Press-fit jig and display panel preparation method

Abstract

The invention discloses a pressing jig and a display panel preparation method, and the pressing jig comprises a pressing body which is provided with at least one first groove body and at least one second groove body, and the first groove body and the second groove body are arranged at an interval; wherein the first groove body corresponds to the light-emitting element in position, the light-emitting element is pressed into a bearing glue layer on the array substrate, and the second groove body is used for containing the bearing glue layer. The position of the light-emitting element which is slightly shifted is self-calibrated through the first groove body, so that the pressing effect is ensured, and the bonding precision of the subsequent light-emitting element is improved. And the second groove body can accommodate the extruded part of the bearing adhesive layer after the light-emitting element is pressed into the bearing adhesive layer, so that the part of the bearing adhesive layer is prevented from influencing the position of the light-emitting element, the position precision of the light-emitting element is ensured, and the subsequent removal of the bearing adhesive layer is facilitated.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic products, and in particular, relates to a pressing fixture and a method for preparing a display panel. Background Art

[0002] Micro-LED (Micro Light Emitting Diode) or Mini-LED (small light-emitting diode) is a new generation of display technology. Compared with the existing OLED (Organic Light-Emitting Diode) or LCD (Liquid Crystal Display) technology, it has the advantages of high resolution, high brightness, ultra-power saving, fast response speed, high light output efficiency and long life. It is widely used in display fields such as mobile phones, laptops and TVs.

[0003] Due to the structural limitations of existing LED chips, the pressing effect between the LED chip and the array substrate cannot meet the requirements.

[0004] Therefore, a new pressing fixture and display panel preparation method are urgently needed. Summary of the invention

[0005] The embodiment of the present application provides a pressing jig and a method for preparing a display panel, wherein the first groove body performs self-calibration on the position of a slightly offset light-emitting element, thereby ensuring the pressing effect and improving the bonding accuracy of the subsequent light-emitting element. The second groove body can accommodate the part of the receiving adhesive layer that is squeezed out after the light-emitting element is pressed into the receiving adhesive layer, thereby preventing this part of the receiving adhesive layer from affecting the position of the light-emitting element, ensuring the position accuracy of the light-emitting element, and facilitating the subsequent removal of the receiving adhesive layer.

[0006] On the one hand, an embodiment of the present application provides a pressing jig, including: a pressing body, on which at least one first groove body and at least one second groove body are arranged, and the first groove body and the second groove body are arranged at intervals; wherein, the first groove body corresponds to the position of the light-emitting element, and presses the light-emitting element into the receiving adhesive layer on the array substrate, and the second groove body is used to accommodate the receiving adhesive layer.

[0007] According to one aspect of the present application, along the thickness direction of the pressed body, the cross-sectional area of ​​the second groove body is greater than the cross-sectional area of ​​the first groove body; preferably, along the thickness direction of the pressed body, the depth of the second groove body is greater than the depth of the first groove body; preferably, along the thickness direction of the pressed body, the cross-sectional shape of the first groove body is at least one of a rectangle and a trapezoid; and / or, along the thickness direction of the pressed body, the cross-sectional shape of the second groove body is at least one of a rectangle and a trapezoid.

[0008] According to one aspect of the present application, along the thickness direction of the pressed body, the cross-section of the first groove body is trapezoidal, and the top surface area of ​​the first groove body away from the pressed body is larger than the bottom surface area of ​​the first groove body close to the pressed body; and / or, along the thickness direction of the pressed body, the cross-section of the second groove body is trapezoidal, and the top surface area of ​​the second groove body away from the pressed body is larger than the bottom surface area of ​​the second groove body close to the pressed body.

[0009] According to one aspect of the present application, the pressing jig further includes a connecting channel provided on the pressing body, wherein the connecting channel connects adjacent first groove bodies; and / or the connecting channel connects the first groove body and the second groove body.

[0010] According to one aspect of the present application, the pressing jig also includes a pressure sensor, which is connected to the pressing body; preferably, the pressure sensor includes a piezoelectric film layer provided on a surface of the pressing body facing away from the first groove body and a sensor connected to the piezoelectric film layer.

[0011] According to one aspect of the present application, the material of the pressed body includes an elastomeric material; preferably, the material of the pressed body includes at least one of silicone and resin.

[0012] According to one aspect of the present application, an anti-stick coating is coated inside the first tank body; and / or an anti-stick coating is coated inside the second tank body.

[0013] On the other hand, the present invention also provides a method for preparing a display panel, comprising the following steps: providing an array substrate, the array substrate comprising a pixel circuit and a receiving adhesive layer arranged on one side of the pixel circuit, the pixel circuit comprising a connecting electrode; transferring the light-emitting element to the side of the receiving adhesive layer away from the pixel circuit; using a pressing body to pressurize the light-emitting element, the light-emitting element at least partially enters the first groove body of the pressing body, so that the light-emitting element is in contact with the connecting electrode, and the receiving adhesive layer is squeezed into the second groove body of the pressing body.

[0014] According to another aspect of the present application, after the step of applying pressure to the light-emitting element by using a pressing body, the light-emitting element at least partially enters the first groove body of the pressing body so that the light-emitting element and the connecting electrode are in contact, and the receiving adhesive layer is squeezed into the second groove body of the pressing body, it also includes: welding the light-emitting element and the connecting electrode, and the receiving adhesive layer is decomposed under the action of the laser; or, welding the light-emitting element and the connecting electrode; after the light-emitting element and the connecting electrode are welded, the receiving adhesive layer is removed.

[0015] According to another aspect of the present application, along the thickness direction of the pressed body, the depth of the first groove body is less than the thickness of the light-emitting element; along the direction parallel to the thickness direction of the pressed body, the width of the first groove body is greater than or equal to the width of the light-emitting element; preferably, along the thickness direction of the pressed body, the thickness of the receiving adhesive layer is greater than the thickness of the light-emitting element.

[0016] Compared with the prior art, the pressing jig provided in the embodiment of the present invention includes a pressing body, a first slot body and a second slot body provided on the pressing body, wherein the first slot body is used to accommodate the light-emitting element, limit the position of the light-emitting element, and prevent the light-emitting element from being displaced during the pressing process, and the first slot body can be used to self-calibrate the position of the light-emitting element that is slightly offset, thereby ensuring the pressing effect and improving the bonding accuracy of the subsequent light-emitting element. The second slot body can accommodate part of the receiving adhesive layer that is squeezed out after the light-emitting element is pressed into the receiving adhesive layer, thereby preventing this part of the receiving adhesive layer from affecting the position of the light-emitting element, ensuring the position accuracy of the light-emitting element, and facilitating the subsequent removal of the receiving adhesive layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 is a structural schematic diagram of a pressing fixture provided by an embodiment of the present invention;

[0019] Figure 2 is a schematic structural diagram of a pressing jig provided in an embodiment of the present invention when applied to preparation of a display panel;

[0020] Figure 3 is a schematic structural diagram of another pressing jig provided by an embodiment of the present invention;

[0021] Figure 4 is a structural schematic diagram of another pressing fixture provided by an embodiment of the present invention;

[0022] Figure 5 is a structural schematic diagram of another pressing fixture provided by an embodiment of the present invention;

[0023] Figure 6 is a structural schematic diagram of another pressing fixture provided by an embodiment of the present invention;

[0024] Figure 7 is a flow chart of a method for preparing a display panel provided by an embodiment of the present invention;

[0025] Figure 8 is a cross-sectional schematic diagram of a structure obtained in step S110 in a method for preparing a display panel provided by an embodiment of the present invention;

[0026] Fig. 9 is a cross-sectional schematic diagram of a structure obtained in step S120 in a method for preparing a display panel provided by an embodiment of the present invention;

[0027] Fig.10 is a cross-sectional schematic diagram of a structure obtained in step S130 in a method for manufacturing a display panel provided by an embodiment of the present invention;

[0028] Fig.11 is a cross-sectional schematic diagram of a structure obtained in a method for preparing a display panel provided by an embodiment of the present invention;

[0029] Fig.12 is a cross-sectional schematic diagram of a structure obtained in a method for preparing a display panel provided in another embodiment of the present invention;

[0030] Fig.13 is a cross-sectional schematic diagram of a structure obtained in a method for preparing a display panel provided in another embodiment of the present invention;

[0031] Fig.14 It is a cross-sectional schematic diagram of a structure obtained in a method for preparing a display panel provided in another embodiment of the present invention.

[0032] In the attached figure:

[0033] 1-pressed body; 2-connecting channel; 3-anti-stick coating; 4-pressure sensor; 41-piezoelectric film layer; 42-sensor; 5-array substrate; 6-supporting adhesive layer; 7-light-emitting element; 8-laser emitting element; K1-first slot body; K2-second slot body; X-pixel circuit; Y-transfer substrate; L-connecting electrode; Z-preparation substrate. DETAILED DESCRIPTION

[0034] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0035] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0036] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Moreover, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0037] It is obvious to those skilled in the art that various modifications and changes can be made in the present application without departing from the spirit or scope of the present application. Therefore, the present application is intended to cover modifications and changes of the present application that fall within the scope of the corresponding claims (technical solutions for protection) and their equivalents. It should be noted that the implementation methods provided in the embodiments of the present application can be combined with each other without contradiction.

[0038] The present application provides a pressing jig and a method for preparing a display panel. Figures 1 to 14 Various embodiments of a pressing jig and a method for manufacturing a display panel are described.

[0039] See also Figure 1 to Figure 2 , Figure 1 is a structural schematic diagram of a pressing fixture provided by an embodiment of the present invention; Figure 2 It is a schematic diagram of the structure of the pressing jig provided by an embodiment of the present invention when applied to the preparation of a display panel.

[0040] A pressing jig provided in an embodiment of the present application includes: a pressing body 1, on which at least one first groove body K1 and at least one second groove body K2 are arranged, and the first groove body K1 and the second groove body K2 are arranged at intervals; wherein the first groove body K1 corresponds to the position of the light-emitting element 7, and presses the light-emitting element 7 into the receiving adhesive layer 6 on the array substrate, and the second groove body K2 is used to accommodate the receiving adhesive layer 6.

[0041] The pressing jig provided in the embodiment of the present invention includes a pressing body 1, a first slot body K1 and a second slot body K2 arranged on the pressing body 1. The first slot body K1 is used to accommodate the light-emitting element 7 and limit the position of the light-emitting element 7 to prevent the light-emitting element 7 from being displaced during the pressing process. The first slot body K1 can be used to self-calibrate the position of the slightly displaced light-emitting element 7, thereby ensuring the pressing effect and improving the subsequent bonding accuracy of the light-emitting element 7. The second slot body K2 can accommodate the part of the receiving adhesive layer 6 that is squeezed out after the light-emitting element 7 is pressed into the receiving adhesive layer 6, thereby preventing this part of the receiving adhesive layer 6 from affecting the position of the light-emitting element 7, ensuring the position accuracy of the light-emitting element 7, and facilitating the subsequent removal of the receiving adhesive layer 6.

[0042] It should be noted that if Figure 2 As shown, the light-emitting element 7 and the receiving adhesive layer 6 are both located on the array substrate 5 of the display panel. Optionally, the array substrate 5 includes a pixel circuit X and a receiving adhesive layer 6 arranged on one side of the pixel circuit X, and the pixel circuit X includes a connecting electrode L; the light-emitting element 7 is located on the side of the receiving adhesive layer 6 away from the pixel circuit X.

[0043] The receiving adhesive layer 6 is provided to ensure the stability when the light emitting element 7 is transferred to the array substrate 5 , to ensure the accuracy of the transfer position of the light emitting element 7 , and to ensure the subsequent bonding accuracy of the light emitting element 7 and the connecting electrode L.

[0044] The pressing jig is provided to press the light emitting element 7 into the receiving adhesive layer 6 through the pressing body 1, and connect it to the connection electrode L of the pixel circuit X. During the pressing process, the extruded receiving adhesive layer 6 can enter the second groove body K2 to prevent the receiving adhesive layer 6 from affecting the position of the light emitting element 7. The first groove body K1 corresponds to the light emitting element 7 one by one, and the light emitting element 7 can be limited and fixed by the first groove body K1 to prevent the light emitting element 7 from being offset, tipping over, and other problems.

[0045] In this embodiment, the first groove body K1 and the second groove body K2 can be formed on the pressed body 1 by patterning process means such as etching. The pressed body 1 can use a material with a certain elasticity, that is, an elastomeric material, such as silicone, resin and other materials. The use of a material with a certain elasticity can avoid damage to the light-emitting element 7 when the pressed body 1 and the light-emitting element 7 are in contact, and it is necessary to ensure that the elasticity of the pressed body 1 can overcome the warping to ensure the accuracy of the relative position of the first groove body K1 of the pressed body 1 and the light-emitting element 7.

[0046] By pressing the elastic deformation of the body 1 itself, errors caused by the mechanism accuracy, back plate warping, etc. are overcome, ensuring that the light emitting element 7 and the connecting electrode L are in full contact.

[0047] Considering that laser may be used to weld the light emitting element 7 later, it is necessary to ensure that the material used for the pressed body 1 does not react with the laser, so that the pressed body 1 can be reused to reduce the production cost.

[0048] It should be noted that the light emitting element 73 may be a Micro-LED (Micro Light Emitting Diode) or a Mini-LED (Miniature Light Emitting Diode). Micro-LED and Mini-LED have the advantages of small size, high luminous efficiency and low energy consumption, and can clearly display numbers and patterns on a smaller display panel.

[0049] Since the adhesive layer 6 has a certain viscosity, in order to prevent the adhesive layer 6 from adhering to the surface of the first tank body K1 or the second tank body K2, it is difficult to remove the adhesive layer 6 later. Figure 3 In some optional embodiments, an anti-stick coating 3 is coated inside the first trough body K1; and / or an anti-stick coating 3 is coated inside the second trough body K2.

[0050] The anti-stick coating 3 can be made of nanomaterials or resin materials, as long as it can ensure that the adhesive layer 6 does not leave residue on the surface of the first tank body K1 or the second tank body K2. Of course, the anti-stick coating 3 can also be a film layer formed by spraying a release agent in the first tank body K1 or the second tank body K2, without special limitation.

[0051] In some optional embodiments, along the thickness direction of the pressed body 1 , the cross-sectional area of ​​the second groove body K2 is greater than the cross-sectional area of ​​the first groove body K1 .

[0052] It can be understood that the larger the cross-sectional area of ​​the second slot body K2 is, the easier it is for the receiving adhesive layer 6 to enter, and the more receiving adhesive layers 6 can be accommodated. The cross-sectional area in this embodiment may refer to the cross-sectional area of ​​any position of the second slot body K2 and the first slot body K1 along the thickness direction of the pressed body 1. For example, the cross-sectional area of ​​the first slot body K1 may include the top surface area of ​​the first slot body K1 away from the pressed body 1 and the bottom surface area of ​​the first slot body K1 close to the pressed body 1. The cross-sectional area of ​​the second slot body K2 may include the top surface area away from the pressed body 1 and the bottom surface area of ​​the second slot body K2 close to the pressed body 1, etc., without special limitation.

[0053] Optionally, along the thickness direction of the pressed body 1 , the depth of the second groove body K2 is greater than the depth of the first groove body K1 .

[0054] Taking into account that the space occupied by the extruded receiving adhesive layer 6 is relatively large, the depth of the second groove body K2 can be made greater than the depth of the first groove body K1 along the thickness direction of the pressed body 1, so as to further increase the accommodating space of the second groove body K2. One or more second groove bodies K2 can be provided as long as they can accommodate the extruded receiving adhesive layer 6.

[0055] In some optional embodiments, along the thickness direction of the pressed body 1, the cross-section of the first groove body K1 is at least one of a rectangle and a trapezoid; and / or, along the thickness direction of the pressed body 1, the cross-section of the second groove body K2 is at least one of a rectangle and a trapezoid.

[0056] It is understandable that, since the first slot body K1 needs to limit and fix the light emitting element 7, the shape and size of the cross section of the first slot body K1 needs to meet the requirements of limiting the light emitting element 7, and specifically, a rectangular, trapezoidal, etc. shape may be adopted. Optionally, considering that the light emitting element 7 may be slightly offset after being transferred to the receiving adhesive layer 6, the cross section of the first slot body K1 may be set to a trapezoid, and the position of the slightly offset light emitting element 7 is self-calibrated through the side wall of the first slot body K1, that is, the position of the light emitting element 7 is adjusted so that the light emitting element 7 is exactly set to the first slot body K1.

[0057] Specifically, along the thickness direction of the pressed body 1, the cross-section of the first groove body K1 is trapezoidal, and the top surface area of ​​the first groove body K1 away from the pressed body 1 is larger than the bottom surface area of ​​the first groove body K1 close to the pressed body 1, that is, the cross-section of the first groove body K1 is a right trapezoid, and the top surface area of ​​the first groove body K1 away from the pressed body 1 is larger than the bottom surface area of ​​the first groove body K1 close to the pressed body 1, so that the first groove body K1 can accommodate a slightly offset light-emitting element 7 and correct the position of the light-emitting element 7 through its own side wall to ensure the subsequent bonding accuracy of the light-emitting element 7 and the connecting electrode L.

[0058] The second groove body K2 is used to accommodate the receiving adhesive layer 6. Therefore, the shape of the second groove body K2 is not particularly limited as long as it is convenient for the receiving adhesive layer 6 to enter and has sufficient accommodating space.

[0059] Optionally, along the thickness direction of the pressed body 1 , the cross section of the second trough body K2 is trapezoidal, so as to facilitate demoulding, that is, to facilitate the preparation of the second trough body K2 .

[0060] See also Figure 4 , along the thickness direction of the pressed body 1, the cross section of the second groove body K2 is trapezoidal, and the top surface area of ​​the second groove body K2 away from the pressed body 1 is larger than the bottom surface area of ​​the second groove body K2 close to the pressed body 1. That is, the cross section of the first groove body K1 is a regular trapezoid, which can facilitate the separation of the receiving adhesive layer 6 located in the second groove body K2 and the pressed body 1.

[0061] See also Figure 5 In order to facilitate the discharge of the receiving adhesive layer 6, or to discharge the receiving adhesive layer 6 to the second groove body K2, in some optional embodiments, the pressing jig also includes a connecting channel 2 provided on the pressing body 1, and the connecting channel 2 connects the adjacent first groove body K1; and / or, the connecting channel 2 connects the first groove body K1 and the second groove body K2.

[0062] Adjacent first trough bodies K1 can be connected through the connecting channel 2 so that the receiving adhesive layer 6 can be moved between adjacent first trough bodies K1, and the first trough body K1 and the second trough body K2 can also be connected through the connecting channel 2 so that the receiving adhesive layer 6 in the first trough body K1 and the receiving adhesive layer 6 between adjacent first trough bodies K1 can be moved into the second trough body K2, thereby effectively reducing the influence of the receiving adhesive layer 6 on the light-emitting element 7 and improving the accuracy of the position of the light-emitting element 7 after pressing.

[0063] In some optional embodiments, see Figure 6 The pressing fixture further includes a pressure sensor 4, which is connected to the pressing body 1.

[0064] By providing the pressure sensor 4, the pressure when the pressing body 1 presses the light emitting element 7 onto the array substrate 5 can be detected, so as to avoid damage to the light emitting element 7 or the array substrate 5 due to the pressure of the pressing body 1 due to excessive pressure. At the same time, the pressure parameter size of the pressure sensor 4 can be used to confirm whether the light emitting element 7 is in contact with the connection electrode L.

[0065] Optionally, the pressing body 1 may be clamped and pressed down by a clamping mechanism until the light emitting element 7 contacts the connecting electrode L and the pressure sensor 4 reaches a set value.

[0066] Optionally, the pressure sensor 4 includes a piezoelectric film layer 41 disposed on the surface of the side of the pressing body 1 away from the first slot body K1 and a sensor 42 connected to the piezoelectric film layer 41. The piezoelectric film layer 41 is a film layer that can produce a piezoelectric effect under pressure, such as quartz, etc. After the piezoelectric film layer 41 is subjected to force, a charge is generated on the surface, and this charge can be converted into an electrical signal output by the sensor 42, that is, the set value of the pressure sensor 4, which can be an electrical parameter such as current. The greater the pressure on the pressure sensor 4, the greater the value of the electrical parameter displayed by the pressure sensor 4. When the pressure sensor 4 reaches the set value, it means that the pressing body 1 is in place and the light-emitting element 7 is in contact with the connection electrode L.

[0067] See also Figure 7 The embodiment of the present invention further provides a method for preparing a display panel, comprising the following steps:

[0068] S110: providing an array substrate 5, the array substrate 5 comprising a pixel circuit X and a receiving adhesive layer 6 arranged on one side of the pixel circuit X, the pixel circuit X comprising a connecting electrode L, such as Figure 8 As shown;

[0069] S120: Transfer the light emitting element 7 to the side of the receiving adhesive layer 6 away from the pixel circuit X. Fig. 9 As shown;

[0070] S130: The light emitting element 7 is pressed by the pressing body 1, and the light emitting element 7 at least partially enters the first groove body K1 of the pressing body 1, so that the light emitting element 7 is in contact with the connecting electrode L, and the receiving adhesive layer 6 is squeezed into the second groove body K2 of the pressing body 1. Fig.10 shown.

[0071] The display panel preparation method provided in the embodiment of the present invention uses a pressing body 1 to press the light-emitting element 7, and the light-emitting element 7 partially enters the first groove body K1 of the pressing body 1, so that the light-emitting element 7 is in contact with the connecting electrode L, and the receiving adhesive layer 6 is squeezed into the second groove body K2 of the pressing body 1. The first groove body K1 is used to accommodate the light-emitting element 7 and limit the position of the light-emitting element 7 to prevent the light-emitting element 7 from being offset during the pressing process, and the position of the slightly offset light-emitting element 7 can be self-calibrated by the first groove body K1, thereby improving the subsequent bonding accuracy of the light-emitting element 7. The second groove body K2 can accommodate part of the receiving adhesive layer 6 that is squeezed out after the light-emitting element 7 is pressed into the receiving adhesive layer 6, so as to prevent this part of the receiving adhesive layer 6 from affecting the position of the light-emitting element 7, ensure the position accuracy of the light-emitting element 7, and facilitate the subsequent removal of the receiving adhesive layer 6.

[0072] In step S110, the array substrate 5 may include a first conductive layer, a second conductive layer, and a third conductive layer that are stacked. An insulating layer is provided between adjacent conductive film layers. Exemplarily, the pixel circuit X provided on the array substrate 5 includes a transistor and a storage capacitor. The transistor includes an active layer, a gate, a source and a drain. The storage capacitor includes a first plate and a second plate. As an example, the gate and the first plate may be located in the first conductive layer, the second plate may be located in the second conductive layer, and the source and the drain may be located in the third conductive layer. The connecting electrode L is electrically connected to one of the source and the drain.

[0073] In step S120, the light emitting element 7 can be transferred from the preparation substrate Z to the receiving adhesive layer 6 by means of the transfer substrate Y. The receiving adhesive layer 6 supports and fixes the light emitting element 7 to prevent the light emitting element 7 from large position changes or overturning. Fig.11 and Fig.12 shown.

[0074] In step S130, since the pressing of the body 1 requires the light emitting element 7 to be in contact with the connecting electrode L, the light emitting element 7 cannot be completely inserted into the first slot body K1, and it is necessary to ensure that at least the part of the light emitting element 7 in contact with the connecting electrode L is exposed relative to the first slot body K1. During the pressing process, the extruded receiving adhesive layer 6 can enter the second slot body K2 to prevent the receiving adhesive layer 6 from affecting the position of the light emitting element 7. The first slot body K1 and the light emitting element 7 correspond one to one, and the light emitting element 7 can be limited and fixed by the first slot body K1 to prevent the light emitting element 7 from being offset, tipping over, and other problems.

[0075] Optionally, the alignment between the pressed body 1 and the array substrate 5 may be achieved by laser alignment or the like, so that the first slot body K1 can be arranged opposite to the light emitting element 7 .

[0076] See also Fig.13 and Fig.14 In some optional embodiments, after the step of applying pressure to the light emitting element 7 by the pressing body 1, the light emitting element 7 at least partially enters the first groove body K1 of the pressing body 1, so that the light emitting element 7 contacts the connection electrode L, and the receiving adhesive layer 6 is pressed into the second groove body K2 of the pressing body 1, the method further includes: welding the light emitting element 7 and the connection electrode L, and removing the receiving adhesive layer 6. The receiving adhesive layer 6 specifically includes a portion of the receiving adhesive layer 6 located on the array substrate 5 and a portion of the receiving adhesive layer 6 remaining in the second groove body K2 of the pressing body 1.

[0077] Optionally, laser can be used to weld the light emitting element 7 and the connecting electrode L. During the welding process, the receiving adhesive layer 6 can be decomposed under the action of the laser and removed together. Alternatively, the light emitting element 7 and the connecting electrode L can be welded in other ways, and the receiving adhesive layer 6 can be cleaned with a cleaning liquid.

[0078] In this embodiment, laser (including but not limited to linear or square spots) can be used to weld the light-emitting element 7 and the connecting electrode L. The laser emitting element 8 that generates laser light can be moved relative to the array substrate 5, while the array substrate 5 remains stationary, so as to weld the light-emitting elements 7 located at different positions. The laser emitting element 8 can also be kept stationary, while the array substrate 5 moves relative to the laser emitting element 8, without any special limitation.

[0079] Compared with the display panel preparation process in the prior art, the embodiment of the present application does not need to go through the processes of transferring the light-emitting element 7 to a temporary substrate and bonding, laser peeling, and flipping the press. The position accuracy of the light-emitting element 7 after pressing can be improved by pressing the body 1, and the use of laser welding can improve the welding yield and efficiency. It avoids the problems of the difficulty in controlling the adhesion of traditional seal transfer, the limited efficiency of the seal size due to the thickness requirement of the silicon wafer, and the short life of the seal; it also avoids the problems of low yield efficiency, low welding quality, thermal expansion, etc. of traditional press heat welding. In addition, the embodiment of the present application only uses laser transfer and laser welding equipment to realize the transfer bonding process, with a simple process flow, a small number of equipment, and high processing efficiency.

[0080] The receiving adhesive layer 6 can specifically be a receiving adhesive (such as flux) that reacts with laser or decomposes thermally. The receiving adhesive will be decomposed during the laser welding process to keep the array substrate 5 and the pressed body 1 clean; or, the receiving adhesive layer 6 can be a receiving adhesive that will not solidify. After the welding of the array substrate 5 and the light-emitting element 7 is completed, the array substrate 5 is cleaned with relevant liquid to remove the receiving adhesive layer 6.

[0081] In some optional embodiments, along the thickness direction of the pressed body 1, the depth of the first slot body K1 is less than the thickness of the light emitting element 7, so that the portion where the light emitting element 7 is connected to the connection electrode L is exposed relative to the first slot body K1. In the direction parallel to the thickness direction of the pressed body 1, the width of the first slot body K1 is set to be greater than or equal to the width of the light emitting element 7, in order to provide a certain redundancy, so that the light emitting element 7 can smoothly enter the first slot body K1 even if the position is slightly offset, and the slightly offset position of the light emitting element 7 is self-calibrated through the side wall of the first slot body K1, that is, the position of the light emitting element 7 is adjusted so that the light emitting element 7 is exactly set corresponding to the first slot body K1.

[0082] Optionally, along the thickness direction of the pressed body 1, the thickness of the receiving adhesive layer 6 is greater than the thickness of the light emitting element 7. Compared with the receiving adhesive layer 6 in the prior art, the receiving adhesive layer 6 in the embodiment of the present invention can be set thicker, so that the second groove body K2 can accommodate the extruded receiving adhesive layer 6. The use of a thicker receiving adhesive layer 6 can improve the stability of the light emitting element 7 when it is transferred to the receiving adhesive layer 6 and the accuracy of the position, thereby improving the transfer and direct transfer yield.

[0083] The display panel provided in the embodiment of the present invention can be a mobile phone or any electronic product with a display function, including but not limited to the following categories: televisions, laptops, desktop displays, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, medical equipment, industrial control equipment, touch interactive terminals, etc. The embodiment of the present invention does not make any special limitations on this.

[0084] The above are only specific implementation methods of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of this application.

[0085] It should also be noted that the exemplary embodiments mentioned in this application describe some methods or systems based on a series of steps or devices. However, this application is not limited to the order of the above steps, that is, the steps can be performed in the order mentioned in the embodiment, or in a different order from the embodiment, or several steps can be performed simultaneously.

Claims

1. A pressing jig, characterized in that: include: A pressing body, wherein at least one first slot body and at least one second slot body are arranged on the pressing body, and the first slot body and the second slot body are arranged at intervals; The first groove body corresponds to the position of the light emitting element and presses the light emitting element into the receiving adhesive layer on the array substrate, and the second groove body is used to accommodate the receiving adhesive layer.

2. The pressing jig according to claim 1, characterized in that: In the thickness direction of the pressed body, the cross-sectional area of ​​the second groove body is larger than the cross-sectional area of ​​the first groove body; Preferably, along the thickness direction of the pressed body, the depth of the second groove body is greater than the depth of the first groove body; Preferably, along the thickness direction of the pressed body, the cross section of the first groove body is at least one of a rectangle and a trapezoid; and / or, In the thickness direction of the pressed body, the cross section of the second groove body is at least one of a rectangle and a trapezoid.

3. The pressing jig according to claim 1, characterized in that: In the thickness direction of the pressed body, the cross section of the first groove body is trapezoidal, and the top surface area of ​​the first groove body away from the pressed body is larger than the bottom surface area of ​​the first groove body close to the pressed body; and / or, In the thickness direction of the pressed body, the cross section of the second groove body is trapezoidal, and the top surface area of ​​the second groove body away from the pressed body is larger than the bottom surface area of ​​the second groove body close to the pressed body.

4. The pressing jig according to claim 1, characterized in that: The pressing jig further includes a connecting channel provided on the pressing body, wherein the connecting channel communicates with adjacent first slot bodies; and / or the connecting channel communicates with the first slot body and the second slot body.

5. The pressing jig according to claim 1, characterized in that: The pressing jig further comprises a pressure sensor, and the pressure sensor is connected to the pressing body; Preferably, the pressure sensing element comprises a piezoelectric film layer provided on a surface of the pressing body on a side away from the first groove body, and a sensor connected to the piezoelectric film layer.

6. The pressing jig according to claim 1, characterized in that: The material of the pressed body includes an elastomeric material; Preferably, the material of the pressed body includes at least one of silicone and resin.

7. The pressing jig according to claim 1, characterized in that: An anti-stick coating is applied in the first tank; and / or, The second tank body is coated with an anti-stick coating.

8. A method for preparing a display panel, characterized in that: The following steps are involved: Providing an array substrate, the array substrate comprising a pixel circuit and a receiving adhesive layer arranged on one side of the pixel circuit, the pixel circuit comprising a connecting electrode; Transferring the light emitting element to a side of the receiving adhesive layer away from the pixel circuit; The light emitting element is pressed by a pressing body, and the light emitting element at least partially enters the first groove of the pressing body, so that the light emitting element contacts the connecting electrode, and the receiving adhesive layer is squeezed into the second groove of the pressing body.

9. The method for preparing a display panel according to claim 8, characterized in that: After the step of applying pressure to the light emitting element by using the pressing body, the light emitting element at least partially enters the first groove of the pressing body so that the light emitting element contacts the connecting electrode, and the receiving adhesive layer is squeezed into the second groove of the pressing body, the method further includes: Welding the light emitting element and the connecting electrode; After the light emitting element and the connecting electrode are welded, the receiving adhesive layer is removed.

10. The method for preparing a display panel according to claim 8, characterized in that: In the thickness direction of the pressed body, the depth of the first groove is less than the thickness of the light emitting element; In a direction parallel to the thickness direction of the pressed body, the width of the first groove body is greater than or equal to the width of the light emitting element; Preferably, along the thickness direction of the pressed body, the thickness of the receiving adhesive layer is greater than the thickness of the light emitting element.

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