Circuit board structure, three-path power synthesis network and power synthesis circuit
By setting the insulating area on the sheet metal parts of the circuit board structure, the insulation distance between the micro -band transmission line and the cold plate is increased, the insertion loss of the power synthesis network is reduced, and the problem of increasing production costs in the existing technology is solved.
Patent Information
- Application Number
- CN202310913641.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-07-24
- Publication Date
- 2025-01-24
AI Technical Summary
Existing methods to reduce the insertion loss of power synthesis networks will increase production costs.
By arranging the first range of the first insulation area on the sheet metal part, the insulation distance between the microstrip transmission line and the cold plate is increased, thereby reducing the insertion loss. In this circuit board structure, it is only necessary to replace the sheet metal parts in the first insulation area with insulating materials to avoid increasing production costs.
Effectively reduce the insertion loss of power synthetic networks, at the same time avoid the increase in production costs, and solve the problem of increasing costs in existing technology.
Smart Images
Figure CN119364632A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of circuit structures, and in particular to a circuit board structure, a three-way power synthesis network and a power synthesis circuit. Background Art
[0002] Power synthesis refers to a method of directly synthesizing the outputs of multiple power amplifiers through some networks to increase the output power. The power synthesis circuit usually consists of a power distribution network, a power amplifier and a power synthesis network. Microstrip line is a microwave transmission line consisting of a single conductor strip supported on a dielectric substrate. It is suitable for making planar structure transmission lines for microwave integrated circuits. Compared with metal waveguides, it has technical advantages such as small size, light weight, wide frequency band, high reliability and low manufacturing cost.
[0003] When the number of power amplifiers is a multiple of 3, a 3-way combining network is usually part of the power combining network. In this case, the insertion loss of the power combining network is high.
[0004] Existing methods for reducing insertion loss of power combining networks increase production costs. Summary of the invention
[0005] In view of this, the purpose of the embodiments of the present application is to provide a circuit board structure, a three-way power synthesis network and a power synthesis circuit to solve the technical problem that the existing method of reducing the insertion loss of the power synthesis network will increase the production cost.
[0006] In a first aspect, an embodiment of the present application provides a circuit board structure method, the circuit board structure comprising:
[0007] A PCB board, wherein a microstrip transmission line is arranged on the bottom layer of the PCB board;
[0008] An insulating pad, the insulating pad is placed below the PCB board;
[0009] A sheet metal part, the sheet metal part is placed below the insulating pad, and the sheet metal part includes a first insulating area of a first range;
[0010] A cold plate is placed below the sheet metal component; wherein the PCB board is fixed on the cold plate based on the insulating pad and the sheet metal component.
[0011] In the above implementation process, by providing a first insulating area with a first range on the sheet metal, the insulation distance between the microstrip transmission line and the cold plate can be increased, the insertion loss of the microstrip transmission line can be reduced, and then the insertion loss of the power synthesis network connected for communication through the microstrip transmission line can be reduced. And the circuit board structure only needs to replace the sheet metal in the first insulating area with an insulating material, while reducing the insertion loss of the power synthesis network, it does not increase the production cost. The existing method of reducing the insertion loss of the power synthesis network solves the technical problem of increasing the production cost.
[0012] Optionally, in an embodiment of the present application, the first insulating area is filled with air.
[0013] In the above implementation process, a first range of air-filled area (first insulating area) is obtained by hollowing out corresponding positions on the sheet metal part. The production cost can be further reduced by replacing the filling of other insulating materials with air filling.
[0014] Optionally, in an embodiment of the present application, the first range is determined based on the microstrip transmission line and a projection range of a creepage spacing of the microstrip transmission line on the sheet metal component.
[0015] In the above implementation process, the first range can be greater than "the projection range of the microstrip transmission line and the creepage spacing of the microstrip transmission line on the sheet metal", and can also be less than or equal to "the projection range of the microstrip transmission line and the creepage spacing of the microstrip transmission line on the sheet metal". By making the first range less than or equal to "the projection range of the microstrip transmission line and the creepage spacing of the microstrip transmission line on the sheet metal", it is possible to avoid the first insulating area on the sheet metal being too large, so as to ensure the contact area between the PCB board and the cold plate in the circuit board structure, so as to ensure the heat dissipation effect of the PCB board.
[0016] Optionally, in an embodiment of the present application, the insulating pad includes a second insulating area of a second range; the second insulating area is filled with air.
[0017] In the above implementation process, a second range of air-filled area (second insulating area) is obtained by hollowing out corresponding positions on the insulating pad. The production cost can be further reduced by replacing the filling of other insulating materials with air filling.
[0018] Optionally, in an embodiment of the present application, the range area of the first range and the second range are the same.
[0019] In the above implementation process, since the range areas of the first range and the second range are the same, the excavation of the first insulating area and the excavation of the second insulating area can be carried out simultaneously. By increasing the excavation thickness, the difficulty of the excavation operation is reduced, thereby reducing the thickness deviation of the excavation result and improving the accuracy of the excavation result.
[0020] Optionally, in an embodiment of the present application, the first range or the second range is equal to the microstrip transmission line and the projection range of the creepage spacing of the microstrip transmission line on the sheet metal part or the insulating pad.
[0021] In the above implementation process, by limiting the first range and the second range to be equal to the microstrip transmission line and the projection range of the creepage spacing of the microstrip transmission line on the sheet metal or the insulating pad, the insertion loss of the circuit board structure can be better reduced while ensuring the contact area between the PCB board and the cold plate in the circuit board structure and the heat dissipation effect of the PCB board.
[0022] In a second aspect, an embodiment of the present application further provides a three-way power synthesis network, which is arranged on a circuit board structure as described in any one of the first aspects above, and the three-way power synthesis network includes: three groups of radio frequency resistors;
[0023] One end of each group of radio frequency resistors is connected to one end of the other two groups of radio frequency resistors based on a microstrip transmission line;
[0024] Wherein, the microstrip transmission line is arranged on the bottom layer of the PCB board of the circuit board structure.
[0025] In the above implementation process, one end of the RF resistor in the three-way power synthesis network is connected to one end of the other two groups of RF resistors based on the microstrip transmission line arranged on the "bottom layer of the PCB board in the circuit board structure shown in the first aspect"; since the sheet metal in the circuit board structure is provided with a first insulating area of the first range, the insulation distance between the microstrip transmission line and the cold plate can be increased, thereby reducing the insertion loss of the power synthesis network that communicates through the microstrip transmission line. And the three-way power synthesis network only needs to replace the sheet metal in the first insulating area with insulating materials, while reducing the insertion loss of the power synthesis network, it does not increase the production cost. It solves the technical problem that the existing method of reducing the insertion loss of the power synthesis network will increase the production cost.
[0026] Optionally, in an embodiment of the present application, the length-to-width ratio of the microstrip transmission line is greater than or equal to 10.
[0027] In the above implementation process, when the width of the microstrip transmission line is constant, the longer the length of the microstrip transmission line, the more obvious the improvement of the insertion loss of the three-way power synthesis network; when the length-to-width ratio of the microstrip transmission line is greater than or equal to 10, the three-way power synthesis network can significantly reduce the insertion loss of the three-way power synthesis network.
[0028] In a third aspect, an embodiment of the present application further provides a power synthesis circuit, which comprises: a power distribution network, a preset number of power amplifiers, and a three-way power synthesis network as described in any one of the second aspects above; wherein the preset number is a multiple of 3.
[0029] In the above implementation process, one end of the "RF resistor of the three-way power synthesis network" in the power synthesis circuit is connected to one end of the other two groups of RF resistors based on the microstrip transmission line arranged on the "bottom layer of the PCB board in the circuit board structure"; because the first insulating area of the first range is provided on the sheet metal in the circuit board structure, the insulation distance between the microstrip transmission line and the cold plate can be increased, thereby reducing the insertion loss of the power synthesis network that communicates through the microstrip transmission line. And the power synthesis circuit only needs to replace the sheet metal in the first insulating area with insulating materials, while reducing the insertion loss of the power synthesis network, it does not increase the production cost. It solves the technical problem that the existing method of reducing the insertion loss of the power synthesis network will increase the production cost.
[0030] Optionally, in an embodiment of the present application, the power amplifier and the three-way power synthesis network are both arranged on the PCB board.
[0031] In the above implementation process, unlike the existing method of raising the PCB board to reduce the insertion loss of the power synthesis network, the power amplifier and the three-way power synthesis network in the embodiment of the present application can be arranged on the same PCB board, thereby reducing the production cost of the power synthesis circuit. And because the power amplifier and the three-way power synthesis network can be arranged on the same PCB board, the power synthesis circuit provided by the embodiment of the present application will also have a better heat dissipation effect.
[0032] By adopting a circuit board structure, a three-way power synthesis network and a power synthesis circuit provided by the present application, a first insulating area with a first range is provided on the sheet metal, so that the insulation distance between the microstrip transmission line and the cold plate can be increased, thereby reducing the insertion loss of the power synthesis network that is connected for communication through the microstrip transmission line. Moreover, the circuit board structure only needs to replace the sheet metal in the first insulating area with an insulating material, which reduces the insertion loss of the power synthesis network without increasing the production cost; it solves the technical problem that the existing method of reducing the insertion loss of the power synthesis network will increase the production cost. BRIEF DESCRIPTION OF THE DRAWINGS
[0033] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0034] Figure 1 A schematic diagram of a circuit board structure provided in an embodiment of the present application;
[0035] Figure 2 A schematic diagram of a creepage clearance of a microstrip transmission line provided in an embodiment of the present application;
[0036] Figure 3 A schematic diagram of another circuit board structure provided in an embodiment of the present application;
[0037] Figure 4 A schematic diagram of insertion loss of a three-way power synthesis network provided in an embodiment of the present application;
[0038] Figure 5 A schematic diagram of insertion loss of another three-way power synthesis network provided in an embodiment of the present application;
[0039] Figure 6 A schematic diagram of the structure of a power synthesis circuit provided in an embodiment of the present application. DETAILED DESCRIPTION
[0040] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.
[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application.
[0042] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.
[0043] See also Figure 1 A schematic diagram of a circuit board structure 01 provided in an embodiment of the present application is shown. The circuit board structure includes:
[0044] A PCB board 10, wherein a microstrip transmission line is arranged on the bottom layer of the PCB board 10;
[0045] An insulating pad 20, the insulating pad 20 is placed under the PCB board 10;
[0046] A sheet metal part 30, the sheet metal part 30 is placed below the insulating pad 20, and the sheet metal part 30 includes a first insulating area 301 of a first range;
[0047] The cold plate 40 is placed below the sheet metal component 30 ; wherein the PCB board 10 is fixed on the cold plate 40 based on the insulating pad 20 and the sheet metal component 30 .
[0048] Among them, the microstrip transmission line is a microwave transmission line composed of a single conductor strip supported on a dielectric substrate. PCB board 10 refers to a printed circuit board; the material of the insulating pad 20 is PVC polyethylene or natural rubber, etc. By adding a layer of insulating pad 20 between the PCB board 10 and the cold plate 40, the bottom layer of the PCB board can be prevented from directly contacting the ground (the sheet metal part 30 in the embodiment of the present application) to increase the insulation. The sheet metal part 30 is a product processed by sheet metal technology, which can be a galvanized steel plate, a stainless steel plate or a cold-rolled plate. The cold plate 40 refers to a water-cooled plate (water-cooled radiator), and the cold plate 40 can be a medium such as water or ethanol to reduce the temperature of the PCB board 10 to achieve heat dissipation of the PCB board 10. The first range can be greater than "the projection range of the creepage spacing of the microstrip transmission line and the microstrip transmission line on the sheet metal part 30", and can also be less than or equal to "the projection range of the creepage spacing of the microstrip transmission line and the microstrip transmission line on the sheet metal part 30". The microstrip transmission line can specifically be a microstrip transmission line arranged on the bottom layer of the PCB board 10 to connect three groups of RF resistors in a three-way power synthesis network; it can also be a long-distance microstrip transmission line arranged on the bottom layer of the PCB board 10 for space and routing considerations.
[0049] It can be seen that the circuit board structure 01 provided in the embodiment of the present application can increase the insulation distance between the microstrip transmission line and the cold plate 40 by providing a first insulating area 301 of a first range on the sheet metal 30, can reduce the insertion loss of the microstrip transmission line, and further can reduce the insertion loss of the power synthesis network that communicates through the microstrip transmission line. And the circuit board structure 01 only needs to replace the sheet metal 30 in the first insulating area 301 with an insulating material, while reducing the insertion loss of the power synthesis network, it does not increase the production cost. The technical problem that the existing method of reducing the insertion loss of the power synthesis network increases the production cost is solved.
[0050] In some optional embodiments, the first insulating region 301 is filled with air.
[0051] The first insulating area 301 filled with air can be obtained by hollowing out the sheet metal part 30 in the first range. It is understandable that the first insulating area 301 can also be made of other insulating materials, such as PVC polyethylene or natural rubber, but compared with the technical solution of "the first insulating area 301 is filled with air" to be protected in this embodiment, the cost of "filling the first insulating area 301 with other insulating materials" is higher.
[0052] Please refer to Figure 2 , Figure 2 A schematic diagram of a creepage clearance of a microstrip transmission line provided in an embodiment of the present application.
[0053] In some optional embodiments, the first range is determined based on the microstrip transmission line 101 and the projection range of the creepage distance 102 of the microstrip transmission line 101 on the sheet metal part 30 .
[0054] The creepage distance 102 refers to a charged area where the insulating material around the microstrip transmission line 101 is charged due to the electric polarization of the insulating material.
[0055] Please refer to Figure 3 , Figure 3 A schematic diagram of another circuit board structure 02 provided in an embodiment of the present application.
[0056] In some optional embodiments, the insulating pad 20 includes a second insulating region 201 of a second range; the second insulating region 201 is filled with air.
[0057] Among them, by hollowing out the corresponding position on the insulating pad 20, a second range of air-filled area (second insulating area 201) is obtained, and the production cost can be further reduced by filling with air instead of filling with other insulating materials. It can be understood that the second insulating area 201 can also be realized by the original insulating material of the insulating pad 20; or by other insulating materials different from the insulating pad 20. However, compared with the technical solution of "the second insulating area 201 is realized by filling with air" to be protected by this embodiment, the material cost of "filling the second insulating area with the original insulating material of the insulating pad 20 or other insulating materials" is higher.
[0058] In some optional embodiments, the range area of the first range and the second range is the same.
[0059] The range of the first range and the second range can be determined based on the "projection range of the microstrip transmission line 101 and the creepage spacing 102 of the microstrip transmission line 101 on the sheet metal part 30" and the actual application scenario of the circuit board structure 01 (for example, the demand for loss reduction in the actual application scenario or the production cost demand of the circuit board structure, etc.). Specifically, the closer the first range and the second range are to the "projection range of the microstrip transmission line 101 and the creepage spacing 102 of the microstrip transmission line 101 on the sheet metal part 30", the higher the loss reduction, the higher the requirement for operation accuracy, and the higher the production cost of the corresponding circuit board structure. Accordingly, if the requirements for operating accuracy are lowered to reduce the production cost of the corresponding circuit board structure; at this time, even if the insertion loss reduction effect is guaranteed as much as possible, the first range and the second range may deviate from the "projection range of the microstrip transmission line 101 and the creepage spacing 102 of the microstrip transmission line 101 on the sheet metal 30" (including: the first range and the second range are greater than the "projection range of the microstrip transmission line 101 and the creepage spacing 102 of the microstrip transmission line 101 on the sheet metal 30", and the first range and the second range are less than the "projection range of the microstrip transmission line 101 and the creepage spacing 102 of the microstrip transmission line 101 on the sheet metal 30"); it can be understood that the lower the requirements for operating accuracy, the more likely the first range and the second range will deviate from the "projection range of the microstrip transmission line 101 and the creepage spacing 102 of the microstrip transmission line 101 on the sheet metal 30" to a greater extent.
[0060] In some optional embodiments, the first range or the second range is equal to the microstrip transmission line 101 and the projection range of the creepage distance of the microstrip transmission line 101 on the sheet metal part 30 or the insulating pad 20 .
[0061] Among them, due to construction errors, it cannot be guaranteed that the "first range or the second range" in the actual production process is absolutely equal to the "projection range of the microstrip transmission line 101 and the creepage spacing 102 of the microstrip transmission line 101 on the sheet metal part 30". The "first range or the second range" can be slightly larger than the "projection range of the microstrip transmission line 101 and the creepage spacing 102 of the microstrip transmission line 101 on the sheet metal part 30", or slightly smaller than the "projection range of the microstrip transmission line 101 and the creepage spacing 102 of the microstrip transmission line 101 on the sheet metal part 30".
[0062] Since the line width of the microstrip transmission line will also affect the insertion loss of the power synthesis network, the wider the line width, the lower the insertion loss of the corresponding power synthesis network, and the higher the transmission power that the microstrip transmission line can carry. The insertion loss of the corresponding power synthesis network can also be reduced by increasing the line width of the microstrip transmission line. The circuit board structure provided in the present application is to regard the PCB board 10 and the insulating pad 20 and the sheet metal 30 under the PCB board 10 as a whole, so that the microstrip transmission line 101 arranged on the bottom layer of the PCB board 10 is regarded as an asymmetric stripline transmission line. The copper foil on the top layer of the PCB board 10 is regarded as the upper layer ground of the asymmetric stripline transmission line, and the sheet metal 30 is the lower layer ground of the asymmetric stripline transmission line (after the insulating pad 20 and the sheet metal 30 are hollowed out, the cold plate 40 is regarded as the lower layer ground of the stripline), and the insulation thickness of the insulating pad 20 under the PCB board 10 is H2 (after the insulating pad 20 and the sheet metal 30 are hollowed out, the insulation thickness H2 is the sum of the thickness of the insulating pad 20 and the sheet metal 30).
[0063] In actual RF devices or equipment, in order to ensure low insertion loss, the characteristic impedance value of the transmission line is usually 50 ohms. Before hollowing out the insulating pad 20 and the sheet metal 30, the microstrip transmission line 101 can be regarded as an asymmetric stripline transmission line. At this time, the line width of the 50-ohm stripline transmission line is narrow and cannot carry a large transmission power. When other parameters remain unchanged, the characteristic impedance value of the stripline transmission line is proportional to H2; after hollowing out the insulating pad 20 and the sheet metal 30, H2 increases significantly, and the line width of the 50-ohm stripline transmission line will be closer to the actual line width of the microstrip transmission line 101. Accordingly, while meeting the transmission line width requirements (transmission power requirements), the insertion loss of the microstrip transmission line 101 will also be lower after hollowing out the insulating pad 20 and the sheet metal 30.
[0064] The embodiment of the present application further provides a three-way power synthesis network, which is arranged on a circuit board structure as described in any one of the first aspects above, and the three-way power synthesis network includes: three groups of radio frequency resistors;
[0065] One end of each group of RF resistors is connected to one end of the other two groups of RF resistors based on a microstrip transmission line 101;
[0066] The microstrip transmission line 101 is arranged on the bottom layer of the PCB board 10 of the circuit board structure.
[0067] The number of each group of RF resistors can be two or three, which is not specifically limited in this application. The microstrip transmission line 101 is arranged on the bottom layer of the PCB board of the circuit board structure, so that the structure size of the three-way power synthesis network can be miniaturized.
[0068] Please refer to Figure 4 , Figure 5 , Figure 4 A schematic diagram of insertion loss of a three-way power synthesis network in which "the sheet metal part 30 in the circuit structure board does not have the first insulating region 301" is provided in an embodiment of the present application. Figure 5 The insertion loss diagram of a three-way power synthesis network in which a sheet metal part in a circuit structure board has a first insulating region 301 is provided in an embodiment of the present application. Specifically, Figure 5 What is shown is: the sheet metal part 30 has a first insulating area 301 of a first range, the insulating pad 20 has a second insulating area 201 of a second range, the range areas of the first range and the second range are the same, the first range or the second range is equal to "the projection range of the microstrip transmission line 101 and the creepage spacing 102 of the microstrip transmission line 101 on the sheet metal part 30; and the air-filled area of the first range (first insulating area 301) is obtained by hollowing out the corresponding position on the sheet metal part 30; and the air-filled area of the second range (second insulating area 201) is obtained by hollowing out the corresponding position on the insulating pad 20". Insertion loss diagram of the three-way power synthesis network in this case.
[0069] in, Figure 4 , Figure 5 The figure shows "the insertion loss diagram of the three-way power synthesis network when the length of the microstrip transmission line 101 is 34.6 mm and other parameters are selected as optimal parameters". It can be understood that Figure 4 , Figure 5 Only a schematic diagram of insertion loss in a specific case is shown. Although the insertion loss of the three-way power synthesis network will be affected by the length of the microstrip transmission line 101, the models and parameters of the components in the circuit of the three-way power synthesis network will also affect the measured insertion loss. Figure 4 , Figure 5It can be seen that in the case where "the sheet metal part 30 in the circuit structure board (01 or 02) does not have the first insulating area 301", the insertion loss of the three-way power synthesis network is about 5.27dB, and the output power is 73dBm, corresponding to an actual input power of about 68.73dBm (7.46kW). In the case where "the sheet metal part 30 has a first insulating area 301 of a first range, the insulating pad 20 has a second insulating area 201 of a second range, the first range and the second range are the same, and the first range or the second range is equal to "the projection range of the microstrip transmission line 101 and the creepage spacing 102 of the microstrip transmission line 101 on the sheet metal part 30, and the air filling area of the first range (first insulating area 301) is obtained by hollowing out the corresponding position on the sheet metal part 30; and the air filling area of the second range (second insulating area 201) is obtained by hollowing out the corresponding position on the insulating pad 20". The insertion loss of the three-way power synthesis network is about 5.16dB, and the output power is 73dBm, corresponding to an actual input power of about 68.62dBm (7.28kW). In the above case, the insertion loss is reduced by 0.18kW by using the three-way power synthesis network provided in the present application, and the three-way input can reduce the insertion loss by about 0.54kW in total.
[0070] In addition, the insertion loss of the microstrip transmission line 101 can also be reduced by changing the line width of the microstrip transmission line 101. However, this method also faces the technical problem that the line width of the microstrip transmission line 101 is too narrow and cannot meet the transmission power requirement.
[0071] In some optional embodiments, the aspect ratio of the microstrip transmission line 101 is greater than or equal to 10.
[0072] Wherein, when the width of the microstrip transmission line 101 is constant, the longer the length of the microstrip transmission line 101, the more obvious the improvement of the insertion loss of the three-way power synthesis network; when the aspect ratio of the microstrip transmission line 101 is greater than or equal to 10, the three-way power synthesis network can significantly reduce the insertion loss of the three-way power synthesis network. Considering the actual size of the PCB board 10, the aspect ratio of the microstrip transmission line 101 is less than 80. Wherein, the line width of the 50-ohm microstrip transmission line is 0.86 mm, and the line width of the microstrip transmission line 101 can be 1.5 mm, or 1.2 mm, and the line width of the microstrip transmission line 101 can be adjusted according to the actual transmission power. Specifically, when the line width of the microstrip transmission line 101 is 1.5 mm, the length of the microstrip transmission line 101 can be 34.6 mm; when the line width of the microstrip transmission line 101 is 1.2 mm, the length of the microstrip transmission line 101 can be 36 mm. At this time, the aspect ratio of the microstrip transmission line 101 is 30.
[0073] It should be understood that the three-way power synthesis network has corresponding content with the embodiment of the above-mentioned circuit board structure. The specific functions of the three-way power synthesis network can be found in the specific description of the circuit board structure above. To avoid repetition, the detailed description is appropriately omitted here.
[0074] Please refer to Figure 6 , Figure 6 A schematic diagram of a power synthesis circuit 03 provided in an embodiment of the present application. The power synthesis circuit 03 comprises: a power distribution network 601, a preset number of power amplifiers 602, and a three-way power synthesis network 603 as described in any one of the second aspects above; wherein the preset number is a multiple of 3.
[0075] The power distribution network 601 is used to distribute power between the load and the power source. The number of the power amplifiers 602 can be 6, 9 or 3, etc. The power amplifiers 602 can be implemented by electronic tubes or transistors.
[0076] In some optional embodiments, the power amplifier 602 and the three-way power synthesis network 603 are both arranged on the PCB board.
[0077] It should be understood that the power synthesis circuit has corresponding content with the above-mentioned circuit board structure and the embodiment of the above-mentioned three-way power synthesis network. The specific functions of the power synthesis circuit can be found in the above-mentioned specific description of the circuit board structure and the three-way power synthesis network. In order to avoid repetition, the detailed description is appropriately omitted here.
[0078] In several embodiments provided by the embodiments of the present application, it should be understood that the disclosed circuit structure can also be implemented in other ways. The circuit structure embodiment described above is merely schematic, for example, the flow chart and block diagram in the accompanying drawings show the circuit structure according to multiple embodiments of the embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a part of a module, a program segment or a code, and a part of a module, a program segment or a code includes one or more executable instructions for realizing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order than those marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes also be executed in the opposite order, depending on the functions involved.
[0079] In addition, the functional modules in each embodiment of the present application can be integrated together to form an independent part, or each module can exist separately, or two or more modules can be integrated to form an independent part.
[0080] The above description is only an optional implementation manner of the embodiments of the present application, but the protection scope of the embodiments of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or replacements within the technical scope disclosed in the embodiments of the present application, which should be covered within the protection scope of the embodiments of the present application.
Claims
1. A circuit board structure, characterized in that: The circuit board structure comprises: A PCB board, wherein a microstrip transmission line is arranged on the bottom layer of the PCB board; An insulating pad, the insulating pad is placed below the PCB board; A sheet metal part, the sheet metal part is placed below the insulating pad, and the sheet metal part includes a first insulating area of a first range; A cold plate is placed below the sheet metal component; wherein the PCB board is fixed on the cold plate based on the insulating pad and the sheet metal component.
2. The circuit board structure according to claim 1, characterized in that: in, The first insulating region is implemented by filling with air.
3. The circuit board structure according to claim 2, characterized in that: in, The first range is determined based on the microstrip transmission line and a projection range of a creepage spacing of the microstrip transmission line on the sheet metal component.
4. The circuit board structure according to claim 2, characterized in that: in, The insulating pad comprises a second insulating region of a second range; the second insulating region is filled with air.
5. The circuit board structure according to claim 4, characterized in that: in, The first range and the second range have the same range area.
6. The circuit board structure according to claim 5, characterized in that: in, The first range or the second range is equal to the microstrip transmission line and the projection range of the creepage distance of the microstrip transmission line on the sheet metal part or the insulating pad.
7. A three-way power synthesis network, characterized in that: The three-way power synthesis network is arranged on the circuit board structure according to any one of claims 1 to 6, and the three-way power synthesis network includes: three groups of radio frequency resistors; One end of each group of radio frequency resistors is connected to one end of the other two groups of radio frequency resistors based on a microstrip transmission line; Wherein, the microstrip transmission line is arranged on the bottom layer of the PCB board of the circuit board structure.
8. The three-way power synthesis network according to claim 6, characterized in that: in, The aspect ratio of the microstrip transmission line is greater than or equal to 10.
9. A power synthesis circuit, characterized in that: The synthesis circuit comprises: a power distribution network, a preset number of power amplifiers and a three-way power synthesis network as described in claim 6 or 7 above; wherein the preset number is a multiple of 3.
10. The synthesis circuit according to claim 9, characterized in that: in, The power amplifier and the three-way power synthesis network are both arranged on the PCB board.