Process parameter monitoring method and upper computer

Abstract

The invention provides a process parameter monitoring method and an upper computer, and the method comprises the steps: obtaining a current value of an index object, the current value of the index object is used for representing a process formula corresponding to a current process step, and the current value is updated to the index object when a target process chamber of semiconductor process equipment enters the current process step; determining parameter information of a current to-be-monitored parameter based on the current value of the index object, the parameter information of the current to-be-monitored parameter comprising a parameter value of the current to-be-monitored parameter and a value interval of the current to-be-monitored parameter; the monitoring result of the target process chamber at the current moment is obtained based on the parameter value of the current to-be-monitored parameter and the value interval of the current to-be-monitored parameter, so that when the process step executed by the target process chamber is updated, the to-be-monitored parameter and the value interval of the to-be-monitored parameter can be adjusted in real time; real-time accurate monitoring of the process parameters of the target process chamber is realized, and then the process processing quality of the semiconductor process equipment is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a process parameter monitoring method and a host computer. Background Art

[0002] With the continuous advancement of semiconductor technology, the requirements for the process quality of semiconductor process equipment are becoming higher and higher, and the stability and accuracy of process parameters are important factors to ensure the quality of process. Therefore, in the process of semiconductor process equipment executing the process, the process parameters need to be monitored.

[0003] In order to improve equipment production efficiency, and reduce equipment costs and equipment space, semiconductor process equipment is usually provided with an integrated process chamber, which is compatible with a variety of processes. However, when the integrated process chamber performs different processes, the process parameters that need to be monitored and / or the value ranges of the process parameters that need to be monitored are different. At present, it is impossible to adjust the monitored process parameters and the value ranges of the process parameters in real time according to the process performed by the integrated process chamber, so that the process parameters of the integrated process chamber cannot be accurately monitored in real time, and the process quality of the semiconductor process equipment cannot be guaranteed. Summary of the invention

[0004] In order to solve the above technical problems, the present application provides a process parameter monitoring method and a host computer to solve the problem in the prior art that the process parameters of the integrated process chamber cannot be accurately monitored in real time.

[0005] To achieve the above technical objectives, the present application provides the following technical solutions:

[0006] In a first aspect, an embodiment of the present specification provides a process parameter monitoring method, comprising:

[0007] Acquire a current value of an index object, wherein the current value of the index object is updated to the index object when a target process chamber of a semiconductor process equipment enters a current process step, and the current value of the index object is used to characterize a process recipe corresponding to the current process step;

[0008] Based on the current value of the index object, determining parameter information of the current parameter to be monitored, wherein the parameter information of the current parameter to be monitored includes the parameter value of the current parameter to be monitored and the value range of the current parameter to be monitored;

[0009] Based on the parameter value of the current parameter to be monitored and the value range of the current parameter to be monitored, a monitoring result of the target process chamber at the current moment is obtained.

[0010] In one implementation, determining parameter information of the current parameter to be monitored based on the current value of the index object includes:

[0011] Based on the current value of the index object, determine a target packaging class object from a plurality of candidate packaging class objects, the plurality of candidate packaging class objects corresponding to a plurality of candidate process recipes, the candidate packaging class objects being used to obtain parameter information of a required monitoring parameter under the corresponding candidate process recipe when called;

[0012] By calling the target encapsulation class object, the parameter information of the required monitoring parameters under the process recipe corresponding to the current process step is obtained, and the parameter information of the required monitoring parameters under the process recipe corresponding to the current process step is used as the parameter information of the current parameter to be monitored.

[0013] In one embodiment, the candidate encapsulation class object is created by the following method:

[0014] When the creation condition of the encapsulation class object is met, obtaining a label set at the current moment and a current value of a configuration parameter associated with the label, wherein the label is used to characterize the candidate process recipe;

[0015] Based on the current value of the configuration parameter associated with the tag, a candidate package class object corresponding to the candidate process recipe represented by the tag is created.

[0016] In one embodiment, the configuration parameters include a data channel of the demand monitoring parameter and a data channel of the value interval of the demand monitoring parameter, the data channel of the demand monitoring parameter is used to obtain the parameter value of the demand monitoring parameter, and the data channel of the value interval of the demand monitoring parameter is used to obtain the value interval of the demand monitoring parameter;

[0017] The step of creating a candidate packaging class object corresponding to the candidate process recipe represented by the tag based on the current value of the configuration parameter associated with the tag comprises:

[0018] Based on the parameter identification information of each of the configuration parameters and the current value of each of the configuration parameters, create each variable in the candidate encapsulation class object;

[0019] Predetermined variables among the variables of the candidate encapsulation class object are used as the parameters of the candidate encapsulation class object, and the predetermined variables include variables corresponding to the data channel of the demand monitoring parameter and variables corresponding to the data channel of the value range of the demand monitoring parameter.

[0020] In one embodiment, after creating each variable in the candidate encapsulation class object based on the parameter identification information of each configuration parameter and the current value of each configuration parameter, the method further includes:

[0021] The attributes of each of the predetermined variables are configured as private attributes, and a public value-taking method for each of the predetermined variables is created.

[0022] In one embodiment, after creating a candidate packaging class object corresponding to the candidate process recipe represented by the tag based on the current value of the configuration parameter associated with the tag, the method further includes:

[0023] A target correspondence relationship is created, where the target correspondence relationship includes a correspondence relationship between the label and the candidate encapsulation class object.

[0024] In one implementation, determining a target encapsulation class object from a plurality of candidate encapsulation class objects based on the current value of the index object includes:

[0025] Matching the current value of the index object with each label in the target correspondence;

[0026] When the current value of the index object successfully matches the label in the target corresponding relationship, the candidate encapsulation class object corresponding to the successfully matched label in the target corresponding relationship is used as the target encapsulation class object.

[0027] In one embodiment, it further includes:

[0028] When the current value of the index object fails to match each label in the target corresponding relationship, the monitoring result of the target process chamber at the current moment is set to empty.

[0029] In a second aspect, an embodiment of the present specification provides a host computer, including at least one processor and at least one memory, wherein the memory stores a computer program, and when the computer program is executed by the processor, the process parameter monitoring method as described in any one of the above items is implemented.

[0030] In a third aspect, an embodiment of the present specification provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the process parameter monitoring method as described in any one of the above items is implemented.

[0031] In a fourth aspect, an embodiment of the present specification provides a computer program product or a computer program, wherein the computer program product includes a computer program, and the computer program is stored in a computer-readable storage medium; the processor of the computer device reads the computer program from the computer-readable storage medium, and when the processor executes the computer program, it implements the process parameter monitoring method as described in any one of the above items.

[0032] It can be seen from the above technical solution that the embodiment of the present application provides a process parameter monitoring method and a host computer, wherein the process parameter monitoring method obtains the current value of the index object, the current value of the index object is updated to the index object when the target process chamber of the semiconductor process equipment enters the current process step, the current value of the index object is used to characterize the process recipe corresponding to the current process step, and the parameter information of the current parameter to be monitored is determined based on the current value of the index object, the parameter information of the current parameter to be monitored includes the parameter value of the current parameter to be monitored and the value range of the current parameter to be monitored, so as to obtain the monitoring result of the target process chamber at the current moment based on the parameter value of the current parameter to be monitored and the value range of the current parameter to be monitored, so that when the process step executed by the target process chamber is updated, the value of the index object can be updated in real time, so that the value of the index object is synchronized with the process recipe of the process step executed by the target process chamber, and then the parameter to be monitored and the value range of the parameter to be monitored can be adjusted in real time according to the value of the index object, thereby, according to the real-time adjusted parameter to be monitored and the value range of the parameter to be monitored, the process parameters of the target process chamber can be accurately monitored in real time, thereby effectively improving the process processing quality of the semiconductor process equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0034] Figure 1 A schematic flow chart of a process parameter monitoring method provided for one embodiment of this specification;

[0035] Figure 2 A schematic flow chart of another process parameter monitoring method provided for one embodiment of the present specification. DETAILED DESCRIPTION

[0036] Unless otherwise defined, the technical terms or scientific terms used in the embodiments of this specification shall have the common meanings understood by persons with ordinary skills in the field to which this specification belongs. The words "first", "second" and similar words used in the embodiments of this specification do not indicate any order, quantity or importance, but are only used to avoid confusion of constituent elements.

[0037] Unless the context requires otherwise, throughout the specification, "plurality" means "at least two", and "including" is interpreted as an open, inclusive meaning, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples" or "some examples" are intended to indicate that a particular feature, structure, material or characteristic associated with the embodiment or example is included in at least one embodiment or example of the specification. The schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0038] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this specification.

[0039] Overview

[0040] As described in the background technology, with the continuous advancement of semiconductor technology, the requirements for the process quality of semiconductor process equipment are getting higher and higher, and the stability and accuracy of process parameters are important factors to ensure the quality of process. For example, cleaning machine equipment is an important equipment throughout the entire process of integrated circuit manufacturing. It is used to clean the pollutants such as particulate matter, organic matter, oxide layer, metal impurities, etc. remaining on the surface of the wafer after etching, ion implantation and other processes. According to the different cleaning methods, cleaning machine equipment can be divided into single-chip cleaning machine and tank cleaning machine. The tank cleaning machine software control system is divided into three parts: the host computer management software control system (BTC, Bench Tool Controller), the transmission module software control system (TMC, Transport Module Controller) and the process module software control system (PMC, Process Module Controller). Among them, PMC is mainly used to control the relevant hardware of each process tank (such as valves, heaters, circulating pumps, etc.) to adjust the relevant parameters of the liquid to achieve the wafer cleaning process. In PMC control, process parameters such as the temperature, concentration, flow rate, and pressure of the chemical solution have an important impact on the process effect of the tank cleaning machine. When the reading of the process parameter exceeds the process setting range, an alarm is required for manual processing, otherwise it will affect the process quality of the wafer. Therefore, in the process of semiconductor process equipment executing the process, the process parameters need to be monitored.

[0041] In order to improve equipment production efficiency, reduce equipment costs and equipment space, some semiconductor process equipment is usually equipped with an integrated process chamber, which can be compatible with multiple processes. Taking a tank cleaning machine as an example, the process chamber of the tank cleaning machine can include an integrated cleaning tank (iClean tank), which can be compatible with a variety of liquid chemicals to perform different process cleanings with different liquid chemicals. Its pipeline structure can meet the needs of a variety of liquid processes, realizing multiple uses of one tank.

[0042] However, when an integrated process chamber executes different processes, there are differences in the process parameters that need to be monitored and / or the value ranges of the process parameters that need to be monitored. Existing process parameter monitoring methods usually monitor fixed process parameters according to a fixed value range during the execution of the process. It is impossible to adjust the monitored process parameters and the value range of the process parameters in real time according to the process executed by the integrated process chamber, thereby failing to accurately monitor the process parameters of the integrated process chamber in real time, and further failing to guarantee the process processing quality of semiconductor process equipment. Taking a tank cleaning machine as an example, an integrated cleaning tank needs to change a variety of different liquids in a single process formula, and the parameter ranges set for different liquids are different. For example, the integrated cleaning tank is equipped with storage tanks for four acid liquids, namely hydrofluoric acid (HF), ammonia water (NH4OH), hydrochloric acid (HCl) and hydrogen peroxide (H2O2), and liquid inlet pipelines for three water liquids, namely deionized water (DIW), hot deionized water (HotDIW) and ozonated deionized water (DIO3). The processes of different liquids can be realized through different liquid preparation sequences and proportions. For example, the integrated cleaning tank can realize two different component types of first standard cleaning liquids (SC1), three different component types of second standard cleaning liquids (SC2) and two different component types of hydrofluoric acid. The process formulas corresponding to different liquids are different, as shown in Table 1.

[0043] Table 1

[0044]

[0045] The mixing ratio in Table 1 is the flow rate of the acid solution A: the flow rate of the water solution, or the flow rate of the acid solution A: the flow rate of the acid solution B: the flow rate of the water solution.

[0046] It can be seen from Table 1 that for different liquid medicines of different component types, the value ranges of parameters such as liquid medicine concentration, flow rate, pressure, and temperature that need to be monitored during the process are all different. Monitoring fixed process parameters based on fixed value ranges is difficult to adapt to the differences in liquid medicines at different process stages. As a result, it is easy to fail to issue an alarm in time when the process parameters exceed the limit, increasing the potential process quality risk.

[0047] Therefore, it is necessary to provide a flexible and efficient monitoring solution to dynamically monitor the process parameters of the integrated process chamber.

[0048] In order to solve the problem that the traditional method cannot monitor the process parameters in real time and accurately, in the technical solution of the present application, by obtaining the current value of the index object, the current value of the index object is updated to the index object when the target process chamber of the semiconductor process equipment enters the current process step, the current value of the index object is used to characterize the process recipe corresponding to the current process step, and the parameter information of the current parameter to be monitored is determined based on the current value of the index object. The parameter information of the current parameter to be monitored includes the parameter value of the current parameter to be monitored and the value range of the current parameter to be monitored, so as to obtain the monitoring result of the target process chamber at the current moment based on the parameter value of the current parameter to be monitored and the value range of the current parameter to be monitored, so that when the process step executed by the target process chamber is updated, the value of the index object can be updated in real time, so that the value of the index object is synchronized with the process recipe of the process step executed by the target process chamber, and then the parameter to be monitored and the value range of the parameter to be monitored can be adjusted in real time according to the value of the index object. Therefore, according to the parameter to be monitored and the value range of the parameter to be monitored adjusted in real time, the process parameters of the target process chamber can be accurately monitored in real time, thereby effectively improving the process processing quality of the semiconductor process equipment.

[0049] At the same time, in order to further improve the real-time and effectiveness of the process parameter monitoring results of the target process chamber, the process parameter monitoring method provided in the implementation mode of this specification also defines a specific method for determining the parameter information of the current parameter to be monitored by calling the target packaging class object, a specific method for determining the target packaging class object from multiple candidate packaging class objects, and a specific method for creating a candidate packaging class object.

[0050] Based on the above-mentioned inventive concept, the process parameter monitoring method provided in the embodiment of this specification is exemplarily described below.

[0051] Exemplary Methods

[0052] The embodiments of this specification provide a method for monitoring process parameters, such as Figure 1 As shown, including:

[0053] S101. Obtain a current value of an index object, where the current value of the index object is updated to the index object when a target process chamber of a semiconductor process equipment enters a current process step, and the current value of the index object is used to characterize a process recipe corresponding to the current process step.

[0054] Specifically, the semiconductor process equipment may be equipment including an integrated process chamber, such as a cleaning machine, etc. The target process chamber is a chamber that needs to monitor process parameters during the process of performing process processing in the semiconductor process equipment. The target process chamber may include an integrated process chamber, that is, the target process chamber may be compatible with multiple processes, such as the target process chamber may be an integrated cleaning tank of the cleaning machine equipment.

[0055] The index object is a readable and writable object created based on each candidate process recipe corresponding to the target process chamber, and the object is used to write the process recipe corresponding to the current process step, wherein the index object may include multiple sub-objects corresponding to each parameter in all candidate process recipes, and each sub-object is used to write the parameter value of the parameter in the process recipe corresponding to the current process step, so as to cover all process requirements of the target process chamber through the values ​​in the multiple sub-objects. For example, for any sub-object, the parameter corresponding to the sub-object can be used as a variable to create the sub-object. Taking the integrated cleaning tank as an example, the multiple sub-objects may include a chemical liquid type sub-object (IClean ChemicalType), a water chemical liquid type sub-object (IClean DI Type), a component type sub-object (Chemical Pattern) and a flow level sub-object (IClean DI Flow), and the chemical liquid type sub-object, the water chemical liquid type sub-object, the component type sub-object and the flow level sub-object are used to write the chemical liquid type, water chemical liquid type, component type and flow level in the process recipe corresponding to the current process step, respectively. For example, if the liquid type in the process recipe corresponding to the current process step is hydrofluoric acid and the component type is type 1 (Pattern1), HF is written in the liquid type sub-object and Pattern1 is written in the component type sub-object.

[0056] Among them, the enumeration elements corresponding to each sub-object can be stored respectively through the index channel corresponding to each sub-object one by one. In implementation, the value of the corresponding sub-object can be obtained by matching each enumeration element in the index channel with the process formula, and the corresponding sub-object can be written. Taking the integrated cleaning tank as an example, the enumeration elements in the index channel corresponding to the liquid type sub-object may include quick drain rinse (QDR), hydrofluoric acid, the first standard cleaning liquid and the second standard cleaning liquid, the enumeration elements in the index channel corresponding to the water liquid type sub-object may include null value (None), deionized water, hot deionized water and ozonated deionized water, the enumeration elements in the index channel corresponding to the component type sub-object may include type 1, type 2, type 3 and reserved type (Unknown), and the enumeration elements in the index channel corresponding to the flow level sub-object may include level 0 (Close), level 1, level 2, level 3, level 4 and level 5. For example, when the water liquid type in the process formula is read as deionized water, the water liquid type sub-object can be written. At this time, the enumeration element stored in the water liquid type sub-object is deionized water.

[0057] During implementation, when the target process chamber enters the current process step, the process recipe corresponding to the current process step can be updated to the index object. For example, whether the target process chamber enters the current process step can be determined based on the scheduling information of the semiconductor process equipment. Thus, when the process step executed by the target process chamber is updated, the value of the index object can be updated in time, so that the value stored in the index object is synchronized with the process recipe of the process step executed by the target process chamber.

[0058] S102: Determine parameter information of a current parameter to be monitored based on a current value of the index object, where the parameter information of the current parameter to be monitored includes a parameter value of the current parameter to be monitored and a value range of the current parameter to be monitored.

[0059] Specifically, in the process of monitoring the process parameters of the target process chamber, the current value of the index object can be read in real time. The current value of the index object is the enumeration element stored in each sub-object of the index object at the current moment. Thus, the parameter values ​​of each parameter in the process recipe corresponding to the current process step can be quickly and accurately determined.

[0060] Among them, the parameter information of the current parameter to be monitored can be determined based on the current value of the index object. The parameter information of the current parameter to be monitored may include the attribute information of the process parameter to be monitored at the current moment, for example, it may include the parameter value of the current parameter to be monitored and the value range of the current parameter to be monitored. In addition, it may also include the data type and identification information of the current parameter to be monitored. The value range of the current parameter to be monitored may include the upper limit value and lower limit value of the current parameter to be monitored.

[0061] During implementation, a correspondence between the value of each sub-object, the identification information of the parameter to be monitored, and the value range of the parameter to be monitored can be created in advance, so as to determine the identification information of the current parameter to be monitored and the value range of the current parameter to be monitored according to the current value of each sub-object, and obtain the parameter value of the current parameter to be monitored according to the identification information of the current parameter to be monitored. In addition, candidate packaging class objects corresponding to different candidate process recipes of the target process chamber can also be created in advance, and the candidate packaging class objects can be used to obtain the parameter information of the required monitoring parameters under the corresponding candidate process recipe when called. Therefore, the target packaging class object can be matched from each candidate packaging class object according to the current value of each sub-object, so as to obtain the parameter information of the required monitoring parameters under the process recipe corresponding to the current process step by calling the target packaging class object, and use it as the parameter information of the current parameter to be monitored.

[0062] Therefore, when the process steps executed by the target process chamber are updated, the parameters to be monitored and the value range of the parameters to be monitored can be adjusted in real time according to the value of the index object, and then according to the real-time adjustment results of the parameters to be monitored and the value range of the parameters to be monitored, the process parameters of the target process chamber can be accurately monitored in real time, thereby effectively improving the process processing quality of the semiconductor process equipment.

[0063] S103 . Obtain a monitoring result of the target process chamber at the current moment based on the parameter value of the current parameter to be monitored and the value range of the current parameter to be monitored.

[0064] Specifically, the monitoring result of the target process chamber at the current moment can be obtained based on the comparison result between the parameter value of the current parameter to be monitored and the value range of the current parameter to be monitored. For example, when the parameter value of the current parameter to be monitored is within the value range of the current parameter to be monitored, it indicates that the target process chamber meets the process requirements at the current moment, and the process parameter monitoring of the target process chamber can continue; when the parameter value of the current parameter to be monitored is not within the value range of the current parameter to be monitored, it indicates that the target process chamber cannot meet the process requirements at the current moment, and an alarm message can be generated and sent.

[0065] During implementation, alarm information can be generated based on the current value of each sub-object in the index object, the parameter value of the current monitored parameter, and the value range of the current monitored parameter, so that relevant personnel can promptly learn about the current process status of the target process chamber through the alarm information and take corresponding measures to ensure the efficient operation of the semiconductor process equipment and effectively improve the process processing quality of the semiconductor process equipment.

[0066] In order to further improve the real-time performance and effectiveness of the process parameter monitoring result of the target process chamber, in one embodiment of the present specification, the determining the parameter information of the current parameter to be monitored based on the current value of the index object includes:

[0067] Based on the current value of the index object, determine a target packaging class object from a plurality of candidate packaging class objects, the plurality of candidate packaging class objects corresponding to a plurality of candidate process recipes, the candidate packaging class objects being used to obtain parameter information of a required monitoring parameter under the corresponding candidate process recipe when called;

[0068] By calling the target encapsulation class object, the parameter information of the required monitoring parameters under the process recipe corresponding to the current process step is obtained, and the parameter information of the required monitoring parameters under the process recipe corresponding to the current process step is used as the parameter information of the current parameter to be monitored.

[0069] Specifically, multiple candidate packaging class objects corresponding to multiple candidate process recipes of the target process chamber can be created in advance. The candidate packaging class objects are used to obtain parameter information of the required monitoring parameters under the corresponding candidate process recipe when called. The required monitoring parameters are the process parameters that need to be monitored for the target process chamber during the process in which the target process chamber executes the process based on the corresponding candidate process recipe. For example, they may include drug liquid flow rate, drug liquid concentration, water flow rate, water pressure, temperature, water resistance, megasonic power, etc.

[0070] During implementation, when creating a candidate packaging class object, a correspondence between the identification information of the candidate packaging class object and the candidate process recipe can be created to determine the target packaging class object based on the current value of the index object and the correspondence between the identification information of the candidate packaging class object and the candidate process recipe. Corresponding identification information of the candidate packaging class object can also be created based on the candidate process recipe to determine the target packaging class object by matching the current value of the index object with the identification information of each candidate packaging class object.

[0071] After determining the target packaging class object, the parameter information of the required monitoring parameters under the process recipe corresponding to the current process step can be obtained by calling the target packaging class object, and the parameter information of the required monitoring parameters under the process recipe corresponding to the current process step can be used as the parameter information of the current parameter to be monitored. Therefore, in the process of monitoring the process parameters of the target process chamber, the parameter information of the current parameter to be monitored can be obtained in real time and accurately, and then according to the parameter information of the current parameter to be monitored, the process parameters of the target process chamber can be monitored in real time and accurately, thereby effectively improving the process processing quality of semiconductor process equipment.

[0072] In a feasible implementation, the candidate encapsulation class object is created by the following method:

[0073] When the creation condition of the encapsulation class object is met, obtaining a label set at the current moment and a current value of a configuration parameter associated with the label, wherein the label is used to characterize the candidate process recipe;

[0074] Based on the current value of the configuration parameter associated with the tag, a candidate package class object corresponding to the candidate process recipe represented by the tag is created.

[0075] Specifically, determining whether the creation condition of the package class object is satisfied may include determining whether a predetermined package class object creation time is reached. For example, it may be determined that the predetermined package class object creation time is reached when the semiconductor process equipment is started, or it may be determined that the predetermined package class object creation time is reached when a package class object update instruction is received and the semiconductor process equipment is started. Wherein, the package class object update instruction may be generated and sent when the user updates the configuration parameters of the candidate package class object through the upper computer operation interface of the semiconductor process equipment.

[0076] In implementation, users can set labels and parameter values ​​of configuration parameters associated with the set labels through the host computer operation interface of semiconductor process equipment. Labels can be used to characterize candidate process recipes, and can also characterize candidate process recipes and demand monitoring parameters under candidate process recipes at the same time. For example, taking the integrated cleaning tank as an example, when the set label is SC1Concentration2, it characterizes that the liquid type in the candidate process recipe is the first standard cleaning liquid, the component type is type 2, and the demand monitoring parameter is liquid concentration; when the set label is HotDIWPressure5, it indicates that the water liquid type is hot deionized water, the flow level is level 5, and the demand monitoring parameter is water pressure. Therefore, the parameter value of the configuration parameter associated with the label can be obtained through the reflection of the label, and the parameter value of the configuration parameter can be written to the corresponding variable array for the creation of candidate package class objects.

[0077] Among them, multiple variable arrays corresponding to multiple configuration parameter input controls in the upper computer operation interface can be set, and the parameter values ​​of each configuration parameter associated with the same tag can be written to the same address in each variable array respectively, that is, according to the address of the parameter value of the configuration parameter associated with the tag in the variable array, the parameter value of each configuration parameter associated with the tag can be synchronously obtained, thereby, the parameter value of the configuration parameter can be quickly identified and called through the tag.

[0078] In implementation, when it is determined that the conditions for creating a package class object are met, the current values ​​of the configuration parameters associated with each tag set in the upper computer operation interface at the current moment can be stored in the corresponding variable array in sequence through tag reflection. For any tag, in the process of creating a candidate package class object corresponding to the candidate process recipe represented by the tag, the current value of the configuration parameter associated with the tag can be read from the variable array according to the address of the parameter value of the configuration parameter associated with the tag in the variable array, and the candidate package class object corresponding to the candidate process recipe represented by the tag can be created based on the current value of the configuration parameter associated with the tag, thereby obtaining the candidate package class object corresponding to each candidate process recipe.

[0079] Due to the strong expansibility and compatibility of the integrated process chamber, the parameter information of the current monitored parameter is obtained by using package class objects, which facilitates the addition of monitoring parameters and / or functional expansion, thereby being able to adapt to the ever-changing process parameter monitoring needs and improving the flexibility and expansibility of process parameter monitoring of the integrated process chamber; at the same time, the package class objects make the code more modular, reducing the workload in the process of adding monitoring parameters and / or functional expansion, and making it easy to maintain and upgrade.

[0080] In a feasible implementation manner, the configuration parameters include a data channel of the demand monitoring parameter and a data channel of the value range of the demand monitoring parameter, the data channel of the demand monitoring parameter is used to obtain the parameter value of the demand monitoring parameter, and the data channel of the value range of the demand monitoring parameter is used to obtain the value range of the demand monitoring parameter;

[0081] The step of creating a candidate packaging class object corresponding to the candidate process recipe represented by the tag based on the current value of the configuration parameter associated with the tag comprises:

[0082] Based on the parameter identification information of each of the configuration parameters and the current value of each of the configuration parameters, create each variable in the candidate encapsulation class object;

[0083] Predetermined variables among the variables of the candidate encapsulation class object are used as the parameters of the candidate encapsulation class object, and the predetermined variables include variables corresponding to the data channel of the demand monitoring parameter and variables corresponding to the data channel of the value range of the demand monitoring parameter.

[0084] Specifically, for any tag, the configuration parameters associated with the tag may include a data channel of a demand monitoring parameter under the candidate process recipe represented by the tag and a data channel of a value range of the demand monitoring parameter. The data channel of the demand monitoring parameter is used to transmit the parameter value of the demand monitoring parameter, and the data channel of the value range of the demand monitoring parameter can be used to transmit the value of the value range of the demand monitoring parameter, for example, it may include a data channel of an upper limit value of the demand monitoring parameter and a data channel of a lower limit value of the demand monitoring parameter.

[0085] In the implementation, in the process of creating each variable in the encapsulation class object, the attributes of the variables corresponding to each configuration parameter can be defined, such as public attributes or private attributes, and based on the parameter identification information of each configuration parameter and the current value of each configuration parameter, by calling the constructor with parameters, each variable in the candidate encapsulation class object is assigned a value to realize the instantiation of the encapsulation class object. For example, each variable in the encapsulation class object can include a demand monitoring parameter (reading Signal Name), a data channel of the demand monitoring parameter (reading Signal AI), an upper limit value data channel of the demand monitoring parameter (cfgUpper Value), and a lower limit value data channel of the demand monitoring parameter (cfg Lower Value), the demand monitoring parameter is used to store the parameter identification information of the demand monitoring parameter, such as the parameter name, parameter identification code, etc., the data channel of the demand monitoring parameter is used to store the channel number of the data channel of the demand monitoring parameter, the upper limit value data channel of the demand monitoring parameter is used to store the channel number of the upper limit value data channel of the demand monitoring parameter, and the lower limit value data channel of the demand monitoring parameter is used to store the channel number of the lower limit value data channel of the demand monitoring parameter.

[0086] In the process of assigning values ​​to each variable in the candidate encapsulation class object, the parameter identification information of each configuration parameter can be used as a formal parameter. For example, the formal parameter can include a demand monitoring parameter (reading Signal Name), a data channel for the demand monitoring parameter (reading Signal AI), an upper limit value data channel for the demand monitoring parameter (cfg Upper Value), and a lower limit value data channel for the demand monitoring parameter (cfg Lower Value).

[0087] After the creation of each variable in the candidate package class object is completed, the predetermined variables in the variables of the candidate package class object can be used as the parameters of the candidate package class object. The predetermined variables can include variables corresponding to the data channel of the demand monitoring parameter and variables corresponding to the data channel of the value interval of the demand monitoring parameter, so that in the process of calling the candidate package class object, the parameter value of the demand monitoring parameter and the value interval of the demand monitoring parameter can be read from each data channel. In the process of calling the candidate package class object, the candidate package class object can obtain the corresponding channel value from the data channel of the demand monitoring parameter and use it as the parameter value of the demand monitoring parameter, and obtain the corresponding channel value from the data channel of the value interval of the demand monitoring parameter and use it as the value interval of the demand monitoring parameter through the Set method, so that the latest change results of the demand monitoring parameter and the value interval of the demand monitoring parameter can be obtained in real time, ensuring the real-time and accuracy of the parameter value and value interval of the acquired demand monitoring parameter, thereby improving the flexibility and effectiveness of process parameter monitoring.

[0088] It is understandable that in the process of creating a candidate encapsulation class object, a null judgment operation can also be added to the candidate encapsulation class object. The null judgment operation can be used to determine whether the created candidate encapsulation class object includes a target variable. The target variable can include necessary variables in the process of obtaining parameter information of the demand monitoring parameter, such as the data channel of the demand monitoring parameter, the data channel of the value range of the demand monitoring parameter, etc. Among them, the null judgment operation can be written in the public attribute for external call. For example, in the process of creating each variable of the candidate encapsulation class object, the null value exception can be captured through the null judgment operation to discover the situation of missing or under-matching of variables in advance, so that the parameter information of the demand monitoring parameter can be effectively obtained by calling the candidate encapsulation class object.

[0089] At the same time, since the configuration parameters include multiple parameters such as the data channel of the required monitoring parameters and the data channel of the value range of the required monitoring parameters, by encapsulating them into a package class object, it is possible to effectively avoid configuration errors in the parameter values ​​of each configuration parameter, thereby further improving the accuracy of the process parameter monitoring results of the target process chamber.

[0090] In a feasible implementation manner, after creating each variable in the candidate encapsulation class object based on the parameter identification information of each configuration parameter and the current value of each configuration parameter, the method further includes:

[0091] The attributes of each of the predetermined variables are configured as private attributes, and a public value-taking method for each of the predetermined variables is created.

[0092] Specifically, in the process of creating a candidate package class object, the attributes of each predetermined variable in the candidate package class object can be configured as a private attribute, and the variable value can only be written and read inside the candidate package class object, thereby realizing the encapsulation and hiding of each predetermined variable in the candidate package class, and can effectively prevent external programs from directly accessing or modifying the values ​​of each predetermined variable in the candidate package class object, thereby ensuring the security of each predetermined object in the package class object, and further avoiding the influence of the parameter information acquisition error of the required monitoring parameters on the process parameter monitoring results of the target process chamber.

[0093] In addition, for each predetermined variable in the candidate package class object, a public value-taking (Get) method is created for each predetermined variable. For example, a public value-taking method for the variable corresponding to the data channel of the required monitoring parameter, a public value-taking method for the variable corresponding to the upper limit value data channel of the required monitoring parameter, and a public value-taking method for the variable corresponding to the lower limit value data channel of the required monitoring parameter are created respectively. Therefore, in the process of monitoring the process parameters of the target process chamber, the channel value of the corresponding data channel can be obtained by calling the corresponding value-taking method. That is, the candidate package class object can use the public value-taking method as an external interface to provide the channel value of each data channel to the outside. Therefore, through the external interface provided by the candidate package class object, the parameter information of the required monitoring parameter can be quickly and effectively obtained.

[0094] In order to further improve the efficiency of obtaining parameter information of the current parameter to be monitored and the accuracy of the obtained result, in one embodiment of the present specification, after creating a candidate packaging class object corresponding to the candidate process recipe represented by the tag based on the current value of the configuration parameter associated with the tag, it also includes:

[0095] A target correspondence relationship is created, where the target correspondence relationship includes a correspondence relationship between the label and the candidate encapsulation class object.

[0096] Specifically, after creating candidate packaging class objects corresponding to the candidate process recipes represented by each label, a target correspondence relationship can also be created. The target correspondence relationship can include the correspondence relationship between the label and the candidate packaging class object. Therefore, in the process of determining the target packaging class object, the current value of the index object can be matched with each label in the target correspondence relationship, and the candidate packaging class object corresponding to the successfully matched label can be used as the target packaging class object, which greatly improves the efficiency of determining the target packaging class object and the accuracy of the determination result, and then based on the target packaging class object, the parameter information of the current parameter to be monitored can be quickly and accurately obtained.

[0097] Among them, the type of the target corresponding relationship can be set according to actual needs, for example, it can be a mapping table, or it can be a dictionary, etc. In implementation, the label can be associated with the candidate package class object through a dictionary, and the dictionary can include key-value pairs corresponding to each label, wherein the label can be used as the key in the key-value pair, and the candidate package class object corresponding to the label can be used as the key value in the key-value pair, thereby, through the binding of the key-value pair, each label is associated with a specific candidate package class object. Since the time complexity of the dictionary search operation is at a constant level, the efficiency of determining the target package class object can be greatly improved, thereby improving the response speed in the process of process parameter monitoring, and ensuring the real-time and effectiveness of the process parameter monitoring results.

[0098] In a feasible implementation manner, determining the target encapsulation class object from a plurality of candidate encapsulation class objects based on the current value of the index object includes:

[0099] Matching the current value of the index object with each label in the target correspondence;

[0100] When the current value of the index object successfully matches the label in the target corresponding relationship, the candidate encapsulation class object corresponding to the successfully matched label in the target corresponding relationship is used as the target encapsulation class object.

[0101] Specifically, in the process of determining the target encapsulation class object from multiple candidate encapsulation class objects, the current value of each sub-object in the index object can be matched with each label in the target correspondence relationship respectively. When the label and the current value of each sub-object match successfully, it is determined that the label and the current value of the index object match successfully.

[0102] When the current value of the index object matches the label in the target correspondence successfully, the candidate packaging class object corresponding to the successfully matched label can be used as the target packaging class object. Since the label can uniquely identify the corresponding candidate process recipe, the target packaging class object is determined by the matching result between the current value of the index object and the label, which can effectively ensure the accuracy of the determination result of the target packaging class object, thereby improving the reliability of the acquisition result of the parameter information of the current parameter to be monitored, and further improving the effectiveness of the process parameter monitoring result of the target process chamber.

[0103] In a feasible implementation, it also includes:

[0104] When the current value of the index object fails to match each label in the target corresponding relationship, the monitoring result of the target process chamber at the current moment is set to empty.

[0105] Specifically, when the tag fails to match the current value of at least one sub-object in the index object, it is determined that the tag fails to match the current value of the index object.

[0106] Among them, when the current value of the index object fails to match each label in the target correspondence, it indicates that there is no label in the target correspondence that matches the process recipe corresponding to the current process step, that is, it indicates that there is no required monitoring parameter in the process recipe corresponding to the current process step. At this time, the monitoring result of the target process chamber at the current moment can be set to empty, that is, the process parameter monitoring step is skipped until the current value of the index object successfully matches the label in the target correspondence, thereby effectively ensuring the normal operation of the semiconductor process equipment.

[0107] The following is an example of a feasible implementation method for the process parameter monitoring method of the present application. Figure 2 , the process parameter monitoring method specifically includes:

[0108] S201, the monitoring thread obtains the current value of the index channel object, and matches the current value of the index channel object with each tag in the dictionary. If the match is successful, step S202 is executed, and if the match fails, step S206 is executed; wherein, the current value of the index channel object represents the process recipe corresponding to the target process chamber when executing the current process step, and the dictionary includes multiple key-value pairs. For any key-value pair, the key in the key-value pair is a tag, and the key value in the key-value pair is a candidate packaging class object. The tag represents the candidate process recipe of the target process chamber, and the candidate packaging class object is used to obtain parameter information of the required monitoring parameters under the corresponding candidate process recipe when called;

[0109] S202, obtaining a candidate encapsulation class object corresponding to a successfully matched tag based on the dictionary, and using it as a target encapsulation class object;

[0110] S203, obtaining the parameter value of the current parameter to be monitored and the value range of the current parameter to be monitored by calling the target encapsulation class object;

[0111] S204, comparing the parameter value of the current parameter to be monitored with the value range of the current parameter to be monitored to determine whether the current parameter to be monitored exceeds the limit, if it exceeds the limit, executing step S205, if it does not exceed the limit, repeating step S201;

[0112] S205, generating alarm information based on the current value of each sub-object in the index object, the parameter value of the current parameter to be monitored, and the value range of the current parameter to be monitored, and repeating step S201;

[0113] S206 , setting the monitoring result of the target process chamber at the current moment to empty, and repeating step S201 .

[0114] Exemplary Devices

[0115] In an exemplary embodiment of the present specification, a host computer is also provided, including: at least one processor and at least one memory, wherein a computer program is stored in the memory, and when the computer program is executed by the processor, the process parameter monitoring method described in any of the above embodiments is implemented.

[0116] In another exemplary embodiment of the present specification, a semiconductor process equipment is provided, including: a host computer as described in the above embodiment, wherein the host computer is used to monitor process parameters of a target process chamber in the semiconductor process equipment.

[0117] Exemplary computer program products and storage media

[0118] In addition to the above-mentioned methods and devices, the process parameter monitoring method provided in the embodiments of this specification may also be a computer program product, which includes computer program instructions, which, when executed by a processor, enable the processor to execute the steps of the process parameter monitoring method according to various embodiments of this specification described in the above "Exemplary Method" section of this specification.

[0119] The computer program product may be written in any combination of one or more programming languages ​​to write program codes for performing the operations of the embodiments of the present specification, including object-oriented programming languages ​​such as Java, C++, etc., and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user semiconductor process equipment, partially on the user equipment, as a separate software package, partially on the user semiconductor process equipment and partially on a remote semiconductor process equipment, or entirely on a remote semiconductor process equipment or server.

[0120] In addition, an embodiment of the present specification also provides a computer-readable storage medium on which a computer program is stored, and the computer program is executed by a processor to execute the steps of the process parameter monitoring method according to various embodiments of the present specification described in the above "Exemplary Method" section of the present specification.

[0121] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this specification can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0122] The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0123] The above-mentioned embodiments only express several implementation methods of this specification, and the descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the solutions provided by the embodiments of this specification. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of this specification, which all belong to the protection scope of this specification. Therefore, the protection scope of the patent of this specification shall be based on the attached claims.

Claims

1. A process parameter monitoring method, characterized in that: include: Acquire a current value of an index object, wherein the current value of the index object is updated to the index object when a target process chamber of a semiconductor process equipment enters a current process step, and the current value of the index object is used to characterize a process recipe corresponding to the current process step; Based on the current value of the index object, determining parameter information of the current parameter to be monitored, wherein the parameter information of the current parameter to be monitored includes the parameter value of the current parameter to be monitored and the value range of the current parameter to be monitored; Based on the parameter value of the current parameter to be monitored and the value range of the current parameter to be monitored, a monitoring result of the target process chamber at the current moment is obtained.

2. The method according to claim 1, characterized in that The determining, based on the current value of the index object, parameter information of the current parameter to be monitored includes: Based on the current value of the index object, determine a target packaging class object from a plurality of candidate packaging class objects, the plurality of candidate packaging class objects corresponding to a plurality of candidate process recipes, the candidate packaging class objects being used to obtain parameter information of a required monitoring parameter under the corresponding candidate process recipe when called; By calling the target encapsulation class object, the parameter information of the required monitoring parameters under the process recipe corresponding to the current process step is obtained, and the parameter information of the required monitoring parameters under the process recipe corresponding to the current process step is used as the parameter information of the current parameter to be monitored.

3. The method according to claim 2, characterized in that The candidate encapsulation class object is created by the following method: When the creation condition of the encapsulation class object is met, obtaining a label set at the current moment and a current value of a configuration parameter associated with the label, wherein the label is used to characterize the candidate process recipe; Based on the current value of the configuration parameter associated with the tag, a candidate package class object corresponding to the candidate process recipe represented by the tag is created.

4. The method according to claim 3, characterized in that The configuration parameters include a data channel of the demand monitoring parameter and a data channel of the value interval of the demand monitoring parameter, the data channel of the demand monitoring parameter is used to obtain the parameter value of the demand monitoring parameter, and the data channel of the value interval of the demand monitoring parameter is used to obtain the value interval of the demand monitoring parameter; The step of creating a candidate packaging class object corresponding to the candidate process recipe represented by the tag based on the current value of the configuration parameter associated with the tag comprises: Based on the parameter identification information of each of the configuration parameters and the current value of each of the configuration parameters, create each variable in the candidate encapsulation class object; Predetermined variables among the variables of the candidate encapsulation class object are used as the parameters of the candidate encapsulation class object, and the predetermined variables include variables corresponding to the data channel of the demand monitoring parameter and variables corresponding to the data channel of the value range of the demand monitoring parameter.

5. The method according to claim 4, characterized in that After creating each variable in the candidate encapsulation class object based on the parameter identification information of each configuration parameter and the current value of each configuration parameter, the method further includes: The attributes of each of the predetermined variables are configured as private attributes, and a public value-taking method for each of the predetermined variables is created.

6. The method according to any one of claims 3 to 5, characterized in that: After creating a candidate packaging class object corresponding to the candidate process recipe represented by the tag based on the current value of the configuration parameter associated with the tag, the method further includes: A target correspondence relationship is created, where the target correspondence relationship includes a correspondence relationship between the label and the candidate encapsulation class object.

7. The method according to claim 6, characterized in that The step of determining a target encapsulation class object from a plurality of candidate encapsulation class objects based on the current value of the index object comprises: Matching the current value of the index object with each label in the target correspondence; When the current value of the index object successfully matches the label in the target corresponding relationship, the candidate encapsulation class object corresponding to the successfully matched label in the target corresponding relationship is used as the target encapsulation class object.

8. The method according to claim 7, characterized in that Also includes: When the current value of the index object fails to match each label in the target corresponding relationship, the monitoring result of the target process chamber at the current moment is set to empty.

9. A host computer, characterized in that: The method comprises at least one processor and at least one memory, wherein a computer program is stored in the memory, and when the computer program is executed by the processor, the process parameter monitoring method according to any one of claims 1 to 8 is implemented.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the process parameter monitoring method according to any one of claims 1 to 8 is implemented.

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