Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes: a body including a dielectric layer and first and second internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween, the first and second internal electrodes being disposed alternately in the first direction; the main body comprises a first surface and a second surface which are opposite to each other in a first direction, a third surface and a fourth surface which are connected to the first surface and the second surface and are opposite to each other in a second direction, and a fifth surface and a sixth surface which are connected to the first surface to the fourth surface and are opposite to each other in a third direction; a side edge portion disposed on the fifth surface and the sixth surface; and an external electrode disposed on the third surface and the fourth surface, in which the side edge portion includes polydopamine, and in which an average size of the plurality of dielectric grains included in the side edge portion is different from an average size of the plurality of dielectric grains included in the dielectric layer.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0142878 filed on October 24, 2023, in the Korean Intellectual Property Office, and Korean Patent Application No. 10-2023-0095536 filed on July 21, 2023, in the Korean Intellectual Property Office, the disclosures of which are incorporated herein in their entirety by reference. Technical Field

[0002] The present disclosure relates to a multi-layer electronic assembly. Background Art

[0003] A multilayer ceramic capacitor (MLCC, a type of multilayer electronic component) may be a chip capacitor mounted on a printed circuit board of various electronic products, including image display devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smart phones, and mobile phones, and used for charging or discharging therefrom. Because the multilayer ceramic capacitor may have a small size and high capacitance and may be easily mounted, such a multilayer ceramic capacitor may be used as a component of various electronic devices.

[0004] Recently, in order to ensure the capacitance per unit volume of the multilayer ceramic capacitor, the multilayer ceramic capacitor has been miniaturized, and therefore, the thickness of the side edge portion of the multilayer ceramic capacitor for protecting the capacitance forming portion (the capacitance forming portion is used to form the capacitance) has been reduced. However, as the thickness of the side edge portion is reduced, the mechanical strength of the multilayer ceramic capacitor may be weakened, which may cause cracks or brittle fractures in the multilayer ceramic capacitor. The cracks may become a path for external moisture to enter the multilayer ceramic capacitor, resulting in a decrease in the moisture resistance reliability of the multilayer ceramic capacitor.

[0005] Therefore, in order to prevent the mechanical strength and moisture resistance reliability of the multilayer ceramic capacitor from being reduced, research may be required to improve the strength of the side edge portion. Summary of the invention

[0006] Embodiments of the present disclosure provide a multilayer electronic component having improved mechanical strength and moisture resistance reliability.

[0007] According to an embodiment of the present disclosure, a multilayer electronic component includes: a main body, including a dielectric layer and a first internal electrode and a second internal electrode, the first internal electrode and the second internal electrode are alternately arranged in a first direction, and the dielectric layer is interposed between the first internal electrode and the second internal electrode, and the main body includes a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other and connected to the first surface and the second surface in the second direction, and a fifth surface and a sixth surface opposite to each other in the third direction and connected to the first surface to the fourth surface; a side edge portion, arranged on the fifth surface and the sixth surface; and an external electrode, arranged on the third surface and the fourth surface, wherein the side edge portion includes polydopamine, and wherein the average size of a plurality of dielectric grains included in the side edge portion is different from the average size of a plurality of dielectric grains included in the dielectric layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0009] Figure 1 is a perspective view showing a multilayer electronic component according to an embodiment of the present disclosure;

[0010] Figure 2 It is shown Figure 1 An exploded perspective view of the main body and side edge portions of FIG.

[0011] Figure 3 is shown along Figure 1 A cross-sectional view of a section taken along line II' in FIG.

[0012] Figure 4 is shown along Figure 1 A cross-sectional view of a section taken along line II-II' in FIG.

[0013] Figure 5A is a diagram showing the chemical structure of dopamine hydrochloride;

[0014] Figure 5B is a diagram showing the chemical structure of polydopamine;

[0015] Figure 5C is a diagram showing the chemical structure of nitrogen-doped carbonized polydopamine;

[0016] Figure 6 It is shown Figure 4 An enlarged view of area K1 in FIG.

[0017] Figure 7 It is shown Figure 4 An enlarged view of region K2 in FIG.

[0018] Figure 8 is a diagram showing the results of analyzing a side edge portion of a multilayer electronic component according to an embodiment of the present disclosure using X-ray photoelectron spectroscopy (XPS);

[0019] Fig. 9 is a diagram showing the result of analyzing the side edge portion of the multilayer electronic component according to the embodiment of the present disclosure using Raman analysis;

[0020] Figures 10 to 12 is a perspective view showing a method for manufacturing a multilayer electronic component according to an embodiment of the present disclosure;

[0021] Fig.13 is a table showing tape test results of comparative examples and embodiments of the present disclosure;

[0022] Fig.14 is a graph showing stress-strain curves of comparative examples and examples of the present disclosure;

[0023] Fig.15A is a diagram showing the results of reliability evaluation of a comparative example; and

[0024] Fig. 15B is a diagram showing the results of reliability evaluation of the embodiment of the present disclosure. DETAILED DESCRIPTION

[0025] Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings.

[0026] These embodiments are described in sufficient detail to enable those skilled in the art to practice the present invention. It should be understood that the various embodiments of the present invention are different, but not necessarily mutually exclusive. For example, without departing from the spirit and scope of the present disclosure, the structure, shape and size described as an example in one embodiment of the present disclosure may be implemented in other embodiments. In addition, without departing from the spirit and scope of the present disclosure, the position or arrangement of the elements in the embodiment may be modified. Therefore, the following detailed description should not be regarded as having a limiting meaning, and the scope of the present invention is limited only by the full scope of the attached claims and the equivalent schemes given by the claims, which are properly interpreted.

[0027] In the accompanying drawings, the same elements will be represented by the same reference numerals. In addition, redundant descriptions and detailed descriptions of known functions and elements that may unnecessarily obscure the main purpose of the present disclosure will be omitted. In the accompanying drawings, some elements may be exaggerated, omitted or briefly shown, and the size of the elements does not necessarily reflect the actual size of these elements. The terms "comprise", "comprising", "constructed to", etc. in the specification are used to indicate the presence of features, numbers, steps, operations, elements, parts or combinations thereof, and do not exclude the possibility of combining or adding one or more features, numbers, steps, operations, elements, parts or combinations thereof.

[0028] In the drawings, a first direction may be defined as a thickness direction, a second direction may be defined as a length direction, and a third direction may be defined as a width direction.

[0029] Multilayer electronic components

[0030] Figure 1 is a perspective view showing a multilayer electronic component according to an embodiment.

[0031] Figure 2 It is shown Figure 1 Exploded three-dimensional view of the main body and side edge parts.

[0032] Figure 3 is shown along Figure 1 A cross-sectional view of a section taken along line II' in FIG.

[0033] Figure 4 is shown along Figure 1 A cross-sectional view of a section taken along line II-II'.

[0034] Figure 5A is a diagram illustrating the chemical structure of dopamine hydrochloride.

[0035] Figure 5B is a diagram illustrating the chemical structure of polydopamine.

[0036] Figure 5C is a diagram illustrating the chemical structure of nitrogen-doped carbonized polydopamine.

[0037] Figure 6 It is shown Figure 4 Magnified view of area K1 in FIG.

[0038] Figure 7 It is shown Figure 4 Magnified view of area K2 in FIG.

[0039] Figure 8 : is a diagram showing the results of analyzing the side edge portion of the multilayer electronic component according to the embodiment using X-ray photoelectron spectroscopy (XPS).

[0040] Fig. 9 : is a diagram showing the result of analyzing the side edge portion of the multilayer electronic component according to the embodiment using Raman analysis.

[0041] In the following, reference will be made to Figures 1 to 9 The multilayer electronic component according to the embodiment is described in more detail. A multilayer ceramic capacitor is described as an example of the multilayer electronic component, but the embodiment is not limited thereto, and the multilayer electronic component may also be various multilayer electronic components such as an inductor, a piezoelectric element, a varistor, or a thermistor.

[0042] The multilayer electronic component 100 may include a body 110 , side margin parts 141 and 142 , and external electrodes 131 and 132 .

[0043] The shape of the body 110 may not be limited to any particular shape, but Figure 2 As shown in , the body 110 may have a hexahedral shape or a shape similar to a hexahedral shape. Due to shrinkage of the ceramic powder included in the body 110 during the firing process and / or corner polishing, the body 110 may not have a precise hexahedral shape formed by straight lines, but may have a substantially hexahedral shape.

[0044] The body 110 may have a first surface 1 and a second surface 2 opposite to each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2 and the third surface 3 and the fourth surface 4 and opposite to each other in a third direction.

[0045] The body 110 may include first and second internal electrodes 121 and 122, and dielectric layers 111 interposed between the first and second internal electrodes 121 and 122, the first and second internal electrodes 121 and 122 being alternately disposed with the dielectric layers 111 in a first direction. The plurality of dielectric layers 111 forming the body 110 may be in a fired state, and adjacent dielectric layers 111 may be integrated with each other so that it is difficult to distinguish a boundary therebetween without using a scanning electron microscope (SEM).

[0046] For example, the dielectric layer 111 may include a perovskite compound represented by ABO3 as a main component. The perovskite compound represented by ABO3 may be, for example, BaTiO3, (Ba 1-x Ca x )TiO3(0 <x<1)、Ba(Ti 1-y Ca y )O3(0 <y<1)、(Ba 1-x Ca x )(Ti 1-y Zry )O3(0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3(0 < y < 1).

[0047] The dielectric layer 111 and the inner electrodes 121 and 122 can be alternately laminated. That is, the first inner electrode 121 and the second inner electrode 122 (a pair of electrodes with different polarities) can be arranged to face each other, and the dielectric layer 111 is interposed between the first inner electrode 121 and the second inner electrode 122. The first inner electrode 121 and the second inner electrode 122 can be electrically separated from each other by the dielectric layer 111 interposed therebetween.

[0048] The first inner electrode 121 can be connected to the third surface 3, the fifth surface 5, and the sixth surface 6, and can be arranged to be spaced apart from the fourth surface 4. The second inner electrode 122 can be connected to the fourth surface 4, the fifth surface 5, and the sixth surface 6, and can be spaced apart from the third surface 3.

[0049] The conductive metal included in the inner electrodes 121 and 122 can be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and their alloys, and more preferably, Ni can be included, but the embodiments are not limited thereto.

[0050] The average thickness td of the dielectric layer 111 and the average thickness te of the inner electrodes 121 and 122 do not have to be limited to any specific examples. The average thickness td of the dielectric layer 111 can be, for example, 0.1 μm to 10 μm. The average thickness te of the inner electrodes 121 and 122 can be, for example, 0.1 μm to 3.0 μm. In addition, the average thickness td of the dielectric layer 111 and the average thickness te of the inner electrodes 121 and 122 can be arbitrarily determined according to the desired performance or purpose. For example, in the case of high-voltage electronic components for achieving miniaturization and high capacitance, the average thickness td of the dielectric layer 111 can be less than 2.8 μm, and the average thickness te of the inner electrodes 121 and 122 can be less than 1 μm. In addition, in the case of small information technology (IT) electronic components for achieving miniaturization and high capacitance, the average thickness td of the dielectric layer 111 can be 0.4 μm or less, and the average thickness te of the inner electrodes 121 and 122 can be 0.4 μm or less.

[0051] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 may represent the average size of the dielectric layer 111 in the first direction and the average size of the internal electrodes 121 and 122 in the first direction, respectively. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 may be measured by scanning the cross section of the body 110 in the first direction and the second direction at a magnification of 10000 using a scanning electron microscope (SEM). More specifically, the average thickness td of the dielectric layer 111 may be obtained by measuring the thickness at a plurality of points (e.g., 30 points equally spaced from each other in the second direction) of one dielectric layer 111 and averaging. In addition, the average thickness te of the internal electrodes 121 and 122 may be obtained by measuring the thickness at a plurality of points (e.g., 30 points equally spaced from each other in the second direction) of one internal electrode 121 or 122 and averaging. 30 points equally spaced from each other may be specified in the capacitance forming portion Ac. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 may be more generalized by obtaining the average thickness after performing thickness measurement on 10 dielectric layers 111 and 10 internal electrodes 121 and 122 , respectively.

[0052] The body 110 may include a capacitor forming part Ac and a first cover part 112 and a second cover part 113, the capacitor forming part Ac including first and second internal electrodes 121 and 122 alternately arranged and a dielectric layer 111 interposed between the first and second internal electrodes 121 and 122, and the first cover part 112 and the second cover part 113 are respectively arranged on two surfaces of the capacitor forming part Ac opposite to each other in the first direction. The cover parts 112 and 113 may mainly prevent the internal electrodes from being damaged due to physical stress and / or chemical stress. The cover parts 112 and 113 may be constructed similarly to the dielectric layer 111 except that the internal electrodes are not included.

[0053] The average thickness tc of the covering portions 112 and 113 is not necessarily limited to any particular example. That is, the average thickness tc of the covering portions 112 and 113 may be arbitrarily determined according to the desired performance or purpose. For example, for the miniaturization and high capacitance of multilayer electronic components, the average thickness tc of the covering portions 112 and 113 may be 300 μm or less, 100 μm or less, 30 μm or less, or 20 μm or less, but embodiments thereof are not limited thereto. Here, the average thickness tc of the covering portions 112 and 113 may represent the average thickness of each of the first covering portion 112 and the second covering portion 113.

[0054] The average thickness tc of the covering parts 112 and 113 may represent an average size of the covering parts 112 and 113 in the first direction, and may be an average value of the size in the first direction measured at five points equally spaced in the second direction in a cross section of the body 110 in the first and second directions.

[0055] The side margin parts 141 and 142 may be disposed on the fifth surface 5 and the sixth surface 6 of the body 110. Specifically, the multilayer electronic component 100 according to the embodiment may include a first side margin part 141 disposed on the fifth surface 5 and a second side margin part 142 disposed on the sixth surface 6. The side margin parts 141 and 142 may have the same composition as that of the dielectric layer 111 except for the configuration that does not include the internal electrodes 121 and 122. That is, the side margin parts 141 and 142 may include a perovskite compound represented by ABO3 as a main component.

[0056] The average thickness tm of the side edge portions 141 and 142 is not necessarily limited to any specific example. That is, the average thickness tm of the side edge portions 141 and 142 can be arbitrarily determined according to the desired performance or purpose. For example, for the miniaturization and high capacitance of multilayer electronic components, the average thickness tm of the side edge portions 141 and 142 may be 100 μm or less, 20 μm or less, or 15 μm or less, but the embodiment is not limited thereto. Here, the average thickness tm of the side edge portions 141 and 142 may represent the average thickness of each of the first side edge portion 141 and the second side edge portion 142.

[0057] The average thickness tm of the side edge portions 141 and 142 may represent the average size of the side edge portions 141 and 142 in the third direction, and may be the average value of the thickness in the third direction measured at five points equally spaced in the first direction in a cross-section of the multilayer electronic component 100 in the first and third directions, the cross-section passing through the center of the main body 110 in the second direction.

[0058] The external electrodes 131 and 132 may be disposed outside the body 110 and may be connected to the internal electrodes 121 and 122. The external electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the body 110 and may extend to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6. The external electrodes 131 and 132 may include a first external electrode 131 connected to the first internal electrode 121 and a second external electrode 132 connected to the second internal electrode 122.

[0059] The external electrodes 131 and 132 may include first electrode layers respectively disposed on the third surface 3 and the fourth surface 4 of the body 110 and respectively connected to the internal electrodes 121 and 122 , and a second electrode layer disposed on the first electrode layer.

[0060] The first electrode layer may be formed by dipping the third surface 3 and the fourth surface 4 of the body 110 into a conductive paste for an external electrode including a conductive metal and glass and firing. The conductive metal included in the first electrode layer may include Cu, Ni, Pd, Pt, Au, Ag, Pb, and / or an alloy thereof, but the embodiment is not limited thereto.

[0061] In addition, the first electrode layer may include only a layer including metal and glass, but the embodiment is not limited thereto, and the first electrode layer may also have a multilayer structure. For example, the first electrode layer may include a first layer and a second layer, the first layer including metal and glass, and the second layer being disposed on the first layer and including metal and resin.

[0062] The metal included in the second layer is not limited to any specific example, and may include one or more selected from the group consisting of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti and their alloys. The resin included in the second layer can ensure adhesion and can be used as a vibration absorbing portion. The resin is not limited to any specific example, and a resin having adhesion and vibration absorbing properties and mixed with metal powder to form a paste can be used. For example, the resin may include one or more types of resins selected from epoxy resins, acrylic resins, etc. In addition, the paste including the resin may also include ethyl cellulose, etc.

[0063] The second electrode layer can improve the mounting performance. The type of the second electrode layer is not limited to any specific example, and can be a plating layer including Ni, Sn, Pd and / or an alloy thereof, and can be formed into multiple layers. For example, the second electrode layer can be a Ni plating layer or a Sn plating layer, or can be formed by sequentially forming a Ni plating layer and a Sn plating layer. In addition, the second electrode layer may include multiple Ni plating layers and / or multiple Sn plating layers.

[0064] In the drawings, the multilayer electronic component 100 may include two external electrodes 131 and 132 , but embodiments thereof are not limited thereto, and the number and shape of the external electrodes 131 and 132 may vary according to the shapes of the internal electrodes 121 and 122 or other purposes.

[0065] According to an embodiment, the side edge portions 141 and 142 may include polydopamine. Polydopamine may be a polymer of dopamine. Polydopamine formed by self-polymerization of dopamine has covalent catechol and imine functional groups and may form a strong bond with both inorganic materials (such as ceramic powders) and organic materials (such as adhesives).

[0066] As will be described later, a side margin portion forming sheet for forming the side margin portions 141 and 142 of the multilayer electronic component 100 according to the embodiment may be added. Figure 5AThe dopamine hydrochloride added to the sheet for forming the side edge portion can be formed by polymerization. Figure 5B The polydopamine shown in . The polydopamine in the sheet for forming the side edge portion can form a strong bond with the ceramic powder and / or adhesive included in the sheet for forming the side edge portion, and therefore, the bonding strength of the sheet for forming the side edge portion can be improved. Therefore, when the sheet for forming the side edge portion is pressed and bonded to the side surface of the ceramic green sheet (which will be described later), defects such as the sheet for forming the side edge portion peeling off from the ceramic green sheet can be prevented.

[0067] All or part of the polydopamine included in the sheet for forming the side margin portion may be converted into the main body 110 and the side margin portions 141 and 142 through a firing process for forming the multilayer electronic component 100. Figure 5C . In an embodiment, at least a portion of the polydopamine included in the side edge portions 141 and 142 may be nitrogen-doped carbonized polydopamine. The nitrogen-doped carbonized polydopamine included in the side edge portions 141 and 142 may be a two-dimensional material, which may improve the elastic modulus and toughness of the side edge portions 141 and 142, and thus may suppress the expansion of cracks generated in the side edge portions 141 and 142. Therefore, the mechanical strength of the multilayer electronic component 100 may be improved, and ultimately the moisture resistance reliability of the multilayer electronic component 100 may be improved.

[0068] In addition, due to the carbonized polydopamine included in the side edge portions 141 and 142, the color of the side edge portions 141 and 142 may be darkened. In an embodiment, the R value, G value, and B value in the color components of the RGB values ​​measured at the side edge portions 141 and 142 may satisfy 71≤R≤79, 71≤G≤79, and 64≤B≤72. The R value, G value, and B value in the RGB values ​​measured on the outer surfaces of the side edge portions 141 and 142 may be respectively less than the R value, G value, and B value in the RGB values ​​measured on the outer surfaces of the cover portions 112 and 113, but the embodiments thereof are not limited thereto. The R value, G value, and B value may be measured by a digital microscope. Even if not described in the present disclosure, other methods and / or tools understood by those of ordinary skill in the art may also be used.

[0069] In the following, reference will be made to Figure 6 and Figure 7 The side margin portions and the dielectric layer are described in more detail. Figure 6 is an enlarged view of a portion of the first side edge portion 141. However, since the configurations of the first side edge portion 141 and the second side edge portion 142 are substantially the same, the following description may be applicable to both the first side edge portion 141 and the second side edge portion 142.

[0070] According to an embodiment, an average size of the plurality of dielectric grains G1 included in the side margin portion 141 may be different from an average size of the plurality of dielectric grains G2 included in the dielectric layer 111. Hereinafter, the dielectric grains and grain boundaries included in the side margin portion 141 may be defined as first dielectric grains G1 and first grain boundaries GB1, respectively, and the dielectric grains and grain boundaries included in the dielectric layer 111 may be defined as second dielectric grains G2 and second grain boundaries GB2, respectively.

[0071] According to an embodiment, the side edge portion 141 may be formed by pressing and firing a sheet for forming the side edge portion separately from the ceramic green sheet for forming the dielectric layer 111. The particle size of the first ceramic powder added to the ceramic green sheet to form the dielectric layer 111 and the particle size of the second ceramic powder added to the sheet for forming the side edge portion to form the side edge portion 141 may be different from each other. By making the particle sizes of the first ceramic powder and the second ceramic powder different from each other, the average size of the plurality of first dielectric grains G1 and the average size of the plurality of second dielectric grains G2 may be adjusted to be different after firing. In addition, the nitrogen-doped carbonized polydopamine included in the side edge portion 141 may suppress the grain growth of the first dielectric grains G1, and therefore, the average size of the plurality of first dielectric grains G1 and the average size of the plurality of second dielectric grains G2 may be different.

[0072] The side margin portion 141 may protect the dielectric layer 111 from external moisture and / or external impact, and the dielectric layer 111 may implement capacitance of the multilayer electronic component 100. That is, according to an embodiment, in order to achieve desired electrical characteristics and / or reliability, the average size of the plurality of first dielectric grains G1 and the average size of the plurality of second dielectric grains G2 may be different from each other.

[0073] For example, in order to improve the capacitance of the multilayer electronic component 100, the average size of the plurality of second dielectric grains G2 included in the dielectric layer 111 may be larger than the average size of the plurality of first dielectric grains G1 included in the side edge portion 141. Alternatively, in order to improve the reliability of the multilayer electronic component 100, the average size of the plurality of second dielectric grains G2 included in the dielectric layer 111 may be smaller than the average size of the plurality of first dielectric grains G1 included in the side edge portion 141.

[0074] The average size of the plurality of first dielectric grains G1 included in the side edge portion 141 is not necessarily limited to any particular example, and, for example, may be greater than or equal to 160 nm and less than or equal to 190 nm.

[0075] The average size of the plurality of first dielectric grains G1 included in the side edge portion 141 may be, for example, an average value of the sizes of the dielectric grains obtained by, for example, using a scanning electron microscope (SEM), obtaining a central region (e.g., Figure 4 An image of the area K1 in FIG. 5 is magnified 50,000 times, and the image is analyzed using an image analysis program (eg, the Zootos program from Zootos).

[0076] In addition, the average size of the plurality of second dielectric grains G2 included in the dielectric layer 111 may be, for example, an average value of the sizes of the dielectric grains obtained by, for example, using a scanning electron microscope (SEM), obtaining a cross section in the first direction and the second direction cut from the center of the multilayer electronic component 100 in the third direction, the central region (for example, Figure 4 An image of the dielectric layer 111 in the region K2 in FIG. 1 is magnified 50,000 times, and the image is analyzed using an image analysis program (eg, the Zootos program from Zootos).

[0077] In an embodiment, the polydopamine included in the side edge portion 141 may be disposed at the first grain boundary GB1. The polydopamine disposed at the first grain boundary GB1 may effectively block the expansion of cracks. In addition, since the nitrogen-doped carbonized polydopamine is hydrophobic, when the nitrogen-doped carbonized polydopamine is present at the first grain boundary GB1, the material may act as a barrier to moisture penetration. The presence of polydopamine (e.g., nitrogen-doped carbonized polydopamine) at the first grain boundary GB1 may be indicated by the presence of N as determined by a scanning electron microscope-energy dispersive spectrometer (SEM-EDS) or an X-ray photoelectron spectroscopy (XPS). Even if not described in the present disclosure, other methods and / or tools understood by a person of ordinary skill in the art may be used.

[0078] Reference Figure 8 In an embodiment, when the side edge portions 141 and 142 are analyzed using X-ray photoelectron spectroscopy (XPS), N1s peak and C1s peak may be detected. When the side edge portions 141 and 142 include nitrogen-doped carbonized polydopamine, in addition to the Ba3d5 peak, O1s peak, Ti2p peak, and C1s peak, the N1s peak may be detected. That is, when the N1s and C1s peaks are simultaneously detected during the XPS analysis, it may be determined that nitrogen-doped carbonized polydopamine is present in the side edge portions 141 and 142. In addition, the intensity of the N1s peak may have a maximum value at a binding energy of 395 eV to 405 eV, and the intensity of the C1s peak may have a maximum value at a binding energy of 280 eV to 290 eV, but embodiments thereof are not limited thereto.

[0079] XPS analysis of the side edge portions 141 and 142 may be performed on the outer surfaces of the side edge portions 141 and 142, but the embodiment is not limited thereto, and may also be analyzed on a cross section in the first and third directions of the central portion of the multilayer electronic component 100 polished to the second direction.

[0080] Reference Fig. 9 In the embodiment, during the Raman analysis of the side edge portions 141 and 142, the -1 Up to 1380cm -1 The first peak X is detected at the Raman shift of 1610 cm -1 Up to 1630cm -1 During the Raman analysis of the side edge portions 141 and 142 , the first peak X and the second peak Y may appear simultaneously because the side edge portions 141 and 142 may include carbonized polydopamine having a two-dimensional structure.

[0081] In an embodiment, the ratio of the maximum intensity of the first peak X to the maximum intensity of the second peak Y may be greater than or equal to 0.01 and less than or equal to 1.50. The ratio of the maximum intensity of the first peak X to the maximum intensity of the second peak Y may vary according to the degree of nitrogen doping and / or defects in the carbonized polydopamine.

[0082] In an embodiment, the full width at half maximum of the first peak may be greater than or equal to 80 cm -1 And less than or equal to 90cm -1 , and the full width at half maximum of the second peak can be greater than 100cm -1 And less than or equal to 110cm -1 The full width at half maximum may refer to the width of a peak when the peak height is half the peak height corresponding to the maximum peak intensity.

[0083] Raman analysis of the side edge portions 141 and 142 may be performed on the outer surfaces of the side edge portions 141 and 142, but embodiments thereof are not limited thereto, and analysis may also be performed on cross sections in the first and third directions of the central portion of the multilayer electronic component 100 polished to the second direction.

[0084] In an embodiment, dielectric layer 111 may not include (may contain) polydopamine. When dielectric layer 111 includes polydopamine, the mechanical strength of dielectric layer 111 may be improved, but when polydopamine is included in dielectric layer 111, which is directly related to the electrical characteristics of multilayer electronic component 100, side effects such as degradation of the breakdown voltage of multilayer electronic component 100 may occur.

[0085] When the dielectric layer 111 does not include polydopamine, nitrogen is not detected in the dielectric layer 111. In addition, when the dielectric layer 111 is analyzed using X-ray photoelectron spectroscopy (XPS), no N1s peak is detected. In addition, when the dielectric layer 111 is subjected to Raman analysis, a peak at 1360 cm -1 Up to 1380cm -1 The Raman shift and 1610cm -1 Up to 1630cm -1 No peak is detected at at least one of the Raman shifts.

[0086] In an embodiment, the content of polydopamine included in the dielectric layer 111 may be less than the content of polydopamine included in the side edge portions 141 and 142. For example, the weight percentage occupied by polydopamine in the dielectric layer 111 may be less than the weight percentage occupied by polydopamine in the side edge portions 141 and 142. As an example, when the dielectric layer includes a content of polydopamine that is less than the content of polydopamine included in the side edge portions, the dielectric layer may have a brighter color than the color of the side edge portions, or the atomic percentage of nitrogen included in the dielectric layer may be less than the atomic percentage of the side edge portions, but is not limited thereto. When polydopamine is added to the dielectric layer 111 to improve the mechanical strength of the dielectric layer 111, the content of polydopamine added to the dielectric layer 111 may be less than the content of polydopamine included in the side edge portions 141 and 142 to prevent the electrical characteristics of the multilayer electronic component 100 from being degraded. When the dielectric layer 111 includes polydopamine, the polydopamine may be disposed at the second grain boundary GB2 of the dielectric layer 111 .

[0087] When the dielectric layer 111 includes polydopamine, during Raman analysis of the dielectric layer 111, the -1 Up to 1380cm -1 The third peak can be detected at the Raman shift of 1610 cm -1 Up to 1630cm -1 Since the content of polydopamine included in the dielectric layer 111 is less than that included in the side edge portions 141 and 142, the intensity of the third peak may be lower than that of the first peak X, and the intensity of the fourth peak may be lower than that of the second peak Y, but the embodiment is not limited thereto.

[0088] Figures 10 to 12 is a perspective view showing a method for manufacturing a multilayer electronic component according to an embodiment. Figures 10 to 12 An example of a method of manufacturing the multilayer electronic component 100 according to the embodiment is described.

[0089] First, a first ceramic slurry including a first ceramic powder, an organic solvent, and a binder can be prepared, and the first ceramic slurry can be coated on a carrier film and dried to prepare a green ceramic sheet. The first ceramic powder is not limited to any specific example as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, or a strontium titanate-based material can be used. Examples of barium titanate-based ceramic powders can include BaTiO3, (Ba 1-x Ca x) TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1).

[0090] After that, as shown in Fig.10 , a laminate can be manufactured by laminating a first green ceramic sheet 211a and a second green ceramic sheet 211b for forming a capacitance forming portion Ac, and a first cover forming sheet 212 and a second cover forming sheet 213 for forming cover portions 112 and 113.

[0091] A first internal electrode pattern 221 can be formed on the first green ceramic sheet 211a to form a first internal electrode 121, and a second internal electrode pattern 222 can be formed on the second green ceramic sheet 211b to form a second internal electrode 122. Specifically, a plurality of first internal electrode patterns 221 arranged at a predetermined interval can be formed on the first green ceramic sheet 211a. The plurality of first internal electrode patterns 221 can have a strip shape and can be formed parallel to each other. In addition, a plurality of second internal electrode patterns 222 arranged at a predetermined interval can be formed on the second green ceramic sheet 211b. The plurality of second internal electrode patterns 222 can have a strip shape and can be formed parallel to each other. The internal electrode patterns 221 and 222 can be formed by printing a conductive paste for internal electrodes including metal powder, binder, solvent, etc. using a screen printing method or a gravure printing method.

[0092] In addition, the sheets 212 and 213 for forming the cover portions can have a structure similar to that of the green ceramic sheet 211, but no internal electrode pattern is formed on the sheets 212 and 213 for forming the cover portions.

[0093] The prepared ceramic laminate may be pressed and cut along cutting lines C1 and C2. Specifically, the ceramic laminate may be cut along a plurality of first cutting lines C1 parallel to the second direction and a plurality of second cutting lines C2 parallel to the third direction. The cutting lines C1 and C2 may intersect the first and second internal electrode patterns 221 and 222.

[0094] Therefore, it is possible to produce Fig.11 . In the ceramic green sheet 210, the cut first internal electrode patterns 221 and the cut second internal electrode patterns 222 may be alternately disposed with the cut ceramic green sheet 211 interposed therebetween. The cut first internal electrode patterns 221 and the cut second internal electrode patterns 222 may be exposed on both surfaces of the ceramic green sheet 210 that are opposite to each other in the third direction.

[0095] After that, the sheets 241 and 242 for forming the side edge portions may be prepared. The sheets 241 and 242 for forming the side edge portions may be manufactured in a manner similar to the above-mentioned ceramic green sheet 211, and may be manufactured using a second ceramic slurry mixed with dopamine hydrochloride, a second ceramic powder, an organic solvent, and a binder. For a total of 100 parts by weight of the second ceramic slurry, the content of dopamine hydrochloride may preferably be greater than 0 parts by weight and less than or equal to 2 parts by weight.

[0096] Afterwards, if Fig.12 As shown in FIG. 2 , the sheets 241 and 242 for forming the side edge portion may be pressed and bonded to both surfaces in the third direction of the ceramic green sheet 210. In this case, the polydopamine formed by polymerization may improve the adhesion of the sheets 241 and 242 for forming the side edge portion, thereby preventing defects from occurring between the ceramic green sheet 210 and the sheets 241 and 242 for forming the side edge portion.

[0097] Thereafter, the ceramic green sheet 210 to which the sheets 241 and 242 for forming the side edge portions are attached may be fired to form a Figure 2 140 and the side edge portions 141 and 142 shown in FIG. The firing temperature may not be particularly limited, but for example, the firing may be performed at a temperature of 1100° C. or more and 1300° C. or less. In addition, before firing the ceramic green sheet 210, a binder removal process and / or a barrel polishing process may be performed, if necessary.

[0098] Then, the external electrodes 131 and 132 may be formed. First, the first electrode layer may be formed by immersing the body 110 on which the side edge portions 141 and 142 are formed in a conductive paste including metal powder and glass and firing. In addition, when the first electrode layer includes a first layer including metal and glass and a second layer provided on the first layer and including metal and resin, the second layer may be formed by coating a conductive resin composition including metal powder and resin on the first layer and drying it, and performing a curing heat treatment at a temperature of 250° C. to 550° C.

[0099] Then, the second electrode layer may be formed on the first electrode layer. The method of forming the second electrode layer may not be particularly limited, and for example, electroplating and / or electroless plating may be used.

[0100] However, the above-described manufacturing method is merely an example, and the manufacturing method of the multilayer electronic component 100 is not limited to the above-described manufacturing method.

[0101] (Experimental example)

[0102] <Tape Test>

[0103] The sample sheets of the embodiment and the comparative example were prepared by the above-mentioned manufacturing method. The sample sheet in the tape test is a ceramic green sheet to which a sheet for forming a side edge portion is attached before firing. In the embodiment, 1 part by weight of dopamine hydrochloride is added to the second ceramic slurry relative to 100 parts by weight of the second ceramic slurry to form a sheet for forming a side edge portion. In the comparative example, dopamine hydrochloride is not added to the second ceramic slurry to form a sheet for forming a side edge portion.

[0104] Fig.13 is a table showing the test results of the tapes of the embodiments and comparative examples of the present disclosure. Under the first condition, a tape having an adhesive force of 1000 gf is adhered to a sheet for forming a side edge portion in a direction parallel to the second direction, and the tape is peeled off from the sheet for forming the side edge portion at a peeling speed of 3000 mm / s. Under the second condition, a tape having an adhesive force of 2200 gf is adhered to a sheet for forming a side edge portion in a direction parallel to the first direction, and the tape is peeled off from the sheet for forming the side edge portion at a peeling speed of 5000 mm / s. Then, the number of sample sheets in which the sheet for forming the side edge portion in the sample sheets of the comparative examples and the embodiments is peeled off from the ceramic green sheet is confirmed.

[0105] Reference Fig.13Under the first condition, 7 of the 36 sample sheets in the comparative example had peeling of the sheet for forming the side edge portion, but no sample sheet in the example had peeling of the sheet for forming the side edge portion. Under the second condition, 42 of the 80 sample sheets in the comparative example had peeling of the sheet for forming the side edge portion, but 35 of the sample sheets in the example had peeling of the sheet for forming the side edge portion. Therefore, the sheet for forming the side edge portion in the example had improved adhesive strength by including polydopamine compared to the comparative example.

[0106] <Measurement of elastic modulus>

[0107] Then, the elastic modulus of the sheet for forming the side edge portion was measured. The elastic modulus was measured by the slope of a straight line of a stress-strain graph measured using a universal testing machine (UTM).

[0108] Fig.14 Graphs showing stress-strain curves of comparative examples and examples. Fig.14 , the elastic modulus of the sheet for forming the side edge portion of the comparative example is 36.7 MPa, and the elastic modulus of the sheet for forming the side edge portion of the embodiment is 38.6 MPa. Therefore, compared with the comparative example, the sheet for forming the side edge portion in the embodiment has a higher elastic modulus by including polydopamine.

[0109] <Moisture resistance reliability test>

[0110] The sample sheets of the embodiment and the comparative example were prepared by the above-mentioned manufacturing method. The sample sheets in the moisture resistance reliability test were in a state where the ceramic green sheet to which the sheet for forming the side edge portion was bonded was fired and the external electrodes were also formed. Then, each of the 400 sample sheets of each of the comparative example and the embodiment was subjected to a temperature of 85°C, a humidity of 85%, and a voltage of 3.75V for 8 hours, and the change in the insulation resistance IR was measured.

[0111] Fig.15A It is a graph showing the results of reliability evaluation of a comparative example. Fig. 15B is a diagram showing the results of reliability evaluation of an embodiment of the present disclosure. Fig.15A and Fig. 15B In the comparative example, there are a plurality of sample pieces whose insulation resistance IR changes sharply, in contrast to the example. In other words, the example improves moisture resistance reliability compared to the comparative example, because the nitrogen-doped carbonized polydopamine in the example has hydrophobicity, and thus when the nitrogen-doped carbonized polydopamine is located at the grain boundary, the nitrogen-doped carbonized polydopamine can act as a barrier against moisture penetration.

[0112] According to the above-described embodiments, a multilayer electronic component having excellent mechanical strength and moisture-resistant reliability can be provided.

[0113] The scope of the present disclosure is not limited to a specific embodiment form. In contrast, modifications, equivalents and alternatives included in the disclosed concepts and technical scope of this specification can be applied. Throughout the specification, the same figure numerals are used for the same elements.

[0114] In the embodiments, the term "embodiment" may not refer to the same embodiment, but may be provided to describe and emphasize the different unique features of each embodiment. The above-mentioned suggested embodiments may be implemented, and they do not exclude the possibility of combining with the features of other embodiments. For example, although the features described in one embodiment are not described in another embodiment, unless otherwise stated, the description may be understood to be related to the other embodiment.

[0115] The terms "first", "second", etc. may be used to distinguish one element from another element, and may not limit the order and / or importance or other aspects of the elements. In some cases, without departing from the scope of rights of the example embodiments, the first element may be referred to as the second element, and similarly, the second element may be referred to as the first element.

[0116] While embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component comprising: a body including a dielectric layer and first and second internal electrodes, the first and second internal electrodes being alternately arranged in a first direction with the dielectric layer interposed between the first and second internal electrodes, and the body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other and connected to the first and second surfaces in the second direction, and a fifth surface and a sixth surface opposite to each other in the third direction and connected to the first to fourth surfaces; A side edge portion, disposed on the fifth surface and the sixth surface; as well as external electrodes, disposed on the third surface and the fourth surface, wherein the side edge portion comprises polydopamine, and The average size of the plurality of dielectric grains included in the side edge portion is different from the average size of the plurality of dielectric grains included in the dielectric layer.

2. The multilayer electronic component according to claim 1, wherein At least a portion of the polydopamine included in the side edge portion is nitrogen-doped carbonized polydopamine.

3. The multilayer electronic component according to claim 1, in, A grain boundary is provided between adjacent dielectric grains among the plurality of dielectric grains included in the side edge portion, and Wherein, the polydopamine included in the side edge portion is disposed at the grain boundary.

4. The multilayer electronic component according to claim 1, wherein: An average size of the plurality of dielectric grains included in the side edge portion is greater than or equal to 160 nm and less than or equal to 190 nm.

5. The multilayer electronic component according to claim 1, wherein In the side edge portion, when analyzed using X-ray photoelectron spectroscopy, an N1s peak and a C1s peak were detected.

6. The multilayer electronic component according to claim 1, wherein: During the Raman analysis of the side edge, at 1360 cm -1 Up to 1380cm -1 The first peak was detected at the Raman shift of 1610 cm -1 Up to 1630cm -1 A second peak was detected at the Raman shift of .

7. The multilayer electronic component according to claim 6, wherein: A ratio of the maximum intensity of the first peak to the maximum intensity of the second peak is greater than or equal to 0.01 and less than or equal to 1.

50.

8. The multilayer electronic component according to claim 6, wherein: The full width at half maximum of the first peak is greater than or equal to 80 cm -1 And less than or equal to 90cm -1 , and the half-maximum width of the second peak is greater than or equal to 100 cm -1 And less than or equal to 110cm -1 .

9. The multilayer electronic component according to claim 1, wherein: The dielectric layer does not contain the polydopamine.

10. The multilayer electronic component according to claim 1, wherein The dielectric layer includes the polydopamine at a content smaller than that included in the side margin portion.

11. The multilayer electronic component according to claim 1, wherein When analyzed using X-ray photoelectron spectroscopy, an N1s peak was detected in the side edge portion, and no N1s peak was detected in the dielectric layer.

12. The multilayer electronic component according to claim 1, wherein During the Raman analysis, in the side edge portion, at 1360 cm -1 Up to 1380cm -1 The first peak was detected at the Raman shift of 1610 cm -1 Up to 1630cm -1 A second peak was detected at the Raman shift of 1360 cm-1 and in the dielectric layer at 1360 cm-1. -1 Up to 1380cm -1 The Raman shift and 1610cm -1 Up to 1630cm -1 No peak is detected at at least one of the Raman shifts.

13. The multilayer electronic component according to claim 1, in, During the Raman analysis, in the side edge portion, at 1360 cm -1 Up to 1380cm -1 The first peak was detected at the Raman shift of 1610 cm -1 Up to 1630cm -1 A second peak was detected at the Raman shift of 1360 cm-1 and in the dielectric layer at 1360 cm-1. -1 Up to 1380cm -1 The third peak was detected at 1610 cm -1 Up to 1630cm -1 A fourth peak was detected at the Raman shift of The intensity of the third peak is lower than that of the first peak, and the intensity of the fourth peak is lower than that of the second peak.

14. The multilayer electronic component according to claim 1, wherein An R value, a G value, and a B value among color components of RGB values ​​measured from the side edge portion satisfy 71≤R≤79, 71≤G≤79, and 64≤B≤72.

15. The multilayer electronic component according to claim 1, wherein at least a portion of the polydopamine included in the side edge portion is nitrogen-doped carbonized polydopamine, The average size of the plurality of dielectric grains included in the side edge portion is greater than or equal to 160 nm and less than or equal to 190 nm, Wherein, the dielectric layer does not contain the polydopamine.

16. The multilayer electronic component according to claim 15, wherein A grain boundary is provided between adjacent dielectric grains among the plurality of dielectric grains included in the side edge portion, and Wherein, the polydopamine included in the side edge portion is disposed at the grain boundary.

17. The multilayer electronic component according to claim 1, wherein: at least a portion of the polydopamine included in the side edge portion is nitrogen-doped carbonized polydopamine, The average size of the plurality of dielectric grains included in the side edge portion is greater than or equal to 160 nm and less than or equal to 190 nm, The content of the polydopamine included in the dielectric layer is less than the content of the polydopamine included in the side edge portion.

18. The multilayer electronic component according to claim 17, wherein: A grain boundary is provided between adjacent dielectric grains among the plurality of dielectric grains included in the side edge portion, and Wherein, the polydopamine included in the side edge portion is disposed at the grain boundary.

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