Heat dissipation device and control method of heat dissipation device

Abstract

The invention discloses a heat dissipation device and a control method of the heat dissipation device. The technical problem that in the prior art, a heat dissipation device is difficult to dissipate heat of a product is solved. The heat dissipation device comprises a first-stage radiator, a refrigeration chip, a second-stage radiator and a shell, the first end face of the first-stage radiator is used for making contact with a heat source, and the shell is sleeved with the second end face of the first-stage radiator; the cold surface of the refrigeration chip is in contact with the second end surface of the first-stage radiator, and the hot surface of the refrigeration chip is in contact with the second-stage radiator; the secondary radiator is arranged on the shell, and the secondary radiator and the primary radiator are arranged in a spaced mode. When the difference value between the temperature of the heat source and the limiting temperature of the heat source is large, the refrigeration chip is powered off, and heat of the heat source is transmitted to the first-stage radiator and the second-stage radiator to achieve parallel heat dissipation; when the temperature of the heat source is close to the limiting temperature of the heat source, the refrigeration chip is powered on so that the refrigeration chip can transmit heat of the first-stage radiator to the second-stage radiator, the temperature of the first-stage radiator is lowered, and therefore the temperature of the heat source is lowered.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation device and a control method for the heat dissipation device. Background Art

[0002] The current cooling system of electronic products generally uses a metal radiator with an increased surface area in contact with the air for heat exchange. The radiator is mainly heated by the heat source, and the temperature rises. When it is higher than the ambient temperature, it exchanges heat with the relatively low temperature air through its own surface, thereby suppressing further temperature rise.

[0003] However, the heat dissipation methods of current conventional electronic products have the following three main limitations: first, the temperature control must be higher than the ambient temperature, and the product temperature cannot be controlled to the same or lower temperature as the ambient temperature; second, the temperature control of the product changes with the ambient temperature, and it is difficult to control the temperature within a relatively stable range; third, when the ambient temperature is high and the heat source temperature is expected to be lower, the heat dissipation efficiency is low, and the cost and volume are high. Summary of the invention

[0004] The purpose of the present application is to provide a heat dissipation device and a control method for the heat dissipation device to solve the technical problem in the prior art that the heat dissipation of the product by the radiator is highly affected by the ambient temperature, resulting in heat dissipation difficulties. The various technical effects that can be produced by the optional technical solutions provided in the present application are described in detail below.

[0005] To achieve the above objectives, this application provides the following technical solutions:

[0006] The present application provides a heat dissipation device, which includes a primary heat sink, wherein a first end surface of the primary heat sink is used to contact a heat source, and a second end surface of the primary heat sink is sleeved with a shell with a hollow interior;

[0007] A cooling chip is arranged in the housing, a cold surface of the cooling chip contacts the second end surface of the primary radiator, a hot surface of the cooling chip contacts the secondary radiator, and the cooling chip can be powered on or off;

[0008] The secondary radiator is arranged on the shell, the secondary radiator is spaced apart from the primary radiator, and the secondary radiator is in contact with the primary radiator through the refrigeration chip;

[0009] The shell is provided with an opening, and the opening is used to transfer the heat of the primary radiator and the secondary radiator to the outside of the shell;

[0010] When the temperature of the heat source is lower than the limit temperature of the heat source and the absolute value of the difference between the two is greater than a set threshold, the refrigeration chip is powered off, and the heat of the heat source is transferred to the primary radiator and the secondary radiator;

[0011] When the temperature of the heat source is close to the limit temperature of the heat source or is lower than the limit temperature of the heat source but the absolute value of the difference between the two is lower than the set threshold, the cooling chip is energized to enable the cooling chip to transfer the heat of the primary radiator to the secondary radiator, thereby reducing the temperature of the primary radiator.

[0012] In some embodiments, the second end surface of the primary radiator is provided with a first heat dissipation fin and a heat transfer plane, the heat transfer plane is in contact with the cold surface of the refrigeration chip, and the first heat dissipation fin is spaced apart from the secondary radiator.

[0013] In some embodiments, a first end surface of the secondary heat sink contacts a hot surface of the refrigeration chip, a second end surface of the secondary heat sink is provided with a second heat dissipation fin, and the second heat dissipation fin is spaced apart from the first heat dissipation fin.

[0014] In some embodiments, an outer edge of the refrigeration chip is surrounded by a heat insulation sheet, and the secondary heat sink and the primary heat sink are spaced apart by the heat insulation sheet.

[0015] In some embodiments, the first-level radiator is provided with a temperature sensor for detecting the temperature value of the first end surface of the first-level radiator; the heat dissipation device also includes a control board, which is electrically connected to the temperature sensor and the refrigeration chip, and is used to receive the temperature value of the first end surface of the first-level radiator, and control the refrigeration chip to power on or off according to the temperature value of the first end surface of the first-level radiator and the limit temperature of the heat source.

[0016] In some embodiments, the control board is disposed in the housing, or the control board is a control board of a control device generated by the heat source.

[0017] In some embodiments, the heat dissipation device also includes a fan, which is disposed in the housing. The control panel is electrically connected to the fan and is used to control the start and stop and operating status of the fan. The fan can blow air to the primary radiator or draw air to the secondary radiator.

[0018] In some embodiments, the fan is provided at the primary radiator, so that the control panel controls the fan to blow air, so that the airflow blows from the primary radiator to the secondary radiator, or blows to the primary radiator and the secondary radiator at the same time;

[0019] Alternatively, the fan is disposed on the secondary radiator, so that the control panel controls the fan to draw air to the secondary radiator.

[0020] In some embodiments, the device is further provided with a fixed bracket or a fixed opening for mounting a primary radiator, a cooling chip, a secondary radiator and a housing.

[0021] In a second aspect, the present application further provides a control method for a heat dissipation device, the control method being applied to the heat dissipation device as described in any one of the first aspects, the control method comprising:

[0022] When it is detected that the temperature of the heat source is lower than the limit temperature of the heat source and the absolute value of the temperature difference between the two is greater than the set threshold, the refrigeration chip is controlled to be powered off;

[0023] When it is detected that the temperature of the heat source is close to the limit temperature of the heat source and the absolute value of the temperature difference between the two is less than the set threshold, the cooling chip is controlled to be powered on so that the cooling chip transfers the heat of the primary radiator to the secondary radiator.

[0024] Implementing one of the above technical solutions of the present application has the following advantages or beneficial effects: a heat dissipation device and a control method of the heat dissipation device of the present application, the heat dissipation device includes a primary heat sink, a cooling chip, a secondary heat sink and a shell, in the shell, the cold surface of the cooling chip contacts the primary heat sink, and the hot surface contacts the secondary heat sink, so that the primary heat sink and the secondary heat sink are only in contact through the cooling chip, and other positions are set at intervals. When the temperature of the heat source is lower than the limit temperature of the heat source and the absolute value of the difference between the two is greater than the set threshold, it means that the temperature difference between the two is large, the cooling chip can be powered off, and the heat of the heat source is transferred to the primary heat sink and the secondary heat sink to achieve parallel heat dissipation, and the heat is transferred to the outside of the shell; if the temperature of the heat source is close to the limit temperature of the heat source, or although it is lower than the limit temperature of the heat source, the absolute value of the difference between the two is less than the set threshold, the heat cannot be dissipated normally, and the temperature of the heat source will inevitably rise above the limit temperature. At this time, the cooling chip can be powered on, so that the cooling chip can transfer the heat of the primary heat sink to the secondary heat sink, reduce the temperature of the primary heat sink, and thus reduce the temperature of the heat source close to the primary heat sink, so as to reduce the temperature of the heat source and ensure the heat dissipation of the heat source. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. It is obvious that the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0026] Figure 1is a first structural schematic diagram of a heat dissipation device involved in an embodiment of the present application;

[0027] Figure 2 is a second structural schematic diagram of the heat dissipation device involved in the embodiment of the present application;

[0028] Figure 3 is an exploded diagram of a heat dissipation device involved in an embodiment of the present application;

[0029] Figure 4 is a cross-sectional view of a heat dissipation device according to an embodiment of the present application;

[0030] Figure 5 It is a flow chart of a control method of a heat dissipation device according to an embodiment of the present application. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solutions and advantages of the present application clearer, the various exemplary embodiments to be described below will refer to the corresponding drawings, which constitute a part of the exemplary embodiments, wherein various exemplary embodiments that may be used to implement the present application are described. Unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation methods described in the following exemplary embodiments do not represent all implementation methods consistent with the present disclosure. It should be understood that they are only examples of processes, methods, and devices that are consistent with some aspects disclosed in the present application as detailed in the attached claims, and other embodiments may also be used, or the embodiments listed herein may be modified in structure and function without departing from the scope and essence of the present application.

[0032] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", etc. indicate the orientation or positional relationship based on the drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the elements referred to must have a specific orientation, be constructed and operated in a specific orientation. The terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. The term "multiple" means two or more. The terms "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, an integral connection, a mechanical connection, an electrical connection, a communication connection, a direct connection, an indirect connection through an intermediate medium, and can be the internal connection of two elements or the interaction relationship between two elements. The term "and / or" includes any and all combinations of one or more related listed items. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0033] In order to illustrate the technical solution described in the present application, a specific embodiment is provided below, and only the parts related to the embodiment of the present application are shown.

[0034] like Figures 1 to 4 As shown, the present application provides a heat dissipation device, including a primary heat sink 10 , a cooling chip 20 , a secondary heat sink 30 and a shell 40 .

[0035] The first end surface of the primary radiator 10 is used to contact the heat source, and the second end surface of the primary radiator 10 is sleeved with a shell 40 with a hollow interior.

[0036] The cooling chip 20 is disposed in the housing 40 , the cold surface of the cooling chip 20 contacts the second end surface of the primary radiator 10 , the hot surface of the cooling chip 20 contacts the secondary radiator 30 , and the cooling chip 20 can be powered on or off.

[0037] The secondary radiator 30 is disposed in the housing 40, and the secondary radiator 30 is spaced apart from the primary radiator 10, and the secondary radiator 30 and the primary radiator 10 are in contact with each other through the cooling chip 20. The secondary radiator 30 can be disposed in the housing 40 or on the housing 40, as long as the secondary radiator 30 and the primary radiator 10 are in contact with each other only through the cooling chip 20.

[0038] The shell 40 is provided with an opening 41 , and the opening 41 is used for air intake and exhaust and for transferring heat of the primary radiator 10 and the secondary radiator 30 to the outside of the shell 40 .

[0039] When the temperature of the heat source is lower than the limit temperature of the heat source and the absolute value of the difference between the two is greater than the set threshold, it means that the temperature of the heat source does not exceed the limit temperature at which the heat source can work normally, and the cooling chip 20 can be powered off, and the heat of the heat source is transferred to the primary radiator 10 and the secondary radiator 30, and the primary radiator 10 and the secondary radiator 30 transfer the heat to the outside of the housing 40 through the opening 41. It can be understood that the primary radiator 10 can also transfer the heat to the cooling chip 20, and then to the secondary radiator 30.

[0040] When the temperature of the heat source is close to the limit temperature of the heat source or is lower than the limit temperature of the heat source but the absolute value of the difference between the two is lower than the set threshold, it means that the heat of the heat source may not be able to be directly dissipated through the primary radiator 10 and the secondary radiator 30. The cooling chip 20 is powered on to enable the cooling chip 20 to transfer the heat of the primary radiator 10 to the secondary radiator 30, thereby lowering the temperature of the primary radiator 10 and increasing the heat exchange temperature gradient of the secondary radiator 30.

[0041] Specifically, the heat source may be an electronic device or electronic equipment that generates heat when powered on or running, such as automotive electronic equipment, computer CPU, etc. The limit temperature of the heat source refers to the maximum operating temperature of the electronic device or electronic equipment. If the ambient temperature of the electronic equipment exceeds the limit temperature, it may cause damage to the electronic equipment or trigger a protection mechanism, such as reducing performance or shutting down.

[0042] The cooling chip 20 can be a TEC semiconductor chip, which is a thermoelectric element made of semiconductor materials. Its working principle is based on the Peltier effect. When a DC voltage is applied to the TEC semiconductor, the heat on one side will be transferred to the other side, so that the temperature of one side decreases and the temperature of the other side increases. The forward and reverse application of voltage will cause the temperature of the cold side and the hot side to change, making the TEC semiconductor chip an effective temperature regulating element. Therefore, the cooling chip 20 has a cold side and a hot side. The side that can dissipate heat after power is turned on is the hot side, and the opposite side is the cold side.

[0043] The heat dissipation device is installed in contact with the heat transfer surface of the heat source to dissipate heat from the heat source. The heat dissipation device includes a primary heat sink 10 , a cooling chip 20 and a secondary heat sink 30 .

[0044] The primary radiator 10 and the secondary radiator 30 may include one or more small radiators or radiating components. Figures 1 to 4 Take a primary radiator 10 and a secondary radiator 30 as an example.

[0045] As the working time of the heat source increases, although the temperature of the heat source gradually rises, if the temperature of the heat source is less than the limit temperature of the heat source, and the absolute value of the difference between the temperature of the heat source and the limit temperature of the heat source is greater than the set threshold, it means that the difference between the temperature of the heat source and the limit temperature of the heat source is large, and heat exchange can be performed. Then, during this period, the refrigeration chip 20 does not need to be powered on, and the refrigeration chip 20 is directly powered off. Since the first end face of the primary radiator 10 contacts the heat source, the second end face contacts the cold surface of the refrigeration chip 20, and the hot surface of the refrigeration chip 20 contacts the secondary radiator 30, and the secondary radiator 30 is spaced from the primary radiator 10, the heat of the primary radiator 10 can be transferred to the secondary radiator 30 through the refrigeration chip 20, and conventional heat transfer and exchange are performed, and the heat is discharged through the shell 40 and the opening 41. Obviously, when the temperature difference between the temperature of the heat source and the limit temperature of the heat source is large, the refrigeration chip 20 can not work, and the two-stage radiator composed of the primary radiator 10 and the secondary radiator 30 realizes parallel heat dissipation of the heat source.

[0046] If the working environment deteriorates, such as the ambient temperature becomes higher, the thermal gradient between the limit temperature of the heat source and the ambient temperature will decrease, or even invert, that is, the temperature of the heat source approaches the limit temperature of the heat source, or although the temperature of the heat source is lower than the limit temperature of the heat source, the absolute value of the difference between the temperature of the heat source and the limit temperature of the heat source is lower than the set threshold, then the heat cannot be dissipated normally, and the temperature of the heat source will inevitably rise and exceed the limit temperature. In order to solve this problem, in this case, the cooling chip 20 is powered on, so that the cooling chip 20 can transfer the heat of the primary radiator 10 to the secondary radiator 30, and reduce the temperature of the primary radiator 10. Under the action of the cooling chip 20, the temperature of the secondary radiator 30 is increased, increasing the heat exchange temperature difference. Due to the reduction in the temperature of the primary radiator 10, the temperature of the heat source in contact with the primary radiator 10 is reduced, and does not exceed the limit temperature of the heat source, so that the heat source can work normally.

[0047] It can be understood that the temperature of the heat source can be obtained by testing and calculating a temperature sensor set on the first end face of the first-level radiator 10 or the heat transfer surface of the heat source. The temperature of the heat source is close to the limit temperature of the heat source, which means that the absolute value of the difference between the temperature of the heat source and the limit temperature of the heat source is small, but the heat source can still work normally.

[0048] In some embodiments, the second end surface of the primary radiator 10 is provided with a first heat dissipation fin 11 and a heat transfer plane 12 , the heat transfer plane 12 contacts the cold surface of the refrigeration chip 20 , and the first heat dissipation fin 11 is spaced apart from the secondary radiator 30 .

[0049] The heat dissipation structure of the primary radiator 10 is not limited to the form of the first heat dissipation fins 11, and may also be a heat dissipation structure of other structural forms, such as a tubular structure, a water-cooled structure, etc., which is not limited here.

[0050] Since the heat transfer plane 12 is in contact with the cold surface of the cooling chip 20, the first heat sink fin 11 is spaced apart from the secondary heat sink 30, and the primary heat sink 10 and the secondary heat sink 30 are only in contact through the cooling chip 20, and are not in contact elsewhere, so that the heat of the primary heat sink 10 can be transferred to the secondary heat sink 30 through the cooling chip 20, while the heat of the secondary heat sink 30 cannot be transferred back to the primary heat sink 10, so the heat source contacting the primary heat sink 10 can achieve heat dissipation.

[0051] In some embodiments, the first end surface of the secondary heat sink 30 contacts the hot surface of the cooling chip 20 , and the second end surface of the secondary heat sink is provided with a second heat sink fin 31 , which is spaced apart from the first heat sink fin 11 .

[0052] When the cooling chip 20 is powered on, even if the temperature of the secondary radiator 30 is higher than that of the primary radiator 10, due to the characteristics of the cooling chip 20, the cooling chip 20 can transfer the heat of the first cooling fins 11 to the second cooling fins 31. Moreover, the second cooling fins 31 are unable to transfer heat to the first cooling fins 11 because they are spaced apart from the first cooling fins 11. The second cooling fins 31 transfer the heat through the openings 41 of the shell 40. In addition, the heat of the primary radiator 10 can also be transferred from the openings 41 of the shell 40.

[0053] When the cooling chip 20 is powered off, the cooling chip 20 acts as a common heat-conducting device. If the temperature of the first heat sink 11 is higher than the temperature of the second heat sink 31, the heat of the heat source is transferred from the primary heat sink 10, the cooling chip 20, and the secondary heat sink 30 to the outside of the opening 41 of the shell 40 in sequence.

[0054] In some of the embodiments, the outer edge of the cooling chip 20 is surrounded by a thermal insulation sheet 50, and the secondary radiator 30 and the primary radiator 10 are spaced apart by the thermal insulation sheet 50. For example, the second cooling fins 31 of the secondary radiator 30 and the first cooling fins 11 of the primary radiator 10 are spaced apart by the thermal insulation sheet 50.

[0055] The thermal insulation sheet 50 is a thermal insulation material that can surround the cooling chip 20. Then, the secondary radiator 30 is placed on the hot surface of the cooling chip 20. The second cooling fins 31 and the first cooling fins 11 can be spaced apart by the thermal insulation sheet 50, or they can be directly physically spaced apart. As long as the second cooling fins 31 and the first cooling fins 11 are not in contact with each other, the primary radiator 10 and the secondary radiator 30 can be filled with thermal insulation material, or vacuuming can be performed. Methods of blocking or reducing the heat transfer between the second cooling fins 31 and the first cooling fins 11 fall within the protection scope of this case.

[0056] Similar to the primary radiator 10 , the heat dissipation structure of the secondary radiator 30 is not limited to the form of the second heat dissipation fins 31 , but may also be a heat dissipation structure of other structural forms, such as a tubular structure, a water-cooled structure, etc., which is not limited here.

[0057] In some embodiments, the primary radiator 10 is provided with a temperature sensor 60 for detecting the temperature value of the first end surface of the primary radiator 10; the heat dissipation device also includes a control board 70, which is electrically connected to the temperature sensor 60 and the refrigeration chip 20, and is used to receive the temperature value of the first end surface of the primary radiator 10, and control the refrigeration chip 20 to power on or off according to the temperature value of the first end surface of the primary radiator 10 and the limit temperature of the heat source.

[0058] Since the first end face of the first-stage radiator 10 contacts the heat source, the temperature sensor 60 of the first-stage radiator 10 is equivalent to detecting the temperature of the heat source, wherein the temperature of the heat source can be accurately calculated based on the weighted value of the contact thermal resistance and the heat transfer thermal resistance of the heat source itself, and the temperature value detected by the receiving temperature sensor 60 is controlled to control the power on or off of the refrigeration chip 20 according to the temperature value and the limit temperature of the heat source.

[0059] That is, when the control board 70 detects that the temperature of the heat source is lower than the limit temperature of the heat source, and the absolute value of the difference between the two is greater than the set threshold, the control board 70 cuts off the power to the refrigeration chip 20, and when the difference between the temperature of the heat source and the limit temperature of the heat source is large, the two-stage radiator dissipates heat in parallel, so that the heat of the heat source is transferred to the primary radiator 10 and the secondary radiator 30.

[0060] When the control board 70 detects that the temperature of the heat source is close to the limit temperature of the heat source, or is lower than the limit temperature of the heat source but the absolute value of the difference between the two is lower than the set threshold, it means that the temperature of the heat source is closer to the limit temperature of the heat source, and the heat source is at risk of starting protection or being damaged. Therefore, the control board 70 powers on the cooling chip 20. After being powered on, the cooling chip 20 can transfer part of the heat of the primary radiator 10 to the secondary radiator 30, thereby enhancing the heat dissipation capacity of the primary radiator 10 and reducing the temperature of the heat source.

[0061] In some embodiments, the control board 70 is disposed in the housing 40 , or the control board 70 is a control board 70 of a device for controlling heat generation.

[0062] like Figure 3 As shown, the second end face of the primary radiator 10 is in a straight line shape, with a plane on the left side on which the control board 70 can be placed, a first heat dissipation fin 11 in the middle, and a heat transfer plane 12 on the right side, on which the cooling chip 20 and the secondary radiator 30 can be placed in sequence. The second end face of the primary radiator 10 is sleeved with a housing 40, that is, the control board 70 is arranged in the housing 40.

[0063] Alternatively, the heat dissipation device can be integrated into an electronic product that requires heat dissipation and used as an accessory. The control board 70 is the control board 70 of the electronic product, and is the control board 70 of the control device that generates the heat source. The refrigeration chip 20 and the temperature sensor 60 are connected through the port for driving and controlling.

[0064] In some embodiments, the heat dissipation device also includes a fan 80, which is disposed in the shell 40. The control panel 70 is electrically connected to the fan 80 for controlling the start and stop and operating status of the fan 80. The fan 80 can blow air to the primary radiator 10 and the secondary radiator 30 in sequence, or draw air to the secondary radiator 30 and the primary radiator 10 in sequence, that is, the airflow sweeps through the primary radiator 10 and the secondary radiator 30 in sequence to achieve heat dissipation for the primary radiator 10 and the secondary radiator 30.

[0065] The fan 80 can be a centrifugal fan 80 or an axial fan 80. It can be a fan 80 with a shell 40 or a motor and fan blades without a shell 40. In addition, an opening 41 is also provided at a position corresponding to the shell 40 and the fan 80, and the opening 41 is used for air intake and exhaust.

[0066] When the control board 70 is arranged on the left side of the primary radiator 10 in the shell 40, the fan 80 can be arranged on the control board 70, or, when the control board 70 is not arranged in the shell 40, the fan 80 can be directly arranged on the primary radiator 10. The fan 80 is connected to the control board 70, and the control board 70 controls the fan 80 to blow air, ensuring that the low-temperature airflow is blown to the primary radiator 10 first, and then blown to the secondary radiator 30 or blown to both radiators at the same time, and transmitted out through the opening 41, but the hot air blown to the secondary radiator 30 will not blow back to the primary radiator 10, so as to avoid the forced heating caused by contacting the heat source of the primary radiator 10.

[0067] The fan 80 can also be set on the secondary radiator 30, for example, on the top and side of the second cooling fin 31. The control panel 70 can control the fan 80 to draw air to the secondary radiator 30, thereby ensuring that the low-temperature airflow passes through the primary radiator 10 first and then through the secondary radiator 30 or passes through both radiators at the same time, and the hot air blown to the secondary radiator 30 will not be blown back to the primary radiator 10.

[0068] In some embodiments, the multiple openings 41 on the shell 40 correspond to the positions of the primary radiator 10 and the secondary radiator 30, respectively, which is conducive to air circulation. The internal cavity structure of the shell 40 is conducive to the wind direction flow when the fan 80 blows or exhausts air.

[0069] In some embodiments, the heat dissipation device further includes a fixing bracket or a fixing opening for mounting the primary heat sink 10, the cooling chip 20, the secondary heat sink 30 and the housing 40, so as to ensure that the primary heat sink 10, the cooling chip 20, the secondary heat sink 30, the fan 80 and other components are assembled together without loosening. The fixing bracket may be a fastener, such as a riveted stud, etc., and the fixing opening may be a screw hole, etc., which is not limited here.

[0070] In the heat dissipation device of the embodiment of the present application, in the shell 40, the cold surface of the cooling chip 20 contacts the primary heat sink 10, and the hot surface contacts the secondary heat sink 30, so that the primary heat sink 10 and the secondary heat sink 30 are only in contact through the cooling chip 20, and other positions are set at intervals. When the temperature of the heat source is lower than the limit temperature of the heat source and the absolute value of the difference between the two is greater than the set threshold, it means that the temperature difference between the two is large, and the cooling chip 20 can be powered off, and the heat of the heat source is dissipated in parallel through the primary heat sink 10 and the secondary heat sink 30, and the heat is transferred to the outside of the shell 40; if the temperature of the heat source is close to the limit temperature of the heat source, or although it is lower than the limit temperature of the heat source, the absolute value of the difference between the two is less than the set threshold, the heat of the heat source cannot be dissipated normally, and the temperature of the heat source will inevitably rise above the limit temperature. At this time, the cooling chip 20 can be powered on, so that the cooling chip 20 can transfer the heat of the primary heat sink 10 to the secondary heat sink 30, reduce the temperature of the primary heat sink 10, and thus reduce the temperature of the heat source close to the primary heat sink 10, so as to reduce the temperature of the heat source and ensure the heat dissipation of the heat source.

[0071] The present application also provides a control method for a heat sink, which is applied to a control board of the heat sink, such as Figure 5 As shown, the control method includes steps S101 to S102.

[0072] S101: When it is detected that the temperature of the heat source is lower than the limit temperature of the heat source and the absolute value of the temperature difference between the two is greater than a set threshold, the refrigeration chip is controlled to be powered off.

[0073] S102: When it is detected that the temperature of the heat source is close to the limit temperature of the heat source and the absolute value of the temperature difference between the two is less than the set threshold, the cooling chip is powered on so that the cooling chip transfers the heat of the primary radiator to the secondary radiator.

[0074] In some embodiments, the control method includes:

[0075] When it is detected that the temperature of the heat source is close to the limit temperature and the absolute value of the temperature difference between the two is less than the set threshold, the refrigeration chip is controlled to be powered on, and the fan is controlled to blow or exhaust air so that the fan discharges heat from the primary radiator, the secondary radiator, and the opening in sequence.

[0076] The above control method has the corresponding functional modules and beneficial effects of the heat dissipation device. For technical details not described in detail in this embodiment, please refer to the heat dissipation device provided in the embodiment of this application.

[0077] In the control method of the heat dissipation device of the embodiment of the present application, when the temperature of the heat source is lower than the limit temperature of the heat source and the absolute value of the difference between the two is greater than the set threshold, it means that the temperature difference between the two is large, and the power of the cooling chip can be cut off, and the heat of the heat source is transferred to the primary heat sink and the secondary heat sink to achieve parallel heat dissipation, and the heat is transferred to the outside of the shell; if the temperature of the heat source is close to the limit temperature of the heat source, or although it is lower than the limit temperature of the heat source, the absolute value of the difference between the two is less than the set threshold, the heat cannot be dissipated normally, and the temperature of the heat source will inevitably rise above the limit temperature. At this time, the cooling chip can be powered on, so that the cooling chip can transfer the heat of the primary heat sink to the secondary heat sink, reduce the temperature of the primary heat sink, and thus reduce the temperature of the heat source close to the primary heat sink, thereby reducing the temperature of the heat source and ensuring the heat dissipation of the heat source.

[0078] The above is only the preferred embodiment of the present application. Those skilled in the art will appreciate that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present application. In addition, under the guidance of the present application, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of the present application belong to the protection scope of the present application.

Claims

1. A heat dissipation device, characterized in that: include: A primary radiator, wherein a first end surface of the primary radiator is used to contact a heat source, and a second end surface of the primary radiator is sleeved with a shell having a hollow interior; A cooling chip is arranged in the housing, a cold surface of the cooling chip contacts the second end surface of the primary radiator, a hot surface of the cooling chip contacts the secondary radiator, and the cooling chip can be powered on or off; The secondary radiator is arranged on the shell, the secondary radiator is spaced apart from the primary radiator, and the secondary radiator is in contact with the primary radiator through the refrigeration chip; The shell is provided with an opening, the opening is used for air intake and exhaust and for transferring the heat of the primary radiator and the secondary radiator to the outside of the shell; When the temperature of the heat source is lower than the limit temperature of the heat source and the absolute value of the difference between the two is greater than a set threshold, the refrigeration chip is powered off, and the heat of the heat source is transferred to the primary radiator and the secondary radiator; When the temperature of the heat source is close to the limit temperature of the heat source or is lower than the limit temperature of the heat source but the absolute value of the difference between the two is lower than the set threshold, the cooling chip is energized to enable the cooling chip to transfer the heat of the primary radiator to the secondary radiator, thereby reducing the temperature of the primary radiator.

2. The heat dissipation device according to claim 1, characterized in that: The second end surface of the primary radiator is provided with a first heat dissipation fin and a heat transfer plane, the heat transfer plane is in contact with the cold surface of the refrigeration chip, and the first heat dissipation fin is spaced apart from the secondary radiator.

3. The heat dissipation device according to claim 2, characterized in that: The first end surface of the secondary heat sink contacts the hot surface of the refrigeration chip, and the second end surface of the secondary heat sink is provided with a second heat dissipation fin, which is spaced apart from the first heat dissipation fin.

4. The heat dissipation device according to claim 1, characterized in that: The outer edge of the refrigeration chip is surrounded by a heat insulation sheet, and the secondary radiator and the primary radiator are spaced apart by the heat insulation sheet.

5. The heat dissipation device according to claim 1, characterized in that: The primary radiator is provided with a temperature sensor for detecting the temperature value of the first end surface of the primary radiator; the heat dissipation device also includes a control board, which is electrically connected to the temperature sensor and the refrigeration chip, and is used to receive the temperature value of the first end surface of the primary radiator, and control the refrigeration chip to power on or off according to the temperature value of the first end surface of the primary radiator and the limit temperature of the heat source.

6. The heat dissipation device according to claim 5, characterized in that: The control board is arranged in the shell, or the control board is a control board of a control device generated by the heat source.

7. The heat dissipation device according to claim 5, characterized in that: The heat dissipation device also includes a fan, which is arranged in the shell. The control board is electrically connected to the fan and is used to control the start and stop and operating status of the fan. The fan can blow air to the primary radiator or draw air to the secondary radiator.

8. The heat dissipation device according to claim 7, characterized in that: The fan is arranged on the primary radiator, so that the control panel controls the fan to blow air, so that the airflow blows from the primary radiator to the secondary radiator, or blows to the primary radiator and the secondary radiator at the same time; Alternatively, the fan is disposed on the secondary radiator, so that the control panel controls the fan to draw air to the secondary radiator.

9. The heat dissipation device according to claim 1, characterized in that: The device is also provided with a fixing bracket or a fixing opening for installing a primary radiator, a cooling chip, a secondary radiator and a shell.

10. A method for controlling a heat dissipation device, characterized in that: The control method is applied to the heat dissipation device according to any one of claims 1 to 9, and the control method comprises: When it is detected that the temperature of the heat source is lower than the limit temperature of the heat source and the absolute value of the temperature difference between the two is greater than the set threshold, the refrigeration chip is controlled to be powered off; When it is detected that the temperature of the heat source is close to the limit temperature of the heat source and the absolute value of the temperature difference between the two is less than the set threshold, the cooling chip is controlled to be powered on so that the cooling chip transfers the heat of the primary radiator to the secondary radiator.

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