A plasma spraying device and a method of using the same

Abstract

The present invention relates to the technical field of plasma spraying devices, and discloses a plasma spraying device and a method for using the same, comprising a spraying box, wherein two support rollers and two transmission rollers are respectively installed between the inner walls on opposite sides of the spraying box, the outer surfaces of the two support rollers are sleeved with a conveyor belt, the outer surfaces of the two transmission rollers are sleeved with a transmission belt, the transmission belt is arranged above the conveyor belt, a plurality of connection blocks are fixedly installed at equal intervals on the outer surface of the transmission belt, and a mounting plate is fixedly installed on the outer surface of the connection block. The present invention can continuously load a plurality of circular semiconductor wafers through the conveyor belt, and can continuously perform plasma spraying operations on the circular semiconductor wafers on the conveyor belt through a plasma thermal spray gun installed on the transmission belt, and can effectively improve the efficiency of plasma spraying operations on the surfaces of the plurality of circular semiconductor wafers.

Description

Technical Field

[0001] The present invention relates to the technical field of plasma spraying devices, and in particular to a plasma spraying device and a use method thereof. Background Art

[0002] Plasma spraying is a technology for strengthening and modifying the surface of materials. It uses a plasma arc driven by direct current as a heat source to heat ceramics, alloys, metals and other materials to a molten or semi-molten state, and then sprays them at high speed onto the pre-treated workpiece surface to form a firmly attached surface layer.

[0003] An existing plasma spraying process for semiconductor-grade silicon (Announcement No.: CN111962007B) has at least the following disadvantages: the above patent starts a driving motor to achieve reciprocating movement of the connecting plate and the two mounting plates, thereby achieving reciprocating movement of the circular semiconductor wafer. When the driving motor works stably, two plasma emitters are started, and the surface of the circular semiconductor wafer can be plasma sprayed by the plasma emitters; because the above patent can only plasma spray the surface of one circular semiconductor wafer at a time, when there are many circular semiconductor wafers to be plasma sprayed, the efficiency of plasma spraying one by one is low. Summary of the invention

[0004] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a plasma spraying device and a method of using the same.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A plasma spraying device comprises a spraying box, wherein two supporting rollers and two driving rollers are respectively installed between inner walls on opposite sides of the spraying box, the two supporting rollers are arranged below the two driving rollers, the outer surfaces of the two supporting rollers are sleeved with conveyor belts, the outer surfaces of the two driving rollers are sleeved with driving belts, the driving belts are arranged above the conveyor belts, a plurality of connecting blocks are fixedly installed at equal intervals on the outer surface of the driving belt, a mounting disk is fixedly installed on the outer surface of the connecting block, a turntable is rotatably installed on the outer surface of the mounting disk away from the connecting block, a plasma thermal spray gun is installed on the outer surface of the turntable, a moving mechanism is installed between the turntable and the plasma thermal spray gun, and a rotating mechanism is installed between the turntable and the inner wall of the spraying box.

[0007] As a further solution of the present invention, the moving mechanism includes a rectangular frame fixedly mounted on the outer surface of the turntable away from the mounting plate, a slider is slidably mounted on the inner wall of the rectangular frame, the plasma thermal spray gun is rotatably mounted on the outer surface of the slider, a feeding device is fixedly mounted on the outer surface of the mounting plate away from the connecting block, a feeding pipeline that is interconnected is fixedly mounted between the feeding device and the plasma thermal spray gun, a conductive component is installed between the feeding device and the spray box, and a moving component is installed between the rectangular frame and the slider.

[0008] As a further solution of the present invention, the conductive component includes a conductive spring fixedly mounted on the outer surface of the feeding device close to the spray box, and a conductive contact strip is fixedly mounted on the inner wall of the spray box close to the conductive spring, and the conductive contact strip is located below the transmission belt.

[0009] As a further solution of the present invention, the moving assembly includes a reciprocating screw rod that is rotatably installed between the opposite ends of the rectangular frame. The reciprocating screw rod passes through the outer surface of the slider and is threadedly connected to it. A transmission assembly is installed between the reciprocating screw rod and the mounting plate.

[0010] As a further solution of the present invention, the transmission assembly includes a transmission gear fixedly mounted on one end of the reciprocating screw rod, and a plurality of tooth grooves are evenly arranged in the circumferential direction on the outer surface of the mounting plate close to the turntable, and the transmission gear meshes with the tooth grooves.

[0011] As a further solution of the present invention, the rotating mechanism includes a gear ring fixedly mounted on the outer periphery of the turntable, and a rack matching the gear ring is fixedly mounted on the inner wall of the spray box on the side opposite to the conductive contact strip.

[0012] As a further solution of the present invention, a plurality of positioning mechanisms are evenly installed on the outer surface of the conveyor belt, and the positioning mechanism includes a mounting block fixedly installed on the outer surface of the conveyor belt, a placing plate is fixedly installed on the outer surface of the mounting block, and four arc-shaped positioning blocks arranged in a ring are evenly fixedly installed in the circumferential direction of the upper surface of the placing plate, and a clamping assembly for clamping the workpiece is also installed on the outer surface of the placing plate.

[0013] As a further solution of the present invention, the clamping assembly includes a reset spring fixedly mounted on the outer surface of the placing plate, a connecting column is fixedly mounted on the outer surface of the reset spring close to the arc-shaped positioning block, a clamping block is fixedly mounted on the end of the connecting column away from the reset spring, and the inner walls of the spray box on both sides opposite to each other above the conveyor belt are fixedly mounted with tightening strips corresponding to the reset spring.

[0014] As a further solution of the present invention, a plurality of support wheels are fixedly installed at equal distances on both side edges of the transmission belt, guide grooves matching the support wheels are opened on the inner walls of the opposite sides of the spray box, the support wheels are slidably installed on the inner walls of the guide grooves, and a stepper motor 1 and a stepper motor 2 are fixedly installed on the outer surface of the spray box, the output end of the stepper motor 1 is fixedly installed on the rotation center of one of the transmission rollers, and the output end of the stepper motor 2 is fixedly installed on the rotation center of one of the support rollers.

[0015] A method for using a plasma spraying device comprises the following steps:

[0016] S1: placing the circular semiconductor wafer to be plasma sprayed between four arc-shaped positioning blocks on the placement plate installed on the outer surface of the feeding end of the conveyor belt by a robotic arm, so that the conveyor belt can transport the circular semiconductor wafer to the inside of the spray box through the placement plate, and clamp the circular semiconductor wafer by a clamping assembly;

[0017] S2: While the conveyor belt is conveying, the transmission belt will synchronously drive the plasma thermal spray gun on its outer surface to move, so that the corresponding plasma thermal spray gun can be aligned with the circular semiconductor wafer placed on the tray on the conveyor belt, so that the plasma thermal spray gun performs plasma spraying operation on the surface of the circular semiconductor wafer;

[0018] S3: Through the cooperation of the moving mechanism and the rotating mechanism, the plasma thermal spray gun can perform a reciprocating spraying operation while performing a rotating spraying operation, thereby achieving a comprehensive spraying effect on the surface of the circular semiconductor wafer.

[0019] The beneficial effects of the present invention are:

[0020] 1. When the gear ring installed on the mounting plate moves to the rack, the gear ring will mesh with the rack, so that the gear ring can roll on the rack, so that the gear ring drives the turntable to rotate, so that the plasma thermal spray gun installed on the turntable rotates accordingly, so that the plasma thermal spray gun can perform a circumferential spray operation on the surface of the circular semiconductor wafer;

[0021] 2. When the turntable drives the rectangular frame to rotate, the transmission gear installed on the outer side of the rectangular frame through the reciprocating screw will rotate accordingly. Since the transmission gear is meshed with the tooth groove provided on the mounting plate, the transmission gear can drive the reciprocating screw to rotate under the action of the tooth groove, so that the reciprocating screw drives the plasma thermal spray gun to move back and forth along the length direction of the rectangular frame through the slider threadedly connected thereto, so that the plasma thermal spray gun can perform a comprehensive spraying operation on the surface of the circular semiconductor wafer;

[0022] 3. A plurality of circular semiconductor wafers can be continuously loaded through the conveyor belt, and a plasma thermal spraying gun installed on the transmission belt can continuously perform plasma spraying on the circular semiconductor wafers on the conveyor belt, which can effectively improve the efficiency of plasma spraying on the surfaces of the plurality of circular semiconductor wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the overall structure of a plasma spraying device proposed by the present invention;

[0024] Figure 2 A schematic diagram of the internal structure of a plasma spraying device proposed by the present invention;

[0025] Figure 3 A schematic diagram of the bottom structure of a mounting plate of a plasma spraying device proposed by the present invention;

[0026] Figure 4 A schematic diagram of a slider structure of a plasma spraying device proposed by the present invention;

[0027] Figure 5 A schematic diagram of the structure of a placement plate of a plasma spraying device proposed by the present invention;

[0028] Figure 6 A schematic diagram of the top structure of a mounting plate of a plasma spraying device proposed by the present invention;

[0029] Figure 7 A schematic diagram of the structure of a plasma spraying device proposed by the present invention showing a mounting plate and a rotating plate in a separated state;

[0030] Figure 8 A schematic diagram of the right side cross-sectional structure of a spray box of a plasma spray device proposed by the present invention;

[0031] Fig. 9 This is a schematic diagram of the left side structure of a spray box of a plasma spray device proposed by the present invention.

[0032] In the figure: 1. spray box; 2. support roller; 3. conveyor belt; 4. drive roller; 5. drive belt; 6. connection block; 7. mounting plate; 8. turntable; 9. rectangular frame; 10. reciprocating screw rod; 11. slider; 12. plasma thermal spray gun; 13. feeding device; 14. feeding pipeline; 15. gear ring; 16. rack; 17. transmission gear; 18. tooth groove; 19. conductive spring; 20. conductive contact strip; 21. guide groove; 22. support wheel; 23. mounting block; 24. placement plate; 25. arc positioning block; 26. reset spring; 27. connecting column; 28. clamping block; 29. ​​tightening strip; 30. stepper motor one. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0034] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0035] See attached Figure 1 -Attached Fig. 9 A plasma spraying device comprises a spraying box 1, two supporting rollers 2 and two driving rollers 4 are respectively installed between the inner walls on opposite sides of the spraying box 1, the two supporting rollers 2 are arranged below the two driving rollers 4, the outer surfaces of the two supporting rollers 2 are sleeved with a conveyor belt 3, the outer surfaces of the two driving rollers 4 are sleeved with a driving belt 5, the driving belt 5 is arranged above the conveyor belt 3, a plurality of connecting blocks 6 are fixedly installed at equal intervals on the outer surface of the driving belt 5, a mounting plate 7 is fixedly installed on the outer surface of the connecting block 6, a turntable 8 is rotatably installed on the outer surface of the mounting plate 7 away from the connecting block 6, a plasma thermal spray gun 12 is installed on the outer surface of the turntable 8, a moving mechanism is installed between the turntable 8 and the plasma thermal spray gun 12, and a rotating mechanism is installed between the turntable 8 and the inner wall of the spraying box 1.

[0036] In this embodiment, the moving mechanism includes a rectangular frame 9 fixedly mounted on the outer surface of the turntable 8 away from the mounting plate 7, a slider 11 is slidably mounted on the inner wall of the rectangular frame 9, a plasma thermal spray gun 12 is rotatably mounted on the outer surface of the slider 11, a feeding device 13 is fixedly mounted on the outer surface of the mounting plate 7 away from the connecting block 6, a feeding pipeline 14 that is interconnected is fixedly mounted between the feeding device 13 and the plasma thermal spray gun 12, a conductive component is installed between the feeding device 13 and the spray box 1, and a moving component is installed between the rectangular frame 9 and the slider 11.

[0037] In this embodiment, the conductive component includes a conductive spring 19 fixedly mounted on the outer surface of the feeding device 13 near the spray box 1 side, the conductive spring 19 is electrically connected to the feeding device 13 and the plasma thermal spray gun 12, and a conductive contact strip 20 is fixedly mounted on the inner wall of the spray box 1 near the conductive spring 19 side, and the conductive contact strip 20 is arranged below the transmission belt 5, and the conductive contact strip 20 is electrically connected to the external power supply. The feeding device 13 and the plasma thermal spray gun 12 are plasma thermal spray equipment (Announcement No.: CN219772221U) The prior art mentioned in the above is that when the transmission belt 5 drives the mounting plate 7 and the feeding device 13 to move to the conductive contact strip 20, the conductive spring piece 19 installed on the side of the feeding device 13 will contact the conductive contact strip 20, so that the external power supply can supply power to the feeding device 13 and the plasma thermal spray gun 12 through the conductive contact strip 20 and the conductive spring piece 19, so that the feeding device 13 and the plasma thermal spray gun 12 can be used together to perform plasma spraying operation on the surface of the circular semiconductor wafer. The specific connection method and working principle of multiple electrical components are well-known technologies in the field and will not be elaborated on here.

[0038] In this embodiment, the moving component includes a reciprocating screw 10 that is rotatably installed between the opposite ends of the rectangular frame 9. The reciprocating screw 10 passes through the outer surface of the slider 11 and is threadedly connected to it. A transmission component is installed between the reciprocating screw 10 and the mounting disk 7. The transmission component includes a transmission gear 17 fixedly installed on one end of the reciprocating screw 10. A plurality of tooth grooves 18 are evenly arranged in the circumferential direction of the outer surface of the mounting disk 7 on the side close to the turntable 8, and the transmission gear 17 is meshed with the tooth grooves 18.

[0039] When the turntable 8 drives the rectangular frame 9 to rotate, the transmission gear 17 installed on the outer side of the rectangular frame 9 through the reciprocating screw 10 will rotate accordingly. Since the transmission gear 17 is meshed with the tooth groove 18 provided on the mounting plate 7, the transmission gear 17 can drive the reciprocating screw 10 to rotate under the action of the tooth groove 18, so that the reciprocating screw 10 drives the plasma thermal spray gun 12 to move back and forth along the length direction of the rectangular frame 9 through the slider 11 threadedly connected thereto, so that the plasma thermal spray gun 12 can perform a comprehensive spraying operation on the surface of the circular semiconductor wafer.

[0040] In this embodiment, the rotating mechanism includes a gear ring 15 fixedly mounted on the outer periphery of the turntable 8 , and a rack 16 matching the gear ring 15 is fixedly mounted on the inner wall of the spray box 1 on the side opposite to the conductive contact strip 20 .

[0041] When the ring gear 15 installed on the mounting plate 7 moves to the rack 16, the ring gear 15 will mesh with the rack 16, so that the ring gear 15 can roll on the rack 16, so that the ring gear 15 drives the turntable 8 to rotate, thereby causing the plasma thermal spray gun 12 installed on the turntable 8 to rotate accordingly, so that the plasma thermal spray gun 12 can perform a circumferential spraying operation on the surface of the circular semiconductor wafer.

[0042] In this embodiment, a plurality of positioning mechanisms are evenly installed on the outer surface of the conveyor belt 3, and the positioning mechanisms include a mounting block 23 fixedly installed on the outer surface of the conveyor belt 3, and a placing disk 24 is fixedly installed on the outer surface of the mounting block 23, and four arc-shaped positioning blocks 25 arranged in a ring are evenly fixedly installed in the circumferential direction of the upper surface of the placing disk 24, and a clamping assembly for clamping the workpiece is also installed on the outer surface of the placing disk 24, and the clamping assembly includes a reset spring piece 26 fixedly installed on the outer surface of the placing disk 24, and a connecting column 27 is fixedly installed on the outer surface of the reset spring piece 26 close to the arc-shaped positioning block 25, and a clamping block 28 is fixedly installed on the end of the connecting column 27 away from the reset spring piece 26, and the inner walls of the spray box 1 on the opposite sides above the conveyor belt 3 are fixedly installed with tightening strips 29 corresponding to the reset spring piece 26.

[0043] When the reset spring piece 26 installed on the placement plate 24 moves to the tightening bar 29, the tightening bar 29 will apply an extrusion force to the reset spring piece 26, so that the reset spring piece 26 pushes the clamping block 28 toward the direction of the circular semiconductor wafer through the connecting column 27, so that the clamping block 28 clamps the circular semiconductor wafer to avoid movement during plasma spraying operation and affect the spraying effect.

[0044] In this embodiment, a plurality of support wheels 22 are fixedly installed at equal distances on both side edges of the transmission belt 5, guide grooves 21 matching the support wheels 22 are opened on the inner walls of the opposite sides of the spray box 1, the support wheels 22 are slidably installed on the inner walls of the guide grooves 21, and a stepper motor 30 and a stepper motor 2 are fixedly installed on the outer surface of the spray box 1, the output end of the stepper motor 30 is fixedly installed with the rotation center of one of the transmission rollers 4, and the output end of the stepper motor 2 is fixedly installed with the rotation center of one of the support rollers 2.

[0045] When in use, when the transmission belt 5 moves, the support wheels 22 installed on both sides thereof slide in the guide grooves 21 , so that the multiple support wheels 22 can provide support for the transmission belt 5 , thereby ensuring the stability of the movement of the plasma thermal spray gun 12 installed on the transmission belt 5 .

[0046] A method for using a plasma spraying device comprises the following steps:

[0047] S1: placing the circular semiconductor wafer to be plasma sprayed between four arc-shaped positioning blocks 25 on the placement plate 24 installed on the outer surface of the feeding end of the conveyor belt 3 by a robotic arm, so that the conveyor belt 3 can transport the circular semiconductor wafer to the inside of the spray box 1 through the placement plate 24, and clamp the circular semiconductor wafer by a clamping assembly;

[0048] S2: While the conveyor belt 3 is conveying, the transmission belt 5 will synchronously drive the plasma thermal spray gun 12 on its outer surface to move, so that the corresponding plasma thermal spray gun 12 can be aligned with the circular semiconductor wafer placed on the placing plate 24 on the conveyor belt 3, so that the plasma thermal spray gun 12 performs plasma spraying operation on the surface of the circular semiconductor wafer;

[0049] S3: Through the cooperation of the moving mechanism and the rotating mechanism, the plasma thermal spraying gun 12 can perform a reciprocating spraying operation while performing a rotational spraying operation, thereby achieving a comprehensive spraying effect on the surface of the circular semiconductor wafer.

[0050] From the above description, it can be seen that the above-mentioned embodiment of the present invention achieves the following technical effects: when in use, the circular semiconductor wafer to be plasma sprayed is placed between the four arc-shaped positioning blocks 25 on the placement disk 24 installed on the outer surface of the feeding end of the conveyor belt 3 by the mechanical arm, so that the conveyor belt 3 can convey the circular semiconductor wafer to the inside of the spray box 1 through the placement disk 24. While the conveyor belt 3 is conveying, the transmission belt 5 will synchronously drive the plasma thermal spray gun 12 on its outer surface to move, so that the corresponding plasma thermal spray gun 12 can be aligned with the circular semiconductor wafer placed on the placement disk 24 on the conveyor belt 3, so that the plasma thermal spray gun 12 performs plasma spraying on the surface of the circular semiconductor wafer;

[0051] When the reset spring piece 26 installed on the placement plate 24 moves to the abutting strip 29, the abutting strip 29 will apply a squeezing force to the reset spring piece 26, so that the reset spring piece 26 pushes the clamping block 28 toward the direction of the circular semiconductor wafer through the connecting column 27, so that the clamping block 28 clamps the circular semiconductor wafer, thereby preventing the circular semiconductor wafer from moving during the plasma spraying operation and affecting the spraying effect;

[0052] When the transmission belt 5 drives the mounting plate 7 and the feeding device 13 to move to the conductive contact strip 20, the conductive spring sheet 19 installed on the side of the feeding device 13 will contact the conductive contact strip 20, so that the external power supply can supply power to the feeding device 13 and the plasma thermal spray gun 12 through the conductive contact strip 20 and the conductive spring sheet 19, so that the feeding device 13 and the plasma thermal spray gun 12 can be used together to perform plasma spraying operation on the surface of the circular semiconductor wafer;

[0053] When the ring gear 15 installed on the mounting plate 7 moves to the rack 16, the ring gear 15 will mesh with the rack 16, so that the ring gear 15 can roll on the rack 16, so that the ring gear 15 drives the turntable 8 to rotate, so that the plasma thermal spraying gun 12 installed on the turntable 8 rotates accordingly, so that the plasma thermal spraying gun 12 performs a circumferential spraying operation on the surface of the circular semiconductor wafer; while the turntable 8 drives the rectangular frame 9 to rotate, the transmission gear 17 installed on the outer side of the rectangular frame 9 through the reciprocating screw rod 10 will rotate accordingly. Since the transmission gear 17 is meshed with the tooth groove 18 provided on the mounting plate 7, the transmission gear 17 can drive the reciprocating screw rod 10 to rotate under the action of the tooth groove 18, so that the reciprocating screw rod 10 drives the plasma thermal spraying gun 12 to move back and forth along the length direction of the rectangular frame 9 through the slider 11 threadedly connected thereto, so that the plasma thermal spraying gun 12 performs a comprehensive spraying operation on the surface of the circular semiconductor wafer;

[0054] After the spraying is completed, the reset spring piece 26 is separated from the pressing strip 29, so that the reset spring piece 26 drives the clamping block 28 to reset, and the clamping of the circular semiconductor wafer is released, so that the sprayed circular semiconductor wafer can be taken out by the robot arm; at the same time, the conductive spring piece 19 will also be separated from the conductive contact strip 20, and the power supply of the feeding device 13 and the plasma thermal spray gun 12 will be disconnected, and the spraying operation will be automatically stopped;

[0055] The conveyor belt 3 can be used to continuously load multiple circular semiconductor wafers, and the plasma thermal spray gun 12 installed on the transmission belt 5 can continuously perform plasma spraying operations on the circular semiconductor wafers on the conveyor belt 3, which can effectively improve the efficiency of plasma spraying operations on the surfaces of multiple circular semiconductor wafers.

[0056] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A plasma spraying device, comprising a spraying box (1), characterized in that: Two supporting rollers (2) and two driving rollers (4) are respectively installed between the inner walls on opposite sides of the spray box (1); the two supporting rollers (2) are arranged below the two driving rollers (4); the outer surfaces of the two supporting rollers (2) are sleeved with a conveyor belt (3); the outer surfaces of the two driving rollers (4) are sleeved with a driving belt (5); the driving belt (5) is arranged above the conveyor belt (3); the outer surface of the driving belt (5) is equidistantly fixed with a plurality of connecting blocks (6); the outer surface of the connecting block (6) is fixedly installed with a mounting plate (7); the outer surface of the mounting plate (7) away from the connecting block (6) is rotatably installed with a turntable (8); the turntable A plasma thermal spray gun (12) is mounted on the outer surface of the rotating disk (8), a moving mechanism is mounted between the rotating disk (8) and the plasma thermal spray gun (12), a rotating mechanism is mounted between the rotating disk (8) and the inner wall of the spray box (1), the moving mechanism comprises a rectangular frame (9) fixedly mounted on the outer surface of the rotating disk (8) away from the mounting disk (7), a slider (11) is slidably mounted on the inner wall of the rectangular frame (9), the plasma thermal spray gun (12) is rotatably mounted on the outer surface of the slider (11), a feeding device (13) is fixedly mounted on the outer surface of the mounting disk (7) away from the connecting block (6), the feeding device (13) is rotatably mounted on the outer surface of the plasma thermal spray gun (12), and the feeding device (13) is rotatably mounted on the outer surface of the mounting disk (7) away from the connecting block (6). A mutually connected feeding pipeline (14) is fixedly installed between the coating guns (12), a conductive component is installed between the feeding device (13) and the spray box (1), and a moving component is installed between the rectangular frame (9) and the slider (11), the conductive component includes a conductive spring (19) fixedly installed on the outer surface of the feeding device (13) on the side close to the spray box (1), and a conductive contact strip (20) is fixedly installed on the inner wall of the spray box (1) on the side close to the conductive spring strip (19), and the conductive contact strip (20) is arranged below the transmission belt (5), and the moving component includes a reciprocating screw rod (10) that is rotatably installed between the opposite ends of the rectangular frame (9), and the moving component includes a reciprocating screw rod (10) that is fixedly installed between the opposite ends of the rectangular frame (9). The reciprocating screw (10) passes through the outer surface of the slider (11) and is threadedly connected thereto. A transmission assembly is installed between the reciprocating screw (10) and the mounting plate (7). The transmission assembly includes a transmission gear (17) fixedly installed at one end of the reciprocating screw (10). The outer surface of the mounting plate (7) close to the rotating disk (8) is evenly provided with a plurality of tooth grooves (18) in the circumferential direction. The transmission gear (17) meshes with the tooth grooves (18). The rotating mechanism includes a gear ring (15) fixedly installed on the outer periphery of the rotating disk (8). A rack (16) matching the gear ring (15) is fixedly installed on the inner wall of the spray box (1) on the side opposite to the conductive contact strip (20).

2. A plasma spraying device according to claim 1, characterized in that: The outer surface of the conveyor belt (3) is evenly mounted with a plurality of positioning mechanisms, the positioning mechanisms comprising a mounting block (23) fixedly mounted on the outer surface of the conveyor belt (3), a placement plate (24) fixedly mounted on the outer surface of the mounting block (23), four arc-shaped positioning blocks (25) arranged in a ring are evenly fixedly mounted on the upper surface of the placement plate (24) in a circumferential direction, and a clamping assembly for clamping a workpiece is also mounted on the outer surface of the placement plate (24).

3. A plasma spraying device according to claim 2, characterized in that: The clamping assembly comprises a reset spring (26) fixedly mounted on the outer surface of the placement plate (24); a connecting column (27) is fixedly mounted on the outer surface of the reset spring (26) on the side close to the arc-shaped positioning block (25); a clamping block (28) is fixedly mounted on the end of the connecting column (27) away from the reset spring (26); and tightening strips (29) corresponding to the reset spring (26) are fixedly mounted on the inner walls of the spray box (1) on both sides opposite to each other above the conveyor belt (3).

4. A plasma spraying device according to claim 3, characterized in that: A plurality of support wheels (22) are fixedly installed at equal intervals on both side edges of the transmission belt (5); guide grooves (21) matching the support wheels (22) are provided on the inner walls of the opposite sides of the spray box (1); the support wheels (22) are slidably installed on the inner walls of the guide grooves (21); a stepper motor 1 (30) and a stepper motor 2 are fixedly installed on the outer surface of the spray box (1); the output end of the stepper motor 1 (30) is fixedly installed with the rotation center of one of the transmission rollers (4); and the output end of the stepper motor 2 is fixedly installed with the rotation center of one of the support rollers (2).

5. The method for using a plasma spraying device according to claim 4, characterized in that: The following steps are involved: S1: placing a circular semiconductor wafer to be plasma sprayed between four arc-shaped positioning blocks (25) on a placement plate (24) mounted on the outer surface of the feed end of the conveyor belt (3) by means of a mechanical arm, so that the conveyor belt (3) can transport the circular semiconductor wafer to the interior of the spraying box (1) via the placement plate (24), and clamp the circular semiconductor wafer via a clamping assembly; S2: While the conveyor belt (3) is performing a conveying operation, the transmission belt (5) will synchronously drive the plasma thermal spray gun (12) on its outer surface to move, so that the corresponding plasma thermal spray gun (12) can be aligned with the circular semiconductor wafer placed on the placement plate (24) on the conveyor belt (3), so that the plasma thermal spray gun (12) performs a plasma spraying operation on the surface of the circular semiconductor wafer; S3: Through the cooperation of the moving mechanism and the rotating mechanism, the plasma thermal spray gun (12) can perform a reciprocating spraying operation while performing a rotational spraying operation, thereby achieving a comprehensive spraying effect on the surface of the circular semiconductor wafer.

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