Wafer thinning equipment

Abstract

The invention provides a wafer thinning device. The wafer thinning equipment comprises a grinding module, the grinding module comprises a base table and a multi-station rotary table, and the multi-station rotary table is rotatably arranged on the base table through a rotary transmission system; the rotary transmission system comprises a synchronous belt, a driving assembly and a tensioning device, wherein the synchronous belt is configured to drive the multi-station rotary table to achieve station rotation, the driving assembly is configured to drive the synchronous belt, and the tensioning device is configured to control tensioning of the synchronous belt in real time. According to the wafer thinning equipment, the tensioning force of the synchronous belt can be monitored and adjusted in real time, and the transmission precision of the synchronous belt is ensured, so that the multi-station rotary table of the wafer thinning equipment has relatively high positioning precision during station rotation, and further wafer grinding and thinning precision is ensured.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology; more specifically, the present application relates to a wafer thinning device. Background Art

[0002] The semiconductor wafer thinning equipment in the prior art adopts a multi-station grinding system, which is composed of multiple workbenches, and each workbench is rotated to the required position by a turntable. The turntable carrying multiple workbenches is driven by a motor, and the multi-station rotation is achieved through a synchronous belt drive. Since the turntable has a large diameter, heavy mass, and high positioning accuracy, the requirements for the synchronous belt are relatively stringent. In addition to the high requirements for the accuracy and quality of the synchronous belt itself, the tension of the synchronous belt is also particularly important.

[0003] At present, the rotary transmission system of the thinning machine achieves tension by stretching the synchronous belt, and the tension is measured by a tension meter during the assembly of the base. This method can only set the preset value of the tension in the early stage of the base, but the tension cannot be detected during the operation of the base or after the base has been running for a long time, which may affect the rotation result of the turntable. Summary of the invention

[0004] In view of this, the present application provides a wafer thinning device, thereby solving or at least alleviating one or more of the above-mentioned problems and other problems existing in the prior art.

[0005] In order to achieve the aforementioned objectives, the first aspect of the present application provides a wafer thinning device, which includes a grinding module, and the grinding module includes a base and a multi-station turntable, and the multi-station turntable is rotatably arranged on the base via a rotary transmission system; the rotary transmission system includes: a synchronous belt configured to drive the multi-station turntable to realize station rotation, a driving component configured to drive the synchronous belt, and a tensioning device configured to control the tensioning of the synchronous belt in real time.

[0006] Optionally, the rotary transmission system further includes a driving assembly, which includes a rotary motor, a reducer and a pulley connected to an output shaft of the reducer, and the rotary motor is configured to drive the synchronous belt through the reducer and the pulley.

[0007] Optionally, the tensioning device includes a slide seat fixed on the base and a slide mounted on the slide seat in a slidable manner, the rotating motor and the reducer are arranged on the slide and can move with the slide, and the slide can be controlled to slide away from the multi-station turntable to tension the synchronous belt through the pulley.

[0008] Optionally, the rotating motor is located above the reducer, the reducer passes downward through the slide so that the output shaft of the reducer is located below the slide, and the pulley is sleeved to the output shaft of the reducer.

[0009] Optionally, the rotary transmission system includes a first tension wheel and a second tension wheel arranged between the pulley and the multi-station turntable, the first tension wheel and the second tension wheel are respectively arranged on both sides of the pulley, the synchronous belt wraps around the pulley with its inner side, and the first tension wheel and the second tension wheel are against the outer side of the synchronous belt.

[0010] Optionally, the distance between the first tensioning wheel and the second tensioning wheel is set so that the synchronous belt is parallel on both sides of the pulley.

[0011] Optionally, the first tensioning wheel and the second tensioning wheel are fixed to a tensioning wheel seat in parallel, and the tensioning wheel seat is fixed to the base.

[0012] Optionally, a motor seat is provided at the end of the slide seat facing away from the multi-station turntable, and a tensioning motor is provided on the motor seat. The tensioning motor is connected via a lead screw and controls the sliding of the slide.

[0013] Optionally, the motor seat is a Z-shaped plate, which includes a first end plate, a second end plate and an intermediate connecting plate located between the first end plate and the second end plate, the first end plate is connected to the end surface of the slide seat, the second end plate is used to fix the tensioning motor, the intermediate connecting plate extends horizontally along the sliding direction of the slide, the first end plate extends vertically downward from the end of the intermediate connecting plate toward the slide seat, and the second end plate extends vertically upward from the end of the intermediate connecting plate away from the slide seat.

[0014] Optionally, a screw frame is provided on the middle connecting plate of the motor seat, and the screw is supported by the screw frame and connected to the output shaft of the tensioning motor through a coupling.

[0015] Optionally, the output shaft of the tensioning motor passes through the first end plate, and the tensioning motor and the coupling are respectively located on both sides of the first end plate.

[0016] Optionally, the slide and the slide seat are joined by a guide rail slide groove structure, the first end of the guide rail slide groove structure is close to the multi-station turntable, the second end of the guide rail slide groove structure is away from the multi-station turntable, and the guide rail slide groove structure includes two guide rails located on both sides of the lead screw and parallel to the lead screw, and two slide grooves respectively cooperating with the two guide rails.

[0017] Optionally, the rotary transmission system has a control device and a tension sensor for measuring the tension of the synchronous belt, the tension sensor feeds back a tension signal to the control device, and the control device controls the tension motor according to the tension signal to adjust the tension of the synchronous belt.

[0018] Optionally, the control device is configured to: When the tensioning force reaches a preset value, the rotary transmission system is determined to be normal, and the tensioning motor is controlled to stop; When the tensioning force does not reach the preset value, it is determined that the rotary transmission system is abnormal, and the tensioning motor is controlled to start stretching the synchronous belt; When the tensioning force exceeds a preset value, the rotary transmission system is determined to be abnormal, and the tensioning motor is controlled to start releasing the synchronous belt; and When the tension force changes suddenly, the synchronous belt is judged to be abnormal and an alarm is issued.

[0019] Optionally, the tensioning force sensor is arranged at the first tensioning wheel and / or the second tensioning wheel.

[0020] Optionally, the rotary transmission system has a tensioning motor sensor, which measures the elongation of the synchronous belt, wherein: When the elongation of the synchronous belt reaches a preset value, a prompt is given to replace the synchronous belt; When the elongation of the synchronous belt does not reach the preset value, the tensioning motor sensor continues to detect the elongation of the synchronous belt.

[0021] It can be seen from the above technical scheme that the present application discloses a wafer thinning device, which can monitor and adjust the tension of the synchronous belt in real time to ensure the transmission accuracy of the synchronous belt, so that the multi-station turntable of the wafer thinning equipment has higher positioning accuracy when rotating the stations, thereby ensuring further wafer grinding and thinning accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The disclosure of the present application will become more apparent with reference to the accompanying drawings. It should be understood that these drawings are only for illustrative purposes and are not intended to limit the scope of protection of the present application. In the drawings: Figure 1 A schematic plan view of an embodiment of a wafer thinning device according to the present application; Figure 2 A three-dimensional schematic diagram of a grinding unit in another embodiment of a wafer thinning device according to the present application; Figure 3 for Figure 2 A three-dimensional schematic diagram of an embodiment of a rotary transmission system of a grinding unit; Figure 4 for Figure 3 A longitudinal section diagram of the mid-slewing transmission system; and Figure 5 The figure is a flow chart of an embodiment of a tensioning motor control method for wafer thinning equipment according to the present application.

[0023] Figure numerals: 1-wafer thinning equipment; 2-rotation transmission system; 3-base; 4-multi-station turntable; 5-synchronous belt; 6-rotating motor; 7-speed reducer; 8-output shaft of speed reducer; 9-pulley; 10-slide; 11-first tensioning wheel; 12-second tensioning wheel; 13-motor seat; 14-tensioning motor; 15-screw; 16-guide rail slide groove structure; 17-screw frame; 18-coupling; 19-tensioning wheel seat; 20-output shaft of tensioning motor; 2 1- nut; 22- tension sensor; 24- grinding spindle; 25- extension slot; 26- slide seat; 27- polishing robot; 28- cleaning system; 29- drying system; 30- rear-end measuring device; 31- equipment front-end module; 32- polishing module; 33- grinding module; 34- conveying assembly; 35- grinding unit; 36- cleaning unit; 37- grinding robot; 39- turntable; 40- workbench; 41- grinding wheel; 42- cleaning device. DETAILED DESCRIPTION

[0024] With reference to the accompanying drawings and specific embodiments, the structure, composition, characteristics and advantages of the rotary transmission system, wafer thinning equipment and control method thereof of the present application will be explained below in an exemplary manner. However, all descriptions should not be used to form any limitations on the present application.

[0025] For any single technical feature described or implied in the embodiments mentioned in this document, or any single technical feature displayed or implied in the drawings, this application still allows any combination or deletion between these technical features (or their equivalents) without any technical obstacles, and thus it should be considered that these more embodiments according to this application are also within the scope of the description of this document.

[0026] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features.

[0027] Figure 1 It is a schematic plan view of an embodiment of a wafer thinning device according to the present application.

[0028] As shown in the figure, the wafer thinning equipment 1 includes an equipment front-end module 31, a polishing module 32, a grinding module 33 and a conveying component 34, etc.

[0029] The equipment front-end module 31 is used to realize the entry and exit of wafers, and the equipment front-end module 31 is arranged at the front end of the wafer thinning equipment 1. The equipment front-end module 31 is a transition module for transporting wafers from the outside to the inside of the equipment base, and is used to realize the entry and exit of wafers.

[0030] The grinding module 33 is used to grind and thin the wafer. The grinding may include rough grinding and fine grinding. The grinding module 33 is, for example, disposed at the end of the wafer thinning device 1 .

[0031] The grinding module 33 may include a grinding unit 35, a cleaning unit 36 ​​and a grinding robot 37. The grinding unit 35 is used to implement wafer grinding and thickness measurement. Figure 1 As shown, the grinding unit 35 includes a base 3, a turntable 39 mounted on the base 3, a workbench 40 disposed on the turntable 39, and a grinding wheel 41 corresponding to the position of the workbench 40. The workbench 40 is used to carry the wafer and can also be called a wafer carrying table. The turntable 39 can rotate around its vertical central axis to drive the workbench 40 to change positions. Figure 1 As shown, in one embodiment, three workbenches 40 are provided, which can rotate between a rough grinding station, a fine grinding station and a loading and unloading station.

[0032] The two grinding wheels 41 respectively perform rough grinding and fine grinding. It is understandable that Figure 1 This is only an example, and the number of workbenches 40 and grinding wheels 41 can also be other values. The cleaning unit 36 ​​can be used to clean, polish and clean the wafer of the workbench 40. The grinding robot 37 is used to transfer wafers between the grinding unit 35 and the conveying assembly 34. The grinding robot 37 takes the wafer from the conveying assembly 34 and sends it to the grinding unit 35 for grinding. After the grinding and cleaning are completed, the grinding robot takes the wafer from the grinding unit 35 and places it in the conveying assembly 34 for the subsequent transmission of the wafer. The grinding robot 37 is provided with a pipeline that can be evacuated to achieve vacuum adsorption of the wafer. Alternatively, the grinding robot 37 can also be implemented by a mechanism with a clamping wheel. In one embodiment, the grinding robot 37 can also drive the wafer to rotate.

[0033] like Figure 1 As shown, in one embodiment of the present application, the grinding module 33 may further include a cleaning device 42, which is installed on the base 3 of the grinding module 33, located next to the turntable 39 and on the moving track of the grinding robot 37, and is used to clean the bottom surface of the wafer after grinding when the grinding robot 37 is transferring the wafer.

[0034] The polishing module 32 is used to perform chemical mechanical polishing on the wafer after the grinding is completed, and also has the function of transferring the wafer between these three modules (equipment front-end module 31, grinding module 33 and polishing module 32). The polishing module 32 is arranged between the equipment front-end module 31 and the grinding module 33.

[0035] The conveying assembly 34 is located at one side of the edge of the polishing module 32 and distributed along the length direction of the equipment, and can connect the front-end module 31 and the grinding module 33 of the equipment.

[0036] During the wafer processing, the wafer is taken out from the front-end module 31 of the equipment and transported to the grinding module 33 for grinding via the conveying assembly 34; after the wafer is ground in the grinding module 33, it is transported to the polishing module 32 for polishing via the conveying assembly 34 and the polishing robot 27; after polishing, the wafer is sequentially transferred to the cleaning system 28 and the drying system 29, and after cleaning and drying, the wafer is transferred back to the front-end module 31 of the equipment. The figure also shows the back-end measurement device 30, etc.

[0037] Understandably, Figure 1 The wafer thinning device shown is only an example. In other implementations, the polishing module 32 may be omitted, and only the device front-end module 31 and the grinding module 32 are retained. In addition, the grinding module 32 may also include multiple grinding passes, such as three passes, four passes, five passes, etc. Similar to these modified embodiments, as long as they can achieve wafer grinding and thinning, they should fall within the protection scope of this application.

[0038] Figure 2 It is a three-dimensional schematic diagram of a grinding unit in another embodiment of the wafer thinning device according to the present application.

[0039] As shown in the figure, the grinding unit may include a base 3, on which a multi-station rotary table 4, a grinding spindle 24 and a rotary transmission system 2 are arranged. Figure 1 The differences, specifically, Figure 2 In the example, the multi-station turntable 4 is provided with four work tables 40, namely, wafer carrying tables. Figure 1 Three workstations 40 are shown.

[0040] In this embodiment, the grinding unit can be integrally mounted on the wafer thinning equipment through the base 3, and is used to perform wafer thinning processing. The multi-station turntable 4 is mounted on the base 3, and can be driven on the base 3 to rotate between the loading and unloading stations and different grinding stations. Three grinding stations are shown in the figure, corresponding to the positions of the three grinding spindles 24 in the figure. The loading and unloading station can be close to the grinding robot of the grinding module to facilitate the loading and unloading of wafers. In the figure, the three grinding spindles 24 are equipped with grinding wheels, which grind the wafers when the workbench is located at the grinding station.

[0041] As shown in the figure, two of the three grinding spindles 24 of the grinding unit are located in parallel at the end of the base, and the other grinding spindle is located at the opposite end. The rotary transmission system 2 is arranged between the two grinding spindles at the end and is arranged on the base 3. The rotary transmission system 2 may include a rotary motor 6, a reducer 7, and a synchronous belt 5. The synchronous belt 5 may be wound around the periphery of the multi-station turntable 4 or the periphery of the rotating shaft at the bottom of the multi-station turntable 4. The rotary motor 6 drives the synchronous belt 5 through the reducer 7, and the synchronous belt 5 drives the multi-station turntable 4 to rotate, thereby realizing the rotation of the stations, i.e., rotation. The rotary motor 6 may be a servo motor.

[0042] exist Figure 2 The cleaning unit, grinding robot, etc. that may be arranged on the base 3 of the grinding unit are omitted in the figure. In the specific implementation, these devices can be arranged on the base as needed.

[0043] Figure 3 for Figure 2 A three-dimensional schematic diagram of an embodiment of a rotary transmission system of a grinding module. Figure 4 yes Figure 3 The longitudinal section diagram of the mid-slewing transmission system. Figure 3 and Figure 4 It is easier to understand the structure, working principle, function, etc. of the rotary transmission system.

[0044] As shown in the figure, the rotary transmission system 2 may include a synchronous belt 5 for driving the multi-station turntable 4 to realize the rotation of the workstation, a driving assembly for driving the synchronous belt 5, and a tensioning device configured to control the tension of the synchronous belt in real time. Specifically, the driving assembly includes a rotary motor 6, a reducer 7, and a pulley 9 connected to the output shaft 8 of the reducer, the synchronous belt 5 is sleeved on the pulley 9 of the output shaft 8 of the reducer, and the rotary motor 6 is configured to drive the synchronous belt 5 through the reducer 7 and the pulley 9. The tensioning device includes a slide seat 26 fixed on the base 3 and a slide 10 slidably mounted on the slide seat 26. The rotary motor 6 and the reducer 7 are arranged on the slide 10 and can move with the slide 10. Under the action of the tensioning motor 14 driving the screw rod 15, the movement of the slide 10 can drive the rotary motor 6, the reducer 7 and the pulley 9 to approach or move away from the multi-station turntable 4, thereby adjusting the tension of the synchronous belt 5. This rotary transmission system 2 can adjust the tension of the synchronous belt during the operation of the wafer thinning equipment and after the wafer thinning equipment has been running for a long time, which is conducive to the correct rotation of the turntable and improves the processing reliability of the wafer thinning equipment.

[0045] exist Figure 2In the figure, the slide seat 26 remains fixed, and the tension wheel seat 19 remains fixed relative to the slide seat 26. Both can be fixed on the base 3 at the same time. The multi-station turntable 4 is also fixed to the base 3, and as mentioned above, the multi-station turntable 4 can rotate on the base 3 to rotate the workstations. In order to make the enlargement of the rotary transmission system 2 clearer, the workstation turntable 4 is not shown in the figure, but the position of the multi-station turntable 4 can be judged according to the outline of the synchronous belt 5 extending from the first tension wheel 11 and the second tension wheel 12 in the figure. The synchronous belt 5 extending outward from the first tension wheel 11 and the second tension wheel 12 is wrapped around the outer peripheral side of the multi-station turntable 4 and almost wraps around the entire circumference of the multi-station turntable 4, so that the synchronous belt 5 can tightly wrap around the multi-station turntable 4 to prevent the synchronous belt 5 from accidentally detaching from the multi-station turntable 4.

[0046] The first tensioning wheel 11 and the second tensioning wheel 12 of the tensioning device are used to tighten the synchronous belt 5, and then the synchronous belt 5 passes through the first tensioning wheel 11 and the second tensioning wheel 12 and is wrapped around the pulley 9 on the output shaft 8 of the reducer. The first tensioning wheel 11 and the second tensioning wheel 12 are against the outside of the synchronous belt 5, and the synchronous belt 5 wraps around the pulley 9 with its inside. The "inside" refers to the side of the synchronous belt 5 that contacts the outer peripheral side of the multi-station turntable 4, and the "outside" refers to the side of the synchronous belt 5 that faces away from the multi-station turntable 4.

[0047] The rotating motor 6 and the reducer 7 can be vertically mounted to the slide 10. Figure 4 As shown in the figure, the rotary motor 6 is vertically connected to the reducer 7, and the output shaft of the rotary motor 6 extends downward. Similarly, the reducer 7 is vertically fixed to the slide 10, and the output shaft 8 of the reducer extends downward through the slide 10, so that the pulley 9 on the output shaft 8 of the reducer is located below the slide 10, and the synchronous belt 5 is wound around the pulley 9 below the slide 10. Figure 2 and Figure 3 It can be understood that an extension groove 25 is provided on the upper part of the slide seat 26. When the slide 10 drives the rotating motor 6 and the reducer 7 to move along the slide seat 26, the pulley 9 and the synchronous belt 5 can move in the extension groove 25 to provide movement space for the pulley 9 when adjusting the tension of the synchronous belt 5 to avoid movement interference.

[0048] A guide rail slot structure 16 is connected between the slide 10 and the slide seat 26, the first end of the guide rail slot structure 16 is close to the multi-station turntable 4, and the second end of the guide rail slot structure 16 is away from the multi-station turntable 4. Therefore, when the slide 10 moves on the slide seat 26, the distance from the pulley 9 to the multi-station turntable 4 is adjusted, so that the tension of the synchronous belt can be controlled. It should be understood that in a preferred embodiment, the pulley 9 moves in the radial direction of the multi-station turntable 4, that is, its moving direction passes through the center of the multi-station turntable 4, and the sliding direction of the slide 10, the extension direction of the guide rail groove structure 16, and the lead screw 15 are parallel to the moving direction of the pulley 9, and the synchronous belt 15 between the pulley 9 and the first tensioning wheel 11 and the second tensioning wheel 12 is parallel to the moving direction of the pulley 9, so that the synchronous belt 15 as a whole is symmetrical about the moving direction of the pulley 9, so that the synchronous belt 15 as a whole is more evenly stressed and avoids eccentric wear, and the tension generated by the pulley 9 on the synchronous belt 15 can be directly transmitted to the synchronous belt 15, and the deflection of the synchronous belt 15 will not cause only a part of the tension generated by the pulley 9 on the synchronous belt 15 to be used for tensioning the synchronous belt 15.

[0049] like Figure 2 and 3 As shown, the guide rail and slide groove structure 16 includes two guide rails located on both sides of the lead screw 15 and parallel to the lead screw 15, and two slide grooves respectively matched with the two guide rails. For example, guide rails are respectively arranged on both sides of the upper surface of the base 3, and the two guide rails are parallel and one end is close to the first tensioning wheel 11 and the second tensioning wheel 12, and the other end is away from the first tensioning wheel 11 and the second tensioning wheel 12, so that when the slide 10 moves away from the multi-station turntable 4 along the guide rails, the pulley 9 can tighten the synchronous belt 5. In coordination with the guide rails, a slide groove is formed on the lower surface of the slide 10, and the slide groove cooperates with the guide rails so that the slide 10 can slide on the slide seat 26. In the illustrated example, the extension direction of the guide rail and the slide groove can be parallel to the extension direction between the first tensioning wheel 11 and the second tensioning wheel 12, or toward the rotation center direction of the multi-station turntable 4.

[0050] In an optional embodiment, other mechanical guiding mechanisms may be used to replace the guide rail slide groove structure.

[0051] Also like Figure 3, the tensioning motor 14 is connected to the end of the slide seat 26 through the motor seat 13, the output shaft 20 of the tensioning motor is connected to the lead screw 15 through the coupling 18, the lead screw 15 is engaged with the nut 21, and the nut 21 can be fixed to the slide 10 by screws. For example, a receiving hole can be provided in the slide 10, the nut 21 extends into the receiving hole, and can be constructed to have a clearance fit with the nut. After the tensioning motor 14 is started, the output shaft 20 of the tensioning motor drives the lead screw 15 to rotate, and the lead screw 15 pulls the slide 10 through the nut 21, so that the slide 10 slides on the slide seat 26, thereby tensioning the synchronous belt 5. The tensioning motor 14 can be a servo motor, and the servo motor can feedback current signals and / or torque signals for control. For example, the tensioning motor can receive feedback signals from a tensioning force sensor and a servo motor sensor, and control the tensioning motor based on these feedback signals. The specific control method can be seen in the description of the tensioning force sensor and the servo motor sensor in this specification.

[0052] As can be seen from the figure, the motor seat 13 is a Z-shaped plate. The Z-shaped plate includes two end plates, namely a first end plate and a second end plate, and an intermediate connecting plate is provided between the first end plate and the second end plate. The first end plate of the Z-shaped plate is connected to the end surface of the slide seat 26, the second end plate of the Z-shaped plate is used to fix the tensioning motor 14, the intermediate connecting plate extends horizontally along the sliding direction of the slide 10, the first end plate extends vertically downward from the end of the intermediate connecting plate facing the slide seat 26, and the second end plate extends vertically upward from the end of the intermediate connecting plate facing away from the slide seat 26.

[0053] The output shaft 20 of the tensioning motor passes through the second end plate of the Z-shaped plate, and the tensioning motor 14 and the coupling 18 are respectively located on both sides of the second end plate. A lead screw frame 17 is provided on the middle connecting plate of the Z-shaped plate, and one end of the connecting coupling 18 of the lead screw 15 passes through the lead screw frame and is held in place by the lead screw frame 17. In addition, the middle connecting plate and the first end plate of the Z-shaped plate are both lower than the slide plate 10 and lower than the nut 21, so that the slide plate 10 will not interfere with it when it moves close to the Z-shaped plate.

[0054] In order to measure the tension of the synchronous belt 5, as shown in the figure, a tension sensor 22 may be provided at one or both of the first tension wheel 11 and the second tension wheel 12, which may be connected to the machine interface (not shown) of the wafer thinning device 1 and the tension motor 14 for communication. The tension sensor 22 may be provided with a preset tension value. If the tension sensor measures that the tension of the synchronous belt 5 reaches the preset value, the signal is transmitted to the machine interface to display normal at the machine interface of the wafer thinning device 1; if the tension of the synchronous belt 5 exceeds or does not reach the preset value, the tension sensor 22 feeds back the signal to the tension motor 14, and the tension motor 14 stretches or contracts the synchronous belt 5 through transmission to make it reach the preset value.

[0055] A servo motor sensor (not shown) may be provided at the tensioning motor 14 to monitor the elongation of the synchronous belt 5. For example, the servo motor sensor may be a displacement sensor. The displacement sensor may be set with a preset value for the elongation, and monitors the elongation of the synchronous belt 5 in real time. When the elongation of the synchronous belt 5 reaches the preset value, the machine interface prompts to replace the synchronous belt 5; when the elongation of the synchronous belt 5 does not reach the preset value, the monitoring continues. Here, when the elongation reaches the preset value, it can be considered that the synchronous belt has reached the fatigue limit, and an early warning can be issued to perform maintenance operations on the synchronous belt.

[0056] In addition, when the monitoring value of the tensioning force sensor changes suddenly, it is determined that the synchronous belt 5 is damaged or abnormal, and an alarm can be issued in time to avoid unnecessary dangerous situations.

[0057] In an optional embodiment, the tension force and the elongation can be dual-monitored to make the system safer and more reliable.

[0058] Figure 5 The figure is a flow chart of an embodiment of a tensioning motor control method for wafer thinning equipment according to the present application.

[0059] The rotary transmission system of the present application may have a control device (not shown) that can receive feedback signals from the tensioning force sensor and the tensioning motor sensor, and control the tensioning motor or issue an alarm according to the feedback signals from the tensioning force sensor and the tensioning motor sensor.

[0060] As described above, the tension sensor is used to measure the tension of the synchronous belt. When the tension is abnormal, the tension of the synchronous belt can be adjusted by the tension motor. Specifically, the tension sensor feeds back the tension signal to the control device, and the control device controls the tension motor 14 according to the tension signal to adjust the tension of the synchronous belt 5. The tension motor sensor (not shown) is used to measure the elongation of the synchronous belt. When the elongation is abnormal, the synchronous belt can be replaced.

[0061] Combination Figure 5 It is understood that an embodiment of the wafer thinning motor or the rotary transmission system can be controlled by a control device, and the control method thereof can include the following steps I to III. Steps I to III can be performed synchronously in real time.

[0062] Step I: Monitor whether the tension of the synchronous belt changes suddenly. If so, it is determined that the synchronous belt is damaged, and an alarm is issued by the machine interface of the wafer thinning equipment.

[0063] The sudden change of the tension of the synchronous belt can be monitored by the tension sensor. Based on the sudden change of the tension of the synchronous belt, it can be determined that the synchronous belt is damaged. At this time, the machine interface of the wafer thinning equipment can issue an alarm prompt to warn that the synchronous belt is abnormal. When no sudden change of the tension is detected, the tension value of the synchronous belt can also be continuously monitored, as described in step II.

[0064] Step II: monitor whether the tension of the synchronous belt is a preset value. If it is, the machine interface displays that the synchronous belt is normal. Otherwise, the tensioning motor stretches or releases the synchronous belt through transmission to make it reach the preset value.

[0065] The synchronous belt needs to be under appropriate tension to work in the best state without accelerated fatigue wear or slipping. Therefore, in this step, it is monitored and judged whether the tension of the synchronous belt is the preset value. When the tension of the synchronous belt is the preset value, the machine interface shows that the synchronous belt is normal; when the tension of the synchronous belt is not the preset value, the tensioning motor stretches or releases the synchronous belt through transmission to make it reach the preset value.

[0066] Step III: Based on the feedback information from the tensioning motor sensor, monitor in real time whether the elongation of the synchronous belt is the preset value. If it is, the machine interface prompts to replace the synchronous belt, otherwise the rotary transmission system operates normally.

[0067] The tensioning motor sensor is used to monitor the elongation of the synchronous belt. The elongation of the synchronous belt is calculated based on the feedback information of the tensioning motor sensor, and it can be determined whether the elongation of the synchronous belt is the preset value. If the elongation of the synchronous belt does not reach the preset value, the rotary transmission system operates normally; if the elongation of the synchronous belt reaches the preset value, the machine interface prompts to replace the synchronous belt, and the specific prompt method can be displayed on the machine interface. "Replace synchronous belt".

[0068] Since the turntable of the wafer thinning equipment has a large diameter, heavy mass, and high positioning accuracy, the requirements for the synchronous belt are relatively stringent. In addition to the high requirements for the accuracy and quality of the synchronous belt itself, the tension of the synchronous belt is also particularly important. It can be seen from the above embodiments that the present application can advantageously maintain safe and stable operation of the rotary transmission system by monitoring and controlling the tension and elongation of the synchronous belt.

[0069] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0070] Although the optional embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they are aware of the basic creative concept. Therefore, the appended claims are intended to be interpreted as including optional embodiments and changes and modifications that fall within the scope of the present application.

[0071] In this document, terms such as "include", "comprises" or any other variations are intended to cover non-exclusive inclusion, so that a process, method, article or other terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, as well as elements fixed to such process, method, article and terminal device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or terminal device including the element.

[0072] The technical solution provided by the present application is introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for general technicians in this field, according to the idea of ​​the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A wafer thinning device, characterized in that: The wafer thinning device (1) comprises a grinding module, wherein the grinding module comprises a base (3) and a multi-station turntable (4), wherein the multi-station turntable (4) is rotatably arranged on the base (3) via a rotary transmission system (2); the rotary transmission system (2) comprises: A synchronous belt (5) configured to drive the multi-station turntable (4) to realize station rotation; A drive assembly configured to drive the timing belt (5); and A tensioning device configured to control the tensioning of the synchronous belt (5) in real time.

2. The wafer thinning device according to claim 1, characterized in that: The driving assembly comprises a rotating motor (6), a reducer (7) and a pulley (9) connected to an output shaft (8) of the reducer, and the rotating motor (6) is configured to drive the synchronous belt (5) through the reducer (7) and the pulley (9).

3. The wafer thinning device according to claim 2, characterized in that: The tensioning device comprises a slide seat (26) fixed on the base (3) and a slide (10) slidably mounted on the slide seat (26); the rotary motor (6) and the reducer (7) are arranged on the slide (10) and can move with the slide (10); the slide (10) can be controlled to slide away from the multi-station turntable (4) so ​​as to tension the synchronous belt (5) through the pulley (9).

4. The wafer thinning device according to claim 3, characterized in that: The rotating motor (6) is located above the reducer (7), the reducer (7) passes downward through the slide (10) so that the output shaft (8) of the reducer is located below the slide (10), and the pulley (9) is sleeved on the output shaft (8) of the reducer.

5. The wafer thinning device according to any one of claims 1 to 4, characterized in that: The rotary transmission system (2) comprises a first tensioning wheel (11) and a second tensioning wheel (12) which are arranged between the pulley (9) and the multi-station turntable (4); the first tensioning wheel (11) and the second tensioning wheel (12) are arranged on both sides of the pulley (9), respectively; the synchronous belt wraps around the pulley (9) with its inner side; and the first tensioning wheel (11) and the second tensioning wheel (12) abut against the outer side of the synchronous belt (5).

6. The wafer thinning device according to claim 5, characterized in that: The spacing between the first tensioning wheel (11) and the second tensioning wheel (12) is arranged so that the synchronous belt (5) is parallel on both sides of the pulley (9).

7. The wafer thinning device according to claim 5, characterized in that: The first tensioning wheel (11) and the second tensioning wheel (12) are fixed to a tensioning wheel seat (19) in parallel, and the tensioning wheel seat (19) is fixed to the base (3).

8. The wafer thinning device according to claim 5, characterized in that: A motor seat (13) is arranged at the end of the slide seat (26) facing away from the multi-station turntable (4), and a tensioning motor (14) is arranged on the motor seat (13). The tensioning motor (14) is connected via a lead screw (15) and controls the sliding of the slide (10).

9. The wafer thinning device according to claim 8, characterized in that: The motor seat (13) is a Z-shaped plate, comprising a first end plate, a second end plate and an intermediate connecting plate located between the first end plate and the second end plate, the first end plate being connected to the end surface of the slide seat (26), the second end plate being used to fix the tensioning motor (14), the intermediate connecting plate extending horizontally along the sliding direction of the slide (10), the first end plate extending vertically downward from the end of the intermediate connecting plate facing the slide seat (26), and the second end plate extending vertically upward from the end of the intermediate connecting plate facing away from the slide seat (26).

10. The wafer thinning device according to claim 9, characterized in that: A screw frame (17) is provided on the middle connecting plate of the motor seat (13); the screw (15) is supported by the screw frame (17) and connected to an output shaft (20) of a tensioning motor via a coupling (18).

11. The wafer thinning device according to claim 10, characterized in that: The output shaft (20) of the tensioning motor passes through the first end plate, and the tensioning motor (14) and the coupling (18) are respectively located on both sides of the first end plate.

12. The wafer thinning device according to claim 8, characterized in that: The slide (10) and the slide seat (26) are connected via a guide rail slot structure (16), a first end of the guide rail slot structure (16) is close to the multi-station turntable (4), a second end of the guide rail slot structure (16) is away from the multi-station turntable (4), and the guide rail slot structure (16) includes two guide rails located on both sides of the lead screw (15) and parallel to the lead screw (15) and two slots respectively matched with the two guide rails.

13. The wafer thinning device according to claim 8, characterized in that: The rotary transmission system (2) comprises a control device and a tensioning force sensor (22) for measuring the tensioning force of the synchronous belt (5); the tensioning force sensor (22) feeds back a tensioning force signal to the control device; and the control device controls the tensioning motor (14) according to the tensioning force signal, thereby adjusting the tensioning force of the synchronous belt (5).

14. The wafer thinning device according to claim 13, characterized in that: The control device is configured as follows: When the tensioning force reaches a preset value, it is determined that the rotary transmission system (2) is normal, and the tensioning motor (14) is controlled to stop; When the tensioning force does not reach a preset value, it is determined that the rotary transmission system (2) is abnormal, and the tensioning motor (14) is controlled to start stretching the synchronous belt (5); When the tensioning force exceeds a preset value, the rotary transmission system (2) is determined to be abnormal, and the tensioning motor (14) is controlled to start releasing the synchronous belt (5); and When the tensioning force suddenly changes, the synchronous belt (5) is judged to be abnormal and an alarm is issued.

15. The wafer thinning device according to claim 13, characterized in that: The tensioning force sensor (22) is arranged on the first tensioning wheel (11) and / or the second tensioning wheel (12).

16. The wafer thinning device according to claim 13, characterized in that: The rotary transmission system (2) has a tensioning motor sensor, which measures the elongation of the synchronous belt (5), wherein: When the elongation of the synchronous belt (5) reaches a preset value, a prompt is given to replace the synchronous belt (5); When the elongation of the synchronous belt (5) does not reach a preset value, the tensioning motor sensor continues to detect the elongation of the synchronous belt (5).

Images