Circuit board supporting equipment in solder paste printing machine and working method of circuit board supporting equipment

Abstract

The invention discloses circuit board supporting equipment in a solder paste printing machine and a working method of the circuit board supporting equipment. The plurality of supporting units are placed on the supporting platform; the transplanting device is used for transplanting the supporting unit; the control center is in signal connection with the transplanting device and is used for controlling the operation of the transplanting device; and the positioning device is in signal connection with the control center, and the positioning device is used for identifying and uploading the position information of the supporting units to the control center. Based on the universality of the supporting unit, the traditional method that each circuit board is equipped with a base plate is replaced, so that the equipment cost is obviously reduced. Meanwhile, a transplanting device and a positioning device which are cooperatively controlled by the control center are further arranged in the scheme, rapid and automatic replacement of the supporting units is achieved, the labor cost is reduced, and the problems of time waste and efficiency reduction caused by manual replacement of the base plate are effectively avoided.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board production equipment, and in particular to a circuit board supporting device in a solder paste printer and a working method thereof. Background Art

[0002] In the current circuit board solder paste printing process, circuit boards are generally transported through conveyor lines. After the circuit boards are transferred from the feeding section conveyor line to the middle section conveyor line, the Z-axis lifting mechanism of the middle section conveyor line provides bottom support for the circuit boards and lifts them to a suitable distance from the steel mesh, preparing for subsequent CCD photography and deviation correction and positioning operations. After the deviation correction and positioning are completed, solder paste printing and subsequent inspection work are carried out.

[0003] However, in previous printing processes, pads were mostly used to support the bottom of circuit boards. Different types of circuit boards corresponded to pads of different sizes. Therefore, multiple types of pads must be prepared to meet unexpected needs. The cost of preparing multiple types of pads is obviously high. Moreover, when the circuit board model needs to be changed during the production process, the pads need to be manually disassembled and replaced simultaneously, and manual replacement of pads will result in greater labor costs. In addition, the manual disassembly and replacement of pads is slow, and frequent manual replacement will greatly reduce the production efficiency of the entire line. Summary of the invention

[0004] The purpose of the embodiments of the present invention is to provide a circuit board supporting device in a solder paste printer and a working method thereof, which can solve the above-mentioned problems existing in the prior art.

[0005] To achieve the above objectives, this application adopts the following technical solutions: In one aspect, a circuit board supporting device in a solder paste printer is provided, comprising: Support platform; A plurality of support units are placed on the support platform; A transplanting device, used for transplanting the supporting unit; A control center, connected to the transplanting device by signal, for controlling the operation of the transplanting device; A positioning device is connected to the control center signal, and the positioning device is used to identify and upload the position information of the support unit to the control center.

[0006] Optionally, the transplanting device includes a transfer mechanism and a pick-and-place mechanism, wherein the pick-and-place mechanism is installed at the movable end of the transfer mechanism and is driven to move by the transfer mechanism; the pick-and-place mechanism includes an adsorption component, and the adsorption component grabs the support unit through negative pressure adsorption.

[0007] Optionally, the picking and placing mechanism also includes an adsorption mounting block, which is installed on the transfer mechanism; the adsorption assembly includes a precision buffer, a suction cup connector and an adsorption cup connected in sequence; a first air duct is provided in the adsorption assembly, and the adsorption mounting block is provided with an air suction hole and an air blowing hole, the air suction hole is connected to an air suction pipe, and the air blowing hole is connected to an air blowing pipe; the precision buffer is installed on the adsorption mounting block, and the first air duct connects the air suction hole and the air blowing hole.

[0008] Optionally, the support unit includes a support head and a piston cylinder, a piston is provided in the piston cylinder, the support head is connected to the piston cylinder, and a second air passage connecting the support head and the piston cylinder is provided in the support unit; a magnet is installed in the piston.

[0009] Optionally, the support unit also includes a transfer tube connected between the support head and the piston cylinder, the support head includes a connected mounting portion and a needle tube, the mounting portion is connected to the transfer tube, and the needle tube is suitable for being inserted into the first air channel of the adsorption assembly so that the second air channel is connected to the first air channel.

[0010] Optionally, the transfer mechanism includes an X-axis movable group, a Y-axis movable group and a Z-axis movable group, the Y-axis movable group is installed at the movable end of the X-axis movable group, and the Y-axis movable group can be driven to translate along the X-axis direction through the X-axis movable group; the Z-axis movable group is installed at the movable end of the Y-axis movable group, and the Z-axis movable group can be driven to translate along the Y-axis direction through the Y-axis movable group; the pick-and-place mechanism is installed at the movable end of the Z-axis movable group, and the pick-and-place mechanism can be driven to translate along the Z direction through the Z-axis movable group.

[0011] Optionally, the Z-axis movable group includes a Z-axis fixed seat and a Z-axis driver installed on the Z-axis fixed seat, the pick-and-place mechanism is connected to the Z-axis driver, and the pick-and-place mechanism is driven to translate along the Z-axis direction by the Z-axis driver; the Z-axis fixed seat is also provided with an upper buffer limit column and a lower buffer limit column arranged at intervals up and down, and the upper buffer limit column and the lower buffer limit column limit the travel of the pick-and-place mechanism along the Z-axis direction.

[0012] Optionally, the Z-axis fixing seat is provided with an upper spring support, and the pick-and-place mechanism is provided with a lower spring support. The upper spring support and the lower spring support are respectively connected to two ends of a tension spring, and the pick-and-place mechanism is pulled upward and reset by the tension spring.

[0013] Optionally, the positioning device is based on the principle of visual positioning, and includes a positioning camera installed at the active end of the Y-axis active group. The positioning camera follows the pick-and-place mechanism and translates synchronously along the X-axis and Y-axis directions.

[0014] On the other hand, a working method of the circuit board supporting device in the above-mentioned solder paste printer is provided, characterized in that it comprises the steps of: The control center combines the position information fed back by the positioning device to control the transplanting device to grab the support unit at the exact position, and then determines the target placement position of the support unit according to the loaded circuit board model, and transplants the grabbed support unit to the target placement position. The transplanting action is repeated multiple times to place multiple support units one by one in each target placement position.

[0015] The beneficial effects of the present application are as follows: the circuit board support device in the solder paste printer provided by the present invention can be used to provide support for the circuit board in the solder paste printing process. By setting up a plurality of transplantable support units, when the circuit board model is changed, it is only necessary to directly transplant the support unit to the appropriate support position according to the model of the circuit board. Based on the versatility of the support unit, the traditional practice of equipping each circuit board with a pad is replaced, which obviously reduces the equipment cost. At the same time, the present solution is also equipped with a transplanting device and a positioning device controlled by the control center, which realizes the rapid and automatic replacement of the support unit, which not only reduces the labor cost, but also effectively avoids the time waste and efficiency reduction caused by manual replacement of the pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present application is further described in detail below based on the drawings and embodiments.

[0017] Figure 1 This is a schematic structural diagram of a circuit board support device in a solder paste printer according to an embodiment of the present application; Figure 2 This is a schematic diagram of the structure of the transfer mechanism described in the embodiment of the present application; Figure 3 It is a structural schematic diagram of the pick-and-place mechanism and the Z-axis movable group described in the embodiment of the present application; Figure 4 for Figure 3 A schematic diagram of another view of the structure shown; Figure 5 This is a schematic diagram of the structure of the support unit described in the embodiment of the present application; Figure 6 This is an exploded schematic diagram of the support unit described in the embodiment of the present application; Figure 7 This is a schematic diagram of the structure of the support platform described in the embodiment of the present application.

[0018] In the figure: 1. Support platform; 11. Lifting mechanism; 2. Support unit; 21. Support head; 211. Needle tube; 212. Mounting part; 22. Transfer tube; 23. Piston cylinder; 24. Piston; 25. Magnet; 26. Piston sealing cover; 27. Base stopper; 3. Transplanting device; 31. Transfer mechanism; 311. X-axis movable group; 312. Y-axis movable group; 313. Z-axis movable group; 3131. Z-axis driver; 3132. Z-axis fixed Seat; 3133, Z guide rail; 3134, Z slider; 3135, upper buffer limit column; 3136, lower buffer limit column; 3137, tension spring; 3138, upper spring support; 3139, lower spring support; 32, pick-and-place mechanism; 321, adsorption assembly; 3211, precision buffer; 3212, buffer adapter; 3213, suction cup connector; 3214, adsorption disc; 322, adsorption mounting block; 4, positioning device. DETAILED DESCRIPTION

[0019] In order to make the technical problems solved by this application, the technical solutions adopted, and the technical effects achieved more clearly, the technical solutions of the embodiments of this application are further described in detail below. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0020] In the description of this application, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0021] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0022] In the current circuit board solder paste printing process, circuit boards are generally transported through conveyor lines. After the circuit boards are transferred from the feeding section conveyor line to the middle section conveyor line, the Z-axis lifting mechanism of the middle section conveyor line provides bottom support for the circuit boards and lifts them to a suitable distance from the steel mesh, preparing for subsequent CCD photography and deviation correction and positioning operations. After the deviation correction and positioning are completed, solder paste printing and subsequent inspection work are carried out.

[0023] However, in previous printing processes, pads were mostly used to support the bottom of circuit boards. Different types of circuit boards corresponded to pads of different sizes. Therefore, multiple types of pads must be prepared to meet unexpected needs. The cost of preparing multiple types of pads is obviously high. Moreover, when the circuit board model needs to be changed during the production process, the pads need to be manually disassembled and replaced simultaneously, and manual replacement of pads will result in greater labor costs. In addition, the manual disassembly and replacement of pads is slow, and frequent manual replacement will greatly reduce the production efficiency of the entire line.

[0024] In order to overcome the above technical problems, refer to Figure 1 , this embodiment provides a circuit board supporting device in a solder paste printer, comprising: Support platform 1; A plurality of support units 2 are placed on the support platform 1; A transplanting device 3, used for transplanting the supporting unit 2; A control center, connected to the transplanting device 3 by signal, for controlling the operation of the transplanting device 3; The positioning device 4 is connected to the control center by signal, and is used to identify and upload the position information of the support unit 2 to the control center.

[0025] The support platform 1 is the foundation of the entire device and is used to carry multiple support units 2. The support platform 1 needs to be designed to be stable to ensure that it does not shake or move during the transplanting process. In some embodiments, the bottom of the support platform 1 can be equipped with a lifting mechanism 11 to facilitate the lifting and adjusting of the height of the support platform 1 during the transplanting of the support unit 2 or the alignment of the circuit board and the steel mesh.

[0026] There are multiple support units 2, which are placed on the support platform 1, and the placement positions can be adjusted according to needs, so that the layout of the support units 2 on the support platform 1 corresponds to the shape of the supported circuit board, so as to achieve the purpose of point support for the circuit board. In the specific setting, the shapes of the support units 2 are the same, which has flexible versatility. Only by adjusting the layout of the support units 2, the shapes of circuit boards of various models can be used.

[0027] The transplanting device 3 is used to transplant the support unit 2 on the support platform 1 to achieve rapid transfer of the support unit 2. The transplanting device 3 needs to have accurate positioning capability and sufficient grasping force, and can stably grasp the support unit 2 and transfer it to ensure accurate placement of the support unit 2.

[0028] The positioning device 4 is used to identify the position information of the support unit 2 and upload it to the control center. The positioning device 4 may adopt optical, mechanical or electromagnetic methods and must have high precision and high reliability.

[0029] The control center is the "brain" of the entire device, responsible for receiving the position information of the positioning device 4 and controlling the operation of the transplanting device 3. The control center must have strong data processing capabilities and precise control accuracy to ensure the smooth progress of the transplanting process.

[0030] The circuit board support device in the solder paste printer of this embodiment is used to support the circuit board. When the model of the circuit board is changed, the model information of the circuit board to be replaced can be loaded into the control center first. According to the model information of the circuit board, the control center determines the required number of support units 2 and the placement position. After that, the positioning device 4 identifies the position information of the support unit 2 on the current support platform 1 and uploads it to the control center. The control center controls the transplanting device 3 to grab the support unit 2 at the accurate position according to the position information, and places the target placement position of the support unit 2 as required. The control center controls the transplanting device 3 to transplant the grabbed support unit 2 to the target placement position. The control center repeats the above transplanting action to place multiple support units 2 one by one in each target placement position. When all support units 2 are placed, the circuit board can be placed on the support unit 2.

[0031] In summary, the circuit board support device in the solder paste printer provided in this embodiment can be used to provide support for the circuit board in the solder paste printing process. By setting up multiple transplantable support units 2, when the circuit board model is changed, it is only necessary to directly transplant the support unit 2 to the appropriate support position according to the model of the circuit board. Based on the versatility of the support unit 2, it replaces the traditional practice of equipping each circuit board with a pad, which obviously reduces the equipment cost. At the same time, this solution is also equipped with a transplanting device 3 and a positioning device 4 controlled by the control center, which realizes the rapid and automatic replacement of the support unit 2, which not only reduces the labor cost, but also effectively avoids the time waste and efficiency reduction caused by manual replacement of the pad.

[0032] In one embodiment, referring to Figure 2-Figure 4The transplanting device 3 includes a transfer mechanism 31 and a pick-and-place mechanism 32. The pick-and-place mechanism 32 is installed at the movable end of the transfer mechanism 31, and the pick-and-place mechanism 32 is driven to move by the transfer mechanism 31; the pick-and-place mechanism 32 includes an adsorption component 321, and the adsorption component 321 grabs the support unit 2 through negative pressure adsorption.

[0033] The transfer mechanism 31, as the main part of the transplanting device 3, is responsible for driving the pick-up and placement mechanism 32 to move horizontally and / or vertically. The design of the transfer mechanism 31 must have sufficient rigidity and precision to ensure the stability and accuracy of the pick-up and placement mechanism 32 during movement.

[0034] The pick-and-place mechanism 32 is installed at the active end of the transfer mechanism 31 and is the component that actually performs the task of grabbing and placing the support unit 2. The pick-and-place mechanism 32 is provided with an adsorption component 321, which grabs the support unit 2 by negative pressure adsorption. The working principle of the adsorption component 321 is to use the suction force generated by negative pressure to firmly adsorb the support unit 2 on the pick-and-place mechanism 32 for transfer.

[0035] During operation, when it is necessary to grab the support unit 2, the transport mechanism 31 moves the pick-and-place mechanism 32 to a suitable position above or beside the support unit 2, and the adsorption component 321 starts the negative pressure adsorption function to adsorb the support unit 2 on the pick-and-place mechanism 32. The transport mechanism 31 then drives the pick-and-place mechanism 32 to move to the target position according to the instructions of the control center. During the movement, the adsorption component 321 maintains the negative pressure adsorption state to ensure that the support unit 2 does not fall off. When the pick-and-place mechanism 32 reaches the target position, the adsorption component 321 stops the negative pressure adsorption function and releases the support unit 2. The transport mechanism 31 continues to move, and the pick-and-place mechanism 32 returns to the initial position or waits for the next grabbing task.

[0036] The coordinated use of the transport mechanism 31 and the pick-and-place mechanism 32 enables the rapid transport and placement of the support unit 2. The support unit 2 is grasped by negative pressure adsorption without manual intervention, thereby improving work efficiency. The negative pressure adsorption function of the adsorption component 321 ensures the stability and safety of the support unit 2 during the transport process.

[0037] In one embodiment, in combination Figure 3-Figure 4The pick-and-place mechanism 32 also includes an adsorption mounting block 322, which is installed on the transfer mechanism 31; the adsorption component 321 includes a precision buffer 3211, a suction cup connector 3213 and an adsorption cup 3214 connected in sequence; a first air duct is provided in the adsorption component 321, and the adsorption mounting block 322 is provided with an air suction hole and an air blowing hole, the air suction hole is connected to an air suction pipe, and the air blowing hole is connected to an air blowing pipe; the precision buffer 3211 is installed on the adsorption mounting block 322, and the first air duct is connected to the air suction hole and the air blowing hole.

[0038] The adsorption mounting block 322 is installed at the movable end of the transfer mechanism 31 as the installation base of the adsorption component 321. The adsorption component 321 includes a precision buffer 3211, a suction cup connector 3213 and a suction cup 3214. The precision buffer 3211 is installed on the adsorption mounting block 322 to play a role of buffering and shock absorption, protecting the adsorption component 321 from impact when grasping and placing the support unit 2. The suction cup connector 3213 connects the precision buffer 3211 and the suction cup 3214 to transmit negative pressure suction. The design of the suction cup connector 3213 must ensure smooth airflow and sealing. The suction cup 3214 is in direct contact with the support unit 2 and grasps the support unit 2 by negative pressure adsorption.

[0039] When it is necessary to grab the support unit 2, the transfer mechanism 31 moves the pick-and-place mechanism 32 to a suitable position above or beside the support unit 2, and provides negative pressure to the suction hole through the suction pipe, and the airflow in the first air channel is guided to the adsorption plate 3214, generating negative pressure suction force to adsorb the support unit 2 on the adsorption plate 3214. When the pick-and-place mechanism 32 reaches the target position, the blowing pipe provides positive pressure airflow to the blowing hole, and the airflow in the first air channel is guided to the adsorption plate 3214, blowing the support unit 2 on the adsorption plate 3214 off.

[0040] The design of the precision buffer 3211 and the suction cup connector 3213 ensures the stability and safety of the adsorption component 321 during the grasping and placing process. The support unit 2 is grasped and placed by negative pressure adsorption and positive pressure blowing, without manual intervention, thereby improving work efficiency.

[0041] Preferably, for the convenience of connection, a buffer adapter 3212 is provided at one end of the precision buffer 3211 for connecting to the suction cup connector 3213, and the suction cup connector 3213 is connected via the buffer adapter 3212.

[0042] In one embodiment, the support unit 2 includes a support head 21 and a piston cylinder 23, a piston 24 is provided in the piston cylinder 23, the support head 21 is connected to the piston cylinder 23, and a second air passage connecting the support head 21 and the piston cylinder 23 is provided in the support unit 2; a magnet 25 is installed in the piston 24.

[0043] The support head 21 is located at the upper part of the support unit 2, and is used to contact the circuit board and provide support. The piston cylinder 23 is the main part of the support unit 2, and is provided with a piston 24 inside, which is used to achieve the lifting and lowering of the piston 24 through air pressure changes. A magnet 25 is installed in the piston 24, which is used to generate magnetic attraction with the support platform 1 to keep the support unit 2 stable. It is located in the support unit 2, connecting the support head 21 and the piston cylinder 23, and is used to transmit air pressure changes.

[0044] When the pick-and-place mechanism 32 needs to grab the support unit 2, the first air passage of the adsorption component 321 is aligned and connected with the second air passage of the support unit 2. After the suction function is turned on, the gas in the second air passage is sucked out, forming a negative pressure, so that the piston 24 moves upward along the piston cylinder 23. When the piston 24 moves upward, the magnet 25 moves away from the support platform 1, and the adsorption component 321 sucks the support unit 2 tightly through the negative pressure.

[0045] After reaching the target position, the blowing function is turned on, and the gas enters the second air passage, causing the piston 24 to move downward along the piston cylinder 23. When the piston 24 moves downward, the magnet 25 approaches the support platform 1 (steel structure) at the bottom, and the magnetic attraction between the magnet 25 and the support platform 1 is used to keep the support unit 2 stable. At the same time, the adsorption component 321 releases the negative pressure, and the support unit 2 is placed on the support platform 1.

[0046] In this embodiment, the lifting and lowering of the support head 21 and the grasping and placement of the support unit 2 are achieved through changes in air pressure, without the need for a complex mechanical structure, thereby improving work efficiency. Importantly, in combination with the structure of air suction and air blowing, a magnet 25 that can be raised and lowered and driven by a piston 24 is provided inside. When the support unit 2 is transferred into place, the magnetic attraction between the magnet 25 and the support platform 1 can be used to ensure the stability of the support unit 2 after placement, so as to avoid displacement of the support unit 2 and affect the support of the circuit board. Moreover, when the support unit 2 is transferred, the negative pressure structure can be used to take the magnet 25 away from the support platform 1, so that the support unit 2 can be easily and stably grasped and transferred, and the magnetic attraction can be avoided to affect the grasping process of the support unit 2.

[0047] Optionally, an air-controlled manifold for controlling suction and blowing is installed on the transfer mechanism 31. The air hole manifold is provided with a pressure sensor and a gas flow meter. The pressure sensor cooperates with the gas flow meter to monitor the changes in air pressure and flow in the pipeline in real time. When the readings of the sensor and the flow meter tend to be stable and the fluctuations are slight, it can be determined that the support unit 2 has been firmly adsorbed by the adsorption component 321, and the magnet 25 deviates upward from the bottom support platform 1. The magnetic adsorption effect is weak. At this time, the support unit 2 can be easily sucked up, so the transfer mechanism 31 can perform the transfer action.

[0048] In one embodiment, referring to Figure 6The support unit 2 also includes a transfer tube 22 connected between the support head 21 and the piston cylinder 23, the support head 21 includes a connected mounting portion 212 and a needle tube 211, the mounting portion 212 is connected to the transfer tube 22, and the needle tube 211 is suitable for being inserted into the first air channel of the adsorption component 321, so that the second air channel is connected to the first air channel.

[0049] The adapter tube 22 is connected between the support head 21 and the piston cylinder 23, and plays a role of transition and connection. The support head 21 includes a connected mounting portion 212 and a needle tube 211, and the mounting portion 212 is connected to the adapter tube 22, and is used to fix and support the needle tube 211; the needle tube 211 is slender and hollow, and is suitable for being inserted into the first airway of the adsorption component 321 to ensure accurate communication between the second airway and the first airway.

[0050] When the pick-and-place mechanism 32 needs to grab the support unit 2, the needle tube 211 of the support unit 2 is aligned with the first air channel of the adsorption component 321 and inserted, and the contracted suction cup wraps the outer surface of the needle tube 211 to achieve sealing. The design of the needle tube 211 ensures the precise connection between the second air channel and the first air channel, avoiding leakage and instability during the air pressure transmission process.

[0051] In one embodiment, the piston cylinder 23 is provided with a piston sealing cover 26 and a base stopper 27 at the upper and lower ends, respectively. The piston sealing cover 26 is connected to the transfer tube 22. The base stopper 27 is a thin magnetically permeable material. The base stopper 27 can limit the piston 24 from escaping from the piston cylinder 23. When the magnet 25 is close to the support platform 1 at the bottom, the magnet 25 can be adsorbed on the support platform 1 through the base stopper 27. Preferably, the base stopper 27 is provided with an air hole.

[0052] In one embodiment, referring to Figure 1-Figure 2 The transfer mechanism 31 includes an X-axis movable group 311, a Y-axis movable group 312 and a Z-axis movable group 313. The Y-axis movable group 312 is installed at the movable end of the X-axis movable group 311, and the Y-axis movable group 312 can be driven to translate along the X-axis direction through the X-axis movable group 311; the Z-axis movable group 313 is installed at the movable end of the Y-axis movable group 312, and the Z-axis movable group 313 can be driven to translate along the Y-axis direction through the Y-axis movable group 312; the pick-and-place mechanism 32 is installed at the movable end of the Z-axis movable group 313, and the pick-and-place mechanism 32 can be driven to translate along the Z-direction through the Z-axis movable group 313. Among them, the X-axis extends along the front-back direction, the Y-axis extends along the left-right direction, and the Z-axis extends along the up-down direction.

[0053] The X-axis movable group 311 serves as the basic part of the transfer mechanism 31. The movable end of the X-axis movable group 311 is extended along the front-to-back direction (X-axis) and is used to install the Y-axis movable group 312. The Y-axis movable group 312 can be driven to translate along the X-axis direction through a driving mechanism (such as a motor and a lead screw, or a cylinder structure, etc.).

[0054] The Y-axis movable group 312 is installed at the movable end of the X-axis movable group 311 and extends along the left-right direction (Y-axis). The movable end of the Y-axis movable group 312 is used to install the Z-axis movable group 313, which can be driven to translate along the Y-axis direction by a driving mechanism (such as a motor and a lead screw, or a cylinder structure, etc.).

[0055] The Z-axis movable group 313 is installed at the movable end of the Y-axis movable group 312 and extends along the up-down direction (Z-axis). The movable end of the Z-axis movable group 313 is used to install the pick-and-place mechanism 32, which can be driven to translate along the Z direction by a driving mechanism (such as a motor and a lead screw, or a cylinder structure, etc.).

[0056] When it is necessary to move the pick-and-place mechanism 32 along the X-axis direction, the driving mechanism of the X-axis movable group 311 is started, driving the Y-axis movable group 312 (and the Z-axis movable group 313 and the pick-and-place mechanism 32 thereon) to translate along the X-axis direction. When it is necessary to move the pick-and-place mechanism 32 along the Y-axis direction, the driving mechanism of the Y-axis movable group 312 is started, driving the Z-axis movable group 313 (and the pick-and-place mechanism 32 thereon) to translate along the Y-axis direction. When it is necessary to move the pick-and-place mechanism 32 along the Z-axis direction (such as when grasping or placing the support unit 2), the driving mechanism of the Z-axis movable group 313 is started, driving the pick-and-place mechanism 32 to translate along the Z-direction.

[0057] Through the combination of the X-axis movable group 311, the Y-axis movable group 312 and the Z-axis movable group 313, the transfer mechanism 31 can achieve precise movement in three-dimensional space, meeting the demand for precise positioning of the support unit 2 in the solder paste printing process.

[0058] In one embodiment, referring to Figure 3-Figure 4 The Z-axis movable group 313 includes a Z-axis fixed seat 3132 and a Z-axis driver 3131 installed on the Z-axis fixed seat 3132. The pick-up and placement mechanism 32 is connected to the Z-axis driver 3131, and the pick-up and placement mechanism 32 is driven to translate along the Z-axis direction by the Z-axis driver 3131; the Z-axis fixed seat 3132 is also provided with an upper buffer limit column 3135 and a lower buffer limit column 3136 which are spaced apart from each other. The upper buffer limit column 3135 and the lower buffer limit column 3136 limit the travel of the pick-up and placement mechanism 32 along the Z-axis direction.

[0059] The Z-axis fixed seat 3132 is the base part of the Z-axis movable group 313, providing a stable support and installation platform. It is fixed on the Y-axis movable group 312 of the transfer mechanism 31 to ensure the stability of the entire Z-axis movable group 313. The Z-axis driver 3131 is installed on the Z-axis fixed seat 3132, and is used to drive the pick-and-place mechanism 32 to translate along the Z-axis direction. The Z-axis driver 3131 usually adopts a motor and a lead screw combination structure, or high-precision components such as a telescopic cylinder to ensure the precise movement of the pick-and-place mechanism 32. The upper buffer limit column 3135 is set on the Z-axis fixed seat 3132, located above the pick-and-place mechanism 32. The upper buffer limit column 3135 is used to limit the upward movable travel of the pick-and-place mechanism 32 in the Z-axis direction to prevent the pick-and-place mechanism 32 from excessively rising and damaging the equipment or affecting the accuracy. The lower buffer limit column 3136 is set on the Z-axis fixed seat 3132, located below the pick-up and placement mechanism 32. The lower buffer limit column 3136 is used to limit the downward movable travel of the pick-up and placement mechanism 32 in the Z-axis direction to prevent the pick-up and placement mechanism 32 from excessively descending and damaging the equipment or failing to work normally.

[0060] In one embodiment, the Z-axis driver 3131 is a telescopic cylinder, which is controlled by air pressure to extend and retract, thereby achieving the purpose of driving the pick-and-place mechanism 32 to rise and fall.

[0061] The structure of the telescopic cylinder is relatively simple and easy to install and maintain. The pneumatic drive has good buffering performance, making the lifting and lowering movement of the pick-and-place mechanism 32 smoother. The pneumatic system is easy to realize automatic control and can achieve precise lifting and lowering control through components such as pneumatic valves and sensors.

[0062] In one embodiment, the Z-axis movable group 313 also includes a Z guide rail 3133 and a Z slider 3134. The Z guide rail 3133 is fixed on the Z-axis fixed seat 3132. The Z slider 3134 can be slidably installed on the Z guide rail 3133. The Z slider 3134 is fixedly connected to the pick-and-place assembly to guide the linear movement of the pick-and-place assembly in the Z direction.

[0063] In one embodiment, the Z-axis fixing seat 3132 is provided with an upper spring support 3138, and the pick-and-place mechanism 32 is provided with a lower spring support 3139. The upper spring support 3138 and the lower spring support 3139 are respectively connected to the two ends of the tension spring 3137, and the pick-and-place mechanism 32 is pulled up and reset by the tension spring 3137.

[0064] When the telescopic cylinder works normally, it is responsible for driving the lifting and lowering of the pick-and-place mechanism 32. If the telescopic cylinder loses air for some reason (such as insufficient air pressure, air pressure system failure or shutdown, etc.), it can no longer support the weight of the pick-and-place mechanism 32, and the tension of the tension spring 3137 becomes the main supporting force of the pick-and-place mechanism 32 to prevent the pick-and-place mechanism 32 from falling freely. The tension spring 3137 automatically pulls the pick-and-place mechanism 32 upward through the action of the upper spring support 3138 and the lower spring support 3139 to ensure its safe reset. The tension spring 3137 provides an additional safety protection mechanism to prevent the pick-and-place mechanism 32 from falling freely when the telescopic cylinder loses air, causing damage to the equipment.

[0065] In one embodiment, the positioning device 4 is positioned based on the visual positioning principle, and includes a positioning camera installed at the active end of the Y-axis movable group 312. The positioning camera follows the pick-and-place mechanism 32 and moves synchronously along the X-axis and Y-axis directions.

[0066] The positioning camera captures the image information of the target object in real time and transmits it to the control center for analysis and processing to determine the exact position of the support unit 2. The visual positioning principle has high positioning accuracy and can meet the positioning accuracy requirements of precision manufacturing fields such as solder paste printing. During the entire process, the positioning camera always follows the pick-and-place mechanism 32 and moves synchronously along the X-axis and Y-axis directions to ensure that the image information of the target object can be captured in real time, providing a reliable basis for subsequent precise positioning.

[0067] On the other hand, this embodiment also provides a working method of the circuit board supporting device in the above-mentioned solder paste printer, characterized in that it includes the steps of: The control center controls the transplanting device 3 to grab the support unit 2 at the accurate position in combination with the position information fed back by the positioning device 4, and then determines the target placement position of the support unit 2 according to the loaded circuit board model, and transplants the grabbed support unit 2 to the target placement position. The transplanting action is repeated multiple times to place multiple support units 2 one by one in each target placement position.

[0068] The circuit board support device in the solder paste printer according to this embodiment can adapt to circuit boards of different sizes and shapes and different types of support units 2, thereby improving the versatility and flexibility of the device. When changing the model of the circuit board and adjusting the position of the support unit 2, the entire working process is automatically controlled and monitored by the control center, thereby reducing manual intervention and labor intensity and improving the intelligent level of the production process.

[0069] In the description of this article, it should be understood that the terms "upper", "lower", "left", "right", etc., and other directions or positional relationships are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of this application. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0070] In the description of this specification, the description with reference to the terms "an embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0071] In addition, it should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0072] The technical principles of the present application are described above in conjunction with specific embodiments. These descriptions are only for explaining the principles of the present application and cannot be interpreted as limiting the scope of protection of the present application in any way. Based on the explanations herein, those skilled in the art can think of other specific implementation methods of the present application without creative work, and these methods will fall within the scope of protection of the present application.

Claims

1. A circuit board support device in a solder paste printer, characterized in that: include: Support platform (1); A plurality of support units (2) are placed on the support platform (1); A transplanting device (3) is used to transplant the support unit (2); the transplanting device (3) comprises a transfer mechanism (31) and a pick-and-place mechanism (32); the pick-and-place mechanism (32) is installed at the movable end of the transfer mechanism (31), and the pick-and-place mechanism (32) is driven to move by the transfer mechanism (31); the pick-and-place mechanism (32) comprises an adsorption component (321), and the adsorption component (321) grabs the support unit (2) by negative pressure adsorption; The support unit (2) comprises a support head (21) and a piston cylinder (23); a piston (24) is provided in the piston cylinder (23); the support head (21) is connected to the piston cylinder (23); and a second air passage connecting the support head (21) and the piston cylinder (23) is provided in the support unit (2); a magnet (25) is installed in the piston (24); A control center connected to the transplanting device (3) by signals and used to control the operation of the transplanting device (3); A positioning device (4) is connected to the control center signal, and the positioning device (4) is used to identify and upload the position information of the support unit (2) to the control center.

2. The circuit board support device in the solder paste printer according to claim 1, characterized in that: The pick-and-place mechanism (32) also includes an adsorption mounting block (322), which is mounted on the transfer mechanism (31); the adsorption component (321) includes a precision buffer (3211), a suction cup connector (3213) and a suction cup (3214) connected in sequence; a first air duct is provided in the adsorption component (321), and the adsorption mounting block (322) is provided with an air suction hole and an air blowing hole, wherein the air suction hole is connected to an air suction pipe, and the air blowing hole is connected to an air blowing pipe; the precision buffer (3211) is mounted on the adsorption mounting block (322), and the first air duct is connected to the air suction hole and the air blowing hole.

3. The circuit board support device in the solder paste printer according to claim 1, characterized in that: The support unit (2) also includes a transfer tube (22) connected between the support head (21) and the piston cylinder (23); the support head (21) includes a connected mounting portion (212) and a needle tube (211); the mounting portion (212) is connected to the transfer tube (22); the needle tube (211) is suitable for being inserted into the first air channel of the adsorption component (321) so that the second air channel is connected to the first air channel.

4. The circuit board supporting device in the solder paste printer according to claim 1, characterized in that: The transfer mechanism (31) comprises an X-axis movable group (311), a Y-axis movable group (312) and a Z-axis movable group (313); the Y-axis movable group (312) is mounted on the movable end of the X-axis movable group (311), and the Y-axis movable group (312) can be driven to translate along the X-axis direction through the X-axis movable group (311); the Z-axis movable group (313) is mounted on the movable end of the Y-axis movable group (312), and the Z-axis movable group (313) can be driven to translate along the Y-axis direction through the Y-axis movable group (312); and the pick-and-place mechanism (32) is mounted on the movable end of the Z-axis movable group (313), and the pick-and-place mechanism (32) can be driven to translate along the Z-axis direction through the Z-axis movable group (313).

5. The circuit board supporting device in the solder paste printer according to claim 4, characterized in that: The Z-axis movable group (313) comprises a Z-axis fixed seat (3132) and a Z-axis driver (3131) mounted on the Z-axis fixed seat (3132); the pick-and-place mechanism (32) is connected to the Z-axis driver (3131), and the pick-and-place mechanism (32) is driven to translate along the Z-axis direction by the Z-axis driver (3131); an upper buffer limit column (3135) and a lower buffer limit column (3136) which are spaced apart from each other are also provided on the Z-axis fixed seat (3132); the upper buffer limit column (3135) and the lower buffer limit column (3136) limit the travel of the pick-and-place mechanism (32) along the Z-axis direction.

6. The circuit board supporting device in the solder paste printer according to claim 5, characterized in that: The Z-axis fixing seat (3132) is provided with an upper spring support (3138), and the pick-and-place mechanism (32) is provided with a lower spring support (3139). The upper spring support (3138) and the lower spring support (3139) are respectively connected to the two ends of a tension spring (3137), and the pick-and-place mechanism (32) is pulled upward and reset by the tension spring (3137).

7. The circuit board supporting device in the solder paste printer according to claim 4, characterized in that: The positioning device (4) is positioned based on the visual positioning principle, and comprises a positioning camera, which is installed at the active end of the Y-axis movable group (312). The positioning camera follows the pick-and-place mechanism (32) and moves synchronously along the X-axis direction and the Y-axis direction.

8. A method for operating a circuit board support device in a solder paste printer as claimed in any one of claims 1 to 7, characterized in that: Includes steps: The control center combines the position information fed back by the positioning device to control the transplanting device to grab the support unit at the exact position, and then determines the target placement position of the support unit according to the loaded circuit board model, and transplants the grabbed support unit to the target placement position. The transplanting action is repeated multiple times to place multiple support units one by one in each target placement position.

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