Self-supply conformal reinforced heat dissipation device

Abstract

The invention provides a self-supply conformal reinforced heat dissipation device. The self-supply conformal reinforced heat dissipation device is composed of a directional uniform-temperature machine shell, a self-supply thermoelectric module, a conformal piezoelectric module, hyperbolic reinforced heat dissipation fins and the like. The directional temperature equalizing machine shell constructs the temperature difference needed by the thermoelectric module, electric energy is generated in the thermoelectric module through the temperature difference, the conformal piezoelectric module is powered on and blows air, and air flow is effectively organized in the hyperbolic reinforced heat dissipation fins for heat dissipation. According to the device, heat dissipation enhancement under external input zero power consumption is achieved, the application range of the method is expanded through dual-mode work of air cooling of the piezoelectric fan and natural heat dissipation, and the reliability of the device is improved; and stable temperature control is realized by a wind speed self-adaptive negative feedback mechanism based on temperature difference. According to the method and the device, a solution is provided for engineering application of a high-energy-efficiency-ratio heat dissipation technology, and organic unification of multiple targets such as modularization, lightness, thinness, conformality, low energy consumption and high performance of an electronic information hardware system is facilitated.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic equipment, and in particular relates to a self-supplied conformal enhanced heat dissipation device. Background Art

[0002] Building blocks, thinness, conformality, low energy consumption, and high performance are the development trends of electronic information hardware systems, involving many fields such as detection, communication, electronic warfare, autonomous driving, and mobile terminals. High performance characterizes the increasing heat flux density and heat consumption of RF chips, and the difficulty of heat dissipation increases. At a temperature rise of 40°C, the surface heat flux density is ≥800W / m 2 When the natural heat dissipation is difficult to apply, the cooling method tends to be forced air cooling or even liquid cooling. The current forced air cooling requires axial flow fans or centrifugal fans and matching static pressure chambers and other structural designs, which have high space size requirements and are difficult to achieve lightweight conformal design; centralized liquid cooling uses centralized cooling units to complete the liquid supply, heat dissipation and other functions of each array unit. The system has a single point of failure and cannot achieve modular functions; distributed liquid cooling requires the integration of micro pumps, fans, radiators, liquid storage tanks, piping systems and many other components on the array unit, which consumes large power and is difficult to achieve lightweight conformal design. In summary, the current forced air cooling and liquid cooling are difficult to achieve the organic unity of multiple goals such as modularization, lightweight, conformal, low energy consumption and high performance.

[0003] The existing technology has the problems of non-conformal design between the fan and the cooling fins; the module requires external power supply, cannot achieve self-supply, and has high energy consumption; the system cannot achieve dual-mode operation of piezoelectric fan air cooling and natural heat dissipation, and requires external power supply, cannot achieve self-supply, and has high energy consumption. Summary of the invention

[0004] In order to overcome the deficiencies in the prior art, the present invention proposes a self-supplied conformal enhanced heat dissipation device, which is composed of a directional temperature-averaging housing, a self-supplied thermoelectric module, a conformal piezoelectric module, hyperbolic enhanced heat dissipation fins, etc. The directional temperature-averaging housing constructs the temperature difference required by the thermoelectric module, the temperature difference generates electrical energy in the thermoelectric module, the conformal piezoelectric module is electrically blown, and the airflow is effectively organized in the hyperbolic enhanced heat dissipation fins to dissipate heat.

[0005] The device achieves enhanced heat dissipation under zero power consumption of external input. The dual-mode operation of piezoelectric fan air cooling and natural heat dissipation expands the scope of application of the method and improves the reliability of the device. The wind speed adaptive negative feedback mechanism based on temperature difference achieves stable temperature control. The method and device provide a solution for the engineering application of high energy efficiency ratio heat dissipation technology, which helps to achieve the organic unity of multiple goals such as modularization, thinness, conformality, low energy consumption and high performance of electronic information hardware systems.

[0006] The self-supplied conformal enhanced heat dissipation device of the present invention is mainly composed of a directional temperature-averaging housing, a self-supplied thermoelectric module, a conformal piezoelectric module, hyperbolic enhanced heat dissipation fins, etc. The self-supplied thermoelectric module is screwed to both sides of the directional temperature-averaging housing through a combination of mounting screws and steel wire screw sleeves; the conformal piezoelectric module is screwed to the bottom of the directional temperature-averaging housing through a combination of mounting screws and steel wire screw sleeves; and the large surface of the hyperbolic enhanced heat dissipation fins is brazed to the front of the directional temperature-averaging housing.

[0007] The directional temperature-averaging housing serves as the hot end of the self-supply thermoelectric module. Through the directional conduction of the copper-water heat pipe, the conduction temperature rise between the hot end of the temperature difference power generation chip and the chip shell temperature in the self-supply thermoelectric module is reduced. The directional temperature-averaging housing consists of an aluminum housing, a copper-water heat pipe, a wire screw sleeve, and a boss. The aluminum housing and the boss are integrally formed by machining. The heating chip of the printed circuit board is pressed onto the boss via a thermal pad or silicone grease. The boss can be customized according to the size and position of the heating chip. The copper-water heat pipe is brazed on the large surface and side of the aluminum housing, corresponding to the position of the boss, effectively reducing the conduction temperature rise. Threaded interfaces are reserved on the side and bottom of the aluminum housing, and the wire screw sleeve is screwed into the housing as a positioning reference for the self-supply thermoelectric module and the conformal piezoelectric module, while preventing the above two modules from damaging the threads during multiple disassembly and assembly. The bottom of the aluminum case is cut into an L-shaped corner to reserve installation space for the fan base of the conformal piezoelectric module, so that the L-shaped steel sheet of the conformal piezoelectric module and the hyperbolic reinforced heat dissipation fins form a conformal design to prevent the base from blocking the air path.

[0008] The self-supply thermoelectric module uses temperature difference to generate stable electric energy, which is input into the conformal piezoelectric module. The self-supply thermoelectric module consists of columnar fins, hydrogel, voltage stabilizing circuit, thermoelectric generator, and mounting screws. The hot end of the thermoelectric generator is in contact with the side of the aluminum casing via a thermal pad or silicone grease, and a small temperature difference is maintained between the chip shell temperature. The columnar fin is pressed to the cold end of the thermoelectric generator via a thermal pad or silicone grease. The end of the columnar fin is coated with hydrogel, which evaporates and absorbs heat when the device is working, and absorbs environmental water vapor when the device is not running, so that the cold end of the thermoelectric generator maintains a small temperature difference with the ambient wet bulb temperature. Through the Seebeck effect, the temperature difference between the hot and cold ends is used to generate electricity. Multiple thermoelectric generators on a single side are connected in series to increase the output voltage and power, and output stable electric energy through the voltage stabilizing circuit.

[0009] The conformal piezoelectric module is powered, and driven by the embedded circuit board, the piezoelectric ceramic sheet is periodically actuated, driving the L-shaped steel sheet to swing periodically, generating forced wind. The conformal piezoelectric module consists of a fan base, an embedded circuit board, a piezoelectric ceramic sheet, an L-shaped steel sheet, mounting screws, etc. The fan base is made of rust-proof aluminum, and is screwed to the wire screw sleeve on the directional temperature equalization housing through mounting screws. The embedded driving circuit board rectifies and converts the electric energy from the self-supplied thermoelectric module. The piezoelectric ceramic sheet is powered and actuated through the inverse piezoelectric effect. The L-shaped steel sheet is made of stainless steel, pickled and passivated, and bonded to the piezoelectric ceramic sheet by glue. A circular pressure relief hole is opened on the L-shaped steel sheet to reduce the swing resistance. At the same time, the L corners and ends are chamfered to reduce concentrated stress and reduce aerodynamic noise during the swing process.

[0010] Hyperbolic enhanced heat dissipation fins organize airflow, forming hyperbolic flow channels between fins, using chimney effect to draw air and accelerate airflow. Hyperbolic enhanced heat dissipation fins consist of fin base plate and hyperbolic fins, made of aluminum, and die-cast in one piece, with stress release gaps reserved to facilitate stress release during die-casting.

[0011] The beneficial effects of the present invention are

[0012] The invention achieves enhanced heat dissipation under zero power consumption of external input, and the dual-mode operation of piezoelectric fan air cooling and natural heat dissipation expands the scope of application of the invention and improves the reliability of the device; the wind speed adaptive negative feedback mechanism based on temperature difference achieves stable temperature control. It provides a solution for the engineering application of high energy efficiency ratio heat dissipation technology, which helps to achieve the organic unity of multiple goals such as modularization, thinness, conformality, low energy consumption and high performance of electronic information hardware systems. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 Schematic diagram of the self-supplied conformal enhanced heat dissipation device assembly.

[0014] Figure 2 Schematic diagram of the directional temperature-averaging casing structure.

[0015] Figure 3 Schematic diagram of the self-supplied thermoelectric module structure.

[0016] Figure 4 Schematic diagram of the conformal piezoelectric module structure.

[0017] Figure 5 Schematic diagram of the hyperbolic enhanced heat dissipation fin structure.

[0018] Figure 6 A workflow diagram for self-supplied conformal enhanced cooling.

[0019] Figure 7 This is a dual-mode workflow diagram.

[0020] Figure 8 Schematic diagram of negative feedback temperature control mechanism.

[0021] Among them, 1 is a directional temperature-averaging casing, 2 is a self-supply thermoelectric module, 3 is a conformal piezoelectric module, 4 is a hyperbolic reinforced heat dissipation fin, 11 is an aluminum casing, 12 is a copper-water heat pipe, 13 is a wire screw sleeve, 14 is a boss, 21 is a columnar fin, 22 is a hydrogel, 23 is a voltage-stabilizing circuit, 24 is a temperature difference power generation sheet, 25 is a mounting screw, 31 is a fan base, 32 is an embedded circuit board, 33 is a piezoelectric ceramic sheet, 34 is an L-shaped steel sheet, 35 is a pressure relief hole, 36 is a mounting screw, 41 is a fin substrate, 42 is a hyperbolic fin, and 43 is a stress release gap. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] The schematic diagram of the assembly of a self-contained conformal enhanced heat dissipation device of the present invention is as follows Figure 1 As shown, it is mainly composed of a directional temperature-averaging housing 1, a self-supply thermoelectric module 2, a conformal piezoelectric module 3, and a hyperbolic enhanced heat dissipation fin 4. The self-supply thermoelectric module 2 is screwed to both sides of the directional temperature-averaging housing 1 by means of a combination of mounting screws 25-wire screw sleeves 13; the conformal piezoelectric module 3 is screwed to the bottom of the directional temperature-averaging housing 1 by means of a combination of mounting screws 36-wire screw sleeves 13; and the large surface of the hyperbolic enhanced heat dissipation fin 4 is brazed to the front of the directional temperature-averaging housing 1.

[0024] The structural schematic diagram of the directional temperature-averaging housing 1 is as follows Figure 2As shown, the directional temperature-averaging housing 1 serves as the hot end of the self-supply thermoelectric module 2. Through the directional conduction of the copper-water heat pipe 12, the conduction temperature rise between the hot end of the temperature difference power generation chip 24 in the self-supply thermoelectric module and the chip shell temperature is reduced. The directional temperature-averaging housing 1 is composed of an aluminum housing 11, a copper-water heat pipe 12, a wire screw sleeve 13, and a boss 14. The aluminum housing 11 and the boss 14 are integrally formed by machining, and the heating chip of the printed circuit board is pressed onto the boss 14 via a thermal pad or silicone grease. The boss 14 can be customized according to the size and position of the heating chip. The copper-water heat pipe 12 is brazed on the large surface and side of the aluminum housing 11, corresponding to the position of the boss 14, effectively reducing the conduction temperature rise. The side and bottom of the aluminum housing 11 are reserved with threaded interfaces, and the wire screw sleeve 13 is screwed into the aluminum housing 11 as a positioning reference for the self-supply thermoelectric module 2 and the conformal piezoelectric module 3, while preventing the above two modules from damaging the threads during multiple disassembly and assembly. The bottom of the aluminum housing 11 is cut into an L-shaped corner to reserve installation space for the fan base 31 of the conformal piezoelectric module 3, so that the L-shaped steel sheet 34 of the conformal piezoelectric module 3 and the hyperbolic reinforced heat dissipation fins 4 form a conformal design to prevent the base 31 from blocking the air path.

[0025] The structural diagram of the self-supply thermoelectric module 2 is shown in Figure 3 As shown, the self-supply thermoelectric module 2 generates stable electric energy by using temperature difference, which is input into the conformal piezoelectric module 3. The self-supply thermoelectric module 2 is composed of columnar fins 21, hydrogel 22, voltage stabilizing circuit 23, thermoelectric power generation sheet 24, and mounting screws 25. The hot end of the thermoelectric power generation sheet 24 contacts the side of the aluminum housing 11 via a thermally conductive pad or silicone grease, and maintains a small temperature difference with the chip shell temperature. The columnar fin 21 is pressed to the cold end of the thermoelectric power generation sheet 24 via a thermally conductive pad or silicone grease. The end of the columnar fin 21 is coated with hydrogel 22, which evaporates and absorbs heat when the device is working, and absorbs environmental water vapor when the device is not running, so that the cold end of the thermoelectric power generation sheet 24 maintains a small temperature difference with the environmental wet bulb temperature. Through the Seebeck effect, the temperature difference between the hot and cold ends is used to generate electricity. Multiple thermoelectric power generation sheets 24 on a single side are connected in series to increase the output voltage and power, and stable electric energy is output to the conformal piezoelectric module 3 near the bottom through the voltage stabilizing circuit 23.

[0026] The structural diagram of the conformal piezoelectric module 3 is shown in FIG. Figure 4As shown, the conformal piezoelectric module 3 is powered, and driven by the embedded circuit board 32, the piezoelectric ceramic sheet 33 is periodically actuated, driving the L-shaped steel sheet 34 to swing periodically, generating forced wind. The conformal piezoelectric module 3 is composed of a fan base 31, an embedded circuit board 32, a piezoelectric ceramic sheet 33, an L-shaped steel sheet 34, and mounting screws 36. The fan base 31 is made of rust-proof aluminum, and is screwed into the wire screw sleeve 13 on the directional temperature-averaging housing 1 by mounting screws 36. The embedded driving circuit board 32 rectifies and converts the electric energy from the self-supplied thermoelectric module 2. The piezoelectric ceramic sheet 33 is powered and actuated by the inverse piezoelectric effect. The L-shaped steel sheet 34 is made of stainless steel, which is pickled and passivated, and is bonded to the piezoelectric ceramic sheet 33 by glue. A circular pressure relief hole 35 is opened on the L-shaped steel sheet 34 to reduce the swing resistance. At the same time, the L corners and ends are rounded to reduce the concentrated stress and reduce the aerodynamic noise during the swing process.

[0027] The structural schematic diagram of the hyperbolic enhanced heat dissipation fin 4 is as follows Figure 5 As shown, the hyperbolic enhanced heat dissipation fins 4 organize the airflow, and a hyperbolic flow channel is formed between the fins, which uses the chimney effect to draw air and accelerate the airflow. The hyperbolic enhanced heat dissipation fins 4 are composed of a fin base plate 41 and a hyperbolic fin 42, which are made of aluminum and are integrally die-cast, and a stress release gap 43 is reserved to facilitate stress release during die-casting.

[0028] The device workflow is as follows Figure 6 As shown, the side wall of the directional temperature-averaging casing 1 serves as the hot end of the thermoelectric power generation sheet 24, and the columnar fins 21 and the hydrogel 22 of the self-supply thermoelectric module 2 are combined as the cold end of the thermoelectric power generation sheet 24 to construct a temperature difference; through the Seebeck effect, the multiple thermoelectric power generation sheets 24 of the self-supply thermoelectric module 2 are connected in series to generate electrical energy, which is supplied to the conformal piezoelectric module 3 after being acted upon by the voltage stabilizing circuit 23; the conformal piezoelectric module 3 is energized, and through the inverse piezoelectric effect, the piezoelectric ceramic sheet 33 is actuated, driving the L-shaped steel sheet 34 to swing, generating forced wind; the airflow is organized in the hyperbolic reinforced heat dissipation fins 4, bringing a cooling effect, and at the same time, the temperature is stably controlled through a negative feedback mechanism.

[0029] The dual-mode workflow is shown in the figure below: Figure 7 As shown, when the temperature difference between the hot end and the cold end of the thermoelectric power generation sheet 24 is greater than or equal to 20°C, the device adopts the piezoelectric fan cooling mode to enhance the heat dissipation capacity; when the temperature difference is less than 20°C, the device directly adopts the natural heat dissipation mode. The dual-mode operation avoids the long-term actuation of the piezoelectric ceramic sheet 33 and fatigue aging, thereby enhancing the reliability of the device.

[0030] Negative feedback temperature control mechanism Figure 8As shown, when the chip is in high heat consumption mode, the chip shell temperature increases, the temperature difference between the two ends of the thermoelectric power generation sheet 24 of the self-supply thermoelectric module 2 increases, the output power after series connection and voltage stabilization increases, the vibration frequency of the piezoelectric ceramic sheet 33 of the conformal piezoelectric module 3 increases, driving the swing of the L-shaped steel sheet to increase, increasing the forced wind speed, and thus reducing the chip shell temperature. Through the negative feedback temperature control mechanism, the temperature rise between the chip shell temperature and the ambient temperature is kept relatively stable.

[0031] The present invention is not limited to the above specific implementations, and the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made to the above implementations based on the technical essence of the present invention shall be included in the protection scope of the present invention.

Claims

1. A self-contained conformal enhanced heat dissipation device, characterized in that: It includes a directional temperature-averaging housing, a self-supplied thermoelectric module, a conformal piezoelectric module, and hyperbolic enhanced heat dissipation fins; The self-supply thermoelectric module is screwed on both sides of the directional temperature-averaging housing; the conformal piezoelectric module is screwed on the bottom of the directional temperature-averaging housing; the large surface of the hyperbolic enhanced heat dissipation fin is brazed to the front of the directional temperature-averaging housing; The directional temperature-averaging housing serves as the hot end of the self-supply thermoelectric module, and reduces the conduction temperature rise between the hot end of the temperature difference power generation chip and the chip shell temperature in the self-supply thermoelectric module through directional conduction of the copper-water heat pipe; The self-supply thermoelectric module utilizes the temperature difference to generate stable electric energy, which is input into the conformal piezoelectric module; The conformal piezoelectric module is driven by the embedded circuit board, and the piezoelectric ceramic sheet is periodically actuated, driving the steel sheet to swing periodically, thereby generating forced wind; The hyperbolic enhanced heat dissipation fins organize airflow, form hyperbolic flow channels between the fins, and utilize the chimney effect to draw air and accelerate the airflow.

2. A self-contained conformal enhanced heat dissipation device according to claim 1, characterized in that: The directional temperature-averaging casing is composed of an aluminum casing, a copper-water heat pipe, a steel wire screw sleeve and a boss; the aluminum casing and the boss are integrally formed by machining, the copper-water heat pipe is brazed on the large surface and the side of the aluminum casing, corresponding to the position of the boss, threaded interfaces are reserved on the side and bottom of the aluminum casing, and the steel wire screw sleeve is screwed into the aluminum casing; the bottom of the aluminum casing is chamfered with an L-shaped angle.

3. A self-contained conformal enhanced heat dissipation device according to claim 2, characterized in that: The self-supplied thermoelectric module consists of columnar fins, hydrogel, voltage stabilizing circuit, thermoelectric generator and mounting screws; the hot end of the thermoelectric generator is in contact with the side of the aluminum casing via a thermal pad or silicone grease, the columnar fin is crimped to the cold end of the thermoelectric generator via a thermal pad or silicone grease, the end of the columnar fin is coated with hydrogel, and multiple thermoelectric generators on a single side are connected in series.

4. A self-contained conformal enhanced heat dissipation device according to claim 3, characterized in that: The conformal piezoelectric module consists of a fan base, an embedded circuit board, a piezoelectric ceramic sheet, an L-shaped steel sheet and mounting screws; the fan base is made of rust-proof aluminum, which is screwed to the wire screw sleeve on the directional temperature-averaging casing through mounting screws, and has an embedded drive circuit board, and the piezoelectric ceramic sheet is electrically actuated; the L-shaped steel sheet is made of stainless steel, which is pickled and passivated, and is bonded to the piezoelectric ceramic sheet by glue, and a circular pressure relief hole is opened on the L-shaped steel sheet.

5. A self-contained conformal enhanced heat dissipation device according to claim 1, characterized in that: The hyperbolic enhanced heat dissipation fins are composed of a fin base plate and a hyperbolic fin, which are made of aluminum and are integrally die-cast, and a stress release slot 43 is reserved.

6. A self-contained conformal enhanced heat dissipation device according to any one of claims 1 to 5, characterized in that: It has dual working modes. When the temperature difference between the hot end and the cold end of the thermoelectric power generation sheet 24 is greater than or equal to 20°C, the piezoelectric fan cooling mode is adopted; when the temperature difference is less than 20°C, the natural heat dissipation mode is directly adopted.

7. A self-contained conformal enhanced heat dissipation device according to claim 6, characterized in that: It has a negative feedback temperature control mechanism. When the chip is in a high heat consumption mode, the chip shell temperature increases, the temperature difference at both ends of the temperature difference power generation sheet of the self-supply thermoelectric module increases, the output power after series connection and voltage stabilization increases, and the vibration frequency of the piezoelectric ceramic sheet of the conformal piezoelectric module increases, which drives the L-shaped steel sheet to swing more strongly, increases the forced wind speed, and thus reduces the chip shell temperature.

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