Masking material and device for forming metal coating film using same

Abstract

The invention discloses a masking material and a film forming device for a metal film using the masking material. Provided is a masking material with which it is possible to stably form a metal film on the surface of a substrate using the surface of the substrate as a cathode. The masking material (60) is a masking material for forming a metal film (F) having a predetermined pattern (P) on the surface of a substrate (B) on which a metal layer (Ba) is formed by electrolytic plating. The masking material (60) is provided with: a mask portion (65) in which a through portion (68) corresponding to the predetermined pattern (P) is formed; and a metal mesh (67) which is in contact with the metal layer (Ba) and serves as a conductive member. The mask portion (65) is made of an elastic material. The metal mesh (67) is embedded in the mask portion (65) such that a part of the metal mesh (67) is exposed from a contact surface (65a) that is in contact with the metal layer (Ba) among the surfaces of the mask portion (65).

Description

Technical Field

[0001] The present invention relates to a masking material and a film-forming device for a metal film using the masking material. Background Art

[0002] In the past, a metal film was formed by depositing a metal on the surface of a substrate by electrolytic plating (for example, Patent Document 1). In Patent Document 1, a film forming device includes a container (housing) for containing a plating solution. An opening is formed in the container, and the opening is sealed by an electrolyte membrane. The film forming device also includes a pressing mechanism for pressing the substrate with the electrolyte membrane by the hydraulic pressure of the plating solution.

[0003] Here, when a metal base layer of a predetermined pattern is formed on the surface of the substrate, a voltage is applied between the anode and the substrate while the substrate is pressed by the hydraulic pressure of the electrolyte membrane. Thus, a metal film of a predetermined pattern can be formed on the base layer. However, when a base layer of a predetermined pattern is not formed on the substrate, it is also conceivable to use a masking material as shown in Patent Document 2, for example.

[0004] Prior Art Literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2016-125087

[0007] Patent Document 2: Japanese Patent Application Publication No. 2016-108586

[0008] Here, as shown in Patent Document 2, when a metal film is formed on the surface of a substrate on which a metal layer is formed, the surface of the substrate is made to function as a cathode of electrolytic plating. In this case, a conduction jig and a masking material are arranged every time a film is formed to conduct the metal layer on the surface of the substrate to a power source, so the preparation work becomes complicated. In addition, when the position where the conduction jig is arranged is offset, the metal film may become uneven. Summary of the invention

[0009] The present invention has been made in view of the above problems, and an object of the present invention is to provide a masking material capable of stably forming a metal film on the surface of a substrate by using the surface of the substrate as a cathode.

[0010] In view of the above-mentioned problems, the masking material involved in the present invention is characterized in that it is a masking material for forming a metal film of a prescribed pattern on the surface of a substrate formed with a metal layer by electrolytic plating, and the masking material comprises: a mask portion formed with a through portion corresponding to the prescribed pattern; and a conductive component in contact with the metal layer, the mask portion being made of an elastic material, and the conductive component being buried in the mask portion in such a manner that a portion of the conductive component is exposed from a contact surface in contact with the metal layer on the surface of the mask portion.

[0011] According to the present invention, the conductive member is embedded in the mask portion in such a manner that a part of the conductive member is exposed from the contact surface with the metal layer among the surface of the mask portion. Thus, when the substrate is covered by the masking material during film formation, the conductive member and the metal layer of the substrate can be made conductive. If the conductive member and the negative electrode of the power supply for plating are electrically connected in this state, the surface of the metal layer of the substrate can function as a cathode for forming a metal film. As a result, a metal film corresponding to the through portion formed in the mask portion can be stably formed on the surface of the metal layer of the substrate.

[0012] As a more preferred embodiment, the conductive member is a metal mesh, and the metal mesh is embedded in the mask portion in a manner that it is exposed from the mask portion on the contact surface. As a further preferred embodiment, the metal mesh is arranged in a manner that surrounds the periphery of the mask portion. As another preferred embodiment, the masking material has a resin mesh that fixes the mask portion on the side opposite to the contact surface across the metal mesh.

[0013] Disclosed is a film-forming device for a metal film having the above-mentioned masking material. The film-forming device comprises a container, the container having an opening formed at a position facing the substrate, and the opening is covered by an electrolyte membrane in a state where a plating solution is contained. The film-forming device further comprises: a moving mechanism for moving at least one of the container and the substrate in a manner that the container and the substrate can contact and separate via the masking material; and a boosting mechanism for increasing the hydraulic pressure of the plating solution contained in the container. The film-forming device comprises: an anode arranged at a position facing the electrolyte membrane inside the container; and a power source for applying a voltage between the anode and the substrate, the masking material is arranged between the electrolyte membrane and the substrate, and the conductive member is conductive to the negative electrode of the power source at least during film formation.

[0014] According to the present invention, a metal film can be stably formed on the surface of a substrate by using the surface of the substrate as a cathode. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 (a) is a schematic cross-sectional view showing an example of a film-forming apparatus including a masking material according to an embodiment of the present invention before forming a metal film. Figure 1 (b) is a description Figure 1 (a) is a cross-sectional view of the film forming apparatus during film forming.

[0016] Figure 2 (a) Observation from below Figure 1 (a) is a schematic perspective view of the masking material shown. Figure 2 (b) is along Figure 2 (a) is a partially enlarged cross-sectional view of the AA line. Figure 2 (c) is along Figure 2 (a) is a partially enlarged cross-sectional view of line BB.

[0017] Figure 3 (a)~ Figure 3 (d) is a schematic diagram for explaining the method for manufacturing the masking material according to the present embodiment.

[0018] Figure 4 (a)~ Figure 4 (d) is a schematic diagram for explaining the method for manufacturing the masking material according to the present embodiment.

[0019] Figure 5 (a) means Figure 2 (b) is an enlarged cross-sectional view of the corresponding metal film during film formation, Figure 5 (b) is to indicate Figure 2 (c) An enlarged cross-sectional view of the corresponding metal film during film formation.

[0020] Description of Reference Numerals

[0021] 1: film forming device, 13: electrolyte membrane, 40: mounting table, 60: masking material, 61: frame, 62: screen mask, 64: resin mesh, 65: mask part, 67: metal mesh, 68: through part, B: substrate, Ba: metal layer, F: metal film, L: plating solution. DETAILED DESCRIPTION

[0022] First, refer to Figure 1 (a) Figure 2 (a) to (c) describe a film forming apparatus 1 including a masking material 60 according to an embodiment of the present invention.

[0023] like Figure 1 As shown in (a), the film forming device 1 is a film forming device that forms a metal film F of a predetermined pattern P on a substrate B by electrolytic plating. The film forming device 1 forms the metal film in a state where a masking material 60 is sandwiched between an electrolyte membrane 13 and the substrate B. The film forming device 1 includes an anode 11, an electrolyte membrane 13, and a power supply 14 that applies a voltage between the anode 11 and the substrate B.

[0024] The film forming apparatus 1 includes a container 15 for containing an anode 11 and a plating solution L, a mounting table 40 for mounting a substrate B, and a masking material 60 . During film formation, the masking material 60 is mounted on the mounting table 40 together with the substrate B. The electrolyte membrane 13 is disposed between the masking material 60 and the anode 11 .

[0025] The film forming apparatus 1 includes a linear actuator 70 for raising and lowering the container 15. The linear actuator 70 corresponds to the "moving mechanism" of the present invention, and any device can be used as long as it moves at least one of the container 15 and the substrate B so that the container 15 and the substrate B can contact and separate through the masking material 60 described later.

[0026] The substrate B functions as a cathode. The substrate B is a plate-shaped substrate. In the present embodiment, the substrate B is a rectangular substrate. The surface of the substrate B facing the electrolyte membrane 13 is a film-forming surface that functions as a cathode. In the present embodiment, a substrate B having a metal layer Ba formed on the surface of an insulating substrate Bb is used (see Figure 5 The insulating substrate Bb is made of, for example, glass, ceramic, resin, or a composite material thereof, and is made of a material having electrical insulation properties. The metal layer Ba can be made of a metal such as aluminum or copper.

[0027] In this embodiment, since the wiring pattern is formed by the metal film F, a substrate having a metal layer Ba of copper or the like formed on the surface of an insulating substrate Bb of resin or the like is used as the substrate B. In this case, after the metal film F is formed, the metal layer Ba other than the portion where the metal film F is formed is removed by etching or the like. Thus, a pattern (wiring pattern) P based on the metal film F can be formed on the surface of the insulating substrate Bb.

[0028] The anode 11 is, for example, a non-porous (e.g., non-porous) anode made of the same metal as the metal film. The anode 11 has a block or flat plate shape. As a material of the anode 11, for example, copper can be cited. The anode 11 is dissolved by the voltage applied by the power supply 14. However, in the case of forming a film using only metal ions of the plating solution L, the anode 11 is an anode that is insoluble in the plating solution L. The anode 11 is electrically connected to the positive electrode of the power supply 14. The negative electrode of the power supply 14 is electrically connected to the metal plug 42 of the mounting table 40 described later.

[0029] The plating solution L is a liquid containing the metal of the metal film to be formed in the state of ions. As an example of the metal, copper or nickel can be cited. The plating solution L is a solution obtained by dissolving (ionizing) these metals with an acid such as nitric acid, phosphoric acid or sulfuric acid. As a solvent for the solution, water, alcohol, etc. can be cited as an example. For example, in the case where the metal is copper, as the plating solution L, an aqueous solution containing copper sulfate, copper pyrophosphate, etc. can be cited.

[0030] The electrolyte membrane 13 is a membrane that can impregnate (contain) metal ions together with the plating solution L by contacting with the plating solution L. The electrolyte membrane 13 is a flexible membrane. As long as the metal ions of the plating solution L can move to the substrate B side when a voltage is applied by the power supply 14, the material of the electrolyte membrane 13 is not particularly limited. As the material of the electrolyte membrane 13, for example, fluorine-based resins such as Nafion (registered trademark) manufactured by DuPont can be listed, and resins having ion exchange functions can be listed. The film thickness of the electrolyte membrane 13 is preferably in the range of 20μm to 200μm.

[0031] The container 15 is made of a material that is insoluble in the plating solution L. A storage space 15a for storing the plating solution L is formed in the container 15. The anode 11 is arranged in the storage space 15a of the container 15. An opening 15d is formed at a position of the storage space 15a facing the substrate B. The opening 15d of the container 15 is covered by the electrolyte membrane 13. Specifically, the periphery of the electrolyte membrane 13 is clamped by the container 15 and the frame 17. Thus, the plating solution L in the storage space 15a can be sealed by the electrolyte membrane 13.

[0032] like Figure 1 (a) and Figure 1 As shown in (b), the direct-acting actuator 70 raises and lowers the container 15 in a manner that the electrolyte membrane 13 and the masking material 60 can be in contact and separated freely. In this embodiment, the mounting table 40 is fixed, and the container 15 is raised and lowered by the direct-acting actuator 70. The direct-acting actuator 70 is an electric actuator that converts the rotational motion of the motor into a linear motion through a ball screw or the like (not shown). However, a hydraulic or pneumatic actuator may be used instead of the electric actuator.

[0033] The container 15 is provided with a supply port 15b for supplying the plating liquid L to the container space 15a. The container 15 is provided with a discharge port 15c for discharging the plating liquid L from the container space 15a. The supply port 15b and the discharge port 15c are holes communicating with the container space 15a. The supply port 15b and the discharge port 15c are formed across the container space 15a. The supply port 15b is fluidically connected to the liquid supply pipe 50. The discharge port 15c is fluidically connected to the liquid discharge pipe 52.

[0034] The film forming apparatus 1 further includes a tank 90, a liquid supply pipe 50, a liquid discharge pipe 52, and a pump 80. Figure 1 As shown in (a), the plating liquid L is contained in the tank 90. ​​The liquid supply pipe 50 connects the tank 90 and the container 15. The liquid supply pipe 50 is provided with a pump 80. The pump 80 supplies the plating liquid L from the tank 90 to the container 15. The liquid discharge pipe 52 connects the tank 90 and the container 15. The liquid discharge pipe 52 is provided with a pressure regulating valve 54. The pressure regulating valve 54 regulates the pressure (hydraulic pressure) of the plating liquid L in the container space 15a to a predetermined pressure.

[0035] In the present embodiment, by driving pump 80, plating liquid L is sucked from tank 90 into liquid supply pipe 50. The sucked plating liquid L is pressure-sent from supply port 15b to storage space 15a. Plating liquid L in storage space 15a is returned to tank 90 via discharge port 15c. In this way, plating liquid L circulates in film forming apparatus 1.

[0036] Furthermore, by continuously driving the pump 80, the hydraulic pressure of the plating solution L in the housing space 15a can be maintained at a predetermined pressure by the pressure regulating valve 54. The pump 80 presses the masking material 60 against the electrolyte membrane 13 by the hydraulic pressure of the plating solution L. The pump 80 is a pump that increases the hydraulic pressure of the plating solution L contained in the housing 15, and corresponds to the "pressurization mechanism" of the present invention.

[0037] The mounting table 40 has a main body 41 formed of an insulating material, for example. The main body 41 has a protrusion 43 protruding toward the mask side, and the protrusion 43 has a concave portion 44 for accommodating the substrate B. The main body 41 is provided with a metal plug 42 connected to the negative electrode of the power source 14.

[0038] like Figure 1 As shown in (a), the masking material 60 includes a frame 61 and a screen mask 62. The periphery 62a of the screen mask 62 is fixed to the frame 61. For example, as the material of the frame 61, metal materials such as stainless steel or resin materials such as thermoplastic resins can be cited. The frame 61 can also be made of a metal material, and a metal mesh 67 described later can be made in contact with the frame 61. Thus, the metal plug 42 is not provided on the mounting table 40, and the metal film F can be formed on the surface of the metal layer Ba only by connecting the frame 61 to the negative electrode of the power supply 14.

[0039] like Figure 2 As shown, a through portion 68 corresponding to a predetermined pattern P of the metal film F is formed in the screen mask 62. The screen mask 62 includes a resin mesh 64, a mask portion 65, and a metal mesh 67. The screen mask 62 is a mask having a flexibility of about 50 μm to 400 μm. The screen mask 62 is supported by the frame 61 on the substrate B side relative to the frame 61.

[0040] The resin net 64 is fixed to the frame 61. The resin net 64 has a plurality of openings 64c, 64c, ... formed in a lattice shape. Specifically, Figure 2As shown in (b), the resin net 64 is a mesh-like portion woven in a manner that a plurality of oriented wires 64a, 64b cross each other. The plurality of wires 64a, 64a are arranged at intervals from each other, and the plurality of wires 64b, 64b crossing them are arranged at intervals from each other. Thus, a plurality of openings 64c, 64c, ... are formed in the resin net 64 in a lattice shape. As long as they are corrosion-resistant to the plating solution L, the material of the wires 64a, 64b is not particularly limited. As the material of the wires 64a, 64b, for example, resin materials such as polyester can be cited.

[0041] The mask portion 65 is fixed to the resin net 64. A through portion 68 corresponding to the prescribed pattern P is formed in the mask portion 65. The mask portion 65 is a portion that is closely attached to the substrate B during film formation by the pressure from the electrolyte membrane 13. As long as it can be closely attached to the substrate B, the material of the mask portion 65 is not particularly limited. For example, as the material of the mask portion 65, rubber materials such as polysiloxane rubber (PMDS) or ethylene propylene diene rubber (EPDM) can be cited. The hardness of the rubber material is preferably HS100 or less, and more preferably HS50 or less in Shore A hardness.

[0042] The mask portion 65 is made of an elastic material that is compressed and elastically deformed by the pressure from the electrolyte membrane 13. In order to ensure the close adhesion with the substrate B, the deformation amount of the mask portion 65 in the thickness direction (pressing direction) by the pressure from the electrolyte membrane 13 can be in the range of 5 to 20% relative to the thickness of the mask portion before deformation. The screen mask 62 having the predetermined pattern P can be manufactured by a general screen manufacturing technology using an emulsion.

[0043] like Figure 2 As shown in (c), a metal mesh 67 as a conductive member is arranged on a contact surface 65a that contacts the metal layer Ba of the substrate B on the surface of the mask part 65. The metal mesh 67 is composed of wires 67a, 67b of stainless steel, nickel, titanium, gold, copper, silver, palladium, etc. The metal mesh 67 is a mesh having the same structure as the resin mesh 64. The metal mesh 67 is formed with a plurality of openings 67c, 67c, ... in a lattice shape. The plurality of wires 67a, 67a are arranged at intervals from each other, and the plurality of wires 67b, 67b crossing them are arranged at intervals from each other. Thus, a plurality of openings 67c, 67c, ... are formed in a lattice shape in the metal mesh 67. In the present embodiment, the elastic material constituting the mask part 65 enters the opening 67c. Thus, the metal mesh 67 is fixed to the mask part 65.

[0044] In this way, the metal mesh 67 is embedded in the mask portion 65 in a manner that it is exposed from the mask portion 65 on the contact surface 65a of the mask portion 65. Figure 2As shown in (a), the metal mesh 67 is arranged so as to surround the periphery of the mask portion 65. Thus, since the metal mesh 67 is arranged so as to surround the entire through portion 68 of the mask portion 65, the metal film F having a pattern corresponding to the through portion 68 can be uniformly formed. Furthermore, the masking material 60 includes a resin mesh 64 for fixing the mask portion 65 on the side opposite to the contact surface 65a across the metal mesh 67. Thus, since the elastic portion 65b of the mask portion 65 is arranged between the resin mesh 64 and the metal mesh 67, the metal mesh 67 can be made to follow the surface of the metal layer Ba of the substrate B.

[0045] The method for manufacturing the masking material 60 is described below. First, a frame 61 having a resin net 64 fixed thereto is prepared. Next, uncured ultraviolet curing resin 82A is applied to the screen mask 62 using a roller or a brush. Figure 3 As shown in (a), ultraviolet rays UV are irradiated to the ultraviolet curing resin (emulsion) according to a prescribed pattern P, and a cured portion 82 corresponding to the prescribed pattern is formed. Next, the uncured portion 82a is washed away. Figure 3 As shown in (b), a forming space 82b is formed for forming the mask portion 65. Figure 3 As shown in (c), the raw material 65A to be the mask portion 65 is placed on the resin plate 85, and the raw material 65A is made to flow into the molding space 82b, and the raw material 65A is impregnated into the resin mesh 64. The metal mesh 67 is placed on the raw material 65A so as to impregnate a part of the raw material 65A. Finally, as shown in FIG. Figure 3 As shown in (d), the raw material 65A is cured to form the mask portion 65. Then, the resin plate 85 is removed from the mask portion 65, and the cured portion 82 is removed by etching. Figure 2 The masking material 60 is shown in the figure.

[0046] Another method for manufacturing the masking material 60 is described below. Figure 4 As shown in (a), ultraviolet rays UV are irradiated to the ultraviolet curing resin (emulsion) 82A according to a predetermined pattern P, and a cured portion 82 corresponding to the predetermined pattern is formed. Figure 4 As shown in (b), the uncured portion 82a is washed and the resin plate 85 is arranged together with the metal mesh 67. Figure 4 As shown in (c), the raw material 65A to be the mask portion 65 flows into the forming space 82b. Figure 4 As shown in (d), the raw material 65A is cured to form the mask portion 65. Then, the resin plate 85 is removed from the mask portion 65, and the cured portion 82 is removed by etching. Figure 2 The masking material 60 is shown in the figure.

[0047] Reference Figure 1 and Figure 5, a film forming method using the film forming apparatus 1 is described. First, Figure 1 As shown in (a), the substrate B is placed on the mounting table 40. In this embodiment, the metal layer Ba of the substrate B protrudes from the mounting table 40 while the substrate B is accommodated in the recess 44. Thus, the mask portion 65 of the masking material 60 can be brought into contact with the surface of the substrate B uniformly.

[0048] Next, the masking material 60 is placed on the mounting table 40. At this time, the masking material 60 is accommodated so that the surface of the substrate B is contained in the internal space 69 of the frame 61 of the masking material 60. In this way, the surface of the substrate B is covered by the mask portion 65 of the masking material 60.

[0049] Then, if Figure 1 As shown in (b), the linear actuator 70 is driven to lower the container 15 toward the masking material 60. Furthermore, when the masking material 60 is integrally mounted on the container 15 at a position facing the electrolyte membrane 13, the surface of the substrate B can be covered by the mask portion 65 of the masking material 60 by lowering the container 15.

[0050] Next, pump 80 is driven to supply plating solution L to accommodation space 15a of accommodation body 15. Since pressure regulating valve 54 is provided on liquid discharge pipe 52, the hydraulic pressure of plating solution L in accommodation space 15a is maintained at a predetermined pressure.

[0051] This pressing can make the screen mask 62 closely attached to the metal layer Ba of the substrate B. Since the mask portion 65 is made of an elastic material, the mask portion 65 is compressed and elastically deformed by the hydraulic pressure of the plating solution L, and the closeness between the mask portion 65 and the substrate B is improved. Since the mask portion 65 is fixed to the resin mesh 64, Figure 5 As shown in (a), the mask portion 65 can be uniformly pressed via the resin mesh 64. When the electrolyte membrane 13 is continuously pressed, the exudate (plating solution) La that seeps out from the electrolyte membrane 13 swollen by the plating solution L is filled into the through portion 68 formed in the screen mask 62.

[0052] Next, the metal film F is formed while maintaining the pressed state based on the electrolyte membrane 13. Specifically, a voltage is applied between the anode 11 and the substrate B. In this embodiment, a part of the metal mesh 67 is exposed from the contact surface 65a that contacts the metal layer Ba among the surfaces of the mask portion 65. Figure 5As shown in (b), when forming a film, the metal layer Ba of the substrate B and the metal plug 42 can be connected through the metal mesh 67 in a state where the substrate B is covered by the masking material 60. If the metal mesh 67 and the negative electrode of the power source 14 for plating are electrically connected through the metal plug 42, the current A of the power source 14 flows from the metal layer Ba to the metal plug 42 through the metal mesh 67. In this way, the surface of the metal layer Ba of the substrate B can be made to function as a cathode for forming the metal film F. As a result, the metal ions contained in the plating solution L pass through the electrolyte membrane 13. The metal ions that have passed through the electrolyte membrane 13 move to the surface of the substrate B through the permeate La and are reduced on the surface of the substrate B. As a result, the metal film F corresponding to the through portion 68 formed in the mask portion 65 can be stably formed on the surface of the metal layer Ba of the substrate B.

[0053] Furthermore, since the permeate La is uniformly pressurized by the pressure of the electrolyte membrane 13, a homogeneous metal film F can be formed. Then, the housing 15 is raised by the direct-acting actuator 70, the substrate B is pulled away from the electrolyte membrane 13, and the substrate B is taken out from the mounting table 40. Furthermore, when the metal film F is used to manufacture wiring, the metal layer Ba formed on the surface of the insulating substrate Bb of the substrate B can be etched as long as the portion where the metal film F is formed is left.

[0054] As described above, when the masking material 60 is integrally mounted on the housing 15, when the housing 15 is raised by the linear actuator 70 to pull the substrate B away from the electrolyte membrane 13, the weight of the plating solution L can be supported by the masking material 60 via the electrolyte membrane 13. Thus, the plastic deformation of the electrolyte membrane 13 due to the weight of the plating solution L can be suppressed.

[0055] The embodiments of the present invention are described in detail above, but the present invention is not limited to the above embodiments, and various design changes can be made within the scope of the spirit of the present invention described in the claims. For example, as long as it can contact the metal layer of the substrate, a conductive member such as a metal foil can be used instead of a metal mesh. In addition, a metal foil having a lattice structure with a plurality of through holes can be used instead of a metal mesh. A conductive mesh can also be used instead of a resin mesh, in which case it is preferably buried in the mask portion in a manner that the surface of the conductive mesh is not exposed.

Claims

1. A masking material, characterized in that: A masking material for forming a metal film of a predetermined pattern on a surface of a substrate having a metal layer formed thereon by electrolytic plating, the masking material comprising: a mask portion having a through portion corresponding to the prescribed pattern; and a conductive member disposed on a contact surface with the metal layer, The mask portion is made of an elastic material, and the conductive member is embedded in the mask portion such that a portion of the conductive member is exposed from a contact surface with the metal layer among the surfaces of the mask portion.

2. The masking material according to claim 1, The conductive member is a metal mesh, On the contact surface, the metal mesh is buried in the mask portion so as to be exposed from the mask portion.

3. The masking material according to claim 2, The metal mesh is arranged to surround a periphery of the mask portion.

4. The masking material according to claim 2, The masking member includes a resin mesh for fixing the mask portion on a side opposite to the contact surface across the metal mesh.

5. A metal film forming device, comprising: A receiving body having an opening formed at a position facing the substrate and covering the opening with an electrolyte membrane in a state where a plating solution is received; a moving mechanism for moving at least one of the container and the substrate in such a manner that the container and the substrate can be brought into contact with and separated from each other via the masking material; a pressurizing mechanism for increasing the hydraulic pressure of the plating solution contained in the containing body; an anode disposed in the housing at a position facing the electrolyte membrane; and a power source for applying a voltage between the anode and the substrate, The masking material is disposed between the electrolyte membrane and the substrate, and the conductive member is electrically connected to the negative electrode of the power source at least during film formation.

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