Light-emitting substrate, manufacturing method thereof and electronic equipment

Abstract

The embodiment of the invention provides a light-emitting substrate and a manufacturing method thereof and electronic equipment, the light-emitting substrate comprises a transparent substrate and a plurality of light-emitting elements, and one side of the transparent substrate is provided with a plurality of grooves; the light-emitting elements are at least partially arranged in the groove, each light-emitting element comprises a light-emitting body, a first pin and a second pin, the first pin and the second pin are electrically connected with the light-emitting body, and the first pin and the second pin are located on the side, away from the bottom of the groove, of the light-emitting body in the depth direction of the groove. According to the light-emitting substrate, the light-emitting elements are arranged in the grooves, the light-emitting elements occupy less space or no longer occupy the external space of the transparent substrate, and the thickness of the light-emitting substrate can be reduced.

Description

Technical Field

[0001] The present application relates to the field of backlight technology, and in particular to a light-emitting substrate and a manufacturing method thereof, and an electronic device. Background Art

[0002] A light-emitting substrate is a light-emitting component that can be used in a display device, for example, a light-emitting component that can be used in a computer, a television, or a car display. It is a light source that can provide a certain brightness and uniformity, so that the display device can display images normally. It is the most important component in a display device.

[0003] However, thinness and portability are the development trends of existing electronic products, that is, display devices are also developing in the direction of thinness and lightness, and the light-emitting substrate, as an important component of the display device, also needs to meet the requirements of thinness and lightness. However, the thickness of the existing light-emitting substrate is still relatively large, making it difficult to achieve thinness and lightness of the display device. And as people's requirements become higher and higher, electronic products must not only be thin but also have a certain degree of lightness and flexibility to achieve the foldability of electronic products, thereby further improving the portability of electronic products. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a light-emitting substrate and a manufacturing method thereof and an electronic device, so as to reduce the thickness of the light-emitting substrate, thereby achieving a light and thin light-emitting substrate. The specific technical solution is as follows:

[0005] A first aspect of the present application provides a light-emitting substrate, comprising: a transparent substrate, a plurality of grooves being provided on one side of the transparent substrate; a plurality of light-emitting elements, the light-emitting elements being at least partially disposed in the grooves, the light-emitting elements comprising a light-emitting body and a first pin and a second pin electrically connected to the light-emitting body, and along the depth direction of the groove, the first pin and the second pin are located on a side of the light-emitting body away from the bottom of the groove.

[0006] In some embodiments, the transparent substrate further includes a concave-convex structure disposed between two adjacent grooves, and a first reflective layer is disposed on a surface of the concave-convex structure.

[0007] In some embodiments, the concave-convex structure includes a plurality of first concave portions arranged at intervals and a convex portion connecting adjacent first concave portions; the depth of the groove is greater than the depth of the first concave portions.

[0008] In some embodiments, a cross-section of the protrusion along the depth direction of the groove is trapezoidal, rectangular or hemispherical.

[0009] In some embodiments, a plurality of dispersedly arranged second reflective layers are disposed at the bottom of the groove, and along the depth direction of the groove, the second reflective layers are located on a side of the light emitting body close to the bottom of the groove.

[0010] In some embodiments, the orthographic projection area of ​​the second reflective layer at the bottom of the groove is 20% to 80% of the total area of ​​the bottom of the groove.

[0011] In some embodiments, the light-emitting element also includes a transparent substrate, the light-emitting body is arranged on a side of the transparent substrate away from the bottom of the groove, the light-emitting body is arranged on the other side of the transparent substrate, a plurality of spherical second recessed portions are arranged at the bottom of the groove, and the second reflective layer is arranged on the upper surface of the second recessed portion.

[0012] In some embodiments, the light-emitting substrate includes a first packaging layer, which is arranged on a side of the light-emitting body and the first reflective layer away from the transparent substrate, and at least part of the first pin and the second pin are exposed on the outside of the first packaging layer for electrical connection with the cathode wiring and the anode wiring.

[0013] In some embodiments, the epitaxial layer of the light emitting body is a wavy structure, and the second reflective layer is a planar structure parallel to the transparent substrate.

[0014] In some embodiments, the light-emitting substrate also includes a second packaging layer, which is arranged on a side of the light-emitting body and the first reflective layer away from the transparent substrate, the upper surfaces of the first pin and the second pin are covered by the second packaging layer, and the first pin and the second pin are electrically connected to the cathode wiring and the anode wiring vias.

[0015] In some embodiments, the light-emitting substrate also includes a third packaging layer, and the third packaging layer is arranged on the side of the cathode wiring and the anode wiring away from the transparent substrate, and the orthographic projections of the light-emitting body, the cathode wiring, and the anode wiring on the transparent substrate are located within the orthographic projection range of the third packaging layer on the transparent substrate.

[0016] In some embodiments, the third encapsulation layer is a white oil layer.

[0017] A second aspect of the present application provides a method for manufacturing a light-emitting substrate, which is used to manufacture the light-emitting substrate described above, comprising the following steps:

[0018] A transparent substrate is provided.

[0019] A photoresist is spin-coated on the transparent substrate, and a first portion of the groove is formed through exposure, development, and first etching processes in sequence.

[0020] After a second etching process, a groove and a concave-convex structure between two adjacent grooves are formed.

[0021] A first reflective layer is formed on the surface of the concavo-convex structure.

[0022] An LED device is embedded in the groove, the light emitting surface of the LED device faces the bottom of the groove, and the LED device includes a light emitting body, wherein a first pin and a second pin of the light emitting body are located at a side away from the bottom of the groove.

[0023] A third aspect of the present application provides an electronic device, comprising the light-emitting substrate described above.

[0024] Beneficial effects of the embodiments of the present application:

[0025] The light-emitting substrate in this embodiment sets the light-emitting element in the groove, and the light-emitting element occupies less or no longer occupies the external space of the transparent substrate, which can reduce the thickness of the light-emitting substrate. Since the thickness of the light-emitting substrate is relatively thin, the deformability of the light-emitting substrate can be improved, that is, it has good flexibility, so that it can be used not only in electronic devices with straight display, but also in electronic devices with curved display, and has a wider range of applications. At the same time, the thickness of the light-emitting substrate is reduced. When it is applied to electronic devices, the thickness of the electronic devices can be reduced, meeting people's demand for thin and light electronic devices and improving their portability.

[0026] Of course, implementing any product or method of the present application does not necessarily require achieving all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other embodiments can also be obtained based on these drawings.

[0028] Figure 1 A schematic diagram of the structure of a light-emitting substrate provided in an embodiment of the present application in a first embodiment;

[0029] Figure 2 A schematic diagram of the structure of the light-emitting substrate provided in the embodiment of the present application in a second embodiment;

[0030] Figure 3 A schematic diagram of the structure of the light-emitting substrate provided in the embodiment of the present application in the third embodiment;

[0031] Figure 4 A schematic diagram of the structure of the light-emitting substrate provided in the embodiment of the present application in a fourth embodiment;

[0032] Figure 5 A schematic diagram of the structure of the light-emitting substrate provided in the embodiments of the present application in a fifth embodiment;

[0033] Figure 6 A schematic diagram of the structure of the light-emitting substrate provided in the embodiments of the present application in a sixth embodiment;

[0034] Figure 7 for Figure 1 Schematic diagram of the steps for making the light-emitting substrate;

[0035] Figure 8 for Figure 2 Schematic diagram of the steps for making the light-emitting substrate;

[0036] Fig. 9 for Figure 3 Schematic diagram of the steps for making the light-emitting substrate;

[0037] Fig.10 for Figure 4 Schematic diagram of the steps for making the light-emitting substrate;

[0038] Fig.11 for Figure 5 Schematic diagram of the steps for making the light-emitting substrate;

[0039] Fig.12 for Figure 6 Schematic diagram of the production steps of the light-emitting substrate.

[0040] The reference numerals are as follows:

[0041] Transparent substrate 10; groove 11; first part 111; concavo-convex structure 12; first recessed portion 121; raised portion 122; first reflective layer 13; second reflective layer 14; second recessed portion 15; photoresist 16; light-emitting element 20; light-emitting body 21; transparent substrate 22; first pin 23; second pin 24; fusion glue 25; metal trace 30; anode trace 31; cathode trace 32; first packaging layer 40; second packaging layer 50; via 51; third packaging layer 60; depth h1 of the groove; depth h2 of the first recessed portion; depth direction H. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field based on the present application belong to the scope of protection of the present application.

[0043] The present application provides a light-emitting substrate for providing a light source for an electronic device, such as Figure 1As shown, the light-emitting substrate includes a transparent substrate 10 and a plurality of light-emitting elements 20. A plurality of grooves 11 are provided on one side of the transparent substrate 10, and the light-emitting elements 20 are at least partially disposed in the grooves 11. The light-emitting element 20 includes a light-emitting body 21 and a first pin 23 and a second pin 24 electrically connected to the light-emitting body 21. Along the depth direction H of the groove 11, the first pin 23 and the second pin 24 are located on a side of the light-emitting body 21 away from the bottom of the groove 11.

[0044] In this embodiment, the light-emitting element 20 is disposed in the groove 11, and the light-emitting element 20 occupies less or no longer occupies the external space of the transparent substrate 10, which can reduce the thickness of the light-emitting substrate. Since the thickness of the light-emitting substrate is relatively thin, the deformability of the light-emitting substrate can be improved, that is, it has good flexibility, so that it can be used not only in electronic devices with straight display, but also in electronic devices with curved display, and has a wider range of applications. At the same time, the thickness of the light-emitting substrate is reduced. When it is applied to electronic devices, the thickness of the electronic devices can be reduced, meeting people's demand for thin and light electronic devices and improving their portability.

[0045] The first pin 23 and the second pin 24 are located on a side of the light emitting body 21 away from the bottom of the groove 11 , that is, the first pin 23 and the second pin 24 are led outward from the opening of the groove 11 , which facilitates the electrical connection between the first pin 23 and the second pin 24 and the external circuit.

[0046] The light emitting element 20 may be a Mini-LED (Mini Light Emitting Diode) or a Micro-LED (Micro Light Emitting Diode). Mini-LED is small in size and high in brightness, and can be widely used in the backlight module of a display device, and can finely adjust the backlight to achieve the display of a high dynamic range image (High-Dynamic Range, HDR).

[0047] Furthermore, Mini-LED is a flip-chip LED.

[0048] In some embodiments, Figure 1 , Figure 2 As shown, the transparent substrate 10 further includes a concave-convex structure 12 disposed between two adjacent grooves 11 , and a first reflective layer 13 is disposed on the surface of the concave-convex structure 12 .

[0049] The light-emitting body 21 is arranged closer to the bottom of the groove 11, and the light-emitting range of the light-emitting body 21 is in all directions, including the direction toward the bottom of the groove 11 or away from the bottom of the groove 11. A concave-convex structure 12 is provided on the same side of the transparent substrate 10 where the groove 11 is provided, and a first reflective layer 13 is provided on the surface of the concave-convex structure 12. The first reflective layer 13 can reflect light emitted in a direction away from the bottom of the groove 11 to a direction toward the bottom of the groove 11, and transmit it out from the transparent substrate on one side of the bottom of the groove 11, thereby increasing the light output rate on this side, while the light-emitting substrate is in a downward light output mode.

[0050] The first reflective layer 13 is arranged on the surface of the concavo-convex structure 12, so that the first reflective layer 13 also has concavo-convex undulations, so that the propagation direction of the reflected light is more dispersed, thereby replacing the light homogenizing film to achieve the effect of horizontal light homogenization. Since this arrangement does not require an additional light homogenizing film, on the one hand, the thickness of the light-emitting substrate can be reduced, and on the other hand, the cost of the light-emitting substrate can be reduced.

[0051] The first reflective layer 13 may be a metal reflective layer, such as a silver-plated layer or an aluminum-plated layer.

[0052] Specifically, Figure 1 , Figure 2 As shown, the concavo-convex structure 12 includes a plurality of first concave portions 121 arranged at intervals and convex portions 122 connecting adjacent first concave portions 121, and the depth h1 of the concave portions is greater than the depth h2 of the first concave portions. The depth h1 of the concave portions and the depth h2 of the first concave portions are both based on a plane where the end of the convex portion 122 farthest from the first concave portion 121 is located and is parallel to the transparent substrate 10 as a common reference.

[0053] In this embodiment, the first concave portion 121 in the concave-convex structure 12 is obtained by etching the transparent substrate, and the convex portion 122 is the portion left between the adjacent first concave portions 121 after etching. The depth h2 of the first concave portion is small, which can reduce the etching amount during the etching process, thereby improving the etching efficiency. The depth of the groove 11 is greater than the depth h2 of the first concave portion, which increases the accommodating volume of the groove 11, so that the groove 11 can accommodate most or even all of the light-emitting element 20, thereby effectively reducing the thickness of the light-emitting substrate.

[0054] Furthermore, the cross section of the protrusion 122 along the depth direction H of the groove 11 is trapezoidal, rectangular or hemispherical. That is, the protrusion 122 can be an oblique quadrangular prism, a truncated cone structure, a cubic column, a cylinder or a hemispherical structure. It should be noted that the cross section of the hemispherical shape is not strictly half of a sphere, and can be larger or smaller than half of a sphere.

[0055] Figure 1 The schematic diagram of the structure of the protrusion 122 is an oblique quadrangular prism, and the cross section thereof along the depth direction H of the groove 11 is a trapezoid. Figure 2 The schematic diagram of the raised portion 122 is a hemispherical structure, and its cross section along the depth direction H of the groove 11 is hemispherical. Figure 1 and Figure 2 The embodiment shown is different in that the relief structure 12 is different.

[0056] Furthermore, if Figure 3 , Figure 4 As shown, a plurality of dispersed second reflective layers 14 are provided at the bottom of the groove 11. Along the depth direction H of the groove 11, the second reflective layer 14 is located on one side of the light emitting body 21 close to the bottom of the groove 11. Figure 1 , Figure 2 The embodiment shown differs in that Figure 3 , Figure 4 A dispersed second reflective layer 14 is disposed at the bottom of the groove 11 .

[0057] In this embodiment, the plurality of dispersed second reflective layers 14 at the bottom of the groove 11 are used to disperse the vertical light emitted by the light emitting body 21 toward the bottom of the groove 11, thereby avoiding the phenomenon that the light intensity of the light emitting body 21 is too high at the position of the positive projection of the transparent substrate, and improving the visual effect of the light emitting substrate. As shown in FIG.-FIG., an embodiment of setting the second reflective layer 14 at the bottom of the groove 11 is shown.

[0058] In some embodiments, Figure 3 , Figure 4 As shown, the orthographic projection area of ​​the second reflective layer 14 at the bottom of the groove 11 is 20% to 80% of the total area of ​​the bottom of the groove 11 .

[0059] In this embodiment, the orthographic projection area of ​​the second reflective layer 14 at the bottom of the groove 11 is 20% to 80% of the total area of ​​the bottom of the groove 11, and the specific ratio can be determined according to the intensity of the light-emitting body 21 and the light transmission intensity of the surrounding area. The orthographic projection area of ​​the second reflective layer 14 reflects the coverage area of ​​the bottom of the groove 11. The orthographic projection area of ​​the second reflective layer 14 cannot be too large, so that all the light is reflected to other positions and emitted, causing the brightness of the orthographic projection area of ​​the light-emitting body 21 on the transparent substrate 10 to be too dark; the orthographic projection area of ​​the second reflective layer 14 cannot be too small, so that a large amount of light is emitted vertically, causing the brightness of the orthographic projection area of ​​the light-emitting body 21 on the transparent substrate 10 to be too high.

[0060] like Figure 3 , Figure 4The figure shows a schematic diagram of the second reflective layer 14 being disposed on the upper surface of the second recessed portion 15. In the present embodiment, the light emitting element 20 further comprises a transparent substrate 22, a light emitting body 21 is disposed on one side of the transparent substrate 22 away from the bottom of the groove 11, the light emitting body 21 is disposed on the other side of the transparent substrate 22, a plurality of spherical second recessed portions 15 are disposed at the bottom of the groove 11, and the second reflective layer 14 is disposed on the upper surface of the second recessed portion 15.

[0061] The light-emitting body 21 is arranged on the transparent substrate 22. The light emitted vertically by the light-emitting body 21 passes through the transparent substrate 22 and is emitted from the transparent substrate 10. Since the surface of the transparent substrate 22 is generally a plane, in order to disperse the vertical light emitted by the light-emitting body 21, the second reflective layer 14 is arranged on the upper surface of the spherical second recessed portion 15, so that the second reflective layer 14 is a spherical surface, which can evenly reflect the reflected light in all directions, thereby achieving the effect of dispersing the vertical light.

[0062] Figure 1-Figure 4 In the illustrated embodiment, the first reflective layer 13 and the light emitting element 20 are packaged in the same manner, and the first lead 23 and the second lead 24 are partially exposed outside the first packaging layer 40 . Figure 3 , Figure 4 The embodiment shown also illustrates that the light emitting element 20 is fixed in the groove 11 by means of the fusion adhesive 25. The coating height of the fusion adhesive 25 is slightly higher than the depth h1 of the groove. Figure 1 , Figure 2 The embodiment shown and Figure 5 , Figure 6 In the illustrated embodiment, the light emitting element 20 is also fixed in the groove 11 by bonding with a fusion adhesive 25, which is not shown in the figure. The light emitting substrate includes a first packaging layer 40, which is disposed on a side of the light emitting body 21 and the first reflective layer 13 away from the transparent substrate 10, and at least a portion of the first pin 23 and the second pin 24 are exposed outside the first packaging layer 40 for electrical connection with the cathode wiring 32 and the anode wiring 31.

[0063] In this embodiment, the light emitting element 20 includes a light emitting body 21 and a transparent substrate 22. Since the transparent substrate 22 has a certain thickness, the total thickness of the light emitting element 20 is relatively large. When it is disposed in the groove 11, a part of the structure protrudes above the upper surface of the groove 11. When the first encapsulation layer 40 encapsulates the light emitting element 20, at least part of the first pin 23 and the second pin 24 can be exposed outside the first encapsulation layer 40, that is, not covered by the first encapsulation layer 40, which facilitates the electrical connection of the first pin 23 and the second pin 24 with the cathode wiring 32 and the anode wiring 31, and can simplify the process. The first encapsulation layer 40 can prevent moisture or air from invading the interior of the first encapsulation layer 40, thereby protecting the first reflective layer 13 and the light emitting body 21, preventing the first reflective layer 13 from being oxidized and corroded, and strengthening the anchoring force between the light emitting body 21 and the bottom of the groove 11.

[0064] Figure 5 , Figure 6 It is a schematic structural diagram of the light emitting element 20 excluding the transparent substrate 22 , the epitaxial layer of the light emitting body 21 is a wavy structure, and the second reflective layer 14 is a planar structure parallel to the transparent substrate 10 .

[0065] In this embodiment, the transparent substrate 22 is peeled off from the light-emitting body 21 before the light-emitting element 20 is arranged in the groove, that is, the light-emitting element 20 does not include the transparent substrate 22. After the transparent substrate 22 is peeled off, the epitaxial layer of the light-emitting body 21 has a wavy structure. The wavy structure of the epitaxial layer can change the light emitting direction of the light-emitting body 21. Therefore, the second reflective layer 14 can be set as a reflective layer with a planar structure, so that the combination of the two can achieve the effect of dispersing the vertical light.

[0066] Figure 5 , Figure 6 For Figure 1-Figure 4 The packaging methods in the two are also slightly different. The difference is mainly due to Figure 5 , Figure 6 The light emitting element 20 does not include the transparent substrate 22, so the overall volume of the light emitting element 20 is very small and can be completely placed in the groove 11. The light emitting substrate also includes a second packaging layer 50, which is arranged on the side of the light emitting body 21 and the first reflective layer 13 away from the transparent substrate 10, and the upper surfaces of the first pin 23 and the second pin 24 are covered by the second packaging layer 50, and the first pin 23 and the second pin 24 are electrically connected to the cathode wiring 32 and the anode wiring 31 through the via 51.

[0067] In this embodiment, since the light emitting element 20 is entirely located in the groove 11, that is, the second encapsulation layer 50 covers the upper surfaces of the light emitting body 21, the first pin 23, and the second pin 24, and since the first pin 23 and the second pin 24 are covered by the second encapsulation layer 50, the cathode wiring 32 and the anode wiring 31 are electrically connected to the first pin 23 and the second pin 24 via 51. The second encapsulation layer 50 can prevent moisture or air from invading the interior of the second encapsulation layer 50, thereby protecting the first reflective layer 13 and the internal structure of the light emitting element 20, preventing the first reflective layer 13 from being oxidized and corroded, and strengthening the anchoring force between the light emitting element 20 and the bottom of the groove 11.

[0068] It is understandable that the first encapsulation layer 40 and the second encapsulation layer 50 may be encapsulation layers made of the same material. For example, the first encapsulation layer 40 and the second encapsulation layer 50 may be made of inorganic encapsulation layers, such as SiO X Layer, SiN X The first encapsulation layer 40 and the second encapsulation layer 50 can be manufactured by inkjet printing, spin coating of encapsulation glue or evaporation.

[0069] Depend on Figure 1-Figure 6 It can be seen that the light-emitting substrate also includes a third packaging layer 60, which is arranged on the side of the cathode wiring 32 and the anode wiring 31 away from the transparent substrate 10, and the orthographic projections of the light-emitting body 21, the cathode wiring 32, and the anode wiring 31 on the transparent substrate 10 are located within the orthographic projection range of the third packaging layer 60 on the transparent substrate 10.

[0070] In this embodiment, the orthographic projections of the light-emitting body 21, the cathode wiring 32, and the anode wiring 31 on the transparent substrate 10 are located within the orthographic projection range of the third packaging layer 60 on the transparent substrate 10, so that the third packaging layer 60 can prevent the cathode wiring 32 and the anode wiring 31 from being oxidized and corroded. The third packaging layer 60 can be used only to cover the area where the light-emitting element 20 and its metal wiring 30 are located, so as to achieve the purpose of cost saving.

[0071] Furthermore, the third encapsulation layer 60 is a white oil layer.

[0072] In this embodiment, the third encapsulation layer 60 is a white oil layer. In addition to the waterproof and anti-oxidation effects of the encapsulation layer, the white oil layer also has a certain reflective effect, further reducing the light leakage rate of the light-emitting body 21 on the white oil layer side.

[0073] A second aspect of the present application provides a method for manufacturing a light-emitting substrate, which is used to manufacture the light-emitting substrate described above. Figure 7 As shown, Figure 7 To form Figure 1 Schematic diagram of the steps for making a light-emitting substrate, including:

[0074] S1: providing a transparent substrate 10.

[0075] S2: Spin-coating a photoresist 16 on the transparent substrate 10, and sequentially performing exposure and development to form a desired pattern;

[0076] S3 : A first etching process forms the first portion 111 of the groove 11 .

[0077] S4: After a second etching process, a groove 11 and a concave-convex structure 12 between two adjacent grooves 11 are formed.

[0078] S5: forming a first reflective layer 13 on the surface of the concavo-convex structure 12 .

[0079] S6: embedding an LED device in the groove 11 , with the light-emitting surface of the LED device facing the bottom of the groove 11 , the LED device includes a light-emitting body 21 , and a first pin 23 and a second pin 24 of the light-emitting body 21 are located on a side away from the bottom of the groove 11 .

[0080] In this embodiment, since the depth h1 of the groove is relatively large, it is completed by etching twice, and the concave-convex structure 12 is formed during the second etching, which can reduce one etching process.

[0081] Specifically, after step S6, the method further includes the following steps:

[0082] S7 : forming a first encapsulation layer 40 on the side of the light emitting element 20 and the first reflective layer 13 away from the transparent substrate 10 to encapsulate the light emitting element 20 and the first reflective layer 13 , and the first pin 23 and the second pin 24 are exposed outside the first encapsulation layer 40 .

[0083] S8: Fabricate a metal trace 30 electrically connected to the first pin 23 and the second pin 24 on the same layer.

[0084] S9: Cutting the metal trace 30 to form a cathode trace 32 electrically connected to the first pin 23 and an anode trace 31 electrically connected to the second pin 24 .

[0085] S10 : forming a third encapsulation layer 60 on the side of the cathode wiring 32 and the anode wiring 31 away from the transparent substrate 10 , to encapsulate the cathode wiring 32 and the anode wiring 31 .

[0086] like Figure 8 Shown Figure 2 Schematic diagram of the production steps of the light-emitting substrate. Figure 2 and Figure 1 The difference lies in the shape of the concave-convex structure 12 of the two, and the only difference in the manufacturing process is the mask.

[0087] like Fig. 9 for Figure 3Schematic diagram of the production steps of the light-emitting substrate. Fig. 9 The figure also shows step S41: cleaning the photoresist 16. It should be noted that this step Figure 7 , Figure 8 , Figure 10-12 It is also contained in the text, but it is not indicated.

[0088] in addition Fig. 9 Production Figure 1 , Figure 2 The difference between the light-emitting substrate and the light-emitting substrate is that before forming the first reflective layer 13, it also includes step S42: making dispersed second recessed portions 15 at the bottom of the groove 11; and step S5 of forming the first reflective layer 13 is: forming the first reflective layer 13 and the second reflective layer 14. The following steps S6-S10 are simplified in the schematic diagram, combining the two steps into one step, but in fact they are still completed in two steps.

[0089] Fig.10 To form Figure 4 Schematic diagram of the steps of the light-emitting substrate, Fig.10 and Fig. 9 The steps are the same, except that step S4 of cleaning the photoresist 16 is not shown in the figure, and Fig.10 The concave-convex structure 12 and Fig. 9 different.

[0090] Fig.11 To form Figure 5 Schematic diagram of the steps of the light-emitting substrate, and Figure 7 The difference is that in step 5, the second reflective layer 14 is formed at the same time as the first reflective layer 13 is formed, and the second encapsulation layer 50 of step S6 completely encapsulates the light emitting element 20. Figure 7 It is different that the first packaging layer 40 does not completely wrap the first pin 23 and the second pin 24. Since the light-emitting element 20 is completely wrapped, after step S6 and before step S7, step S61 is also included to form a via 51 in the second packaging layer 50, so that the cathode wiring 32 is electrically connected to the second pin 24 through the via 51, and the anode wiring 31 is electrically connected to the first pin 23 through the via 51.

[0091] Fig.12 To form Figure 6 Schematic diagram of the steps of the light-emitting substrate Fig.11 The difference is that the concave-convex structures 12 of the two are different.

[0092] Figure 9-10 Examples and Figure 7 , Figure 8The difference between the embodiments is that a second reflective layer 14 is made at the bottom of the groove 11, and the second reflective layer 14 is made before the light-emitting element 20 is arranged in the groove 11. The groove 11 is first etched to form a second recessed portion 15, and then the second reflective layer 14 is deposited. After the second reflective layer 14 is deposited, a flat layer is generally deposited for flattening, and then the light-emitting element 20 is arranged in the groove 11. Figure 11-Figure 12 and Figure 9-10 The difference is that the light emitting element 20 only includes the light emitting body 21, and the transparent substrate 22 thereof is peeled off. Since the transparent substrate 22 is peeled off, the second reflective layer 14 and the Fig. 9 , Fig.10 It’s also different.

[0093] A third aspect of an embodiment of the present application provides an electronic device, comprising the light-emitting substrate described above.

[0094] The electronic device described in the application embodiment is a type of electronic device with a display function. Specifically, the electronic device includes but is not limited to a mobile phone, a notebook computer, a tablet computer, a laptop computer, a personal digital assistant or a wearable device. Among them, the wearable device includes but is not limited to a smart watch, a smart head-mounted display, etc.

[0095] The electronic device comprises a light emitting substrate, which is a bottom-emitting light emitting substrate and can reduce the light emitted from the upper side and improve the problem of uneven brightness between vertical light emission and surroundings.

[0096] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0097] Each embodiment in this specification is described in a related manner, and the same or similar parts between the embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0098] The above description is only a preferred embodiment of the present application and is not intended to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application are included in the protection scope of the present application.

Claims

1. A light-emitting substrate, characterized in that: include: A transparent substrate, wherein a plurality of grooves are provided on one side of the transparent substrate; A plurality of light-emitting elements are at least partially disposed in the groove, the light-emitting elements comprising a light-emitting body and a first pin and a second pin electrically connected to the light-emitting body, and along the depth direction of the groove, the first pin and the second pin are located on a side of the light-emitting body away from the bottom of the groove.

2. The light-emitting substrate according to claim 1, characterized in that: The transparent substrate further comprises a concave-convex structure arranged between two adjacent grooves, and a first reflective layer is arranged on the surface of the concave-convex structure.

3. The light-emitting substrate according to claim 2, characterized in that: The concave-convex structure comprises a plurality of first concave portions arranged at intervals and a convex portion connecting adjacent first concave portions; The depth of the groove is greater than the depth of the first recessed portion.

4. The light-emitting substrate according to claim 3, characterized in that: The cross section of the protrusion along the depth direction of the groove is trapezoidal, rectangular or hemispherical.

5. The light-emitting substrate according to any one of claims 1 to 4, characterized in that: A plurality of dispersedly arranged second reflective layers are disposed at the bottom of the groove, and along the depth direction of the groove, the second reflective layers are located at a side of the light emitting body close to the bottom of the groove.

6. The light-emitting substrate according to claim 5, characterized in that: The orthographic projection area of ​​the second reflective layer at the bottom of the groove is 20% to 80% of the total area of ​​the bottom of the groove.

7. The light-emitting substrate according to claim 5, characterized in that: The light emitting element further comprises a transparent substrate, the light emitting body is arranged on a side of the transparent substrate away from the bottom of the groove, a plurality of spherical second recessed parts are arranged at the bottom of the groove, and the second reflective layer is arranged on the upper surface of the second recessed part.

8. The light-emitting substrate according to claim 7, characterized in that: The light-emitting substrate includes a first packaging layer, which is arranged on a side of the light-emitting body and the first reflective layer away from the transparent substrate, and at least part of the first pin and the second pin are exposed outside the first packaging layer for electrical connection with the cathode wiring and the anode wiring.

9. The light-emitting substrate according to claim 5, characterized in that: The epitaxial layer of the light-emitting body is a wavy structure, and the second reflective layer is a planar structure parallel to the transparent substrate.

10. The light emitting substrate according to claim 9, characterized in that: The light-emitting substrate also includes a second packaging layer, which is arranged on a side of the light-emitting body and the first reflective layer away from the transparent substrate, the upper surfaces of the first pin and the second pin are covered by the second packaging layer, and the first pin and the second pin are electrically connected to the cathode wiring and the anode wiring vias.

11. The light-emitting substrate according to claim 8 or 10, characterized in that: The light-emitting substrate also includes a third packaging layer, which is arranged on a side of the cathode wiring and the anode wiring away from the transparent substrate, and the orthographic projections of the light-emitting body, the cathode wiring, and the anode wiring on the transparent substrate are located within the orthographic projection range of the third packaging layer on the transparent substrate.

12. The light emitting substrate according to claim 11, characterized in that: The third encapsulation layer is a white oil layer.

13. A method for manufacturing a light-emitting substrate, used for manufacturing the light-emitting substrate according to any one of claims 1 to 12, characterized in that: The following steps are involved: providing a transparent substrate; Spin-coating photoresist on the transparent substrate, and sequentially performing exposure, development, and first etching processes to form a first portion of the groove; After a second etching process, a groove and a concave-convex structure between two adjacent grooves are formed; forming a first reflective layer on the surface of the concavo-convex structure; An LED device is embedded in the groove, the light emitting surface of the LED device faces the bottom of the groove, and the LED device includes a light emitting body, wherein a first pin and a second pin of the light emitting body are located at a side away from the bottom of the groove.

14. An electronic device, characterized in that: The light-emitting substrate comprises the light-emitting substrate according to any one of claims 1 to 12.

Images