Burning device and method for sensor circuit board

Abstract

The invention relates to the technical field of circuit board machining, in particular to sensor circuit board burning equipment and method.The sensor circuit board burning equipment comprises a machining table, a cleaning pool, a clamp, a driving mechanism, a containing plate, a clamping plate, a connecting spring, a suction mechanism and a suction nozzle. After the circuit board is cleaned, moisture and dust on the circuit board are sucked away through the suction nozzle, so that the circuit board can be cleaned and blow-dried, residues on the circuit board can be automatically cleaned, and the phenomenon that in the burning process of the circuit board, the circuit board is damaged due to the fact that the residues exist on the circuit board is avoided. According to the circuit board burning equipment, the problem that residues existing on the circuit board influence normal operation of burning work is solved, and the technical problem that the residues existing on the circuit board influence normal operation of burning work in the burning process of the circuit board due to the fact that existing burning equipment does not clean the circuit board before burning is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and in particular to a sensor circuit board burning device and method. Background Art

[0002] After the sensor circuit board is manufactured, it is usually necessary to test the circuit board first, and then burn it after passing the test before it can be assembled. The existing circuit board testing process and burning process are set separately, and it is necessary to manually place the qualified circuit board into the burning equipment for burning, which takes more time and reduces the processing efficiency of the circuit board.

[0003] The prior art CN107239259B discloses a burning device for a nitrogen oxygen sensor circuit board. By arranging the detection process and the burning process together in the same burning device, there is no need for the operator to manually place the qualified circuit board into the burning device for burning, thereby shortening the processing time of the circuit board and improving the processing efficiency of the circuit board.

[0004] However, the above-mentioned burning device does not clean the circuit board before burning, resulting in that during the burning process of the circuit board, the residues on the circuit board will affect the normal burning work. Summary of the invention

[0005] The purpose of the present invention is to provide a sensor circuit board burning device and method, which solves the technical problem that the existing burning device does not clean the circuit board before burning, resulting in that during the burning process of the circuit board, the residues on the circuit board will affect the normal burning work.

[0006] To achieve the above-mentioned purpose, the present invention provides a burning device for a sensor circuit board, comprising a processing table, and also comprising a cleaning tank, a clamp, a driving mechanism, a placement plate, a clamping plate, a connecting spring, a suction mechanism and a suction nozzle. The cleaning tank and the clamp are arranged on the processing table in sequence from front to back. The driving mechanism is used to drive the placement plate to move. The placement plate is located on the processing table. The placement plate has a groove. The clamping plate is slidably connected to the placement plate and partially extends into the groove. The connecting spring is arranged between the placement plate and the clamping plate. The connecting spring is located in the groove. The suction mechanism is used to suck moisture and dust on the circuit board into the suction nozzle. The suction nozzle is located above the cleaning tank.

[0007] Wherein, the driving mechanism includes a hydraulic telescopic rod and a movable column, the hydraulic telescopic rod is arranged on the processing table, the movable column is connected to the output end of the hydraulic telescopic rod, and is slidably connected to the processing table and is located on the processing table.

[0008] Wherein, the processing table has a slide groove, and the movable column has a protrusion, and the protrusion is located in the slide groove and slides longitudinally in the slide groove.

[0009] Among them, the driving mechanism also includes a driving motor, a screw and a guide block. The driving motor is arranged on the movable column. The screw is connected to the output end of the driving motor, and the screw passes through the top of the movable column and is connected to the bottom of the movable column. The guide block is movably arranged outside the screw and passes through the movable column.

[0010] Wherein, the clamping plate has a protrusion, and the protrusion of the clamping plate is located in the groove and slides up and down in the groove.

[0011] Wherein, the suction mechanism includes an air pump and a storage box. The air pump is connected to the suction nozzle and is located on the side of the suction nozzle away from the cleaning pool. The storage box is connected to the air pump through a connecting pipe, and the storage box is arranged on the processing table.

[0012] The present invention also provides a method for burning a sensor circuit board, comprising the following steps:

[0013] Placing the circuit board between the placement plate and the clamping plate, and allowing the placement plate and the clamping plate to clamp and fix the circuit board;

[0014] After clamping and fixing, first move the circuit board longitudinally to move the circuit board above the cleaning tank, then move the circuit board up and down to extend the circuit board into the cleaning tank;

[0015] Cleaning the circuit board with the cleaning liquid in the cleaning tank, and after cleaning, removing the circuit board from the cleaning tank;

[0016] During the process of removing the circuit board, the moisture and dust on the circuit board are sucked away by a suction nozzle, thereby completing the cleaning and drying of the circuit board;

[0017] After the circuit board is dried, the circuit board is moved longitudinally again to be above the fixture, and then the circuit board is moved up and down to be placed in the fixture, so as to facilitate the detection and burning of the circuit board.

[0018] The present invention discloses a burning device and method for a sensor circuit board. Before the circuit board is inspected and burned, the circuit board is first placed in a cleaning tank for cleaning. After cleaning, the moisture and dust on the circuit board are sucked away by the suction nozzle, thereby cleaning and drying the circuit board, and then automatically cleaning the residue on the circuit board, avoiding the situation in which the residue on the circuit board affects the normal burning process during the burning process of the circuit board, and solving the technical problem that the existing burning device does not clean the circuit board before burning, resulting in the residue on the circuit board affecting the normal burning process during the burning process of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0020] Figure 1 It is a schematic diagram of the overall structure of the burning device for the sensor circuit board according to the first embodiment of the present invention.

[0021] Figure 2 2 is a schematic cross-sectional view of the suction nozzle of the first embodiment of the present invention.

[0022] Figure 3 1 is a schematic cross-sectional view along the screw rod of the first embodiment of the present invention.

[0023] Figure 4 It is a flowchart of a method for programming a sensor circuit board according to a second embodiment of the present invention.

[0024] In the figure: 101-processing table, 102-cleaning tank, 103-clamp, 104-placing plate, 105-clamping plate, 106-connecting spring, 107-suction nozzle, 108-first protective pad, 109-second protective pad, 110-hydraulic telescopic rod, 111-movable column, 112-driving motor, 113-screw, 114-guide block, 115-air pump, 116-storage box, 117-groove, 118-slide, 119-bump, 120-protrusion, 121-connecting pipe, 122-drain pipe, 123-valve. DETAILED DESCRIPTION

[0025] Embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but should not be construed as limiting the present invention.

[0026] First embodiment:

[0027] See also Figures 1 to 3 ,in, Figure 1 is a schematic diagram of the overall structure of the sensor circuit board burning device of the first embodiment of the present invention, Figure 2 is a schematic cross-sectional view along the suction nozzle 107 of the first embodiment of the present invention, Figure 3 It is a cross-sectional schematic diagram along the screw 113 of the first embodiment of the present invention. The present invention provides a burning device for a sensor circuit board, including a processing table 101, a cleaning tank 102, a clamp 103, a driving mechanism, a placement plate 104, a clamping plate 105, a connecting spring 106, a suction mechanism, a suction nozzle 107, a first protective pad 108 and a second protective pad 109. The driving mechanism includes a hydraulic telescopic rod 110, a movable column 111, a driving motor 112, a screw 113 and a guide block 114. The suction mechanism includes an air pump 115 and a storage box 116.

[0028] In this embodiment, before the circuit board is inspected and burned, the circuit board is first placed in the cleaning tank 102 for cleaning, and after cleaning, the moisture and dust on the circuit board are sucked away by the suction nozzle 107, so that the circuit board can be cleaned and dried, and then the residue on the circuit board can be automatically cleaned, avoiding the situation that the residue on the circuit board will affect the normal burning process during the burning process of the circuit board, and solving the technical problem that the existing burning equipment does not clean the circuit board before burning, resulting in the residue on the circuit board affecting the normal burning process during the burning process of the circuit board.

[0029] The cleaning pool 102 and the fixture 103 are sequentially arranged on the processing table 101 from front to back, the driving mechanism is used to drive the placement plate 104 to move, the placement plate 104 is located on the processing table 101, the placement plate 104 has a groove 117, the clamping plate 105 is slidably connected to the placement plate 104, and partially extends into the groove 117, the connecting spring 106 is arranged between the placement plate 104 and the clamping plate 105, the connecting spring 106 is located in the groove 117, the suction mechanism is used to suck moisture and dust on the circuit board into the suction nozzle 107, the suction nozzle 107 is located above the cleaning pool 102, the cleaning pool 102 and the fixture 103 are in The parts are all hollow structures. The placement plate 104 is L-shaped. The connecting spring 106 is arranged on the top of the groove 117 of the placement plate 104. The clamping plate 105 is connected to the bottom of the connecting spring 106. The clamping plate 105 is held and moved in a direction away from the bottom plate of the placement plate 104, thereby causing the connecting spring 106 to be compressed. When the clamping plate 105 is released, the compression force on the connecting spring 106 disappears. Since the connecting spring 106 has a self-recovery effect, the connecting spring 106 will drive the clamping plate 105 to move in the direction of returning to its original position until the circuit board is clamped and fixed between the placement plate 104 and the clamping plate 105.

[0030] Secondly, the hydraulic telescopic rod 110 is arranged on the processing table 101, the movable column 111 is connected to the output end of the hydraulic telescopic rod 110, and is slidably connected to the processing table 101, and is located on the processing table 101, the processing table 101 has a slide groove 118, the movable column 111 has a protrusion 119, the protrusion 119 is located in the slide groove 118, and slides longitudinally in the slide groove 118, the output end of the hydraulic telescopic rod 110 is connected to the movable column 111, and drives the protrusion 119 of the movable column 111 to slide longitudinally in the slide groove 118 of the processing table 101.

[0031] Again, the driving motor 112 is arranged on the movable column 111, the screw 113 is connected to the output end of the driving motor 112, and the screw 113 passes through the top of the movable column 111 and is connected to the bottom of the movable column 111, the guide block 114 is movably arranged outside the screw 113 and passes through the movable column 111, the guide block 114 has an internal thread, and the screw 113 has an external thread. The internal thread of the guide block 114 cooperates with the external thread of the screw 113, so that the guide block 114 can move outside the screw 113 along the thread trajectory of the external thread of the screw 113, thereby driving the guide block 114 to move up and down in the movable column 111.

[0032] At the same time, the clamping plate 105 has a protrusion 120, and the protrusion 120 of the clamping plate 105 is located in the groove 117 and slides up and down in the groove 117, so that the moving direction of the clamping plate 105 can be limited, so that the clamping plate 105 can only move up and down.

[0033] In addition, the air pump 115 is connected to the suction nozzle 107 and is located on a side of the suction nozzle 107 away from the cleaning pool 102. The storage box 116 is connected to the air pump 115 via a connecting pipe 121. The storage box 116 is arranged on the processing table 101. The storage box 116, the connecting pipe 121, the air pump 115 and the suction nozzle 107 are connected. When the air pump 115 is started, the suction force generated at the output end of the air pump 115 can suck moisture and dust on the circuit board into the suction nozzle 107, and transmit it to the storage box 116 through the air pump 115 and the connecting pipe 121 for unified collection and processing.

[0034] In addition, the first protective pad 108 is arranged on a side of the placement plate 104 close to the clamping plate 105, and the second protective pad 109 is arranged on a side of the clamping plate 105 close to the placement plate 104. The first protective pad 108 and the second protective pad 109 are both made of flexible soft materials. The first protective pad 108 and the second protective pad 109 can protect the circuit board to avoid damage to the circuit board during the clamping process.

[0035] Finally, a drain pipe 122 is provided outside the cleaning pool 102, and the drain pipe 122 is connected to the cleaning pool 102. The drain pipe 122 has a valve 123, and the valve 123 is used to control the opening or closing of the channel of the drain pipe 122. When the valve 123 is opened, the channel of the drain pipe 122 is opened, so that the cleaning liquid in the cleaning pool 102 can be discharged from the drain pipe 122.

[0036] When using a sensor circuit board burning device of the present embodiment, the clamping plate 105 is held and moved in a direction away from the bottom plate of the placement plate 104, thereby causing the connecting spring 106 to be compressed. When the connecting spring 106 is compressed to the limit position, the circuit board is placed on the placement plate 104. Thereafter, the clamping plate 105 is released to allow the compression force on the connecting spring 106 to disappear. Since the connecting spring 106 has a self-recovery effect, the clamping plate 105 is driven to move in a direction to restore to its original position until the circuit board is clamped and fixed between the placement plate 104 and the clamping plate 105, thereby achieving clamping and fixing of the circuit board. At this time, the first protective pad 108 and the second protective pad 109 can protect the circuit board to avoid damage to the circuit board during the clamping process.

[0037] After the circuit board is clamped and fixed, the hydraulic telescopic rod 110 is started, so that the power output from the output end of the hydraulic telescopic rod 110 drives the protrusion 119 of the movable column 111 to slide longitudinally in the slide groove 118 of the processing table 101, thereby driving the placement plate 104 and the clamping plate 105 to move longitudinally above the processing table 101, and then driving the circuit board clamped and fixed between the placement plate 104 and the clamping plate 105 to move longitudinally above the processing table 101. When the circuit board moves to the top of the cleaning tank 102, the drive motor 112 is started, so that the power output from the output end of the drive motor 112 drives the screw 113 to rotate along its own axis in the movable column 111, thereby driving the guide block 114 to move up and down in the movable column 111, and then driving the circuit board clamped and fixed between the placement plate 104 and the clamping plate 105 to move up and down above the processing table 101, and extending the circuit board into the cleaning tank 102.

[0038] When the circuit board is extended into the cleaning tank 102, the cleaning liquid in the cleaning tank 102 can clean the circuit board. After the cleaning is completed, the guide block 114 is moved upward, thereby driving the circuit board clamped and fixed between the placement plate 104 and the clamping plate 105 to move upward, and the circuit board is moved out of the cleaning tank 102. In the process of the circuit board being moved out of the cleaning tank 102, the air pump 115 is started, so that the suction force generated by the output end of the air pump 115 sucks the moisture and dust on the front and back sides of the circuit board into the suction nozzle 107, and transmits it to the storage box 116 through the air pump 115 and the connecting pipe 121 for unified storage, thereby completing the cleaning and drying process of the circuit board.

[0039] After the circuit board is dried, the movable column 111 is moved longitudinally again, thereby driving the circuit board to move longitudinally, and then the circuit board can be moved above the clamp 103. Thereafter, the guide block 114 is moved up and down, thereby driving the circuit board to move up and down, and then the circuit board can be placed in the clamp 103 to facilitate subsequent inspection and burning operations on the circuit board.

[0040] Second embodiment:

[0041] Based on the first embodiment, please refer to Figure 4 , Figure 4 1 is a flowchart of a method for programming a sensor circuit board according to a second embodiment of the present invention. The present invention further provides a method for programming a sensor circuit board, comprising the following steps:

[0042] S101 , placing a circuit board between a placement plate 104 and a clamping plate 105 , and allowing the placement plate 104 and the clamping plate 105 to clamp and fix the circuit board.

[0043] Specifically, the clamping plate 105 is held by hand and moved in a direction away from the bottom plate of the placement plate 104, thereby causing the connecting spring 106 to be compressed. When the connecting spring 106 is compressed to the limit position, the circuit board is placed on the placement plate 104. Thereafter, the clamping plate 105 is released to allow the compression force on the connecting spring 106 to disappear. Since the connecting spring 106 has a self-recovery effect, the clamping plate 105 is driven to move in a direction to restore to its original position until the circuit board is clamped and fixed between the placement plate 104 and the clamping plate 105, thereby achieving clamping and fixing of the circuit board. At this time, the first protective pad 108 and the second protective pad 109 can protect the circuit board to avoid damage to the circuit board during the clamping process.

[0044] S102 , after clamping and fixing, first move the circuit board longitudinally to move the circuit board above the cleaning tank 102 , then move the circuit board up and down to extend the circuit board into the cleaning tank 102 .

[0045] Specifically, after the circuit board is clamped and fixed, the hydraulic telescopic rod 110 is started, so that the power output from the output end of the hydraulic telescopic rod 110 drives the protrusion 119 of the movable column 111 to slide longitudinally in the slide groove 118 of the processing table 101, thereby driving the placement plate 104 and the clamping plate 105 to move longitudinally above the processing table 101, and then driving the circuit board clamped and fixed between the placement plate 104 and the clamping plate 105 to move longitudinally above the processing table 101. When the circuit board moves to the top of the cleaning tank 102, the drive motor 112 is started, so that the power output from the output end of the drive motor 112 drives the screw 113 to rotate along its own axis in the movable column 111, thereby driving the guide block 114 to move up and down in the movable column 111, and then driving the circuit board clamped and fixed between the placement plate 104 and the clamping plate 105 to move up and down above the processing table 101, and extending the circuit board into the cleaning tank 102.

[0046] S103 , cleaning the circuit board with the cleaning liquid in the cleaning tank 102 , and after cleaning, removing the circuit board from the cleaning tank 102 .

[0047] Specifically, when the circuit board is extended into the cleaning tank 102, the cleaning liquid in the cleaning tank 102 can clean the circuit board. After the cleaning is completed, the guide block 114 is moved upward, thereby driving the circuit board clamped and fixed between the placement plate 104 and the clamping plate 105 to move upward, and the circuit board is moved out of the cleaning tank 102.

[0048] S104, when the circuit board is removed, the moisture and dust on the circuit board are sucked away by the suction nozzle 107, so as to complete the cleaning and drying of the circuit board.

[0049] Specifically, during the process of removing the circuit board from the cleaning tank 102, the air pump 115 is started so that the suction force generated by the output end of the air pump 115 sucks the moisture and dust on the front and back sides of the circuit board into the suction nozzle 107, and transmits them to the storage box 116 through the air pump 115 and the connecting pipe 121 for unified storage, thereby completing the cleaning and drying process of the circuit board.

[0050] S105, after the circuit board is dried, the circuit board is moved longitudinally again, the circuit board is moved above the fixture 103, and then the circuit board is moved up and down, and the circuit board is placed in the fixture 103, so as to facilitate the detection and burning of the circuit board.

[0051] Specifically, after the circuit board is dried, the movable column 111 is moved longitudinally again, thereby driving the circuit board to move longitudinally, and then the circuit board can be moved above the clamp 103. Thereafter, the guide block 114 is moved up and down, thereby driving the circuit board to move up and down, and then the circuit board can be placed in the clamp 103 to facilitate subsequent inspection and burning operations on the circuit board.

[0052] What is disclosed above is only one or more preferred embodiments of the present application, and cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiments and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. A burning device for a sensor circuit board, comprising a processing table, characterized in that: It also includes a cleaning tank, a clamp, a driving mechanism, a placement plate, a clamping plate, a connecting spring, a suction mechanism and a suction nozzle. The cleaning tank and the clamp are arranged on the processing table from front to back in sequence. The driving mechanism is used to drive the placement plate to move. The placement plate is located on the processing table. The placement plate has a groove. The clamping plate is slidably connected to the placement plate and partially extends into the groove. The connecting spring is arranged between the placement plate and the clamping plate. The connecting spring is located in the groove. The suction mechanism is used to suck moisture and dust on the circuit board into the suction nozzle. The suction nozzle is located above the cleaning tank.

2. The burning device for the sensor circuit board according to claim 1, characterized in that: The driving mechanism comprises a hydraulic telescopic rod and a movable column, wherein the hydraulic telescopic rod is arranged on the processing table, and the movable column is connected to the output end of the hydraulic telescopic rod, is slidably connected to the processing table, and is located on the processing table.

3. The burning device for the sensor circuit board as claimed in claim 2, characterized in that: The processing table has a slide groove, and the movable column has a protrusion. The protrusion is located in the slide groove and slides longitudinally in the slide groove.

4. The burning device for the sensor circuit board as claimed in claim 3, characterized in that: The driving mechanism also includes a driving motor, a screw and a guide block. The driving motor is arranged on the movable column. The screw is connected to the output end of the driving motor, and the screw passes through the top of the movable column and is connected to the bottom of the movable column. The guide block is movably arranged outside the screw and passes through the movable column.

5. The burning device for the sensor circuit board as claimed in claim 4, characterized in that: The clamping plate has a protrusion, and the protrusion of the clamping plate is located in the groove and slides up and down in the groove.

6. The burning device for the sensor circuit board according to claim 1, characterized in that: The suction mechanism includes an air pump and a storage box. The air pump is connected to the suction nozzle and is located on a side of the suction nozzle away from the cleaning tank. The storage box is connected to the air pump through a connecting pipe and is arranged on the processing table.

7. A method for burning a sensor circuit board, applied to the burning device of the sensor circuit board according to any one of claims 1 to 6, characterized in that: The following steps are involved: Placing the circuit board between the placement plate and the clamping plate, and allowing the placement plate and the clamping plate to clamp and fix the circuit board; After clamping and fixing, first move the circuit board longitudinally to move the circuit board above the cleaning tank, then move the circuit board up and down to extend the circuit board into the cleaning tank; Cleaning the circuit board with the cleaning liquid in the cleaning tank, and after cleaning, removing the circuit board from the cleaning tank; During the process of removing the circuit board, the moisture and dust on the circuit board are sucked away by a suction nozzle, thereby completing the cleaning and drying of the circuit board; After the circuit board is dried, the circuit board is moved longitudinally again to be above the fixture, and then the circuit board is moved up and down to be placed in the fixture, so as to facilitate the detection and burning of the circuit board.

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