Electronic circuit device and circuit-integrated motor

Abstract

The invention provides an electronic circuit device and a circuit-integrated motor, which have a small number of components, can reduce processing cost, and can improve heat dissipation performance with a simple structure. An electronic circuit device (1) is provided with: at least one semiconductor device (10); a substrate (20) on which the semiconductor device (10) is mounted and which has a through hole (24) at a position facing the back surface (17) of the semiconductor device (10); a heat sink (30), which is located on the opposite side of the semiconductor device (10) with the substrate (20) therebetween, and which has at least one protrusion (32) protruding toward the back surface (17) of the semiconductor device (10) so as to penetrate into the through-hole (24) of the substrate (20); and a heat dissipation material (40) provided at least between the back surface (17) of the semiconductor device (10) and the top surface (33) of the protrusion (32) of the heat dissipation sheet (30).

Description

Technical Field

[0001] The present disclosure relates to an electronic circuit device and a circuit-integrated motor. Background Art

[0002] Conventionally, in an electronic circuit device in which a semiconductor device is mounted on a substrate, attempts have been made to promote heat dissipation from the semiconductor device, which is a heat generating element.

[0003] For example, Patent Document 1 describes a heat dissipation structure of an in-vehicle electronic control device that transfers heat generated by a semiconductor from a heat sink to a base via heat dissipation holes. Patent Document 2 describes an electronic device in which a heat dissipation member is inserted into a through hole provided in an insulating substrate, and a protruding portion of the heat dissipation member protruding to the opposite side of the semiconductor across the insulating substrate is joined to a case via a thermally conductive member. Prior art literature Patent Literature

[0004] Patent Document 1: International Publication No. 2015 / 072294 Patent Document 2: Japanese Patent Application Laid-Open No. 2013-123011 Summary of the invention 1. Technical issues to be resolved

[0005] In the heat dissipation structure described in Patent Document 1, sufficient heat dissipation performance cannot be obtained if the cross-sectional area of ​​the heat dissipation hole cannot be ensured, and there is room for improvement. In addition, the processing cost for forming the heat dissipation hole on the substrate increases. In the electronic device described in Patent Document 2, the number of components increases because the heat dissipation component is provided separately from the housing. In addition, the component bonding material between the heat sink provided on the back of the electronic component and the heat dissipation component and the heat conductive component provided between the heat dissipation component and the housing become heat transfer resistance, hindering the improvement of heat dissipation performance.

[0006] In view of the above situation, an object of at least some embodiments of the present invention is to provide an electronic circuit device and a circuit-integrated motor that have a small number of components, can reduce processing costs, and can improve heat dissipation performance with a simple structure. (II) Technical solution

[0007] An electronic circuit device according to at least some embodiments of the present invention comprises: at least one semiconductor device; a substrate having a semiconductor device mounted thereon and having a through hole at a position facing the back surface of the semiconductor device; a heat sink located on the opposite side of the semiconductor device across the substrate and having at least one protrusion protruding toward the back surface of the semiconductor device in a manner that intrudes into the through hole of the substrate; and The heat dissipation material is at least arranged between the back surface of the semiconductor device and the top surface of the convex portion of the heat sink. (III) Beneficial effects

[0008] According to at least some embodiments of the present invention, the convex portion of the heat sink is inserted into the through hole of the substrate, so that the top surface of the convex portion, which is the heat receiving surface of the heat sink, is close to the back surface of the semiconductor device. Therefore, by inserting the convex portion of the heat sink into the through hole of the substrate, the heat transfer resistance in the heat transfer path from the semiconductor device to the heat sink can be reduced, and the heat dissipation performance can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1A This is a schematic cross-sectional view of an electronic circuit device according to an embodiment. Figure 1B This is a schematic cross-sectional view of an electronic circuit device according to another embodiment. Figure 2A It is a perspective view schematically showing an electronic circuit device according to an embodiment. Figure 2B This is a perspective view schematically showing an electronic circuit device according to another embodiment. Figure 3A This is a schematic plan view of an electronic circuit device according to an embodiment. Figure 3B It is a schematic plan view of an electronic circuit device according to another embodiment. Figure 4A Yes means Figure 1B 1 is a perspective view of a specific example of a protrusion of a heat sink of an electronic circuit device shown in FIG. Figure 4B Yes means Figure 1B 1 is a perspective view of another specific example of the protrusion of the heat sink of the electronic circuit device shown. Figure 5 It is a cross-sectional view schematically showing the overall structure of a circuit-integrated motor according to an embodiment. Figure 6 This is a perspective view showing a specific configuration example of the periphery of an electronic circuit device of a circuit-integrated motor. Figure 7 This is a perspective view showing a specific structural example of the electronic circuit device and the surrounding area of ​​the circuit-integrated motor. Figure 6 The figure after the substrate is omitted. Figure 8 This is a schematic plan view of an electronic circuit device according to an embodiment. Fig. 9 It is a schematic plan view of an electronic circuit device according to another embodiment. Fig.10This is a schematic plan view of an electronic circuit device according to still another embodiment. Description of Reference Numerals 1 (1A to 1I) - electronic circuit device; 10 (10U, 10V, 10W) ​​- semiconductor device; 11A - first peripheral portion; 11B - second peripheral portion; 12 - semiconductor chip; 13 - package; 14 - terminal; 16 - heat sink; 17 - back surface; 20 - substrate; 24 - through hole; 30 (30A, 30B) - heat sink; 32 - convex portion; 33 - top surface; 34 - peripheral surface; 35 - concave and convex; 40 - heat dissipation material; 42 - first part; 44 - second part; 51 - substrate receiving chamber; 52 - partition wall; 100 - circuit-integrated motor; 110 - motor; 300 (300A to 300F) - common convex portion. DETAILED DESCRIPTION

[0010] Hereinafter, some embodiments of the present invention will be described with reference to the accompanying drawings. However, the dimensions, materials, shapes, and relative arrangements of the components described in the embodiments or shown in the accompanying drawings are not intended to limit the scope of the present invention, but are merely illustrative examples.

[0011] Hereinafter, some embodiments of electronic circuit devices are described with reference to the accompanying drawings. The electronic circuit device described below may be an electronic control device for controlling a vehicle-mounted motor. Specific examples of vehicle-mounted motors include a motor for driving a fan of a radiator, a motor for driving a vacuum pump, and the like.

[0012] Figure 1A This is a schematic cross-sectional view of an electronic circuit device according to an embodiment. Figure 1B This is a schematic cross-sectional view of an electronic circuit device according to another embodiment. Figure 2A It is a perspective view schematically showing an electronic circuit device according to an embodiment. Figure 2B FIG. 1 is a perspective view schematically showing an electronic circuit device according to another embodiment. Figure 2A as well as Figure 2B In FIG. 1 , the package of the semiconductor device is represented by imaginary lines. Figure 3A This is a schematic plan view of an electronic circuit device according to an embodiment. Figure 3B FIG. 1 is a schematic top view of an electronic circuit device according to another embodiment. Figure 3A as well as Figure 3B In the figure, the heat dissipation material is omitted in order to show the relationship between the through hole, the protrusion and the semiconductor device. Figure 4A as well as Figure 4B It means respectively Figure 1B 1 is a perspective view of a specific example of a protrusion of a heat sink of an electronic circuit device shown in FIG. In addition, the following description will include Figure 1A , Figure 1B , Figure 2A , Figure 2B , Figure 3A as well as Figure 3B Electronic circuit devices of some embodiments of at least one of the electronic circuit devices 1A to 1F exemplarily shown in FIG. 1 are collectively referred to as an electronic circuit device 1 .

[0013] In some embodiments, Figure 1A to Figure 3B As shown, the electronic circuit device 1 includes: at least one semiconductor device 10; a substrate 20 on which the semiconductor device 10 is mounted; and a heat sink 30 and a heat dissipation material 40 forming a path (heat dissipation path) for dissipating heat generated in the semiconductor device 10 to the outside.

[0014] The semiconductor device 10 includes a semiconductor chip 12 and a package 13 covering the semiconductor chip 12 . The semiconductor device 10 has a package 13 in the form of a mounting method relative to the substrate 20. In some embodiments, as Figure 1A to Figure 3B As shown, the package 13 is a surface mount (SMT: surface mount technology) type package including a terminal 14 electrically connected to an electrode 22 provided on the surface of a substrate 20. In another embodiment, the package 13 is an insertion mount (IMT: insertion mount technology) type package in which a lead (lead) is inserted into a through hole provided on the substrate 20 and engaged and protrudes from the package 13.

[0015] Although the specific structure of the package of the semiconductor device 10 is not particularly limited, in order to effectively utilize the heat dissipation performance of the protrusion 32 of the heat sink 30 described later, it is desired to adopt a structure in which terminals are provided on the outer periphery (side) of the package 13 (DIP, SOP, SOJ, SON, QFP, QFJ, QFN, etc.), rather than a structure in which a plurality of terminals are arranged in a grid pattern on the back side of the package 13 (PGA, LGA, BGA, etc.). exist Figure 2A , Figure 3A as well as Figure 3B In the illustrated exemplary embodiment, the semiconductor device 10 of the electronic circuit apparatus 1 ( 1C, 1E, 1F) is a small outline nonlead (SON) type including terminals (pads) 14 provided on peripheral portions 11A, 11B of a package 13 . exist Figure 2B In the illustrated exemplary embodiment, the semiconductor device 10 of the electronic circuit apparatus 1C includes terminals 14 protruding from peripheral portions 11A, 11B of a package 13 .

[0016] The semiconductor chip 12 includes semiconductor elements such as transistors, diodes, and thyristors. Examples of the semiconductor chip 12 having a high heat density include power semiconductors including MOSFETs and IGBTs as semiconductor elements. The semiconductor chip 12 may be an integrated circuit (IC) in which a plurality of semiconductor elements are integrated, or a discrete chip in which one semiconductor element is formed. Alternatively, the semiconductor device 10 may be a module structure in which a plurality of discrete chips (semiconductor chips 12 ) are provided in a package 13 .

[0017] The semiconductor chip 12 is at least partially covered by the package 13. The semiconductor chip 12 may be buried in the package 13. The material constituting the package 13 is, for example, resin or ceramic.

[0018] In some embodiments, the semiconductor device 10 includes a heat sink 16 located on a back side 17 of the semiconductor device 10. Figure 1A to Figure 3B In the illustrated embodiment, the heat sink 16 is disposed to face the back surface of the semiconductor chip 12. The heat sink 16 may be disposed close to the semiconductor chip 12 and adjacent to the semiconductor chip 12. The back surface 17 of the semiconductor device 10 on which the heat sink 16 is provided is a surface of the semiconductor device 10 that faces the substrate 20 . The heat sink 16 is exposed on the back surface 17 of the semiconductor device 10 and faces the substrate 20 .

[0019] The semiconductor device 10 includes a plurality of terminals 14 electrically connected to the semiconductor chip 12. The terminals 14 may be electrically connected to the semiconductor chip 12 via bonding wires 15 embedded in the package 13. exist Figure 1A to Figure 3B In the illustrated embodiment, a plurality of terminals 14 are provided on a pair of side surfaces (peripheral portions 11A and 11B of the package 13) of a surface-mounted package 13. Specifically, the plurality of terminals 14 include a source electrode 14S, a gate electrode 14G, and a drain electrode 14D. The source electrode 14S and the gate electrode 14G are provided on the peripheral portion 11A of the package, and the drain electrode 14D is provided on the peripheral portion 11B of the package. The drain electrode 14D also serves as the above-mentioned heat sink (heat sink) 16. That is, the portion of the drain electrode 14D facing the semiconductor chip 12 functions as the heat sink 16, and the portion of the drain electrode 14D near the peripheral portion 11B of the package 13 functions as the terminal 14.

[0020] The semiconductor device 10 of the above structure is mounted (mounted) on a substrate 20. Specifically, the semiconductor device 10 is mounted on the substrate 20 in a posture where the back surface 17 of the semiconductor device 10 faces the substrate 20, and the terminal 14 is electrically connected to the electrode 22 of the substrate 20. The electrode 22 is provided on the surface of the semiconductor device 10 side of the substrate 20. In addition, the electrical connection between the terminal 14 and the electrode 22 can be achieved by solder 23. The solder 23 is provided between the electrode 22 and the terminal 14, and the electrode 22 and the terminal 14 are joined. The substrate 20 is a printed wiring board in which a circuit including electrodes 22 is formed on an insulating substrate 21. The insulating substrate 21 is made of, for example, a composite material of glass fiber and resin.

[0021] The substrate 20 has a through hole 24 at a position facing the back surface 17 of the semiconductor device 10. The shape (outline) of the through hole 24 is not particularly limited, and may be circular, elliptical, track-shaped, polygonal, or a shape based on these shapes. Figure 2A , Figure 2B as well as Figure 3A In the exemplary embodiment shown, the through hole 24 has an outer shape in which the corners of the rectangle are curved. Figure 3B In the exemplary embodiment shown, the through-hole 24 has an oval profile.

[0022] In some embodiments, Figure 2A to Figure 3B As shown, the through hole 24 is non-circular, and the dimension W1 of the through hole 24 along the first peripheral portion 11A and the second peripheral portion 11B of the package 13 provided with the terminal 14 is larger than the dimension W2 of the through hole 24 along the direction intersecting the first peripheral portion 11A and the second peripheral portion 11B (W1>W2). Here, W1 is the dimension of the through hole 24 in the long side direction, and W2 is the dimension of the through hole 24 in the short side direction. exist Figure 2A to Figure 3B In the illustrated embodiment, the through hole 24 extends to the outside of the package 13 beyond the other peripheral portions 11C and 11D of the package 13 except the first peripheral portion 11A and the second peripheral portion 11B of the package 13 in a plan view. In one embodiment, the through hole 24 overlaps the semiconductor device 10 in an area of ​​more than 50% of the occupied area of ​​the semiconductor device 10 when viewed from above. The opening size of the through hole 24 can also be set to include all or most of the occupied area of ​​the semiconductor chip 12 of the semiconductor device 10 when viewed from above (for example, more than 80% of the occupied area of ​​the semiconductor chip 12). Figure 3A as well as Figure 3B In the illustrated exemplary embodiment, the occupied area of ​​the semiconductor chip 12 of the semiconductor device 10 is entirely included in the opening area of ​​the through hole 24 in a plan view.

[0023] A heat sink 30 is disposed on the opposite side of the semiconductor device 10 across the substrate 20. The heat sink 30 is made of metal, for example, copper, aluminum, or an alloy thereof. In some embodiments, the heat sink 30 has a substrate facing surface 31 facing the substrate 20, and a convex portion 32 protruding from the substrate facing surface 31 toward the substrate 20. The convex portion 32 of the heat sink 30 protrudes from the substrate facing surface 31 toward the back surface 17 of the semiconductor device 10 in a manner that intrudes into the through hole 24 of the substrate 20. That is, the substrate 20 is fixed relative to the heat sink 30 in a state where the convex portion 32 of the heat sink 30 is inserted into the through hole 24. exist Figure 1A as well as Figure 1B In the illustrated embodiment, the top surface 33 of the convex portion 32 facing the back surface 17 of the semiconductor device 10 is located inside the through hole 24. That is, the convex portion 32 intrudes into the middle of the through hole 24 and stops before the surface of the substrate 20 on which the electrode 22 is formed. The size of the convex portion 32 is smaller than the size of the through hole 24. Therefore, there is a gap between the outer peripheral surface 34 of the convex portion 32 and the inner wall surface of the through hole 24.

[0024] In some embodiments, in order to increase the contact area between the heat dissipation material 40 and the protrusion 32, as described below, Figure 1B As shown, the outer surface of the convex portion 32 in contact with the heat dissipation material 40 is provided with a concave-convex 35. In another embodiment, as shown in FIG. Figure 1A As shown, the outer surface of the convex portion 32 that contacts the heat dissipation material 40 has no concavities and convexities. exist Figure 1B In the illustrated embodiment, the top surface 33 of the convex portion 32 is provided with the concavoconvex 35. In another embodiment, in addition to or instead of the top surface 33 of the convex portion 32, the outer peripheral surface 34 of the convex portion 32 is provided with the concavoconvex 35. Figure 4A In the exemplary embodiment shown, the heat sink 30A has a convex portion 32 having grid-like grooves 35A (concaves and convexities 35) formed on a top surface 33. Figure 4B In the illustrated exemplary embodiment, the heat sink 30B has the convex portion 32 having the corrugated concavities and convexities 35B (concavities and convexities 35 ) formed on the top surface 33 .

[0025] In some embodiments, the protrusion 32 is non-circular and corresponds to the shape of the through hole 24. Figure 3A to Figure 4B As shown, the cross-sectional shape of the protrusion 32 along the in-plane direction of the substrate 20 has a long side dimension L1 slightly smaller than the long side dimension W1 of the through hole 24 and a short side dimension L2 slightly smaller than the short side dimension W2 of the through hole 24, satisfying L1>L2. exist Figure 3A to Figure 3BIn the illustrated exemplary embodiment, the protrusion 32 has a non-circular contour corresponding to the through hole 24 , and extends to the outside of the package 13 beyond the other peripheral portions 11C and 11D of the package 13 except the first peripheral portion 11A and the second peripheral portion 11B of the package 13 when viewed from above. In one embodiment, the protrusion 32 overlaps the semiconductor device 10 in an area of ​​more than 50% of the occupied area of ​​the semiconductor device 10 when viewed from above. The size of the protrusion 32 can be set to include all or most of the occupied area of ​​the semiconductor chip 12 of the semiconductor device 10 when viewed from above (for example, more than 80% of the occupied area of ​​the semiconductor chip 12). Figure 3A as well as Figure 3B In the illustrated exemplary embodiment, the occupied area of ​​the semiconductor chip 12 of the semiconductor device 10 is entirely included in the area of ​​the top surface 33 of the protrusion 32 in a plan view.

[0026] The heat dissipation material 40 is provided at least between the back surface 17 of the semiconductor device 10 and the top surface 33 of the protrusion 32 of the heat sink 30. When the semiconductor device 10 has the heat dissipation plate 16 on the back surface 17, the heat dissipation material 40 is provided at least between the heat dissipation plate 16 and the top surface 33 of the protrusion 32. The heat dissipation material 40 is a thermal interface material (TIM) that fills the gap between the semiconductor device 10 and the heat sink 30 and reduces the heat transfer resistance in the heat conduction path from the semiconductor device 10 to the heat sink 30. As the heat dissipation material 40, for example, a thermally conductive paste, a thermally conductive sheet, a thermally conductive adhesive, etc. can be used. It is desirable that the thermal conductivity of the heat dissipation material 40 is higher than the thermal conductivity of the substrate 20. In the case where the terminal 14 of the semiconductor device 10 also serves as the heat sink 16, the heat dissipation material 40 is made of an insulating material in order to electrically insulate the terminal 14 from the heat sink 30.

[0027] In some embodiments, Figure 1A as well as Figure 1B As shown, the heat dissipation material 40 includes a first portion 42 located between the top surface 33 of the protrusion 32 and the back surface 17 of the semiconductor device 10, and a second portion 44 at least partially covering the outer peripheral surface 34 of the protrusion 32. The second portion 44 of the heat dissipation material 40 is connected to the outer peripheral edge of the first portion 42, and extends along the height direction of the protrusion 32 in the gap between the through hole 24 and the outer peripheral surface 34 of the protrusion 32 with the outer peripheral edge of the first portion 42 as a starting point.

[0028] Next, refer to Figure 5 to Figure 7 , a circuit-integrated motor including an electronic circuit device 1 is described. In this specification, the circuit-integrated motor is a device in which a motor and a control unit (control substrate) are integrated into one module. Figure 5It is a cross-sectional view schematically showing the overall structure of a circuit-integrated motor according to an embodiment. Figure 6 This is a perspective view showing a specific configuration example of the periphery of an electronic circuit device of a circuit-integrated motor. Figure 7 This is a perspective view showing a specific structural example of the electronic circuit device and the surrounding area of ​​the circuit-integrated motor. Figure 6 The figure after the substrate is omitted.

[0029] like Figure 5 As shown, in some embodiments, the circuit-integrated motor 100 includes the above-mentioned electronic circuit device 1 and a motor 110. The electronic circuit device 1 controls the motor 110 through an inverter circuit including a semiconductor device 10 mounted on a substrate 20. In this case, the electronic circuit device 1 is a control device for the motor 110, and the semiconductor device 10 is a FET constituting the inverter circuit.

[0030] The electronic circuit device 1 includes, in addition to the semiconductor device 10 , the substrate 20 , the heat sink 30 , and the heat dissipation material 40 described above, a housing 50 forming a substrate accommodation chamber 51 for accommodating the substrate 20 . The housing 50 includes a metal partition wall 52 for partitioning the substrate storage chamber 51 from the arrangement area of ​​the motor 110, and a cover 54 for forming the substrate storage chamber 51 together with the partition wall 52. In one embodiment, the cover 54 is made of resin and is mounted on the partition wall 52 by fitting in a fitting portion (not shown).

[0031] like Figure 5 As shown, the partition wall 52 also serves as the heat sink 30 of the electronic circuit device 1. That is, the partition wall 52 as the heat sink 30 has a convex portion 32 protruding from the substrate facing surface 31, and a heat conduction path is formed from the semiconductor device 10 to the convex portion 32 via the heat dissipation material 40. The partition wall 52 may have heat dissipation fins 53 from the viewpoint of improving the heat dissipation performance of the heat sink 30. Figure 5 In the embodiment shown, the heat dissipation fins 53 are provided on the surface of the partition wall 52 opposite to the substrate storage chamber 51 so as to face the arrangement space of the motor 110. Figure 6 as well as Figure 7 As shown, the heat dissipation fins 53 are disposed on the side of the partition wall 52 .

[0032] like Figure 5 to Figure 7 As shown in FIG. 1 , the partition wall 52 includes a substrate fixing portion 60 on which the substrate 20 is mounted. The substrate fixing portion 60 is located in the substrate receiving chamber 51 and has the function of fixing the substrate 20 at a predetermined position. The substrate fixing portion 60 abuts against the back surface of the substrate 20 and has an abutting surface 61 for positioning the substrate 20 in the substrate receiving chamber 51 in the height direction. The height position of the abutting surface 61 from the substrate facing surface 31 is as shown in FIG. Figure 1A , Figure 1B as well as Figure 5 As shown, the top surface 33 of the protrusion 32 is set to be located in the through hole 24. Specifically, the height h of the contact surface 61 from the substrate facing surface 31 is set so that 0<Hh<t is satisfied when the thickness of the substrate 20 is t and the height of the top surface 33 of the protrusion 32 from the substrate facing surface 31 is H. exist Figure 5 to Figure 7 In the illustrated embodiment, the substrate 20 is placed on the contact surface 61 of the substrate fixing portion 60, and the substrate 20 is fixed to the substrate fixing portion 60 by screwing the screw 62 into the internal thread provided on the substrate fixing portion 60. In another embodiment, instead of screwing with the screw 62, the substrate 20 is fixed to the substrate fixing portion 60 by riveting or pressing based on the convex portion provided on the contact surface 61 of the substrate fixing portion 60. In addition, Figure 6 as well as Figure 7 In the illustrated exemplary embodiment, the substrate fixing portions 60 are disposed at four corners of the substrate receiving chamber 51 .

[0033] In addition, the partition wall 52 has an attachment portion 56 extending radially outward. The attachment portion 56 is used to install the circuit-integrated motor 100. For example, when the circuit-integrated motor 100 is a vehicle-mounted motor, the circuit-integrated motor 100 can be mounted on the vehicle body via the attachment portion 56.

[0034] exist Figure 6 as well as Figure 7 In the exemplary embodiment shown, six protrusions 32 are provided on the heat sink 30 (partition wall 52) respectively corresponding to the six semiconductor devices 10 constituting the inverter circuit for controlling the power supplied to the motor 110. The partition wall 52 is provided with an opening 70 (see FIG. 1 ) through which the motor wire (the end of the stator coil 124 described later) of the motor 110 passes. Figure 7 ). In order to ensure the airtightness of the substrate receiving chamber 51, the opening 70 is sealed with a rubber material (not shown) to seal the gap around the motor wire. Six through holes 72 (see FIG. 1 ) are provided on the substrate 20 for inserting the motor wire of the motor 110. Figure 6 ). The inverter circuit including the semiconductor device 10 is controlled by a microcontroller 74 (see Figure 6 )’s PWM control instruction is used to control the power supplied to the motor 110. A connector 76 for connecting the substrate 20 to an external device is provided on the partition wall 52. A terminal 77 of the connector 76 is inserted into a through hole provided on the substrate 20 and is electrically connected to the circuit of the substrate 20. The outer surface of the side wall of the partition wall 52 is provided with a fitting protrusion 78. The fitting protrusion 78 is used to fit Figure 5 The resin cover 54 shown is fitted on the partition wall 52 .

[0035] like Figure 5 As shown, the motor 110 includes a stator 120 including a stator core 122, and a rotor 130 having a magnet 132 arranged to be radially opposed to the stator core 122. A stator coil 124 is wound around the stator core 122. The stator coil 124 is electrically connected to a circuit formed on a substrate 20 of the electronic circuit device 1. When current supplied from substrate 20 flows through stator coil 124, rotor 130 rotates in the circumferential direction due to the interaction of magnetic fields generated by stator coil 124 with magnet 132. In addition, power supplied to stator coil 124 is controlled by an inverter circuit including semiconductor device 10.

[0036] exist Figure 5 In the illustrated embodiment, the circuit-integrated motor 100 is an outer rotor type motor in which the magnets 132 of the rotor 130 are located on the outer circumference side of the stator core 122 of the stator 120 . Specifically, if Figure 5 As shown, the stator 120 includes a stator core 122 wound with a stator coil 124; a support shaft 126 rotatably supporting the rotor 130 via a bearing 134; and a base 128 mounted on the back of the heat sink 30 of the electronic circuit device 1. The base 128 is mounted on the heat sink 30 (partition wall 52) by a fastening member (e.g., bolt) not shown. The stator core 122 is located radially outside the support shaft 126 in a manner of surrounding the support shaft 126. The magnet 132 of the rotor 130 is arranged on the outer peripheral side of the stator core 122. The rotor 130 has a double-layered cylindrical structure including an outer peripheral wall 136 and an inner peripheral wall 137, and the outer peripheral wall 136 and the inner peripheral wall 137 are connected to each other via a bottom wall 138. The magnet 132 is mounted on the inner peripheral surface of the outer peripheral wall 136. A vent 139 is formed between the rotor 130 and the heat sink 30 (partition wall 52). The vent 139 is formed by an axial gap between the outer peripheral wall 136 of the rotor 130 and the housing 50 (partition wall 52 ).

[0037] In another embodiment, the circuit-integrated motor 100 is an inner rotor type motor in which the rotor 130 is located on the inner circumference side of the stator 120. The inner rotor type circuit-integrated motor 100 has the same advantages as the inner rotor type except for the positional relationship between the rotor 130 and the stator 120. Figure 5 The examples shown have a common basic structure.

[0038] In the above-described embodiment, the heat sink 30 of the electronic circuit device 1 has the protrusions 32 provided corresponding to the semiconductor devices 10 as heat generating elements. However, the present invention is not limited to these examples, and a plurality of semiconductor devices 10 may share one protrusion 32 .

[0039] Figure 8 This is a schematic plan view of an electronic circuit device according to an embodiment. Fig. 9 It is a schematic plan view of an electronic circuit device according to another embodiment. Fig.10 FIG. 1 is a schematic top view of an electronic circuit device according to another embodiment. Figure 8 to Figure 10 The heat dissipation material 40 is omitted.

[0040] In some embodiments, Figure 8 to Figure 10 As shown, the electronic circuit device 1 ( 1G to 1I) includes common protrusions 300 ( 300A to 300F) corresponding to two or more semiconductor devices 10 among the plurality of semiconductor devices 10 mounted on the substrate 20 as the protrusions 32 of the heat sink 30 .

[0041] exist Figure 8 to Figure 10 In the illustrated embodiment, the electronic circuit device 1 (1G to 1I) includes six semiconductor devices 10 as six FETs constituting an inverter circuit for controlling the power supplied to the three-phase motor 110. The six semiconductor devices 10 include two semiconductor devices 10U corresponding to U, two semiconductor devices 10V corresponding to V, and two semiconductor devices 10W corresponding to W. Each semiconductor device 10 extends from the first peripheral portion 11A of the package 13 provided with the above-mentioned terminal 14 to the second peripheral portion 11B across the common protrusion 300 (300A to 300F). Figure 3A The relationship (W1>W2, L1>L2) between the through hole 24, the convex portion 32 (the common convex portion 300) and the semiconductor device 10 described above also holds. That is, in the electronic circuit devices 1G to 1I, the dimension W1 of the through hole 24 and the dimension L1 of the convex portion 32 along the first peripheral portion 11A of the package 13 provided with the terminal 14 are respectively larger than the dimension W2 of the through hole 24 and the dimension L2 of the convex portion 32 along the direction intersecting the first peripheral portion 11A and the second peripheral portion 11B.

[0042] exist Figure 8 In the illustrated exemplary embodiment, the electronic circuit device 1G includes two common protrusions 300A, 300B corresponding to two groups Gr1, Gr2, respectively, which are obtained by combining three corresponding semiconductor devices 10U, 10V, 10W one by one. exist Fig. 9In the illustrated exemplary embodiment, the electronic circuit device 1H includes three common protrusions 300C to 300E corresponding to three groups Gr3 to Gr5 respectively constituted by pairs ( 10U, 10V, 10W) ​​of semiconductor devices 10 corresponding to each other. exist Fig.10 In the illustrated exemplary embodiment, the electronic circuit device 1I includes one common convex portion 300F corresponding to all of the six semiconductor devices 10 (10U, 10V, 10W) ​​corresponding to three phases.

[0043] The characteristic structures of the electronic circuit device 1 and the circuit-integrated motor 100 according to some of the above-mentioned embodiments are summarized as follows.

[0044] [1] An electronic circuit device 1 according to at least some embodiments comprises: at least one semiconductor device (10); A substrate (20) having a semiconductor device (10) mounted thereon and having a through hole (24) at a position facing a back surface (17) of the semiconductor device (10); A heat sink (30) located on the opposite side of the semiconductor device (10) across the substrate (20) and having at least one protrusion (32) protruding toward the back side (17) of the semiconductor device (10) in a manner that intrudes into the through hole (24) of the substrate (20); and A heat dissipation material (40) is provided at least between a back surface (17) of a semiconductor device (10) and a top surface (33) of a convex portion (32) of a heat sink (30).

[0045] According to the structure of [1], by making the convex portion (32) of the heat sink (30) intrude into the through hole (24) of the substrate (20), the top surface (33) of the convex portion (32) as the heat receiving surface of the heat sink (30) is close to the back surface (17) of the semiconductor device (10). Therefore, by the simple structure of inserting the convex portion (32) of the heat sink (30) into the through hole (24) of the substrate (20), the heat transfer resistance in the heat transfer path from the semiconductor device (10) to the heat sink (30) can be reduced, thereby improving the heat dissipation performance.

[0046] [2] In some embodiments, in the structure of [1] above, The semiconductor device (10) includes a heat sink (16) located on the back side (17) of the semiconductor device (10). The heat dissipation material (40) is arranged between the heat dissipation plate (16) of the semiconductor device (10) and the top surface (33) of the protrusion (32).

[0047] According to the structure of [2] above, the heat flux from the heat sink (16) provided on the back side (17) of the semiconductor device (10) toward the top surface (33) of the protrusion (32) via the heat sink material (40) can be increased, and the heat dissipation performance can be further improved.

[0048] [3] In some embodiments, in the structure of [1] or [2] above, The semiconductor device (10) comprises: Semiconductor chip (12); A package (13) covering the semiconductor chip (12); A first terminal (14S, 14G) provided on a first peripheral portion (11A) of a package (13); and a second terminal (14D) provided at a second peripheral portion (11B) of the package (13) opposite to the first peripheral portion (11A), When viewed from above, the long side dimension (W1) of the through hole (24) in the direction along the first peripheral portion (11A) and the second peripheral portion (11B) of the package (13) is larger than the short side dimension (W2) of the through hole (24) in the direction intersecting the first peripheral portion (11A) and the second peripheral portion (11B).

[0049] According to the structure of [3], since the size (W1) of the through hole (24) in the direction along the peripheral portion (11A, 11B) of the package (13) provided with the terminal (14) is relatively increased, the size (L1) of the convex portion (32) in the same direction can be sufficiently ensured, thereby promoting heat dissipation using the convex portion (32). In addition, since the size (W2) of the through hole (24) in the direction intersecting the peripheral portion (11A, 11B) of the package (13) provided with the terminal (14) is relatively reduced, the bonding area between the terminal (14) provided on the peripheral portion (11A, 11B) of the package (13) and the electrode (22) of the substrate (20) can be ensured.

[0050] [4] In some embodiments, in the structure of [3] above, The through hole (24) extends to the outside of the package (13) beyond the other peripheral portions (11C, 11D) of the package (13) except the first peripheral portion (11A) and the second peripheral portion (11B) when viewed from above.

[0051] According to the structure of [4] above, a larger size (L1) of the protrusion (32) in the direction along the peripheral edge (11A, 11B) of the package (13) provided with the terminal (14) can be ensured, thereby promoting heat dissipation using the protrusion (32).

[0052] [5] In some embodiments, in any one of the structures of [1] to [4] above, The top surface (33) of the protrusion (32) is located in the through hole (24).

[0053] According to the structure of [5] above, when the substrate (20) is assembled to the heat sink (30), the protrusion (32) is prevented from interfering with the semiconductor device (10), and the reliability of the electronic circuit device (1) is not impaired.

[0054] [6] In some embodiments, in any one of the structures of [1] to [5] above, The cross-sectional shape of the protrusion (32) along the in-plane direction of the substrate (20) is non-circular, The through hole (24) of the substrate (20) has a non-circular shape corresponding to the protrusion (32).

[0055] According to the structure of [6] above, when the substrate (20) is assembled to the heat sink (30), the substrate (20) can be positioned by the protrusion (32) and the through hole (24).

[0056] [7] In some embodiments, in the structure of [6] above, The non-circular convex portion (32) has an outer shape in which the corners of a rectangle are curved in a plan view.

[0057] According to the structure of [7] above, since the protrusion (32) has a curved corner, the stress acting on the heat dissipation material (40) in contact with the protrusion (32) can be alleviated, and the reduction in heat dissipation performance caused by cracking of the heat dissipation material (40) can be suppressed.

[0058] [8] In some embodiments, in the structure of [6] above, The non-circular convex portion (32) has an elliptical outer shape in a plan view.

[0059] According to the structure of the above [8], since the contour of the convex portion (32) has a curved shape, it is possible to suppress a reduction in heat dissipation performance due to cracking of the heat dissipation material (40) for the same reason as the above [7].

[0060] [9] In some embodiments, in any one of the structures of [1] to [8] above, The plurality of protrusions (32) are respectively arranged corresponding to the plurality of semiconductor devices (10) mounted on the substrate (20).

[0061] According to the structure of [9], it is possible to enjoy the heat dissipation effect using the protrusion (32) described in [1] while maintaining the freedom of configuration of the semiconductor device (10).

[0062]

[10] In some embodiments, in any one of the structures of [1] to [8] above, At least one convex portion (32) includes a common convex portion (300) corresponding to two or more semiconductor devices (10) among a plurality of semiconductor devices (10) mounted on a substrate (20).

[0063] According to the structure of

[10] above, the heat capacity of the common protrusion (300) can be increased, thereby improving the heat dissipation performance.

[0064]

[11] In some embodiments, in any one of the structures of [1] to

[10] above, The heat dissipation material (40) comprises: a first portion (42) located between a top surface (33) of the protrusion (32) and a back surface (17) of the semiconductor device (10); and A second portion (44) is connected to the outer peripheral edge of the first portion (42) and at least partially covers the outer peripheral surface (34) of the protrusion (32).

[0065] According to the structure of

[11] above, not only the top surface (33) of the protrusion (32) but also the outer peripheral surface (34) of the protrusion (32) can be used as a heat input surface, and the heat dissipation performance will be further improved.

[0066]

[12] In some embodiments, in any one of the structures of [1] to

[11] above, The top surface (33) of the convex portion (32) has concavities and convexities (35).

[0067] According to the structure of

[12] above, the contact area between the top surface (33) of the protrusion (32) and the heat dissipation material (40) is increased, and the heat dissipation performance is further improved.

[0068]

[13] The circuit-integrated motor (100) of at least some embodiments of the present invention comprises: An electronic circuit device (1) having any one of the structures of [1] to

[12] above, and A motor (110) is configured to be controlled by an inverter circuit of a semiconductor device (10) including an electronic circuit device (1), A heat sink (30) of an electronic circuit device (1) is a metal partition wall (52) for separating a substrate storage chamber (51) storing a substrate (20) from a configuration area of ​​a motor (110).

[0069] According to the structure of the above

[13] , by using the metal partition wall (52) for separating the substrate receiving chamber (51) and the configuration area of ​​the motor (110) as the heat sink (30) of the electronic circuit device (1), the excellent heat dissipation performance described in the above [1] can be enjoyed.

[0070] In the present specification, the expression “having”, “including”, or “having” a constituent element is not an exclusive expression excluding the presence of other constituent elements.

Claims

1. An electronic circuit device comprising: at least one semiconductor device; a substrate on which the semiconductor device is mounted and which has a through hole at a position facing the back surface of the semiconductor device; a heat sink located on the opposite side of the semiconductor device across the substrate and having at least one protrusion protruding toward the back surface of the semiconductor device in a manner that intrudes into the through hole of the substrate; and A heat dissipation material is provided at least between the back surface of the semiconductor device and the top surface of the protrusion of the heat sink.

2. The electronic circuit device according to claim 1, characterized in that The semiconductor device includes a heat sink located on the back side of the semiconductor device, The heat dissipation material is disposed between the heat dissipation plate of the semiconductor device and the top surface of the protrusion.

3. The electronic circuit device according to claim 1 or 2, characterized in that: The semiconductor device comprises: Semiconductor chips; a package covering the semiconductor chip; A first terminal disposed at a first peripheral portion of the package; and A second terminal provided at a second peripheral portion of the package opposite to the first peripheral portion, In a plan view, a longitudinal dimension of the through hole in a direction along the first peripheral portion and the second peripheral portion of the package is larger than a lateral dimension of the through hole in a direction intersecting the first peripheral portion and the second peripheral portion.

4. The electronic circuit device according to claim 3, characterized in that The through hole extends to the outside of the package beyond the other peripheral portions of the package except the first peripheral portion and the second peripheral portion in the plan view.

5. The electronic circuit device according to claim 1 or 2, characterized in that: The top surface of the protrusion is located in the through hole.

6. The electronic circuit device according to claim 1 or 2, characterized in that: The cross-sectional shape of the protrusion along the in-plane direction of the substrate is non-circular, The through hole of the substrate has the non-circular shape corresponding to the convex portion.

7. The electronic circuit device according to claim 6, characterized in that The non-circular convex portion has an outer shape in which corners of a rectangle are curved in a plan view.

8. The electronic circuit device according to claim 6, characterized in that The non-circular convex portion has an elliptical outer shape in a plan view.

9. The electronic circuit device according to claim 1 or 2, characterized in that: The plurality of protrusions are provided corresponding to the plurality of semiconductor devices mounted on the substrate, respectively.

10. The electronic circuit device according to claim 1 or 2, characterized in that: The at least one convex portion includes a common convex portion corresponding to two or more semiconductor devices among the plurality of semiconductor devices mounted on the substrate.

11. The electronic circuit device according to claim 1 or 2, characterized in that: The heat dissipation material comprises: a first portion located between the top surface of the protrusion and the back surface of the semiconductor device, and A second portion is connected to the outer periphery of the first portion and at least partially covers the outer periphery of the protrusion.

12. The electronic circuit device according to claim 1 or 2, characterized in that: The top surface of the convex portion has concavities and convexities.

13. A circuit-integrated motor comprising: The electronic circuit device according to claim 1 or 2, and a motor configured to be controlled by an inverter circuit including the semiconductor device of the electronic circuit device, The heat sink of the electronic circuit device is a metal partition wall for partitioning a substrate storage chamber storing the substrate and a placement region of the motor.

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