Modular detector architecture

Abstract

A modular digital radiographic detector is configured with a housing for receiving and securing a detector member. The one or more removable and interchangeable modular detector components may be replaced by the same component or replacement version of the removed modular detector components. A compartment opening is formed in the housing and includes an electrical connector for integrally incorporating one or more replacement detector components into a communication system of the detector.

Description

Technical Field

[0001] The subject matter disclosed herein relates to digital radiography (DR) detectors, and in particular to modular digital detectors composed of several interchangeable detector segments or components. Background Art

[0002] X-ray detectors are typically manufactured as monolithic devices with components incorporated as part of a fixed architecture. During manufacturing and throughout the life of the product, the architecture typically remains static, perhaps with the exception of batteries or other simple mechanical parts that may be replaced or potentially updated (such as battery latches, buffers, handles). Thus, detectors may be monolithic with components that may come from several suppliers to address a variety of intrinsic and extrinsic aspects. Examples of intrinsic aspects include: (1) physical imaging: x-ray imagers may include, but are not limited to, a-Si, a-Se, IGZO, LTPS, or CMOS panels with any type of scintillator that converts x-ray signals into electrical signals; and (2) functionality, such as A / D conversion units, detector control / monitoring electronics, power management systems, image storage units, image readout electronics, and communication interfaces (wired and wireless).

[0003] Examples of external aspects include: (1) packaging and ergonomics: coating and IP rating, weight, ruggedness and handles; (2) maintainability: battery and diagnostics (self-test and shock sensors); and (3) post-processing of the detector for improvements and enhancements in image quality processing and other aspects.

[0004] The above discussion provides general background information only and is not intended to be used as an aid in determining the scope of the claimed subject matter. Summary of the invention

[0005] A modular digital radiography detector is configured with a housing for receiving and securing detector components. One or more removable and interchangeable modular detector components are replaceable by the same component, a replacement version, or an upgraded version of the removed modular detector component. A compartment opening is formed in the housing and includes an electrical connector for integrally coupling the one or more replacement detector components into a communication and processing system of the detector. Advantages that may be realized in the practice of some disclosed embodiments of the modular detector are that upgrades are easier and less expensive without having to purchase an entirely new detector.

[0006] While typical detector manufacturing may be geared toward optimizing detector construction based on a fixed architecture, the modular construction described in this article has the benefit of quality control and reduces the number of product variants to support in the field. Fixed architectures have several drawbacks, including: component and technology obsolescence, the inability to upgrade / update the product in terms of functionality to support newer requirements, long development times from design to final product delivery, and high maintenance costs, as the entire detector must be replaced when a single component fails. In fact, identifying components at an early stage can result in a product with components that may have been replaced by newer versions with better performance or more desirable characteristics.

[0007] This modular approach allows interchangeable components to be integrated into a common frame or housing in a manner similar to how a PC is assembled. This flexibility facilitates an approach to x-ray detectors as systems with open architecture design that are assembled and tested, rather than as whole devices. Current detectors still require a lot of effort to design, test, verify, obtain regulatory approvals, and manufacture, even though they include various components that may come from different sources / manufacturers. Such efforts are costly and affect time to market, even when updating small components such as communication modules or increasing memory capacity by updating memory modules.

[0008] On the other hand, when the components have well-defined interfaces, these can be developed and tested independently. The detector can then be configured depending on the needs, market demands, and can incorporate the latest technologies. When the detector is a medical device, various configurations can be validated by the manufacturer at the time the components are combined as a whole. The configuration can obtain regulatory approval for a class / group of interchangeable components. This flexibility provides for rapid response to customer needs and technological innovations. In addition, field upgrades can be performed on validated configurations simply by shipping the components and running automated tests remotely or at the customer site.

[0009] Building DR detectors using a modular approach provides for rapid evolution of the technology, where components become readily available (commoditized), leading to lower manufacturing costs and customer prices. Modular design can result in detectors retaining value over a longer period of time, as components can be upgraded with the latest technology to extend their lifespan. Refurbishment of detectors can become a substantial business opportunity, and with the dramatic reduction in component costs, this can translate into building disposable / recyclable detectors.

[0010] Manufacturers may offer a set of validated configurations that are tailored to meet a specific task, whether it be a clinical task or NDT (non-destructive testing). Thus, a consumer may be able to select from a set of configurations online and receive a detector that is suitable for the desired task or to help the manufacturer validate a use case. Conversion kits may be used to convert detectors across a variety of configurations to support a variety of use cases.

[0011] A modular architecture for a DR detector may include a frame or housing with (one or more) communication backbones to which various components may be connected; and a minimum set of components such as imagers (to convert x-rays into electronic signals), readout ICs, analog-to-digital conversion, detector control and monitoring electronics, power management systems, image storage units, and communication interfaces (wired and wireless). One embodiment of the present invention modifies how x-ray detectors may be designed, tested, certified, assembled, licensed (regulated), and manufactured. A new modular architecture is disclosed whereby a detector is constructed by integrally bonding various components to a common physical frame / housing with a processing system communication backbone.

[0012] In one embodiment, a digital radiography detector includes a housing for receiving a detector component, and two or more removable modular detector components, each modular detector component being interchangeable with an identical replacement component or another version of the modular detector component.

[0013] In one embodiment, a method of replacing a modular component of a digital radiography detector includes removing the modular component from an opening in a rear side of a DR detector by manually disconnecting an electrical connector built into the modular component from an electrical connector built into an opening of the detector. The removed modular component is replaced with a replacement or upgraded modular component by inserting the new modular component into the opening such that the electrical connector of the new modular component electrically engages the electrical connector built into the opening.

[0014] In one embodiment, a digital radiography (DR) detector includes a housing and a processing system within the housing that controls the operation of the DR detector. A plurality of modular components within the housing are in digital communication with the processing system for at least receiving control signals from the processing system and for at least transmitting data to the processing system. The housing includes a plurality of openings, each opening corresponding to at least one of the modular components, wherein each of the openings includes an electrical connector configured to engage an electrical connector on each of the plurality of modular components.

[0015] The above general description is not intended to describe individual single embodiments whose elements are not interchangeable. In fact, many of the elements described in connection with a particular embodiment can be used together with the elements of other described embodiments, and may be interchangeable with the elements of other described embodiments. Many changes and modifications can be made within the scope of the present invention without departing from the spirit of the present invention, and the present invention includes all such modifications.

[0016] The brief description of the present invention is intended only to provide a brief overview of the subject matter disclosed herein according to one or more exemplary embodiments, and is not intended to serve as a guide to interpreting the claims or to define or limit the scope of the present invention, which is limited only by the appended claims. This brief description is provided to introduce an exemplary selection of concepts in a simplified form, which will be further described in the detailed description below. This brief description is not intended to identify the key features or essential features of the subject matter claimed, nor is it intended to be used to assist in determining the scope of the subject matter claimed. The subject matter claimed is not limited to implementations that address any or all of the shortcomings noted in the background technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention may be described in detail with reference to certain embodiments, some of which are shown in the accompanying drawings so that the features of the invention in an understandable manner. However, it should be noted that the accompanying drawings only show certain embodiments of the present invention and should not be considered to limit its scope, as the scope of the present invention encompasses other equally effective embodiments. The following drawings are not intended to be drawn to any exact scale with respect to relative size, angular relationship, relative position or time relationship, nor are they drawn to any combination of representations with respect to interchangeability, alternatives or desired implementations, but rather are generally intended to focus on illustrating the features of certain embodiments of the present invention. In the accompanying drawings, the same numbers are used to represent the same parts in each view. Therefore, in order to further understand the present invention, reference may be made to the following detailed description, read in conjunction with the accompanying drawings, in which: Figure 1 is a schematic perspective view of an exemplary digital x-ray imaging system; Figure 2 is a schematic diagram of a two-dimensional imaging pixel array in a radiographic detector; Figure 3 is a perspective view of an exemplary DR detector; Figure 4 is a cross-sectional view of an exemplary DR detector; Figure 5 is a frame housing showing various slot locations (A, B, C, D) where components may be connected in a manner similar to how batteries are clamped in currently manufactured detectors; and Figure 6 is a schematic diagram of a detector processing system in digitally and electrically communicating with a removable detector member. DETAILED DESCRIPTION

[0018] This application claims priority to U.S. patent application serial number 63 / 357,026, filed on June 30, 2022 in the name of Bogoni et al. and entitled “MODULARDETECTOR ARCHITECTURE,” which is incorporated herein by reference in its entirety.

[0019] Figure 1 is a perspective view of a digital radiography (DR) imaging system 10 according to one embodiment, which may include a DR detector 40 (housing not shown for clarity of description), an x-ray source 14 configured to generate radiographic energy (x-ray radiation), and a control station including a digital monitor or electronic display 26 configured to display an image 24 captured by the DR detector 40, and a processing system 34 for controlling the operation of the (DR) imaging system 10. The DR detector 40 may include a two-dimensional array 12 of detector cells 22 (imaging pixels or photosensors) arranged in electronically addressable rows and columns. For example, the dimensions of the detector may include 17×17 cm, 35×35 cm, or 35×43 cm. The DR detector 40 may be positioned to receive x-rays 16 emitted by the x-ray source 14 that pass through an object 20. As shown in FIG. Figure 1 As shown in , the radiographic imaging system 10 may use an x-ray source 14 that emits collimated x-rays 16 (e.g., an x-ray beam) that selectively targets a region of interest 18 and passes through a preselected object 20 so that the emitted x-rays 16 fall on an imaging region (i.e., imaging pixels 22) of a DR detector 40. The x-ray beam 16 may be attenuated to varying degrees along its multiple rays according to the structure of the object 20 (e.g., different thicknesses), and the attenuated x-rays may be detected by an array 12 of imaging pixels 22. The DR detector 40 may be positioned as perpendicular as possible to a central ray 17 of the multiple rays 16 emitted by the x-ray source 14. The array 12 of individual imaging pixels 22 may be electronically addressed (scanned) by their positions according to columns and rows. As used herein, the terms "columns" and "rows" refer to the vertical and horizontal arrangements of the photosensor units 22, and for clarity of description, it will be assumed that the rows extend horizontally and the columns extend vertically. However, the orientation of the columns and rows is arbitrary and does not limit the scope of any embodiment disclosed herein. Each individual imaging pixel 12 may be scanned by the interchangeable modular readout components 28, 30 described herein to determine the stored voltage level generated therein by the incident x-ray energy level. The stored voltage level in each imaging pixel 12 may be read out by the modular readout components 28, 30 and stored electronically as a digitized value. As is well known, an A / D converter component may be used to convert the stored voltage level in each pixel 12 to a digital value. It will be appreciated that a higher value indicates a greater amount of x-ray energy absorbed by the individual imaging pixel 12 during an imaging procedure of the object 20.

[0020] In an exemplary embodiment, the rows of photosensitive cells 22 can be scanned one or more rows at a time by modular electronic scanning components 28 so that exposure data from the array 12 can be transmitted to modular electronic readout components 30. Each photosensitive cell 22 can independently store an electrical charge proportional to the intensity or energy level of the attenuated radiographic radiation or x-rays received and absorbed in the cell. Thus, each photosensitive cell 22, when read out, provides information defining a pixel of the radiographic image 24, such as the brightness level or the amount of energy absorbed by the pixel, which information can be digitally decoded and transmitted by the image processing electronics 34 to be displayed by the digital monitor 26 for viewing by a user. The modular electronic bias components 32 are electrically connected to the two-dimensional detector array 12 to provide a bias voltage to each of the photosensitive cells 22.

[0021] Each of the modular biasing member 32, the modular scanning member 28, and the modular readout member 30 may communicate with the acquisition control and image processing unit 34 via a connecting cable 33 (wired), or the DR detector 40 and the acquisition control and image processing unit 34 may be equipped with a wireless transmitter and receiver to wirelessly 35 transmit radiographic image data to the acquisition control and image processing unit 34. The acquisition control and image processing unit 34 may include a processor and electronic memory (not shown) to control the operation of the DR detector 40 as described herein, including, for example, controlling the interchangeable modular members 28, 30, and 32 by using programming instructions, and storing and processing image data. The acquisition control and image processing unit 34 may also be used to control the activation of the x-ray source 14 during radiographic exposure, control the x-ray tube current amplitude, and thus control the integrated flux of x-rays in the x-ray beam 16, and / or the x-ray tube voltage, and thus control the energy level of x-rays in the x-ray beam 16.

[0022] Some or all of the functions of the acquisition control and image processing unit 34 described herein may be located in the detector 40 in an onboard processing system 36, which may include a processor and electronic memory to control the operation of the DR detector 40 as described herein, including controlling the modular components 28, 30 and 32 through the use of programming instructions, and storing and processing image data, similar to the functions of the independent acquisition control and image processing system 34. The image processing system 36 can perform image acquisition and image processing functions as described herein. The image processing system 36 can control image transmission and image processing and image correction onboard the detector 40, and transmit corrected digital image data therefrom. Alternatively, the acquisition control and image processing unit 34 can receive raw image data from the detector 40 and process the image data and store it, or it can store the raw unprocessed image data in a local memory or in a remotely accessible memory.

[0023] For direct detection embodiments of the DR detector 40, the photosensitive units 22 may each include a sensing element that is sensitive to x-rays, i.e., it absorbs x-rays and generates an amount of charge carriers that is proportional to the amount of energy of the absorbed x-rays. The switching element in each unit 22 may be configured to be selectively activated to read out the charge level of the corresponding x-ray sensing element. For indirect detection embodiments of the DR detector 40, the photosensitive units 22 may each include a sensing element that is sensitive to light in the visible spectrum (i.e., it absorbs light and generates an amount of charge carriers that is proportional to the amount of light energy absorbed), and a switching element that is selectively activated to read the charge level of the corresponding sensing element. A scintillator or wavelength converter may be disposed above the photosensitive sensing element to convert the radiographic energy of the incident x-rays into visible light energy. Therefore, in the embodiments disclosed herein, it should be noted that the DR detector 40, or Figure 3 DR detector 300 or Figure 4 The DR detector 400 in may include an indirect or direct type of DR detector.

[0024] Examples of sensing elements used in the sensing array 12 include various types of photoelectric conversion devices (e.g., photosensors) such as photodiodes (PN or PIN diodes), photocapacitors (MIS), phototransistors, or photoconductors. Examples of switching elements used for signal readout include a-Si TFTs, oxide TFTs, MOS transistors, bipolar transistors, and other pn structures.

[0025] Figure 2 Schematic diagram 240 of a portion of a two-dimensional array 12 of DR detectors 40. The array 212 of photosensor cells, which may operate in accordance with the photosensor array 12 described above, may include a number of hydrogenated amorphous silicon (a-Si:H) nip photodiodes 270 and thin film transistors (TFTs) 271 formed as field effect transistors (FETs) each having a gate (G), source (S), and drain (D) terminals. The DR detector 40 disclosed herein (such as a multilayer DR detector ( Figure 4In an embodiment of 400)), the two-dimensional array of photosensor units 12 may be formed in a device layer adjacent to an adjacent layer of a DR detector structure, wherein the adjacent layer may include a rigid glass layer or a flexible polyimide layer or a layer with carbon fiber without any adjacent rigid layer. Multiple gate driver circuits 228 may be formed as interchangeable modular components and electrically connected to multiple gate lines 283, which control the voltage applied to the gate of the TFT271. Multiple readout circuits 230 may be formed as interchangeable modular components and electrically connected to data lines 284. Multiple bias lines 285 may be electrically connected to a bias line bus or a variable bias reference voltage line 232 that controls the voltage applied to the photodiode 270. A charge amplifier 286 may be electrically connected to the data line 284 to receive a signal therefrom. The outputs from the charge amplifiers 286 may be electrically connected to a multiplexer 287 (such as an analog multiplexer) and then to an analog-to-digital converter (ADC) 288, or they may be connected directly to the ADC to stream out digital radiographic image data at a desired rate. Figure 2 The schematic diagram of may represent a portion of a DR detector 40, such as an a-Si:H based indirect flat panel, curved panel, or flexible panel imager.

[0026] Incident x-rays or x-ray photons 16 are converted by the scintillator into visible photons or light, which are subsequently converted into electron-hole pairs or charges when striking an a-Si:H nip photodiode 270. An exemplary detector cell 222 or pixel may include a photodiode 270 having its anode electrically connected to a bias line 285 and its cathode electrically connected to the drain (D) of a TFT 271. The integrated signal output is transmitted from an external charge amplifier 286 to an analog-to-digital converter (ADC) 288 using a parallel-to-serial converter such as a multiplexer 287, which together constitute a modular readout component 230.

[0027] The digital image information may then be processed by processing system 36 to produce a digital image which may then be digitally stored and immediately displayed on monitor 26, or which may be displayed at a later time by accessing a digital electronic memory containing the stored image. Figure 2 The flat panel DR detector 40 of the described imaging array may be capable of both single shot (eg, static radiography) and continuous (eg, fluoroscopy) image acquisition.

[0028] Figure 3A perspective view of a top (front) side 321 of an exemplary portable wireless DR detector 300 according to an embodiment of a DR detector 40 disclosed herein is shown. The DR detector 300 may include a flexible substrate to allow the DR detector to capture radiographic images in a bent orientation. The DR detector 300 may include a housing portion 314 that surrounds a modular component structure including a photosensor array portion 12 of the DR detector 300. The housing portion 314 of the DR detector 300 may include a continuous, rigid or flexible x-ray opaque material or (as used synonymously herein) radiopaque material surrounding the interior volume of the DR detector 300. The housing portion 314 may include four flexible edges 318 that extend between a top (front) side 321 and a bottom side 322 and are arranged substantially orthogonally relative to the top side 321 and the bottom side 322. The bottom side 322 may include openings (A, B, C, Figure 5 ), for replacing interchangeable components of the detector 40 as described herein. The top side 321 includes a top cover 312 attached to the housing portion 314, and the top cover 312 and the housing portion 314 together substantially enclose the modular structure within the interior volume of the DR detector 300. The top cover 312 can be attached to the housing 314 to form a seal therebetween, and is made of a material that can transmit x-rays 16 without significantly attenuating them, that is, an x-ray transparent material or a radiolucent material as used synonymously herein, such as a carbon fiber plastic, a polymer, or other plastic-based material.

[0029] See also Figure 4 , in which a DR detector 300 is shown in schematic form ( Figure 3 ) is an exemplary cross-sectional view of an exemplary embodiment of the DR detector 400 along section AA. For spatial reference purposes, as used herein, one major surface of the DR detector 400 may be referred to as the top (front) side 451, and the second major surface may be referred to as the bottom (rear) side 452. The multi-layer structure may be disposed within an interior volume 450 enclosed by the housing 314 and the top cover 312, and may include a scintillator layer 404 located above the two-dimensional imaging sensor array 12 (schematically shown as device layer 402). The scintillator layer 404 may be directly beneath the substantially planar top cover 312, and the imaging array 402 may be directly beneath the scintillator 404. Alternatively, a flexible layer 406 may be positioned between the scintillator layer 404 and the top cover 312 to provide shock absorption. The flexible layer 406 may be selected to provide a certain amount of flexible support for both the top cover 312 and the scintillator 404, and may include a foam rubber type material. As described with reference to Figure 3 As mentioned, the layers just described comprising the multi-layer structure may be formed generally in a rectangular shape and defined by edges arranged orthogonally and disposed parallel to the inside of the edge 318 of the housing 314 .

[0030] In one embodiment, a substrate layer 420 may be disposed below the imaging array 402, such as a rigid glass layer, or a flexible substrate including polyimide or carbon fiber, the array of photosensors 402 may be formed on the flexible substrate to allow for an adjustable curvature of the array, and the substrate layer 420 may include another layer of a multilayer structure. Below the substrate layer 420, a radiopaque shielding layer 418 may be used as an x-ray blocking layer to help prevent scattering of x-rays passing through the substrate layer 420 and to block x-rays reflected from other surfaces in the internal volume 450. The modular scanning component 28, the modular readout component 30, the modular biasing component 32, and the processing system 36 (all in Figure 1 The modular readout electronics (IC) 424, 425 may be formed adjacent to the imaging array 402, or as shown, may be formed as modular components of integrated circuits 424, 425 arranged below the frame support member 416. The imaging array 402 may be electrically connected to the readout electronics (IC) 424, 425 via a flexible connector 428, which may include a plurality of flexible sealed conductors (referred to as chip-on-film (COF) connectors). The modular electronics 424 may be interchangeably removed / replaced via an opening A (shown in phantom) in the housing 314, and the modular electronics 425 may be interchangeably removed / replaced via an opening B (also shown in phantom) in the housing 314. In one embodiment, as explained in more detail herein, the imaging layer(s) forming the imager may be interchangeably removed and replaced via an opening D that passes through a slit in a side wall of the housing 314. The modular imaging layer(s) may include the photosensor array 402, or the photosensor array 402 together with the scintillator layer 404.

[0031] The x-ray flux may pass through the radiolucent top panel cover 312 in a direction represented by the exemplary x-ray beam 16 and impinge upon the scintillator 404 where excitation by the high energy x-rays 16 or photons causes the scintillator 404 to emit lower energy photons as visible light rays which are then received by the photosensors of the imaging array 402. The frame support member 416 may connect the multi-layer structure to the housing 314 and may further act as a shock absorber by providing an elastomeric pad (not shown) between the frame support beams 422 and the housing 314. In one embodiment, an external bumper 412 may be attached along the edge 318 of the DR detector 400 to provide additional shock absorption.

[0032] Figure 5The bottom (rear) side 515 of the detector is shown, which has openings A, B, C, each of which is used to receive exemplary interchangeable modular detector components A', B', C', respectively. Each of the openings A, B, C includes a system electrical connector 502, 504, 506, respectively, each of which is used to electrically engage with a component electrical connector 508, 510 and 512 on a corresponding interchangeable modular detector component A', B', C', respectively. Each of the system electrical connectors 502, 504, 506 includes a plurality of conductive transmission lines, each of which corresponds to and electrically engages one of the plurality of conductive transmission lines in the component electrical connectors 508, 510 and 512. Thus, the corresponding modular components A', B', C' are electrically connected and digitally connected to the processing system ( Figure 1 and Figure 6 36). At least one of the conductive transmission lines may include a power transmission line for providing power from a detector power source (e.g., an onboard battery) to the interchangeable modular components A', B', C'. The components A', B', C' may be configured so that when they are inserted into corresponding openings A, B, C, the rear surfaces 515a, 515b, and 515c of each of the components A', B', and C' are coplanar with the rear surface 515 of the DR detector 40, respectively. As shown, the modular interchangeable components A', B', C' may each include one of various components, such as detector control electronics, a Wi-Fi communication module, a battery, a processor-battery combination, advanced onboard processing (DSP, FPGA) with associated storage, a second type of communication component, an imager that converts x-rays into electronic signals, a readout IC, an analog-to-digital conversion module, a detector control and monitoring electronics, a power management system, an image storage unit, and / or a communication interface, each of which may be interchangeably replaced. In one embodiment, a photoelectric sensor imaging array or an imaging array plus a scintillator combination ( Figure 4 ) may be large enough to occupy almost the entire area of ​​the top (front) side of the detector. Such a physical imager can be inserted into the housing via a notch D near the top (front) surface of the DR detector 40. The physical imager can include an electrical connector to electrically engage a mating system electrical connector positioned in the notch D. As described herein, the physical imager can include an array layer of imaging pixels 402 and can be combined with a scintillator layer 404 attached thereto, and optionally, can also include selected electronic devices such as formed on a PCB. The detector 40 can also include a user interface such as buttons, indicator LEDs, and a GUI screen.

[0033] The overall integration approach described herein may be based on, but not limited to, the above-mentioned key components. Any further subdivision or combination may be adapted as needed. Standardized designs may be included for the base frame / housing, and for functional modules related to size and communication interface electrical connectors. Before enabling the function, the DR detector processing system may be used to safely verify the individual components through a verification step. The overall integration may be used for different modular components AD to communicate with each other through bus 620 ( Figure 6 ) of data communication. The data communication can be readily available, such as USB-C 3.0. The overall structure maintains the competitive performance of the structural design, which includes but is not limited to weight, IP rating and ruggedness.

[0034] Figure 6 is in some ways Figure 5 Schematic diagram of a similar plurality of modular components E, F, G, H having their component electrical connectors electrically engaged with the system electrical connector at connector locations 601-604, respectively. As described herein, the processing system 36 of the DR detector 40 may include an electronic system memory for storing digital data (such as system instructions and radiographic images captured by the DR detector 40). The processing system 36 may be electrically connected to each of the modules EH via a system bus 620 for transmitting and receiving data. As described herein, each interchangeable module EH may be removed from the DR detector 40 and replaced with the same or upgraded version of the removed module. The replacement module may be detected by the processing system 36, which may be programmed to access identification data from the new module and thereby install the new module for activation of the DR detector 40 and use with the DR detector 40.

[0035] As will be appreciated by those skilled in the art, aspects of the present invention may be embodied as a system, method, or computer program product. Thus, aspects of the present invention may take the form of a complete hardware embodiment, a software embodiment (including firmware, resident software, microcode, etc.), or an embodiment combining software and hardware aspects, all of which may be generally referred to herein as a "service," "circuit," "circuitry," "module," and / or "system." Furthermore, aspects of the present invention may take the form of a computer program product embodied in one or more computer-readable media having computer-readable program code embodied thereon.

[0036] Any combination of one or more computer-readable media may be utilized. A computer-readable medium may be a computer-readable signal medium or a computer-readable storage medium. A computer-readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or apparatus, or any suitable combination of the foregoing. More specific examples (non-exhaustive list) of computer-readable storage media would include the following: an electrical connection with one or more lines, a portable computer floppy disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the context of this article, a computer-readable storage medium may be a tangible medium that may contain or store a program used by or associated with an instruction execution system, device, or apparatus.

[0037] Program code and / or executable instructions embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.

[0038] The computer program code for performing the operations of various aspects of the present invention can be written in any combination of one or more programming languages. The program code can be executed completely on the user's computer (device), partially on the user's computer, as an independent software package, partially on the user's computer and partially on a remote computer, or completely on a remote computer or server. In the latter scheme, the remote computer can be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computer (e.g., using an Internet service provider to connect through the Internet).

[0039] Various aspects of the present invention are described herein with reference to the block diagrams of the systems and computer programs according to embodiments of the present invention. It should be understood that each frame in the block diagram and the combination of frames can be implemented by computer program instructions. These computer program instructions can be provided to the processor of a general-purpose computer, a special-purpose computer or other programmable data processing system to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device create means for implementing the functions / actions specified in the block diagram.

[0040] These computer program instructions may also be stored in a computer-readable medium, which may instruct a computer, other programmable data processing device or other apparatus to operate in a particular manner so that the instructions stored in the computer-readable medium produce an article of manufacture including instructions for implementing the functions / actions specified in the block diagram.

[0041] The computer program instructions may also be loaded onto a computer, other programmable data processing device or other apparatus so that a series of operational steps are performed on the computer, other programmable device or other apparatus to produce a computer-implemented process, so that the instructions executed on the computer or other programmable device provide a process for implementing the functions / actions specified in the block diagram.

[0042] This written description uses examples to disclose the invention, including the best mode, and also to enable those skilled in the art to practice the invention, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the invention is defined by the claims, and may include other examples that occur to those skilled in the art. Such other embodiments are intended to be within the scope of the claims if they have structural elements that are not different from the written language of the claims, or if they include equivalent structural elements that are not substantially different from the written language of the claims.

Claims

1. A digital radiography detector comprising: a housing having a plurality of openings, each opening being adapted to receive an interchangeable detector internal component; Two or more interchangeable detector components, each of the two or more interchangeable detector components being configured to be interchangeable with an identical replacement component or an interchangeable detector component having different capabilities.

2. The detector of claim 1 , wherein the two or more interchangeable detector components are selected from the group consisting of: an imager that converts x-rays into electronic signals, an image readout IC electrically connected to the imager, an analog-to-digital converter, control module electronics disposed on a PCB, a power management system, an electronic image storage unit, a main processor unit, and a wired or wireless communication module.

3. The detector of claim 2, wherein the imager comprises a two-dimensional array of photosensitive pixels and a scintillator.

4. The detector of claim 2, wherein the imager comprises a two-dimensional array of x-ray sensitive pixels.

5. The detector of claim 1, wherein the plurality of openings each include a system electrical connector and the interchangeable detector components each include a component electrical connector, wherein each of the system electrical connectors is configured to electrically engage a corresponding component electrical connector.

6. The detector of claim 5, wherein each of the system electrical connectors is electrically connected to a detector processing system for transmitting signals to and from the detector processing system through the system electrical connector.

7. A method of replacing a component of a digital radiography (DR) detector, the method comprising: removing a modular component of the DR detector from an opening in a rear side of the DR detector, including manually disconnecting a component electrical connector built into the modular component from a system electrical connector built into the opening; replacing the removed modular component with a replacement modular component, including inserting the replacement modular component into the opening such that a component electrical connector of the replacement modular component electrically engages the system electrical connector built into the opening; as well as The replacement modular components are selected from the following: an imager that converts x-rays into electronic signals, an image readout integrated circuit, an analog-to-digital converter, control module electronic devices disposed on a PCB, an image readout IC electrically connected to the imager, an analog-to-digital converter, control module electronic devices disposed on a PCB, a power management system, an electronic image storage unit, a main processor unit, a power management system, a memory module, an electronic image storage unit and a WiFi wireless transceiver, wherein the system electrical connector is configured to communicate electrically with a processing system of the DR detector.

8. The method of claim 7, further comprising transmitting identification data from the replacement modular component to the processing system.

9. The method of claim 8, further comprising transmitting digital instructions from the processing system to the replacement modular component.

10. A digital radiography (DR) detector comprising: case; a processing system within the housing for controlling operation of the DR detector; as well as a plurality of modular components within the housing, each modular component being in digital communication with the processing system for at least receiving control signals from the processing system and for at least transmitting data to the processing system, Wherein the housing comprises a plurality of openings, each opening corresponding to at least one of the modular detector components.

11. The detector of claim 10, wherein each of the plurality of openings comprises a system electrical connector configured to engage a component electrical connector on each of the plurality of modular components.

12. The detector of claim 11, wherein the plurality of modular components are selected from the group consisting of: an imager that converts x-rays into electronic signals, an image readout IC electrically connected to the imager, an analog-to-digital converter, control module electronics disposed on a PCB, a power management system, an electronic image storage unit, and a wired or wireless communication module.

13. The detector of claim 11, wherein the imager comprises a two-dimensional array of photosensitive pixels and a scintillator.

14. The detector of claim 11, wherein the imager comprises a two-dimensional array of x-ray sensitive pixels.

15. The detector of claim 11, wherein each of the system electrical connectors is electrically connected to the processing system for transmitting signals to and from the processing system through the system electrical connector.

16. The detector of claim 1, wherein the detector comprises dimensions of 17 x 17 cm, 35 x 35 cm, or 35 x 43 cm.

17. The detector of claim 2, wherein the two or more interchangeable detector components are connected to a power source of the detector.

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