Forming method of composite layer structural component, electronic equipment and storage medium

Abstract

The invention relates to the technical field of material forming, and discloses a forming method of a composite layer structural component, electronic equipment and a storage medium, the forming method comprises the following steps: prefabricating a base layer and a fitting layer, and arranging a bonding layer and an inorganic fiber layer between the base layer and the fitting layer in a laminated manner; a high-temperature adhesive tape layer is arranged on the base layer, so that the high-temperature adhesive tape layer surrounds the attaching layer; and forming the base layer, the fitting layer, the bonding layer and the inorganic fiber layer into the composite layer structural member through a compression molding process. Therefore, through the arrangement of the inorganic fiber layer, isolation between the base layer and the attaching layer is well achieved, the galvanic corrosion phenomenon between the base layer and the attaching layer can be relieved, and the anti-corrosion effect of the composite layer structural part is improved. And moreover, through the arrangement of the high-temperature adhesive tape layer, impurities flowing to the base layer from the laminating layer in the compression molding process can be well reduced, so that the influence of the impurities on the base layer on a subsequent electrophoresis process is reduced, and the anti-corrosion effect of the composite layer structural member is improved.

Description

Technical Field

[0001] The present application relates to the technical field of material forming, and in particular to a forming method of a composite layer structure, an electronic device and a storage medium. Background Art

[0002] When composite materials are in direct contact with heterogeneous materials, corrosion usually occurs due to the existence of potential difference. This corrosion phenomenon is called galvanic corrosion. In order to avoid the risk of galvanic corrosion, in the process of forming composite parts with heterogeneous materials, adhesives are applied to the entire area of ​​the connection surface to isolate the interface between the composite material and the heterogeneous material.

[0003] In the related art, there are defects in the glue coating process such as uncontrolled operating techniques (thickness, glue amount) and insufficient space for glue coating facilities, which will lead to more serious galvanic corrosion of the formed composite parts and reduce the quality of the composite parts. Summary of the invention

[0004] In view of the above problems, the present application provides a molding method of a composite layer structure, an electronic device and a storage medium. By setting an inorganic fiber layer and a high-temperature tape layer, the anti-corrosion effect of the composite layer structure can be improved.

[0005] The first aspect of the present application provides a method for forming a composite layer structure, comprising: prefabricating a base layer and a bonding layer, and stacking an adhesive layer and an inorganic fiber layer between the base layer and the bonding layer; arranging a high-temperature tape layer on the base layer so that the high-temperature tape layer surrounds the bonding layer; wherein the working temperature of the high-temperature tape layer is greater than a preset temperature; and forming a composite layer structure by a compression molding process using the base layer, the bonding layer, the adhesive layer and the inorganic fiber layer.

[0006] In some specific embodiments, the base layer is prefabricated with a first through hole; the step of stacking an adhesive layer and an inorganic fiber layer between the base layer and the bonding layer includes: arranging a first inorganic fiber patch; wherein the first inorganic fiber patch corresponds to the first through hole one by one, and the inorganic fiber patch can cover the first through hole corresponding thereto; stacking the first inorganic fiber patch and the adhesive layer between the base layer and the bonding layer, and making the first inorganic fiber patch cover the first through hole corresponding thereto, so that all the first inorganic fiber patches constitute an inorganic fiber layer.

[0007] In some specific embodiments, the step of stacking an adhesive layer and an inorganic fiber layer between the base layer and the bonding layer also includes: arranging a second inorganic fiber patch; wherein the second inorganic fiber patch corresponds to the shape and size of the surrounding edge areas of the bonding layer; stacking the second inorganic fiber patch and the adhesive layer between the base layer and the bonding layer, and making the second inorganic fiber patch face the surrounding edge areas of the bonding layer.

[0008] In some specific embodiments, the step of setting a first inorganic fiber patch includes: setting a first inorganic fiber patch corresponding to each first through hole so that the shape of the first inorganic fiber patch is the same as the shape of the corresponding first through hole and the size is larger than the size of the corresponding first through hole.

[0009] In some specific embodiments, the base layer is prefabricated with a first through hole; before the step of forming a composite layer structure by a compression molding process using the base layer, the bonding layer, the adhesive layer and the inorganic fiber layer, the step includes: arranging second through holes on the bonding layer that are opposite to the first through holes one by one; after the step of forming a composite layer structure by a compression molding process using the base layer, the bonding layer, the adhesive layer and the inorganic fiber layer, the step includes: performing electrophoresis treatment on the composite structure layer; and arranging avoidance holes on the adhesive layer and the inorganic fiber layer that are opposite to the first through hole and the second through hole.

[0010] In some specific embodiments, the base layer is prefabricated with a first through hole; after the step of forming a composite layer structure by a molding process using the base layer, the bonding layer, the adhesive layer and the inorganic fiber layer, the step includes: performing electrophoresis treatment on the composite structure; forming a second through hole opposite to the first through hole on the bonding layer, and providing avoidance holes opposite to the first through hole and the second through hole on the adhesive layer and the inorganic fiber layer.

[0011] In some specific embodiments, before the step of providing a high-temperature tape layer on the base layer so that the high-temperature tape layer surrounds the bonding layer, the step includes: obtaining the size of the bonding layer and the distance between the outer edge of the bonding layer and the outer edge of the base layer; determining the target width of the high-temperature tape layer after formation according to the size and distance of the bonding layer; wherein the target width is greater than a preset width.

[0012] In some specific embodiments, after the step of forming the composite layer structure by a compression molding process with the base layer, the laminating layer, the adhesive layer and the inorganic fiber layer, the step further includes: removing the high temperature tape layer.

[0013] A second aspect of the present application provides an electronic device, comprising: a processor; and a memory for storing a computer program, wherein when the computer program is executed by the processor, any of the above-mentioned methods for forming a composite layer structure is implemented.

[0014] A third aspect of the present application provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, any of the above-mentioned methods for forming a composite layer structure is implemented.

[0015] The present application has at least the following beneficial technical effects: Based on the forming method of the composite layer structure provided by the present application, the electronic device and the storage medium, the method includes: prefabricating a base layer and a bonding layer, and stacking an adhesive layer and an inorganic fiber layer between the base layer and the bonding layer; arranging a high-temperature tape layer on the base layer so that the high-temperature tape layer surrounds the bonding layer; wherein the working temperature of the high-temperature tape layer is greater than the preset temperature; the base layer, the bonding layer, the adhesive layer and the inorganic fiber layer are formed into a composite layer structure through a compression molding process. Therefore, by setting the inorganic fiber layer, the isolation between the base layer and the bonding layer is well achieved, and the galvanic corrosion phenomenon between the base layer and the bonding layer can be reduced. Moreover, by setting the high-temperature tape layer, the impurities flowing from the bonding layer to the base layer during the compression molding process can be well reduced, thereby reducing the influence of the impurities on the base layer on the subsequent electrophoresis process, so as to improve the anti-corrosion effect of the composite layer structure.

[0016] The above description is only an overview of the technical solution of the embodiment of the present application. In order to more clearly understand the technical means of the embodiment of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the embodiment of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are only used to illustrate the embodiments and are not to be considered as limiting the present application. In addition, the same reference symbols are used to represent the same components throughout the accompanying drawings. In the accompanying drawings:

[0018] Figure 1 It is a schematic flow chart of an embodiment of a method for forming a composite layer structure provided by the present application;

[0019] Figure 2 It is a structural schematic diagram of a configuration of a base layer, a laminating layer, an adhesive layer and an inorganic fiber layer;

[0020] Figure 3 It is a structural schematic diagram of another arrangement of the base layer, the laminating layer, the bonding layer and the inorganic fiber layer;

[0021] Figure 4 It is a top view of a configuration of a base layer, a laminating layer, an adhesive layer and an inorganic fiber layer;

[0022] Figure 5 is a schematic flow chart of another embodiment of a method for forming a composite layer structure provided by the present application;

[0023] Figure 6 It is a schematic flow chart of another embodiment of the method for forming a composite layer structure provided by the present application;

[0024] Figure 7 is an example diagram of the edge area around the bonding layer;

[0025] Figure 8 It is a schematic flow chart of another embodiment of the method for forming a composite layer structure provided by the present application;

[0026] Fig. 9 It is a schematic flow chart of another embodiment of the method for forming a composite layer structure provided by the present application;

[0027] Fig.10 It is a schematic flow chart of another embodiment of the method for forming a composite layer structure provided by the present application;

[0028] Fig.11 It is a schematic diagram of the structural framework of an embodiment of the electronic device provided by the present application;

[0029] Fig.12 It is a schematic diagram of the structural framework of an embodiment of the computer-readable storage medium provided by the present application. DETAILED DESCRIPTION

[0030] The exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0031] If there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if the meaning of "and / or" appearing in the full text is to include three parallel schemes, taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0032] The first aspect of the present application provides a method for forming a composite layer structure. Figure 1 1 is a schematic diagram of a process flow of an embodiment of a method for forming a composite layer structure provided by the present application. Figure 1 , the method comprises the following steps:

[0033] S101: prefabricate a base layer and a laminating layer, and laminate an adhesive layer and an inorganic fiber layer between the base layer and the laminating layer.

[0034] Among them, the base layer can be a structural layer made of heterogeneous materials. Heterogeneous materials are materials with new structures and properties prepared by two or more different materials through specific methods. The bonding layer can be a structural layer made of composite materials. Composite materials are a multiphase solid material composed of two or more substances with different physical and chemical properties. Since electrical corrosion can occur when heterogeneous materials are in direct contact with composite materials, electrical corrosion can occur when the base layer is in direct contact with the bonding layer.

[0035] In some specific application scenarios, the base layer can be a metal layer, in which case the base layer can be made of a metal heterogeneous material, and at least part of the various materials in the metal heterogeneous material are metal materials. The bonding layer can be a carbon fiber layer, in which case the carbon fiber layer can be made of a carbon fiber composite material, and at least part of the various materials in the carbon fiber composite material are carbon fiber materials. In the process of prefabricating the bonding layer, a composite material layer can be made of carbon fiber raw materials and epoxy resin to serve as the bonding layer.

[0036] When the adhesive layer and the inorganic fiber layer are stacked between the base layer and the laminating layer, the order of arranging the adhesive layer and the inorganic fiber layer is not specifically limited in this embodiment. After the adhesive layer and the inorganic fiber layer are stacked between the base layer and the laminating layer, the four structural layers are initially laminated together to form a whole.

[0037] Figure 2 It is a structural diagram of a configuration of a base layer, a laminating layer, an adhesive layer and an inorganic fiber layer. Figure 3 It is a structural schematic diagram of another arrangement of the base layer, the laminating layer, the adhesive layer and the inorganic fiber layer.

[0038] like Figure 2 As shown, in one arrangement, the adhesive layer can be arranged close to the base layer. Figure 3 As shown, in another arrangement, the inorganic fiber layer can be arranged close to the base layer. The arrangement method to be selected can be determined according to the specific application scenario.

[0039] Specifically, the adhesive layer can be made of an adhesive material, in which case the adhesive layer can be an adhesive film, which can be made of silicone rubber. Due to its adhesive properties, the adhesive layer mainly realizes the bonding between the structural layers. The inorganic fiber layer is made of an inorganic fiber material, for example, it can be made of inorganic fiber materials such as glass fiber and basalt fiber. The inorganic fiber layer will not cause galvanic corrosion with the base layer and the bonding layer, so that good isolation between the base layer and the bonding layer can be achieved, thereby reducing the galvanic corrosion phenomenon between the base layer and the bonding layer.

[0040] S102: Arranging a high-temperature tape layer on the base layer so that the high-temperature tape layer surrounds the bonding layer; wherein the working temperature of the high-temperature tape layer is greater than a preset temperature.

[0041] It should be understood that the size of the base layer is larger than the size of the bonding layer, the adhesive layer and the inorganic fiber layer, so that the projections of the three structural layers are all located within the base layer, and the outer edge of the base layer and the outer edges of the three structural layers are all at a certain distance, so that the high-temperature tape layer can be set. Moreover, in some application scenarios, the outer edges of the adhesive layer and the inorganic fiber layer do not exceed the outer edge of the bonding layer. When the high-temperature tape layer is set on the base layer, for the specific setting method of the high-temperature tape layer, the high-temperature tape layer needs to surround the bonding layer.

[0042] Figure 4 It is a top view of a configuration of a base layer, a laminating layer, an adhesive layer and an inorganic fiber layer.

[0043] Combination Figure 4 From another perspective, the adhesive layer, the inorganic fiber layer and the bonding layer form a combination, and the high-temperature tape layer is arranged around the bonding layer, that is, the high-temperature tape layer is arranged around the combination.

[0044] The working temperature of the high temperature tape layer is greater than the preset temperature, that is, the high temperature tape layer can withstand the preset temperature and can ensure normal performance at the preset temperature. The preset temperature may be 160° C., but is not limited thereto.

[0045] S103: Forming a composite layer structure by a compression molding process using the base layer, the laminating layer, the adhesive layer and the inorganic fiber layer.

[0046] In the above steps, when the base layer, the laminating layer, the adhesive layer and the inorganic fiber layer form a preliminary integrated structure, the connections between the various structural layers are not tight. This step compresses the preliminary formed integrated structure through a compression molding process to form a tight integrated structure, i.e., a composite layer structural part. Of course, in other embodiments, the composite layer structural part can be formed by a molding method such as vacuum bag molding.

[0047] In the process of forming the composite structural part by the compression molding process, the compression molding can be performed by a relevant mold, thereby ensuring the stability of the shape of each structural layer during the molding process. During the compression molding process, there will be a relatively high temperature, for example, it may be around 160°C, so in one embodiment, the preset temperature can be set to 160°C.

[0048] During the die-casting process, the bonding layer formed by the composite material usually flows out resin. If the flowing resin flows to the base layer, it will adhere to the base layer. The resin attached to the surface of the base layer will affect the electrophoresis effect of the subsequent process, and then affect the anti-corrosion effect of the composite layer structure. In this embodiment, a high-temperature tape layer is arranged around the bonding layer, and most of the resin flowing out of the bonding layer can flow onto the high-temperature tape layer. In the subsequent process, the high-temperature tape layer is directly removed and then electrophoresis is performed. That is, after this step, the high-temperature tape layer can be removed, and then electrophoresis can be performed, which can reduce the impact caused by the flowing resin, thereby ensuring that the composite layer structure has a good anti-corrosion effect.

[0049] In summary, based on the molding method of the composite layer structure provided by the above embodiment, on the one hand, an inorganic fiber layer is arranged between the base layer and the bonding layer, which can well isolate the base layer and the inorganic fiber layer, thereby reducing the galvanic corrosion between the base layer and the bonding layer, so as to improve the anti-corrosion effect of the composite layer structure. On the other hand, a high-temperature tape layer is arranged around the bonding layer, which can reduce the influence of the resin flowing out during the die-casting process on the electrophoresis, thereby improving the anti-corrosion effect of the composite layer structure.

[0050] Figure 5 It is a schematic flow chart of another embodiment of the molding method of the composite layer structure provided in the present application.

[0051] Combination Figure 5 In some specific embodiments, the step of laminating an adhesive layer and an inorganic fiber layer between the base layer and the laminating layer includes:

[0052] S201: Setting a first inorganic fiber patch; wherein the first inorganic fiber patch corresponds to the first through hole one by one, and the inorganic fiber patch can cover the first through hole corresponding thereto.

[0053] It should be understood that during the forming process of the base layer, the base layer will be provided with a first through hole, that is, the base layer is prefabricated with a first through hole. The number of the first through holes can be multiple, and the shapes or sizes corresponding to different first through holes can be different. Among them, the first through hole is used to facilitate the setting of subsequent structures, or the passage of subsequent wiring harnesses, etc.

[0054] The first inorganic fiber patch is made of the above-mentioned inorganic fiber material. The number of the first inorganic fiber patches is the same as the number of the first through holes, so that one first inorganic fiber patch corresponds to one first through hole, and the first inorganic fiber patch can cover the corresponding first through hole. The size of the first inorganic fiber patch does not need to be set larger, and can cover the first through hole with a certain margin.

[0055] S202: stacking the first inorganic fiber patch and the adhesive layer between the base layer and the laminating layer, and making the first inorganic fiber patch cover the first through hole corresponding thereto, so that all the first inorganic fiber patches constitute an inorganic fiber layer.

[0056] In this embodiment, the inorganic fiber layer is composed of all the first inorganic fiber patches, and one first inorganic fiber patch constitutes a part of the inorganic fiber layer. The arrangement of the first inorganic fiber patch and the adhesive layer can refer to the arrangement of the inorganic fiber layer and the adhesive layer described above. When there are multiple first inorganic fiber patches, since the multiple first inorganic fiber patches correspond to the multiple first through holes respectively, the multiple first inorganic fiber patches generally do not contact each other.

[0057] It should be understood that galvanic corrosion is likely to occur between the base layer and the bonding layer at the location of the first through hole. In this embodiment, the first inorganic fiber patch is arranged at the location of the first through hole, which can effectively reduce the galvanic corrosion at the first through hole. At this time, the bonding layer is other than the area opposite to the first through hole, and the inorganic fiber layer is not required to be arranged in other areas.

[0058] Based on this embodiment, an inorganic fiber layer is disposed in the area of ​​the first through hole where galvanic corrosion is more serious, but not in other areas. This can ensure a better anti-corrosion effect on the one hand, and reduce the number of inorganic fiber layers on the other hand, thereby reducing costs.

[0059] In other embodiments, an inorganic fiber layer having the same shape and size as the bonding layer may be provided to achieve full coverage of the bonding layer to achieve a better anti-corrosion effect, but at a slightly higher cost.

[0060] Figure 6 It is a schematic flow chart of another embodiment of the molding method of the composite layer structure provided in the present application.

[0061] Combination Figure 6 Based on the above embodiments, in some specific embodiments, the step of laminating an adhesive layer and an inorganic fiber layer between the base layer and the laminating layer further includes:

[0062] S301: Arrange a second inorganic fiber patch; wherein the second inorganic fiber patch corresponds to the shape and size of the peripheral edge area of ​​the bonding layer.

[0063] On the basis of the above embodiment, a second inorganic fiber patch is further provided. The peripheral edge area of ​​the bonding layer and the base layer are also prone to galvanic corrosion, so in this embodiment, a second inorganic fiber patch corresponding to the peripheral edge area of ​​the bonding layer is provided.

[0064] Specifically, the surrounding edge areas of the bonding layer can be set according to actual conditions, and different bonding layer sizes and application scenarios can correspond to different surrounding edge areas. The second inorganic fiber patch corresponds to the shape and size of the surrounding edge areas, and the shape of the second inorganic fiber patch can be the same as the shape of the surrounding edge areas, but the size of the second inorganic fiber patch is larger than the size of the surrounding edge areas.

[0065] Figure 7 This is an example diagram of the edge area around the bonding layer.

[0066] Combination Figure 7 , 11 is the outer edge of the bonding layer, 12 is the inner edge of the surrounding edge area of ​​the bonding layer, and the area between 11 and 12 is the surrounding edge area of ​​the bonding layer. Figure 7 The laminating layer is shown as a rectangle, and the corresponding surrounding edge areas are arranged in a manner that is illustrative only, and are not limited thereto in other embodiments.

[0067] S302: stacking a second inorganic fiber patch and an adhesive layer between the base layer and the laminating layer, and making the second inorganic fiber patch face the peripheral edge areas of the laminating layer.

[0068] After the second inorganic fiber patch is arranged, the second inorganic fiber patch and the adhesive layer are arranged between the base layer and the bonding layer. At this time, the first inorganic fiber patch and the second inorganic fiber patch together constitute the inorganic fiber layer, and the first inorganic fiber patch and the second inorganic fiber patch are both part of the inorganic fiber layer. Among them, when the second inorganic fiber patch is facing the edges of the bonding layer, on the one hand, the second inorganic fiber patch faces the edge area of ​​the bonding layer, and on the other hand, the edge area of ​​the patch layer faces the area facing the base layer and the second inorganic fiber patch.

[0069] In combination with the above content, if the embodiment of setting the first inorganic fiber patch is combined with the embodiment of setting the second inorganic fiber patch, then the above steps are: stack the first inorganic fiber patch, the second inorganic fiber patch and the adhesive layer between the base layer and the bonding layer, and make the first inorganic fiber patch cover the first through hole corresponding to it, so that the second inorganic fiber patch is opposite to the surrounding edge areas of the bonding layer, so that all the first inorganic fiber patches and the second inorganic fiber patches constitute an inorganic fiber layer.

[0070] Based on this embodiment, the anti-corrosion effect between the base layer and the bonding layer is further enhanced by providing the second inorganic fiber patch, and there is no need to provide an inorganic fiber layer with the same size as the bonding layer, thereby saving materials and reducing costs.

[0071] In combination with the above content, in some specific embodiments, the step of providing the first inorganic fiber patch includes:

[0072] A first inorganic fiber patch is arranged corresponding to each first through hole so that the shape of the first inorganic fiber patch is the same as the shape of the corresponding first through hole and the size of the first inorganic fiber patch is larger than the size of the corresponding first through hole.

[0073] It should be understood that in order to cover the first through hole, the shape of the first inorganic fiber patch is the same as the shape of the first through hole. For example, when the shape of the first through hole is rectangular, the corresponding shape of the first inorganic fiber patch is rectangular; when the shape of the first through hole is circular, the corresponding shape of the first inorganic fiber patch is circular. At this time, the size of the first inorganic fiber patch is set larger than the shape of the first through hole, so that the first inorganic fiber patch can cover the first through hole.

[0074] In some application scenarios, the first inorganic fiber patch should be neither too large nor too small. For example, the distance between the outer edge of the first inorganic fiber patch and the outer edge of the first through hole needs to be greater than the first distance and less than the second distance, thereby ensuring the anti-corrosion effect while saving materials.

[0075] Figure 8 It is a schematic flow chart of another embodiment of the molding method of the composite layer structure provided in the present application.

[0076] Combination Figure 8 In some specific embodiments, before the step of forming the composite layer structure by the molding process of the base layer, the laminating layer, the adhesive layer and the inorganic fiber layer, that is, before the above step S103, the process includes:

[0077] S401: second through holes are provided on the bonding layer, one-to-one with the first through holes.

[0078] In order to facilitate the setting of the structure and the passage of the wire harness, a through hole, namely a second through hole, is also required to be provided on the bonding layer. The second through hole corresponds to the first through hole one by one, and the second through hole can be arranged directly opposite to the corresponding first through hole. Since the distance between the bonding layer and the base layer is actually very small, the shape and size of the first through hole and the second through hole can be the same.

[0079] It should be understood that before the die-casting process is performed, only the bonding layer is punched to form the second through hole, and the adhesive layer and the inorganic fiber layer are not punched.

[0080] In combination with the above content, the first inorganic fiber patch can cover the first through hole, that is, the first inorganic fiber patch can cover the second through hole.

[0081] After the step of forming the composite layer structure by the molding process of the base layer, the laminating layer, the bonding layer and the inorganic fiber layer, that is, after the above step S103, the method includes:

[0082] S402: performing electrophoresis treatment on the composite layer structure.

[0083] After the composite layer structure is formed, electrophoresis treatment is further performed to improve the anti-corrosion effect of the composite layer structure. In combination with the above embodiment, before electrophoresis, the high temperature tape layer needs to be removed.

[0084] S403: Disposing avoidance holes on the adhesive layer and the inorganic fiber layer, which are opposite to the first through holes and the second through holes.

[0085] After the electrophoresis treatment is completed, the inorganic fiber layer and the adhesive layer are further punched to form avoidance holes, wherein the avoidance holes may have the same shape and size as the first through hole and the second through hole.

[0086] It should be understood that in this step, only the bonding layer is punched before the die-casting process, so that when the composite layer structure is subjected to electrophoresis, there is an adhesive layer and an inorganic fiber layer between the first through hole and the second through hole, so that it is not easy for the base layer and the bonding layer to react during the electrophoresis process, thereby ensuring that the composite layer structure has good performance.

[0087] Fig. 9 It is a schematic flow chart of another embodiment of the molding method of the composite layer structure provided in the present application.

[0088] Combination Fig. 9 In some specific embodiments, after the step of forming the composite layer structure by the molding process of the base layer, the laminating layer, the adhesive layer and the inorganic fiber layer, that is, after the above step S103, the method includes:

[0089] S501: performing electrophoresis treatment on the composite layer structure.

[0090] This embodiment provides another punching method for the laminating layer, the adhesive layer and the inorganic fiber layer, that is, no punching process is performed before the die-casting process.

[0091] S502: forming a second through hole opposite to the first through hole on the laminating layer, and providing an avoidance hole opposite to the first through hole and the second through hole on the adhesive layer and the inorganic fiber layer.

[0092] After the electrophoresis treatment is completed, a second through hole is further formed in the bonding layer, and an avoidance hole is formed in the adhesive layer and the inorganic fiber layer.

[0093] Similarly, in this embodiment, the second through hole and the avoidance hole are formed after the electrophoresis is completed. During the electrophoresis process, there is no situation where the first through hole and the second through hole are connected. Therefore, the electrophoresis process will not cause related reactions in the composite layer structure to reduce its performance.

[0094] Fig.10It is a schematic flow chart of another embodiment of the molding method of the composite layer structure provided in the present application.

[0095] Combination Fig.10 In some specific embodiments, before the step of providing a high temperature tape layer on the base layer so that the high temperature tape layer surrounds the bonding layer, that is, before the above step S102, the method includes:

[0096] S601: Obtain the size of the laminating layer and the distance between the outer edge of the laminating layer and the outer edge of the base layer.

[0097] It should be understood that the size of the bonding layer can reflect the possible situation of resin outflow during the die-casting process. The distance between the outer edge of the bonding layer and the outer edge of the base layer reflects the area where the high-temperature tape layer can be arranged and the operable area.

[0098] S602: Determine a target width of the high-temperature tape layer after it is formed according to the size and spacing of the bonding layer; wherein the target width is greater than a preset width.

[0099] In some application scenarios, when the size of the bonding layer is large, the target width of the high-temperature tape layer can be set larger. When the spacing is large, the target width can also be set larger. When the spacing is small, in order to avoid the high-temperature tape layer exceeding the edge of the base layer and facilitate setting, the target width can be set smaller.

[0100] In this embodiment, the target width is set to be larger than the preset width, which can ensure that the target width is not too small, thereby ensuring that it has a good effect of receiving the outflowing resin, thereby preventing a large amount of resin from flowing onto the base layer. In order to ensure that the high-temperature tape layer and the bonding layer are relatively close to ensure a good effect of receiving the resin, the distance between the orthographic projection of the outer edge of the bonding layer on the base layer and the edge of the high-temperature tape layer can be made smaller than the preset distance.

[0101] In some specific application scenarios, the preset distance can be set to ≤1mm, the target width of the high temperature tape layer can be set to 10mm-100mm, and the thickness can be set to 0.1mm-0.2mm. The specific material of the high temperature tape layer can be polytetrafluoroethylene PTFE or polyimide PI film.

[0102] A second aspect of the present application provides an electronic device, comprising: a processor; a memory for storing a computer program, wherein when the computer program is executed by the processor, the forming method of the composite layer structure in any of the above embodiments is implemented.

[0103] Fig.11 It is a schematic diagram of the structural framework of an embodiment of the electronic device 500 provided in the present application.

[0104] In some specific embodiments, the electronic device 500 includes a central processing unit (CPU) 501 and a read-only memory (ROM) 502, wherein the CPU 501 is a processor and the ROM 502 is a memory. The CPU 501 can perform various appropriate actions and processes according to the program stored in the ROM 502 or the program loaded from the storage part 508 to the random access memory (RAM) 503, such as executing the method in the above embodiment. In the RAM 503, various programs and data required for system operation are also stored. The CPU 501, the ROM 502 and the RAM 503 are connected to each other via the bus 504. The input / output (I / O) interface 505 is also connected to the bus 504.

[0105] The following components are connected to the I / O interface 505: an input section 506 including a keyboard, a mouse, etc.; an output section 507 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc., and a speaker, etc.; a storage section 508 including a hard disk, etc.; and a communication section 509 including a network interface card such as a LAN (Local Area Network) card, a modem, etc. The communication section 509 performs communication processing via a network such as the Internet. A drive 510 is also connected to the I / O interface 505 as needed. A removable medium 511, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 510 as needed so that a computer program read therefrom is installed into the storage section 508 as needed.

[0106] In particular, according to an embodiment of the present application, the process described above with reference to the flowchart can be implemented as a computer software program. For example, an embodiment of the present application includes a computer program product, which includes a computer program carried on a computer-readable medium, and the computer program includes a computer program for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network through a communication section 509, and / or installed from a removable medium 511. When the computer program is executed by a central processing unit (CPU) 501, various functions defined in the system of the present application are executed.

[0107] A third aspect of the present application provides a computer-readable storage medium 40, Fig.12It is a schematic diagram of the structural framework of an embodiment of the computer-readable storage medium 40 provided in the present application.

[0108] The computer readable storage medium 40 stores a computer program 41 , and when the computer program 41 is executed by a processor, the forming method of the composite layer structure component in any of the above embodiments is implemented.

[0109] It should be noted that the computer-readable medium 40 shown in the embodiment of the present application can be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable storage medium can be, for example, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media can include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a flash memory, an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable storage medium can be any tangible medium containing or storing a program, which can be used by an instruction execution system, device or device or used in combination with it. In the present application, a computer-readable signal medium can include a data signal propagated in a baseband or as a part of a carrier wave, wherein a computer-readable computer program is carried. Such propagated data signals may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. Computer-readable signal media may also be any computer-readable medium other than computer-readable storage media, which may send, propagate, or transmit programs for use by or in conjunction with an instruction execution system, apparatus, or device. The computer program contained on the computer-readable medium may be transmitted using any appropriate medium, including but not limited to: wireless, wired, etc., or any suitable combination of the above.

[0110] In summary, based on the forming method of the composite layer structure provided by the present application, the electronic device and the storage medium, the method includes: prefabricating a base layer and a bonding layer, and stacking an adhesive layer and an inorganic fiber layer between the base layer and the bonding layer; wherein, when the base layer is in direct contact with the bonding layer, an electric corrosion phenomenon can occur; a high-temperature tape layer is arranged on the base layer, so that the high-temperature tape layer surrounds the bonding layer; wherein, the working temperature of the high-temperature tape layer is greater than the preset temperature; the base layer, the bonding layer, the adhesive layer and the inorganic fiber layer are formed into a composite layer structure by a compression molding process. Therefore, by setting the inorganic fiber layer, the isolation between the base layer and the bonding layer is well achieved, and the galvanic corrosion phenomenon between the base layer and the bonding layer can be reduced. Moreover, by setting the high-temperature tape layer, the impurities flowing from the bonding layer to the base layer during the compression molding process can be well reduced, thereby reducing the influence of the impurities on the base layer on the subsequent electrophoresis process, so as to improve the anti-corrosion effect of the composite layer structure.

[0111] The above content is only a preferred exemplary embodiment of the present application and is not intended to limit the implementation scheme of the present application. A person skilled in the art can easily make corresponding changes or modifications based on the main concept and spirit of the present application. Therefore, the scope of protection of the present application shall be based on the scope of protection required by the claims.

Claims

1. A method for forming a composite layer structure, characterized in that: include: Prefabricating a base layer and a laminating layer, and laminating an adhesive layer and an inorganic fiber layer between the base layer and the laminating layer; A high-temperature tape layer is arranged on the base layer so that the high-temperature tape layer surrounds the bonding layer; wherein the working temperature of the high-temperature tape layer is greater than a preset temperature; The base layer, the laminating layer, the bonding layer and the inorganic fiber layer are formed into a composite layer structure through a compression molding process.

2. The method for forming a composite layer structure according to claim 1, characterized in that: The base layer is prefabricated with a first through hole; and the step of laminating an adhesive layer and an inorganic fiber layer between the base layer and the laminating layer comprises: Provide a first inorganic fiber patch; wherein the first inorganic fiber patch corresponds to the first through hole one by one, and the inorganic fiber patch can cover the first through hole corresponding thereto; The first inorganic fiber patch and the adhesive layer are stacked between the base layer and the laminating layer, and the first inorganic fiber patch covers the first through hole corresponding thereto, so that all the first inorganic fiber patches constitute an inorganic fiber layer.

3. The method for forming a composite layer structure according to claim 2, characterized in that: The step of laminating an adhesive layer and an inorganic fiber layer between the base layer and the laminating layer further includes: Arranging a second inorganic fiber patch; wherein the second inorganic fiber patch corresponds to the shape and size of the peripheral edge area of ​​the bonding layer; The second inorganic fiber patch and the adhesive layer are stacked between the base layer and the laminating layer, and the second inorganic fiber patch is directly opposite to the peripheral edge areas of the laminating layer.

4. The method for forming a composite layer structure according to claim 2, characterized in that: The step of providing a first inorganic fiber patch comprises: A first inorganic fiber patch is disposed corresponding to each of the first through holes, so that the first inorganic fiber patch has the same shape as the first through hole corresponding thereto and has a size larger than that of the first through hole corresponding thereto.

5. The method for forming a composite layer structure according to claim 1, characterized in that: The base layer is prefabricated with a first through hole; before the step of forming the base layer, the laminating layer, the bonding layer and the inorganic fiber layer into a composite layer structure through a molding process, the step includes: Disposing second through holes on the bonding layer that are opposite to the first through holes one by one; After the step of forming the base layer, the laminating layer, the bonding layer and the inorganic fiber layer into a composite layer structure through a compression molding process, the method comprises: Performing electrophoresis treatment on the composite layer structure; Avoidance holes opposite to the first through holes and the second through holes are provided on the adhesive layer and the inorganic fiber layer.

6. The method for forming a composite layer structure according to claim 1, characterized in that: The base layer is prefabricated with a first through hole; after the base layer, the laminating layer, the bonding layer and the inorganic fiber layer are formed into a composite layer structure through a molding process, the method comprises: Performing electrophoresis treatment on the composite layer structure; A second through hole opposite to the first through hole is formed on the bonding layer, and avoidance holes opposite to the first through hole and the second through hole are provided on the adhesive layer and the inorganic fiber layer.

7. The method for forming a composite layer structure according to claim 1, characterized in that: Before the step of providing a high temperature tape layer on the base layer so that the high temperature tape layer surrounds the bonding layer, the method includes: Obtaining the size of the laminating layer and the distance between the outer edge of the laminating layer and the outer edge of the base layer; The target width of the high-temperature tape layer after formation is determined according to the size of the bonding layer and the spacing; wherein the target width is greater than a preset width.

8. The method for forming a composite layer structure according to claim 1, characterized in that: After the step of forming the base layer, the laminating layer, the bonding layer and the inorganic fiber layer into a composite layer structure through a compression molding process, the method further includes: The high temperature tape layer is removed.

9. An electronic device, characterized in that: include: processor; A memory for storing a computer program, wherein when the computer program is executed by the processor, the method for forming a composite layer structure according to any one of claims 1 to 8 is implemented.

10. A computer-readable storage medium, characterized in that: The storage medium stores a computer program, and when the computer program is executed by a processor, the forming method of the composite layer structure according to any one of claims 1 to 8 is implemented.

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