PCBA explosion-proof plate continuous automatic welding system and method

By flipping the PCB circuit board at the welding station and turning the pins of the electronic components upward, the problems of small solder quantity and irregular shape caused by welding under the soldering equipment in the prior art are solved, and the solder quality and stability are improved .

CN119387742APending Publication Date: 2025-02-07WUHU YABOSION ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202411663009.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-20
Publication Date
2025-02-07

AI Technical Summary

Technical Problem

The prior art is equipped with solder equipment below the PCB circuit board. Due to the influence of the gravity of the molten solder paste, the pin soldering amount of electronic components is small and the shape is irregular during soldering, which affects the solder quality.

Method used

When welding station, turn the PCB circuit board in situ by 180°, so that the ends of the electronic components are facing down and the pins are facing up. The pins are soldered using the solder equipment on the transmission chain. The solder paste is rounded under gravity action shaped structure to ensure the complete welding structure and the stable solder paste amount.

Benefits of technology

By flipping the PCB circuit board, the solder paste of the solder equipment has a circular structure, which solves the problems of small solder amount and irregular shape during soldering, and improves the solder quality and stability.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a continuous automatic welding system and method for a PCBA explosion-proof board, and the method comprises the steps: enabling a PCB to be clamped on a clamping seat bottom plate, and enabling the clamping seat bottom plate provided with the PCB to be transmitted to a welding station through a transmission chain; an anti-moving assembly is used for covering the upper surface of the electronic element on the clamping base bottom plate at the welding station, the clamping base bottom plate and the anti-moving assembly are driven to rotate synchronously, the pin of the electronic element faces upwards, the end of the electronic element faces downwards, the pin of the electronic element is in a vertical state by abutting against the end of the electronic element, and the pin of the electronic element is welded; the welded PCB and the anti-moving assembly are synchronously rotated until the ends of the electronic elements face upwards and the pins of the electronic elements face downwards, the anti-moving assembly is separated from the welded PCB, and the conveying chain continues to work so as to convey the next PCB to a welding station; during welding, a welding structure which is complete in shape and stable in solder paste amount is formed at the pin of each electronic element.
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Description

Technical Field

[0001] The present invention relates to the technical field of PCB welding, and in particular to a continuous automatic welding system and method for a PCBA explosion-proof plate. Background Art

[0002] The whole process of putting the PCB blank through SMT mounting or DIP plug-in is referred to as PCBA. DIP package or DIP packaging is a packaging method for integrated circuits. The shape of the integrated circuit is rectangular, and there are two rows of parallel metal pins on both sides, called pin headers. The components of DIP package can be soldered in the through holes of the printed circuit board electroplating, or inserted into the DIP socket.

[0003] In the traditional soldering process for DIP plug-ins, the soldering equipment is mostly set under the PCB circuit board. In this way, there is no need to adjust the pin position of the PCB circuit board, and the soldering work can be directly performed on the lower surface of the PCB circuit board. However, due to the influence of gravity, the molten solder paste presents a flat shape, resulting in the pins of the electronic components being prone to insufficient solder and irregular solder shapes during soldering. The solder structure at the welding position is unstable, affecting the final quality effect. Summary of the invention

[0004] The purpose of the present invention is to provide a continuous automated welding system and method for PCBA explosion-proof panels, so as to solve the technical problem that in the prior art, a soldering device is arranged below a PCB circuit board, and the molten solder paste is flattened due to the gravity, resulting in the pins of the electronic components being prone to having a small amount of solder and irregular welding shapes during welding, and the solder structure at the welding position being unstable, which affects the final quality effect.

[0005] In order to solve the above technical problems, the present invention specifically provides the following technical solutions:

[0006] A PCBA explosion-proof plate continuous automatic welding method comprises the following steps:

[0007] Step 100: The PCB circuit board is clamped on the base plate of the card holder, and the base plate assembled with the PCB circuit board is transported to the welding station by a transmission chain;

[0008] Step 200: At the welding station, an anti-movement assembly is used to cover the upper surface of the electronic component of the base plate, and the base plate and the anti-movement assembly are driven to rotate synchronously, so that the pins of the electronic component face upward and the ends of the electronic component face downward, the ends of the electronic component are pressed against so that the pins of the electronic component are in a vertical state, and the pins of the electronic component are welded;

[0009] Step 300, synchronously rotate the welded PCB circuit board and the anti-movement assembly until the end of the electronic component faces upward and the pin of the electronic component faces downward, the anti-movement assembly is separated from the welded PCB circuit board, and the transmission chain continues to work to transmit the next PCB circuit board to the welding station.

[0010] As a preferred solution of the present invention, in the step 200, an electronic component laying station is provided upstream of the welding station, and the placement posture of the PCBA circuit board is determined upstream of the electronic component laying station by image acquisition, and based on the difference between the placement posture and the set posture, the overall rotation of the base plate is regulated until the placement posture is the same as the set posture;

[0011] The electronic components are arranged in order on the PCBA circuit board at the electronic component laying station, so that the electronic components are inserted on the front side of the PCBA circuit board, and the pins of the electronic components pass through the through holes and are located on the back side of the PCBA circuit board.

[0012] As a preferred solution of the present invention, in step 200, the method for implementing the welding work on the PCB circuit board with electronic components installed at the welding station is:

[0013] Fixing and clamping the two parallel side surfaces of the base plate, and covering the upper surface of the base plate with an anti-movement component;

[0014] The anti-movement assembly and the base plate are driven to rotate synchronously around the central axis of the two sides of the base plate until they rotate 180° in situ, so that the end of the electronic component faces downward and the pin of the electronic component faces upward;

[0015] The anti-movement component is pushed by an electric cylinder, and a squeezing force is generated on the end of the electronic component, so that the electronic component is closely attached to the surface of the PCB circuit board;

[0016] The soldering assembly is used to generate solder on the pins of the electronic components to achieve the welding work of the electronic components.

[0017] As a preferred solution of the present invention, after the welding work of the electronic components is completed, the anti-movement component and the base plate of the card holder are driven to rotate 180 degrees in the opposite direction in situ synchronously to reset the PCB circuit board and release the fixing work of the two parallel sides of the base plate of the card holder.

[0018] In order to solve the above technical problems, the present invention provides a welding system for a continuous automated welding method of a PCBA explosion-proof plate, comprising:

[0019] The transmission unit comprises two transmission chains, a card holder bottom plate (12) provided with a PCB circuit board is installed between the two transmission chains, and the transmission unit is used to sequentially transmit all PCB circuit boards to the welding station through the electronic component installation station in sequence;

[0020] The flipping and resisting unit is arranged at the welding station, and is used to flip the PCB circuit board transferred to the welding station by 180 degrees in situ, so that the pins of the electronic components face upwards, and resist the electronic components on the PCB circuit board so that they do not fall off the PCB circuit board, and after the welding unit completes the welding work, it drives the PCB circuit board to flip 180 degrees in situ for the second time, and releases the resisting work on the PCB circuit board;

[0021] Soldering unit, used to secure solder to the pins of electronic components.

[0022] As a preferred solution of the present invention, the center positions of the two parallel side surfaces of the base plate are placed on the transmission chain through an extended hanging rod;

[0023] Wherein, the transmission chain includes two narrow chains parallel to each other, a space for placing the base plate is formed between the two narrow chains, and the width between the two narrow chains is the same as the spacing between the base plates corresponding to the extended hanging rods.

[0024] As a preferred solution of the present invention, the base plate includes four cutting blocks, wherein two of the cutting blocks parallel to each other can be fixed in position so that the distance between the two cutting blocks is the same as the width of the PCB circuit board;

[0025] The other two parallel cutting blocks can move linearly relative to each other, and the PCB circuit board is installed between the two parallel cutting blocks, and the two parallel cutting blocks can fix the PCB circuit board;

[0026] The upper surface of the PCB circuit board installed in the base plate of the card seat is lower than the upper surface of the base plate of the card seat, and the lower surface of the PCB circuit board is lower than the lower surface of the base plate of the card seat.

[0027] As a preferred solution of the present invention, a groove is provided in the diameter direction of the extension hanging rod, and a driving assembly is provided on both sides of the transmission chain respectively, and the driving assembly is divided into a linear driving assembly and a rotation driving assembly, and the rotation driving assembly includes an insertion rod and an arc-shaped cover plate provided on the upper end surface of the insertion rod, and the linear driving assembly drives the insertion rod to be inserted into the groove of the extension hanging rod, and the end of the arc-shaped cover plate is installed with the anti-movement assembly;

[0028] The area of ​​the anti-movement component on one side is half of the upper surface area of ​​the base plate, and the areas of the anti-movement components on both sides are combined to form the upper surface area of ​​the base plate.

[0029] As a preferred solution of the present invention, the anti-movement assembly includes a rigid frame arranged on the outside, and an elastic surface arranged on the inside of the rigid frame;

[0030] An electric cylinder is provided under the transmission unit of the welding station, and an elastic push plate is also provided at the pushing end of the electric cylinder. When the electric cylinder pushes the elastic surface using the elastic push plate, it can apply an extrusion force to all electronic components on the PCB circuit board to ensure that the pins pass through the through holes of the PCB circuit board and face vertically upward.

[0031] Compared with the prior art, the present invention has the following beneficial effects:

[0032] The present invention flips the PCB circuit board 180 degrees in situ at the welding station, so that the end of the electronic component faces downward and the pin of the electronic component faces upward, so that the soldering equipment directly solders the pin of the electronic component. At this time, the solder paste of the soldering equipment is in a circular structure due to the effect of gravity, so that a welding structure with a complete shape and a stable amount of solder paste is formed at the pin of each electronic component during welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the implementation methods or the description of the prior art. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0034] Figure 1 A schematic diagram of a flow chart of an automated welding method according to an embodiment of the present invention;

[0035] Figure 2 A schematic diagram of the top view of the automated welding system according to an embodiment of the present invention;

[0036] Figure 3 is a schematic diagram of the three-dimensional structure of a rotation drive assembly according to an embodiment of the present invention;

[0037] Figure 4 A schematic diagram of the structure of an electric cylinder according to an embodiment of the present invention;

[0038] In the figure:

[0039] 1-transmission unit; 2-flipping and resisting unit; 3-welding unit; 4-linear drive assembly; 5-rotation drive assembly; 6-electric cylinder; 7-elastic push plate;

[0040] 11-transmission chain; 12-card holder bottom plate; 13-extension hanging rod; 14-cutting groove;

[0041] 51-insertion rod; 52-arc cover plate; 53-anti-movement component;

[0042] 531- Rigid frame; 532- Elastic surface. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] like Figure 1 As shown, the present invention provides a PCBA explosion-proof plate continuous automatic welding method, comprising the following steps:

[0045] Step 100: The PCB circuit board is clamped on the base plate of the clamping base, and the base plate assembled with the PCB circuit board is transported to the welding station by using a transmission chain.

[0046] Step 200: Use an anti-displacement assembly to cover the upper surface of the electronic component of the base plate of the card holder at the welding station, and drive the base plate and the anti-displacement assembly to rotate synchronously, so that the pins of the electronic component face upward and the ends of the electronic component face downward, press against the ends of the electronic component so that the pins of the electronic component are in a vertical state, and weld the pins of the electronic component.

[0047] Step 300, synchronously rotate the welded PCB circuit board and the anti-movement assembly until the end of the electronic component faces upward and the pin of the electronic component faces downward, the anti-movement assembly is separated from the welded PCB circuit board, and the transmission chain continues to work to transmit the next PCB circuit board to the welding station.

[0048] The automated welding process for PCB circuit boards in this embodiment is as follows: first, at the starting end of the welding production line, a blank PCB board is mounted on the base plate of the card holder, and the base plate of the card holder is inserted into the through holes of the blank PCB board through the DIP plug-in to achieve the installation of the electronic components.

[0049] After installing the electronic components on the card base plate, place the card base plate on the conveyor chain, and use the conveyor chain to pass the card base plate equipped with the PCB circuit board through the electronic component installation station and welding work in sequence. Finally, after the PCB circuit board is quality inspected, the entire welding process is completed.

[0050] Among them, the traditional welding process mostly sets the soldering equipment under the PCB circuit board, so that there is no need to adjust the pin position of the PCB circuit board, and the welding work can be directly performed on the lower surface of the PCB circuit board. Due to the influence of gravity, the molten solder paste presents a flat shape, resulting in the pins of the electronic components being prone to problems such as insufficient solder and irregular welding shapes during welding. The solder structure at the welding position is unstable, affecting the final quality effect.

[0051] In the present embodiment, in order to improve the stability of the welding section, the soldering equipment needs to be arranged above the transmission chain. Therefore, at the welding station, the PCB circuit board is flipped 180° in situ so that the end of the electronic component faces downward and the pin of the electronic component faces upward, so that the soldering equipment directly solders the pin of the electronic component. At this time, the solder paste of the soldering equipment is circular in structure due to the action of gravity, so that a welding structure with a complete shape and a stable amount of solder paste is formed at the pin of each electronic component during welding.

[0052] Furthermore, in order to prevent the electronic components on the PCB from falling off during the flipping process, the present embodiment integrates an anti-displacement component on the driving device that drives the PCB to flip, that is, before driving the PCB to flip, first try to cover the upper surface of the PCB with the anti-displacement component. At this time, the ends of the electronic components on the PCB are covered by the anti-displacement component and will not fall off during the flipping process. Then, the PCB and the anti-displacement component are driven to rotate 180° synchronously. At this time, the anti-displacement component is on the lower surface of the PCB. Then, the anti-displacement component is pushed to deform, and the electronic components are further attached to the PCB. Finally, the pins of the electronic components on the PCB are welded.

[0053] In step 200, an electronic component placement station is provided upstream of the welding station. The placement posture of the PCBA circuit board is determined upstream of the electronic component placement station through image acquisition, and based on the difference between the placement posture and the set posture, the overall rotation of the base plate of the card holder is regulated until the placement posture is the same as the set posture.

[0054] At the electronic component laying station, the electronic components are arranged in order on the PCBA circuit board so that the electronic components are inserted on the front side of the PCBA circuit board and the pins of the electronic components pass through the through holes and are on the back side of the PCBA circuit board.

[0055] In step 200, the method for implementing the welding work on the PCB circuit board with electronic components installed at the welding station is as follows:

[0056] The two parallel sides of the clamping base bottom plate are fixedly clamped, and the anti-movement component is covered on the upper surface of the clamping base plate;

[0057] Drive the anti-movement assembly and the base plate to rotate synchronously around the central axis of the two sides of the base plate until they rotate 180° in situ, so that the end of the electronic component faces downward and the pin of the electronic component faces upward;

[0058] The anti-movement component is pushed by an electric cylinder, and a squeezing force is generated on the end of the electronic component, so that the electronic component is closely attached to the surface of the PCB circuit board;

[0059] The soldering assembly is used to generate solder on the pins of the electronic components to achieve the welding work of the electronic components.

[0060] After completing the welding work on the electronic components, the anti-movement component and the base plate are driven to rotate 180 degrees in the opposite direction in situ synchronously, the PCB circuit board is reset, and the fixing work on the two parallel sides of the base plate is released at the same time.

[0061] It should be particularly noted that before welding, since the anti-displacement component 53 and the PCB circuit board are rotated 180° in situ synchronously, the anti-displacement component 53 is located below the PCB circuit board. Under the resistance of the transmission chain 11, the connection with the PCB circuit board cannot be released, and the PCB circuit board cannot continue to be transmitted.

[0062] Therefore, in order to solve the above problem, it is necessary to rotate the anti-displacement component 53 and the PCB circuit board synchronously by 180° after completing the welding work. It can be a forward rotation of 180° or a reverse rotation of 180°. After the reset rotation, the anti-displacement component 53 is again on the upper surface of the PCB circuit board, and the connection with the PCB circuit board is released. At this time, the PCB circuit board can continue to be transmitted.

[0063] In the traditional soldering process for DIP plug-ins, the soldering equipment is mostly set under the PCB circuit board. In this way, there is no need to adjust the pin position of the PCB circuit board, and the soldering work can be directly performed on the lower surface of the PCB circuit board. However, due to the influence of gravity, the molten solder paste presents a flat shape, resulting in the pins of the electronic components being prone to insufficient solder and irregular solder shapes during soldering. The solder structure at the welding position is unstable, affecting the final quality effect.

[0064] In this embodiment, at the welding station, the PCB circuit board is flipped 180 degrees in situ, so that the end of the electronic component faces downward and the pin of the electronic component faces upward, so that the soldering equipment above the pin directly solders the pin of the electronic component. At this time, the solder paste of the soldering equipment is in a circular structure due to the effect of gravity, so that a welding structure with a complete shape and a stable amount of solder paste is formed at the pin of each electronic component during welding.

[0065] In addition, in order to realize the specific implementation of the above-mentioned PCBA explosion-proof panel continuous automatic welding method, this embodiment also specifically provides a PCBA explosion-proof panel continuous automatic welding system, such as Figure 1 and Figure 2 As shown, it includes a transmission unit 1, a flipping and resisting unit 2 and a welding unit 3.

[0066] The transmission unit 1 includes two transmission chains 11, and a card holder base plate 12 provided with a PCB circuit board is installed between the two transmission chains 11. The transmission unit 1 is used to sequentially transmit all PCB circuit boards to the welding station through the electronic component installation station.

[0067] The flipping and resisting unit 2 is arranged at the welding station, and is used to flip the PCB circuit board transmitted to the welding station 180° in situ, so that the pins of the electronic components face upwards, and resist the electronic components on the PCB circuit board so that they do not fall off the PCB circuit board. After the welding unit 3 completes the welding work, it drives the PCB circuit board to flip 180° in situ for the second time, and releases the resisting work on the PCB circuit board.

[0068] The welding unit 3 is used to fix solder on the pins of the electronic components.

[0069] The steps of the traditional PCBA automated welding process are as follows: the PCB circuit board is mounted on the card holder base plate 12, the card holder base plate 12 is placed on the transmission chain 11, and the PCB circuit board is sequentially passed through the electronic component insertion station and the welding station by the transmission chain 11. At the electronic component insertion station, the electronic components are inserted into the through holes of the PCB circuit board from top to bottom. At the welding station, the pins of the electronic components are welded using a soldering device under the PCB circuit board. Since the solder paste of the soldering device is in a flat elliptical structure due to the action of gravity, a welding structure with a complete shape and a stable amount of solder paste cannot be formed at the pins of each electronic component during welding.

[0070] In this embodiment, the difference from the traditional PCBA automated welding process steps is that: in this embodiment, at the welding station, the PCB circuit board is flipped 180°, the pins of the electronic components are facing upward and the ends are facing downward, the soldering equipment is set above the transmission chain 11, and the soldering equipment is used to solder the pins of the electronic components. The solder paste of the soldering equipment is circular due to the action of gravity, so that a welding structure with a complete shape and a stable amount of solder paste is formed at the pins of each electronic component during welding.

[0071] After soldering is completed, the PCB circuit board is flipped 180° in the reverse direction, or further flipped 180° in the forward direction, so that the pins of the electronic components face downward and the ends face upward, and the soldered PCB circuit board is continued to be transported.

[0072] It should be noted that when the PCB circuit board is flipped 180° at the welding station, it is easy to cause the electronic components to fall off. In order to solve this problem, the present embodiment uses an anti-displacement component 53 for placing the electronic components. Before the PCB circuit board is rotated, the anti-displacement component 53 is used to cover the upper surface of the PCB circuit board, so that the electronic components will not fall off when the circuit board is flipped. After the flipping is completed, an electric cylinder capable of pushing the anti-displacement component 53 is provided under the transmission chain 11. The electric cylinder is used to push the anti-displacement component 53 to adjust the pin posture of the electronic component so that the pin posture of the electronic component can be perpendicular to the PCB circuit board.

[0073] In order to realize the transmission of the card base bottom plate 12 , the center positions of the two parallel side surfaces of the card base bottom plate 12 are placed on the transmission chain 11 through the extended hanging rod 13 .

[0074] The transmission chain 11 includes two narrow chains parallel to each other, and a space for placing the base plate 12 is formed between the two narrow chains. The width between the two narrow chains is the same as the spacing between the base plates 12 corresponding to the extended hanging rods 13.

[0075] The base plate 12 includes four cutting blocks, wherein two cutting blocks parallel to each other can be fixed in position so that the distance between the two cutting blocks is the same as the width of the PCB circuit board.

[0076] The other two parallel cutting blocks can move linearly relative to each other, and the PCB circuit board is installed between the two parallel cutting blocks, and the two parallel cutting blocks can fix the PCB circuit board.

[0077] The upper surface of the PCB circuit board installed in the card base bottom plate 12 is lower than the upper surface of the card base bottom plate 12 , and the lower surface of the PCB circuit board is lower than the lower surface of the card base bottom plate 12 .

[0078] In this embodiment, the card holder base plate 12 is specifically limited to the fixing method of the PCB circuit board, so that the width of the PCB circuit board is the same as the spacing between the two fixed cutting blocks, and the other two movable cutting blocks are used to fix the length direction of the PCB circuit board. In this way, after distinguishing the front and back sides of the PCB circuit board, there are only two fixing methods for the PCB circuit board installed in the card holder base plate 12.

[0079] When the PCB circuit board is clamped on the base plate 12 of the holder, there are two clamping modes: the starting end is at the upper left corner and the starting end is at the lower right corner. Assuming that the starting end is at the upper left corner as the correct posture, the starting position placed at the lower right corner is an incorrect posture. Since the PCB circuit board is limited to only one error situation, at the electronic component installation station, the posture of the PCB circuit board is adjusted by rotating it 180° so that its posture is the same as that of the template, so that the electronic component installation station can install electronic components on the PCB circuit board in sequence.

[0080] That is to say, at the electronic component laying station, the placement posture of the PCBA circuit board is determined by image acquisition, and based on the difference between the placement posture and the set posture, the overall rotation of the base plate 12 is regulated until the placement posture is the same as the set posture.

[0081] At the electronic component laying station, the electronic components are arranged in order on the PCBA circuit board so that the electronic components are inserted on the front side of the PCBA circuit board and the pins of the electronic components pass through the through holes and are on the back side of the PCBA circuit board.

[0082] Furthermore, in order to realize the flipping of the driving card base base plate 12, a groove 14 is provided in the diameter direction of the extended hanging rod 13. When the card base base plate 12 is placed on the transport chain, the groove 14 is in a vertical distribution state. The driving components are respectively arranged on both sides of the transmission chain 11. The driving components are divided into a linear driving component 4 and a rotational driving component 5. The rotational driving component 5 includes an insertion rod 51 and an arc-shaped cover plate 52 arranged on the upper end surface of the insertion rod 51. The linear driving component 4 drives the insertion rod 51 to be inserted into the groove 14 of the extended hanging rod 13. The end of the arc-shaped cover plate 52 is provided with an anti-displacement component 53.

[0083] The area of ​​the anti-movement component 53 on one side is half of the upper surface area of ​​the base bottom plate 12 , and the areas of the anti-movement components 53 on both sides are combined to form the upper surface area of ​​the base bottom plate 12 .

[0084] After the welding of the electronic components is completed, the anti-movement assembly 53 and the base plate 12 are driven to rotate 180° in the opposite direction to reset the PCB circuit board, and the fixing work of the two parallel sides of the base plate 12 is released at the same time.

[0085] It should be particularly noted that before welding, since the anti-displacement component 53 and the PCB circuit board are rotated 180° in situ synchronously, the anti-displacement component 53 is located below the PCB circuit board. Under the resistance of the transmission chain 11, the connection with the PCB circuit board cannot be released, and the PCB circuit board cannot continue to be transmitted.

[0086] Therefore, in order to solve the above problem, it is necessary to rotate the anti-displacement component 53 and the PCB circuit board synchronously by 180° after completing the welding work. It can be a forward rotation of 180° or a reverse rotation of 180°. After the reset rotation, the anti-displacement component 53 is again on the upper surface of the PCB circuit board, and the connection with the PCB circuit board is released. At this time, the PCB circuit board can continue to be transmitted.

[0087] In this embodiment, the specific method of fixing and clamping the two parallel sides of the base plate 12 and covering the anti-movement component 53 on the upper surface of the base plate is as follows:

[0088] The linear drive assembly 4 drives the rotary drive assembly 5 to move toward the PCB circuit board until the insertion rod 51 is inserted into the cut groove 14 of the extension hanging rod 13. At this time, the arc cover plate 52 is wrapped around the outside of the extension hanging rod 13, and the anti-movement assembly 53 moves to cover the upper surface of the PCB circuit board;

[0089] The rotation drive assembly 5 works, driving the PCB circuit board and the anti-movement assembly 53 to rotate synchronously until the end of the electronic component faces downward and the pins of the electronic component face upward;

[0090] After the welding is completed, the rotation drive assembly 5 works to drive the PCB circuit board and the anti-movement assembly 53 to rotate synchronously until the end of the electronic component faces upward and the pin of the electronic component faces downward;

[0091] The linear drive assembly 4 drives the rotary drive assembly 5 away from the PCB circuit board until the insertion rod 51 is pulled out of the slot 14 and the anti-movement assembly 53 is separated from the upper surface of the PCB circuit board.

[0092] As an advantage of this embodiment, the anti-displacement assembly 53 includes a rigid frame 531 disposed on the outside, and an elastic surface 532 disposed on the inside of the rigid frame 531;

[0093] like Figure 4 As shown, the pushing end of the electric cylinder 6 is also provided with an elastic push plate 7. When the electric cylinder 6 pushes the elastic surface 532 using the elastic push plate 7, it can apply an extrusion force to all electronic components on the PCB circuit board to ensure that the pins pass through the through holes of the PCB circuit board and face vertically upward.

[0094] In this embodiment, at the welding station, the PCB circuit board is flipped 180 degrees in situ, so that the end of the electronic component faces downward and the pin of the electronic component faces upward, so that the soldering equipment above the pin directly performs soldering work on the pin of the electronic component. At this time, the solder paste of the soldering equipment is in a circular structure due to the effect of gravity, so that a welding structure with a complete shape and a stable amount of solder paste is formed at the pin of each electronic component during welding.

[0095] The above embodiments are only exemplary embodiments of the present application and are not intended to limit the present application. The protection scope of the present application is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present application within the essence and protection scope of the present application, and such modifications or equivalent substitutions shall also be deemed to fall within the protection scope of the present application.

Claims

1. A PCBA explosion-proof panel continuous automated welding method, characterized in that: The following steps are involved: Step 100: The PCB circuit board is clamped on the base plate of the card holder, and the base plate assembled with the PCB circuit board is transported to the welding station by a transmission chain; Step 200: At the welding station, an anti-movement assembly is used to cover the upper surface of the electronic component of the base plate, and the base plate and the anti-movement assembly are driven to rotate synchronously, so that the pins of the electronic component face upward and the ends of the electronic component face downward, the ends of the electronic component are pressed against so that the pins of the electronic component are in a vertical state, and the pins of the electronic component are welded; Step 300, synchronously rotate the welded PCB circuit board and the anti-movement assembly until the end of the electronic component faces upward and the pin of the electronic component faces downward, the anti-movement assembly is separated from the welded PCB circuit board, and the transmission chain continues to work to transmit the next PCB circuit board to the welding station.

2. A PCBA explosion-proof panel continuous automated welding method according to claim 1, characterized in that: In step 200, an electronic component placement station is provided upstream of the welding station, and the placement posture of the PCBA circuit board is determined upstream of the electronic component placement station by image acquisition, and based on the difference between the placement posture and the set posture, the overall rotation of the base plate is regulated until the placement posture is the same as the set posture; The electronic components are arranged in order on the PCBA circuit board at the electronic component laying station, so that the electronic components are inserted on the front side of the PCBA circuit board, and the pins of the electronic components pass through the through holes and are located on the back side of the PCBA circuit board.

3. A PCBA explosion-proof panel continuous automated welding method according to claim 2, characterized in that: In step 200, the method for implementing the welding work on the PCB circuit board with electronic components installed at the welding station is: Fixing and clamping the two parallel side surfaces of the base plate, and covering the upper surface of the base plate with an anti-movement component; The anti-movement assembly and the base plate are driven to rotate synchronously around the central axis of the two sides of the base plate until they rotate 180° in situ, so that the end of the electronic component faces downward and the pin of the electronic component faces upward; The anti-movement component is pushed by an electric cylinder, and a squeezing force is generated on the end of the electronic component, so that the electronic component is closely attached to the surface of the PCB circuit board; The soldering assembly is used to generate solder on the pins of the electronic components to achieve the welding work of the electronic components.

4. A PCBA explosion-proof panel continuous automated welding method according to claim 2, characterized in that: After the welding of the electronic components is completed, the anti-movement assembly and the base plate are driven to rotate 180° in the opposite direction to reset the PCB circuit board, and the fixing work of the two parallel sides of the base plate is released at the same time.

5. A welding system based on the continuous automated welding method for PCBA explosion-proof panels according to any one of claims 1 to 4, characterized in that: include: The transmission unit (1) comprises two transmission chains (11), a card holder bottom plate (12) provided with a PCB circuit board is installed between the two transmission chains (11), and the transmission unit (1) is used to sequentially transmit all PCB circuit boards to the welding station through the electronic component installation station in sequence; The flipping and resisting unit (2) is arranged at the welding station and is used to flip the PCB circuit board transferred to the welding station by 180 degrees in situ, so that the pins of the electronic components face upwards, and resist the electronic components on the PCB circuit board so that they do not fall off the PCB circuit board, and after the welding unit (3) completes the welding work, it drives the PCB circuit board to flip by 180 degrees in situ for the second time, so as to release the resisting work on the PCB circuit board; The soldering unit (3) is used to fix solder on the pins of the electronic components.

6. A PCBA explosion-proof panel continuous automatic welding system according to claim 5, characterized in that: The center positions of the two parallel side surfaces of the card base bottom plate (12) are placed on the transmission chain (11) through an extended hanging rod (13); The transmission chain (11) comprises two narrow chains parallel to each other, a space for placing the card base bottom plate (12) is formed between the two narrow chains, and the width between the two narrow chains is the same as the spacing between the card base bottom plates (12) corresponding to the extended hanging rods (13).

7. A PCBA explosion-proof panel continuous automatic welding system according to claim 5, characterized in that: The base plate (12) comprises four cutting blocks, wherein two of the cutting blocks which are parallel to each other can be fixed in position so that the distance between the two cutting blocks is the same as the width of the PCB circuit board; The other two parallel cutting blocks can move linearly relative to each other, and the PCB circuit board is installed between the two parallel cutting blocks, and the two parallel cutting blocks can fix the PCB circuit board; The upper surface of the PCB circuit board installed in the card base bottom plate (12) is lower than the upper surface of the card base bottom plate (12), and the lower surface of the PCB circuit board is lower than the lower surface of the card base bottom plate (12).

8. A PCBA explosion-proof panel continuous automatic welding system according to claim 7, characterized in that: A groove (14) is provided in the diameter direction of the extended hanging rod (13), and drive components are respectively provided on both sides of the transmission chain (11), and the drive components are divided into a linear drive component (4) and a rotary drive component (5), and the rotary drive component (5) includes an insertion rod (51) and an arc-shaped cover plate (52) provided on the upper end surface of the insertion rod (51), and the linear drive component (4) drives the insertion rod (51) to be inserted into the groove (14) of the extended hanging rod (13), and the end of the arc-shaped cover plate (52) is installed with the anti-movement component (53); The area of ​​the anti-movement component (53) on one side is half of the upper surface area of ​​the base bottom plate (12), and the areas of the anti-movement components (53) on both sides are combined to form the upper surface area of ​​the base bottom plate (12).

9. A PCBA explosion-proof panel continuous automatic welding method according to claim 7, characterized in that: The anti-movement component (53) comprises a rigid frame (531) arranged on the outside, and an elastic surface (532) arranged on the inside of the rigid frame (531); An electric cylinder (6) is provided below the transmission unit (1) of the welding station, and an elastic push plate (7) is also provided at the pushing end of the electric cylinder (6). When the electric cylinder (6) pushes the elastic surface (532) using the elastic push plate (7), a squeezing force can be applied to all electronic components on the PCB circuit board to ensure that the pins pass through the through holes of the PCB circuit board and face vertically upward.

10. A PCBA explosion-proof panel continuous automatic welding method according to claim 7, characterized in that: When the card base bottom plate (12) is placed on a transport chain, the cutting grooves (14) are in a vertically distributed state.