensor board may be connected to the connection board.

[0436] In the comparative example, the sensor board may be connected to the connection board by welding. Welding is an additional process, and it is difficult to connect the sensor board to the fourth circuit board. In addition, in the comparative example, during the process of welding the sensor board to the connection board, noise may be generated at the image sensor, and the image sensor may be affected by the noise. In addition, in the comparative example, due to the tolerance stacking in the process of welding the sensor board, there may be difficulties in the alignment between the lens module and the image sensor and between the lens module and the cover member.

[0437] In this embodiment, the sensor board in the comparative example is fused with the connection board to realize a single integrated fourth circuit board 260. In the example, the image sensor 810 is moved from above the image sensor unit 350 to the fourth circuit board, and then joined to the connection board 260 by chip bonding, and the image sensor is conductively connected to the connection board by wire bonding. Subsequently, the filter holder 600 and the filter 610 are moved from above the image sensor unit 350 to the connection board 260, and coupled to the connection board 260.

[0438] Compared with the comparative example, the present embodiment can simplify the process of assembling the camera. In addition, the number of soldering points in the signal path of the image sensor can be reduced, and the image sensor can be prevented from becoming inoperable or image noise can be suppressed.

[0439] In addition, compared with the comparative example, the present embodiment can simplify the assembly process and thus eliminate tolerance stacking. Therefore, it is also advantageous in managing the alignment of the lens module 400.

[0440] Furthermore, the present embodiment can provide an effect of reducing material cost and manufacturing cost by reducing the number of parts and the number of processes as compared with the comparative example.

[0441] Fig.24 A connecting elastic member 280 - 1 according to another embodiment is shown.

[0442] Reference Fig.24 , the connecting elastic member 280-1 may include a plate portion 280A and an elastic portion 280B. The plate portion 280A may alternatively be referred to as a "plate member", "circuit board", "plate" or "circuit member".

[0443] The board portion 280A may include a plurality of terminals 41 - 1 corresponding to the terminals 262 of the connection board 260 .

[0444] The plate portion 280A may have a bore hole 79 therein corresponding to the bore hole 71 in the holder 270. The bore hole 79 in the plate portion 280A may be a through hole formed through the plate portion 280A in the optical axis direction.

[0445] For example, the surface area of ​​the borehole 79 in the plate portion 280A may be greater than the surface area of ​​the second surface 60B of the connection plate 260. For example, the borehole 79 in the plate portion 280A may expose the second surface 60B of the connection plate 260 and may expose the terminal 262 of the connection plate 260.

[0446] The terminal 41-1 of the board portion 280A may include a first portion 41a and a second portion 41b. The first portion 41a of the terminal 41-1 may be disposed in the board portion 280A, and the second portion 41b of the terminal 41-1 may be exposed to the outside from the board portion 280A and may be coupled to the terminal 262 of the connection board 260 via solder.

[0447] The plate portion 280A may be disposed on the second surface 70B of the holder 270 , and may be coupled or attached to the second surface 70B of the holder 270 via an adhesive member.

[0448] For example, the board portion 280A may be implemented as a printed circuit board or an FPCB.

[0449] The elastic portion 280B may be exposed from the plate portion 280A, and may be connected to the terminal 41 - 1 of the plate portion 280A.

[0450] The elastic portion 280B may include a coupler 32A coupled to the support member 220 and a connector 33A connecting the coupler 32A to the terminal 41 - 1 .

[0451] The terminals 41 - 1 of the elastic portion 280B and the plate portion 280A may correspond to Fig.16 The connecting spring 281 is shown.

[0452] For example, the first portion 41a of the terminal 41-1 may correspond to Fig.16 The first portion 31a of the connecting spring 281 shown, and the second portion 41b of the terminal 41-1 may correspond to Fig.16 The second portion of the connecting spring 281 is shown. The description of the first portion 31a and the second portion 31b of the connecting spring 281 can be applied to the first portion 41a and the second portion 41b of the terminal 41-1 with or without modification.

[0453] In addition, the coupler 32A of the elastic portion 280B may correspond to Fig.16 The second coupler 32 of the connecting spring 281 shown, and the connector 33A of the elastic portion 280B may correspond to Fig.16 The connector 33 of the connecting spring 281 is shown. The description of the second coupler 32 and the connector 33 of the connecting spring 281 can be applied to the coupler 32A and the connector 33A of the elastic portion 280B with or without modification.

[0454] right Fig.17 The description of the groups 1A to 4A of the connecting elastic members 280 shown may be applied with or without modification to Fig.24 The connecting elastic member 280-1 is shown.

[0455] The plate portion 280A may include Fig.14 and Fig.17 , and the description of the dummy components 28 - 1 to 28 - 4 may be applied to the dummy components of the plate portion 280A with or without modification.

[0456] Fig.25 is an exploded perspective view of a camera module 20 according to another embodiment of the present invention. Fig.26 It is shown Fig.25 FIG. 1 is a diagram showing an embodiment of an AF operation unit 100-1. Figure 2 The same reference numerals are used in Fig.25 The reference numerals in FIG. 1 denote the same components, and descriptions of the same components are briefly given or omitted.

[0457] Reference Fig.25 and Fig.26 , the camera module 20 may include an AF operation unit 100-1 and an image sensor unit 350. Fig.25 In the camera module 200 shown in FIG. 1 , the AF operation unit 100-1 may be used to replace the AF operation unit 100-1. Figure 2 The lens module 400 and the AF operation unit 100 are shown.

[0458] The AF operation unit 100-1 may include a barrel unit 1110 and a lens assembly 1120. The barrel unit 1110 may alternatively be referred to as a "lens barrel" or a "holder."

[0459] The lens assembly 1120 may be mounted to the barrel unit 1110 or disposed at the barrel unit 1110 .

[0460] For example, the lens assembly 1120 may include a liquid lens cell 1130 including the liquid lens 1050. For example, the lens assembly 1120 may include at least one of the liquid lens cell 1130, the first lens cell 1111, and the second lens cell 1112.

[0461] In the lens assembly 1120 , the first lens unit 1111 may alternatively be referred to as a “first solid-state lens unit”, and the second lens unit 1112 may alternatively be referred to as a “second solid-state lens unit”.

[0462] The liquid lens unit 1130 may include a liquid lens 1050, a first terminal 1060, a second terminal 1070, and a holder 1080. In another embodiment, the liquid lens unit 1130 may not include at least one of the first terminal 1060, the second terminal 1070, and the holder 1080. For example, the liquid lens unit 1130 may include the liquid lens 1050, the first terminal 1060, and the second terminal 1070.

[0463] The first terminal 1060 may alternatively be referred to as an “upper terminal”, and the second terminal 1070 may alternatively be referred to as a “lower terminal”.

[0464] The liquid lens 1050 may be disposed between the lens of the first lens unit 1111 and the lens of the second lens unit 1112 , and may be spaced apart from both the lens of the first lens unit 1111 and the lens of the second lens unit 1112 in the optical axis direction.

[0465] The liquid lens 1050 may include a liquid lens region including different kinds of liquids, a first electrode region conductively connected to the first terminal 1060 , and a second electrode region conductively connected to the second terminal 1070 .

[0466] The liquid lens region may include a conductive first liquid and a non-conductive second liquid, and an interface may be formed between the first liquid and the second liquid.

[0467] In the liquid lens 50, the interface formed between the conductive liquid and the non-conductive liquid can be deformed in response to a driving signal (e.g., a driving current or a driving voltage) or a control signal, and the focal length of the liquid lens can be controlled by the deformed interface. Therefore, the AF operation of the lens assembly 1120 can be performed, and the focus of the camera module can be controlled.

[0468] The holder 1080 may receive or support the liquid lens 1050. For example, the holder 1080 may receive or support the liquid lens 1050, the first terminal 1060, and the second terminal 1070.

[0469] The holder 1080 may have a hole or a bore configured to receive therein the liquid lens 1050. For example, the hole or the bore in the holder 1080 configured to receive therein the liquid lens may be formed through the holder 80 in the optical axis direction.

[0470] The liquid lens 1050 may be arranged or disposed on the holder 1080. For example, the liquid lens 1050 may be arranged or disposed in a hole in the holder 1080. The liquid lens 1050, the first terminal 1060, and the second terminal 1070 may be arranged or disposed on the holder 1080.

[0471] The barrel unit 1110 may be disposed on the first circuit board 800 .

[0472] Alternatively, the barrel unit 1110 may be disposed on the housing 450 .

[0473] For example, although the shape of the outer peripheral surface of the barrel unit 1110 may be consistent with or the same as the shape of the housing 450 when viewed from above, the present disclosure is not limited thereto.

[0474] For example, the cartridge unit 1110 may be coupled to the housing 450 .

[0475] For example, the lower portion, lower end or lower surface of the barrel unit 1110 may be coupled to the upper portion, upper end or upper surface of the housing 450 by means of an adhesive member or a coupling structure. Here, the coupling structure may include a first coupler disposed at the lower portion, lower end or lower surface of the barrel unit 1110 and a second coupler disposed at the upper portion, upper end or upper surface of the housing 450. The first coupler may be a protrusion or a groove (or a hole), and the second coupler may be a groove (or a hole) or a protrusion.

[0476] The barrel unit 1110 may have a hole or opening 1118, and the liquid lens unit 1130 may be mounted or inserted into the hole or opening 1118. The hole or opening 1118 in the barrel unit 1110 may be formed through the barrel unit 1110 in a direction perpendicular to the optical axis, and the liquid lens unit 1130 may be inserted into the hole or opening 1118 in the barrel unit 1110 in a direction perpendicular to the optical axis, and may be mounted or coupled to the barrel unit 1110.

[0477] The lens assembly 1120 may correspond to or face the filter 610 and the image sensor 810 in the direction of the optical axis OA. For example, the liquid lens 1050 may correspond to or face the filter 610 and the image sensor 810 in the direction of the optical axis OA.

[0478] As camera technology develops, the resolution of images is getting higher and higher, and thus the size of image sensors is increasing. As the size of image sensors is increasing, the size of lens modules and the size of actuators for shifting the lens modules are also increasing. Therefore, not only the weight of the lens modules increases, but also the weight of other actuator components for moving the lens modules increases.

[0479] According to an embodiment of the present invention, auto focusing is performed using the AF operation unit (or first actuator) 100 operated in a lens shift manner, and optical image stabilization (OIS) is performed using the image sensor unit (or second actuator) 350 operated in an image sensor shift manner, thereby improving the reliability of the camera device.

[0480] This embodiment can perform 5-axis hand shake correction using a sensor offset method. For example, the 5-axis hand shake may include two angular hand shakes (e.g., pitch and yaw), two offset hand shakes (e.g., x-axis offset and y-axis offset), and one rotational hand shake (e.g., roll).

[0481] The camera module 10 or 20 according to the embodiment may be included in an optical instrument designed to form an image of an object in space using reflection, refraction, absorption, interference, diffraction, etc. as characteristics of light, extend vision, record an image obtained through a lens or reproduce an image, perform optical measurement, or propagate or transmit an image. For example, although the optical instrument according to the embodiment may be a mobile phone, a cellular phone, a smart phone, a portable smart instrument, a digital camera, a laptop computer, a digital broadcast terminal, a PDA (personal digital assistant), a PMP (portable multimedia player), a navigation device, etc., the present disclosure is not limited thereto. In addition, any device capable of taking an image or a photo is possible.

[0482] Fig. 27 is a perspective view showing a portable terminal 200A according to an embodiment. Fig.28 It is shown Fig. 27 A view showing the configuration of a portable terminal.

[0483] Reference Fig. 27 and Fig.28 The portable terminal (hereinafter referred to as "terminal") 200A may include a main body 850, a wireless communication unit 710, an audio / video (A / V) input unit 720, a sensing unit 740, an input / output unit 750, a memory unit 760, an interface unit 770, a controller 780 and a power supply unit 790.

[0484] Fig. 27 The body 850 shown in FIG. 8 has a bar shape, but is not limited thereto, and may be any of various types such as a sliding type, a folding type, a swing type, or a rotation type in which two or more sub-bodies are coupled to be movable relative to each other.

[0485] The body 850 may include a shell (housing, housing, cover, etc.) defining the appearance of the terminal. For example, the body 850 may be divided into a front shell 851 and a rear shell 852. Various electronic components of the terminal may be accommodated in a space defined between the front shell 851 and the rear shell 852.

[0486] The wireless communication unit 710 may include one or more modules, and the one or more modules implement wireless communication between the terminal 200A and the wireless communication system or between the terminal 200A and the network in which the terminal 200A is located. For example, the wireless communication unit 710 may include a broadcast receiving module 711, a mobile communication module 712, a wireless Internet module 713, a near field communication module 714, and a location information module 715.

[0487] The A / V input unit 720 is used to input an audio signal or a video signal, and may include, for example, a camera 721 and a microphone 722 .

[0488] The camera 721 may include the camera module 10 or 20 according to the embodiment.

[0489] The sensing unit 740 can sense the current state of the terminal 200A, for example, the opening or closing of the terminal 200A, the position of the terminal 200A, the presence of a user touch, the orientation of the terminal 200A, or the acceleration / deceleration of the terminal 200A, and can generate a sensing signal to control the operation of the terminal 200A. When the terminal 200A is, for example, a sliding-type cellular phone, the sensing unit 740 can sense whether the sliding-type cellular phone is opened or closed. In addition, the sensing unit 740 can sense the supply of power from the power supply unit 790, the coupling of the interface unit 770 with an external device, etc.

[0490] The input / output unit 750 is used to generate, for example, visual, auditory or tactile input or output. The input / output unit 750 may generate input data to control the operation of the terminal 200A, and may display information processed in the terminal 200A.

[0491] The input / output unit 750 may include a keyboard unit 730, a display module 751, a sound output module 752, and a touch screen panel 753. The keyboard unit 730 may generate input data in response to input on the keyboard.

[0492] The display module 751 may include a plurality of pixels whose colors vary according to electrical signals applied thereto. For example, the display module 751 may include at least one of a liquid crystal display, a thin film transistor liquid crystal display, an organic light emitting diode, a flexible display, and a 3D display.

[0493] The sound output module 752 may output audio data received from the wireless communication unit 710 in, for example, a call signal reception mode, a call mode, a recording mode, a voice recognition mode, or a broadcast reception mode, or may output audio data stored in the memory unit 760 .

[0494] The touch screen panel 753 may convert a capacitance variation caused by a user's touch on a specific area of ​​the touch screen into an electric input signal.

[0495] The memory unit 760 may temporarily store a program for processing and control of the controller 780 and input / output data (e.g., phone numbers, messages, audio data, still images, moving images, etc.). For example, the memory unit 760 may store images captured by the camera 721, such as pictures or moving images.

[0496] The interface unit 770 serves as a path through which the lens moving device is connected to an external device connected to the terminal 200A. The interface unit 770 may receive power or data from an external component and may transmit it to a corresponding constituent element inside the terminal 200A, or may transmit data inside the terminal 200A to an external component. For example, the interface unit 770 may include a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting to a device equipped with an identification module, an audio input / output (I / O) port, a video input / output (I / O) port, an earphone port, and the like.

[0497] The controller 780 may control general operations of the terminal 200A. For example, the controller 780 may perform control and processing related to, for example, voice calls, data communications, and video calls.

[0498] The controller 780 may include a multimedia module 781 for multimedia playback. The multimedia module 781 may be implemented in the controller 780 or may be implemented separately from the controller 780.

[0499] The controller 780 may perform a pattern recognition process capable of recognizing a writing input or a drawing input performed on the touch screen as characters and images, respectively.

[0500] The power supply unit 790 may provide power required to operate corresponding constituent elements upon receiving external power or internal power under the control of the controller 780 .

[0501] The embodiments of the present disclosure disclose but are not limited to the following schemes:

[0502] Solution 1. A camera module, comprising:

[0503] case;

[0504] a first circuit board arranged on the housing;

[0505] a magnet disposed on the housing;

[0506] a retainer spaced apart from the housing;

[0507] a second circuit board coupled to the holder;

[0508] a coil disposed on the second circuit board to align with the magnet;

[0509] A connection plate including a first terminal;

[0510] An image sensor disposed on the connecting board;

[0511] a support member coupled at one end thereof to the first circuit board; and

[0512] The connecting elastic member includes a first coupler disposed on the holder and coupled to the first terminal, a second coupler coupled to the other end of the supporting member, and a connector connecting the first coupler to the second coupler.

[0513] Solution 2. The camera module according to Solution 1, wherein the connection elastic member is arranged on a second surface of the holder opposite to the first surface of the holder, the first surface facing the second circuit board.

[0514] Solution 3. The camera module according to Solution 1, wherein the support member extends through the second circuit board and the holder.

[0515] Solution 4. The camera module according to Solution 1, wherein the second circuit board includes a second terminal, and the connecting board includes a third terminal conductively connected to the second terminal of the second circuit board.

[0516] Option 5. The camera module according to Option 1, wherein the second coupler is spaced apart from the holder.

[0517] Solution 6. The camera module according to Solution 1, wherein a width of the connector is smaller than any one of a width of the first coupler and a width of the second coupler.

[0518] Solution 7. The camera module according to Solution 1, wherein the first circuit board has a first bore hole exposing the image sensor, the second circuit board has a second bore hole exposing the image sensor, and the holder has a third bore hole corresponding to the connecting board.

[0519] Solution 8. A camera module according to Solution 1, wherein the first terminal of the connecting board includes a plurality of first terminals, the connecting elastic member includes a plurality of connecting springs corresponding to the plurality of first terminals, the supporting member includes a plurality of supporting members corresponding to the plurality of connecting springs, and each of the plurality of connecting springs includes a first coupler, a second coupler and a connector.

[0520] Solution 9. The camera module according to solution 1, wherein the connection elastic member includes a plurality of groups, and each of the plurality of groups includes a plurality of connection springs.

[0521] Aspect 10. The camera module according to aspect 9, wherein the connection board includes a plurality of first terminals corresponding to the plurality of connection springs.

[0522] The features, configurations, effects, etc. described in the above embodiments are included in at least one embodiment, but the present invention is not limited to these embodiments. In addition, the features, configurations, effects, etc. illustrated in each embodiment can be combined with other embodiments or modified by those skilled in the art. Therefore, the contents related to these combinations and modifications should be interpreted as falling within the scope of the disclosure.

[0523] [Industrial Applicability]

[0524] The present embodiment is applicable to a lens moving device, a camera module, and an optical apparatus, which can simplify the process of assembling a camera, reduce the number of solder joints in a signal path of an image sensor, prevent the image sensor from becoming inoperable, and suppress image noise.

Claims

1. A camera module, comprising: a fixed portion including a housing, a first circuit board portion coupled to the housing, and a magnet disposed on the housing; a movable portion disposed below the fixed portion so as to be spaced apart from the fixed portion; and a connecting portion including an upper end connected to the fixed portion and a lower end connected to the movable portion and configured to support the movable portion, Wherein, the movable part comprises: a retainer spaced apart from the housing; a second circuit board portion coupled to the holder and disposed below the first circuit board portion; a coil arranged on the second circuit board to be positioned below the magnet; and an image sensor arranged on the second circuit board portion, wherein the movable portion connected to the lower end of the connecting portion is configured to move or tilt in a direction perpendicular to the optical axis through interaction between the magnet and the coil.

2. The camera module according to claim 1, wherein: The connecting portion includes a supporting member configured to support the movable portion, and Wherein, the length of the supporting member is greater than the sum of the thickness of the fixed part and the thickness of the movable part.

3. The camera module according to claim 1, wherein: The connection portion includes wiring.

4. The camera module according to claim 1, wherein: The connection portion includes a plurality of wirings spaced apart from each other.

5. The camera module according to claim 3, wherein: A lower end of the connection portion is coupled to the second circuit board portion.

6. The camera module according to claim 1, wherein: The coil is positioned higher than the holder.

7. The camera module according to claim 1, wherein: The second circuit board portion has a drilled hole through which the image sensor is exposed.

8. The camera module according to claim 1, wherein: The movable portion is configured to be displaced or tilted in a direction perpendicular to the optical axis by interaction between the magnet and the coil, and the optical axis is perpendicular to one surface of the image sensor.

9. The camera module of claim 1, comprising a lens module spaced apart from the image sensor.

10. The camera module of claim 9, comprising a filter arranged on the image sensor.

11. The camera module according to claim 10, wherein: The movable portion includes a filter holder arranged around the image sensor, and the filter is arranged on the filter holder.

12. The camera module according to claim 11, wherein: The coil includes a plurality of coil units, and the magnet includes a plurality of magnets corresponding to the plurality of coil units.

13. The camera module according to claim 1, wherein: The first circuit board portion is positioned higher than the second circuit board portion and the image sensor.

14. The camera module according to claim 1, wherein: The coil is arranged to be opposed to the magnet in a direction parallel to the optical axis.

15. The camera module according to claim 1, wherein: The movable portion includes a position sensor that is arranged on the second circuit board portion and is configured to detect movement of the movable portion in a direction perpendicular to the optical axis.

16. A camera module, comprising: A fixing portion including a first circuit board portion; a movable portion arranged below the fixed portion and including a holder, a second circuit board portion, and an image sensor arranged on the second circuit board portion; and a connecting portion connecting the fixed portion and the movable portion, wherein the movable part is configured to be movable or tiltable relative to the fixed part in a direction perpendicular to the optical axis, wherein the connecting portion comprises a supporting member including an upper end connected to the fixed portion and a lower end connected to the movable portion, and The first circuit board portion includes a first region connected to an upper end of the support member, a second region including a connector, and a third region connecting the first region and the second region.

17. The camera module according to claim 16, wherein: The length of the supporting member in a direction parallel to the optical axis is greater than the sum of the thickness of the fixed portion in the direction parallel to the optical axis and the thickness of the movable portion in the direction parallel to the optical axis.

18. The camera module according to claim 16, wherein: The supporting member is a wiring.

19. The camera module according to claim 16, wherein: The first circuit board is positioned higher than the image sensor.

20. A camera module, comprising: a fixed portion including a first circuit board portion, a housing, and a magnet positioned on the housing; a movable portion disposed below the fixed portion to be spaced apart from the fixed portion; and a connecting portion connecting the fixed portion and the movable portion, Wherein, the movable part includes: The second circuit board part, an image sensor disposed on the second circuit board portion, a coil opposite to the magnet, and a controller disposed on and electrically connected to the second circuit board portion, and wherein the controller is configured to control a signal supplied to the coil, and The movable portion is configured to move or tilt in a direction perpendicular to the optical axis through interaction between the magnet and the coil.

21. The camera module according to claim 20, wherein: The controller is a driver integrated circuit.

22. The camera module according to claim 20, wherein: The second circuit board portion includes a second circuit board and a connection board arranged below the second circuit board, and Wherein, the image sensor is arranged on the connecting board, and the controller is arranged on the second circuit board.

23. The camera module of claim 22, wherein: The coil is arranged on the second circuit board.

24. A camera module, comprising: a fixed portion including a first circuit board portion; a movable portion disposed below the fixed portion and including a second circuit board portion and an image sensor disposed on the second circuit board portion; and A connecting portion connects the fixed portion and the movable portion.

25. An optical device comprising a camera module according to any one of claims 1 to 24.

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