Wafer defect detection device and detection method

Abstract

The present invention relates to the field of detection technology, and discloses a wafer defect detection device and a detection method. The detection device includes: a detection table, having a lifting slot arranged concavely relative to the table top; a detection signal transmitter, fixed above the detection table through a gantry; a detection spacing adjustment device, arranged in the lifting slot and capable of longitudinal movement in the Z-axis direction relative to the table top; a detection signal receiver, fixed on the detection spacing adjustment device; a motion platform, arranged on the table top, including a first motion component that moves in the X-axis direction relative to the table top and a second motion component arranged on the first motion component and moves in the Y-axis direction relative to the table top; a detection turntable, used for adsorbing and fixing the wafer, the detection turntable is fixed on the second motion component and provides rotation in the Z-axis direction, and the center thereof has a detection channel extending in the Z-axis direction. The present invention has the advantages of accurate detection and high detection efficiency.

Description

Technical Field

[0001] The present invention relates to the field of detection technology, and in particular to a wafer defect detection device and a detection method. Background Art

[0002] In the production process of semiconductor wafers, it is necessary to go through processes such as cutting the crystal rod into slices, grinding, and polishing. In each process, scratches, small pits, bubbles and other defects may occur due to various factors. Therefore, the finished wafers must be inspected to prevent wafers with surface defects from flowing into the next stage.

[0003] The existing technology usually uses machine vision to collect wafer images, use algorithms to analyze images and measure defects, and can achieve non-contact, long-term, fast online defect detection. However, the machine vision detection method can only identify one surface of the wafer, and the wafer needs to be flipped to identify the second surface. There is a deviation in the position of the wafer before and after flipping, resulting in inaccurate detection results. At the same time, it is currently limited in actual use by detection efficiency and there are few available defect detection algorithms, making it difficult to improve the accuracy and comprehensiveness of defect detection. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a wafer defect detection device and a corresponding detection method with accurate detection and high detection efficiency.

[0005] The present invention provides a wafer defect detection device, comprising:

[0006] A testing table, the table top of which has a concave lifting groove;

[0007] The detection signal transmitter is fixed above the detection table through the gantry;

[0008] The detection spacing adjustment device is arranged in the lifting slot and can move longitudinally in the Z-axis direction relative to the table;

[0009] A detection signal receiver is fixed on the detection distance adjustment device and adjusts the detection distance between the detection signal transmitter and the detection signal receiver through the detection distance adjustment device;

[0010] The motion platform is arranged on the table, and comprises a first motion component that moves in the X-axis direction relative to the table, and a second motion component that is arranged on the first motion component and moves in the Y-axis direction relative to the table;

[0011] The detection turntable is used for adsorbing and fixing the wafer. The detection turntable is fixed on the second motion component and provides rotation in the Z-axis direction. The center of the detection turntable is provided with a detection channel extending in the Z-axis direction.

[0012] Preferably, the detection turntable comprises:

[0013] An annular housing having an integral structure with the second moving component;

[0014] A spindle disposed in an annular housing via a bearing;

[0015] An annular rotating motor disposed between the core shaft and the annular housing;

[0016] A carrier plate fixedly connected to the mandrel, the carrier plate having an adsorption structure to adsorb and fix the wafer;

[0017] The detection channel is formed by a through groove penetrating the carrier plate and the core shaft along the Z-axis direction.

[0018] Preferably, the adsorption structure includes a plurality of air holes distributed in a circumference on the carrier plate, and a negative pressure air source for providing negative pressure to the air holes to generate adsorption force.

[0019] Preferably, the detection interval adjustment device comprises:

[0020] A slot seat sleeve fixed in the lifting slot;

[0021] A lifting platform for fixing a detection signal receiver is arranged in the groove seat sleeve;

[0022] A third linear motor is arranged between the slot seat sleeve and the first vertical side surface of the lifting platform to drive the lifting platform to perform linear lifting motion in the Z-axis direction relative to the slot seat sleeve;

[0023] The cylinder used for keeping the lifting platform in the Z-axial position is fixed at the bottom of the groove seat sleeve, and the push rod of the cylinder is connected with the second vertical side surface of the lifting platform through a hinge structure.

[0024] Preferably, the first motion component comprises:

[0025] Two first support beams extending in the Y-axis direction and spaced apart from each other;

[0026] A first connecting beam connected to first ends of the two first support beams;

[0027] a support plate fixed to the second ends of the two first support beams;

[0028] Two first linear motors, first motor movers of the two first linear motors are respectively fixed between the first ends and the second ends of the two first support beams, and first motor stators of the two first linear motors are respectively fixed on the table surface of the detection table.

[0029] Preferably, the second motion component comprises:

[0030] A movable bracket is located between the two first bracket beams, and two opposite sides of the movable bracket are connected with the two first bracket beams by sliding fit;

[0031] The second linear motor is used to drive the movable bracket to perform Y-axis motion. The second linear motor includes a second motor mover fixedly connected to the movable bracket and a second motor stator used to drive the second motor mover. The second motor stator is fixed on the support plate.

[0032] Preferably, the second motion component further comprises:

[0033] A bracket wing plate fixedly connected to one end of the mobile bracket, the bracket wing plate being located above the support plate;

[0034] An end plate is extended downward from the bracket wing plate, and the second motor mover is fixed on the vertical side surface of the end plate.

[0035] Preferably, the support plate and the second motor stator are offset relative to the detection turntable as a whole, so that the orthographic projection of the support plate and the second motor stator in the Z-axial plane does not overlap with the orthographic projection of the detection turntable in the Z-axial plane.

[0036] Preferably, the second motor mover and the end plate as a whole have a preset angle between the geometric midline in the linear motion direction of the second motor mover and the Y-axis direction between them between 0.1-2°, so that the geometric midline is on the same straight line as the center of mass determined by the geometric center of the detection turntable.

[0037] The present invention also discloses a wafer defect detection method, which is implemented based on the wafer defect detection device, and includes:

[0038] The wafer is adsorbed and fixed on the inspection turntable and is located in the inspection channel;

[0039] Move the wafer to the preset inspection position based on the motion platform and the inspection turntable;

[0040] Based on the detection spacing, the position of the detection signal receiver in the Z-axis direction is adjusted by the detection spacing adjustment device;

[0041] The detection signal is generated by the detection signal transmitter, and the detection signal is received by the detection signal receiver after passing through the wafer to generate a detection result for evaluating the wafer defects.

[0042] Compared with the prior art, the present invention has the following beneficial effects:

[0043] The present invention can accurately move the wafer adsorbed and fixed on the detection turntable to a preset detection position through the coordinated cooperation of the motion platform and the detection turntable, which is beneficial to improving the detection accuracy; and through the detection channel of the detection turntable, the two side surfaces of the wafer can be detected at one time, which is beneficial to improving the detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 It is a schematic diagram of the three-dimensional structure of the wafer defect detection equipment of the present invention.

[0045] Figure 2 It is a three-dimensional structural schematic diagram of the detection spacing adjustment device.

[0046] Figure 3 It is a schematic diagram of the partially cutaway structure of the detection turntable.

[0047] Figure 4 It is a schematic diagram of the three-dimensional structure of the wafer defect detection equipment of the present invention when the gantry is omitted.

[0048] Figure 5 It is one of the three-dimensional structural schematic diagrams in which the detection turntable is integrated on the first motion component through the second motion component.

[0049] Figure 6 This is the second schematic diagram of the three-dimensional structure in which the detection turntable is integrated on the first motion component through the second motion component.

[0050] Figure 7 It is a partial three-dimensional structural schematic diagram of the first motion component.

[0051] Figure 8 It is a schematic diagram of the three-dimensional structure in which the detection turntable is fixed on the second motion component. DETAILED DESCRIPTION

[0052] In order to further explain the technical means and effects adopted by the present application to achieve the predetermined purpose, the specific implementation methods, structures, features and effects of the present application are described in detail below in conjunction with the accompanying drawings and preferred embodiments. In the following description, different "one embodiment" or "embodiment" does not necessarily refer to the same embodiment. In addition, specific features, structures, or characteristics in one or more embodiments may be combined in any suitable form.

[0053] The invention discloses a wafer defect detection device, aiming to improve the accuracy and efficiency of wafer defect detection in a wafer manufacturing process.

[0054] Combination Figure 1-Figure 8 As shown, the detection equipment specifically includes a detection platform 1, a detection signal transmitter, a motion platform, a detection turntable 6, a detection signal receiver and a detection interval adjustment device 8.

[0055] The detection table 1 has a lifting groove 10 which is recessed relative to the table top, and the lifting groove 10 is used to provide an accommodation space for the detection spacing adjustment device 8; the detection signal transmitter is fixed above the detection table 1 through a gantry 9; the detection spacing adjustment device 8 is arranged in the lifting groove 10 and can perform longitudinal movement in the Z-axis direction relative to the table top; the detection signal receiver is fixed on the detection spacing adjustment device 8 and the detection spacing between the detection signal transmitter and the detection signal receiver is adjusted by the detection spacing adjustment device 8; the motion platform is arranged on the table top, including a first motion component 2 which performs X-axis movement relative to the table top and a second motion component 4 which is arranged on the first motion component and performs Y-axis movement relative to the table top; the detection turntable 6 is used to adsorb and fix the wafer, the detection turntable is fixed on the second motion component 4 and provides rotation in the Z-axis direction, and the center thereof has a detection channel extending in the Z-axis direction, so that the detection signal can pass through the wafer and be transmitted from the detection channel to the detection signal receiver.

[0056] The wafer to be inspected is fixed on the inspection turntable. After the wafer is moved to a preset inspection position based on the motion platform and the inspection turntable, the inspection distance between the inspection signal transmitter and the inspection signal receiver is adjusted by the inspection distance adjustment device 8. The inspection signal transmitter generates a inspection signal, which is received by the inspection signal receiver after passing through the wafer to generate an inspection result for evaluating wafer defects.

[0057] See Figure 2 In the preferred embodiment shown, the detection distance adjustment device 8 is designed as an integral module, so that the detection distance adjustment device 8 can be fixedly assembled into the lifting slot 10 as a whole, and it is also convenient for later disassembly and maintenance.

[0058] Specifically, the detection spacing adjustment device 8 includes: a slot seat sleeve 81 fixed in the lifting slot 10; a lifting platform 82 for fixing the detection signal receiver, and the lifting platform 82 is slidably arranged in the slot seat sleeve 81; a third linear motor arranged between the slot seat sleeve 81 and the first vertical side surface of the lifting platform 82 to drive the lifting platform 82 to perform linear lifting movement in the Z-axis direction relative to the slot seat sleeve 81; a cylinder 87 for maintaining the lifting platform 82 in the Z-axial position, the cylinder 87 is fixed at the bottom of the slot seat sleeve 81, and the push rod of the cylinder 87 is connected to the second vertical side surface of the lifting platform 82 through a hinge structure 88.

[0059] There are two third linear motors, which are extended in the Z-axis direction. The two third linear motors are respectively arranged between the slot seat sleeve 81 and the lifting platform 82 at two opposite first vertical side surfaces. The third motor mover 83 of the third linear motor is fixed to the first vertical side surface of the lifting platform 82, and the third motor stator 84 of the third linear motor is fixed to the corresponding inner wall of the slot seat sleeve 81.

[0060] In order to improve the movement accuracy of the detection spacing adjustment device 8 in the Z-axis direction during the detection spacing adjustment process, a sliding matching structure is provided on both sides of each third linear motor, and the sliding matching structure includes: a third slide rail 85 fixed on the first vertical side surface of the lifting platform 82, and a third slide seat 86 fixed on the corresponding inner wall of the groove seat sleeve 81. The third slide rail 85 is connected to the third slide seat 86 in a sliding matching manner.

[0061] After the lifting platform 82 is driven by the third linear motor to move up and down in the Z-axis direction to a preset height position determined by a preset detection interval, the cylinder 87 is activated to change the stroke of the push rod of the cylinder 87 accordingly, so that the lifting platform 82 can be fixed and maintained at the preset height position in the Z-axis direction by the cylinder 87, and the third linear motor stops working.

[0062] See Figure 3 As shown, the detection turntable 6 is used to fix the wafer and rotate the orientation of the wafer as needed so that the wafer can be accurately moved to the preset detection position. The detection turntable includes: an annular shell 61 that is an integral structure with the second motion component 4; a core shaft 62 arranged in the annular shell 61 through a bearing 63; an annular rotating motor arranged between the core shaft 62 and the annular shell 61, including a circular motor mover 64 fixed on the outer side of the core shaft 62 and a circular motor stator 65 fixed on the inner wall of the annular shell 61, and the circular motor mover 64 is driven by the circular motor stator 65 to drive the core shaft 62 to rotate relative to the annular shell 61 according to the bearing 63; a carrier plate 66 fixedly connected to the core shaft 62, and the carrier plate 66 has an adsorption structure to adsorb and fix the wafer; wherein the detection channel is formed by a through groove that penetrates the carrier plate 66 and the core shaft 62 along the Z-axis direction.

[0063] In one embodiment, the adsorption structure includes a plurality of air holes circumferentially distributed on the carrier plate 66, and a negative pressure air source for providing negative pressure to the air holes to generate adsorption force. When the wafer is placed on the carrier plate 66, the air holes blocked by the wafer generate negative pressure suction to adsorb and fix the wafer.

[0064] Among them, the motion platform is used to transport the detection turntable carrying the wafer to the preset detection position. However, due to the limited accuracy of the motion platform, the detection turntable may also need to rotate the wafer at an appropriate azimuth angle so that the wafer can be moved to the preset detection position where it can be detected.

[0065] The detection position can be determined by any existing means. For example, an electron microscope is arranged on the gantry 9, and after the motion platform moves to the central axis of the detection channel, the detection signal transmitter and the detection signal receiver are in the same straight line, the annular rotary motor is controlled to drive the carrier plate 66 to rotate until the identification point (Mark point) on the wafer can be identified by the electron microscope and the rotation stops, indicating that the wafer has been accurately moved to the preset detection position through the cooperation of the motion platform and the detection turntable.

[0066] Further integration Figure 4-Figure 8 As shown, the first motion component 2 mainly provides X-axis linear movement for the detection turntable during the movement to the preset detection position through the second motion component 4. The first motion component 2 specifically includes: two first support beams 21 running in the Y-axis direction and spaced apart; a first connecting beam 22 connected to the first ends of the two first support beams 21; a support plate 24 fixed to the second ends of the two first support beams 21, and one end of the support plate 24 can also be fixed by a second connecting beam 23 connected to the second ends of the two first support beams 21; two first linear motors, the first motor movers 31 of the two first linear motors are respectively fixed between the first ends and the second ends of the two first support beams 21, and the first motor stators 32 of the two first linear motors are respectively fixed to the table surface of the detection table 1.

[0067] In order to improve the accuracy of the X-axis movement of the first motion component 2 relative to the table top of the detection table 1 and to meet the need for rapid linear movement, a plurality of first slides 13 are fixed on the first support beam 21, and a first slide rail 12 arranged in the X-axis direction is fixed on the table top of the detection table 1. The first slide rail 12 is connected to the first slide 13 in a sliding manner.

[0068] The second motion assembly 4 is used to provide the detection turntable with Y-axis linear movement during the movement to the preset detection position. The second motion assembly 4 includes: a moving bracket 41 located between the two first bracket beams 21, and the two opposite sides of the moving bracket 41 are connected with the two first bracket beams 21 by sliding fit; a second linear motor for driving the moving bracket 41 to perform Y-axis movement, the second linear motor includes a second motor mover 51 fixedly connected to the moving bracket 41 and a second motor stator 52 for driving the second motor mover 51, and the second motor stator 52 is fixed on the support plate 24.

[0069] In order to improve the movement accuracy of the second moving component 4, second slide rails 45 are respectively provided on the inner walls of the two first bracket beams 21, and second slide seats 46 are respectively provided on two opposite sides of the movable bracket 41. The second slide seats 46 are slidably connected to the second slide rails 45.

[0070] In order to meet the requirements of the movement stroke of the second linear motor and to facilitate the installation of the second motor mover 51, the second movement component 4 also includes: a bracket wing 42 fixedly connected to one end of the movable bracket 41, the bracket wing 42 is located above the support plate 24; an end plate 43 extending downward from the bracket wing 42, the second motor mover 51 is fixed on the vertical side surface of the end plate 43, so that the second motor mover 51 forms a driving cooperation relationship with the second motor stator 52 fixed on the support plate 24.

[0071] Furthermore, in the process of linear motion of the second motion component 4 in the Y-axis direction, in order to avoid changes in the relative positions of the support plate 24 and the second motor stator 52 as a whole and the detection turntable, and in order to avoid collision and interference between the support plate 24 and the second motor stator 52 as a whole and the detection turntable, the support plate 24 and the second motor stator 52 are offset as a whole relative to the detection turntable, so that the orthographic projection of the support plate 24 and the second motor stator 52 in the Z-axial plane does not overlap with the orthographic projection of the detection turntable in the Z-axial plane.

[0072] Since the second motor stator 52 is offset relative to the detection turntable, the driving force of the second linear motor may generate a torsional torque on the detection turntable, causing the detection turntable to twist and affecting the detection accuracy. For this reason, the second motor mover 51 and the end plate 43 of the present invention are arranged as a whole on the geometric center line of the second motor mover 51 in the linear motion direction, with a preset angle of 0.1-2° with the Y-axis direction, so that the geometric center line and the center of mass determined by the geometric center of the detection turntable are on the same straight line, thereby eliminating the torsional torque that the second linear motor may generate on the detection turntable by eliminating the distance between the driving force of the second linear motor and the center of mass of the detection turntable in the Z-axis direction.

[0073] A wafer defect detection method disclosed in the present invention is implemented based on the above-mentioned wafer defect detection equipment, including: adsorbing and fixing the wafer on a detection turntable and locating it in a detection channel; moving the wafer to a preset detection position based on a motion platform and a detection turntable; adjusting the position of a detection signal receiver in the Z-axis direction through a detection spacing adjustment device 8 based on a detection spacing; a detection signal is generated by a detection signal transmitter, and the detection signal is received by a detection signal receiver after passing through the wafer to generate a detection result for evaluating wafer defects.

[0074] For example, the detection signal transmitter is an X-ray generator, and the detection signal receiver is an X-ray receiver. After the X-ray generator emits X-rays that pass through the wafer on the detection turntable, the X-rays are received by the X-ray receiver to generate a detection result for evaluating wafer defects.

[0075] Among them, any existing implementation means can be used to evaluate wafer defects using X-ray detection results. For example, the results received by the X-ray receiver are compared and analyzed with a preset model to determine the defects of the wafer.

[0076] In addition, the size of the image after the X-ray receiver receives the X-ray depends on the distance ratio between the X-ray generator and the wafer. The magnification ratio M = SDD / SOD, SDD is the straight-line distance between the X-ray generator and the wafer, and SOD is the straight-line distance between the X-ray generator and the X-ray receiver. Therefore, in order to meet the imaging needs of the detection results to determine the preset detection interval, the detection interval adjustment device 8 is used to move in the Z-axis direction to change the position of the X-ray receiver, thereby changing the distance between the X-ray generator and the X-ray receiver to meet the distance ratio required for imaging.

[0077] Of course, when the wafers are of different sizes, the wafers can be inspected by one X-ray imaging or multiple X-ray imaging on the carrier plate 66. When multiple X-ray imaging tests are required: the wafer is planned to be a number of detection ranges, and the multiple detection ranges are arranged in a matrix and recorded as N*M, where N and M are both natural numbers greater than 1; the detection is started by moving the platform to the position of the detection range 1*1, and then the first motion component 2 provides X-axis movement to the position of 1*2 for detection, and so on until the detection of 1*M is completed; when the detection of 1*M is completed, the second motion component 4 provides Y-axis movement to the position of the detection range 2*1, and the detection is carried out from the detection range 2*1 to the detection range 2*M in sequence; this step is repeated until the detection of the detection range N*M is completed.

[0078] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A wafer defect detection device, characterized in that: include: A testing platform (1), wherein the surface of the testing platform (1) has a lifting groove (10) which is arranged concavely; A detection signal transmitter is fixed above the detection platform (1) via a gantry (9); A detection spacing adjustment device (8) is arranged in the lifting slot (10) and can move longitudinally in the Z-axis direction relative to the table; A detection signal receiver, fixed on the detection distance adjustment device (8) and adjusting the detection distance between the receiver and the detection signal transmitter through the detection distance adjustment device (8); A motion platform is arranged on a table top, comprising a first motion component (2) that moves relative to the table top in an X-axis direction and a second motion component (4) that is arranged on the first motion component and moves relative to the table top in a Y-axis direction; The detection turntable (6) is used for adsorbing and fixing the wafer. The detection turntable is fixed on the second motion component (4) and is provided to rotate in the Z-axis direction. The detection turntable has a detection channel extending in the Z-axis direction in the middle. The detection turntable comprises: an annular shell (61) which is an integral structure with the second motion component (4); a core shaft (62) arranged in the annular shell (61) through a bearing (63); an annular rotating motor arranged between the core shaft (62) and the annular shell (61); a carrier plate (66) fixedly connected to the core shaft (62), the carrier plate (66) having an adsorption structure for adsorbing and fixing the wafer; wherein the detection channel is formed by a through groove that penetrates the carrier plate (66) and the core shaft (62) along the Z-axis direction; The detection spacing adjustment device (8) comprises: a slot seat sleeve (81) fixed in the lifting slot (10); a lifting platform (82) for fixing the detection signal receiver, arranged in the slot seat sleeve (81); a third linear motor arranged between the slot seat sleeve (81) and the first vertical side surface of the lifting platform (82), so as to drive the lifting platform (82) to perform linear lifting movement in the Z-axis direction relative to the slot seat sleeve (81); a cylinder (87) for maintaining the lifting platform (82) in the Z-axis direction, fixed at the bottom of the slot seat sleeve (81), and a push rod of the cylinder (87) connected to the second vertical side surface of the lifting platform (82) via a hinge structure (88); The first motion component (2) comprises: two first support beams (21) arranged in a Y-axis direction and spaced apart; a first connecting beam (22) connected to the first ends of the two first support beams (21); a supporting plate (24) fixed to the second ends of the two first support beams (21); two first linear motors, the first motor movers (31) of the two first linear motors being respectively fixed between the first ends and the second ends of the two first support beams (21); and the first motor stators (32) of the two first linear motors being respectively fixed to the table top of the detection table (1); The second motion assembly (4) comprises: a movable bracket (41) located between the two first bracket beams (21), wherein two opposite sides of the movable bracket (41) are connected to the two first bracket beams (21) in a sliding manner; and a second linear motor for driving the movable bracket (41) to perform Y-axis motion, wherein the second linear motor comprises a second motor mover (51) fixedly connected to the movable bracket (41) and a second motor stator (52) for driving the second motor mover (51), wherein the second motor stator (52) is fixed on the support plate (24).

2. The wafer defect detection device according to claim 1, characterized in that: The adsorption structure comprises a plurality of air holes which are circumferentially distributed on the object carrier plate (66), and a negative pressure air source for providing negative pressure to the air holes to generate an adsorption force.

3. The wafer defect detection device according to claim 1, characterized in that: The second motion assembly (4) further comprises: A bracket wing plate (42) fixedly connected to one end of the movable bracket (41), the bracket wing plate (42) being located above the support plate (24); An end plate (43) is extended downward from the bracket wing plate (42), and a second motor mover (51) is fixed to a vertical side surface of the end plate (43).

4. The wafer defect detection device according to claim 3, characterized in that: The support plate (24) and the second motor stator (52) are offset relative to the detection turntable as a whole, so that the orthographic projections of the support plate (24) and the second motor stator (52) in the Z-axial plane do not overlap with the orthographic projection of the detection turntable in the Z-axial plane.

5. The wafer defect detection device according to claim 4, characterized in that: The second motor mover (51) and the end plate (43) as a whole have a preset angle of 0.1-2° between the geometric center line of the second motor mover (51) in the linear motion direction and the Y-axis direction, so that the geometric center line and the center of mass determined by the geometric center of the detection turntable are on the same straight line.

6. A wafer defect detection method, implemented based on the wafer defect detection device according to any one of claims 1 to 5, comprising: The wafer is adsorbed and fixed on the inspection turntable and is located in the inspection channel; Move the wafer to the preset inspection position based on the motion platform and the inspection turntable; Based on the detection spacing, the position of the detection signal receiver in the Z-axis direction is adjusted by a detection spacing adjustment device (8); The detection signal is generated by the detection signal transmitter, and the detection signal is received by the detection signal receiver after passing through the wafer to generate a detection result for evaluating the wafer defects.

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