Light source, photoelectric conversion device, related equipment and system

Abstract

The embodiment of the invention discloses a light source, a photoelectric conversion device, related equipment and a system, and aims to improve the peak light power output by the light source under the condition of effectively reducing the size of the light source. The light source comprises a first substrate, a driving circuit and a first laser. The double surfaces, namely the first surface and the second surface, of the first substrate are located in the first packaging space and the second packaging space respectively. The first laser is packaged in the first packaging space or the second packaging space, and the driving circuit is packaged in at least one of the first packaging space and the second packaging space. Moreover, a packaging space packaged by the first laser is different from a packaging space packaged by at least part of the driving circuit. The driving circuit is electrically connected with the first laser through the first substrate so as to drive the first laser to emit light.

Description

Technical Field

[0001] The present application relates to the field of optical communication technology, and in particular to a light source, a photoelectric conversion device, related equipment and a system. Background Art

[0002] The application fields of light sources for emitting lasers are becoming more and more extensive. For example, light sources are applied to radar, passive optical network (PON), optical transport network (OTN) and industrial optical network. Taking the application of light sources to radar as an example, the peak optical power output by the light source is positively correlated with the detection distance of the radar. Therefore, increasing the peak optical power output by the light source can increase the detection distance of the radar.

[0003] The light source includes a laser and a radiator. The radiator is used to dissipate heat for the laser to ensure that the laser is always within a preset temperature range to increase the peak optical power output by the laser. For example, the radiator is fitted with the laser, and the radiator can dissipate heat for the laser through a water-cooled cooling channel.

[0004] In order to increase the peak optical power output by the laser, the number of lasers needs to be increased. When the number of lasers is increased, the volume of the heat sink needs to be increased to ensure heat dissipation of the lasers. The increase in the volume of the heat sink included in the light source will bring about the problem of increasing the volume of the light source. Moreover, the peak optical power output by the laser is increased only by the heat sink, which has limited effect on the peak optical power output by the laser. Summary of the invention

[0005] The embodiments of the present application provide a light source, a photoelectric conversion device, related equipment and a system, which can improve the peak optical power output by the light source while effectively reducing the volume of the light source.

[0006] In the first aspect, the embodiment of the present application provides a light source, including a first substrate, a driving circuit and a first laser. The driving circuit is electrically connected to the first laser through the first substrate, and the driving circuit is used to drive the first laser to emit light; along the direction perpendicular to the first substrate, the light source includes a first packaging space and a second packaging space stacked in position, the first surface of the first substrate is located in the first packaging space, the second surface of the first substrate is located in the second packaging space, and the orientation of the first surface is opposite to the orientation of the second surface. The first laser is packaged in the first packaging space or the second packaging space, and the driving circuit is packaged in at least one of the first packaging space and the second packaging space. And the packaging space packaged by the first laser is different from the packaging space packaged by at least part of the driving circuit. It can be understood that the packaging method of the first laser and the driving circuit can be the following example, for example, the first laser is packaged in the first packaging space, and the driving circuit is packaged in the second packaging space. For example, the first laser is packaged in the first packaging space, a part of the driving circuit is packaged in the first packaging space, and another part is packaged in the second packaging space. For example, the first laser is packaged in the second packaging space, and the driving circuit is packaged in the first packaging space. For another example, the first laser is packaged in the second packaging space, a part of the driving circuit is packaged in the first packaging space, and another part is packaged in the second packaging space.

[0007] According to the present aspect, the driving circuit and the first laser are directly electrically connected through the first substrate, so that the physical length of the electrical connection loop between the driving circuit and the first laser is shorter. The physical length of the electrical connection loop between the driving circuit and the first laser is negatively correlated with the driving current. The driving current is used to drive the first laser to emit light. The driving current is positively correlated with the peak optical power output by the first laser. Then, when the physical length of the electrical connection loop between the driving circuit and the first laser is shorter, the peak optical power output by the first laser is effectively improved. It can be understood that the light source shown in the present aspect can improve the peak optical power output by a single first laser included in the light source. Without changing the number of first lasers included in the light source, the peak optical power output by the light source as a whole is improved.

[0008] Based on the first aspect, in an optional implementation, along a direction perpendicular to the first substrate, the light source also includes a circuit board stacked with the first substrate, the surface of the circuit board facing the first substrate is located in the first packaging space, and the first surface is the surface of the first substrate facing the circuit board.

[0009] In the present aspect, when the light source includes a circuit board, a first packaging space is formed between the circuit board and the first substrate. Specifically, the surface of the circuit board facing the substrate and the first surface are located in the first packaging space to ensure that the driving circuit and the first laser are directly electrically connected through the first substrate, thereby effectively reducing the physical length of the electrical connection loop between the driving circuit and the first laser, thereby improving the peak optical power of the overall output of the light source.

[0010] Based on the first aspect, in an optional implementation, along a direction perpendicular to the first substrate, the first substrate includes at least a first sub-board and a second sub-board stacked in position, and the first sub-board includes a first current channel passing through the first sub-board, the second sub-board includes a second current channel passing through the second sub-board, any first current channel among the multiple first current channels is electrically connected to a second current channel among the multiple second current channels, and the driving circuit is electrically connected to the first laser through the first current channel and the second current channel.

[0011] By using the first substrate shown in this implementation, an electrical connection is achieved between the driving circuit and the first laser in a direction perpendicular to the first substrate, which effectively reduces the physical length of the electrical connection loop between the driving circuit and the first laser and effectively improves the peak optical power of the overall output of the light source.

[0012] Based on the first aspect, in an optional implementation, the first orthographic projection partially overlaps with the second orthographic projection, wherein the first orthographic projection is the orthographic projection of any first current channel among the multiple first current channels, and the second orthographic projection is the orthographic projection of a second current channel among the multiple second current channels.

[0013] By adopting the present implementation method, when the first sub-board includes multiple first current channels, the second sub-board includes multiple second current channels, and the first orthographic projection and the second orthographic projection partially overlap, the uniformity of the current flowing through the first substrate is improved, the parasitic inductance of the driving circuit is effectively reduced, and the peak light power output by the light source as a whole is improved.

[0014] Based on the first aspect, in an optional implementation, the driving circuit includes a first electrical module and a second electrical module, the first electrical module is encapsulated in the first encapsulation space, and the second electrical module is encapsulated in the second encapsulation space.

[0015] With this implementation, the driving circuit is packaged in the first packaging space and the second packaging space, which effectively reduces the physical length of the electrical connection loop between the driving circuit and the first laser and effectively improves the peak optical power output by the light source as a whole.

[0016] Based on the first aspect, in an optional implementation, the first laser is packaged in the first packaging space, and the driving circuit is packaged in the second packaging space, or the first laser is packaged in the second packaging space, and the driving circuit is packaged in the first packaging space.

[0017] By adopting this implementation, the driving circuit and the first laser are packaged in different packaging spaces, which can reduce the physical length of the electrical connection loop between the driving circuit and the first laser, and effectively improve the peak optical power of the overall output of the light source.

[0018] Based on the first aspect, in an optional implementation, the light source also includes a second laser electrically connected to the driving circuit, the driving circuit is electrically connected to the second laser through the first substrate, and the driving circuit is also used to drive the second laser to emit light; the second laser is packaged in the first packaging space or the second packaging space.

[0019] With this implementation, the light source includes multiple lasers, and each laser is directly electrically connected to the driving circuit through the first substrate, which effectively improves the peak optical power output by the light source as a whole and improves the integration of multiple lasers packaged in the light source.

[0020] Based on the first aspect, in an optional implementation, along a direction perpendicular to the first substrate, the light source also includes a second substrate stacked with the first substrate, the second packaging space includes a first sub-packaging space and a second sub-packaging space, the third surface and the second surface of the second substrate are located in the first sub-packaging space, the third surface is the surface of the second substrate facing the first substrate, the fourth surface of the second substrate is located in the second sub-packaging space, and the orientation of the third surface is opposite to that of the fourth surface; the first laser is packaged in one of the first packaging space, the first sub-packaging space and the second sub-packaging space, and the driving circuit is packaged in at least one of the first packaging space, the first sub-packaging space and the second sub-packaging space.

[0021] With this implementation, the first laser is packaged in one of the first packaging space, the first sub-packaging space, and the second sub-packaging space, and the driving circuit is packaged in at least one of the first packaging space, the first sub-packaging space, and the second sub-packaging space, thereby effectively reducing the physical length of the electrical connection loop between the first laser and the driving circuit and improving the integration of the light source.

[0022] Based on the first aspect, in an optional implementation, the light source further includes a heat sink for dissipating heat for the first laser. The heat sink is packaged on a surface of the circuit board facing away from the first substrate, and the heat sink includes at least one of an air cooling system, a water cooling system, a semiconductor cooler TEC, a heat sink, or an electric cooler.

[0023] In the second aspect, the embodiment of the present application provides a photoelectric conversion device, including a processing module, a modulation module, a demodulation module, a transmission port, a receiving port and a light source as described in any one of the first aspects above, wherein the processing module is respectively connected to the modulation module and the demodulation module, the modulation module is respectively connected to the light source and the transmission port, and the demodulation module is connected to the receiving port; the processing module is used to send a first service electrical signal to the modulation module; the light source is used to send an optical signal to the modulation module; the modulation module is used to modulate the first service electrical signal on the optical signal to obtain a first service optical signal; the transmission port is used to send the first service optical signal; the receiving port is used to receive a second service optical signal; the demodulation module is used to demodulate the second service electrical signal from the second service optical signal, and send the second service electrical signal to the processing module. For the description of the beneficial effects of this aspect, please refer to the first aspect, and the details will not be repeated.

[0024] For the description of the beneficial effects of this aspect, please refer to the first aspect and the details will not be repeated here.

[0025] In a third aspect, an embodiment of the present application provides an optical communication device, comprising an outer shell, a processor, and a photoelectric conversion device as described in any one of the first aspects above, wherein the outer shell is used to fix the processor and the photoelectric conversion device, and the processor is connected to the photoelectric conversion device; the processor is used to send the first service electrical signal to the photoelectric conversion device, and is also used to receive the second service electrical signal from the photoelectric conversion device.

[0026] In a fourth aspect, an embodiment of the present application provides a radar, comprising a controller, a receiving device, and a light source as described in any one of the first aspects above, wherein the controller is connected to the light source and the receiving device respectively; the light source is used to emit a laser beam; the receiving device is used to receive an echo light beam, and is used to perform photoelectric conversion on the echo light beam to obtain a detection electrical signal, wherein the object to be measured is used to reflect the laser beam to reflect the echo light beam to the receiving device; and the controller is used to detect the object to be measured based on the detection electrical signal.

[0027] In a fifth aspect, an embodiment of the present application provides a projection system, comprising an image modulation module, a lens, and a light source as described in any one of the first aspects above; the image modulation module is used to receive a projection beam from the light source, and to modulate the projection beam to obtain a modulated beam, and to transmit the modulated beam to the lens; the lens is used to image the modulated beam.

[0028] In the sixth aspect, an embodiment of the present application provides a head-up display system, comprising a light deflection module and a projection system as described in any one of the first aspects above; the projection system is used to transmit the modulated light beam to the light deflection module; the light deflection module is used to transmit the amplified modulated light beam to the windshield, and the modulated light beam reflected by the windshield forms a virtual image.

[0029] In the seventh aspect, an embodiment of the present application provides a vehicle, comprising a vehicle body, a windshield, a processor and a head-up display system as described in any one of the first aspects above; the vehicle body is used to fix the windshield, the processor and the head-up display system; the processor is used to transmit vehicle driving related information to the image modulation module; the image modulation module is used to modulate the vehicle driving related information on the projection light beam to obtain the modulated light beam.

[0030] In an eighth aspect, an embodiment of the present application provides an optical communication system, which includes multiple optical communication devices, among which two optical communication devices are connected via an optical cable. For the description of the optical communication devices, please refer to the third aspect above, and the details will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a structural example diagram of the light source provided in this application applied to a vehicle;

[0032] Figure 2 This is an example diagram of the circuit connection structure of an embodiment of the light source provided in this application;

[0033] Figure 3 This is an example diagram of the packaging structure of the first embodiment of the light source provided in this application;

[0034] Figure 4 This is an example diagram of the packaging structure of the second embodiment of the light source provided in this application;

[0035] Figure 5 This is an example diagram of the packaging structure of the third embodiment of the light source provided in this application;

[0036] Figure 6 This is an example diagram of the packaging structure of the fourth embodiment of the light source provided in this application;

[0037] Figure 7 This is an example diagram of the packaging structure of the fifth embodiment of the light source provided in the present application;

[0038] Figure 8 This is an example diagram of the packaging structure of the sixth embodiment of the light source provided in the present application;

[0039] Fig. 9 This is an example diagram of the packaging structure of the seventh embodiment of the light source provided in the present application;

[0040] Fig.10 This is an example diagram of the packaging structure of the eighth embodiment of the light source provided in the present application;

[0041] Fig.11 An example diagram of the structure of an embodiment of the photoelectric conversion device provided in this application;

[0042] Fig.12 An example diagram of the structure of an embodiment of the optical communication system provided in the present application;

[0043] Fig.13 An example diagram of the structure of an embodiment of the radar provided in this application;

[0044] Fig.14 An example diagram of the structure of an embodiment of the projection system provided in this application;

[0045] Fig.15 This is an example diagram of the structure of an embodiment of the head-up display system provided in this application. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0047] The embodiment of the present application provides a light source capable of emitting laser light, and the light source is applied to a vehicle as an example for illustrative description. It should be clear that the present embodiment does not limit the scene of the light source application. For example, the light source can also be applied to a data center network (DCN), a metropolitan area network, a PON or an OTN, etc., without specific limitation. The vehicle shown in this example can be a car, a truck, a motorcycle, a public vehicle, a lawn mower, an entertainment vehicle, a playground vehicle, a tram, a golf cart, a train, a cart or a drone, etc.

[0048] Figure 1This is a structural example diagram of a light source provided in the present application applied to a vehicle. In this embodiment, a vehicle 100 is configured to be in a fully or partially autonomous driving mode. The vehicle shown in this embodiment includes a vehicle body, which is used to fix a sensor system 120, an advanced driving assistance system (ADAS) 110, a peripheral device 130, and a computer system 140.

[0049] The sensor system 120 includes one or more sensors for sensing environmental information about the surroundings of the vehicle 100. For example, the sensor system 120 may include a positioning system, wherein the positioning system is any positioning system such as a global positioning system (GPS) system or a Beidou system. The sensor system 120 also includes an inertial measurement unit (IMU), a radar, and a camera. The sensor system 120 may also include sensors for monitoring the internal systems of the vehicle 100 (e.g., an in-vehicle air quality monitor, a fuel gauge, an oil temperature gauge, etc.). Sensor data from one or more of these sensors may be used to detect objects and their corresponding characteristics (position, shape, direction, speed, etc.). The positioning system may be used to estimate the geographic location of the vehicle 100. The IMU is used to sense the position and orientation changes of the vehicle 100 based on inertial acceleration. The IMU may be a combination of an accelerometer and a gyroscope. The radar may use radio signals to detect objects to be measured in the surroundings of the vehicle 100, for example, the objects to be measured may be pedestrians, vehicles, or buildings, etc. Optionally, the radar may also be used to detect the speed and / or forward direction of the object to be measured. This embodiment does not limit the specific type of radar, for example, the radar may be a millimeter wave radar or a laser radar, etc. The camera may be used to capture multiple images of the surrounding environment of the vehicle 100. The camera may be a static camera, a video camera, a single or binocular camera, or an infrared imager, etc.

[0050] ADAS110 senses the surrounding environment at any time during the driving process of the vehicle, collects data, identifies, detects and tracks static and dynamic objects, and combines navigation map data to perform systematic calculations and analysis, so as to make the driver aware of possible dangers in advance, effectively increasing the comfort and safety of driving the vehicle. For example, ADAS110 can control the vehicle through the data obtained by the sensor system 120. For another example, ADAS110 can control the vehicle through vehicle driving related information, where the vehicle driving related information can be the main data on the vehicle dashboard (fuel consumption, engine speed, temperature, etc.), vehicle speed information, steering wheel angle information, or body posture data, etc.

[0051] The vehicle 100 interacts with external sensors, other vehicles, other computer systems, or users through the peripheral device 130. The peripheral device 130 may include a wireless communication system, an onboard computer, a microphone, and / or a speaker. For example, the onboard computer may provide information to the user of the vehicle 100. The user interface may also operate the onboard computer to receive the user's input. The onboard computer may be operated through a touch screen. In other cases, the peripheral device 130 may provide a means for the vehicle 100 to communicate with other devices located in the vehicle. For example, the microphone may receive audio (e.g., voice commands or other audio input) from the user of the vehicle 100. The speaker may output audio to the user of the vehicle 100. The wireless communication system may communicate wirelessly with one or more devices directly or via a communication network.

[0052] Some or all functions of the vehicle 100 are controlled by the computer system 140. The computer system 140 may control functions of the vehicle 100 based on input received from various systems (e.g., the sensing system 120, the ADAS 110, the peripherals 130) and from a user interface. The computer system 140 may include at least one processor that executes instructions stored in a memory.

[0053] In this embodiment, the application of the light source to the radar of a vehicle is taken as an example. In other examples, the light source can also be applied to fixed radars (such as radars fixed on roads, monitoring radars, radars in industrial scenes, etc.). The light source can also be applied to radars of unmanned transport vehicles in logistics warehouses or radars of smart appliances in smart homes (for example, smart appliances are automatic cleaning robots), etc., without specific limitation. It can be understood that the laser beam emitted by the light source in this embodiment can also be called an optical signal, a laser pulse, a laser, a projection beam, or a transmission beam, etc., without limitation. In order to achieve the distinction, when the light source is applied to different scenes, the name of the light emitted by the light source is different. For example, if the light source is applied to a laser radar, the light emitted by the light source is called a laser beam. For another example, if the light source is applied to an optical communication system, the light emitted by the light source is called an optical signal. For another example, if the light source is applied to a projection system, the light emitted by the light source is called a projection beam.

[0054] Taking the radar of a vehicle in which the light source provided in this embodiment is applied as an example, the specific type of the radar is a laser radar, which is used to detect objects to be detected around the vehicle. The laser beam emitted by the light source has a high frequency and a short wavelength, so the height, distance and speed resolution of the laser detection can be improved. The detection distance of the laser radar is positively correlated with the peak optical power of the laser beam output by the light source. Specifically, the greater the peak optical power of the laser beam emitted by the light source, the farther the laser radar detects. Similarly, the smaller the peak optical power of the laser beam emitted by the light source, the closer the laser radar detects. For example, if the peak optical power of the laser beam emitted by the light source is 800 watts (W), the detection distance of the laser radar is 150 meters (m). For another example, if the peak optical power of the laser beam emitted by the light source is 1500W, the detection distance of the laser radar is 220m. For another example, if the peak optical power of the laser beam emitted by the light source is not less than 2000W, the detection distance of the laser radar is 300m. The light source provided in the embodiment of the present application effectively reduces the volume of the light source and also improves the peak light power output by the light source.

[0055] The light source provided in the embodiment of the present application includes a first laser and a driving circuit, wherein the driving circuit is electrically connected to the first laser and is used to drive the first laser to emit light. The electrical connection shown in this embodiment refers to a circuit connection of physical contact. It can be understood that the electrical connection refers to the form of connection between the first laser and the driving circuit through a physical line that can transmit electrical signals.

[0056] Figure 2An example diagram of a circuit connection structure of an embodiment of the light source provided in the present application. The light source shown in this embodiment includes a first laser 202, and the driving circuit includes a capacitor 201, a transistor 203 and a laser driver (laserdriver) 204. Specifically, the capacitor 201, the first laser 202, the transistor 203 and the laser driver 204 are connected in series in sequence. Among them, the capacitor 201 can realize the output of the laser driving current. When the transistor is in a conducting state, the laser driver 204 loads the driving current to the first laser 202 so that the first laser 202 emits an optical signal under the drive of the laser driver 204. Among them, the first laser 202 can be a Fabry-Perot (FP) laser, a distributed feedback (DFB) laser or a vertical cavity surface emitting laser (VCSEL), etc. The transistor 203 can be a triode (bipolar transistor) (also known as a bipolar junction transistor). The transistor 203 may also be a field effect transistor (e.g., a metal oxide semiconductor (MOSFET)). The present embodiment does not limit the description of the driving circuit structure, as long as the driving circuit successfully drives the first laser to emit light. For example, the driving circuit also includes an amplifier circuit for amplifying the current loaded on the first laser 202. For another example, the driving circuit also includes an impedance matching circuit for achieving impedance matching.

[0057] The driving current I applied by the driving circuit to the first laser 202 pk It can be expressed by formula 1, which is:

[0058]

[0059] Among them, V in is the voltage at the voltage input terminal of the driving circuit, V OUT is the voltage at the voltage output terminal of the driving circuit, ESL is the parasitic inductance of the driving circuit, and C is the capacitance value of capacitor 201. As shown in Formula 1, when V in 、V OUT And if C is fixed, then I pk There is a negative correlation between I pk The larger the value, the smaller the ESL. Similarly, I pk The smaller the ESL, the greater the ESL. pkThe larger the ESL, the greater the peak optical power output by the first laser 202. From the example of the light source applied to the radar shown above, it can be seen that if the peak optical power output by the first laser 202 is greater, the detection distance is farther. Therefore, by reducing the ESL of the driving circuit, the peak optical power output by the first laser is increased.

[0060] The ESL of the driving circuit can be expressed by Formula 2, which is: ESL=u0*L / 2π(ln(2L / r)-0.75).

[0061] L is the physical length of the electrical connection loop between the drive circuit and the first laser, r is the circuit cross-sectional radius, u0 is the vacuum magnetic permeability, and u0 = 4π*10-7 Henry per meter (H / m). It can be seen from Formula 2 that there is a positive correlation between L and the ESL of the drive circuit. Figure 2 As shown, L=L1+L2+L3+L4+L5, where L1 refers to the physical length of the circuit between the voltage input terminal of the driving circuit and the capacitor 201, L2 refers to the physical length of the circuit between the capacitor 201 and the first laser 202, L3 refers to the physical length of the circuit between the first laser 202 and the transistor 203, L4 refers to the physical length of the circuit between the transistor 203 and the laser driver 204, and L5 refers to the physical length of the circuit between the laser driver 204 and the voltage output terminal of the driving circuit. When r in Formula 2 is fixed, there is a positive correlation between ESL and L, that is, the larger L is, the larger ESL is, and similarly, the smaller L is, the smaller ESL is.

[0062] Combined with I shown in formula 1 pk There is a negative correlation between ESL and L. As shown in formula 2, there is a positive correlation between ESL and L. It can be understood that I pk There is a negative correlation between I and L. pk The larger L is, the greater the peak optical power output by the first laser. Therefore, to increase the peak optical power output by the first laser, it can be achieved by reducing L. The power supply provided in this embodiment can effectively reduce the physical length L of the electrical connection loop between the driving circuit and the first laser.

[0063] Figure 3 This is an example diagram of the packaging structure of the first embodiment of the light source provided in this application. The light source shown in this embodiment includes a first substrate 302, and the first substrate 302 is made of a plate material. This embodiment does not limit the plate material. For example, the plate material can be a paper base, a glass fiber cloth base, a composite base, a ceramic base, a metal core base, or an epoxy glass cloth laminate (FR-4), etc. Figure 3The surface of the first substrate 302 shown is parallel to or located in the XZ plane. The XZ plane includes a direction X and a direction Z perpendicular to the direction X, and a direction Y is perpendicular to the XZ plane. The direction Y is a direction perpendicular to the first substrate 302. Along the direction Y, the light source includes a first packaging space 311 ( Figure 3 311) and a second packaging space 312 ( Figure 3 312). It can be understood that along the direction Y, the second packaging space 312 is located above the first packaging space 311, so that the first packaging space 311 and the second packaging space 312 are in a stacked position relationship along the direction Y. The first surface 321 of the first substrate 302 is located in the first packaging space 311. The second surface 322 of the first substrate 302 is located in the second packaging space 312. The first surface 321 of the first substrate 302 is oriented in opposite directions to the second surface 322. It can be understood that in Figure 3 In the example shown, the first surface 321 and the second surface 322 are two surfaces of the first substrate 302 that are opposite to each other along the Y direction.

[0064] Figure 4 This is an example diagram of the packaging structure of the second embodiment of the light source provided in the present application. The light source shown in this embodiment also includes a circuit board 401, which can be a printed circuit board (PCB). The first packaging space 311 is formed between the circuit board 401 and the first substrate 302. Specifically, the first packaging space 311 includes the surface of the circuit board 401 facing the first substrate 302 and the first surface 321 of the first substrate 302. Along the direction Y, the first substrate 302 and the circuit board 401 are in a stacked position relationship. The first surface 321 is the surface of the first substrate 302 facing the circuit board 401.

[0065] Figure 3 as well as Figure 4In the example shown, the first laser 202 is packaged in the first packaging space 311. The first driving circuit is packaged in the first packaging space 311 and the second packaging space 312. For example, the first driving circuit includes a first electrical module and a second electrical module. The first electrical module is packaged in the first packaging space 311, and the second electrical module is packaged in the second packaging space 312. This embodiment does not limit the type and quantity of the first electrical module and the second electrical module. In this embodiment, the first electrical module includes a capacitor 201, and the second electrical module includes a transistor 201 and a laser driver 204. The first driving circuit is packaged in the first packaging space 311 and the second packaging space 312, which means that the capacitor 201 is packaged in the first packaging space 311, and the transistor 203 and the laser driver 204 are packaged in the second packaging space 312. In order to realize the electrical connection between the driving circuit and the first laser 202, the capacitor 201 and the first laser 202, the first laser 202 and the transistor 203, and the transistor 203 and the laser driver 204 are all connected in series through the first substrate 302. For a description of the circuit, please refer to Figure 2 As shown, the details are not repeated here.

[0066] It should be made clear that Figure 3 as well as Figure 4 The description of the components encapsulated in the first encapsulation space 311 and the second encapsulation space 312 is an optional example and is not limited. It can be understood that the light source provided in this embodiment includes four components as an example, and the four components are the first laser 202, the capacitor 201, the transistor 203 and the laser driver 204. Among the four components shown in this embodiment, some components are encapsulated in the first encapsulation space 311, and the other components are encapsulated in the second encapsulation space 312. Then it is explained that the encapsulation space encapsulated by the first laser 202 is different from the encapsulation space encapsulated by at least part of the first driving circuit. The specific examples are as follows:

[0067] Example 1: In this example, the first packaging space 311 packages one of the four devices, and the second packaging space 312 packages the other three of the four devices. Figure 5 The example shown, Figure 5 This is an example diagram of the packaging structure of the third embodiment of the light source provided in this application. Figure 5 In the example shown, the first laser 202 is packaged in the first packaging space 311, and the capacitor 201, transistor 203 and laser driver 204 of the driving circuit are all packaged in the second packaging space 312. It should be clear that Figure 5This is only an optional example of Example 1, which is not limited. For example, the capacitor 201 is packaged in the first packaging space 311. The first laser 202, the transistor 203, and the laser driver 204 are all packaged in the second packaging space 312. For another example, the transistor 203 is packaged in the first packaging space 311. The first laser 202, the capacitor 201, and the laser driver 204 are all packaged in the second packaging space 312. For another example, the laser driver 204 is packaged in the first packaging space 311. The first laser 202, the capacitor 201, and the transistor 203 are all packaged in the second packaging space 312.

[0068] Example 2: In this example, the first packaging space 311 packages two of the four devices, and the second packaging space 312 packages the other two of the four devices. Figure 3 as well as Figure 4 Example shown. Figure 3 as well as Figure 4 This is only an optional example, not limiting. For example, the first laser 202 and the transistor 203 are packaged in the first packaging space 311. The capacitor 201 and the laser driver 204 are both packaged in the second packaging space 312. For another example, the first laser 202 and the laser driver 204 are packaged in the first packaging space 311. The capacitor 201 and the transistor 203 are packaged in the second packaging space 312. For another example, the capacitor 201 and the transistor 203 are packaged in the first packaging space 311. The first laser 202 and the laser driver 204 are packaged in the second packaging space 312. For another example, the capacitor 201 and the laser driver 204 are packaged in the first packaging space 311. The transistor 203 and the first laser 202 are packaged in the second packaging space 312. For another example, the transistor 203 and the laser driver 204 are packaged in the first packaging space 311, and the first laser 202 and the capacitor 201 are packaged in the second packaging space 312.

[0069] Example 3: In this example, the first packaging space 311 packages three of the four devices, and the second packaging space 312 packages another of the four devices. Figure 6 The example shown, Figure 6 This is an example diagram of the packaging structure of the fourth embodiment of the light source provided in this application. Figure 6 In the example shown, the first laser 202, the capacitor 201 and the transistor 203 are packaged in the first packaging space 311. The laser driver 204 is packaged in the second packaging space 312. It should be clear that Figure 6This is only an optional example of Example 3 and is not limited. For example, capacitor 201, laser driver 204 and first laser 202 are packaged in first packaging space 311. Transistor 203 is packaged in second packaging space 312. For another example, laser driver 204, first laser 202 and first laser 202 are packaged in first packaging space 311. Capacitor 201 is packaged in second packaging space 312. For another example, laser driver 204, transistor 203 and capacitor 201 are packaged in first packaging space 311. First laser 202 is packaged in second packaging space 312.

[0070] In the above three examples, two or more devices packaged in the same package space can be integrated into a system in a package (SIP). Figure 3 In the example shown, the transistor 203 and the laser driver 204 are integrated in a package and packaged in the second packaging space 312 by means of SIP. Optionally, the first substrate 302 can be packaged in the SIP so that the SIP integrates the first substrate 302, the transistor 203 and the laser driver 204 to improve the integration of the light source.

[0071] In this embodiment, along direction Y, the first packaging space and the second packaging space are in a stacked state, and the device packaged in the first packaging space and the device packaged in the second packaging space (see the above examples one to three) are directly electrically connected through the first substrate 302, which effectively reduces the physical length of the electrical connection loop between the device packaged in the first packaging space and the device packaged in the second packaging space. For example, when the first laser is packaged in the first packaging space and the transistor is packaged in the second packaging space, the first laser and the transistor are directly electrically connected along the Y direction through the first substrate 302, which effectively reduces the physical length of the electrical connection loop between the first laser and the transistor. It can be understood that when the first laser and the driving circuit are packaged in the first packaging space and the second packaging space, the physical length of the electrical connection loop between the driving circuit and the first laser is effectively reduced. Therefore, the physical length of the electrical connection loop between the driving circuit and the first laser is proportional to the driving current I pk In this embodiment, the light source reduces the physical length of the electrical connection loop between the driving circuit and the first laser, thereby effectively increasing the driving current I pk . The light source increases the driving current I pk Under this circumstance, the peak optical power output by the first laser is effectively improved.

[0072] The first laser and the driving circuit shown in this embodiment are packaged in the first packaging space and the second packaging space in a positional superposition manner, ensuring that the driving circuit successfully drives the first laser to emit light, and improving the peak optical power of the laser while reducing the physical length of the electrical connection loop between the driving circuit and the first laser.

[0073] In the existing scheme, if it is necessary to increase the peak optical power output by the light source, it is necessary to integrate more lasers in the light source. The light source shown in the present application effectively increases the peak optical power output by each laser. Then, if the light source of the existing scheme and the light source provided by the embodiment of the present application have the same peak optical power output, the light source provided by the embodiment of the present application includes a smaller number of lasers, and there is no need to increase the volume of the radiator, thereby effectively reducing the volume of the light source, improving the integration of the light source and the utilization efficiency of the volume, and also reducing the cost of the light source. Compared with the existing light source, the driving current of the light source provided by the embodiment of the present application is increased by about 75%, thereby increasing the peak optical power output by about 50%.

[0074] Combination Figure 7 The driving circuit is electrically connected to the first laser through the first substrate, wherein: Figure 7 This is an example diagram of the packaging structure of the fifth embodiment of the light source provided in the present application.

[0075] Figure 7 The example shown is exemplified by taking the first laser 202 and the capacitor 201 packaged in the first packaging space 311, and the transistor 203 and the laser driver 204 packaged in the second packaging space 312 as an example. Along the direction perpendicular to the first substrate (i.e., direction Y), the first substrate includes at least a first sub-board 701 and a second sub-board 702 stacked in position. Along direction Y, the distance between the first sub-board 701 and the circuit board 401 is less than the distance between the second sub-board 702 and the circuit board 401. The first sub-board 701 includes a plurality of first current channels. This embodiment does not limit the number of first current channels included in the first sub-board 701, for example Figure 7 In the example shown, the first sub-board 701 includes a first current channel 711, a first current channel 712, a first current channel 713, and a first current channel 714. Each first current channel included in the first sub-board 701 passes through the first sub-board 701 along a direction Y. The second sub-board 702 includes a plurality of second current channels. This embodiment does not limit the number of second current channels included in the second sub-board 702, for example Figure 7In the example shown, the second sub-board 702 includes a second current channel 721, a second current channel 722, a second current channel 723, and a second current channel 724. Each second current channel included in the second sub-board 702 passes through the second sub-board 702 along the direction Y. Taking the first current channel 711 as an example, the first current channel 711 is a conductive material that runs through the first sub-board 701. This embodiment does not limit the conductive material, for example, it can be silver, copper, gold, aluminum or nickel. For the description of the second current channel, please refer to the description of the first current channel 711, and no further details will be given.

[0076] The first current channel and the second current channel shown in this embodiment, which are close to each other, are in contact to achieve electrical connection. For example, the first current channel 711 and the second current channel 721 are in contact with each other to achieve electrical connection. By analogy, the first current channel 714 and the second current channel 724 are in contact with each other to achieve electrical connection. The first laser 202 and each device included in the drive circuit are soldered to the first substrate 302 in a flip-chip manner. Taking the first laser 202 as an example, the flip-chip soldering of the first laser 202 to the first substrate 302 means that the electrical connection of the first laser 202 faces the first substrate 302. The electrical connection may be a solder ball. To achieve electrical connection between the first laser 202 and the first substrate 302, the solder ball of the first laser 202 is soldered to the first current channel of the first sub-plate 701. The transistor 203 is soldered to the second current channel of the second sub-plate 702 in a flip-chip manner. Due to the electrical connection between the first current channel and the second current channel, the electrical connection between the first laser 202 and the transistor 203 is realized based on the first substrate 302, and the physical length of the electrical connection loop between the first laser 202 and the transistor 203 is reduced based on the first substrate 302. In this embodiment, each device is packaged in the first packaging space or the second packaging space by flip-chip welding as an example, and the specific embodiment is not limited. In other examples, the device can be packaged in the first packaging space or the second packaging space by any die bonding method.

[0077] Between the multiple first current channels and the multiple second current channels shown in this embodiment, the first current channel 711 and the second current channel 721 are located close to each other, so the first orthographic projection of the first current channel 711 and the second orthographic projection of the second current channel 721 partially overlap. Among them, the first orthographic projection of the first current channel 711 refers to the orthographic projection formed on the projection plane by multiple mutually parallel projection lines irradiating the first current channel 711. The first sub-board 701 is parallel to the projection plane, and the multiple projection lines are perpendicular to the projection plane and the first sub-board 701. For the description of the second orthographic projection of the second current channel 721, please refer to the description of the first orthographic projection of the first current channel 711, and the details are not repeated. It can be understood that in this embodiment, the first orthographic projection of any first current channel among the multiple first current channels partially overlaps with the orthographic projection of one second current channel among the multiple second current channels.

[0078] The beneficial effect of the first current channel 711 and the second current channel 721 shown in this embodiment contacting each other to achieve electrical connection is described in Formula 3.

[0079] Formula 3 is:

[0080] Where, In is the logarithm with base e, and A is a preset constant, for example, A=5.08. h is the sum of the via depths of the current channels that are in contact with each other to achieve electrical connection and are located on different sub-boards. For example, h is the sum of the depth of the first current channel 711 along the direction Y and the depth of the second current channel 721 along the direction Y. D is the sum of the via diameters of the current channels that are in contact with each other to achieve electrical connection and are located on different sub-boards. For example, D is the sum of the diameter of the first current channel 711 and the diameter of the second current channel 721. See, for example, Figure 7 As shown, the staggered layout of the current channels of different sub-boards is equivalent to increasing the diameter of the current channel of the substrate. For example, the diameter of a current channel of the substrate is the sum of the diameter of the first current channel 711 and the diameter of the second current channel 721, thereby improving the inductance of the driving circuit.

[0081] Combined with I shown in formula 1 pk There is a negative correlation between D and ESL. As shown in Formula 3, there is a negative correlation between D and ESL. Then, I pk It is positively correlated with D. Therefore, increasing D can effectively increase the I of the driving circuit. pk The staggered layout of the current channels of different sub-boards shown in this embodiment effectively increases the diameter D of the current channel of the substrate, thereby effectively improving the I pk .

[0082] In this embodiment, the first substrate 302 includes two sub-boards as an example. In other examples, the first substrate 302 may include more than two sub-boards. This embodiment does not limit the number of sub-boards included in the first substrate 302. Because the first substrate 302 shown in this embodiment includes multiple layers of sub-boards, and each side of the sub-board includes multiple current channels, and the first orthographic projection and the second orthographic projection of different layers partially overlap, the uniformity of the current flowing through the first substrate is improved, and the parasitic inductance of the driving circuit is effectively reduced. For example, compared with the method of connecting the laser and the driving circuit in series in the existing light source, the light source shown in the embodiment of the present application reduces the parasitic inductance of the light source by about 30%.

[0083] It should be noted that the structure of the circuit board 401 shown in this embodiment may also adopt the structure of the first substrate, that is, the circuit board 401 includes a first sub-board and a second sub-board, the first sub-board includes a plurality of first current channels, and the second sub-board includes a plurality of second current channels. For descriptions of the first sub-board, the second sub-board, the first current channel, and the second current channel included in the circuit board 401, please refer to Figure 7 The description of the corresponding first substrate structure is not repeated in detail.

[0084] Figure 8 This is an example diagram of the packaging structure of the sixth embodiment of the light source provided in the present application. The light source shown in this embodiment also includes a heat sink 801. Specifically, the surface of the circuit board 401 facing away from the first substrate 302 is packaged with a heat sink 801, and the heat sink 801 is used to control the optical power of the optical signal emitted by the first laser 202 to be within a preset range, so as to ensure the stability of the peak optical power output by the first laser 202 and avoid the situation where the peak optical power output by the first laser 202 decreases. This embodiment does not limit the specific heat dissipation method of the heat sink 801. For example, the heat sink 801 includes an air cooling system, a water cooling system, a semiconductor refrigerator (thermo electric cooler, TEC), a heat sink or an electric refrigerator, etc.

[0085] The light source shown in this embodiment includes a first laser array, and the first laser array includes N*M first lasers. For the description of the first laser, please refer to the above embodiment, and no further details are given. Wherein, N refers to the number of first lasers included in the first laser along the direction X, and M refers to the number of first lasers included in the first laser array along the direction Z. For the description of the packaging position of the first laser array in the light source shown in this embodiment, please refer to the description of the packaging position of the first laser 202, and no further details are given. This embodiment does not limit the specific electrical connection form of the first laser array. For example, in the first laser array, different first lasers are connected in parallel so that each first laser is connected in series to the drive circuit. For another example, in the first laser array, a part of the first lasers are connected in series in sequence and connected in series to the drive circuit. Another first laser is connected in parallel to each other and connected in series to the drive circuit. For another example, in the first laser array, multiple first lasers are connected in series in sequence and connected in series to the drive circuit.

[0086] Fig. 9 The seventh embodiment of the light source provided in the present application is a packaging structure example diagram. The light source shown in this embodiment includes a first laser array 901 and a second laser array 902. Among them, the second laser array 902 includes a plurality of second lasers. For the description of the plurality of second lasers included in the second laser array 902, please refer to the description of the first laser array including a plurality of first lasers shown above, and no further details are given. Fig. 9The embodiment shown takes the first laser array 901 and the second laser array 902 encapsulated in the first encapsulation space as an example, the first laser array 901 and the second laser array 902 are in a parallel connection relationship, and the first laser array 901 and the second laser array 902 are respectively connected in series with the driving circuit. For the description of the driving circuit encapsulated in the light source, please refer to the above example, which is not limited. This embodiment does not limit the electrical connection method between the first laser array 901 and the second laser array 902. In other examples, a part of the second laser included in the second laser array 902 is connected in series with the first laser array 901, and another second laser is connected in parallel with the first laser array 901. For another example, the second laser array 902 is connected in series with the first laser array 901. This embodiment takes the first laser array 901 and the second laser array 902 as an example, which is not limited. In other examples, the first laser array 901 and the second laser array 902 are both encapsulated in the second encapsulation space 311. For another example, the first laser array 901 is packaged in the first packaging space 311, and the second laser array 902 is packaged in the second packaging space 312. For another example, the first laser array 901 is packaged in the second packaging space 312, and the second laser array 902 is packaged in the first packaging space 311. This embodiment does not limit the number of laser arrays included in the light source. When the light source includes multiple laser arrays, the peak optical power output by the light source is increased.

[0087] Fig.10 This is an example diagram of the packaging structure of the eighth embodiment of the light source provided in the present application. Along the direction Y perpendicular to the first substrate 302, the light source shown in this embodiment also includes a second substrate 1001. It can be understood that along the direction Y perpendicular to the first substrate 302, the first substrate 302 and the second substrate 1001 are in a stacked relationship. The second packaging space shown in this embodiment specifically includes a first sub-packaging space 1021 and a second sub-packaging space 1011. Specifically, the third surface 1002 of the second substrate 1001 and the second surface 322 of the first substrate 302 are located in the second sub-packaging space 1021. It can be understood that the third surface 1002 of the second substrate 1001 is the surface of the second substrate 1001 facing the first substrate 302. That is, along the direction Y, the second substrate 1001, the first substrate 302 and the circuit board 401 are stacked in sequence. Along the direction perpendicular to the first substrate 302 (that is, along the direction Y), the light source includes a second sub-packaging space 1011 ( Fig.10The fourth surface 1003 of the second substrate 1001 is located in the second sub-packaging space 1011. The orientation of the third surface 1002 is opposite to the orientation of the fourth surface 1003. For the description of the positions of the third surface 1002 and the fourth surface 1003 of the second substrate 1001, please refer to the description of the positions of the first surface 321 and the second surface 322 of the first substrate 302 in the above embodiment, and the specific details are not repeated. The driving circuit and the first laser shown in this embodiment are packaged in the first packaging space, the first sub-packaging space 1021 and the second sub-packaging space 1011. For example, the first laser 202 and the capacitor 201 are packaged in the first packaging space 311, the transistor 203 is packaged in the second sub-packaging space 1021, and the laser driver 204 is packaged in the second sub-packaging space 1011. It can be understood that the first laser and the driving circuit shown in this embodiment include four devices. In the first packaging space 311, the second sub-packaging space 1021 and the second sub-packaging space 1011, each packaging space encapsulates at least one of the four devices. For specific descriptions, please refer to the descriptions of the four devices encapsulated in the first packaging space 311 and the second packaging space 312 shown in the above examples 1 to 3. The specific descriptions are not repeated here. The light source shown in this embodiment may also include a first laser array and a second laser array. For descriptions of the first laser array and the second laser array, please refer to Fig. 9 The corresponding descriptions are not described in detail. The first laser array and the second laser array can be packaged in the same packaging space of the first packaging space 311, the second sub-packaging space 1021 and the second sub-packaging space 1011. For another example, the first laser array and the second laser array can be packaged in any two different packaging spaces of the first packaging space 311, the second sub-packaging space 1021 and the second sub-packaging space 1011. It should be clear that for the description of the structure of the second substrate 1001 and the description of the electrical connection of the second substrate 1001, please refer to the description of the structure of the first substrate 302 and the description of the electrical connection of the first substrate 302 in the above embodiment, and no further details are given. This embodiment does not limit the number of substrates included in the light source. In other examples, the light source may include any number of more than two substrates.

[0088] Fig.11An example diagram of the structure of an embodiment of the photoelectric conversion device provided in the present application. The photoelectric conversion device 1100 shown in this embodiment can be referred to as an optical module (optical transceiver). The photoelectric conversion device 1100 includes a light source 1101, a modulation module 1102, a demodulation module 1104, a transmission (transport, TX) port 1103, a receiving port (receive, RX) 1105 and a processing module 1106. The processing module 1106 is connected to the modulation module 1102 and the demodulation module 1104 respectively, the modulation module 1102 is connected to the light source 1101 and the transmission port 1103 respectively, and the demodulation module 1104 is connected to the receiving port 1105. The light source 1101 is used to send an optical signal to the modulation module 1102, the processing module 1106 is used to send a first service electrical signal to the modulation module 1102, the modulation module 1102 is used to receive the optical signal from the light source, and is used to modulate the first service electrical signal on the optical signal to obtain a first service optical signal. The light source 1101 and the modulation module 1102 shown in this embodiment can be two separate devices, or the light source 1101 and the modulation module 1102 can be a device packaged as one, so as to perform electrical-optical conversion on the first service electrical signal to output the first service optical signal, which is not limited in this embodiment. The sending port 1103 is used to send the first service optical signal from the modulation module 1102.

[0089] The receiving port 1105 is used to receive the second service optical signal, and the demodulation module 1104 is used to receive the second service optical signal from the receiving port 1105, and to perform photoelectric conversion on the second service optical signal to demodulate the second service electrical signal from the second service optical signal. The demodulation module 1104 is used to send the second service electrical signal to the processing module 1106.

[0090] This embodiment does not limit the form of the processing module 1106. For example, the processing module 1106 may be one or more chips, or one or more integrated circuits. For example, the processing module 1106 may be one or more optical digital signal processors (oDSP), field-programmable gate arrays (FPGA), application specific integrated circuits (ASIC), system on chip (SoC), central processor unit (CPU), network processor (NP), microcontroller unit (MCU), programmable logic device (PLD) or other integrated chips, or any combination of the above chips or processing modules, etc., which will not be described in detail.

[0091] The photoelectric conversion device shown in this embodiment includes a fiber optic connector, which includes a transmission port 1103 and a receiving port 1105. The transmission port 1103 is used to connect the first external optical cable and the first internal optical cable. The receiving port 1105 is used to connect the second external optical cable and the second internal optical cable. The first external optical cable and the second external optical cable are located outside the housing of the photoelectric conversion device 1100. The first internal optical cable and the second internal optical cable are located inside the housing of the photoelectric conversion device 1100. For example, the photoelectric conversion device 1100 is connected to an external device, then one end of the first external optical cable is connected to the transmission port 1103, and the other end is connected to the external device, so that the photoelectric conversion device 1100 sends the first service optical signal to the external device through the first external optical cable. For another example, one end of the second external optical cable is connected to the receiving port 1105, and the other end is connected to the external device, so that the photoelectric conversion device 1100 receives the second service optical signal from the external device through the second external optical cable. The transmission port 1103 is connected to the modulation module 1102 through the first internal optical cable. The receiving port 1105 is connected to the demodulation module 1104 via a second internal optical cable.

[0092] The specific type of the optical fiber connector shown in this embodiment can be any of the following. It should be noted that the description of the optical fiber connector type in this embodiment is an optional example and is not limited:

[0093] Multi fiber push on (MPO) type fiber optic connector, ferrule connector (FC) type fiber optic connector, square connector (SC) type fiber optic connector, lucent connector (LC) type fiber optic connector, straight tip (ST) type fiber optic connector or fiber distributed data interface (IFDD) type fiber optic connector.

[0094] Fig.12 This is an example diagram of the structure of an embodiment of the optical communication system provided in the present application. The optical communication system 1200 shown in this embodiment includes a core node (central point, CP) 1201 and multiple access nodes (access point, AP) 1202 connected to CP1201. CP1201 can be connected to multiple APs through one or more optical splitters. This embodiment does not limit the number of APs included in the optical communication system 1200. For example, the optical communication system 1200 includes three AP1202. CP1201 includes an outer shell, a frame, a CP side device 1211 and a first optoelectronic conversion device 1212. The CP side device 1211 includes a processor. For a description of the processor type, please refer to Fig.11 The description of the corresponding processing module is not repeated in detail. The processor is used to send a first service electrical signal to the first photoelectric conversion device 1212, and to receive a second service electrical signal from the first photoelectric conversion device 1212. The plug-in frame of the CP side device 1211 is used to plug in one or more first photoelectric conversion devices 1212. Optionally, the first photoelectric conversion device 1212 can also be integrated with the CP side device 1211. For a description of the first photoelectric conversion device 1212, please refer to Fig.11 The corresponding description is omitted here. CP1201 is connected to AP1202 via an external optical cable.

[0095] AP1202 includes an outer shell, a second photoelectric conversion device, and an AP side device. Exemplarily, the second photoelectric conversion device can be directly plugged into the AP side device, or can be integrated with the AP side device. This embodiment takes the example of AP1202 including a second photoelectric conversion device. In other examples, AP1202 may also include multiple second photoelectric conversion devices. For the description of the AP1202 structure in this embodiment, refer to the description of the CP1201 structure, and the details are not repeated here.

[0096] This embodiment does not limit the network to which the optical communication system 1200 is applied. For example, if the optical communication system 1200 shown in this embodiment is applied to PON, the AP may be an optical network unit (ONU) or an optical network terminal (ONT). The core node CP1201 may be an optical line terminal (OLT), a switch (e.g., a core layer switch, a layer 2 switch) or a router. If the optical communication system 1200 is applied to OTN, the CP and AP may both be OTN devices.

[0097] The present application provides an optical communication device. The description of the optical communication device can be found in Fig.12 The corresponding description of CP1201 or AP1202 is not repeated here.

[0098] Fig.13 This is an example diagram of the structure of an embodiment of the radar provided in the present application. The radar 1300 shown in this embodiment includes a controller 1301, a light source 1302 and a receiving device 1303. The light source 1302 and the receiving device 1303 are respectively connected to the controller 1301. The connection relationship between the various components included in the radar can be an electrical connection or an optical fiber connection. The controller 1301 is used to control the light source 1302 and the receiving device 1303 so that the light source 1302 and the receiving device 1303 can work normally. Exemplarily, the controller 1301 provides driving voltages to the light source 1302 and the receiving device 1303 respectively, and the controller 1301 can also provide a transmission control signal for the light source 1302. Among them, the description of the structure of the light source 1302, please refer to the description of the above embodiment, and the details are not repeated. For the description of the type of controller 1301, please refer to Fig.11 The description of the corresponding processing module types is not repeated here.

[0099] The controller 1301 is used to send a control signal to the light source 1302, and the light source 1302 is used to emit a laser beam for realizing radar detection according to the control signal. The laser beam propagates along the emission direction. When the laser beam encounters the object to be measured, it is reflected on the surface of the object to be measured, and the reflected echo beam is received by the receiving device 1303 of the radar 1300. In the embodiment of the present application, the beam reflected by the laser beam from the object to be measured is called an echo beam. After receiving the echo beam, the receiving device 1303 performs photoelectric conversion on the echo beam, that is, converts the echo beam into an electrical signal (the electrical signal is referred to as the detection electrical signal below). The receiving device 1303 sends the detection electrical signal to the controller 1301, so that the controller 1301 can obtain the position information of the object to be measured according to the detection electrical signal. Specifically, the controller 1301 can determine the position information of the object to be measured by calculating the time delay between the emission time point of the laser beam and the return time point of the detection electrical signal. At the same time, the radar 1300 can also acquire the position information of each point on the surface of the object to be measured by emitting laser beams with different spatial orientations to the object to be measured, thereby generating a point cloud image of the object to be measured.

[0100] In this embodiment, the radar 1300 is a laser radar as an example. Laser radar is a target detection technology. Laser radar emits a laser beam, and the laser beam is diffusely reflected after encountering the object to be measured. The reflected echo beam determines the distance, direction, height, speed, posture, shape and other characteristic quantities of the object to be measured. Laser radar is applied to intelligent driving vehicles, intelligent driving aircraft, 3D printing, virtual reality (VR), augmented reality (AR), service robots and other fields. The intelligent driving in the embodiment of this application can be unmanned driving, automatic driving, or assisted driving.

[0101] Fig.14 This is an example diagram of the structure of an embodiment of the projection system provided in the present application. The projection system 1400 includes a light source 1401, an image modulation module 1402 and a lens 1403. For the description of the structure of the light source 1401 shown in this embodiment, please refer to the above embodiment, and the specific details are not repeated here. The light source 1401 in this embodiment outputs a projection light beam (white light) to the image modulation module 1402. The image modulation module 1402 is used to receive a projection light beam from the light source 1401, and to modulate the projection light beam 1401 to obtain a modulated light beam, and is also used to transmit the modulated light beam to the lens 1403. The lens 1403 is used to project the modulated light beam outward and to image the modulated light beam. The lens 1403 can be a short-focus lens.

[0102] The image modulation module 1402 in this embodiment can be a liquid crystal on silicon (LCOS) display, an organic light-emitting diode (OLED) display, a liquid crystal display (LCD), a digital light processing (DLP) display or a micro-electro-mechanical systems (MEMS) display, etc.

[0103] The light source 1401 in this embodiment may include a three-color light source (the laser array included in the light source specifically includes a laser for emitting blue light, a laser for emitting red light, and a laser for emitting green light). Optionally, the light source 1401 may include a beam splitter, which may be a wave plate or a semi-reflective and semi-transmissive wave plate, etc. The beam splitter is used to filter out the red light in the projection beam output by the light source and transmit it to the image modulation module 1402. The beam splitter is used to filter out the blue light in the projection beam output by the light source and transmit it to the image modulation module 1402. The beam splitter is used to filter out the green light in the projection beam output by the light source and transmit it to the image modulation module 1402.

[0104] The projection system shown in this embodiment can be applied to projection lamps. Specifically, the modulated light beam emitted by the lens 1403 displays a target light pattern on the road surface to form an image. The target light pattern formed by the modulated light beam can be a light blanket displayed on the road surface projection area. The light blanket prompts the driver with the vehicle's ADAS information, the main data on the vehicle dashboard (fuel consumption, engine speed, temperature, etc.), vehicle speed information, steering wheel angle information or vehicle body posture data, etc. through the modulated image, color, light pattern, etc., which is not limited in this embodiment. The modulated light beam emitted by the projection lamp shown in this embodiment, which is displayed in a target light pattern, can also be used to illuminate the road surface around the vehicle, etc., to improve driving safety or navigation efficiency. The projection lamp shown in this embodiment is used for vehicle lighting and image projection, and can be a low beam lamp or an adaptive high beam lamp to realize vehicle-assisted automatic driving.

[0105] Fig.15 This is an example diagram of an embodiment of the head-up display system provided in this application. The head-up display (HUD) system shown in this embodiment includes a projection system 1401 and a light deflection module 1402. For a description of the projection system 1401, please refer to Fig.13The corresponding instructions are not detailed here. The HUD system projects vehicle-related information to the front of the driver's field of vision. Vehicle-related information can be instrument information (such as vehicle speed) or navigation information, etc. Then, the driver can see vehicle-related information in front of the field of vision without having to look down at the instrument panel or central control display under the steering wheel, thereby improving the braking reaction time in an emergency and improving driving safety.

[0106] The projection system 1401 shown in this embodiment transmits the modulated light beam 1411 to the light deflection module 1402. Specifically, Fig.13 As shown, the projection system 1401 includes a light source, an image modulation module and a lens. The light source transmits a projection beam to the image modulation module, and the image modulation module modulates the vehicle-related information on the projection beam to obtain a modulated beam 1411. The lens 1403 transmits the imaged modulated beam 1411 to the light deflection module 1402. The light deflection module 1402 forms an enlarged virtual image 1412 of the modulated beam in front of the vehicle. Among them, the light deflection module shown in this embodiment includes a curved mirror 1403. The curved mirror 1403 enlarges the light spot of the modulated beam 1411 to transmit it to the windshield 1404 of the vehicle. The windshield 1404 reflects the modulated beam 1411 to the driver's binoculars for imaging. That is, the reverse extension line of the image formed in the driver's binoculars forms a virtual image 1412 in front of the vehicle. This embodiment takes the application of the HUD system to a vehicle as an example. In other examples, the HUD system can also be applied to driving tools such as ships, airplanes, and helicopters that require drivers to drive.

[0107] The HUD shown in this embodiment can also be a HUD with a three-dimensional (3D) display function. The HUD with a 3D display function modulates the vehicle driving related information on the projection beam emitted by the projection system, and displays the vehicle driving related information in the form of a virtual image in front of the vehicle. Moreover, the virtual image is superimposed on the road scene (such as roads, buildings, pedestrians, etc.) to achieve a 3D display effect.

[0108] This embodiment also provides a means of transportation. For a detailed description of the structure, see Figure 1 The corresponding instructions are not elaborated in detail.

[0109] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A light source, characterized in that: It comprises a first substrate, a driving circuit and a first laser, wherein the driving circuit is electrically connected to the first laser through the first substrate, and the driving circuit is used to drive the first laser to emit light; Along a direction perpendicular to the first substrate, the light source comprises a first packaging space and a second packaging space stacked in position, a first surface of the first substrate is located in the first packaging space, a second surface of the first substrate is located in the second packaging space, and the first surface and the second surface are oriented in opposite directions; The first laser is packaged in the first packaging space or the second packaging space, the driving circuit is packaged in at least one of the first packaging space and the second packaging space, and the packaging space in which the first laser is packaged is different from the packaging space in which at least part of the driving circuit is packaged.

2. The light source according to claim 1, characterized in that Along a direction perpendicular to the first substrate, the light source further includes a circuit board stacked with the first substrate, a surface of the circuit board facing the first substrate is located in the first packaging space, and the first surface is a surface of the first substrate facing the circuit board.

3. The light source according to claim 1 or 2, characterized in that: Along a direction perpendicular to the first substrate, the first substrate includes at least a first sub-plate and a second sub-plate stacked in position, and the first sub-plate includes a first current channel passing through the first sub-plate, the second sub-plate includes a second current channel passing through the second sub-plate, any first current channel among the plurality of the first current channels is electrically connected to a second current channel among the plurality of the second current channels, and the driving circuit is electrically connected to the first laser through the first current channel and the second current channel.

4. The light source according to claim 3, characterized in that The first orthographic projection partially overlaps with the second orthographic projection, wherein the first orthographic projection is the orthographic projection of any first current channel among the multiple first current channels, and the second orthographic projection is the orthographic projection of one second current channel among the multiple second current channels.

5. The light source according to any one of claims 1 to 4, characterized in that: The driving circuit includes a first electrical module and a second electrical module, wherein the first electrical module is encapsulated in the first encapsulation space, and the second electrical module is encapsulated in the second encapsulation space.

6. The light source according to any one of claims 1 to 4, characterized in that: The first laser is packaged in the first packaging space, and the driving circuit is packaged in the second packaging space, or the first laser is packaged in the second packaging space, and the driving circuit is packaged in the first packaging space.

7. The light source according to any one of claims 1 to 6, characterized in that: The light source further comprises a second laser electrically connected to the driving circuit, the driving circuit is electrically connected to the second laser through the first substrate, and the driving circuit is further used to drive the second laser to emit light; The second laser is packaged in the first packaging space or the second packaging space.

8. The light source according to any one of claims 1 to 7, characterized in that: In a direction perpendicular to the first substrate, the light source further comprises a second substrate stacked with the first substrate, the second encapsulation space comprises a first sub-encapsulation space and a second sub-encapsulation space, the third surface and the second surface of the second substrate are located in the first sub-encapsulation space, the third surface is a surface of the second substrate facing the first substrate, the fourth surface of the second substrate is located in the second sub-encapsulation space, and the orientation of the third surface is opposite to that of the fourth surface; The first laser is packaged in one of the first packaging space, the first sub-packaging space, and the second sub-packaging space, and the driving circuit is packaged in at least one of the first packaging space, the first sub-packaging space, and the second sub-packaging space.

9. A photoelectric conversion device, characterized in that: The method comprises a processing module, a modulation module, a demodulation module, a transmission port, a receiving port and a light source according to any one of claims 1 to 8, wherein the processing module is connected to the modulation module and the demodulation module respectively, the modulation module is connected to the light source and the transmission port respectively, and the demodulation module is connected to the receiving port; The processing module is used to send a first service electrical signal to the modulation module; The light source is used to send an optical signal to the modulation module; The modulation module is used to modulate the first service electrical signal on the optical signal to obtain a first service optical signal; The sending port is used to send the first service optical signal; The receiving port is used to receive a second service optical signal; The demodulation module is used for demodulating the second service electrical signal from the second service optical signal, and sending the second service electrical signal to the processing module.

10. An optical communication device, characterized in that: It comprises an outer shell, a processor and the photoelectric conversion device according to claim 9, wherein the outer shell is used to fix the processor and the photoelectric conversion device, and the processor is connected to the photoelectric conversion device; The processor is used to send the first service electrical signal to the photoelectric conversion device, and is also used to receive the second service electrical signal from the photoelectric conversion device.

11. A radar, characterized in that: It comprises a controller, a receiving device and the light source according to any one of claims 1 to 8, wherein the controller is connected to the light source and the receiving device respectively; The light source is used to emit a laser beam; The receiving device is used to receive the echo light beam and to perform photoelectric conversion on the echo light beam to obtain a detection electrical signal, wherein the object to be measured is used to reflect the laser beam to reflect the echo light beam toward the receiving device; The controller is used to detect the object to be detected according to the detection electrical signal.

12. A projection system, characterized in that: It comprises an image modulation module, a lens and a light source as claimed in any one of claims 1 to 8; The image modulation module is used to receive the projection light beam from the light source, and to modulate the projection light beam to obtain a modulated light beam, and is also used to transmit the modulated light beam to the lens; The lens is used to image the modulated light beam.

13. A head-up display system, characterized in that: comprising a light deflection module and a projection system as claimed in claim 12; The projection system is used to transmit the modulated light beam to the light deflection module; The light deflection module is used to transmit the amplified modulated light beam to the windshield, and the modulated light beam reflected by the windshield forms a virtual image.

14. A means of transport, characterized in that: It comprises a vehicle body, a windshield, a processor and the head-up display system as claimed in claim 13; the vehicle body is used to fix the windshield, the processor and the head-up display system; The processor is used to transmit vehicle driving related information to the image modulation module; The image modulation module is used to modulate the vehicle driving related information on the projection light beam to obtain the modulated light beam.

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