Flip chip
By setting convex blocks and support parts on the active surface of the crystal chip, the supporting foot is suspended on the first side of the active side, and the short -circuit or electrical abnormal problems caused by metal sections and edges during the chip cutting process can be solved. Higher reliability and stability.
Patent Information
- Application Number
- CN202311019088.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-07-25
- Filing Date
- 2023-08-14
- Publication Date
- 2025-01-28
AI Technical Summary
During the chip cutting process, the metal layer is cut to form metal sections and burrs, resulting in short circuits or electrical abnormalities when the pins come into contact with the circuit substrate.
Design a crystallization chip, which sets at least one convex block on the active surface to connect the pin, and set at least one support part on the active surface to support the pin. , Avoid contact with metal sections or hair edges.
Effectively avoid contact with the section or edges of the metal or edges, prevent short -circuit or electrical abnormalities, and improve the reliability and stability of the chip.
Smart Images
Figure CN119381350A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a flip chip, in particular to a flip chip which prevents the pins of a circuit substrate from contacting the metal burrs or metal sections of the chip. Background Art
[0002] See also Figure 1 In the dicing process, a cutter (not shown) is used to cut the wafer 10 along the dicing lanes 11 of the wafer 10 to form a plurality of separate chips 12. Figure 2 During the cutting process, the tool will cut off the metal layer (such as circuits and marks) located at the cutting path 11, so that the metal layer forms a metal section 14 (such as circuit sections and / or mark sections) located at the side wall 13 of the chip 12, and due to the material ductility of the metal layer, the metal section 14 will produce metal burrs 16 (such as circuit burrs and / or mark burr sections) protruding from the active surface 15.
[0003] See also Figure 2 When the pin 21 of the circuit substrate is connected to the bump 17 of the chip 12, if the pin 21 contacts the metal section 14 or the metal burr 16, a short circuit or electrical abnormality may occur. Summary of the invention
[0004] The main purpose of the present invention is to provide a flip chip, which supports the pins connected to the bumps by at least one supporting member protruding from the active surface.
[0005] A flip chip of the present invention has at least one bump arranged on the active surface, and the bump is used to engage the pin of the circuit substrate. The chip is characterized in that: the chip also has at least one support member arranged on the active surface, and the support member is located between the bump and the first side of the active surface. The bump protrudes from the active surface and has a first height. The support member protrudes from the active surface and has a second height, and the second height is not greater than the first height. The support member is used to support the pin.
[0006] Preferably, the second height is smaller than the first height, and the difference between the first height and the second height is no more than 7 μm.
[0007] Preferably, the second height is not less than 5 μm.
[0008] Preferably, there is a first distance between the protrusion and the support member, a virtual edge line is extended along the first side of the active surface, there is a second distance between the support member and the virtual edge line, and the ratio of the first distance to the second distance is between 0.5 and 100.
[0009] Preferably, along the axial direction of the support member toward the first side, the support member has a width that is not less than 5 μm.
[0010] Preferably, there is also a metal layer and a protective layer, the metal layer includes a plurality of pads and a sealing ring, the sealing ring surrounds the plurality of pads, the protective layer covers the sealing ring and exposes the plurality of pads, the active surface is the surface of the protective layer, the bump is electrically connected to the pad therein, the sealing ring is projected onto the active surface and a sealing ring projection is formed, and the support member is located between the bump and the sealing ring projection.
[0011] Preferably, there is also a metal layer and a protective layer, the metal layer includes at least one pad and a sealing ring, the sealing ring surrounds the pad, the protective layer covers the sealing ring and exposes the pad, the active surface is the surface of the protective layer, the bump is electrically connected to the pad therein, the sealing ring is projected onto the active surface and a sealing ring projection is formed, and the support member is arranged between the sealing ring projection and the first side.
[0012] Preferably, the support member has an outer side wall adjacent to the first side edge, and a third distance between the outer side wall and a projection of the sealing ring is not less than 1 μm.
[0013] Preferably, the support member has an inner side wall adjacent to the bump, and a first distance between the inner side wall and the bump is not less than 1 μm.
[0014] Preferably, the active surface has a bump setting area, the bump is set in the bump setting area, and there is an opening between adjacent support members, and the opening communicates with the first side and the bump setting area.
[0015] Preferably, there is a side wall, and the support member has an outer side wall, and the outer side wall is flush with the side wall.
[0016] Preferably, along the axial direction of the support member toward the first side, the protrusion is projected onto the support member, and along a direction perpendicular to the axial direction, the protrusion has a first length, and the support member has a second length, and the second length is not less than the first length.
[0017] Preferably, the bump forms a bump projection on the support member, the bump projection has a second side, the support member has a third side adjacent to the second side, and along a direction perpendicular to the axis, a fourth distance from the second side to the third side is not less than 1 μm.
[0018] The present invention supports the pin connected to the bump by the support member protruding from the active surface, so that the pin is suspended above the first side of the active surface to avoid the pin contacting the metal section and / or metal burr on the first side, thereby preventing the problem of short circuit or electrical abnormality. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 : Schematic diagram of a conventional wafer.
[0020] Figure 2 : A cross-sectional view of a conventional chip.
[0021] Figure 3 : Schematic diagram of the chip of the present invention.
[0022] Figure 4 : A cross-sectional view of a chip of the present invention.
[0023] Figure 5 : Schematic diagram of the chip of the present invention.
[0024] Figure 6 : A cross-sectional view of a chip of the present invention.
[0025]
Main component symbol description
[0026] 10: Wafer 11: Cutting road
[0027] 12: Chip 13: Sidewall
[0028] 14: Metal section 15: Active surface
[0029] 16: Metal burrs 17: Bumps
[0030] 21: Pin
[0031] 100: chip 100a: side wall
[0032] 110: Active surface 111: First side
[0033] 111a: Virtual edge 112: Bump setting area
[0034] 120: Bump 121: Bump projection
[0035] 121a: second side 130: support member
[0036] 131: Outer wall 132: Inner wall
[0037] 133: third side 140: metal layer
[0038] 141: pad 142: sealing ring
[0039] 142a: Sealing ring projection 143: Marking
[0040] 143a: Marking section 143b: Metal burrs
[0041] 150: protection layer 160: circuit layer
[0042] 161: Line section 170: Opening
[0043] 210: Pin 211: Connecting end
[0044] 212: Exposure section H1: First height
[0045] H2: Second height L1: First length
[0046] L2: Second length S1: First distance
[0047] S2: Second distance S3: Third distance
[0048] S4: fourth distance W: width
[0049] X: Axis DETAILED DESCRIPTION
[0050] See also Figure 3 and Figure 4 A flip chip 100 of the present invention is formed by a wafer (not shown) through a cutting process. The chip 100 has an active surface 110, at least one bump 120, a support member 130, a metal layer 140, a protection layer 150 and at least one circuit layer 160. The bump 120 and the support member 130 are convexly disposed on the active surface 110. The active surface 110 has a bump setting area 112. The bump 120 is disposed in the bump setting area 112. The bump 120 is used to join the pin 210 of the circuit substrate 200.
[0051] See also Figure 3 and Figure 4 , the metal layer 140 includes a plurality of pads 141, a sealing ring 142 (seal ring) and at least one mark 143. In the present embodiment, the mark 143 is located on the cutting path of the wafer (not shown), but is not limited thereto. The circuit layer 160 connects the plurality of pads 141, the sealing ring 142 surrounds the plurality of pads 141, the protective layer 150 covers the sealing ring 142 and the plurality of circuits 141 and exposes the plurality of pads 141. In the present embodiment, the active surface 110 is the surface of the protective layer 150, and the bump 120 is electrically connected to at least one pad 141.
[0052] See also Figure 3 and Figure 4After being cut, each chip 100 is formed with at least one side wall 100a. The circuit layer 160 and the mark 143 are cut, and a circuit section 161 of the circuit layer 160 and a marking section 143a of the mark 143 are formed on the side wall 100a. Due to the material ductility of the metal layer 140 and the circuit layer 160, the marking section 143a will produce a metal burr 143b protruding from the active surface 110, or the circuit section 161 will produce a metal burr protruding from the active surface 110 (not shown).
[0053] See also Figure 3 and Figure 4 The support member 130 is protruding from the active surface 110. The material of the support member 130 can be selected from polymer materials or non-conductive materials. The support member 130 is located between the bump 120 and the first side 111 of the active surface 110. There is an opening 170 between adjacent support members 130. The opening 170 connects the first side 111 and the bump setting area 112. The opening 170 is used for filling glue (not shown) to flow through the first side 111 to the bump setting area 112 to seal the bump 120 and the pin 210. The bump 120 protrudes from the active surface 110 and has a first height H1. The support member 120 protrudes from the active surface 110 and has a second height H2, and the second height H2 is not greater than the first height H1. In one embodiment, the second height H2 is less than the first height H1, and the difference between the first height H1 and the second height H2 is not greater than 7μm. Preferably, the second height H2 is not less than 5μm. When the joining end 211 of the pin 210 is joined to the bump 120, the support member 120 is used to support the exposed section 212 of the pin 210 to prevent the exposed section 212 from contacting the marking section 143a, the metal burr 143b, the circuit section 161 or the metal burr of the circuit section 161.
[0054] See also Figure 4 , there is a first distance S1 between the protrusion 120 and the support member 130, a virtual edge line 111a is extended along the first side 111 of the active surface 110, and there is a second distance S2 between the support member 122 and the virtual edge line 111a, and the ratio (S1 / S2) of the first distance S1 to the second distance S2 is between 0.5 and 100. By using the ratio of the first distance S1 to the second distance S2, the flexural strength of the exposed section 212 is improved to prevent the exposed section 212 from bending and contacting the marking section 143a, the metal burr 143b, the circuit section 161 or the metal burr of the circuit section 161.
[0055] See also Figure 3 and Figure 4In the present embodiment, the sealing ring 142 is projected onto the active surface 110 and forms a sealing ring projection 142a. The support member 130 is located between the bump 120 and the sealing ring projection 142a. Along the axis X direction from the support member 130 to the first side 111, the support member 130 has a width W. Preferably, the width W is not less than 5 μm and not greater than the distance from the bump 120 to the sealing ring projection 142a. The support member 130 has an outer side wall 131 adjacent to the first side 111 and an inner side wall 132 adjacent to the bump 120. The third distance S3 between the outer side wall 131 and the sealing ring projection 142a is not less than 1 μm and not greater than 100 μm. The first distance S1 between the inner side wall 132 and the bump 120 is not less than 1 μm and not greater than 100 μm.
[0056] See also Figure 3 and Figure 4 , along the axis X direction, the protrusion 120 is projected to the support member 130, along the direction perpendicular to the axis X, the protrusion 120 has a first length L1, the support member 130 has a second length L2, the second length L2 is not less than the first length L1, the protrusion 120 forms a protrusion projection 121 on the support member 130, the protrusion projection 121 has a second side 121a, the support member 130 has a third side 133 adjacent to the second side 121a, along the direction perpendicular to the axis X, the fourth distance S4 from the second side 121a to the third side 133 is not less than 1μm and not more than 10μm, when the pin 210 is skewly engaged with the protrusion 120, the support member 130 can support the exposed section 212.
[0057] See also Figure 4 , Figure 5 and Figure 6 The support member 130 can be disposed between the sealing ring projection 142a and the first side 111. When the joining end 211 is joined to the bump 120, the support member 120 is used to support the exposed section 212 to prevent the exposed section 212 from contacting the marking section 143a, the metal burr 143b, the circuit section 161 and the metal burr of the circuit section 161. In one embodiment, the outer side wall 131 of the support member 130 is flush with the side wall 100a of the chip 100.
[0058] The present invention supports the pin 210 connected to the bump 120 by means of the support member 130 protruding from the active surface 110, so that the exposed section 212 of the pin 210 is suspended above the first side 111 of the active surface 110, so as to prevent the exposed section 212 from contacting the metal section (such as the marking section 143a, the circuit section 161) and / or metal burrs (such as the metal burrs 143b of the marking section 143a, the metal burrs of the circuit section 161) on the first side 111, thereby preventing short circuit or electrical abnormality problems from occurring.
[0059] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with the profession can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.
Claims
1. A flip chip having at least one bump disposed on an active surface, the bump being used to engage a pin of a circuit substrate, characterized in that: The chip also has at least one supporting member arranged on the active surface, the supporting member is located between the bump and the first side of the active surface, the bump protrudes from the active surface and has a first height, the supporting member protrudes from the active surface and has a second height, the second height is not greater than the first height, and the supporting member is used to support the pin.
2. The flip chip according to claim 1, characterized in that: The second height is smaller than the first height, and a difference between the first height and the second height is no greater than 7 μm.
3. The flip chip according to claim 2, characterized in that: The second height is not less than 5 μm.
4. The flip chip according to claim 1, characterized in that: There is a first distance between the protrusion and the support member, a virtual edge line extends along the first side of the active surface, and there is a second distance between the support member and the virtual edge line, and the ratio of the first distance to the second distance is between 0.5 and 100.
5. The flip chip according to claim 4, characterized in that: Along the axis direction of the support member toward the first side, the support member has a width that is not less than 5 μm.
6. The flip chip according to claim 1, characterized in that: It also has a metal layer and a protective layer, the metal layer includes multiple pads and a sealing ring, the sealing ring surrounds the multiple pads, the protective layer covers the sealing ring and exposes the multiple pads, the active surface is the surface of the protective layer, the bump is electrically connected to the pad therein, the sealing ring is projected onto the active surface and a sealing ring projection is formed, and the support member is located between the bump and the sealing ring projection.
7. The flip chip according to claim 1, characterized in that: It also has a metal layer and a protective layer, the metal layer includes at least one pad and a sealing ring, the sealing ring surrounds the pad, the protective layer covers the sealing ring and exposes the pad, the active surface is the surface of the protective layer, the bump is electrically connected to the pad therein, the sealing ring is projected onto the active surface and a sealing ring projection is formed, and the support member is arranged between the sealing ring projection and the first side.
8. The flip chip according to claim 6, characterized in that: The support member has an outer side wall adjacent to the first side edge, and a third distance between the outer side wall and a projection of the sealing ring is not less than 1 μm.
9. The flip chip according to claim 8, characterized in that: The support member has an inner side wall adjacent to the bump, and a first distance between the inner side wall and the bump is not less than 1 μm.
10. The flip chip according to claim 6 or 7, characterized in that: The active surface has a convex block setting area, the convex block is set in the convex block setting area, and there is an opening between adjacent support members, and the opening is connected with the first side and the convex block setting area.
11. The flip chip according to claim 1 or 7, characterized in that: The support member has a side wall, and the support member has an outer side wall, and the outer side wall is flush with the side wall.
12. The flip chip according to claim 1, characterized in that: Along the axial direction of the support member toward the first side, the protrusion is projected onto the support member. Along the direction perpendicular to the axial direction, the protrusion has a first length, and the support member has a second length, which is not less than the first length.
13. The flip chip according to claim 12, characterized in that: The bump forms a bump projection on the support member, the bump projection has a second side, the support member has a third side adjacent to the second side, and along a direction perpendicular to the axis, a fourth distance from the second side to the third side is not less than 1 μm.