High-temperature adhesive tape for fixing thermocouple

Abstract

The invention relates to the technical field of semiconductors, in particular to a high-temperature adhesive tape for fixing a thermocouple. The high-temperature adhesive tape comprises the high-temperature-resistant base film and the high-temperature-resistant adhesive layer, the through hole is formed in the first base film section, so that a self-locking mechanism is formed when the second base film section penetrates through the through hole, a thermocouple is firmly fixed, and the temperature measurement accuracy of the thermocouple is improved. Meanwhile, the high-temperature adhesive tape in contact with the thermocouple is not provided with an adhesive material, so that gasified organic matters are prevented from polluting the internal environment of the cavity.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductors, and in particular to a high-temperature adhesive tape for fixing a thermocouple. Background Art

[0002] In the semiconductor manufacturing process, the high temperature processing step is crucial, which directly affects the performance and yield of semiconductor devices. As the core equipment for high temperature processing, high temperature furnaces are widely used in oxidation, diffusion, annealing and other process links. Precise temperature control of wafers is one of the key factors to ensure the success of the process.

[0003] During operation, the uneven distribution of heat sources such as the hot air outlet and the ceramic heating tube will cause uneven heating of wafers at different positions in the furnace and different positions of the same wafer. In addition, the heating efficiency of heating sources such as heating tubes will also decay with the use time, which will affect the heating rate and heat distribution of the wafers in the high-temperature furnace. The temperature measuring device inside the equipment may also drift, resulting in incorrect temperature detection. Therefore, the high-temperature furnace needs to be calibrated regularly and the heating curve needs to be fitted to monitor the temperature parameters as the basis for adjusting the process parameters of the high-temperature furnace.

[0004] The temperature monitoring and calibration of wafers in high-temperature furnaces are achieved by thermocouples. When in use, the thermocouple is fixed on the surface of the wafer and fixed with high-temperature tape. However, since the thermocouple itself is easy to bend and has a certain elasticity, after it is fixed on the surface of the wafer, its own elastic force often causes the tape to be unreliable, causing the adhesive layer of the high-temperature tape to detach from the wafer surface. During the high-temperature baking process, accompanied by the circulation of hot air, the adhesive layer of the high-temperature tape will gradually be vaporized along the detachment position, lose its viscosity, and gradually reduce the bonding area between the tape and the wafer. At the least, it will cause the thermocouple to be severely warped, resulting in inaccurate temperature measurement, and at worst, it will fall off completely and pollute the cavity.

[0005] Therefore, a new high-temperature tape suitable for fixing thermocouples is urgently needed to solve the above technical problems. Summary of the invention

[0006] The object of the present invention is to provide a high temperature adhesive tape for fixing a thermocouple, which is used to firmly fix the thermocouple, increase the accuracy of the temperature measurement of the thermocouple, and reduce the contamination of the furnace cavity of the high temperature furnace by the high temperature adhesive tape. In order to solve the problems and shortcomings existing in the prior art, the present invention provides a high temperature adhesive tape for fixing a thermocouple. The high temperature adhesive tape provided by the present invention includes: A high temperature resistant base film, the high temperature resistant base film comprising a first base film segment, a second base film segment and a third base film segment, the second base film segment and the third base film segment are respectively located at two ends of the first base film segment; a through hole is provided on the first base film segment; the width of the second base film segment is smaller than the length of the through hole, so that the first base film segment can pass through the second base film segment; The high temperature resistant adhesive layer comprises a first adhesive layer and a second adhesive layer located on the same side surface of the high temperature resistant base film, the first adhesive layer is coated on the second base film segment, and the second adhesive layer is coated on the third base film segment.

[0007] Optionally, the position of the second base film segment adjacent to the first base film segment is not coated with the high temperature resistant adhesive layer, and the first adhesive layer is not in contact with the first base film segment.

[0008] Optionally, The high temperature resistant base film segment further includes a fourth base film segment connected to the first base film segment, and the fourth base film segment and the second base film segment are located at the same end of the first base film segment; The high temperature resistant adhesive layer further comprises a third adhesive layer located on the same side surface of the high temperature resistant base film as the first adhesive layer, and the third adhesive layer is coated on the third base film segment.

[0009] Optionally, the distance between the first adhesive layer and the first base film segment is greater than 1 cm.

[0010] Optionally, the high temperature tape further includes: a first release film, wherein the first release film is located on the second base film segment and the first base film segment and the first base film segment are respectively located on two sides of the first adhesive layer; The second release film is located on the third base film segment, and the second release film and the third base film segment are respectively located on two sides of the second adhesive layer.

[0011] Optionally, the high temperature tape further includes: a first release film, wherein the first release film is located on the second base film segment and the first base film segment and the first base film segment are respectively located on two sides of the first adhesive layer; a second release film, the second release film being located on the third base film segment and being located on both sides of the second adhesive layer with the third base film segment; A third release film is located on the third adhesive layer.

[0012] Optionally, the length of the second base film segment is not greater than 0.6 cm, and the degree of warping in extreme cases is less than 0.3 cm.

[0013] Compared with the prior art, the present invention has the following beneficial effects: (1) The first base film segment is provided with a through hole, and the second base film segment passes through the through hole to form a self-locking structure, which can firmly fix the thermocouple and increase the accuracy of the thermocouple temperature measurement; (2) No adhesive material is set on the high-temperature tape in contact with the thermocouple to avoid the formation of gasified organic matter to pollute the internal environment of the cavity; (3) An exposed section is provided at the second base film section to prevent the adhesive layer from being separated from the wafer surface and forming an oblique gap, which would cause the adhesive layer material to vaporize.

[0014] Based on the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will become more aware of the above and other objects, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings: Figure 1 is a front view of a high temperature tape for fixing a thermocouple according to an embodiment of the present invention; Figure 2 is a top view of a high temperature tape for fixing a thermocouple according to an embodiment of the present invention; Figure 3 is a front view of a thermocouple fixed with a high temperature tape in one embodiment of the present invention; Figure 4 is a top view of a high temperature tape for fixing a thermocouple according to an embodiment of the present invention; Figure 5 It is a schematic diagram of the force of fixing a thermocouple with a high-temperature tape in one embodiment of the present invention.

[0016] In the figure, 1-high temperature tape, 2-wafer, 3-thermocouple, 20-high temperature resistant base film, 30-adhesive layer, 40-release film, 50-through hole, 21-first base film segment, 22-second base film segment, 23-third base film segment, 24-fourth base film segment. DETAILED DESCRIPTION

[0017] Refer to the following Figures 1 to 5 To describe a high temperature tape for fixing thermocouples in an embodiment of the present invention. In the description of this embodiment, it should be understood that the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features, that is, include one or more of the features. In the description of the present invention, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. When a feature "includes or contains" one or some of the features it covers, unless otherwise specifically described, this indicates that other features are not excluded and may further include other features.

[0018] In the description of the present embodiment, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0019] Figure 1 1 is a front view of a high temperature tape for fixing a thermocouple according to an embodiment of the present invention. Figure 1 , and combined with Figures 2 to 5 The present invention provides a high temperature adhesive tape for fixing a thermocouple, wherein the high temperature adhesive tape 1 comprises a high temperature resistant base film 20 and a high temperature resistant adhesive layer 30. The high temperature resistant base film 20 comprises a first base film segment 21, a second base film segment 22 and a third base film segment 23, wherein the second base film segment 22 and the third base film segment 23 are respectively located at two ends of the first base film segment 21; a through hole 50 is provided on the first base film segment 21, and the width of the second base film segment 22 is less than the length of the through hole 50, so that the first base film segment 21 can pass through the second base film segment 22. The high temperature resistant adhesive layer 30 comprises a first adhesive layer and a second adhesive layer located on the same side surface of the high temperature resistant base film 20, wherein the first adhesive layer is coated on the second base film segment 22, and the second adhesive layer is coated on the third base film segment 23.

[0020] Specifically, the first basement membrane segment 21, the second basement membrane segment 22 and the third basement membrane segment 23 are an integral structure, that is, the high temperature resistant basement membrane 20 is a continuous whole without being cut in the middle. The direction from the second basement membrane segment 22 to the third basement membrane segment 23 is the length direction of the high temperature resistant basement membrane 20, and the direction perpendicular to the length direction in the main view of the high temperature resistant basement membrane 20 is the width direction of the high temperature basement membrane. A through hole 50 is provided on the first basement membrane segment 21, and the through hole 50 passes through the upper surface and the lower surface of the first basement membrane segment 21. The length of the through hole 50 is greater than the width of the second basement membrane segment 22, and the width of the through hole 50 is greater than the superimposed thickness of the second basement membrane segment 22 and the first adhesive layer. The second adhesive layer and the third basement membrane segment 23 have the same length, that is, the second adhesive layer is in contact with the first basement membrane segment 21. The adhesive used in the first adhesive layer and the second adhesive layer is a high temperature resistant adhesive that can withstand high temperatures of 800°C and above. No adhesive layer is provided on the surface of the first basement membrane segment 21.

[0021] In the specific use process, first, the high temperature tape 1 is placed on the surface of the wafer 2, and the high temperature tape 1 is bonded to the wafer 2 through the second adhesive layer. Secondly, the second base film segment 22 and the first adhesive layer are passed through the through hole 50 on the second base film segment 22 after crossing the thermocouple 3. At this time, the thermocouple 3 is located in the ring formed by the first base film segment 21 and the second base film segment 22. After passing through the through hole 50, the first adhesive layer is attached to the wafer 2 to achieve the connection between the second base film segment 22 and the wafer 2, thereby achieving the fixation of the thermocouple 3.

[0022] In this embodiment, according to the distance between the preset through hole 50 of the thermocouple 3 and the second base film segment 22, a preset space for fixing the thermocouple 3 is formed after the second base film segment 22 and the first adhesive layer pass through the through hole 50, forming a self-locking structure to fully fix the thermocouple 3.

[0023] In some embodiments of the present invention, the position of the second base film segment adjacent to the first base film segment is not coated with a high temperature resistant adhesive layer, so that the first adhesive layer and the first base film segment 21 are not in contact. Specifically, the length of the first adhesive layer is smaller than the length of the second base film segment 22, and part of the second base film segment 22 is exposed at one end of the second base film segment 22 close to the first base film segment 21. In other words, part of the second base film segment 22 does not have the first adhesive layer. At this time, the length of the exposed part of the second base film segment 22 and the first base film segment 21 is made greater than the circumference of the thermocouple 3. For example, the sum of the lengths of the exposed parts of the first base film 21 and the second base film segment 22 is 1 cm. At this time, if Figure 3 As shown, the thermocouple 3 is allowed to warp within a ring with a circumference of 1 cm, which can not only fully restrain the thermocouple to prevent it from warping too high, but also prevent the thermocouple from being restrained too tightly after being heated, resulting in excessive bending stress upward and breaking free from the restraint of the high-temperature tape.

[0024] In this embodiment, the first adhesive layer and the second adhesive layer are all bonded to the surface of the wafer 2, and there is no gap between the first adhesive layer and the second adhesive layer, which can avoid the formation of gaps between the high-temperature tape 1 and the surface of the wafer 2, and further avoid the gasification of the high-temperature resistant adhesive to produce organic matter that pollutes the internal environment of the cavity.

[0025] In some other embodiments of the present invention, the second base film segment 22 has an exposed portion at one end adjacent to the first base film segment 21, and the length of the exposed portion is greater than 1 cm. The exposed portion here means that the second base film segment 22 is not covered by the first adhesive layer. Figure 3 It can be seen that the second base film segment 22 is folded and passes through the through hole 50 and is fixed on the wafer surface. The exposed part can avoid the presence of viscose material in the part of the second base film segment 22 that is exposed to the chamber environment after being flipped, and the viscose material decomposes and pollutes the cavity under hot air circulation.

[0026] In some embodiments of the present invention, the high temperature adhesive tape 1 further includes a release film 40. The release film 40 is located at the second base film segment 22 and the third base film segment 23. The release film 40 located at the second base film segment 22 and the second base film segment 22 are respectively located on both sides of the first adhesive layer; the release film 40 located at the third base film segment 23 and the third base film segment 23 are respectively located on both sides of the second adhesive layer. The thickness of the through hole 50 is greater than the sum of the thicknesses of the second base film segment 22, the first adhesive layer and the release film 40.

[0027] In this embodiment, the provision of the release film 40 is beneficial to the preservation of the high-temperature tape 1 and can avoid misoperation when the tape is used to fix the thermocouple 3 .

[0028] In some embodiments of the present invention, the high temperature resistant base film 20 further includes a fourth base film segment 24, and the fourth base film segment 24 and the second base film segment 22 are located at the same end of the first base film segment 21. The length of the fourth base film segment 24 is greater than that of the first base film segment 21. The high temperature resistant adhesive layer 30 further includes a third adhesive layer, and the third adhesive layer is coated on the fourth base film segment 24.

[0029] In this embodiment, if Figure 3 As shown, when the high-temperature tape 1 is used to fix the thermocouple 3, first, the high-temperature tape 1 is placed on the surface of the wafer 2, the release film on the surface of the second adhesive layer is removed, and the second adhesive layer and the wafer 2 are bonded; secondly, the second base film segment 22 is turned over and the thermocouple 3 is restrained and passed through the through hole 50, and the release film 40 on the surface of the third adhesive layer is removed, so that the third adhesive layer is bonded to the wafer 2. It should be noted that while the third adhesive layer is bonded to the wafer 2, try to ensure that the first base film segment 21 is fully extended and there is no gap with the wafer surface; finally, the release film 40 on the surface of the first adhesive layer is removed, so that the second base film segment 22 is bonded to the wafer surface.

[0030] In this embodiment, the added fourth base film segment 24 and the third adhesive layer have a stronger bonding force with the wafer 2. When the second base film segment 22 is affected by the warping stress of the thermocouple 3 away from the wafer 2, the warping stress will first act on the second base film segment due to the downward fastening force applied by the third adhesive layer on the third base film segment 23. Figure 5 As shown, when the third base film segment 23 and the second adhesive layer are fixed, the direction of the tension K1 received by the second base film segment 22 is almost completely parallel to the surface of the wafer 2. At this time, the second adhesive layer and the third adhesive layer are completely in contact with the surface of the wafer. Since the tension K1 of the second adhesive layer is almost parallel to the surface of the wafer, the area of ​​the second adhesive layer that is separated from the surface of the wafer is relatively small, thereby slowing down the speed at which the adhesive layer is vaporized under the hot air circulation, ensuring that the tape can restrain the position of the thermocouple so that it does not move during the entire calibration process cycle to cause unstable temperature data, and can reduce the decomposition of the adhesive material to maintain a clean environment in the cavity.

[0031] In some embodiments of the present invention, there are two fourth base film segments 24 and two third adhesive layers. Specifically, the high temperature adhesive tape 1 includes two fourth base film segments 24 and two third adhesive layers, which are symmetrically attached to both sides of the first base film segment 21 when in use.

[0032] In this embodiment, two fourth base film segments 24 and a third adhesive layer are provided, so that the forces on both sides are more evenly distributed during pasting.

[0033] In a further embodiment of the present invention, the fourth base film segment 24 and the second base film segment 22 are integrally formed, and the third adhesive layer and the first adhesive layer are integrally formed, and are separated and cut during use.

[0034] In this embodiment, the one-piece molding is simple to manufacture.

[0035] In a further embodiment of the present invention, the fourth base film segment 24 is in contact with but not connected to the second base film segment 22, and the third adhesive layer is in contact with but not connected to the first adhesive layer. In this embodiment, the high temperature adhesive tape 1 is used to fix the thermocouple 3, which is easy to operate.

[0036] In some embodiments of the present invention, the high temperature adhesive tape 1 further includes a release film 40. The release film 40 is located in the second base film segment 22, the third base film segment 23 and the fourth base film segment 24. The release film 40 located in the second base film segment 22 and the second base film segment 22 are respectively located on both sides of the first adhesive layer; the release film 40 located in the third base film segment 23 and the third base film segment 23 are respectively located on both sides of the second adhesive layer. The release film 40 located in the fourth base film segment 24 and the fourth base film segment 24 are respectively located on both sides of the third adhesive layer.

[0037] In this embodiment, the release film 40 is provided to facilitate the storage of the high-temperature adhesive tape 1 .

[0038] In some embodiments of the present invention, the length of the second base film segment 22 is no more than 0.6 cm, and the degree of warping in extreme cases is less than 0.3 cm.

[0039] In this embodiment, the thermocouple is fully fixed while preventing excessive warping, so that the warping stress of the thermocouple after being bound can be released, and the thermocouple 3 is prevented from being overly stressed, so that a gap is formed between the adhesive layer and the surface of the wafer 2, resulting in detachment.

[0040] At this point, those skilled in the art should recognize that, although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived based on the content disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all these other variations or modifications.

Claims

1. A high temperature tape for fixing a thermocouple, characterized in that: The high temperature tape comprises: A high temperature resistant base film, the high temperature resistant base film comprising a first base film segment, a second base film segment and a third base film segment, the second base film segment and the third base film segment are respectively located at two ends of the first base film segment; a through hole is provided on the first base film segment; the width of the second base film segment is smaller than the length of the through hole, so that the first base film segment can pass through the second base film segment; The high temperature resistant adhesive layer comprises a first adhesive layer and a second adhesive layer located on the same side surface of the high temperature resistant base film, the first adhesive layer is coated on the second base film segment, and the second adhesive layer is coated on the third base film segment.

2. The high temperature adhesive tape for fixing thermocouples according to claim 1, characterized in that: The position of the second base film segment adjacent to the first base film segment is not coated with the high temperature resistant adhesive layer, so that the first adhesive layer is not in contact with the first base film segment.

3. The high temperature adhesive tape for fixing thermocouples according to claim 2, characterized in that: The high temperature resistant base film segment further includes a fourth base film segment connected to the first base film segment, and the fourth base film segment and the second base film segment are located at the same end of the first base film segment; The high temperature resistant adhesive layer further comprises a third adhesive layer located on the same side surface of the high temperature resistant base film as the first adhesive layer, and the third adhesive layer is coated on the third base film segment.

4. The high temperature adhesive tape for fixing thermocouples according to claim 1 or 3, characterized in that: The distance between the first adhesive layer and the first base film segment is greater than 1 cm.

5. The high temperature adhesive tape for fixing thermocouples according to claim 1 or 2, characterized in that: The high temperature tape also includes: a first release film, wherein the first release film is located on the second base film segment and the first base film segment and the first base film segment are respectively located on two sides of the first adhesive layer; The second release film is located on the third base film segment, and the second release film and the third base film segment are respectively located on two sides of the second adhesive layer.

6. The high temperature adhesive tape for fixing thermocouples according to claim 3, characterized in that: The high temperature tape also includes: a first release film, wherein the first release film is located on the second base film segment and the first base film segment and the first base film segment are respectively located on two sides of the first adhesive layer; a second release film, the second release film being located on the third base film segment and being located on both sides of the second adhesive layer with the third base film segment; A third release film is located on the third adhesive layer.

7. The high temperature adhesive tape for fixing thermocouples according to any one of claims 1 to 3, characterized in that: The length of the second base film segment is no more than 0.6 cm, and the degree of warping in extreme cases is less than 0.3 cm.

8. The high temperature adhesive tape for fixing thermocouples according to claim 5, characterized in that: The length of the second base film segment is no more than 0.6 cm, and the degree of warping in extreme cases is less than 0.3 cm.

9. The high temperature adhesive tape for fixing a thermocouple according to claim 6, characterized in that: The length of the second base film segment is no more than 0.6 cm, and the degree of warping in extreme cases is less than 0.3 cm.

10. The high temperature adhesive tape for fixing thermocouples according to claim 7, characterized in that: The length of the second base film segment is no more than 0.6 cm, and the degree of warping in extreme cases is less than 0.3 cm.

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