A flexible clamping mechanism and a cleaning device for glass microfluidic chip

Abstract

The present invention belongs to the technical field of clamps, and relates to a flexible clamping mechanism and a cleaning device for a glass microfluidic chip. The flexible clamping mechanism comprises a first clamping mechanism, a second clamping mechanism, and a composite linear motion mechanism. The first clamping mechanism comprises a positioning plate, a limiting component, a suction cup, and a suction piece. The limiting component is arranged on one side of the positioning plate. The limiting component has at least three limiting surfaces, wherein the three limiting surfaces are respectively perpendicular to an X-axis, a Y-axis, and a Z-axis. The three limiting surfaces are used to limit the glass microfluidic chip. The suction cup is arranged on a limiting surface perpendicular to the Z-axis. The suction cup is used to adsorb the glass microfluidic chip. The second clamping mechanism is used to clamp the positioning plate. The composite linear motion mechanism is used to drive the second clamping mechanism, the positioning plate, and the glass microfluidic chip to move, thereby ensuring the safety of the glass microfluidic chip during the cleaning process. The entire flushing process does not require experimenters to touch the chip, which can reduce the danger during the experiment.

Description

Technical Field

[0001] The invention belongs to the technical field of clamps, and in particular relates to a flexible clamping mechanism and a cleaning device for a glass microfluidic chip. Background Art

[0002] Microfluidic chip is also called microfluidic chip laboratory. Microfluidic chip is very small and is processed on a small piece of plexiglass. The pattern is generally composed of micron-scale microchannels and liquid storage tanks. Biological or chemical reactions can be completed on the chip. The reagents required for the reaction are precisely controlled by external devices, which can greatly improve the efficiency of reagent use.

[0003] Bonding is one of the most important processes in the manufacturing process of microfluidic chips. Bonding is a technology that directly combines two clean, atomically flat chip materials under certain conditions after surface cleaning and activation, and bonds the chips together through van der Waals forces, molecular forces, and even atomic forces. Excellent bonding technology can greatly improve the service life of microfluidic chips, increase chip reliability, and improve the pass rate of chip manufacturing.

[0004] Thin-walled parts have different boundary conditions, such as circular, curved, and rectangular. Different thin-walled parts are used under different conditions, but all thin-walled parts have a common feature, regardless of the size of the boundary, but the thickness is sometimes only a few millimeters. Thin-walled parts also have problems such as poor rigidity and difficulty in centering. The above methods are all aimed at thin-walled metal parts with more flexible gripping mechanisms, but there is no suitable gripping mechanism for thin-walled parts made of fragile materials such as glass, and most of the gripping mechanisms are fixed and cannot be moved.

[0005] The existing bonding methods of glass microfluidic chips have the following problems: 1. The glass microfluidic chip needs to be continuously cleaned with pure water during bonding to complete the pre-bonding of the glass microfluidic chip, but the entire process requires the experimenter to hold the glass microfluidic chip by hand to rinse it. 2. The etching of the glass microfluidic chip needs to be carried out in a strong acid solution, and there is a certain risk for the experimenter to grab it by hand. 3. The glass microfluidic chip is a fragile material, which can easily cause the chip to break and break during the bonding process. Summary of the invention

[0006] In view of this, the present invention provides a flexible clamping mechanism and a cleaning device for a glass microfluidic chip, which eliminates the need for manual hand-holding of the glass microfluidic chip, reduces the danger of the experimental process, and reduces the breakage and damage of the glass microfluidic chip during the cleaning process.

[0007] The technical solution of the present invention is:

[0008] The present invention provides a flexible clamping mechanism, comprising:

[0009] The first clamping mechanism comprises a first base, a positioning plate, a limiting assembly, and an adsorption assembly, wherein the first base is arranged on one side of the positioning plate, the limiting assembly is arranged on the other side of the positioning plate, the limiting assembly has at least three limiting surfaces, wherein three limiting surfaces are mutually perpendicular, and the plurality of limiting surfaces are used to limit the glass microfluidic chip; the adsorption assembly comprises a suction cup and a suction member, wherein the suction cup is arranged on one of the limiting surfaces, the suction cup is connected to the suction member, and the suction cup is used to adsorb the glass microfluidic chip;

[0010] The second clamping mechanism includes a second base, at least one pair of clamping plates, and a position adjustment component. The pair of clamping plates are relatively arranged on the second base. The position adjustment component is arranged between the clamping plates and the second base and is used to adjust the distance between the two relative clamping plates. The two relative clamping plates are used to clamp the first base.

[0011] Preferably, the limit block assembly includes a first limit block, two oppositely arranged second limit blocks, and a third limit block, the third limit block is arranged parallel to the positioning plate, the first limit block, the second limit block and the third limit block are perpendicular to each other, the first limit block and the second limit block are connected to the positioning plate through a guide structure, the third limit block is threadedly connected to the positioning plate for adjusting the height of the third limit block, and the suction cup is arranged on the third limit block.

[0012] Preferably, the guide structure includes a guide groove, a guide block, a positioning pin, and a first nut. The guide groove is opened on the positioning plate, and the guide block is slidably arranged in the guide groove. The length direction of the positioning pin is the same as the direction of the guide groove. The first limit block and the second limit block are both provided with positioning holes. The positioning pin is inserted into the corresponding positioning hole. The positioning pin is threadedly connected with a first nut, and the first nut is in contact with the corresponding first limit block or the second limit block.

[0013] Preferably, a plurality of support rods are arranged between the first base and the positioning plate, one end of the support rod is connected to the positioning plate, and the other end is connected to the positioning plate, and the suction member comprises a vacuum pump, and the vacuum pump is arranged between the first base and the positioning plate.

[0014] Preferably, a connecting plate is provided between the positioning plate and the support rod, a pipe is provided in the middle of the connecting plate, the pipe is used to connect the vacuum pump and the suction cup, a through hole is opened in the middle of the positioning plate, a bearing is provided in the through hole, and the pipe is passed through the bearing.

[0015] Preferably, a limiting groove is provided on the second base, and the clamping plate is slidably arranged in the limiting groove. The position adjustment assembly includes a threaded rod and a hand-held part. A threaded rod is provided on the side of the two clamping plates facing away from each other. One end of the threaded rod is connected to the second base, and the other end passes through the clamping plate. The threaded rod is threadedly connected to the hand-held part, and the hand-held part abuts against the clamping plate.

[0016] Preferably, it also includes a compound linear motion mechanism, which includes a first telescopic rod and a second telescopic rod, the first end of the first telescopic rod is fixedly connected to the second base, and the second end is fixed to the first end of the second telescopic rod, the telescopic direction of the first telescopic rod is parallel to the direction of the X-axis, and the telescopic direction of the second telescopic rod is parallel to the direction of the Z-axis.

[0017] Preferably, the compound linear motion mechanism also includes a lead screw, the direction of which is parallel to the direction of the Y-axis, a second nut being threadedly connected to the lead screw, the second nut being fixedly connected to the second end of the second telescopic rod, one end of the lead screw being connected to a motor, a guide rail parallel to the lead screw being provided on one side of the lead screw, and the second end of the second telescopic rod being slidably connected to the guide rail.

[0018] The present invention also provides a cleaning device for a glass microfluidic chip, the device comprising the above-mentioned flexible clamping mechanism.

[0019] Preferably, the device further comprises a workbench and a cleaning tank, wherein two sets of cleaning tanks are arranged side by side on the workbench, each set of cleaning tanks comprises a plurality of cleaning grids arranged in sequence, and each set of cleaning tanks is equipped with a set of the flexible clamping mechanism.

[0020] Compared with the prior art, the flexible clamping mechanism and the cleaning device for glass microfluidic chip provided by the present invention have the following beneficial effects:

[0021] The present invention sets a limit component, and multiple limit surfaces on the limit component limit the microfluidic chip, and then adsorbs the microfluidic chip through a suction cup, so as to fix the microfluidic chip. The clamping mechanism of the present invention does not require experimenters to touch the chip during the entire flushing process, which can reduce the danger during the experiment. The glass microfluidic chip is a fragile part. The use of the clamping mechanism of the present invention can improve the safety of the glass microfluidic chip during the cleaning process and can reduce the fracture and breakage of the glass microfluidic chip during the cleaning process. The use of the present invention can improve the efficiency of glass microfluidic chip manufacturing, save labor, and reduce experimental risks. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the overall structure of Example 1 of the present invention.

[0023] Figure 2 It is a schematic diagram of the first clamping mechanism of the present invention.

[0024] Figure 3 It is a cross-sectional view of the first clamping mechanism of the present invention.

[0025] Figure 4 Schematic diagram of the second clamping mechanism of the present invention.

[0026] Figure 5 This is a schematic diagram of the overall structure of Example 2 of the present invention.

[0027] Description of reference numerals:

[0028] 1-first clamping mechanism, 2-cleaning tank, 3-compound linear motion mechanism, 4-workbench, 5-guide rail, 6-screw, 7-first telescopic rod, 8 motor, 9-second telescopic rod, 10-second nut, 11-bearing seat, 12-suction cup, 13-positioning pin, 14-first limit block, 15-second limit block, 16-first nut, 17-suction piece, 19-positioning plate, 20-glass microfluidic chip, 21-first base, 22-bearing, 23-third limit block, 24-airway, 25-plywood, 26-threaded rod, 27-second base, 28-handheld part. DETAILED DESCRIPTION

[0029] It should be noted that, in the description of the present invention, the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0030] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0031] In addition, it should be noted that the connections involved in the present invention can be achieved by using conventional connection methods and do not involve any innovation.

[0032] The subject matter of the present invention is a flexible clamping mechanism and a cleaning device for a glass microfluidic chip. The microfluidic chip is also called a microfluidic chip laboratory. The microfluidic chip is very small and is processed on a very small piece of organic glass. The pattern is generally composed of micron-level microchannels and liquid storage tanks. Biological or chemical reactions can be completed on the chip, and the reagents required for the reaction are precisely controlled by external devices, which can greatly improve the efficiency of reagent use.

[0033] Bonding is one of the most important processes in the manufacturing process of microfluidic chips. Bonding is a technology that directly combines two clean, atomically flat chip materials under certain conditions after surface cleaning and activation, and bonds the chips together through van der Waals forces, molecular forces, and even atomic forces. Excellent bonding technology can greatly improve the service life of microfluidic chips, increase chip reliability, and improve the pass rate of chip manufacturing.

[0034] Thin-walled parts have different boundary conditions, such as circular, curved, and rectangular. Different thin-walled parts are used under different conditions, but all thin-walled parts have a common feature, regardless of the size of the boundary, but the thickness is sometimes only a few millimeters. Thin-walled parts also have problems such as poor rigidity and difficulty in centering. The above methods are all aimed at thin-walled metal parts with more flexible gripping mechanisms, but there is no suitable gripping mechanism for thin-walled parts made of fragile materials such as glass, and most of the gripping mechanisms are fixed and cannot be moved.

[0035] The existing bonding methods of glass microfluidic chips have the following problems: 1. The glass microfluidic chip needs to be continuously cleaned with pure water during bonding to complete the pre-bonding of the glass microfluidic chip, but the entire process requires the experimenter to hold the glass microfluidic chip by hand to rinse it. 2. The etching of the glass microfluidic chip needs to be carried out in a strong acid solution, and there is a certain risk for the experimenter to grab it by hand. 3. The glass microfluidic chip is a fragile material, which can easily cause the chip to break during the bonding process.

[0036] Based on the above reasons, the present invention provides a flexible clamping mechanism and a cleaning device for a glass microfluidic chip to solve the above-mentioned technical problems. Figures 1 to 5 , the present invention is described in detail.

[0037] Example 1

[0038] This embodiment provides a flexible clamping mechanism, including a first clamping mechanism 1 and a second clamping mechanism.

[0039] The first clamping mechanism 1 includes a first base 21, a positioning disk 19, a limiting assembly, and an adsorption assembly. The first base 21 is arranged on one side of the positioning disk 19, and the limiting assembly is arranged on the other side of the positioning disk 19. The limiting assembly has at least three limiting surfaces, wherein three limiting surfaces are perpendicular to each other, and the plurality of limiting surfaces are used to limit the glass microfluidic chip; the adsorption assembly includes a suction cup 12 and a suction member 17. The suction cup 12 is arranged on one of the limiting surfaces, and the suction cup 12 is connected to the suction member 17, and the suction cup 12 is used to adsorb the glass microfluidic chip. The second clamping mechanism includes a second base 27, at least a pair of clamps 25, and a position adjustment assembly. The pair of clamps 25 are relatively arranged on the second base 27, and the position adjustment assembly is arranged between the clamps 25 and the second base 27, and is used to adjust the distance between the two relative clamps 25, and the two relative clamps 25 are used to clamp the first base 21.

[0040] The microfluidic chip is limited by a plurality of limiting surfaces on the limiting component, and then the microfluidic chip is adsorbed by the suction cup, thereby fixing the microfluidic chip.

[0041] In this embodiment, the limiting assembly includes a first limiting block 14, two oppositely arranged second limiting blocks 15, and a third limiting block 23. The third limiting block 23 is arranged parallel to the positioning plate 19. The first limiting block 14, the second limiting block 15 and the third limiting block 23 are perpendicular to each other. The first limiting block 14 and the second limiting block 15 are connected to the positioning plate 19 through a guide structure.

[0042] In this embodiment, the guide structure includes a guide groove, a guide block, a positioning pin 13, and a first nut 16. The guide groove is opened on the positioning plate 19, and the guide block is slidably set in the guide groove. The length direction of the positioning pin 13 is the same as the direction of the guide groove. The first limit block 14 and the second limit block 15 are both provided with positioning holes, and the positioning pin 13 is inserted into the corresponding positioning hole. The positioning pin 13 is threadedly connected with a first nut 16, and the first nut 16 is in contact with the corresponding first limit block 14 or the second limit block 15.

[0043] The first limit block 14 and two oppositely arranged second limit blocks 15 on the positioning plate 19 can slide in the respective positioning pins 13 and the guide grooves on the surface of the positioning plate 19. The first limit block 14 and the second limit block 15 of the present invention can fix the position of the microfluidic chip by rotating the first nut 16 on the positioning pin 13, so as to achieve the purpose of limiting the X-axis and Y-axis directions of the microfluidic chip.

[0044] In this embodiment, the third limiting block 23 is threadedly connected to the positioning plate 19 , and the suction cup 12 is disposed on the third limiting block 23 .

[0045] The limitation in the Z-axis direction is achieved by the third limiting block 23 in the middle of the positioning disk 19. There is a thread at the bottom of the third limiting block 23, which is connected to the first base 21. By rotating the third limiting block 23, the position of chips of different thicknesses can be adjusted up and down, thereby achieving the purpose of limiting the movement of the microfluidic chip on the Z-axis.

[0046] In this embodiment, a plurality of support rods are arranged between the first base 21 and the positioning plate 19, one end of the support rods is connected to the positioning plate 19, and the other end is connected to the positioning plate 19, and the suction member 17 includes a vacuum pump, which is arranged between the first base 21 and the positioning plate 19. The first base 21 is a positioning block.

[0047] The suction cup 12 is fixed on the third limiting block 23 in the middle. There is an air chamber in the middle of the third limiting block 23, which is connected to the suction member 17 through the air channel 24 of the first base 21. The suction member 17 controls the suction cup 12 to adsorb the glass microfluidic chip.

[0048] In this embodiment, a limiting groove is provided on the second base 27, and the clamping plate 25 is slidably set in the limiting groove. A threaded rod 26 is provided on the side of the two clamping plates 25 facing away from each other. One end of the threaded rod 26 is connected to the second base 27, and the other end passes through the clamping plate 25. A hand-held part 28 is threadedly connected to the threaded rod 26, and the hand-held part 28 abuts against the clamping plate 25.

[0049] The second clamping mechanism of the present invention is a mechanism for clamping the first base 21, that is, the positioning block, and the clamping plate 25 is connected to the second base 27 through the threaded rod 26. When the second clamping mechanism clamps the positioning block, the handheld part 28 rotates on the threaded rod 26 to make the clamping plate clamp the positioning block.

[0050] In this embodiment, a connecting plate is provided between the positioning plate 19 and the support rod, a pipe is provided in the middle of the connecting plate, the pipe is used to connect the vacuum pump and the suction cup 12, a through hole is opened in the middle of the positioning plate 19, a bearing is provided in the through hole, and the pipe is passed through the inside of the bearing.

[0051] The positioning plate 19 and the first base 21 are connected via a bearing 22. When there is a position deviation when the suction cup fixes the microfluidic chip, the position can be adjusted by rotating the positioning plate.

[0052] In this embodiment, a compound linear motion mechanism 3 is also included. The compound linear motion mechanism 3 has a power output end, which is connected to the positioning disk 19. The compound linear motion mechanism 3 is used to drive the positioning disk 19 and the glass microfluidic chip to move.

[0053] The composite linear motion mechanism 3 includes a first telescopic rod 7 and a second telescopic rod 9. The first end of the first telescopic rod 7 is fixedly connected to the second base 27, and the second end is fixed to the first end of the second telescopic rod 9. The telescopic direction of the first telescopic rod 7 is parallel to the direction of the X axis, and the telescopic direction of the second telescopic rod 9 is parallel to the direction of the Z axis. Both the first telescopic rod 7 and the second telescopic rod 9 can be selected as cylinders.

[0054] In this embodiment, the compound linear motion mechanism 3 also includes a lead screw 6, the direction of the lead screw 6 is parallel to the direction of the Y-axis, a second nut 10 is threadedly connected to the lead screw 6, the second nut 10 is fixedly connected to the second end of the second telescopic rod 9, one end of the lead screw 6 is connected to the motor 8, and a guide rail 5 parallel to the lead screw 6 is provided on one side of the lead screw 6, and the second end of the second telescopic rod 9 is slidably connected to the guide rail 5.

[0055] The compound linear motion mechanism 3 is connected to the lead screw 6 through the second nut 10, and the compound linear motion mechanism 3 can slide left and right on the guide rail 5. One end of the lead screw 6 is connected to the bearing seat 11, and the other end is connected to the motor 8. The compound linear motion mechanism 3 uses the lead screw 6 and the guide rail 5 to drive the clamping system to make an overall forward and backward movement. The second clamping mechanism can move up and down through the extension and retraction of the second telescopic rod 9, and the second clamping mechanism can move forward and backward through the first telescopic rod 7. The present invention has two sets of clamping mechanisms and compound linear motion mechanisms, and the movement principle is the same.

[0056] Working principle of this embodiment

[0057] The composite linear motion mechanism of the present invention adopts a motion method of a lead screw plus a guide rail. Two sets of composite linear motion mechanisms are installed side by side on the bottom plate of the entire mechanism. One end of the lead screw is connected to a bearing seat, and the other end is driven to rotate by a motor, driving the second nut on the lead screw to move forward and backward. The other end of the second nut is connected to a longitudinal cylinder, driving the longitudinal cylinder to move forward and backward on the guide rail. The second clamping mechanism controls the positioning guide arm to move up and down to clamp the first clamping mechanism through the telescopic control of the longitudinal cylinder, and controls the left and right movement of the first clamping mechanism through the telescopic control of the transverse cylinder.

[0058] The clamping mechanism of the present invention needs to limit the chip in the X direction, Y direction, and Z direction. The clamping mechanism uses limit blocks in the X direction and Y direction, and uses a vacuum suction cup to limit the Z direction. Since the weight of glass is relatively light, the requirements for the vacuum system are very small, and a vacuum pump can be used to connect the suction cup through a pipeline to complete the adsorption of the glass sheet.

[0059] The X-axis and Y-axis directions of the microfluidic chip are limited by three sliding limit blocks on the positioning disk. A guide groove for the limit blocks to slide is processed on the positioning disk of the first clamping mechanism. The first limit block and the second limit block are connected to the positioning disk through threaded positioning pins and can slide on the positioning pins. When the first limit block and the second limit block are used to position the microfluidic chip, the position of the microfluidic chip can be fixed by rotating the nut on the positioning pin. The limitation in the Z-axis direction is completed by the third limit block in the middle of the positioning disk. There is a fixed suction cup on the third limit block. There are threads at the bottom of the third limit block, which is threaded with the positioning disk.

[0060] Example 2

[0061] Based on Example 1, this embodiment provides a cleaning device for a glass microfluidic chip, and the cleaning device includes the above-mentioned mechanical flexible clamping mechanism.

[0062] In this embodiment, the cleaning device also includes a workbench 4 and a cleaning tank 2. Two sets of cleaning tanks 2 are arranged side by side on the workbench 4. Each set of cleaning tanks 2 includes a plurality of cleaning grids arranged in sequence. Each set of cleaning tanks 2 is equipped with a set of mechanical flexible clamping mechanisms.

[0063] Two sets of cleaning tanks 2 are arranged side by side on the workbench 4 of the present invention, each row of cleaning tanks is divided into five grids, and each cleaning grid is equipped with a cleaning component 29. Under the action of the clamping mechanism and the composite linear motion mechanism, the microfluidic chip is cleaned grid by grid from one end of the cleaning tank. After the cleaning is completed, the chip is prepared for pre-bonding.

[0064] Working principle of this embodiment

[0065] Since the microfluidic chip bonding process requires two chips to be bonded, the two chips also need to be cleaned simultaneously during the cleaning process. In order to avoid collision between the two chips during movement, two sets of clamping mechanisms are designed, and cylinder lifting methods are used in the vertical and horizontal directions to achieve vertical and horizontal movement.

[0066] Since the etching of the glass microfluidic chip needs to be carried out in a strong acid solution, pure water is needed to clean the strong acid solution remaining on the surface after etching, and the whole experimental process is dangerous. The use of the present invention can reduce the danger in the experimental process, and the experimenter does not need to touch the chip during the entire rinsing process of the chip. Glass microfluidic chips are fragile parts. The use of the clamping mechanism of the present invention can improve the safety of glass microfluidic chips during the cleaning process, and can reduce the occurrence of fractures and breakages of glass microfluidic chips during the cleaning process. The use of the present invention can improve the efficiency of glass microfluidic chip manufacturing, save labor, and reduce experimental risks.

[0067] Aiming at the requirements of the microfluidic chip cleaning process and the glass microfluidic chip bonding, the flexible clamp designed by the present invention enables the microfluidic chip to be cleaned and bonded without manual clamping, and can be realized by using a mechanical structure.

[0068] The composite linear motion mechanism of the present invention needs to realize the up and down, left and right, front and back movements of the microfluidic chip during the cleaning process. Since the microfluidic chip needs to be transferred from one container to another during the cleaning process, a combination of a cylinder and a lead screw is adopted. However, considering that the pressure of the longitudinal cylinder during the movement is relatively large, a guide rail is introduced to help the longitudinal cylinder share the pressure, so the cylinder and the lead screw need to be designed.

[0069] The above disclosure is only a preferred specific embodiment of the present invention, but the embodiments of the present invention are not limited thereto, and any changes that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. A flexible clamping mechanism, characterized in that: include: A first clamping mechanism (1), comprising a first base (21), a positioning plate (19), a limiting assembly, and an adsorption assembly, wherein the first base (21) is arranged on one side of the positioning plate (19), the limiting assembly is arranged on the other side of the positioning plate (19), the limiting assembly has at least three limiting surfaces, wherein three limiting surfaces are mutually perpendicular, and the plurality of limiting surfaces are used to limit the glass microfluidic chip (20); the adsorption assembly comprises a suction cup (12) and a suction piece (17), wherein the suction cup (12) is arranged on one of the limiting surfaces, the suction cup (12) is connected to the suction piece (17), and the suction cup (12) is used to adsorb the glass microfluidic chip (20); A second clamping mechanism, comprising a second base (27), at least one pair of clamping plates (25), and a position adjustment component, wherein the pair of clamping plates (25) are relatively arranged on the second base (27), and the position adjustment component is arranged between the clamping plates (25) and the second base (27) and is used to adjust the distance between the two relatively clamping plates (25), and the two relatively clamping plates (25) are used to clamp the first base (21); The limiting assembly comprises a first limiting block (14), two second limiting blocks (15) arranged opposite to each other, and a third limiting block (23); the third limiting block (23) is arranged in parallel with the positioning plate (19); the first limiting block (14), the second limiting block (15) and the third limiting block (23) are perpendicular to each other; the first limiting block (14) and the second limiting block (15) are connected to the positioning plate (19) through a guide structure; the third limiting block (23) is threadedly connected to the positioning plate (19) for adjusting the height of the third limiting block (23); and the suction cup (12) is arranged on the third limiting block (23).

2. The flexible clamping mechanism according to claim 1, characterized in that: The guide structure comprises a guide groove, a guide block, a positioning pin (13), and a first nut (16); the guide groove is arranged on the positioning plate (19); the guide block is slidably arranged in the guide groove; the length direction of the positioning pin (13) is the same as the direction of the guide groove; the first limit block (14) and the second limit block (15) are both provided with positioning holes; the positioning pin (13) is inserted into the corresponding positioning hole; the positioning pin (13) is threadedly connected with a first nut (16); the first nut (16) contacts the corresponding first limit block (14) or the second limit block (15).

3. The flexible clamping mechanism according to claim 1, characterized in that: A plurality of support rods are arranged between the first base (21) and the positioning plate (19), one end of each support rod is connected to the positioning plate (19), and the other end of each support rod is connected to the positioning plate (19), and the suction member (17) comprises a vacuum pump, which is arranged between the first base (21) and the positioning plate (19).

4. The flexible clamping mechanism according to claim 3, characterized in that: A connecting plate is provided between the positioning plate (19) and the supporting rod, a pipe is provided in the middle of the connecting plate, the pipe is used to connect the vacuum pump and the suction cup (12), a through hole is opened in the middle of the positioning plate (19), a bearing is provided in the through hole, and the pipe is passed through the inside of the bearing.

5. The flexible clamping mechanism according to claim 1, characterized in that: A limiting groove is provided on the second base (27), and the clamping plate (25) is slidably arranged in the limiting groove. The position adjustment component comprises a threaded rod (26) and a hand-held portion (28). A threaded rod (26) is provided on the side of the two clamping plates (25) facing away from each other. One end of the threaded rod (26) is connected to the second base (27), and the other end passes through the clamping plate (25). The threaded rod (26) is threadedly connected with the hand-held portion (28), and the hand-held portion (28) abuts against the clamping plate (25).

6. The flexible clamping mechanism according to claim 1, characterized in that: The invention also comprises a compound linear motion mechanism (3), wherein the compound linear motion mechanism (3) comprises a first telescopic rod (7) and a second telescopic rod (9), wherein the first end of the first telescopic rod (7) is fixedly connected to the second base (27), and the second end is fixed to the first end of the second telescopic rod (9), the telescopic direction of the first telescopic rod (7) is parallel to the direction of the X-axis, and the telescopic direction of the second telescopic rod (9) is parallel to the direction of the Z-axis.

7. The flexible clamping mechanism according to claim 6, characterized in that: The composite linear motion mechanism (3) further comprises a lead screw (6), the direction of the lead screw (6) being parallel to the direction of the Y axis, a second nut (10) being threadedly connected to the lead screw (6), the second nut (10) being fixedly connected to the second end of the second telescopic rod (9), one end of the lead screw (6) being connected to a motor (8), a guide rail (5) being parallel to the lead screw (6) being provided on one side, and the second end of the second telescopic rod (9) being slidably connected to the guide rail (5).

8. A cleaning device for a glass microfluidic chip, characterized in that: The device comprises the flexible clamping mechanism described in any one of claims 1-7.

9. The cleaning device for glass microfluidic chip according to claim 8, characterized in that: The device also comprises a workbench (4) and a cleaning tank (2). Two sets of cleaning tanks (2) are arranged side by side on the workbench (4). Each set of cleaning tanks (2) comprises a plurality of cleaning grids arranged in sequence. Each set of cleaning tanks (2) is equipped with a set of the flexible clamping mechanism.

Images