Voltage regulation module, manufacturing method thereof, packaging structure and electronic equipment

Abstract

The embodiment of the invention relates to the technical field of electronic equipment, and provides a voltage regulation module, a manufacturing method thereof, a packaging structure and electronic equipment. The voltage regulation module comprises a module body, the module body is provided with a first surface, a second surface and a first side face, the first surface and the second surface are opposite in the first direction, the first side face is connected between the first surface and the second surface, and the first direction is parallel to the first side face; the module body further comprises a module circuit board assembly and at least one power chip, the module circuit board assembly is transversely arranged between the first surface and the second surface, and any power chip is arranged on the side, facing the first surface or the side, facing the second surface, of the module circuit board assembly. The first side face is provided with a bonding pad connected with the module circuit board assembly. According to the voltage regulation module and the manufacturing method thereof, the packaging structure and the electronic equipment, the problem that the voltage regulation module cannot be set when the size of the mounting area in the width direction of the packaging structure circuit board is limited is solved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a voltage regulation module and a manufacturing method thereof, a packaging structure and an electronic device. Background Art

[0002] As chip capacity and computing power increase, the packaging structure has significantly increased the requirements for the power supply capacity of the voltage regulator module (VRM). However, while the requirements for the power supply capacity of the voltage regulator module have been greatly increased, the size of the area on the packaging structure circuit board used to set the voltage regulator module is usually limited, which brings great challenges to the setting of the voltage regulator module in the packaging structure. Summary of the invention

[0003] A voltage regulating module and a manufacturing method thereof, a packaging structure and an electronic device provided in the embodiments of the present application can realize the setting of the voltage regulating module when the area size of the packaging structure circuit board used to set the voltage regulating module is limited.

[0004] In a first aspect, a voltage regulating module is provided, which includes a module body, the module body having a first surface, a second surface and a first side surface, wherein the first surface and the second surface are opposite to each other along a first direction, the first side surface is connected between the first surface and the second surface, and the first direction is parallel to the first side surface; further, the module body also includes a module circuit board assembly and at least one power chip, the module circuit board assembly is horizontally arranged between the first surface and the second surface, and any one of the power chips is arranged on the side of the module circuit board assembly facing the first surface or the side facing the second surface; the first side surface is provided with a solder pad connected to the module circuit board assembly.

[0005] The voltage regulating module provided in the embodiment of the present application is welded to the packaging structure circuit board through the solder pad on the first side of the module body, and the first direction is parallel to the direction in which the size of the installation area is limited. This can reduce the size of the voltage regulating module in the direction in which the size of the installation area of ​​the packaging structure circuit board is limited. Therefore, when the size of the installation area of ​​the packaging structure circuit board is limited in a certain direction, the voltage regulating module can be set in the installation area of ​​the packaging structure circuit board on the basis of meeting the power supply capacity requirements.

[0006] When the above-mentioned module body is specifically set up, in an optional technical solution, the module body includes a first heat-conducting layer and a second heat-conducting layer; the second heat-conducting layer is arranged on the second side of the module body away from the first side, and the first heat-conducting layer is connected between the power chip and the second heat-conducting layer, so as to transfer the heat emitted by each power chip to the external environment through the module heat sink, the second heat-conducting layer and the first heat-conducting layer, thereby realizing the heat dissipation of each power chip.

[0007] Furthermore, the first heat-conducting layer is arranged on a side of the power chip away from the module circuit board assembly, so that the contact area between the power chip and the first heat-conducting layer is larger, and better heat dissipation of the power chip can be achieved.

[0008] Specifically, the first heat-conducting layer and / or the second heat-conducting layer is a metal layer to achieve better heat-conducting performance.

[0009] In a specific technical solution, an insulating protective layer is provided on the side of each power chip facing away from the module circuit board assembly to insulate and protect the power chip.

[0010] In a possible technical solution, at least one power chip is provided on the side of the module circuit board assembly facing the first surface, and at least one power chip is provided on the side of the module circuit board assembly facing the second surface, so that the power supply capacity of the voltage regulation module is stronger.

[0011] When the above-mentioned module circuit board assembly is specifically set up, in an optional technical solution, the module circuit board assembly includes an inductor assembly and a module circuit board, and the inductor assembly is arranged on the module circuit board; the inductor assembly has a first pin and a second pin, the first pin is connected to the power chip, and the second pin is connected to the pad at the first side.

[0012] In a specific technical solution, the winding of the inductor component includes a first routing segment parallel to the surface of the module circuit board. The first routing segment can also be used as a connecting wire between the power chip and the solder pad, thereby reducing the setting of additional connecting wires between the power chip and the solder pad and reducing energy loss during the operation of the voltage regulation module.

[0013] In a specific technical solution, the power chip is a driver metal-oxide-semiconductor field-effect transistor (DrMOS) power chip.

[0014] In a second aspect, a packaging structure is provided, including a packaging structure circuit board, a control chip installed on the packaging structure circuit board, and any voltage regulation module provided by the above technical solution, the packaging structure circuit board has an installation area for installing the voltage regulation module, and the voltage regulation module is soldered to the installation area through each pad.

[0015] According to a third aspect, an electronic device is provided, comprising a chip heat sink and the above-mentioned packaging structure, wherein the chip heat sink is fixed to a side of the control chip of the packaging structure away from a circuit board of the packaging structure.

[0016] In a fourth aspect, a method for manufacturing a voltage regulating module is provided, comprising the following steps:

[0017] Providing a module circuit board assembly, the module circuit board assembly having two opposing surfaces;

[0018] A power chip is disposed on at least one surface of the module circuit board assembly;

[0019] The module circuit board assembly and the power chip are packaged to form a module body; the module body has a first surface, a second surface and a first side surface, the first surface and the second surface are opposite to each other along a first direction, the first side surface is connected between the first surface and the second surface, and the first direction is parallel to the first side surface; the module circuit board assembly is horizontally arranged between the first surface and the second surface, and any power chip is arranged on the side of the module circuit board assembly facing the first surface or the side facing the second surface;

[0020] A solder pad connected to the module circuit board assembly is arranged on the first side surface of the module body.

[0021] In a possible technical solution, encapsulating the module circuit board assembly and the power chip to form a module body may specifically include:

[0022] A second heat-conducting layer is disposed on a second side surface of the module body away from the first side surface;

[0023] A first heat-conducting layer is arranged between the power chip and the second heat-conducting layer, and the first heat-conducting layer is connected between the power chip and the second heat-conducting layer.

[0024] In a possible technical solution, a first heat-conducting layer is provided between the power chip and the second heat-conducting layer, and the first heat-conducting layer is connected between the power chip and the second heat-conducting layer, which may specifically include:

[0025] A first heat-conducting layer is arranged on a side of the power chip facing away from the module circuit board assembly.

[0026] Specifically, the first heat conducting layer and / or the second heat conducting layer is a metal layer.

[0027] In a possible technical solution, encapsulating the module circuit board assembly and the power chip to form a module body may specifically include:

[0028] An insulating protective layer is provided on a side of each power chip away from the module circuit board assembly.

[0029] In a possible technical solution, a power chip is arranged on at least one surface of the module circuit board assembly, which may specifically include:

[0030] At least one power chip is arranged on a side of the module circuit board assembly facing the first surface, and at least one power chip is arranged on a side of the module circuit board assembly facing the second surface.

[0031] In a possible technical solution, before providing the module circuit board assembly, the method for manufacturing the voltage regulating module further includes:

[0032] An inductor component and a module circuit board are provided, wherein the inductor component has a first pin and a second pin;

[0033] The inductor component is arranged on the module circuit board, and the first pin of the inductor component is connected to the power chip, and the second pin of the inductor component is connected to the pad at the first side surface of the module body.

[0034] For the technical effects that can be achieved by the above-mentioned second to fourth aspects, please refer to the description of the technical effects that can be achieved by the corresponding design scheme in the above-mentioned first aspect, and this application will not repeat them here. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a structural schematic diagram of a packaging structure in the prior art;

[0036] Figure 2 A schematic diagram of a packaging structure provided in an embodiment of the present application;

[0037] Figure 3 for Figure 2 An exploded view of the package structure shown;

[0038] Figure 4 A cross-sectional view of a voltage regulating module provided in an embodiment of the present application, wherein the dotted line portion in the figure indicates the cut-off portion;

[0039] Figure 5 A schematic diagram of the structure of a voltage regulation module provided in an embodiment of the present application;

[0040] Figure 6 A cross-sectional view of another voltage regulation module provided in an embodiment of the present application;

[0041] Figure 7 A cross-sectional view of another voltage regulation module provided in an embodiment of the present application;

[0042] Figure 8 A cross-sectional view of a voltage regulation module provided in an embodiment of the present application;

[0043] Fig. 9 A schematic diagram of the structure of an inductor component in a voltage regulation module provided in an embodiment of the present application;

[0044] Fig.10 A schematic diagram of a voltage conversion circuit of a voltage regulation module provided in an embodiment of the present application;

[0045] Fig.11A cross-sectional view of another voltage regulation module provided in an embodiment of the present application;

[0046] Fig.12 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0047] Fig.13 A flowchart of a method for manufacturing a voltage regulation module provided in an embodiment of the present application;

[0048] Fig.14 A schematic diagram of the steps of a manufacturing method provided in an embodiment of the present application;

[0049] Fig.15 A flowchart of a manufacturing method provided in an embodiment of the present application;

[0050] Fig.16 A schematic diagram of the steps of a manufacturing method provided in an embodiment of the present application, wherein the dotted line portion in the figure indicates the portion of the voltage regulating module that is cut away;

[0051] Fig.17 A schematic diagram of the steps of a manufacturing method provided in an embodiment of the present application;

[0052] Fig.18 A flowchart of a manufacturing method provided in an embodiment of the present application;

[0053] Fig.19 A schematic diagram of the steps of a manufacturing method provided in an embodiment of the present application. DETAILED DESCRIPTION

[0054] The voltage regulator module is an important part of the package structure and is used to provide a suitable supply voltage for the control chip. For example, the voltage regulator module can provide an adjustable voltage to the control chip. Figure 1 A schematic diagram of a packaging structure in the prior art is shown below. Figure 1 The setting of the voltage regulation module in the packaging structure is briefly described. Figure 1As shown, the packaging structure includes a packaging structure circuit board 200', a control chip 300' and a voltage regulating module 100', wherein the control chip 300' is fixed to the packaging structure circuit board 200'. The packaging structure circuit board 200' has an installation area for installing the voltage regulating module 100', and the voltage regulating module 100' is laid flat on the installation area of ​​the packaging structure circuit board 200'. The disadvantage of this packaging structure is that when the size of the installation area in a certain direction is limited, the voltage regulating module 100' cannot be set. For example, the maximum size of the installation area in the width direction of the packaging structure circuit board 200' can only be d1, and in practice, the minimum size d2 of the voltage regulating module 100' in the same direction is greater than d1, and the voltage regulating module 100' cannot be set because the size of the voltage regulating module 100' in this direction exceeds the limit.

[0055] Based on this, the embodiments of the present application provide a voltage regulation module and a manufacturing method thereof, a packaging structure and an electronic device to solve the above problems. The voltage regulation module can be arranged on the back and / or front of the control chip, mainly as a low-voltage and high-current power supply, used in wireless networks, information technology (IT) boards, etc., to provide stable and reliable power supply for the control chip.

[0056] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings.

[0057] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to be limiting of the present application. As used in the specification and appended claims of the present application, the singular expressions "a", "an", "said", "above", "the" and "this" are intended to also include expressions such as "one or more", unless there is a clear contrary indication in the context.

[0058] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0059] Figure 2 A schematic diagram of a packaging structure provided in an embodiment of the present application. Figure 2As shown, the packaging structure provided in the embodiment of the present application includes a packaging structure circuit board 200 , a control chip 300 and a voltage regulation module 100 , wherein the control chip 300 is installed on the packaging structure circuit board 200 .

[0060] For further information, please refer to Figure 3 In the exploded view of a package structure shown in FIG. 2 , the package structure circuit board 200 has a mounting area a for mounting the voltage regulating module 100 , and the voltage regulating module 100 can be soldered to the mounting area a. Generally, the size of the mounting area a is adapted to the orthographic projection of the voltage regulating module 100 on the package structure circuit board 200 .

[0061] When setting the voltage regulation module 100, please refer to Figure 4 A schematic diagram of the structure of a voltage regulation module 100 is shown in FIG. Figure 4 As shown, the voltage regulating module 100 includes a module body 1, the module body 1 has a first surface 11 and a second surface 12 opposite to each other along a first direction X, and the module body 1 also has a first side surface 13 connected between the first surface 11 and the second surface 12. The first side surface 13 is parallel to the first direction X, that is, the first side surface 13 is perpendicular to the first surface 11 and the second surface 12. Further, the module body 1 also includes a module circuit board assembly 14 and a power chip 15, and the module circuit board assembly 14 is horizontally arranged between the first surface 11 and the second surface 12. The module circuit board assembly 14 has two surfaces, one of which faces the first surface 11 of the module body 1, and the other faces the second surface 12 of the module body 1. There is at least one power chip 15, and each power chip 15 is arranged on the side of the module circuit board assembly 14 facing the first surface 11 or the side of the module circuit board assembly 14 facing the second surface 12.

[0062] Please combine Figure 5 The first side surface 13 of the module body 1 is provided with a soldering pad 131 connected to the module circuit board assembly 14, so that the welding surface of the power chip 15 and the module circuit board assembly 14 is perpendicular to the welding surface of the voltage regulating module 100 and the packaging structure circuit board 200, and the voltage regulating module 100 is soldered to the packaging structure circuit board 200 through the soldering pad 131 on the first side surface 13 of the module body 1 for installing the installation area a of the voltage regulating module 100.

[0063] Exemplarily, the pads 131 of the first side surface 13 of the module body 1 include a high voltage input pad Vin, two low voltage output pads Vout, and two ground pads PGND.

[0064] The direction perpendicular to the first side surface 13 is the second direction Z. Obviously, the size of the first side surface 13 of the voltage regulating module 100 in the first direction X is smaller than the size of the first surface 11 and the second surface 12 of the voltage regulating module 100 in the second direction Z. Therefore, when the size of the mounting area a of the package structure circuit board 200 used to mount the voltage regulating module 100 is limited in a certain direction, the voltage regulating module 100 provided by the present solution is adopted, that is, the voltage regulating module 100 is welded to the package structure circuit board 200 through the pad 131 of the first side surface 13 of the module body 1, and the first direction X is parallel to the direction in which the size of the mounting area a is limited, so that the size of the voltage regulating module 100 in the direction in which the size of the mounting area a of the package structure circuit board 200 is limited can be reduced, so that the setting of the voltage regulating module 100 when the size of the mounting area a of the package structure circuit board 200 is limited in a certain direction can be realized on the basis of meeting the power supply capacity requirements. In some embodiments, more voltage regulating modules 100 can also be arranged to improve the power supply current capacity of the voltage regulating module 100 within a unit width. The first direction X may be parallel to the width direction or the length direction of the package structure circuit board 200. Taking the case where the first direction X is parallel to the width direction of the package structure circuit board 200 as an example, the voltage regulating module 100 provided by the present solution can reduce the width of the voltage regulating module 100 with a two-phase width of 9 mm to 5.5 mm, and the module limit width is reduced by 39%.

[0065] In addition, when the voltage regulating module 100 outputs low voltage and high current, the loss of the current output from the voltage regulating module 100 to the control chip 300 in the transmission path cannot be ignored. The smaller the size of the voltage regulating module 100 in the first direction X, the closer the voltage regulating module 100 can be to the control chip 300, the shorter the current transmission path, and the smaller the current loss.

[0066] It is worth noting that the power chip 15 mentioned in this embodiment includes but is not limited to a driver metal-oxide-semiconductor field-effect transistor power chip, that is, a DrMOS (driver metal-oxide-semiconductor field-effect transistor) power chip.

[0067] When the module body 1 is specifically configured, in an optional implementation, at least one power chip 15 may be provided on the side of the module circuit board assembly 14 facing the first surface 11. For example, a power chip 15 is provided on the side of the module circuit board assembly 14 facing the first surface 11. Figure 4As shown. The side of the module circuit board assembly 14 facing the first surface 11 may also be provided with two power chips 15 or three power chips 15, etc. The side of the module circuit board assembly 14 facing the second surface 12 may also be provided with at least one power chip 15. For example, the side of the module circuit board assembly 14 facing the second surface 12 is provided with a power chip 15, such as Figure 6 The side of the module circuit board assembly 14 facing the second surface 12 may also be provided with two power chips 15 or three power chips 15 or the like.

[0068] In another optional implementation, Figure 7 As shown, at least one power chip 15 is disposed on the side of the module circuit board assembly 14 facing the first surface 11, and at least one power chip 15 is also disposed on the side of the module circuit board assembly 14 facing the second surface 12. A filling layer or an insulating protective layer may be disposed on the periphery of the power chip 15. It is not difficult to understand that when the module body 1 includes multiple power chips 15, the power supply capacity of the voltage regulating module 100 is stronger.

[0069] Figure 8 1 is a cross-sectional view of a voltage regulating module 100 provided in an embodiment of the present application. Figure 8 As shown, when the module circuit board assembly 14 is specifically set, in an optional implementation, the module circuit board assembly 14 includes an inductor assembly 141 and a module circuit board 142, and the inductor assembly 141 is arranged on the module circuit board 142. Among them, the inductor assembly 141 can be arranged on the surface of the module circuit board 142 or embedded in the module circuit board 142. Please refer to Fig. 9 The three-dimensional structure diagram of the inductor component 141 is shown in FIG. Fig. 9 As shown, the inductor assembly 141 includes a magnetic core 1413 and a winding 1414, the winding 1414 has a first pin 1411 and a second pin 1412, the first pin 1411 is connected to the power chip 15, and the second pin 1412 extends to the first side 13 and is connected to the pad 131. Exemplarily, the inductor assembly 141 can be an assembled inductor, and can be a single-phase inductor, a two-phase inductor, or a multi-phase inductor.

[0070] Please combine Figure 8 and Fig. 9 In a specific implementation, the winding 1414 of the inductor component 141 includes a first line segment L parallel to the surface of the module circuit board 142. For example, the winding is H-shaped or Fig. 9 The first wiring segment L can also be used as a connecting wire between the power chip 15 and the pad 131 , thereby reducing the number of additional connecting wires between the power chip 15 and the pad 131 , and further reducing energy loss during the operation of the voltage regulating module 100 .

[0071] The power chip 15 is connected to the inductor component 141 to form Fig.10 The voltage conversion circuit shown. The voltage conversion circuit includes a first power tube switch Q1, a second power tube switch Q2, a capacitor C', an inductor component L and a load R0. Among them, the first power tube switch Q1 and the second power tube switch Q2 can be the power chip 15 in the embodiment of the present application, and it can also be considered that the power chip 15 can realize the functions of the first power tube switch Q1 and the second power tube switch Q2. The inductor L can be the inductor component 141 in the embodiment of the present application, and the load R0 can be the control chip 300 in the embodiment of the present application. The high voltage input by Vin can be converted into a low voltage through the voltage conversion circuit, and output from Vout to the load R0 to power the load.

[0072] Fig.11 Schematic diagram of a voltage regulation module 100 provided in an embodiment of the present application. Fig.11 As shown, the side of the module body 1 away from the first side 13 is the second side 18 (not visible from the perspective of the figure), and the second side 18 of the module body 1 is provided with a second heat-conducting layer 17, and the first heat-conducting layer 16 is connected between the power chip 15 and the second heat-conducting layer 17. The voltage regulating module 100 provided in the embodiment of the present application is vertically arranged on the packaging structure circuit board 200 through the first side 13, and the second side 18 is located on the side of the voltage regulating module 100 away from the packaging structure circuit board 200. Exemplarily, the first heat-conducting layer 16 is arranged on the side of the power chip 15 away from the module circuit board assembly 14, so as to have a larger contact area with the power chip 15, improve the heat dissipation rate, and better play the role of heat conduction. The first heat-conducting layer 16 and the second heat-conducting layer 17 can both be metal layers or other high heat dissipation material layers, for example, high heat dissipation material layers of non-metallic materials.

[0073] In this solution, a second heat-conducting layer 17 is disposed on the second side surface 18, a module heat sink 500 is disposed on the side of the second heat-conducting layer 17 away from the first side surface 13, and the first heat-conducting layer 16 is used to achieve the connection between the power chip 15 and the second heat-conducting layer 17, that is, the heat emitted by each power chip 15 can be transferred to the external environment through the module heat sink 500, the second heat-conducting layer 17 and the first heat-conducting layer 16, thereby achieving the heat dissipation of each power chip 15. Specifically, the module heat sink 500 can be a "X"-shaped heat sink or a zigzag-shaped heat sink, etc., and the material of the module heat sink 500 can be a high thermal conductivity material such as copper or aluminum, and the back copper of the power chip 15 is thermally connected to the module heat sink 500 through the first heat-conducting layer 16 and the second heat-conducting layer 17.

[0074] In addition, compared to the situation where the voltage regulating module 100 is laid flat on the packaging structure circuit board 200, in the embodiment of the present application, the voltage regulating module 100 is vertically arranged on the packaging structure circuit board 200, and the module radiator 500 is arranged on the second side surface 18 of the module body 1. The second side surface 18 of the module body 1 is smoother than the mounting surface of the module radiator 500 when the voltage regulating module 100 is laid flat on the packaging structure circuit board 200, and the module radiator 500 is easier to set up and the heat dissipation solution is simpler.

[0075] Furthermore, in an optional implementation, the power chip 15 is thermally connected to the package structure circuit board 200 through a power via, so that part of the heat is transferred to the package structure circuit board 200, and the heat is dissipated through the package structure circuit board 200. As a result, the package structure provided in this embodiment can achieve bidirectional low thermal resistance heat dissipation. Specifically, the power chip 15 achieves low thermal resistance heat dissipation in the direction from the first side 13 of the voltage regulating module 100 to the second side 18 through the first thermal conductive layer 16, the second thermal conductive layer 17 and the module heat sink 500. The power chip 15 is also directly connected to the package structure circuit board 200 through a vertical power via, and the voltage regulating module 100 is side-bonded to achieve low thermal resistance heat dissipation to the package structure circuit board 200.

[0076] Please continue to refer to Fig.11 In a specific implementation, each power chip 15 has an insulating protective layer 19 on the side away from the module circuit board assembly 14 to insulate and protect the power chip 15. In a specific implementation, each power chip 15 has a first heat-conducting layer 16 on the side away from the module circuit board assembly 14, and the insulating protective layer 19 is provided between each power chip 15 and the corresponding first heat-conducting layer 16. Exemplarily, the insulating protective layer 19 can be a plastic layer.

[0077] Fig.12 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application is shown in FIG. Fig.12 As shown, the electronic device includes a chip heat sink 400 and the above-mentioned packaging structure, and the chip heat sink 400 is fixed to the side of the control chip 300 of the packaging structure away from the packaging structure circuit board 200. The electronic device includes the above-mentioned packaging structure, and thus, at least the technical effect that can be achieved by the above-mentioned packaging structure can be achieved, and the specific effects will not be repeated here.

[0078] The embodiment of the present application further provides a method for manufacturing a voltage regulating module 100 , and the method is used to manufacture the voltage regulating module 100 . Fig.13 Flow chart of a method for manufacturing a voltage regulating module 100 provided in an embodiment of the present application. Fig.13 As shown, the manufacturing method at least comprises the following steps:

[0079] S1. providing a module circuit board assembly, wherein the module circuit board assembly has two opposite surfaces;

[0080] S2. Arranging a power chip on at least one surface of the module circuit board assembly;

[0081] The module circuit board assembly 14 is plate-shaped and has a small thickness. The two surfaces of the module circuit board assembly 14 perpendicular to the thickness direction can be considered as two opposite surfaces. The power chip 15 can be set on one of the surfaces, or at least one power chip can be set on both surfaces at the same time. In an optional implementation, the module circuit board assembly 14 has opposite surfaces b and c, and at least one power chip 15 is set on both surfaces b and c. Fig.14 The structure shown. Among them, the number of power chips 15 on the surface b and the surface c of the module circuit board assembly 14 is one, two or three, etc. Of course, the number of power chips 15 on the surface b and the surface c of the module circuit board assembly 14 is not limited to this. For example, in another optional implementation, the surface b of the module circuit board assembly 14 is not provided with a power chip 15, and only the surface c of the module circuit board assembly 14 is provided with a power chip 15. In this case, the number of power chips 15 on the surface c of the module circuit board assembly 14 can be one, two or three, etc. In another optional implementation, the surface c of the module circuit board assembly 14 is not provided with a power chip 15, and only the surface b of the module circuit board assembly 14 is provided with a power chip 15. In this case, the number of power chips 15 on the surface b of the module circuit board assembly 14 can be one, two or three, etc.

[0082] S3, encapsulating the module circuit board assembly and the power chip to form a module body;

[0083] Among them, the module body 1 has a first surface 11, a second surface 12 and a first side surface 13, the first surface 11 and the second surface 12 are opposite to each other along a first direction X, the first side surface 13 is connected between the first surface 11 and the second surface 12, and the first direction X is parallel to the first side surface 13; the module circuit board assembly 14 is horizontally arranged between the first surface 11 and the second surface 12, and any power chip 15 is arranged on the side of the module circuit board assembly 14 facing the first surface 11 or the side facing the second surface 12.

[0084] S4. Dispose a solder pad connected to the module circuit board assembly on the first side of the module body.

[0085] In this solution, the voltage regulating module 100 is welded to the package structure circuit board 200 through the pad 131 of the first side surface 13 of the module body 1, and the first direction X is parallel to the direction in which the size of the mounting area a is limited, that is, the size of the voltage regulating module 100 in the direction in which the size of the mounting area a of the package structure circuit board 200 is limited can be reduced, so that the setting of the voltage regulating module 100 when the size of the mounting area a of the package structure circuit board 200 is limited in a certain direction can be achieved on the basis of meeting the power supply capacity requirements. In some embodiments, more voltage regulating modules 100 can also be set to improve the power supply current capacity of the voltage regulating module 100 within a unit width. The first direction X can be parallel to the width direction or the length direction of the package structure circuit board 200.

[0086] In addition, when the voltage regulating module 100 outputs low voltage and high current, the loss caused by the current output from the voltage regulating module 100 to the control chip 300 in the transmission path cannot be ignored. The smaller the size of the voltage regulating module 100 in the first direction X, the closer the voltage regulating module 100 can be to the control chip 300, the shorter the current transmission path, and the smaller the current loss.

[0087] Fig.15 A flowchart of a manufacturing method provided in an embodiment of the present application. Fig.15 As shown, in a specific implementation, step S3, encapsulating the module circuit board assembly and the power chip to form a module body, specifically includes:

[0088] S31, disposing a second heat-conducting layer on a second side surface of the module body away from the first side surface;

[0089] S32, disposing a first heat-conducting layer between the power chip and the second heat-conducting layer, and connecting the first heat-conducting layer between the power chip and the second heat-conducting layer, to obtain Fig.16 The structure shown forms a heat conduction path from the power chip 15 to the first heat conduction layer 16 and then from the first heat conduction layer 16 to the second heat conduction layer 17, which facilitates the heat of each power chip 15 to be transferred from the second heat conduction layer 17 to the outside of the packaging structure.

[0090] Specifically, the first heat-conducting layer 16 and the second heat-conducting layer 17 can both be metal layers or other high heat-dissipating material layers.

[0091] In a specific implementation, step S32, disposing a first heat-conducting layer between the power chip and the second heat-conducting layer, and connecting the first heat-conducting layer between the power chip and the second heat-conducting layer, specifically includes:

[0092] A first heat-conducting layer 16 is disposed on a side of the power chip 15 away from the module circuit board assembly 14 , so that the contact area between the power chip 15 and the first heat-conducting layer 16 is larger, thereby achieving better heat dissipation of the power chip 15 .

[0093] In a specific implementation, step S3, encapsulating the module circuit board assembly and the power chip to form a module body, specifically includes:

[0094] An insulating protective layer 19 is provided on the side of each power chip 15 away from the module circuit board assembly 14, so as to obtain Fig.17 The structure shown. Among them, the insulating protective layer 19 can play the role of insulating and protecting the power chip 15. Exemplarily, the insulating protective layer 19 can be a plastic layer. When the first thermal conductive layer 16 and / or the second thermal conductive layer 17 are metal layers, the insulating protective layer 19 can be arranged between the power chip 15 and the corresponding thermal conductive layer.

[0095] Fig.18 A flowchart of a manufacturing method provided in an embodiment of the present application is shown in FIG. Fig.18 As shown, in a specific implementation, step S1, providing a module circuit board assembly, specifically includes:

[0096] S11. Provide an inductor component and a module circuit board, wherein the inductor component has a first pin and a second pin; wherein the production of the inductor component includes: making the winding include a first routing segment parallel to the surface of the module circuit board, and providing pins at the top and bottom to reduce the path impedance.

[0097] S12, placing the inductor component on the module circuit board to obtain Fig.19 Specifically, the inductor component 141 and passive components can be embedded in the module circuit board 142. The two surfaces of the module circuit board 142 are welded with capacitors and power chips 15 by surface mount technology (SMT), and the pins of the module circuit board 142, power chips 15, capacitors, etc. are interconnected by copper pillars or metal filling after drilling.

[0098] Exemplarily, after step S2 and before step S3 and step S4, the process includes: connecting the first pin 1411 of the inductor component 141 to the power chip 15 , and connecting the second pin 1412 of the inductor component 141 to the pad 131 at the first side surface 13 of the module body 1 .

[0099] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A voltage regulation module, characterized in that: The module body comprises a first surface, a second surface and a first side surface, the first surface and the second surface are opposite to each other along a first direction, the first side surface is connected between the first surface and the second surface, and the first direction is parallel to the first side surface; The module body further includes a module circuit board assembly and at least one power chip, wherein the module circuit board assembly is disposed transversely between the first surface and the second surface, and any one of the power chips is disposed on a side of the module circuit board assembly facing the first surface or a side facing the second surface; The first side surface is provided with a soldering pad connected to the module circuit board assembly.

2. The voltage regulating module according to claim 1, characterized in that: The module body comprises a first heat-conducting layer and a second heat-conducting layer; The second heat-conducting layer is disposed on a second side surface of the module body away from the first side surface, and the first heat-conducting layer is connected between the power chip and the second heat-conducting layer.

3. The voltage regulating module according to claim 2, characterized in that: The first heat-conducting layer is arranged on a side of the power chip away from the module circuit board assembly.

4. The voltage regulating module according to claim 2 or 3, characterized in that: The first heat-conducting layer and / or the second heat-conducting layer is a metal layer.

5. The voltage regulating module according to any one of claims 1 to 4, characterized in that: An insulating protective layer is provided on a side of each power chip facing away from the module circuit board assembly.

6. The voltage regulating module according to any one of claims 1 to 5, characterized in that: At least one of the power chips is disposed on a side of the module circuit board assembly facing the first surface, and at least one of the power chips is disposed on a side of the module circuit board assembly facing the second surface.

7. The voltage regulating module according to any one of claims 1 to 6, characterized in that: The module circuit board assembly includes an inductor assembly and a module circuit board, wherein the inductor assembly is arranged on the module circuit board; the inductor assembly has a first pin and a second pin, wherein the first pin is connected to the power chip, and the second pin is connected to the pad at the first side.

8. The voltage regulating module according to any one of claims 1 to 7, characterized in that: The power chip is a driving metal oxide semiconductor field effect transistor power chip.

9. A packaging structure, characterized in that: It includes a packaging structure circuit board, a control chip installed on the packaging structure circuit board, and a voltage regulating module according to any one of claims 1 to 8, wherein the packaging structure circuit board has a mounting area for mounting the voltage regulating module, and the voltage regulating module is soldered to the mounting area through each of the solder pads.

10. An electronic device, characterized in that: The invention comprises a chip heat sink and the packaging structure as claimed in claim 9, wherein the chip heat sink is fixed to a side of the control chip of the packaging structure away from the circuit board of the packaging structure.

11. A method for manufacturing a voltage regulating module, characterized in that: The steps include: Providing a module circuit board assembly, the module circuit board assembly having two opposing surfaces; Disposing a power chip on at least one of the surfaces; Encapsulating the module circuit board assembly and the power chip to form a module body; The module body has a first surface, a second surface and a first side surface, the first surface and the second surface are opposite to each other along a first direction, the first side surface is connected between the first surface and the second surface, and the first direction is parallel to the first side surface; the module circuit board assembly is horizontally arranged between the first surface and the second surface, and any one of the power chips is arranged on the side of the module circuit board assembly facing the first surface or the side facing the second surface; The production method further comprises: A solder pad connected to the module circuit board assembly is disposed on the first side surface of the module body.

12. The manufacturing method according to claim 11, characterized in that: The encapsulation of the module circuit board assembly and the power chip to form a module body specifically includes: A second heat-conducting layer is disposed on a second side surface of the module body away from the first side surface; A first heat-conducting layer is disposed between the power chip and the second heat-conducting layer, and the first heat-conducting layer is connected between the power chip and the second heat-conducting layer.

13. The manufacturing method according to claim 12, characterized in that: The method of disposing a first heat-conducting layer between the power chip and the second heat-conducting layer and connecting the first heat-conducting layer between the power chip and the second heat-conducting layer specifically includes: The first heat-conducting layer is disposed on a side of the power chip facing away from the module circuit board assembly.

14. The production method according to any one of claims 11 to 13, characterized in that: The encapsulation of the module circuit board assembly and the power chip to form a module body specifically includes: An insulating protective layer is provided on a side of each power chip away from the module circuit board assembly.

15. The production method according to any one of claims 11 to 14, characterized in that: The step of arranging a power chip on at least one of the surfaces specifically includes: At least one of the power chips is disposed on a side of the module circuit board assembly facing the first surface, and at least one of the power chips is disposed on a side of the module circuit board assembly facing the second surface.

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