Electronic component mounting substrate

Abstract

The present disclosure provides an electronic component mounting substrate capable of sufficiently protecting an electronic component by a sealing resin and suppressing outflow of the sealing resin. This electronic component mounting substrate is provided with a printed substrate, an electronic component, and a sealing resin. The printing substrate has a main surface. The electronic component is mounted on the main surface. The sealing resin is disposed on the main surface so as to cover the electronic component. A trench is formed in the main surface. The trench extends across a region between one side of the main surface and the electronic component in plan view.

Description

Technical Field

[0001] The present disclosure relates to an electronic component mounting substrate. Background Art

[0002] For example, Japanese Patent Application Laid-Open No. 2022-112463 (Patent Document 1) describes a thermal print head. The thermal print head described in Patent Document 1 includes a connection substrate. Various electronic components are mounted on the connection substrate.

[0003] [Background Technology Literature]

[0004] [Patent Document]

[0005] [Patent Document 1] Japanese Patent Publication No. 2022-112463 [Summary] Based on the viewpoint of protecting the electronic components mounted on the connection substrate, it is preferred to seal the electronic components on the connection substrate with resin. When the amount of sealing resin is small, the surface of the electronic components will be exposed from the sealing resin, and the protection of the electronic components will be insufficient. On the other hand, if the amount of sealing resin is increased, the sealing resin may flow out from the place where it is supplied to the end of the connection substrate, and interfere with other parts (such as a cover, etc.). Summary of the invention

[0006] The electronic component mounting substrate disclosed herein comprises a printed substrate, an electronic component and a sealing resin. The printed substrate has a main surface. The electronic component is mounted on the main surface. The sealing resin is arranged on the main surface in a manner covering the electronic component. A groove is formed on the main surface. The groove extends in a manner that crosses an edge of the main surface and a region between the electronic component when viewed from above. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 It is a top view of the electronic component mounting substrate 100 .

[0008] Figure 2 yes Figure 1 A partial enlarged view of area II.

[0009] Figure 3 yes Figure 2 Cross-sectional view at III-III in FIG.

[0010] Figure 4 yes Figure 2 Cross-sectional view at IV-IV in FIG.

[0011] Figure 5 It is an enlarged plan view of an electronic component mounting substrate 100 according to a modification.

[0012] Figure 6 It is an enlarged plan view of the electronic component mounting substrate 200 .

[0013] Figure 7 yes Figure 6 Cross-sectional view at VII-VII in FIG. DETAILED DESCRIPTION

[0014] The embodiments of the present disclosure will be described with reference to the accompanying drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and the description thereof will not be repeated.

[0015] (First embodiment)

[0016] Hereinafter, a component mounting substrate according to the first embodiment will be described. The component mounting substrate according to the first embodiment is assumed to be an electronic component mounting substrate 100 .

[0017] <Configuration of Electronic Component Mounting Substrate 100>

[0018] Next, the structure of the electronic component mounting substrate 100 will be described.

[0019] Figure 1 It is a top view of the electronic component mounting substrate 100 . Figure 2 yes Figure 1 A local enlarged view of area II in FIG. Figure 3 yes Figure 2 Cross-sectional view at III-III in FIG. Figure 4 yes Figure 2 The cross-sectional view at IV-IV in FIG. Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the electronic component mounting substrate 100 includes a printed substrate 10, an electronic component 20, and a sealing resin 30. The electronic component mounting substrate 100 is used, for example, in a thermal print head. However, the use of the electronic component mounting substrate 100 is not limited thereto.

[0020] The printed substrate 10 has a main surface 10a and a main surface 10b. The main surface 10a and the main surface 10b are end surfaces in the thickness direction of the printed substrate 10. The main surface 10b is the opposite surface of the main surface 10a. The main surface 10a is, for example, rectangular in a plan view. Although not shown, there is wiring on the main surface 10a, and the wiring is covered with a solder resist. In addition, a part of the wiring becomes a pad exposed from the solder resist.

[0021] The electronic component 20 is mounted on the main surface 10a. More specifically, the electronic component 20 is, for example, soldered to a wiring pad located on the main surface 10a of the printed substrate 10. The electronic component 20 is, for example, an IC (Integrated Circuit) having a memory. The identification information of the thermal print head is stored in the IC memory. However, the electronic component 20 is not limited to this.

[0022] A groove 10c is formed on the main surface 10a. The groove 10c extends in a manner that crosses a region between one side (side S) of the main surface 10a and the electronic component 20 when viewed from above. The width of the groove 10c in a direction parallel to the side S is, for example, greater than the width of the electronic component 20 in a direction parallel to the side S. The groove 10c extends, for example, parallel to the side S when viewed from above.

[0023] The sealing resin 30 is arranged on the main surface 10a so as to cover the electronic component 20. The sealing resin 30 is poured so as to cover the electronic component 20 in an uncured state, and then cured by heating or the like. It is preferred that the sealing resin 30 covers the side surface of the electronic component 20 facing the groove 10c. The sealing resin 30 is preferably also arranged in the groove 10c.

[0024] The adhesion strength between the sealing resin 30 and the electronic component 20 is preferably greater than the adhesion strength between the sealing resin 30 and the printed board 10. The adhesion strength between the sealing resin 30 and the electronic component 20 and the adhesion strength between the sealing resin 30 and the printed board 10 were measured by the following method.

[0025] First, prepare a first sample and a second sample. The surface of the first sample simulates the surface of the printed substrate 10. That is, the surface of the first sample is composed of a solder resist. The surface of the second sample simulates the surface of the electronic component 20. That is, the surface of the second sample is composed of a mold resin of the electronic component 20. Second, arrange a sealing resin 30 on the surface of the first sample and the surface of the second sample. Third, measure the adhesion strength of the surface of the first sample and the surface of the second sample with the sealing resin 30 by tensile strength measurement using a tensile gauge. The measurement results are regarded as the adhesion strength between the sealing resin 30 and the electronic component 20 and the adhesion strength between the sealing resin 30 and the printed substrate 10.

[0026] <Example of variation>

[0027] Figure 5 FIG. 1 is an enlarged top view of an electronic component mounting substrate 100 according to a variation. Figure 5 As shown, the groove 10c may be formed so as to surround the electronic component 20 in a plan view. In the above, the groove 10c is formed on the main surface 10a, but the groove may not be formed on the main surface 10a. In the above case, the electronic component mounting substrate 100 is for a thermal print head, and the electronic component 20 is an IC having a memory storing identification information of the thermal print head.

[0028] <Effects of Electronic Component Mounting Substrate 100>

[0029] Next, the effects of the electronic component mounting substrate 100 will be described.

[0030] When the electronic component 20 is an IC having a memory storing identification information of the thermal print head, the identification information can be used to ensure traceability of the thermal print head, thereby preventing similar products from being installed in the printer.

[0031] When the electronic component 20 is exposed on the printed substrate 10, a third party can easily grasp the existence of the electronic component 20, so by separating the electronic component 20 from the printed substrate 10 and analyzing it, a similar product can be produced. In the electronic component mounting substrate 100, since the electronic component 20 is covered with the sealing resin 30, it is difficult for a third party to grasp the existence of the electronic component 20. In addition, since it is difficult to separate the electronic component 20 from the printed substrate 10, it is possible to suppress the third party from producing a similar product.

[0032] When the amount of the sealing resin 30 is small, the sealing resin 30 may not completely cover the electronic component 20, resulting in a portion of the electronic component 20 being exposed from the sealing resin 30. On the other hand, if the amount of the sealing resin 30 is increased, the sealing resin 30 may flow out and reach the vicinity of the edge S. When other parts (such as a cover) are installed, the sealing resin 30 may interfere with the other parts. In the electronic component mounting substrate 100, since the groove 10c is formed in a manner that crosses the area between the edge S and the electronic component 20 when viewed from above, the sealing resin 30 is accumulated in the groove 10c, which can suppress the sealing resin 30 from flowing out.

[0033] By forming the groove 10c and sufficiently supplying the sealing resin 30, the electronic component 20 including the side surface of the electronic component 20 facing the groove 10c can be covered with the sealing resin 30 without being exposed. In addition, by forming the groove 10c and sufficiently supplying the sealing resin 30, the sealing resin 30 also enters the groove 10c, and the bonding area with the printed substrate 10 is increased, and the sealing resin 30 is not easily peeled off from the printed substrate 10. As a result, it is more difficult to separate the electronic component 20 from the printed substrate 10.

[0034] When the sealing resin 30 and the electronic component 20 have a stronger adhesion strength than the sealing resin 30 and the printed substrate 10, even if the sealing resin 30 can be peeled off from the printed substrate 10, it is difficult to peel the sealing resin 30 from the electronic component 20. Therefore, in such a case, it becomes more difficult for a third party to analyze the electronic component 20 and make a similar product. In addition, when the groove 10c surrounds the electronic component 20 in a plan view, it not only suppresses the sealing resin 30 from spreading to the vicinity of the edge S, but also suppresses interference with other parts on the printed substrate 10.

[0035] (Second embodiment)

[0036] An electronic component mounting substrate according to a second embodiment will be described. The component mounting substrate according to the second embodiment is referred to as an electronic component mounting substrate 200. Here, points different from the electronic component mounting substrate 100 will be mainly described, and duplicate descriptions will not be repeated.

[0037] <Configuration of Electronic Component Mounting Substrate 200>

[0038] Next, the structure of the electronic component mounting substrate 200 will be described.

[0039] Figure 6 It is an enlarged plan view of the electronic component mounting substrate 200 . Figure 7 yes Figure 6 The cross-sectional view at VII-VII in FIG. Figure 6 and Figure 7 As shown, the electronic component mounting substrate 200 includes a printed substrate 10, an electronic component 20, and a sealing resin 30. In this regard, the configuration of the electronic component mounting substrate 20 is the same as that of the electronic component mounting substrate 100.

[0040] In the electronic component mounting substrate 200, a through hole 10d is formed in the printed substrate 10. The through hole 10d penetrates the printed substrate 10 in the thickness direction. The through hole 10d is arranged around the electronic component 20 in a plan view. More specifically, the through hole 10d is located at a position overlapping with the sealing resin 30 in a plan view. In these points, the configuration of the electronic component mounting substrate 200 is different from that of the electronic component mounting substrate 100.

[0041] <Effects of the Electronic Component Mounting Substrate 200>

[0042] Next, the effects of the electronic component mounting substrate 200 will be described.

[0043] When the sealing resin 30 is cured, the air present in the sealing resin 30 may bubble on the surface of the sealing resin 30. If such bubbles occur, the appearance of the sealing resin 30 is damaged. In addition, the electronic component 20 may be exposed from the trace of such bubbles. In the electronic component mounting substrate 200, a through hole 10d is formed at a position overlapping with the sealing resin 30 when viewed from above. Therefore, the air inside the sealing resin 30 is released from the main surface 10b side through the through hole 10d, and it is not easy to bubble on the surface of the sealing resin 30. Therefore, according to the electronic component mounting substrate 200, it is possible to suppress the deterioration of the appearance of the sealing resin 30 caused by the bubbles of air present in the sealing resin 30, or the exposure of the electronic component 20 from the trace of the bubbles.

[0044] (Note)

[0045] The following describes the configurations included in the embodiments of the present disclosure.

[0046] <Additional Note 1>

[0047] An electronic component mounting substrate comprising:

[0048] Printing substrate;

[0049] Electronic components; and

[0050] Sealing resin;

[0051] The printed substrate has a main surface,

[0052] The electronic component is mounted on the main surface.

[0053] The sealing resin is arranged on the main surface so as to cover the electronic component.

[0054] A groove is formed on the main surface,

[0055] The groove extends across a region between one side of the main surface and the electronic component in a plan view.

[0056] <Note 2>

[0057] The electronic component mounting substrate according to Supplementary Note 1, wherein the sealing resin covers a side surface of the electronic component facing the groove side.

[0058] <Addendum 3>

[0059] The electronic component mounting substrate according to Supplementary Note 1 or 2, wherein the sealing resin is arranged in the groove.

[0060] <Addendum 4>

[0061] The electronic component mounting substrate according to any one of Supplementary Notes 1 to 3, wherein the groove extends so as to surround the electronic component in a plan view.

[0062] <Addendum 5>

[0063] The electronic component mounting substrate according to any one of Supplementary Notes 1 to 4, wherein a through hole is formed in the printed substrate so as to penetrate the printed substrate in a thickness direction.

[0064] The through hole is located at a position overlapping with the sealing resin in a plan view.

[0065] <Addendum 6>

[0066] The electronic component mounting substrate according to any one of Supplementary Notes 1 to 5, wherein the adhesion strength between the sealing resin and the electronic component is greater than the adhesion strength between the sealing resin and the printed substrate.

[0067] <Addendum 7>

[0068] The electronic component mounting substrate according to any one of Supplementary Notes 1 to 6, wherein the electronic component mounting substrate is used for a thermal print head,

[0069] The electronic component is an IC having a memory,

[0070] The memory stores identification information of the thermal print head.

[0071] <Addendum 8>

[0072] An electronic component mounting substrate comprising:

[0073] Printing substrate;

[0074] Electronic components; and

[0075] Sealing resin;

[0076] The printed substrate has a main surface,

[0077] The electronic component is mounted on the main surface.

[0078] The sealing resin is arranged on the main surface so as to cover the electronic component.

[0079] The electronic component mounting substrate is used for a thermal print head,

[0080] The electronic component is an IC having a memory,

[0081] The memory stores identification information of the thermal print head.

[0082] As described above, the embodiments of the present disclosure have been described, but various changes may be made to the embodiments. In addition, the scope of the present invention is not limited to the embodiments. The scope of the present invention is indicated by the claims, and is intended to include all changes within the meaning and scope equivalent to the claims.

[0083] [Explanation of symbols]

[0084] 10 Printing substrate

[0085] 10a, 10b Main surface

[0086] 10c Groove

[0087] 10d Through hole

[0088] 20 Electronic parts

[0089] 30 Sealing resin

[0090] 100,200 electronic parts mounting substrate

[0091] S side.

Claims

1. An electronic component mounting substrate comprising: Printing substrate; Electronic components; and Sealing resin; The printed substrate has a main surface, The electronic component is mounted on the main surface. The sealing resin is arranged on the main surface so as to cover the electronic component. A groove is formed on the main surface, The groove extends across a region between one side of the main surface and the electronic component in a plan view. 2 . The electronic component mounting substrate according to claim 1 , wherein the sealing resin covers a side surface of the electronic component facing the groove side. 3 . The electronic component mounting substrate according to claim 1 , wherein the sealing resin is arranged in the groove. 4 . The electronic component mounting substrate according to claim 1 , wherein the groove extends so as to surround the electronic component in a plan view.

5. The electronic component mounting substrate according to any one of claims 1 to 4, wherein a through hole is formed in the printed substrate so as to penetrate the printed substrate in a thickness direction. The through hole is located at a position overlapping with the sealing resin in a plan view. 6 . The electronic component mounting substrate according to claim 1 , wherein the adhesion strength between the sealing resin and the electronic component is greater than the adhesion strength between the sealing resin and the printed substrate.

7. The electronic component mounting substrate according to any one of claims 1 to 6, wherein the electronic component mounting substrate is used for a thermal print head, The electronic component is an IC having a memory, The memory stores identification information of the thermal print head.

8. An electronic component mounting substrate comprising: Printing substrate; Electronic components; and Sealing resin; The printed substrate has a main surface, The electronic component is mounted on the main surface. The sealing resin is arranged on the main surface so as to cover the electronic component. The electronic component mounting substrate is used for a thermal print head, The electronic component is an IC having a memory, The memory stores identification information of the thermal print head.

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