Radiator based on three-dimensional vapor chamber

Abstract

The invention discloses a radiator based on a three-dimensional uniform temperature plate, which enables an upper cover plate of the uniform temperature plate to fully exchange heat with the outside, improves the heat exchange efficiency of a heat pipe and the outside, and improves the overall heat transfer efficiency. The device comprises a uniform temperature plate mechanism which comprises a bottom plate, a cover plate and an internal cavity mechanism; a plurality of convex heat pipes; the contact fin assembly is combined to form a bottom contact surface, an upper contact surface and a plurality of connecting vertical plates connected between the upper contact surface and the bottom contact surface, and first heat exchange cavities spaced in the horizontal direction are formed between the adjacent connecting vertical plates; the perforated fin assembly is combined to form a plurality of sets of horizontal heat dissipation plates which are arranged in a stacked mode, and second heat exchange cavities which are spaced in the height direction are formed between the adjacent horizontal heat dissipation plates.

Description

Technical Field

[0001] The present invention relates to the technical field of radiator structures, and in particular to a radiator based on a three-dimensional temperature homogenizing plate. Background Art

[0002] With the development of science and technology, the level of intelligence of electronic devices is getting higher and higher, and chip technology is developing rapidly. The electronic components in electronic devices will generate heat during operation, which directly affects the performance and reliability of electronic products.

[0003] At present, the heat dissipation technologies of electronic components mainly include air cooling technology and liquid cooling technology. Air cooling technology includes natural convection air cooling technology and forced convection air cooling technology. Natural convection air cooling technology is mainly used for electronic devices with low heat generation per unit volume, while forced convection air cooling technology is generally used in combination with heat pipes and temperature dispersion board technology.

[0004] The various types of three-dimensional heat spreader structures available in the prior art only include a heat spreader mechanism and a number of upwardly protruding heat pipes, which ignore the heat transfer efficiency of the heat spreader surface itself, thereby hindering the heat spreader's three-dimensional heat transfer efficiency. Summary of the invention

[0005] In response to the above problems, the present invention provides a radiator based on a three-dimensional temperature homogenizing plate, which enables sufficient heat exchange between the upper cover plate of the temperature homogenizing plate and the outside world, while improving the efficiency of heat exchange between the heat pipe and the outside world, thereby improving the overall heat transfer efficiency.

[0006] A heat sink based on a three-dimensional temperature homogenizing plate, characterized in that it comprises:

[0007] A temperature-averaging plate mechanism, comprising a bottom plate, a cover plate, and an internal cavity mechanism;

[0008] A plurality of protruding heat pipes;

[0009] A contact fin assembly, which is combined to form a bottom contact surface, an upper contact surface, and a plurality of connecting vertical plates connecting the upper contact surface and the bottom contact surface, and a first heat exchange cavity spaced in a horizontal direction is formed between adjacent connecting vertical plates;

[0010] and a perforated fin assembly, the combination of which forms a plurality of stacked horizontal heat sinks, with second heat exchange cavities spaced in height direction formed between adjacent horizontal heat sinks;

[0011] The upper surface of the cover plate is provided with a plurality of upwardly convex heat pipes, the bottom contact surface of the contact fin assembly is arranged in close contact with the upper surface of the cover plate, the contact fin assembly is provided with an avoidance gap corresponding to the space of each heat pipe, the contact fin assembly does not contact the outer surface of the heat pipe, the perforated fin assembly is arranged in the upper area of ​​the contact fin assembly, each group of horizontal heat sinks of the perforated fin assembly is provided with contoured sleeve holes corresponding to the positions of the heat pipes, the outer surface of the heat pipe is in close contact with the inner wall of the contoured sleeve hole of each horizontal heat sink, the height of the horizontal heat sink on the top layer is not lower than the top height of the heat pipe, and there is a fitting area between the inner wall of the contoured sleeve hole of the horizontal heat sink on the top layer and the heat pipe.

[0012] It is further characterized by:

[0013] It also includes a support plate, on which a plurality of positioning holes are arranged, and the positioning holes are arranged in the shape of a plurality of protruding heat pipes and arranged at positions, the lower surface of the support plate fits the upper contact surface of the contact fin assembly, and the corresponding heat pipes are respectively inserted through the corresponding positioning holes and then convexly arranged, and the vertical edges on both sides of the bottom of the perforated fin assembly are supported on both sides of the upper surface of the support plate, and the support plate ensures reliable positioning and arrangement of both the contact fin assembly and the perforated fin assembly;

[0014] The positioning holes on the support plate are welded to the outer periphery of the corresponding heat pipe, thereby ensuring that the position of the heat pipe is stable and reliable, so that the heat pipe will not be caused to expand and displace when the temperature plate mechanism is working;

[0015] The contact fin assembly is formed by horizontally welding a plurality of vertical heat dissipation fins, each of which includes a connecting vertical plate, an upper contact edge, and a lower contact edge. The top of the connecting vertical plate is provided with a bent upper contact edge, and the bottom of the connecting vertical plate is provided with a bent lower contact edge. The upper contact edge and the lower contact edge are bent in the same direction to form a horizontal short edge.

[0016] After the adjacent vertical heat dissipation fins are arranged vertically, the outer ends of the upper contact edge and the lower contact edge are respectively welded to the corresponding end faces of the connecting vertical plates of the vertical heat dissipation fins at adjacent positions until they are combined to form an integral contact fin assembly covering the upper surface area of ​​the cover plate;

[0017] During layout, the vertical heat sink fins located at the avoidance gap are cut in advance, so that the avoidance gap can be reliably formed after subsequent assembly;

[0018] The bottom contact surface of the contact fin assembly is composed of several groups of lower contact edges, and the upper contact surface is composed of several groups of upper contact edges. The assembled bottom contact surface and the upper contact surface have no protruding foreign matter, ensuring reliable and stable subsequent assembly.

[0019] The perforated fin assembly is formed by stacking and welding a plurality of horizontal heat dissipation fins, each of which comprises a horizontal heat dissipation plate and two side vertical edges, and the two sides of the horizontal heat dissipation plate in the length direction are respectively provided with downwardly bent side vertical edges;

[0020] After each horizontal heat sink fin is arranged horizontally, the vertical edges on both sides of the upper horizontal heat sink fin are welded to the upper surfaces on both sides of the length direction of the horizontal heat sink plate of the adjacent lower horizontal heat sink fin until the height of the entire perforated fin assembly reaches the set height value;

[0021] The two side vertical plates of the bottommost horizontal heat dissipation fins are welded to the two sides of the upper surface of the support plate;

[0022] The cover plate of the temperature homogenizing plate mechanism is a rectangular structure in a plan view, and the air flow channels of the first heat exchange cavity and the second heat exchange cavity are arranged perpendicular to each other.

[0023] After adopting the technology of the present invention, after the bottom plate of the temperature equalizing plate mechanism is heated, the working fluid is vaporized, part of the heat is conducted through the contact surface between the cover plate and the bottom contact surface of the contact fin assembly, and finally part of the heat is conducted to the connecting vertical plate of the contact fin assembly, and then the convection air takes away the heat from the first heat exchange cavity, thereby improving the heat dissipation efficiency; in addition, after the bottom plate of the radiator is heated, part of the working fluid is vaporized and enters the heat pipe, and the far end (top) of the heat pipe contacts the contoured sleeve holes of the horizontal heat dissipation plate to dissipate heat, and the heat is taken away from the second heat exchange cavity by convection air, and the contact fin assembly and the perforated fin assembly are arranged on the upper surface of the temperature equalizing plate mechanism, so that the upper cover plate of the temperature equalizing plate and the outside world can fully exchange heat, and at the same time, the heat exchange efficiency between the heat pipe and the outside world is improved, thereby improving the overall heat transfer efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0025] Figure 2 It is a schematic exploded perspective view of the present invention;

[0026] Figure 3 is an assembly flow chart of a specific embodiment of the present invention;

[0027] Figure 4 It is a three-dimensional diagram of the vertical heat dissipation fin of the present invention;

[0028] Figure 5 It is a three-dimensional diagram of the horizontal heat dissipation fins of the present invention;

[0029] The names corresponding to the serial numbers in the figure are as follows:

[0030] The temperature equalizing plate mechanism 10, the bottom plate 11, the cover plate 12, the heat pipe 20, the contact fin assembly 30, the bottom contact surface 31, the upper contact surface 32, the connecting vertical plate 33, the first heat exchange cavity 34, the avoidance gap 35, the perforated fin assembly 40, the horizontal heat dissipation plate 41, the contoured sleeve hole 411, the second heat exchange cavity 42, the side vertical edge 43, the support plate 50, the positioning hole 51, the vertical heat dissipation fin 60, the upper contact edge 61, the lower contact edge 62, and the horizontal heat dissipation fin 70. DETAILED DESCRIPTION

[0031] A heat sink based on a three-dimensional temperature plate, see Figure 1-Figure 5 , which includes a temperature plate mechanism 10, a plurality of protruding heat pipes 20, a contact fin assembly 30, a perforated fin assembly 40, and a support plate 50;

[0032] The temperature plate mechanism 10 includes a bottom plate 11, a cover plate 12, and an internal cavity mechanism;

[0033] The contact fin assembly 30 includes a bottom contact surface 31, an upper contact surface 32, and a plurality of connecting vertical plates 33 connecting the upper contact surface 31 and the bottom contact surface 31, and first heat exchange cavities 34 spaced apart in a horizontal direction are formed between adjacent connecting vertical plates 33;

[0034] The perforated fin assembly 40 includes a plurality of groups of horizontal heat dissipation plates 41 arranged in a stacked manner, and second heat exchange cavities 42 spaced apart in height direction are formed between adjacent horizontal heat dissipation plates 41;

[0035] A plurality of positioning holes 51 are arranged on the support plate 50, and the positioning holes 51 are arranged in the shape and arrangement position of a plurality of protruding heat pipes 20;

[0036] The upper surface of the cover plate 12 is provided with a plurality of upwardly convex heat pipes 20, the heat pipes 20 are cylindrical structures, the bottom contact surface 31 of the contact fin assembly 30 is arranged close to the upper surface of the cover plate 12, the contact fin assembly 30 is provided with an avoidance gap 35 corresponding to the space of each heat pipe 20, the contact fin assembly 30 does not contact the outer surface of the heat pipe 20, the lower surface of the support plate 50 fits the upper contact surface of the contact fin assembly 30, the corresponding heat pipes 20 are respectively passed through the corresponding positioning holes 51 and then convexly arranged, the vertical edges 43 on both sides of the bottom of the perforated fin assembly 40 are supported on both sides of the upper surface of the support plate 50, and the support plate 50 ensures the reliable positioning and arrangement of both the contact fin assembly 30 and the perforated fin assembly 40;

[0037] Each group of horizontal heat sinks 41 of the perforated fin assembly 40 is provided with a contoured sleeve hole 411 corresponding to the position of the heat pipe 20, and the outer surface of the heat pipe 20 is in close contact with the inner wall of the contoured sleeve hole 411 of each horizontal heat sink 41, and the height of the top layer of horizontal heat sinks 41 is not lower than the top height of the heat pipe 20, and there is a fitting area between the inner wall of the contoured sleeve hole 411 of the top layer of horizontal heat sinks 41 and the heat pipe 20.

[0038] In a specific embodiment, the cover plate 12 of the temperature homogenizing plate mechanism 10 is a rectangular structure in a top view, and the air flow channels of the first heat exchange cavity 34 and the second heat exchange cavity 42 are arranged perpendicular to each other.

[0039] In specific implementation, the positioning holes 51 on the support plate 50 are welded to the outer periphery of the corresponding heat pipe 20, thereby ensuring that the position of the heat pipe 20 is stable and reliable, so that the heat pipe 20 will not be expanded or displaced when the temperature plate mechanism 10 is working.

[0040] In a specific implementation, the contact fin assembly 30 is formed by horizontally welding a plurality of vertical heat dissipation fins 60, each of which includes a connecting vertical plate 33, an upper contact edge 61, and a lower contact edge 62. The top of the connecting vertical plate 33 is provided with a bent upper contact edge 61, and the bottom of the connecting vertical plate 33 is provided with a bent lower contact edge 62. The upper contact edge 61 and the lower contact edge 62 are bent in the same direction to form a horizontal short edge.

[0041] After the adjacent vertical heat dissipation fins 60 are arranged vertically, the outer ends of the upper contact edge 61 and the lower contact edge 62 are respectively welded to the corresponding end faces of the connecting vertical plates 33 of the vertical heat dissipation fins 60 at adjacent positions until they are combined to form an integral contact fin assembly 30 covering the upper surface area of ​​the cover plate 12; the bottom contact surface 31 of the contact fin assembly 30 is composed of a plurality of groups of lower contact edges 61, and the upper contact surface 32 is composed of a plurality of groups of upper contact edges 62. After the assembly, there are no protruding foreign objects on the bottom contact surface 31 and the upper contact surface 32, ensuring reliable and stable subsequent assembly;

[0042] During layout, the vertical heat dissipation fins 60 located at the avoidance gaps 35 are pre-cut, so that the avoidance gaps 35 can be reliably formed after subsequent assembly.

[0043] In specific implementation, the perforated fin assembly 40 is formed by stacking and welding a plurality of horizontal heat dissipation fin layers 70, each horizontal heat dissipation fin 70 includes a horizontal heat dissipation plate 41 and two side vertical edges 43, and the horizontal heat dissipation plate 41 is provided with downwardly bent side vertical edges 43 on both sides in the length direction; after each horizontal heat dissipation fin 70 is horizontally arranged, the two side vertical edges 43 of the upper horizontal heat dissipation fin 70 are welded to the upper surfaces of the two sides in the length direction of the horizontal heat dissipation plate 41 of the adjacent lower horizontal heat dissipation fin 70 until the height of the entire perforated fin assembly 40 reaches the set height value; the two side vertical plates 43 of the bottom layer of horizontal heat dissipation fins 70 are welded to the two sides of the upper surface of the support plate 50.

[0044] When the entire radiator is assembled, the heat pipe 20 and the temperature equalizing plate mechanism 10 are assembled in advance, the horizontal heat dissipation fins 70 are stacked and welded to form a perforated fin assembly 40, and the vertical heat dissipation fins 60 are horizontally welded and connected to form a contact fin assembly 30;

[0045] Then follow Figure 3 During assembly, the bottom of the contact fin assembly 30 is welded to the surface of the cover plate 12, the lower surface of the support plate 50 is pressed onto the upper contact surface of the contact fin assembly 30, and the support plate 50 and the heat pipe are welded and positioned, and then the perforated fin assembly 40 is sleeved on the heat pipe 20, and the two side vertical plates 43 at the bottom of the perforated fin assembly 40 are welded and connected to the two sides of the upper surface of the support plate 50.

[0046] Its working principle is as follows: after the bottom plate of the temperature equalizing plate mechanism is heated, the working fluid is vaporized, part of the heat is conducted through the contact surface between the cover plate and the bottom of the contact fin assembly, and finally part of the heat is conducted to the connecting vertical plate of the contact fin assembly and then taken away by the convection air from the first heat exchange cavity, thereby improving the heat dissipation efficiency; after the bottom plate of the radiator is heated, part of the working fluid is vaporized and enters the heat pipe, and the far end (top) of the heat pipe contacts the contoured holes of the horizontal heat dissipation plate for heat dissipation, and the heat is taken away from the second heat exchange cavity by the convection air. By arranging the contact fin assembly and the perforated fin assembly on the upper surface of the temperature equalizing plate mechanism, the upper cover plate of the temperature equalizing plate and the outside world can fully exchange heat, thereby improving the heat exchange efficiency between the heat pipe and the outside world and improving the overall heat transfer efficiency.

[0047] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0048] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A heat sink based on a three-dimensional temperature homogenizing plate, characterized in that: It includes: A temperature-averaging plate mechanism, comprising a bottom plate, a cover plate, and an internal cavity mechanism; A plurality of protruding heat pipes; A contact fin assembly, which is combined to form a bottom contact surface, an upper contact surface, and a plurality of connecting vertical plates connecting the upper contact surface and the bottom contact surface, and a first heat exchange cavity spaced in a horizontal direction is formed between adjacent connecting vertical plates; and a perforated fin assembly, the combination of which forms a plurality of stacked horizontal heat sinks, with second heat exchange cavities spaced in height direction formed between adjacent horizontal heat sinks; The upper surface of the cover plate is provided with a plurality of upwardly convex heat pipes, the bottom contact surface of the contact fin assembly is arranged in close contact with the upper surface of the cover plate, the contact fin assembly is provided with an avoidance gap corresponding to the space of each heat pipe, the contact fin assembly does not contact the outer surface of the heat pipe, the perforated fin assembly is arranged in the upper area of ​​the contact fin assembly, each group of horizontal heat sinks of the perforated fin assembly is provided with contoured sleeve holes corresponding to the positions of the heat pipes, the outer surface of the heat pipe is in close contact with the inner wall of the contoured sleeve hole of each horizontal heat sink, the height of the horizontal heat sink on the top layer is not lower than the top height of the heat pipe, and there is a fitting area between the inner wall of the contoured sleeve hole of the horizontal heat sink on the top layer and the heat pipe.

2. The heat sink based on a three-dimensional temperature homogenizing plate according to claim 1, characterized in that: It also includes a support plate, on which a plurality of positioning holes are arranged, and the positioning holes are arranged in the shape of a plurality of protruding heat pipes and in the arrangement position, and the lower surface of the support plate fits the upper contact surface of the contact fin assembly, and the corresponding heat pipes are respectively passed through the corresponding positioning holes and are arranged to convex upward, and the vertical edges on both sides of the bottom of the perforated fin assembly are supported on both sides of the upper surface of the support plate.

3. The heat sink based on a three-dimensional temperature homogenizing plate according to claim 2, characterized in that: The positioning holes on the support plate are welded to the outer periphery of the corresponding heat pipe.

4. The heat sink based on a three-dimensional temperature homogenizing plate according to claim 1, characterized in that: The contact fin assembly is formed by horizontally welding a plurality of vertical heat dissipation fins, each of which includes a connecting vertical plate, an upper contact edge, and a lower contact edge. The top of the connecting vertical plate is provided with a bent upper contact edge, and the bottom of the connecting vertical plate is provided with a bent lower contact edge. The upper contact edge and the lower contact edge are bent in the same direction to form a horizontal short edge.

5. The heat sink based on a three-dimensional temperature homogenizing plate according to claim 4, characterized in that: After the adjacent vertical heat dissipation fins are arranged vertically, the outer ends of the upper contact edge and the lower contact edge are respectively welded to the corresponding end faces of the connecting vertical plates of the vertical heat dissipation fins at adjacent positions until they are combined to form an integral contact fin assembly covering the upper surface area of ​​the cover plate.

6. The heat sink based on a three-dimensional temperature homogenizing plate according to claim 5, characterized in that: During layout, the vertical heat sink fins located in the avoidance position are cut in advance.

7. The heat sink based on a three-dimensional temperature homogenizing plate according to claim 6, characterized in that: The bottom contact surface of the contact fin assembly is composed of several groups of lower contact edges, and the upper contact surface is composed of several groups of upper contact edges. The assembled bottom contact surface and the upper contact surface have no protruding foreign matter.

8. The heat sink based on a three-dimensional temperature homogenizing plate according to claim 1, characterized in that: The perforated fin assembly is formed by stacking and welding a plurality of horizontal heat dissipation fins, each of which comprises a horizontal heat dissipation plate and two side vertical edges, and the two sides of the horizontal heat dissipation plate in the length direction are respectively provided with downwardly bent side vertical edges.

9. The heat sink based on a three-dimensional temperature homogenizing plate according to claim 8, characterized in that: After each horizontal heat sink fin is arranged horizontally, the vertical edges on both sides of the upper horizontal heat sink fin are welded to the upper surfaces on both sides of the length direction of the horizontal heat sink plate of the adjacent lower horizontal heat sink fin until the height of the entire perforated fin assembly reaches the set height value.

10. The heat sink based on a three-dimensional temperature homogenizing plate according to claim 1, characterized in that: The cover plate of the temperature homogenizing plate mechanism is a rectangular structure in a plan view, and the air flow channels of the first heat exchange cavity and the second heat exchange cavity are arranged perpendicular to each other.

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