Lithographic apparatus operation control method, device, storage medium and apparatus

Abstract

The application provides a lithography equipment operation control method, device, storage medium and equipment, comprising: obtaining a lithography task sent by a user end, the lithography task comprising substrate parameters and process parameters to be operated; comparing the substrate parameters in the lithography task with preset substrate parameter thresholds, and comparing the process parameters in the lithography task with preset process parameter thresholds; if the substrate parameters satisfy the substrate parameter thresholds and the process parameters satisfy the process parameter thresholds, sending an in-equipment real-time state parameter acquisition instruction to the lithography equipment; obtaining in-equipment real-time state parameters sent by the lithography equipment; if the in-equipment real-time state parameters match the substrate parameters to be operated in the lithography task, generating a plurality of lithography equipment operation instructions according to the lithography task, and sending the lithography equipment operation instructions to the lithography equipment in a set order, so that the lithography equipment performs first-stage processing on an in-equipment substrate according to the lithography equipment operation instructions.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment, and more specifically to a method, apparatus, storage medium, and device for controlling the operation of lithography equipment. Background Technology

[0002] Laser direct-write lithography equipment is one of the key pieces of equipment in the field of micro-nano fabrication and electronic product manufacturing. It uses one or more focused laser beams to expose photoresist, enabling the fabrication of micro- and nano-structures over large areas. Laser direct-write lithography equipment does not require the use of photomasks and can directly control the laser beam to expose the photoresist, achieving rapid fabrication of micro- and nano-structures.

[0003] On the one hand, existing laser direct-write lithography equipment is inherently complex to operate. The lithography process involves multiple steps, requiring operators to locate and input the corresponding parameters in each step before proceeding. Operators must input the correct process parameters in a specific order and click the corresponding buttons for the lithography task to execute correctly. Otherwise, even slight errors in the sequence, incorrect parameter input, or clicking the wrong button can easily lead to problematic results or prevent exposure settings, potentially damaging the equipment. On the other hand, unlike the relatively stable lithography processes used in semiconductor manufacturing, research-oriented lithography processes involve different product requirements, necessitating different substrates, photoresists, and various parameters. The experimental nature of research and the interdisciplinary nature of researchers make lithography processes more prone to operational errors. Summary of the Invention

[0004] Based on this, the present invention provides a method, apparatus, storage medium and device for operating and controlling lithography equipment. By extracting data input from the user terminal and comprehensively processing the status information of the lithography equipment, specific operation data and operation steps are sent to the lithography equipment according to a preset process, reducing the direct operation of the complex interface of the lithography equipment by the operator and avoiding errors caused by non-standard operation.

[0005] In a first aspect, the present invention provides a method for controlling the operation of a photolithography device, comprising:

[0006] Obtain the lithography task sent by the user terminal, wherein the lithography task includes the substrate parameters and process parameters to be operated;

[0007] The substrate parameters in the lithography task are compared with preset substrate parameter thresholds, and the process parameters in the lithography task are compared with preset process parameter thresholds.

[0008] If the substrate parameters meet the substrate parameter threshold and the process parameters meet the process parameter threshold, a real-time status parameter acquisition instruction is sent to the photolithography equipment.

[0009] Acquire real-time status parameters within the lithography equipment sent by the equipment;

[0010] If the real-time status parameters within the device match the substrate parameters to be operated in the lithography task, several lithography device operation instructions are generated according to the lithography task, and the lithography device operation instructions are sent to the lithography device in a set order, so that the lithography device performs the first stage processing on the substrate within the device according to the lithography device operation instructions.

[0011] Furthermore,

[0012] Obtain the authentication information sent by the user terminal, and obtain the group permissions and user task permissions of the lithography equipment on the user terminal based on the authentication information;

[0013] For each level of group permission used by lithography equipment, multiple levels of user task permissions are specified, including:

[0014] When the user terminal's lithography equipment usage permission is the first permission, the lithography task sent by the user terminal and the historical lithography tasks within the upper-level group permission are obtained.

[0015] The lithography task sent by the user terminal is compared with the historical lithography tasks saved in the upper-level group permissions. If the lithography task is consistent with any historical lithography task, the lithography task is retained.

[0016] If the lithography task is inconsistent with any of the historical lithography tasks, return an insufficient permission prompt to the user.

[0017] When the user terminal's lithography equipment usage permission is the second permission, the lithography task sent by the user terminal is obtained. If the parameters of the lithography task meet the maximum threshold of the lithography task within the upper-level group permission, the lithography task is retained.

[0018] If the parameters of the lithography task do not meet the maximum threshold of the lithography task within the upper-level group's permissions, a permission insufficient prompt will be returned to the user terminal.

[0019] When the user's task permission level is the third level, the lithography task sent by the user is obtained. If the parameters of the lithography task meet the maximum threshold of the lithography task within the upper-level group permission, the lithography task is retained.

[0020] If the parameters of the lithography task do not meet the maximum threshold for lithography tasks within the upper-level group's permissions, a permission request prompt is returned to the user's terminal. Furthermore, the lithography task also includes exposure modes, which include a first exposure mode and a second exposure mode.

[0021] When the exposure mode is the second exposure mode, the lithography equipment control method further includes:

[0022] Upon receiving the first-stage processing completion instruction, an image acquisition command is sent to the photolithography equipment;

[0023] The marking coordinates of the substrate are determined based on the image information returned by the lithography equipment, and the marking coordinates and lithography process parameters are sent to the lithography equipment so that the lithography equipment can perform the second stage processing on the substrate inside the equipment according to the marking coordinates and lithography process parameters.

[0024] Furthermore, the step of determining the marker coordinates of the substrate based on the image information returned by the photolithography equipment, and sending the marker coordinates and photolithography process parameters to the photolithography equipment, so that the photolithography equipment can perform a second-stage processing on the substrate within the equipment according to the marker coordinates and photolithography process parameters, specifically involves:

[0025] By combining the image information returned by the photolithography equipment, at least one target pattern on the substrate is determined through image recognition.

[0026] If the target pattern is not located at the center point of the cursor within the field of view, send an image movement command and an image acquisition command to the lithography equipment until the target pattern is located at the center point of the cursor within the field of view in the image information returned by the lithography equipment.

[0027] When the target pattern is located at the center point of the cursor within the field of view, a target pattern coordinate acquisition command is sent to the photolithography equipment to obtain the actual coordinates of the target pattern;

[0028] By comparing the actual coordinates of the target pattern with the design coordinates, the displacement information of the first-stage photolithography image is obtained;

[0029] The second-stage processing instructions are generated based on the displacement information of the first-stage photolithography image and the photolithography process parameters, and then sent to the photolithography equipment to realize the second-stage processing of the substrate inside the equipment.

[0030] Furthermore, the substrate parameters include the quantity, size, material, thickness, and shape of the substrates to be processed;

[0031] The process parameters include the exposure pattern, selection of the front and back sides for exposure, type of photoresist, and exposure dosage.

[0032] Furthermore, the comparison between the process parameters in the lithography task and the preset process parameter thresholds is specifically as follows:

[0033] Based on the exposure pattern and exposure front and back sides in the lithography process parameters, historical data of lithography process parameters are selected and obtained. The historical data of lithography process parameters includes the historical types of photoresist and historical exposure dosages corresponding to the exposure pattern and exposure front and back sides.

[0034] If the photoresist type in the photolithography process parameters is consistent with the historical photoresist type, determine whether the exposure dose meets the exposure dose condition;

[0035] If the exposure dose meets the first exposure dose condition, a request to obtain the substrate state parameters inside the lithography equipment is sent. The first exposure dose condition is the first exposure dose threshold obtained based on the historical exposure dose and the exposure dose limit of the lithography equipment.

[0036] Furthermore, the comparison of process parameters with preset process parameter thresholds in the lithography task also includes:

[0037] If the photoresist type in the photolithography process parameters is inconsistent with the historical photoresist type, a prompt message will be sent to the user terminal.

[0038] After receiving the confirmation information returned by the user, if the type of photoresist is not within the prohibited range of the photolithography equipment, determine whether the exposure dose meets the exposure dose conditions.

[0039] If the exposure dose meets the second exposure dose condition, a request to obtain the substrate state parameters inside the lithography equipment is sent to the lithography equipment.

[0040] The second exposure dose condition is a second exposure dose threshold obtained based on the exposure dose limit of the lithography equipment.

[0041] Furthermore, the comparison of process parameters with preset process parameter thresholds in the lithography task also includes:

[0042] If the exposure dose does not meet the first exposure dose condition or the second exposure dose condition, an operation stop prompt message is sent to the user terminal.

[0043] Furthermore, the photolithography equipment operation control method also includes:

[0044] If the exposure dose exceeds the first ratio of the first exposure dose condition or the second exposure dose condition, a lithography exposure dose prompt message is sent to the user terminal;

[0045] If the exposure dose exceeds the second ratio of the first exposure dose condition or the second exposure dose condition, a lithography exposure dose alarm message is sent to the user terminal, and a task abort command is sent to the lithography equipment.

[0046] The first ratio is less than the second ratio.

[0047] Furthermore, the substrate parameters in the lithography task are compared with preset substrate parameter thresholds, specifically as follows:

[0048] If the size of the substrate exceeds the size limit of the photolithography equipment or the thickness of the substrate exceeds the thickness limit of the photolithography equipment, an operation stop prompt message is sent to the user terminal.

[0049] Furthermore, the real-time status parameters within the device include the real-time substrate size, the real-time number of substrate wafers, and the real-time pattern to be exposed.

[0050] If the real-time substrate size in the device is inconsistent with the substrate size in the lithography task, the real-time pattern to be exposed is inconsistent with the pattern to be exposed in the lithography task, or the number of real-time substrate wafers is inconsistent with the number of substrates to be processed in the lithography task, an operation stop prompt message is sent to the user terminal.

[0051] Furthermore, the photolithography equipment operation control method also includes:

[0052] After the photolithography task is completed, obtain the actual sample image information;

[0053] If the difference between the actual sample image information and the lithography image of the lithography task exceeds the acceptable threshold, an alarm message indicating that the processing sample yield is too low will be sent to the user terminal.

[0054] Secondly, the present invention also provides a photolithography equipment operation control device, comprising:

[0055] The task acquisition module is used to acquire the lithography task sent by the user terminal. The lithography task includes the substrate parameters and process parameters to be operated.

[0056] The rationality judgment module is used to compare the substrate parameters in the lithography task with preset substrate parameter thresholds and the process parameters in the lithography task with preset process parameter thresholds.

[0057] The status instruction request module is used to send a real-time status parameter acquisition instruction to the photolithography equipment if the substrate parameters meet the substrate parameter threshold and the process parameters meet the process parameter threshold.

[0058] The device status acquisition module is used to acquire real-time status parameters sent by the lithography equipment.

[0059] The substrate processing module is used to generate several lithography equipment operation instructions according to the lithography task if the real-time status parameters in the equipment match the substrate parameters to be operated in the lithography task, and send the lithography equipment operation instructions to the lithography equipment in a set order, so that the lithography equipment performs the first stage processing on the substrate in the equipment according to the lithography equipment operation instructions.

[0060] Thirdly, the present invention also provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the steps of any of the photolithography equipment operation control methods in the first aspect.

[0061] Fourthly, the present invention also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform any of the photolithography equipment operation control methods in the first aspect.

[0062] The beneficial effects of adopting the above technical solution are as follows: The lithography equipment operation control method provided in this embodiment breaks the existing method of direct operation on the lithography equipment, avoids delay errors caused by human operation errors or input errors, avoids equipment damage, and greatly improves the efficiency of equipment training and use; and adds a verification step for the lithography task, improves the data rigor of the lithography task and reduces unnecessary experimental errors, thereby increasing the success rate of the experiment. Attached Figure Description

[0063] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0064] Figure 1 This is a schematic diagram of a photolithography equipment operation control method in one embodiment of this application;

[0065] Figure 2 This is a schematic diagram of substrate identification within the slot of a photolithography device in one embodiment of this application;

[0066] Figure 3 This is a schematic diagram of the image acquisition operation of a lithography device in one embodiment of this application;

[0067] Figure 4 This is a schematic diagram illustrating the acquisition of substrate marker coordinates in one embodiment of this application;

[0068] Figure 5 This is a schematic diagram illustrating the overlay operation performed in conjunction with marker coordinates in one embodiment of this application;

[0069] Figure 6 This is a schematic diagram of the operation control device of a lithography equipment in one embodiment of this application. Detailed Implementation

[0070] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. To describe the present invention in more detail, the photolithography equipment operation control method, apparatus, storage medium, and device provided by the present invention will be specifically described below with reference to the accompanying drawings.

[0071] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms "first," "second," and similar terms used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms "an," "a," or "the" do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "comprising" or "including" mean that the preceding element or object encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. The terms "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up," "down," "left," "right," etc., are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0072] Laser direct writing lithography equipment is a precision processing equipment that uses a laser beam to directly expose the substrate. It is widely used in micro-nano manufacturing in fields such as microelectronics, micromechanics, and biomedicine. Compared with traditional optical lithography, laser direct writing lithography has the following characteristics: (1) Laser direct writing does not require the use of a mask. The laser beam is directly controlled by a computer to expose the photosensitive material, which can realize the rapid production of any complex pattern. (2) By using short-wavelength lasers (such as ultraviolet lasers) and fine focusing technology, laser direct writing lithography equipment can achieve nanometer-level resolution, which is suitable for ultra-precision processing needs. (3) Because it is digitally controlled, it is very easy to modify the design pattern, which is suitable for small-batch customized production or sample preparation in the R&D stage. (4) For small-batch production and personalized customization, laser direct writing avoids the expensive mask production cost in traditional lithography, reducing costs. (5) It can be used not only for hard materials such as silicon wafers, but also for processing various materials such as flexible substrates and organic materials.

[0073] The key components of laser direct-write lithography equipment include the front-end module (EFEM), which is used for the automatic loading and unloading of substrates. It consists of three main components: a substrate loading system, a substrate transport robot, and a substrate aligner, to realize operations such as substrate loading, unloading, and pre-process batching. Operators can choose different robots and substrate loading platforms to meet production needs.

[0074] To address this issue, the present invention provides a method for operating and controlling a lithography device. This method extracts data input from the user terminal and comprehensively processes the status information of the lithography device. It then sends specific operation data and steps to the lithography device according to a preset procedure, reducing the need for operators to directly manipulate the complex interface of the lithography device and preventing errors due to improper operation. The method is illustrated using an application to a terminal device as an example, in conjunction with the appendix. Figure 1 The diagram shows the operation and control method of the photolithography equipment.

[0075] This application provides an application scenario for a lithography equipment operation control method. This application scenario includes the terminal device provided in the embodiment. The terminal device includes, but is not limited to, smartphones and computer devices, wherein the computer device can be at least one of desktop computers, portable computers, laptop computers, mainframe computers, tablet computers, etc. The terminal device obtains the lithography task sent by the user terminal, and then sends operation instructions corresponding to each step of the lithography task to the lithography equipment. For details, please refer to the embodiment of the lithography equipment operation control method.

[0076] It should be noted that the application environment of the lithography equipment operation control method in this embodiment includes a user terminal, an intelligent process automation processor, and a lithography equipment. The user terminal is the execution terminal for users to upload or send lithography tasks. The parameters related to each step of the user's lithography task can be uploaded all at once or adjusted according to the instructions returned by the intelligent process automation processor. The intelligent process automation processor is a processor that integrates artificial intelligence (AI), machine learning, and robotic process automation (RPA) functions. It can perform rationality verification on the lithography tasks uploaded by the user and generate specific operation instructions to send the parameters and operation keys required for each step of the lithography task to the lithography equipment to execute the lithography task. Simultaneously, it can compare the equipment status information returned by the lithography equipment with the lithography task, marking and positioning the substrates to be overlaid within the lithography equipment, thereby improving the success rate of lithography task execution. The lithography equipment in this embodiment is a laser direct-write lithography equipment used to perform laser lithography operations on the substrate to be processed.

[0077] The following describes the steps involved in applying the lithography equipment operation control method to the execution of an intelligent process automation processor:

[0078] Step S101: Obtain the lithography task sent by the user terminal. The lithography task includes the substrate parameters and process parameters to be operated.

[0079] Specifically, the substrate parameters include the quantity, size, material, thickness, and shape of the substrate to be processed; the process parameters include the exposure pattern, selection of the front and back sides for exposure, type of photoresist, and exposure dose.

[0080] Step S102: Compare the substrate parameters in the lithography task with preset substrate parameter thresholds, and compare the process parameters in the lithography task with preset process parameter thresholds.

[0081] Specifically, after obtaining the lithography task sent by the user terminal, step S102 needs to determine the rationality of the lithography task, including determining the rationality of substrate parameters and process parameters. The determination of substrate parameter rationality specifically involves comparing the substrate parameters in the lithography task with preset substrate parameter thresholds, including:

[0082] If the size of the substrate exceeds the size limit of the photolithography equipment or the thickness of the substrate exceeds the thickness limit of the photolithography equipment, an operation stop prompt message is sent to the user terminal.

[0083] It should be noted that the size and thickness limits of the lithography equipment in this embodiment are set according to the specific model of the lithography equipment, and the limit ranges may differ for different models of lithography equipment. This step is designed to avoid damage to the lithography equipment or waste of the exposure substrate. When the substrate size exceeds the limit range, the substrate cannot be placed into the slot of the lithography equipment; when the substrate thickness exceeds the upper limit of the lithography equipment thickness, the substrate will collide with the exposure lens and damage the equipment; when the substrate thickness is less than the thickness of the lithography equipment, it will exceed the exposure range of the exposure lens, resulting in the inability to form an exposure pattern; when the shape of the substrate does not match the shape detected by the actual equipment (e.g., large flat edges, small flat edges, notches, circles), causing a slight change in the wafer placement orientation, it will affect the overlay accuracy.

[0084] In addition, the rationality judgment of process parameters specifically involves comparing the process parameters in the lithography task with preset process parameter thresholds, including:

[0085] Step S401: Based on the exposure pattern and exposure front and back sides in the photolithography process parameters, obtain historical data of photolithography process parameters. The historical data of photolithography process parameters includes the historical types of photoresist and historical exposure doses corresponding to the exposure pattern and exposure front and back sides.

[0086] The intelligent process automation processor in this embodiment has a storage module that forms a corresponding process parameter database. When a lithography task is received, it can be compared with the specific parameters of existing or executed lithography tasks in the database to determine whether the process parameters of the lithography task are feasible. The index of the historical parameters in the database is the exposure pattern and the exposure front and back selection. The first historical parameter with the same exposure pattern and exposure front and back selection as the current lithography task is found from the historical parameters in the database. Then, the rationality of other process parameters is judged based on the first historical parameter.

[0087] Step S402: If the type of photoresist in the photolithography process parameters is consistent with the historical type of photoresist, determine whether the exposure dose meets the exposure dose condition.

[0088] Step S403: If the exposure dose meets the first exposure dose condition, send a request to the lithography equipment to obtain the substrate state parameters. The first exposure dose condition is the first exposure dose threshold obtained based on the historical exposure dose and the exposure dose limit of the lithography equipment.

[0089] In this embodiment, for the types of photoresist recorded in the historical parameters, specific exposure dose conditions can be set according to the minimum, average, or preset ratio of the historical exposure dose. Simultaneously, while considering the historical parameters, the exposure dose limit of the lithography equipment itself also needs to be considered. In this embodiment, it can be first determined whether the exposure dose meets the exposure dose limit of the lithography equipment, and then it can be determined whether the exposure dose meets the minimum, average, or preset ratio of the historical exposure dose.

[0090] Step S404: If the type of photoresist in the photolithography process parameters is inconsistent with the historical type of photoresist, a prompt message is sent to the user terminal.

[0091] Step S405: After receiving the confirmation information returned by the user terminal, if the type of photoresist does not fall within the scope of inapplicability of the photolithography equipment, determine whether the exposure dose meets the exposure dose conditions.

[0092] Step S406: If the exposure dose meets the second exposure dose condition, send a request to the lithography equipment to obtain the substrate state parameters; wherein, the second exposure dose condition is a second exposure dose threshold obtained according to the exposure dose limit of the lithography equipment.

[0093] In this embodiment, if the photoresist type does not appear in the historical photoresist types in the database, the user first needs to confirm whether to use that photoresist type. This can be done by sending a prompt message to the user's device. Once the user confirms the use of that photoresist type, it is necessary to further determine whether the photoresist type is not applicable to this model of lithography equipment. If it is, the lithography equipment needs to send an alarm message to the user and terminate the execution of the lithography task.

[0094] Furthermore, when the type of photoresist used is not present in the historical data, the second threshold for exposure dose can only be limited based on the exposure limit of the photolithography equipment.

[0095] It should be noted that when the type of photoresist used is not present in historical data, to better determine the optimal exposure dose range for that photoresist type, reference documents related to the photoresist or exposure limits of the lithography equipment can be collected to generate an exposure dose test task, thereby determining a second threshold for that photoresist type. Specifically:

[0096] Obtain the instruction manual or related documents for the photoresist, and from these documents, obtain the recommended exposure dose range for the photoresist. Then, set multiple test exposure doses based on this recommended exposure dose range. For example, according to the instruction manual for photoresist A, the recommended exposure range for this photoresist is 600-900 mJ. Multiple test exposure doses can be set for this range: 600 mJ, 650 mJ, 700 mJ, 750 mJ, 800 mJ, 850 mJ, and 900 mJ. It should be noted that when the number of instruction manuals and related documents for the photoresist exceeds one, the recommended exposure dose range is the union of the exposure dose ranges mentioned in all the instruction manuals or related documents. For example, the instruction manual for photoresist A mentions an exposure dose range of 600-900 mJ, while related literature on photoresist A mentions an exposure dose range of 500-800 mJ. In this case, the recommended exposure range for photoresist A is 500-900 mJ. Multiple test exposure doses can be set for this purpose: 500 mJ, 550 mJ, 600 mJ, 650 mJ, 700 mJ, 750 mJ, 800 mJ, 850 mJ, and 900 mJ.

[0097] In addition, multiple test exposure doses can be set directly based on the exposure limit of the lithography equipment. For example, if the exposure limit of the lithography equipment is 1000mJ, test exposure doses of 50mJ, 100mJ, 150mJ, ..., 850mJ, 900mJ and 1000mJ can be set. Multiple dose test tasks can be issued based on the above multiple test exposure doses to determine the optimal exposure dose range of the photoresist. The optimal exposure dose range is then sent to the lithography equipment database and the user terminal.

[0098] Step S407: If the exposure dose does not meet the first exposure dose condition or the second exposure dose condition, send an operation stop prompt message to the user terminal.

[0099] Specifically, when the user receives an operation abort prompt, they can either re-execute the lithography task by adjusting the exposure dose or delete the lithography task.

[0100] Furthermore, to determine whether the exposure dose meets the exposure dose limit of the lithography equipment, a first exposure dose alarm value and a second exposure dose alarm value can be set based on the exposure dose limit to provide corresponding prompts or alarm operations. For example, the exposure dose limit of AZ4620 photoresist on a certain model of laser direct-write lithography equipment is... The upper limit of the exposure dose is The lower limit of the exposure dose is When the exposure dose is or An alarm message is issued to remind that the exposure dose is at the edge of the exposure dose limit. The first exposure dose alarm value can be set as a first percentage exceeding the exposure dose limit. For example, setting the first percentage to 20% means the first exposure dose alarm value will be either 20% above the upper limit or 20% above the lower limit, indicating an exposure dose exceeding the limit. or below At this point, a notification message is sent to the user to alert them that the exposure dose has exceeded the limit. The second exposure dose alarm value can be set as a second percentage of the exposure dose limit. For example, setting the second percentage to 50% means the second exposure dose alarm value will be either 50% above the upper limit or 50% above the lower limit, indicating an exposure dose exceeding the limit. or below At this point, an alarm message is sent to the user, and the exposure operation of the lithography equipment is stopped, or a confirmation menu pops up, and exposure can only continue after confirmation from the user or administrator.

[0101] Furthermore, considering the variations in the lithography environment or machine wear and tear, the first threshold for exposure dose of various photoresists stored internally by the intelligent process automation processor is not static. The intelligent process automation processor statistically analyzes feedback information from historical lithography tasks regarding photoresist exposure dose exceeding the first threshold at preset intervals. This includes whether the user adjusted the photoresist exposure dose to within the first threshold range after a historical lithography task's exposure dose exceeded it, or whether the user did not adjust the photoresist exposure dose after a historical lithography task's exposure dose exceeded the first threshold. When the proportion of historical lithography tasks in which the user did not adjust the photoresist exposure dose exceeds a third threshold, the first threshold for exposure dose of the photoresist is adjusted based on the photoresist exposure dose in the historical lithography tasks.

[0102] For example, if the proportion of users not adjusting the photoresist exposure dose in historical lithography tasks exceeds 50%, and statistics show that all instances of users not adjusting the photoresist exposure dose exceed the upper limit of the first exposure dose threshold, then the upper and lower limits of the first exposure dose threshold for the photoresist are increased. If the proportion of users not adjusting the photoresist exposure dose in historical lithography tasks exceeds 50%, and statistics show that all instances of users not adjusting the photoresist exposure dose exceed the lower limit of the first exposure dose threshold, then the upper and lower limits of the first exposure dose threshold for the photoresist are decreased. If the proportion of users not adjusting the photoresist exposure dose in historical lithography tasks exceeds 50%, and statistics show that instances of users not adjusting the photoresist exposure dose include instances where the photoresist exposure dose exceeds either the upper or lower limit of the first exposure dose threshold, then an exposure dose test task for the photoresist is generated, and the upper and lower limits of the first exposure dose threshold are redefined.

[0103] It should be noted that during the above-mentioned process parameter rationality judgment stage, the intelligent process automation processor acquires the pattern to be exposed for the photolithography task and determines key dimensions such as the length, width, minimum linewidth, maximum linewidth, minimum circle diameter, and maximum circle diameter of the pattern to be exposed. Based on these key dimensions of the pattern to be exposed, adjustments can be made to the subsequent photoresist type and exposure dosage data.

[0104] Step S103: If the substrate parameters meet the substrate parameter threshold and the process parameters meet the process parameter threshold, send a real-time status parameter acquisition instruction to the photolithography equipment.

[0105] Step S104: Obtain the real-time status parameters within the lithography equipment sent by the equipment.

[0106] Specifically, the real-time internal state parameters of the device include the real-time substrate size, the real-time number of substrate wafers, and the real-time pattern to be exposed.

[0107] It should be noted that, in this embodiment, the real-time status parameters within the device also include the slot number of the substrate already placed within the device, and the specific code of the substrate in each slot. The substrate requiring operation within the lithography device is determined based on the consistency between the specific substrate code and the lithography task code. The lithography operation on the substrate is then performed based on the slot code and the status of whether a substrate is placed in the slot. For example, substrate A is located based on the lithography task code. Substrate A is in slot 1. The lithography device needs to recognize that a substrate is placed in slot 1 before it can perform the lithography task operation, as shown in the attached diagram. Figure 2 When the green light is on in slot 1; if the lithography equipment cannot recognize that a substrate is placed in slot 1, it cannot perform the lithography task. At this time, it is necessary to send an alarm message to the user terminal to check whether the lithography equipment has misidentified the slot or the substrate has not been placed in the correct slot.

[0108] Step S105: If the real-time status parameters within the device match the substrate parameters to be operated in the lithography task, generate several lithography device operation instructions according to the lithography task, and send the lithography device operation instructions to the lithography device in a set order, so that the lithography device performs the first stage processing on the substrate within the device according to the lithography device operation instructions.

[0109] If the real-time substrate size in the device is inconsistent with the substrate size in the lithography task, the real-time pattern to be exposed is inconsistent with the pattern to be exposed in the lithography task, or the number of real-time substrate wafers is inconsistent with the number of substrates to be processed in the lithography task, an alarm message is sent to the user terminal.

[0110] After verifying the rationality of the lithography task parameters, before sending the lithography equipment operation instructions, it is necessary to check whether the real-time status parameters within the lithography equipment are consistent with the parameters of the lithography task. The lithography task can only be executed if the two are completely consistent; otherwise, corresponding alarm information needs to be issued. For example, if the substrate size in the lithography task is 4 inches, while the real-time substrate size in the equipment is 8 inches; if the number of substrates to be processed in the lithography task is 10, while the number of substrates to be processed in the real-time task is 25; if the exposure pattern in the lithography task includes four patterns (A, B, C, and D), while the real-time pattern to be exposed only shows three patterns (A, B, and D); or if the size of the exposure pattern in the lithography task is 100mm*100mm, while the real-time pattern to be exposed is only 80mm*80mm, etc., these are all cases where the real-time status parameters within the equipment do not match the substrate parameters to be operated on in the lithography task. In this case, an alarm information needs to be sent to the user terminal to check the lithography equipment.

[0111] It should be noted that in this embodiment, the user can input a complete lithography task, while the intelligent process automation processor needs to break down the complete lithography task, divide it into several lithography equipment operation instructions based on the lithography equipment's operating system, and send them to the lithography equipment in a set order, so as to realize the input of corresponding parameters or the clicking of specific operation buttons to the lithography equipment's operating system in a set order.

[0112] In addition, since the lithography equipment in this embodiment is publicly available, users include enterprise users, on-campus users, and off-campus users. Among them, users are mostly managed in the form of project groups. However, considering that different users within a project group have different permissions in terms of equipment use or material allocation, a user permission verification process is also included before receiving the lithography task sent by the user terminal.

[0113] Step S201: Obtain the authentication information sent by the user terminal, and obtain the group permissions and user task permissions used by the lithography equipment based on the authentication information. The group permissions used by the lithography equipment at each level include multiple levels of user task permissions.

[0114] For each level of group permission used by lithography equipment, multiple levels of user task permissions are specified, including:

[0115] Step S202: If the user's task permission level is Level 1, obtain the lithography task sent by the user and the historical lithography tasks within the upper-level group permissions. Iterate and compare the lithography task sent by the user with the historical lithography tasks saved within the upper-level group permissions. If the lithography task is consistent with any historical lithography task, retain the lithography task; if the lithography task is inconsistent with none of the historical lithography tasks, return a permission insufficient prompt to the user.

[0116] Step S203: If the user's task permission level is the second level, obtain the lithography task sent by the user terminal. If the parameters of the lithography task meet the maximum threshold of the lithography task within the upper-level group permission, retain the lithography task. If the parameters of the lithography task do not meet the maximum threshold of the lithography task within the upper-level group permission, return a permission insufficient prompt to the user terminal.

[0117] Step S204: If the user's task permission level is Level 3, retrieve the lithography task sent by the user. If the parameters of the lithography task meet the maximum threshold for lithography tasks within the upper-level group's permissions, retain the lithography task; if the parameters of the lithography task do not meet the maximum threshold for lithography tasks within the upper-level group's permissions, return a permission request prompt to the user. (Lithography equipment)

[0118] The parameters of the aforementioned lithography task include, but are not limited to, the usage time of the lithography equipment, the materials required for the lithography task, and the substrate material, size, exposure time, and the type and capacity of the photoresist used.

[0119] To better understand the above settings for group permissions and user task permissions, a specific example is provided:

[0120] The lithography equipment itself has group permissions set according to user nature. These group permissions are often displayed in the form of a research group or project group, which can be specifically displayed as a laboratory research group, an enterprise project group, etc. Each group permission has different limits on the usage time of the lithography equipment, the substrate material used, the exposure time, etc. Under the lower-level management of each project group or research group, there are multiple users, each with different user task permissions. In this embodiment, user task permissions are divided into three categories: lithography task manager, lithography task designer, and lithography task executor, as detailed below:

[0121] Taking an enterprise project team as an example, the enterprise project team includes enterprise operators, enterprise technicians, and enterprise managers. Each user's task permission can observe the same content of the lithography equipment, but each user's task permission leads to different operations performed on the lithography equipment. Among them, the enterprise operator's user task permission is at the first level, which means that the enterprise operator can only expose existing processes in the database, cannot modify or create new processes, and can report and view problems encountered in the operation. Therefore, it is necessary to compare the lithography tasks sent by the enterprise operator with the historical lithography tasks that the enterprise project team has already executed one by one. Only when the sent lithography task is found to be consistent with the historical lithography task can the lithography task be released. The user task permissions for enterprise technical personnel are at the second level, meaning they have greater flexibility and operational space. They can execute lithography tasks within the maximum threshold range corresponding to the enterprise project team. For example, if the lithography task operation time threshold for the enterprise project team is 50 hours, the lithography task published by the enterprise technical personnel can be published if the operation time does not exceed 50 hours. The user task permissions for enterprise managers are at the third level, meaning they have higher operational permissions. For example, if the operation time of a published lithography task exceeds the operation time threshold for the enterprise project team, they can send a permission request to the equipment administrator to increase the operation time threshold for the enterprise project team.

[0122] Similarly, the above-mentioned user task permission settings can be equivalent to those of a laboratory research group. For example, a laboratory research group includes a supervisor, senior students, and junior students. Junior students can only issue lithography tasks for existing processes in the database. Senior students can issue lithography tasks if they meet the maximum threshold for lithography tasks in the laboratory research group. Supervisors can send permission requests to the equipment administrator to modify the maximum threshold if the parameters of the lithography task exceed the maximum threshold for lithography tasks in the laboratory research group.

[0123] Furthermore, since the lithography task includes a single lithography task or an overlay lithography task, the lithography task in this embodiment is also set to include an exposure mode, which includes a first exposure mode and a second exposure mode, wherein the first exposure mode is a single lithography mode and the second exposure mode is an overlay lithography mode.

[0124] When the exposure task is the first exposure mode, the intelligent process automation processor only needs to execute the above step S105 to complete the lithography task.

[0125] When the exposure task is the second exposure mode, considering that the pattern needs to be positioned and aligned for multiple photolithography steps during the overlay process, the photolithography equipment control method further includes the following steps:

[0126] In step S301 of the photolithography equipment, after receiving the first stage processing completion instruction, an image acquisition instruction is sent to the photolithography equipment.

[0127] Step S302: Determine the marker coordinates of the substrate based on the image information returned by the lithography equipment, and send the marker coordinates and lithography process parameters to the lithography equipment so that the lithography equipment can perform the second stage processing on the substrate in the equipment according to the marker coordinates and lithography process parameters.

[0128] Specifically, the image acquisition commands sent to the lithography equipment can be found in the appendix. Figure 3 As shown, the system includes operation commands such as "turn on the light source," "turn on the micromirror," and "turn on the camera." It locates the substrate markers within the image field of view and obtains the coordinates of these markers, as illustrated in the attached diagram. Figure 4 As shown, the photolithography equipment can accurately position the substrate and perform overlay steps by combining the marker coordinates and specific photolithography process parameters. See Appendix. Figure 5 .

[0129] Before the first stage of processing, the intelligent process automation processor obtains the initial exposure position based on the critical dimensions of the pattern to be exposed in the lithography task, combined with the center position coordinates of the exposure platform returned by the lithography equipment. The specific expression is as follows:

[0130] , ,

[0131] in,( , ) represents the initial exposure position coordinates, , () represents the coordinates of the center position of the exposure platform. The width of the image to be exposed. The length of the image to be exposed.

[0132] Furthermore, considering that the pattern of the first processing stage and the pattern of the second processing stage need to be matched with high precision during the overlay process, and that the first layer of the exposed pattern may be deformed or shifted due to various reasons after the first processing stage, resulting in a difference between the ideal coordinates and the actual coordinates of the pattern to be exposed in the first processing stage, in order to correct the above coordinate deviation, the marked coordinates of the confirmed substrate are used to correct the deviation. Specifically, step S302 above includes the following steps:

[0133] Step S501: Combining the image information returned by the photolithography equipment, at least one target pattern on the substrate is determined by image recognition. The target pattern is generally set to a special shape, such as a circle, triangle, rhombus, etc.

[0134] Step S502: If the target pattern is not located at the center point of the cursor within the field of view, send an image movement command and an image acquisition command to the lithography device until the target pattern is located at the center point of the cursor within the field of view in the image information returned by the lithography device.

[0135] Step S503: When the target pattern is located at the center point of the cursor within the field of view, a target pattern coordinate acquisition command is sent to the photolithography equipment to obtain the actual coordinates of the target pattern.

[0136] It should be noted that the field of view cursor of the lithography equipment is similar to the function of a mouse. For any point within the field of view of the lithography equipment, it needs to be placed at the center of the field of view cursor in order to obtain specific coordinate information.

[0137] Step S504: Compare the actual coordinates of the target pattern with the design coordinates to obtain the displacement information of the first-stage photolithography image.

[0138] It should be noted that the design coordinates of the target pattern are recorded in the photolithography task, and these are the ideal coordinates of the target pattern under the condition that no deformation or displacement occurs in the first stage of processing.

[0139] Step S505: Generate a second-stage processing instruction based on the displacement information of the first-stage photolithography image and the photolithography process parameters, and send the second-stage processing instruction to the photolithography equipment to realize the second-stage processing of the substrate inside the equipment.

[0140] Specifically, by combining the displacement information of the first-stage lithography image with the lithography process parameters, the overlay pattern processed in the second stage is processed accordingly. For example, when the first-stage lithography image is displaced, the corresponding displacement information needs to be added when generating the second-stage processing instructions so that the lithography image processed in the second stage can be accurately nested with the lithography image processed in the first stage.

[0141] Regarding step S501 above, where at least one target pattern on the substrate is determined by image recognition, it should be noted that, due to various reasons, there may be cases where the image information returned by the lithography equipment does not contain a target pattern. The corresponding solution steps are as follows:

[0142] Step S601: If the target pattern is not present in the image information returned by the lithography device, a field of view movement command is generated and sent to the lithography device until the target pattern appears in the image information returned by the lithography device.

[0143] The field-of-view movement command includes, but is not limited to, moving the field of view horizontally or vertically within a range of 1mm*1mm based on the image center coordinates returned by the current lithography device.

[0144] Step S602: If the number of times the field of view is moved exceeds the adjustment number threshold, a sample thickness check instruction is sent to the user terminal to determine whether the actual sample thickness does not conform to the set sample thickness of the first processing stage.

[0145] Step S603: If the user terminal reports that the actual sample thickness matches the set sample thickness in the first processing stage, a target pattern recognition algorithm traversal instruction is sent to determine whether the executed target pattern recognition algorithm is inconsistent with the target pattern.

[0146] Step S604: If the executed target pattern recognition algorithm is consistent with the target pattern, obtain the RGB value of the image returned by the lithography device. If the RGB value of the image includes values ​​other than 0 or 255, return to step S301 to obtain the image information again.

[0147] Step S605: If the RGB values ​​of the image only include 0 or 255, send a lithography device parameter reading instruction to determine whether the first layer of paper is selected when the lithography device acquires image information.

[0148] Furthermore, since the photolithography equipment in this embodiment is located within a semiconductor laboratory, which also includes a label positioning system, a sample handling system, a coating equipment, and a developing equipment, the various devices or systems within the laboratory can interact with each other through an intelligent process automation processor. Specifically:

[0149] In conjunction with the aforementioned tag positioning system, the photolithography equipment control method further includes:

[0150] The information of the lithography equipment operator sent by the tag positioning system is obtained, wherein the tag positioning system is a UWB tag positioning system;

[0151] If the operator information of the lithography equipment does not match the user identity information of the user who issued the lithography task, a task stop command is sent to the lithography equipment, and an alarm message is sent to the equipment management terminal.

[0152] By combining with a tag positioning system, it can be ensured that the actual operator of the lithography equipment is the same as the user who issued the lithography task, thereby preventing the theft of user identity.

[0153] In conjunction with the sample handling system, the photolithography equipment control method further includes:

[0154] Acquire sample handling information and equipment movement information sent by the sample handling system;

[0155] If the sample transport information is inconsistent with the specific substrate code of the lithography task, a task stop command is sent to the lithography equipment, and an alarm message is sent to the equipment management terminal.

[0156] If the motion information of the transport equipment includes information on rapid deceleration of the transport equipment, information on rapid acceleration of the transport equipment, or information on severe vibration of the transport equipment, a sample integrity check instruction is generated and sent to the photolithography equipment.

[0157] The specific parameter threshold settings for information on rapid deceleration, rapid acceleration, and severe vibration of the handling equipment are configured according to the requirements of the experimenters or equipment managers regarding the integrity of the substrate edge. The sample integrity check instructions include sample edge integrity checks and overall sample integrity checks.

[0158] In conjunction with the aforementioned coating equipment, the photolithography equipment control method further includes:

[0159] Acquire coating parameters such as the amount of adhesive dripped and the rotation speed of the coating equipment when the substrate is processed in the coating equipment;

[0160] If the coating parameters are lower than the set coating parameters, including but not limited to the amount of adhesive droplets being less than the set amount of adhesive droplets or the rotation speed being higher than the set rotation speed, the photoresist exposure dose should be reduced.

[0161] If the coating parameters are higher than the set coating parameters, including but not limited to the amount of adhesive added being greater than the set amount of adhesive added or the rotation speed being lower than the set rotation speed, the photoresist exposure dose will be increased.

[0162] In conjunction with the developing equipment, the photolithography equipment control method further includes:

[0163] Obtain the actual minimum linewidth of the substrate after the photolithography task is performed;

[0164] Adjust the development time or baking temperature of the development task according to the actual minimum linewidth and the designed minimum linewidth of the substrate.

[0165] Furthermore, after the lithography task is completed, the intelligent process automation processor acquires the actual sample image information and compares it with the lithography image of the lithography task. If the difference between the actual sample image information and the lithography image of the lithography task exceeds the acceptable threshold, it sends an alarm message to the user terminal indicating that the processing sample yield is too low, reminding the user to perform yield analysis on the lithography task or re-enter the lithography image of the lithography task.

[0166] It should be understood that, although attached Figure 1 The steps in the flowchart are shown sequentially according to the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order requirement for the execution of these steps, and they can be executed in other orders. Furthermore, [the following is a list of steps]. Figure 1At least some of the steps in the process may include multiple sub-steps or sub-stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least some of the sub-steps or stages of other steps.

[0167] The above-described embodiments of the present invention describe in detail a method for operating and controlling a lithography apparatus. Since this method can be implemented using various types of equipment, the present invention also discloses an operating and controlling device for a lithography apparatus. Figure 6 The following are specific embodiments for detailed explanation.

[0168] The task acquisition module 701 is used to acquire the lithography task sent by the user terminal, wherein the lithography task includes the substrate parameters and process parameters to be operated;

[0169] The rationality judgment module 702 is used to compare the substrate parameters in the lithography task with preset substrate parameter thresholds and the process parameters in the lithography task with preset process parameter thresholds.

[0170] The status instruction request module 703 is used to send a real-time status parameter acquisition instruction to the photolithography equipment if the substrate parameters meet the substrate parameter threshold and the process parameters meet the process parameter threshold.

[0171] The device status acquisition module 704 is used to acquire real-time status parameters within the lithography device sent by the lithography device.

[0172] The substrate processing module 705 is used to generate several lithography equipment operation instructions according to the lithography task if the real-time status parameters in the equipment match the substrate parameters to be operated in the lithography task, and send the lithography equipment operation instructions to the lithography equipment in a set order so that the lithography equipment performs the first stage processing on the substrate in the equipment according to the lithography equipment operation instructions.

[0173] The operation and control device for the lithography equipment can be found in the above description of the method's limitations, and will not be repeated here. Each module in the aforementioned device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of the terminal device in hardware form or independent of it, or stored in the memory of the terminal device in software form, so that the processor can call and execute the operations corresponding to each module.

[0174] In one embodiment, the present invention also provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the steps of the above-described photolithography equipment operation control method.

[0175] The computer-readable storage medium may be an electronic storage device such as flash memory, EEPROM (Electrically Erasable Programmable Read-Only Memory), EPROM (Erasable Programmable Read-Only Memory), hard disk, or ROM. Optionally, the computer-readable storage medium includes a non-transitory computer-readable storage medium. The computer-readable storage medium has storage space for program code that performs any of the method steps described above. This program code can be read from or written to one or more computer program products, and the program code may be compressed in an appropriate form.

[0176] In one embodiment, the present invention provides a computer device including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform the above-described photolithography equipment operation control method.

[0177] The computer device includes a memory, a processor, and one or more computer programs, wherein the one or more computer programs can be stored in the memory and configured to be executed by one or more processors, and the one or more application programs are configured to perform the above-described lithography equipment operation control method.

[0178] A processor may include one or more processing cores. The processor connects to various parts of the computer device using various interfaces and lines, and performs various functions and processes data by running or executing instructions, programs, code sets, or instruction sets stored in memory, and by calling data stored in memory. Optionally, the processor may be implemented using at least one hardware form of Digital Signal Processing (DSP), Field-Programmable Gate Array (FPGA), or Programmable Logic Array (PLA). The processor may integrate one or a combination of several of the following: Central Processing Unit (CPU), Graphics Processing Unit (GPU), and modem. The CPU primarily handles the operating system, user interface, and applications; the GPU is responsible for rendering and drawing the displayed content; and the modem handles wireless communication. It is understood that the modem may also be implemented separately as a communication chip, without being integrated into the processor.

[0179] The memory may include random access memory (RAM) or read-only memory (ROM). The memory can be used to store instructions, programs, code, code sets, or instruction sets. The memory may include a program storage area and a data storage area. The program storage area may store instructions for implementing an operating system, instructions for implementing at least one function (such as touch functionality, sound playback functionality, image playback functionality, etc.), and instructions for implementing the various method embodiments described above. The data storage area may also store data created by the terminal device during use.

[0180] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for controlling the operation of a photolithography equipment, characterized in that, include: Obtain the lithography task sent by the user terminal, wherein the lithography task includes the substrate parameters and process parameters to be operated; The substrate parameters in the lithography task are compared with preset substrate parameter thresholds, and the process parameters in the lithography task are compared with preset process parameter thresholds. If the substrate parameters meet the substrate parameter threshold and the process parameters meet the process parameter threshold, a real-time status parameter acquisition instruction is sent to the photolithography equipment. Acquire real-time status parameters within the lithography equipment sent by the equipment; If the real-time status parameters within the device match the substrate parameters to be operated in the lithography task, several lithography device operation instructions are generated according to the lithography task, and the lithography device operation instructions are sent to the lithography device in a set order, so that the lithography device performs the first stage processing on the substrate within the device according to the lithography device operation instructions.

2. The photolithography equipment operation control method as described in claim 1, characterized in that, Before obtaining the lithography task sent by the user, the process also includes: Obtain the authentication information sent by the user terminal, and obtain the group permissions and user task permissions of the lithography equipment on the user terminal based on the authentication information; For each level of group permission used by lithography equipment, multiple levels of user task permissions are specified, including: When the user terminal's lithography equipment usage permission is the first permission, the lithography task sent by the user terminal and the historical lithography tasks within the upper-level group permission are obtained. The lithography task sent by the user terminal is compared with the historical lithography tasks saved in the upper-level group permissions. If the lithography task is consistent with any historical lithography task, the lithography task is retained. If the lithography task is inconsistent with any of the historical lithography tasks, return an insufficient permission prompt to the user. When the user terminal's lithography equipment usage permission is the second permission, the lithography task sent by the user terminal is obtained. If the parameters of the lithography task meet the maximum threshold of the lithography task within the upper-level group permission, the lithography task is retained. If the parameters of the lithography task do not meet the maximum threshold of the lithography task within the upper-level group's permissions, a permission insufficient prompt will be returned to the user terminal. When the user's task permission level is the third level, the lithography task sent by the user is obtained. If the parameters of the lithography task meet the maximum threshold of the lithography task within the upper-level group permission, the lithography task is retained. If the parameters of the lithography task do not meet the maximum threshold of the lithography task within the upper-level group's permissions, a permission request prompt will be returned to the user's terminal.

3. The photolithography equipment operation control method as described in claim 2, characterized in that, The lithography task also includes an exposure mode, which includes a first exposure mode and a second exposure mode; When the exposure mode is the second exposure mode, the lithography equipment operation control method further includes: Upon receiving the first-stage processing completion instruction, an image acquisition command is sent to the photolithography equipment; The marking coordinates of the substrate are determined based on the image information returned by the lithography equipment, and the marking coordinates and lithography process parameters are sent to the lithography equipment so that the lithography equipment can perform the second stage processing on the substrate inside the equipment according to the marking coordinates and lithography process parameters.

4. The photolithography equipment operation control method as described in claim 3, characterized in that, The step involves determining the marker coordinates of the substrate based on the image information returned by the photolithography equipment, and sending the marker coordinates and photolithography process parameters to the photolithography equipment. This allows the photolithography equipment to perform a second-stage processing of the substrate within the equipment based on the marker coordinates and photolithography process parameters. Specifically: By combining the image information returned by the photolithography equipment, at least one target pattern on the substrate is determined through image recognition. If the target pattern is not located at the center point of the cursor within the field of view, send an image movement command and an image acquisition command to the lithography equipment until the target pattern is located at the center point of the cursor within the field of view in the image information returned by the lithography equipment. When the target pattern is located at the center point of the cursor within the field of view, a target pattern coordinate acquisition command is sent to the photolithography equipment to obtain the actual coordinates of the target pattern; By comparing the actual coordinates of the target pattern with the design coordinates, the displacement information of the first-stage photolithography image is obtained; The second-stage processing instructions are generated based on the displacement information of the first-stage photolithography image and the photolithography process parameters, and then sent to the photolithography equipment to realize the second-stage processing of the substrate inside the equipment.

5. The photolithography equipment operation control method as described in claim 4, characterized in that, The substrate parameters include the quantity, size, material, thickness, and shape of the substrates to be processed; The process parameters include the exposure pattern, selection of the front and back sides for exposure, type of photoresist, and exposure dosage.

6. The photolithography equipment operation control method as described in claim 4, characterized in that, The comparison between the process parameters in the photolithography task and the preset process parameter thresholds is specifically as follows: Based on the exposure pattern and exposure front and back sides in the lithography process parameters, historical data of lithography process parameters are selected and obtained. The historical data of lithography process parameters includes the historical types of photoresist and historical exposure dosages corresponding to the exposure pattern and exposure front and back sides. If the type of photoresist in the photolithography process parameters is consistent with the historical type of photoresist, determine whether the exposure dose meets the exposure dose condition. If the exposure dose meets the first exposure dose condition, a request to obtain the substrate status parameters inside the lithography equipment is sent. The first exposure dose condition is the first exposure dose threshold obtained based on the historical exposure dose and the exposure dose limit of the lithography equipment.

7. The photolithography equipment operation control method as described in claim 6, characterized in that, The comparison between the process parameters and preset process parameter thresholds in the photolithography task also includes: If the photoresist type in the photolithography process parameters is inconsistent with the historical photoresist type, a prompt message will be sent to the user terminal. After receiving the confirmation information returned by the user, if the type of photoresist is not within the scope of the photolithography equipment, determine whether the exposure dose meets the exposure dose conditions. If the exposure dose meets the second exposure dose condition, a request to obtain the substrate state parameters inside the lithography equipment is sent to the lithography equipment. The second exposure dose condition is a second exposure dose threshold obtained based on the exposure dose limit of the lithography equipment.

8. The photolithography equipment operation control method as described in claim 7, characterized in that, The comparison between the process parameters and preset process parameter thresholds in the photolithography task also includes: If the exposure dose does not meet the first exposure dose condition or the second exposure dose condition, an operation stop prompt message is sent to the user terminal.

9. The photolithography equipment operation control method as described in claim 8, characterized in that, Also includes: If the exposure dose exceeds the first ratio of the first exposure dose condition or the second exposure dose condition, a lithography exposure dose prompt message is sent to the user terminal; If the exposure dose exceeds the second ratio of the first exposure dose condition or the second exposure dose condition, a lithography exposure dose alarm message is sent to the user terminal, and a task abort command is sent to the lithography equipment. The first ratio is less than the second ratio.

10. The photolithography equipment operation control method as described in claim 9, characterized in that, The substrate parameters in the photolithography task are compared with preset substrate parameter thresholds, specifically as follows: If the size of the substrate exceeds the size limit of the photolithography equipment or the thickness of the substrate exceeds the thickness limit of the photolithography equipment, an operation stop prompt message is sent to the user terminal.

11. The photolithography equipment operation control method as described in claim 10, characterized in that, The real-time status parameters within the device include the real-time substrate size, the real-time number of substrate wafers, and the real-time pattern to be exposed. If the real-time substrate size in the device is inconsistent with the substrate size in the lithography task, the real-time pattern to be exposed is inconsistent with the pattern to be exposed in the lithography task, or the number of real-time substrate wafers is inconsistent with the number of substrates to be processed in the lithography task, an operation stop prompt message is sent to the user terminal.

12. The photolithography equipment operation control method as described in claim 11, characterized in that, Also includes: After the photolithography task is completed, obtain the actual sample image information; If the difference between the actual sample image information and the lithography image of the lithography task exceeds the acceptable threshold, an alarm message indicating that the processing sample yield is too low will be sent to the user terminal.

13. A photolithography equipment operation control device, characterized in that, include: The task acquisition module is used to acquire the lithography task sent by the user terminal. The lithography task includes the substrate parameters and process parameters to be operated. The rationality judgment module is used to compare the substrate parameters in the lithography task with preset substrate parameter thresholds and the process parameters in the lithography task with preset process parameter thresholds. The status instruction request module is used to send a real-time status parameter acquisition instruction to the photolithography equipment if the substrate parameters meet the substrate parameter threshold and the process parameters meet the process parameter threshold. The device status acquisition module is used to acquire real-time status parameters sent by the lithography equipment. The substrate processing module is used to generate several lithography equipment operation instructions according to the lithography task if the real-time status parameters in the equipment match the substrate parameters to be operated in the lithography task, and send the lithography equipment operation instructions to the lithography equipment in a set order, so that the lithography equipment performs the first stage processing on the substrate in the equipment according to the lithography equipment operation instructions.

14. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the steps of any one of the photolithography equipment operation control methods according to claims 1-12.

15. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it performs any one of the lithography equipment operation control methods according to claims 1-12.

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