Light emitting diode and detection device for light emitting diode wafer

Abstract

The invention discloses a light-emitting diode and a detection device for a light-emitting diode wafer, and relates to the technical field of light-emitting diodes, the light-emitting diode comprises a light-emitting diode body, the light-emitting diode body comprises a substrate, a wafer is installed in the middle of the upper surface of the substrate, a transparent medium layer covers the outside of the wafer, and the transparent medium layer is arranged on the substrate. A first electrode is arranged on the lower surface of the left end of the substrate, and a second electrode is arranged on the lower surface of the right end of the substrate; according to the LED lamp, firstly, the heat dissipation layer can conduct out heat generated on the substrate, in this way, heat dissipation of the light-emitting diodes is completed in one step, then ventilation in the heat dissipation layer can be promoted through matched use of the ventilation holes and the heat dissipation holes, in this way, replacement of the air in the heat dissipation layer can be effectively completed, and the service life of the LED lamp is prolonged. Therefore, the heat dissipation rate of the light-emitting diode is further improved, meanwhile, the light-emitting diode has a self-heat-dissipation function, and the service life of the light-emitting diode is greatly prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field related to light emitting diodes, in particular to light emitting diodes and a detection device for light emitting diode chips. Background Art

[0002] Light-emitting diode chips are a type of semiconductor light-emitting components made of semiconductor materials. Light-emitting diode chips are the main raw materials of LEDs and are the core components of LED light. During the production process of light-emitting diode chips, it is necessary to test the brightness, thickness, width and other parameters of the semiconductor chips. At the same time, the defects on the chip surface will also be detected.

[0003] At present, the existing LED chip detection device uses manual centering to adjust the position of the LED chip on the detection table during use, which reduces the convenience of using the LED chip thickness detection. In addition, most of the existing chip detection devices only support one shape of chip clamping, which is not conducive to the comparison of detection results of chips of various shapes, and greatly reduces the efficiency of collecting detection data. At the same time, the existing chip detection device lacks a switching structure for multiple detection methods, thereby reducing the accuracy of the detection results. Summary of the invention

[0004] In order to solve the defects in the prior art, the present invention provides a light emitting diode and a detection device for a light emitting diode chip.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions: The present invention provides a light-emitting diode, comprising a light-emitting diode body, wherein the light-emitting diode body comprises a substrate, a chip is mounted at a middle position of an upper surface of the substrate, the outside of the chip is covered with a transparent medium layer, a first electrode is arranged on a lower surface of the substrate at a left end, a second electrode is arranged on a lower surface of the substrate at a right end, a heat dissipation layer is fixedly connected to a lower surface of the substrate, ventilation cavities interconnected are provided inside the heat dissipation layer, and heat dissipation holes connected to the ventilation cavities are respectively arranged on an outer surface of the heat dissipation layer.

[0006] A detection device for light emitting diode wafers, the detection device comprising a clamping component and a detection component, wherein the detection component is installed on the upper surface of the clamping component at the rear end thereof; The clamping assembly includes a base plate, the upper surface of the base plate is fixedly connected to an outer protective frame, two clamping cylinders are fixedly installed on both side surfaces of the outer protective frame, one end of the two clamping cylinders close to each other is fixedly connected to two U-shaped carriers, and one side of the two U-shaped carriers close to each other is fixedly connected to two guide rails, and each guide rail is clamped with two driven blocks on the outside of the front end and the rear end thereof.

[0007] As a preferred technical solution of the present invention, the clamping assembly also includes a main adjusting screw, which is threadedly connected to the inner cavity of the driven block away from the guide rail, and the front and rear ends of the main adjusting screw are respectively embedded in the middle positions of the front and back of the U-shaped carrier through bearings, and two servo motors are fixedly installed at the top position of the front of the two U-shaped carriers, and a liquid storage tank is provided on the upper surface of each driven block, and an oil guide hole is provided on the bottom surface of the inner cavity of each liquid storage tank.

[0008] As a preferred technical solution of the present invention, the upper surface of each driven clamping block is fixedly connected to an external fixed tube, the inner cavity of each external fixed tube is plugged with an angle claw, an oil inlet hole is provided in the middle position of the upper surface of each angle claw, a plug hole is provided on one side of each external fixed tube close to the guide rail, and a card groove is provided at the bottom of each angle claw close to the guide rail.

[0009] As a preferred technical solution of the present invention, a limit column is inserted into the inner cavity of each socket and slot, and a positioning spring is fixedly connected to the side of each limit column opposite to the outer fixed tube. Two ends of the two limit columns on the left and right sides that are away from each other are fixedly connected to two telescopic rods, and a central support platform is fixedly connected to the middle position of the upper surface of the base plate.

[0010] As a preferred technical solution of the present invention, the detection component includes a main frame plate, the lower end of the main frame plate is fixedly connected to the upper surface of the rear end of the outer protective frame, a lifting cylinder is installed on the upper surface of the main frame plate at the front end, a stepper motor is installed at the lower end of the lifting cylinder, the output shaft end of the stepper motor at the lower side is fixedly connected to a track plate, and the outer part of the lower end of the track plate is sleeved with a lower matching frame.

[0011] As a preferred technical solution of the present invention, a horizontal adjustment cylinder is fixedly installed on the right side of the track plate, and the left end of the horizontal adjustment cylinder is fixedly connected to the right side of the upper end of the lower supporting frame, and a rotating cylinder is fixedly installed on the right side of the lower end of the lower supporting frame, and the left end of the rotating cylinder is fixedly connected to an inner slave plate, a non-contact thickness gauge is fixedly installed on the upper surface of the inner slave plate, and a camera is fixedly installed on the lower surface of the inner slave plate.

[0012] As a preferred technical solution of the present invention, the lower rack is provided with a content groove on the front side at its upper end, an inner plug plate is inserted into the inner cavity of the content groove, a sponge brush is bonded to the lower surface of the inner plug plate, and an upper fixing bolt is threadedly connected to the front side of the inner plug plate and the front side of the upper end of the lower rack.

[0013] As a preferred technical solution of the present invention, the outer walls of the front end and the rear end of the main adjusting screw are provided with reverse threads.

[0014] As a preferred technical solution of the present invention, an arc groove is formed at one end of each corner claw close to the middle support platform.

[0015] The beneficial effects of the present invention are: 1. The light-emitting diode, through the provided heat dissipation layer, ventilation cavity and heat dissipation holes, firstly, the heat dissipation layer can conduct the heat generated on the substrate, thus completing the heat dissipation of the light-emitting diode in advance, and then the coordinated use of the ventilation holes and the heat dissipation holes can promote the air circulation inside the heat dissipation layer, thus effectively completing the replacement of the air inside the heat dissipation layer, so as to further improve the heat dissipation rate of the light-emitting diode, and at the same time, also enable the light-emitting diode to have the function of self-heating, thereby greatly improving the service life of the light-emitting diode.

[0016] 2. This detection device for light-emitting diode wafers, through the set clamping assembly, first controls the two clamping cylinders to start up, which can drive the driven clamping blocks and the corner claws on both sides to move in opposite directions at the same time. When the corner claws on both sides contact the two end surfaces of the wafer, the initial fixation of the wafer is completed. Then, the servo motor is controlled to rotate forward to drive the main adjustment screw to rotate forward. The forward rotation of the main adjustment screw can drive the front and rear outer fixing tubes and the corner claws to move in opposite directions at the same time. When the front and rear corner claws contact the front and rear end surfaces of the wafer, the secondary fixation of the wafer is quickly completed. The wafer is quickly aligned by fixing the wafer twice, and this alignment The middle method saves time and effort and greatly improves the user experience. Again, the coordinated use of the clamping cylinder and the servo motor can conveniently clamp round, square, rectangular and hemispherical wafers, so that it is convenient to compare and analyze the detection structures of wafers of various shapes, which greatly improves the efficiency of collecting detection data. Finally, controlling the telescopic rods on both sides to pull in opposite directions can drive the limit columns on both sides to move in opposite directions. When the limit columns on both sides are fully out of the inner cavity of the card slot, pulling the corner claws upwards respectively can quickly complete their disassembly, thereby facilitating the replacement of new corner claws, greatly improving the practicality of the entire device.

[0017] 3. This detection device for light-emitting diode wafers, through the detection component set, first controls the lifting cylinder to start, which can drive the camera to move downward to the shooting height, and then controls the horizontal adjustment cylinder to start, which can drive the lower rack and the camera to move to the left at the same time, so that the camera can quickly adjust the observation diameter of the wafer, and then controls the stepper motor to start, which can drive the adjusted camera to rotate, so that the camera can shoot the wafer in an all-round way, thereby effectively improving the work efficiency of the staff in detecting surface defects of the wafer, and then controls the rotation cylinder to start, which can drive the inner slave plate to rotate 180°, and the inner slave plate rotates 180° forward, which can drive the non-contact thickness gauge to flip to the bottom, and at this time, controls the lifting cylinder to start, which can drive the non-contact thickness gauge detection end to approach the wafer, so as to facilitate the completion of the wafer thickness detection, and finally controls the horizontal adjustment cylinder and the stepper motor to start, which can drive the non-contact thickness gauge to perform all-round thickness detection on the wafer, which greatly improves the detection rate, and at the same time, has the function of fast switching of multiple detection methods, which greatly improves the accuracy of the detection results. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 It is a structural schematic diagram of the present invention from the right side viewing angle; Figure 3 is a front cross-sectional view of the present invention; Figure 4 The present invention Figure 3 Stereoscopic image of Figure 5 is a side sectional view of the present invention; Figure 6 is a side sectional view of the corner claw and the driven block of the present invention; Figure 7 is a front cross-sectional view of the corner claw and the driven block of the present invention; Figure 8 It is a structural schematic diagram of the light emitting diode body of the present invention; Fig. 9 The present invention Figure 8 A front cross-sectional view of Fig.10 is a cross-sectional view of the bottom of the heat dissipation layer of the present invention; Fig.11 It is a schematic diagram of the structure of the corner claws of the present invention for clamping wafers of different shapes; Fig.12 The present invention Figure 4The enlarged view of point A in the middle; Fig.13 The present invention Figure 5 The enlarged view of point B in the middle; Fig.14 The present invention Figure 6 Enlarged view of point C in the middle; Fig.15 The present invention Figure 7 Enlarged view of point D in the middle.

[0019] In the figure: 1. LED body; 101. substrate; 102. wafer; 103. transparent medium layer; 104. first electrode; 105. second electrode; 106. heat dissipation layer; 107. ventilation cavity; 108. heat dissipation hole; 2. clamping assembly; 201. bottom plate; 202. outer protective frame; 203. clamping cylinder; 204. U-shaped carrier; 205. guide rail; 206. driven block; 207. main adjustment screw; 208. servo motor; 209. liquid storage tank; 210. oil guide hole; 211. outer fixed pipe; 212. corner claw ; 213, oil inlet hole; 214, socket; 215, slot; 216, limit column; 217, positioning spring; 218, telescopic rod; 219, middle support platform; 3, detection component; 301, main frame plate; 302, lifting cylinder; 303, stepping motor; 304, track plate; 305, lower rack; 306, horizontal adjustment cylinder; 307, rotating cylinder; 308, inner slave plate; 309, non-contact thickness gauge; 310, camera; 311, content slot; 312, inner plug-in board; 313, sponge brush; 314, upper bolt. DETAILED DESCRIPTION

[0020] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0021] Example: Figure 1-15 As shown, a light-emitting diode of the present invention comprises a light-emitting diode body 1, wherein the light-emitting diode body 1 comprises a substrate 101, a chip 102 is mounted at a middle position of an upper surface of the substrate 101, an outer portion of the chip 102 is covered with a transparent medium layer 103, a first electrode 104 is arranged on a lower surface of the substrate 101 at a left end, a second electrode 105 is arranged on a lower surface of the substrate 101 at a right end, a heat dissipation layer 106 is fixedly connected to a lower surface of the substrate 101, a ventilation cavity 107 interconnected is provided inside the heat dissipation layer 106, and heat dissipation holes 108 connected to the ventilation cavity 107 are respectively arranged on an outer surface of the heat dissipation layer 106.

[0022] A detection device for light emitting diode wafers, the detection device comprising a clamping component 2 and a detection component 3, wherein the detection component 3 is mounted on the upper surface of the clamping component 2 at the rear end thereof; The clamping assembly 2 includes a base plate 201, an outer protective frame 202 is fixedly connected to the upper surface of the base plate 201, two clamping cylinders 203 are fixedly installed on the two side surfaces of the outer protective frame 202, the ends of the two clamping cylinders 203 close to each other are fixedly connected to two U-shaped carriers 204, and the sides of the two U-shaped carriers 204 close to each other are fixedly connected to two guide rails 205, and each guide rail 205 is located at the front and rear ends thereof. The outside is clamped with two driven blocks 206; the clamping assembly 2 also includes a main adjustment screw 207, the main adjustment screw 207 is respectively connected to the inner cavity of the driven block 206 away from the guide rail 205, and the front and rear ends of the main adjustment screw 207 are respectively embedded in the middle position of the front and back of the U-shaped carrier 204 through bearings, and two servo motors 208 are fixedly installed at the top position of the front of the two U-shaped carriers 204, and the upper surface of each driven block 206 is provided with a storage Liquid tank 209, each liquid storage tank 209 has an oil guide hole 210 on its bottom surface; each driven block 206 has an outer fixed tube 211 fixedly connected to its upper surface, each outer fixed tube 211 has an inner cavity plugged with an angle claw 212, each angle claw 212 has an oil inlet hole 213 in the middle of its upper surface, each outer fixed tube 211 has a plug hole 214 on one side close to the guide rail 205, each angle claw 212 has a card slot 215 at its bottom close to the guide rail 205; each plug hole 214 and card slot 215 has a limit column 216 plugged into its inner cavity, each limit column 216 has a positioning spring 217 fixedly connected to one side opposite to the outer fixed tube 211, two telescopic rods 218 are fixedly connected to the ends of the two limit columns 216 on the left and right sides that are away from each other, and a middle support 219 is fixedly connected to the middle position of the upper surface of the bottom plate 201.

[0023] Among them, by setting the clamping assembly 2, firstly controlling the two clamping cylinders 203 to start can drive the two U-shaped carriers 204 to move in relative directions, and the two U-shaped carriers 204 moving in relative directions can drive the driven blocks 206 and the corner claws 212 on both sides to move in relative directions at the same time, and when the corner claws 212 on both sides contact the two end surfaces of the wafer 102, the initial fixation of the wafer 102 is completed, and then controlling the servo motor 208 to rotate forward can drive the main adjustment screw 207 to rotate forward, and the main adjustment screw 207 to rotate forward can drive the front and rear driven blocks 206 to move in relative directions, and the front and rear driven blocks 206 to move in relative directions can bring The outer fixed tube 211 and the corner claws 212 at the front and rear sides move in opposite directions at the same time. When the corner claws 212 at the front and rear sides contact the front and rear end surfaces of the wafer 102, the secondary fixation of the wafer 102 is quickly completed. The centering of the wafer 102 is quickly completed by fixing the wafer 102 twice. This centering method saves time and effort, and greatly improves the user experience. The coordinated use of the clamping cylinder 203 and the servo motor 208 can facilitate the clamping of circular, square, rectangular and hemispherical wafers 102, so that the detection structures of wafers 102 of various shapes can be easily compared and analyzed, which greatly improves the efficiency of collecting detection data.

[0024] The detection component 3 includes a main frame plate 301, the lower end of the main frame plate 301 is fixedly connected to the upper surface of the rear end of the outer protective frame 202, a lifting cylinder 302 is installed on the upper surface of the front end of the main frame plate 301, a stepper motor 303 is installed at the lower end of the lifting cylinder 302, the output shaft end of the stepper motor 303 is fixedly connected to a track plate 304 at the lower side, and the lower end of the track plate 304 is sleeved with a lower frame 305; a horizontal adjustment cylinder 306 is fixedly installed on the right side of the track plate 304, and the left end of the horizontal adjustment cylinder 306 is fixedly connected to the right side of the upper end of the lower frame 305, A rotating cylinder 307 is fixedly installed on the right side of the lower end of the rack 305, and an inner slave plate 308 is fixedly connected to the left end of the rotating cylinder 307. A non-contact thickness gauge 309 is fixedly installed on the upper surface of the inner slave plate 308, and a camera 310 is fixedly installed on the lower surface of the inner slave plate 308; the lower rack 305 is provided with a content groove 311 on the front of the upper end, and an inner plug-in plate 312 is inserted into the inner cavity of the content groove 311, and a sponge brush 313 is bonded to the lower surface of the inner plug-in plate 312, and the front of the inner plug-in plate 312 and the front of the upper end of the lower rack 305 are both threadedly connected with an upper fixing bolt 314.

[0025] Among them, by setting up the detection component 3, first controlling the lifting cylinder 302 to start can drive the stepper motor 303 and the track plate 304 to move downward at the same time, and the downward movement of the track plate 304 can drive the lower rack 305 and the rotating cylinder 307 to move downward at the same time, and the downward movement of the rotating cylinder 307 can drive the inner plate 308 and the camera 310 to move downward at the same time, so that the camera 310 can be controlled to move downward to the shooting height, and then controlling the horizontal adjustment cylinder 306 to start can drive the lower rack 305 and the camera 310 to move to the left at the same time, so that the observation diameter of the wafer 102 by the camera 310 can be quickly adjusted, and then controlling the stepper motor 303 to start can drive the adjusted camera 310 to rotate, so that the camera 310 can be moved downward to the shooting height. 0 can take pictures of the wafer 102 in all directions, thereby effectively improving the work efficiency of the staff in detecting surface defects of the wafer 102. Then, the rotation cylinder 307 can be controlled to start to drive the inner slave plate 308 to rotate 180° forward. The inner slave plate 308 can rotate 180° forward to drive the non-contact thickness gauge 309 to flip to the bottom. At this time, the lifting cylinder 302 can be controlled to start to drive the detection end of the non-contact thickness gauge 309 to approach the wafer 102, thereby facilitating the completion of the thickness detection of the wafer 102. The maximum rotation angle of the camera 310 and the non-contact thickness gauge 309 is 360°. After rotating to 360°, the stepper motor 303 will control the camera 310 and the non-contact thickness gauge 309 to rotate 360° in the opposite direction, which can effectively avoid the entanglement of the connecting lines.

[0026] The outer walls of the front and rear ends of the main adjustment screw rod 207 are provided with reverse threads.

[0027] An arc groove is formed at one end of each corner claw 212 close to the middle support 219 .

[0028] The arc-shaped groove can conveniently clamp the circular wafer 102 .

[0029] During operation, firstly, the two clamping cylinders 203 are controlled to start so as to drive the two U-shaped carriers 204 to move in opposite directions. The movement of the two U-shaped carriers 204 in opposite directions can drive the driven clamping blocks 206 and the corner claws 212 on both sides to move in opposite directions at the same time. When the corner claws 212 on both sides contact the two end surfaces of the wafer 102, the preliminary fixation of the wafer 102 is completed. Then, the servo motor 208 is controlled to rotate forward so as to drive the main adjustment screw 207 to rotate forward. The main adjustment screw 207 rotates forward so as to drive the front and rear driven clamping blocks 206 to move in opposite directions. The movement of the front and rear driven clamping blocks 206 in opposite directions can drive the front and rear outer fixed tubes 211 and the corner claws 212 to move in opposite directions at the same time. When 212 contacts the front and rear end surfaces of the wafer 102, the secondary fixation of the wafer 102 is quickly completed. By fixing the wafer 102 twice, the centering of the wafer 102 is quickly completed, and this centering method saves time and effort, greatly improving the user experience. The coordinated use of the clamping cylinder 203 and the servo motor 208 can conveniently clamp circular, square, rectangular and hemispherical wafers 102. Finally, the telescopic rods 218 on both sides are controlled to be pulled in opposite directions to drive the limiting columns 216 on both sides to move in opposite directions. When the limiting columns 216 on both sides are fully separated from the inner cavity of the card slot 215, the corner claws 212 are pulled upwards respectively at this time to quickly complete their disassembly, thereby facilitating the replacement of new corner claws 212. Fig.11 As shown; Detection of wafer 102: First, control the lifting cylinder 302 to start, which can drive the stepper motor 303 and the track plate 304 to move downward at the same time. The downward movement of the track plate 304 can drive the lower rack 305 and the rotating cylinder 307 to move downward at the same time. The downward movement of the rotating cylinder 307 can drive the inner plate 308 and the camera 310 to move downward at the same time, so that the camera 310 can be controlled to move downward to the shooting height. Then control the horizontal adjustment cylinder 306 to start, which can drive the lower rack 305 and the camera 310 to move to the left at the same time, so that the camera 310 can be quickly adjusted. 0 for the observation diameter of the wafer 102, and then controlling the stepper motor 303 to start can drive the camera 310 adjusted to rotate, so that the camera 310 can take pictures of the wafer 102 in all directions, thereby effectively improving the work efficiency of the staff in detecting surface defects of the wafer 102, and then controlling the rotation cylinder 307 to start can drive the inner slave plate 308 to rotate 180° forward, and the inner slave plate 308 rotates 180° forward to drive the non-contact thickness gauge 309 to flip to the bottom, and at this time, controlling the lifting cylinder 302 to start can drive the non-contact thickness gauge 309 to detect The measuring end is close to the wafer 102, so as to facilitate the thickness detection of the wafer 102. The maximum rotation angle of the camera 310 and the non-contact thickness gauge 309 is 360°. After turning to 360°, the stepper motor 303 will control the camera 310 and the non-contact thickness gauge 309 to rotate 360° in the opposite direction, which can effectively avoid the entanglement of the connecting line. As described in the above principle, the horizontal adjustment cylinder 306 and the stepper motor 303 are finally controlled to start, so that the non-contact thickness gauge 309 can be driven to perform a full range of thickness detection on the wafer 102. After the detection of the wafer 102 is completed, the rotating cylinder is controlled 307 is started, and the rotating cylinder 307 is started to drive the inner slave plate 308 to reverse 180 degrees, and then the camera 310 and the non-contact thickness gauge 309 are quickly reset, so that the device can be used continuously. At the same time, the positive and negative rotation of the camera 310 can cause the surface of its camera end to automatically rub against the sponge brush 313, thereby effectively completing the automatic cleaning of the camera 310, and then the upper bolt 314 is controlled to reverse. When the upper bolt 314 is separated from the interior of the lower rack 305, the inner plug plate 312 is pulled outward to quickly complete the removal and replacement of the sponge brush 313; Oiling of the transmission structure: first, the lubricating oil is introduced into the oil inlet hole 213, and the oil inlet hole 213 will transfer the lubricating oil to the inside of the liquid storage tank 209. Then the oil guide hole 210 will transfer the lubricating oil to the surface of the main adjusting screw 207. Finally, the servo motor 208 controls the forward and reverse rotation of the main adjusting screw 207 to drive the oil guide hole 210 to automatically apply the lubricating oil to the surface of the main adjusting screw 207. In this way, the automatic oiling of the main adjusting screw 207 is effectively completed.

[0030] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A light emitting diode, comprising a light emitting diode body (1), characterized in that: The light-emitting diode body (1) comprises a substrate (101), a chip (102) is mounted at a middle position of the upper surface of the substrate (101), the outside of the chip (102) is covered with a transparent medium layer (103), a first electrode (104) is arranged on the lower surface of the substrate (101) at the left end, a second electrode (105) is arranged on the lower surface of the substrate (101) at the right end, a heat dissipation layer (106) is fixedly connected to the lower surface of the substrate (101), a ventilation cavity (107) interconnected with each other is provided inside the heat dissipation layer (106), and heat dissipation holes (108) connected with the ventilation cavity (107) are respectively provided on the outer surface of the heat dissipation layer (106).

2. A detection device for light emitting diode wafers, using a light emitting diode according to claim 1, characterized in that: The detection device comprises a clamping component (2) and a detection component (3); the detection component (3) is mounted on the upper surface of the clamping component (2) at the rear end thereof; The clamping assembly (2) comprises a base plate (201), the upper surface of the base plate (201) being fixedly connected to an outer protective frame (202), two clamping cylinders (203) being fixedly mounted on two side surfaces of the outer protective frame (202), two U-shaped carriers (204) being fixedly connected to one end of the two clamping cylinders (203) close to each other, two guide rails (205) being fixedly connected to one side of the two U-shaped carriers (204) close to each other, and two driven clamping blocks (206) being clamped to the outside of each guide rail (205) located at the front end and the rear end thereof.

3. The detection device for light emitting diode wafer according to claim 2, characterized in that: The clamping assembly (2) further comprises a main adjusting screw (207), wherein the main adjusting screw (207) is respectively threadedly connected to the inner cavity of the end of the driven clamp (206) away from the guide rail (205), and the front end and the rear end of the main adjusting screw (207) are respectively embedded in the middle position of the front and back of the U-shaped carrier (204) through bearings, and two servo motors (208) are fixedly installed at the top position of the front of the two U-shaped carriers (204), and each driven clamp (206) has a liquid storage tank (209) on the upper surface, and each liquid storage tank (209) has an oil guide hole (210) on the bottom surface of the inner cavity.

4. The detection device for light emitting diode wafer according to claim 3, characterized in that: The upper surface of each driven clamping block (206) is fixedly connected to an outer solid tube (211), the inner cavity of each outer solid tube (211) is plugged with an angle claw (212), an oil inlet hole (213) is provided in the middle of the upper surface of each angle claw (212), a plug hole (214) is provided on one side of each outer solid tube (211) close to the guide rail (205), and a clamping groove (215) is provided on the bottom of one side of each angle claw (212) close to the guide rail (205).

5. The detection device for light emitting diode wafer according to claim 4, characterized in that: A limiting column (216) is inserted into the inner cavity of each insertion hole (214) and the slot (215); a positioning spring (217) is fixedly connected to a surface of each limiting column (216) opposite to the outer fixed tube (211); two ends of the two limiting columns (216) on the left and right sides that are away from each other are fixedly connected to two telescopic rods (218); and a middle support platform (219) is fixedly connected to the middle position of the upper surface of the bottom plate (201).

6. The detection device for light emitting diode wafer according to claim 5, characterized in that: The detection component (3) comprises a main frame plate (301), the lower end of the main frame plate (301) is fixedly connected to the upper surface of the rear end of the outer protective frame (202), a lifting cylinder (302) is installed on the upper surface of the front end of the main frame plate (301), a stepping motor (303) is installed at the lower end of the lifting cylinder (302), the output shaft end of the stepping motor (303) is fixedly connected to a track plate (304) at the lower side, and a lower matching frame (305) is sleeved on the outside of the lower end of the track plate (304).

7. The detection device for light emitting diode wafer according to claim 6, characterized in that: A horizontal adjustment cylinder (306) is fixedly mounted on the right side of the track plate (304), and the left end of the horizontal adjustment cylinder (306) is fixedly connected to the right side of the upper end of the lower supporting frame (305). A rotating cylinder (307) is fixedly mounted on the right side of the lower end of the lower supporting frame (305), and the left end of the rotating cylinder (307) is fixedly connected to an inner slave plate (308). A non-contact thickness gauge (309) is fixedly mounted on the upper surface of the inner slave plate (308), and a camera (310) is fixedly mounted on the lower surface of the inner slave plate (308).

8. The detection device for light emitting diode wafer according to claim 7, characterized in that: The lower rack (305) is provided with a content groove (311) on the front surface at the upper end thereof, an inner plug-in plate (312) is inserted into the inner cavity of the content groove (311), a sponge brush (313) is bonded to the lower surface of the inner plug-in plate (312), and an upper fixing bolt (314) is threadedly connected to the front surface of the inner plug-in plate (312) and the front surface of the upper end of the lower rack (305).

9. The detection device for light emitting diode wafer according to claim 3, characterized in that: The outer walls of the front and rear ends of the main adjustment screw rod (207) are provided with reverse threads.

10. The detection device for light emitting diode wafer according to claim 5, characterized in that: An arc groove is formed on one end of each corner claw (212) close to the middle support platform (219).

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