Coordinate correction method, system and device and computer readable storage medium

By constructing the offset calculation model and correction of the plane right -angle coordinates, the coordinate conversion deviation problem caused by inconsistent coordinate systems between different amount of detection machines is solved, and the accuracy of interactive use between machines is improved.

CN119334239APending Publication Date: 2025-01-21SIEN (QINGDAO) INTEGRATED CIRCUITS CO LTD
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Patent Information

Application Number
CN202310891131.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-07-19
Publication Date
2025-01-21

AI Technical Summary

Technical Problem

The coordinate systems between different detection machines are inconsistent, resulting in large deviations in coordinate conversion, affecting the interactive use between machines.

Method used

Construct the offset calculation model to correct the plane right -angle coordinates by calculating the offset to reduce the deviation after the coordinate conversion. Specific steps include the spherical coordinate system model of the scan scanning route and the plane right -angle coordinate system model, build a offset calculation model, and calculate the offset through this model for correction.

Benefits of technology

Through the correction coordinates, the deviation after the coordinate conversion is significantly reduced, and the accuracy of interactive use between machines is improved.

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Abstract

The invention provides a coordinate correction method, system and device and a computer readable storage medium, and the coordinate correction method comprises the steps: constructing an offset calculation model, calculating an offset according to the offset calculation model, and correcting a plane rectangular coordinate through the offset to obtain a corrected coordinate, thereby reducing the deviation after coordinate conversion.
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Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a coordinate correction method, system, device and computer-readable storage medium. Background Art

[0002] In current inspection machines, in order to accurately mark the location of defects, the corresponding coordinate system is usually used to represent them. However, the coordinate systems of different inspection machines are not the same, which has a great impact on the interactive use between machines.

[0003] Figure 1 Schematic diagram of the scanning route of the plane rectangular coordinate system. Figure 2 This is a schematic diagram of the scanning route of the spherical coordinate system. Figure 1 When scanning in a rectangular coordinate system, the light source scans from left to right and then from right to left. Figure 2 When scanning in a spherical coordinate system, the light source moves from the outside to the inside of the spiral trajectory toward the center of the circle. The scanning route of the plane rectangular coordinate system is completely different from the scanning route of the spherical coordinate system. When the machine using the two scanning routes performs coordinate conversion, the coordinate deviation is large.

[0004] Therefore, it is necessary to provide a new coordinate correction method, system, device and computer-readable storage medium to solve the above problems existing in the prior art. Summary of the invention

[0005] The object of the present invention is to provide a coordinate correction method, system, device and computer-readable storage medium to reduce the deviation after coordinate conversion.

[0006] To achieve the above object, the coordinate correction method of the present invention comprises:

[0007] Construct an offset calculation model;

[0008] Calculating the offset according to the offset calculation model;

[0009] The plane rectangular coordinates are corrected by the offset to obtain corrected coordinates.

[0010] The beneficial effect of the coordinate correction method is: building an offset calculation model, calculating the offset according to the offset calculation model, correcting the plane rectangular coordinates by the offset to obtain the corrected coordinates, thereby reducing the deviation after the coordinate conversion.

[0011] Optionally, the constructing the offset calculation model includes:

[0012] Obtaining a spherical coordinate system model of the spiral scanning route;

[0013] Acquire a plane rectangular coordinate system model constructed by the offset, the plane rectangular coordinate and the included angle, wherein the included angle is an angle formed by a line connecting the plane rectangular coordinate and the origin of the plane rectangular coordinate system and an X-coordinate axis of the plane rectangular coordinate system;

[0014] An offset calculation model is constructed based on the spherical coordinate system model and the plane rectangular coordinate system model. Optionally, the plane rectangular coordinate system model is expressed as Among them, x represents the abscissa of the plane rectangular coordinate before correction, y represents the ordinate of the plane rectangular coordinate before correction, S represents the offset of the coordinate (x, y), and θ represents the angle between the line connecting the coordinate (x, y) and the origin of the plane rectangular coordinate system and the X-axis of the plane rectangular coordinate system.

[0015] Optionally, the spherical coordinate system model is expressed as Among them, r represents the distance from the coordinate (x, y) to the origin of the plane rectangular coordinate system, v represents the linear velocity of the circular motion at the corresponding coordinate (x, y) during spiral scanning, w represents the angular velocity of the circular motion at the corresponding coordinate (x, y) during spiral scanning, and DA represents the deviation angle during spiral scanning.

[0016] Optionally, the coordinate correction method further includes:

[0017] Dividing the wafer into a plurality of partitions, wherein the partition located at the center of the wafer is circular, the remaining partitions are annular, and the centers of the plurality of partitions are the same as the center of the wafer;

[0018] The offset of any plane rectangular coordinate in the partition is obtained as the offset of all the plane rectangular coordinates in the corresponding partition.

[0019] Optionally, obtaining the offset of any plane rectangular coordinate in the partition as the offset of all the plane rectangular coordinates in the corresponding partition includes:

[0020] The offset of any plane rectangular coordinate located at the outermost edge of the partition is obtained as the offset of all the plane rectangular coordinates in the corresponding partition.

[0021] Optionally, the correcting the plane rectangular coordinates by using the offset to obtain corrected coordinates includes:

[0022] The plane rectangular coordinates are added to the offset to obtain the corrected coordinates.

[0023] The present invention also provides a coordinate correction system, including an offset calculation model construction unit, an offset calculation unit and a correction unit, wherein the offset calculation model construction unit is used to construct an offset calculation model, the offset calculation unit is used to calculate the offset according to the offset calculation model, and the correction unit is used to correct the plane rectangular coordinates through the offset to obtain corrected coordinates.

[0024] The beneficial effect of the coordinate correction system is that the offset calculation model construction unit constructs an offset calculation model, the offset calculation unit calculates the offset according to the offset calculation model, and the correction unit corrects the plane rectangular coordinates by the offset to obtain the corrected coordinates, thereby reducing the deviation after the coordinate conversion.

[0025] The present invention also provides a coordinate correction device, comprising:

[0026] processor;

[0027] a memory for storing processor-executable instructions;

[0028] Wherein, when the processor is configured to execute instructions in the memory, the coordinate correction method is implemented.

[0029] The present invention also provides a computer-readable storage medium, comprising computer instructions, and when the computer instructions are executed by a processor, the coordinate correction method is implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the scanning route of the plane rectangular coordinate system;

[0031] Figure 2 Schematic diagram of the scanning route of the spherical coordinate system;

[0032] Figure 3 A flowchart of a coordinate correction method in some embodiments of the present invention;

[0033] Figure 4 A schematic diagram of wafer partitioning in some embodiments of the present invention;

[0034] Figure 5 A structural block diagram of a coordinate correction system in some embodiments of the present invention;

[0035] Figure 6 Schematic diagram of defects scanned by a spherical coordinate system model of a spiral scanning route;

[0036] Figure 7 For the existing technology Figure 6 Schematic diagram of the defect scanned after the spherical coordinate system model is converted to a plane rectangular coordinate system;

[0037] Figure 8 In some embodiments of the present invention Figure 6 Schematic diagram of the defect scanned after the spherical coordinate system model is converted to a plane rectangular coordinate system model. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0039] In view of the problems existing in the prior art, an embodiment of the present invention provides a coordinate correction method. Figure 3 , the coordinate correction method comprises the following steps:

[0040] S1: build an offset calculation model;

[0041] S2: calculating the offset according to the offset calculation model;

[0042] S3: Correcting the plane rectangular coordinates by the offset to obtain corrected coordinates. Specifically, adding the plane rectangular coordinates to the offset to obtain corrected coordinates.

[0043] In some embodiments, constructing the offset calculation model includes:

[0044] Obtaining a spherical coordinate system model of the spiral scanning route;

[0045] Acquire a plane rectangular coordinate system model constructed by the offset, the plane rectangular coordinate and the included angle, wherein the included angle is an angle formed by a line connecting the plane rectangular coordinate and the origin of the plane rectangular coordinate system and an X-coordinate axis of the plane rectangular coordinate system;

[0046] An offset calculation model is constructed according to the spherical coordinate system model and the plane rectangular coordinate system model.

[0047] In some specific embodiments, the plane rectangular coordinate system model is expressed as:

[0048]

[0049] The spherical coordinate system model is expressed as:

[0050]

[0051] The offset calculation model constructed according to the plane rectangular coordinate system model and the spherical coordinate system model is expressed as:

[0052]

[0053] Among them, the coordinate (x, y) is any coordinate on the wafer before correction, x represents the horizontal coordinate, y represents the vertical coordinate, θ represents the angle between the line connecting the coordinate (x, y) and the origin of the plane rectangular coordinate system and the X-axis of the plane rectangular coordinate system, r represents the distance from the coordinate (x, y) to the origin of the plane rectangular coordinate system, that is, the radius of the coordinate (x, y), v represents the linear velocity of the circular motion at the coordinate (x, y) during spiral scanning, w represents the angular velocity of the circular motion at the coordinate (x, y) during spiral scanning, DA represents the deflection angle during spiral scanning, and S represents the offset of the coordinate (x, y). Among them, the coordinates (x, y) before correction are calculated and output by the machine itself. However, when the machine itself calculates the coordinates (x, y), the influence of the offset is not considered, and the output result has a large deviation. Therefore, the output coordinates (x, y) are the coordinates before correction; v is the linear velocity of the circular motion of the spiral scan when the coordinates (x, y) are calculated, that is, the linear velocity of the circular motion at the corresponding coordinates (x, y) during the spiral scan, and w is the angular velocity of the circular motion during the spiral scan, that is, the angular velocity of the circular motion at the corresponding coordinates (x, y) during the spiral scan.

[0054] After determining the coordinates (x, y), the radius r from the coordinates (x, y) to the origin of the plane rectangular coordinate system can be determined by the Pythagorean theorem, and the angle θ between the line connecting the coordinates (x, y) and the origin of the plane rectangular coordinate system and the X-axis of the plane rectangular coordinate system can be determined. After determining the coordinates (x, y), the linear velocity v, angular velocity w and the deviation angle DA are fixed. By bringing the coordinates (x, y), the angle θ, the radius r, the linear velocity v, the angular velocity w and the deviation angle DA into the offset calculation model, the offset S can be calculated. By adding the offset S to the coordinates (x, y), the corrected coordinates (x+S, y+S) can be obtained.

[0055] Specifically, taking the coordinate (1, 1) as an example, the distance between the coordinate (1, 1) and the coordinate (0, 0) can be calculated by the Pythagorean theorem: That is, the radius r is The angle θ is 45°. If the calculated offset is 0.5, the corrected coordinates are (1.5, 1.5).

[0056] In some embodiments, the formula for the offset can be expressed as a represents the centripetal acceleration. The formula for calculating the centripetal acceleration is: F represents the centripetal force, m represents the mass, and the formula for calculating the centripetal force is F=mrw 2 , r represents the radius of the circle, w represents the angular velocity of the circular motion, so the formula for the offset can be converted to It can be seen that when △t and w are fixed, the offset S is proportional to the radius r. The closer to the edge of the wafer, the greater the coordinate deviation of the defect.

[0057] For the convenience of calculation, the wafer is divided into several partitions, wherein the partition located at the center of the wafer is circular, the remaining partitions are annular, and the centers of several of the partitions are the same as the center of the wafer, the radius of the partition located at the center is 1 / 2 of the radius of the wafer, and the remaining partitions divide the remaining 1 / 2 radius of the wafer into equal parts, and obtain the offset of any plane rectangular coordinate in the partition as the offset of all the plane rectangular coordinates in the corresponding partition. Preferably, obtain the offset of any plane rectangular coordinate located at the outermost edge of the partition as the offset of all the plane rectangular coordinates in the corresponding partition.

[0058] Figure 4 FIG. 1 is a schematic diagram of wafer partitioning in some embodiments of the present invention. Figure 4 , a wafer with a radius of R is divided into four partitions, the four partitions are the first partition 1, the second partition 2, the third partition 3 and the fourth partition 4, the first partition 1 is circular, the second partition 2, the third partition 3 and the fourth partition 4 are all ring-shaped, and the radius of the first partition 1 is The distance from the outer edge of the second partition 2 to the center of the wafer is The distance from the outer edge of the third partition 3 to the center of the wafer is The distance from the outer edge of the fourth partition 4 to the center of the wafer is R. The number of partitions is not specifically limited here, and can be as follows: Figure 4 The four partitions shown may also be two partitions, three partitions, five partitions, or even more partitions.

[0059] Reference Figure 4 , a plane rectangular coordinate system is established with the center of the wafer as the origin, and the offset of any plane rectangular coordinate located in the first partition 1 is calculated by the offset calculation model as the offset of all plane rectangular coordinates in the first partition 1. Preferably, the offset of the plane rectangular coordinate located on the edge of the first partition 1 is selected, for example, the coordinate coordinate

[0060] Reference Figure 4, a plane rectangular coordinate system is established with the center of the wafer as the origin, and the offset of any plane rectangular coordinate located in the second partition 2 is calculated by the offset calculation model as the offset of all plane rectangular coordinates in the second partition 2. Preferably, the offset of the plane rectangular coordinate located on the edge of the second partition 2 is selected, for example, the coordinate coordinate

[0061] Reference Figure 4 , a plane rectangular coordinate system is established with the center of the wafer as the origin, and the offset of any plane rectangular coordinate located in the third partition 3 is calculated by the offset calculation model as the offset of all plane rectangular coordinates in the third partition 3. Preferably, the offset of the plane rectangular coordinate located on the edge of the third partition 3 is selected, for example, the coordinate coordinate

[0062] Reference Figure 4 , establish a plane rectangular coordinate system with the center of the wafer as the origin, and calculate the offset of any plane rectangular coordinate located in the fourth partition 4 through the offset calculation model, as the offset of all plane rectangular coordinates in the fourth partition 4, preferably select the offset of the plane rectangular coordinate located on the edge of the fourth partition 4, such as coordinate (R, 0) and coordinate (0, R).

[0063] In some embodiments, after the wafer is partitioned, the offset calculation model is expressed as

[0064] Here, i represents the i-th partition.

[0065] Reference Figure 4 When the coordinate (x, y) is located in the first partition 1, S1 represents the scanning offset of the first partition 1; when the coordinate (x, y) is located in the second partition 2, S2 represents the scanning offset of the second partition 2; when the coordinate (x, y) is located in the third partition 3, S3 represents the scanning offset of the third partition 3; when the coordinate (x, y) is located in the fourth partition 4, S4 represents the scanning offset of the fourth partition 4.

[0066] Figure 5 FIG. 1 is a block diagram of a coordinate correction system in some embodiments of the present invention. Figure 5The coordinate correction system 100 includes an offset calculation model construction unit 101, an offset calculation unit 102 and a correction unit 103. The offset calculation model construction unit 101 is used to construct an offset calculation model, the offset calculation unit 102 is used to calculate the offset according to the offset calculation model, and the correction unit 103 is used to correct the plane rectangular coordinates by the offset to obtain the corrected coordinates. Specifically, the plane rectangular coordinates are added to the offset to obtain the corrected coordinates.

[0067] In some embodiments, the offset calculation model construction unit includes a spherical coordinate system model acquisition module, an offset model acquisition module and an offset calculation model construction sub-module, the spherical coordinate system model acquisition module is used to acquire the spherical coordinate system model of the spiral scanning route, the offset model acquisition module is used to acquire the offset model, and the offset calculation model construction sub-module is used to construct the offset calculation model based on the spherical coordinate system model and the offset model.

[0068] The present invention also provides a coordinate correction device, comprising:

[0069] processor;

[0070] a memory for storing processor-executable instructions;

[0071] Wherein, when the processor is configured to execute instructions in the memory, the coordinate correction method is implemented.

[0072] The present invention also provides a computer-readable storage medium, comprising computer instructions, and when the computer instructions are executed by a processor, the coordinate correction method is implemented.

[0073] Computer readable storage media can be, for example, but not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or components, or any combination thereof. More specific examples of computer readable storage media include: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read only memory (ROM), an erasable programmable read only memory (EPROM) or flash memory, an optical fiber, a portable compact disk read only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In this document, a computer readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, device, or device.

[0074] The program code contained on the computer-readable storage medium may be transmitted using any appropriate medium, including but not limited to wireless, wire, optical cable, or any suitable combination of the foregoing.

[0075] Computer program code for performing the operations of the present specification may be written in one or more programming languages ​​or a combination thereof, such as Java, Smalltalk, C++, C, etc. The program code may execute entirely on the user's computer, partially on the user's computer, as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on the remote computer or server.

[0076] Figure 6 Schematic diagram of defects scanned by a spherical coordinate system model for a spiral scanning route; Figure 7 For the existing technology Figure 6 Schematic diagram of the scanned defect after the spherical coordinate system model is converted to a plane rectangular coordinate system;

[0077] Figure 8 In some embodiments of the present invention Figure 6 Schematic diagram of the defect scanned after the spherical coordinate system model is converted to a plane rectangular coordinate system model.

[0078] Reference Figure 6 There are 4 partitions in total, namely the first partition 1, the second partition 2, the third partition 3 and the fourth partition 4. 600 defects were scanned in the first partition 1, 498 defects were scanned in the second partition 2, 446 defects were scanned in the third partition 3, and 372 defects were scanned in the fourth partition 4.

[0079] Reference Figure 6 and Figure 7 In the prior art, after the spherical coordinate system model is converted to the plane rectangular coordinate system, the number of defects scanned by the first partition 1 is 73, that is, the accurate coordinate number is 73, the number of defects scanned by the second partition 2 is 47, that is, the accurate coordinate number is 47, the number of defects scanned by the third partition 3 is 62, that is, the accurate coordinate number is 62, and the number of defects scanned by the fourth partition 4 is 49, that is, the accurate coordinate number is 49.

[0080] Reference Figure 6 and Figure 8After the spherical coordinate system model in the present invention is converted to a plane rectangular coordinate system, the number of defects scanned by the first partition 1 is 362, that is, the accurate coordinate number is 362, which is 48.17% higher than the prior art; the number of defects scanned by the second partition 2 is 188, that is, the accurate coordinate number is 188, which is 48.17% higher than the prior art; the number of defects scanned by the third partition 3 is 152, that is, the accurate coordinate number is 152, which is 48.17% higher than the prior art; the number of defects scanned by the fourth partition 4 is 143, that is, the accurate coordinate number is 143, which is 48.17% higher than the prior art.

[0081] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A coordinate correction method, characterized in that: include: Construct an offset calculation model; Calculating the offset according to the offset calculation model; The plane rectangular coordinates are corrected by the offset to obtain corrected coordinates.

2. The coordinate correction method according to claim 1, characterized in that: The constructing of the offset calculation model comprises: Obtaining a spherical coordinate system model of the spiral scanning route; Acquire a plane rectangular coordinate system model constructed by the offset, the plane rectangular coordinate and the included angle, wherein the included angle is an angle formed by a line connecting the plane rectangular coordinate and the origin of the plane rectangular coordinate system and an X-coordinate axis of the plane rectangular coordinate system; An offset calculation model is constructed according to the spherical coordinate system model and the plane rectangular coordinate system model.

3. The coordinate correction method according to claim 2, characterized in that: The plane rectangular coordinate system model is expressed as Among them, x represents the abscissa of the plane rectangular coordinate before correction, y represents the ordinate of the plane rectangular coordinate before correction, S represents the offset of the coordinate (x, y), and θ represents the angle between the line connecting the coordinate (x, y) and the origin of the plane rectangular coordinate system and the X-axis of the plane rectangular coordinate system.

4. The coordinate correction method according to claim 3, characterized in that: The spherical coordinate system model is expressed as Among them, r represents the distance from the coordinate (x, y) to the origin of the plane rectangular coordinate system, v represents the linear velocity of the circular motion at the corresponding coordinate (x, y) during spiral scanning, w represents the angular velocity of the circular motion at the corresponding coordinate (x, y) during spiral scanning, and DA represents the deviation angle during spiral scanning.

5. The coordinate correction method according to any one of claims 1 to 4, characterized in that: Also includes: Dividing the wafer into a plurality of partitions, wherein the partition located at the center of the wafer is circular, the remaining partitions are annular, and the centers of the plurality of partitions are the same as the center of the wafer; The offset of any plane rectangular coordinate in the partition is obtained as the offset of all the plane rectangular coordinates in the corresponding partition.

6. The coordinate correction method according to claim 5, characterized in that: Obtaining the offset of any rectangular coordinate in the partition as the offset of all rectangular coordinates in the corresponding partition, including: The offset of any plane rectangular coordinate located at the outermost edge of the partition is obtained as the offset of all the plane rectangular coordinates in the corresponding partition.

7. The coordinate correction method according to claim 1, characterized in that: Correcting the plane rectangular coordinates by the offset to obtain the corrected coordinates includes: The plane rectangular coordinates are added to the offset to obtain the corrected coordinates.

8. A coordinate correction system, characterized in that: It includes an offset calculation model construction unit, an offset calculation unit and a correction unit. The offset calculation model construction unit is used to construct an offset calculation model. The offset calculation unit is used to calculate the offset according to the offset calculation model. The correction unit is used to correct the plane rectangular coordinates by the offset to obtain the corrected coordinates.

9. A coordinate correction device, characterized in that: include: processor; a memory for storing processor-executable instructions; Wherein, when the processor is configured to execute the instructions of the memory, the coordinate correction method according to any one of claims 1 to 7 is implemented.

10. A computer-readable storage medium, characterized in that: The method comprises computer instructions, and when the computer instructions are executed by a processor, the coordinate correction method according to any one of claims 1 to 7 is implemented.