Low-damage laser pumping source chip base electroplating silver plating process

Abstract

The invention relates to the technical field of silver plating processes, in particular to a low-damage laser pump source chip base electroplating and silver plating process which comprises the following steps: step 1, material cleaning; step 2, surface activation treatment; step 3, silver plating preparation; step 4, silver plating operation; 5, cleaning after silver plating; step 6, drying treatment; step 7, surface coating; step 8, packaging is carried out; step 9, quality inspection; silver plating is carried out at the low temperature, the crystal form and growth speed of a plating layer can be controlled, stress and defects in the plating layer are reduced, the thickness and uniformity of the plating layer can be accurately controlled by adjusting parameters such as the current density, the electroplating time and the plating solution temperature, the requirements of different application scenes are met, and the application prospect is wide. Materials and chemicals used in the whole technological process meet the environmental protection requirement, pollution to the environment is reduced, compared with a traditional silver plating technology, the technology can obtain a low-damage and high-quality plating layer, and the product cost performance and market competitiveness are improved.

Description

Technical Field

[0001] The invention relates to the technical field of silver plating technology, and in particular to a low-damage laser pump source chip base electroplating silver plating process. Background Art

[0002] The electroplating silver plating process of the laser pump source chip base is to plate a layer of silver on the surface of the laser pump source chip base to improve the light source plasticity, light concentration of the chip and the fit between the chip and the silver layer.

[0003] Traditional electroplating processes often require multiple steps and equipment to complete. The movement and conversion of products during the processing may increase time and cost. At the same time, traditional electroplating processes may be affected by various factors during operation, such as plating solution composition, temperature, current density, etc. Changes in these factors may lead to fluctuations in the quality of the coating, resulting in a large amount of damage to the laser pump source chip base during the silver plating process, and the laser pump source chip base cannot be processed efficiently.

[0004] Therefore, the above-mentioned laser pump source chip base will be affected by many factors during operation, such as plating solution composition, temperature, current density, etc. Changes in these factors can lead to fluctuations in the quality of the coating, resulting in certain damage to the laser pump source chip base during the silver plating process. A low-damage laser pump source chip base silver plating process can be designed to meet the needs of efficient and low-damage electroplating of the laser pump source chip base. Summary of the invention

[0005] In order to overcome the problem that the traditional laser pump source chip base will be affected by various factors during long-term operation, resulting in fluctuations in the coating quality, and then causing certain damage to the laser pump source chip base during the silver electroplating process.

[0006] The technical solution of the present invention is: a low-damage laser pump source chip base electroplating silver plating process, the steps of which are as follows: Step 1: Material cleaning First, use a rotary cleaning machine to clean the laser pump source chip base in all directions. Add cleaning fluid to the rotary cleaning machine to remove surface grease, oxides and other contaminants while minimizing damage. Step 2: Surface activation treatment The cleaned materials are immersed in the activation solution to remove the surface oxide layer through chemical reaction and increase the surface activity, providing favorable conditions for the subsequent silver plating process. The activation solution can be dilute sulfuric acid. When dilute sulfuric acid is used, the concentration range of dilute sulfuric acid is between 2% and 8%, and the immersion time is between 5 seconds and 2 minutes; Step 3: Silver Plating Preparation According to the process requirements, the plating solution required for electroplating silver is accurately prepared, and the plating solution includes 60-180g / L silver nitrate, 6-14% thiosulfate or ammonia water, 1-2% acetate or borate, 0.4-0.6% brightener, 0.3-0.5% leveler and 0.2-0.4% wetting agent; Step 4: Silver plating operation Place the laser pump source chip base pretreated in step 2 into the electroplating tank, keep a certain distance from the anode, and use the low-temperature silver plating solution in step 3. During the electroplating process, the silver ions in the plating solution are reduced to metallic silver under the action of the current and deposited on the surface of the bottom plate to form a coating. The current density is between 0.03-0.2A / dm², and the plating solution temperature is between 10-15°C. By adjusting parameters such as current density, plating time and plating solution temperature, the thickness and uniformity of the coating can be controlled. Step 5: Cleaning after silver plating After the electroplating is completed, the laser pump source chip base is taken out of the electroplating tank and cleaned several times with a cleaning agent to remove the electroplating solution and impurities remaining on the surface. The cleaning agent includes a surfactant, a chelating agent, a corrosion inhibitor, a pH regulator, a dispersant, a defoaming agent and a co-solvent; Step 6: Drying Put the cleaned laser pump source chip base into a drying device for drying to remove surface moisture. The drying device can be a hot air dryer, a vacuum dryer or an infrared dryer. Step 7: Surface coating The surface of the laser pump source chip base that has been dried can be coated with a protective agent using a spraying device for protection treatment to further improve the corrosion resistance and aesthetics of the coating; Step 8: Packaging The laser pump source chip base is packaged using packaging equipment and moisture-proof and shock-proof packaging materials to protect the silver-plated layer from contamination and damage; Step 9: Quality Check Use optical microscope, X-ray fluorescence analyzer, coating thickness gauge, hardness tester, corrosion resistance tester and gloss meter to check the quality of the silver coating to ensure it meets the requirements.

[0007] Preferably, the cleaning solution in step 1 is any one or more of alkyl glycoside, fatty acid methyl ester ethoxylate, phosphate, carbonate, nano-silicon dioxide, nano-silver, protease, lipase, ethanol and isopropanol.

[0008] Preferably, the activation solution in step 2 may also be diluted hydrochloric acid. When using diluted hydrochloric acid, the concentration range of the diluted hydrochloric acid is between 2% and 4%, and the immersion time is between 4 seconds and 3 minutes.

[0009] Preferably, the specific range of the electroplating time in step 4 depends on the required coating thickness, current density and plating solution efficiency, and the electroplating time is between 8 minutes and 1 hour.

[0010] Preferably, the drying temperature of the drying equipment in step six is ​​generally not too high, and is between 50° C. and 80° C., and the drying time is between 20 minutes and 3 hours.

[0011] Preferably, the spraying equipment in step seven can be a spray gun or a spraying robot, and a dip coating pool can be used for batch dip coating treatment for large or complex-shaped laser pump source chip bases.

[0012] Preferably, the silver plating protective agent in step seven includes an organic silicon polymer, a preservative, a diluent, a leveling agent or a defoaming agent.

[0013] Preferably, in step seven, a chemical method can be used to form a dense chemical conversion film on the silver-plated surface, including a chromate conversion film or a phosphate conversion film. This conversion film can improve the corrosion resistance and adhesion of the coating.

[0014] Preferably, in step seven, a layer of metal or alloy film, including titanium, chromium or nickel, can be deposited on the silver-plated surface. The PVD film has excellent wear resistance, corrosion resistance and decorative properties, and can significantly improve the service life and aesthetics of the silver-plated base plate.

[0015] Beneficial effects of the present invention: 1. The present invention uses a rotary cleaning machine for all-round cleaning, which can effectively remove surface grease, oxides and other pollutants, while reducing mechanical damage. The composition of the plating solution is accurately calculated and formulated to ensure the quality of the coating. The addition of various additives, such as brightener, leveler and wetting agent, helps to obtain a smooth, uniform and dense coating. At the same time, silver plating at a lower temperature is conducive to controlling the crystal morphology and growth rate of the coating, reducing the stress and defects inside the coating, and by adjusting parameters such as current density, electroplating time and plating solution temperature, the thickness and uniformity of the coating can be accurately controlled to meet the needs of different application scenarios; 2. The present invention uses a variety of cleaning agents for multiple cleanings, which can completely remove the residual electroplating solution and impurities on the surface, reduce the risk of corrosion of the coating, and use appropriate drying equipment to remove surface moisture to prevent the coating from rusting due to residual moisture during subsequent use. The coating of the coating surface with a protective agent after drying can further improve the corrosion resistance and aesthetics of the coating and extend its service life. At the same time, moisture-proof and shock-proof packaging materials are used to package the laser pump source chip base, which can effectively protect the silver-plated layer from pollution and damage from the external environment, ensuring the stability and reliability of the product. The materials and chemicals used in the entire process meet environmental protection requirements, reducing pollution to the environment. Compared with the traditional silver plating process, this process can obtain a low-damage and high-quality coating, thereby improving the product's cost-effectiveness and market competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Shown is a flow chart of a low-damage laser pump source chip base electroplating silver plating process of the present invention. DETAILED DESCRIPTION

[0017] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0018] See also Figure 1 The present invention provides an embodiment: a low-damage laser pump source chip base electroplating silver plating process, the steps of which are as follows: Step 1: Material cleaning First, use a rotary cleaning machine to clean the laser pump source chip base in all directions. Add cleaning fluid to the rotary cleaning machine to remove surface grease, oxides and other contaminants while minimizing damage. Step 2: Surface activation treatment The cleaned materials are immersed in the activation solution to remove the surface oxide layer through chemical reaction and increase the surface activity, providing favorable conditions for the subsequent silver plating process. The activation solution can be dilute sulfuric acid. When dilute sulfuric acid is used, the concentration range of dilute sulfuric acid is between 2% and 8%, and the immersion time is between 5 seconds and 2 minutes; Step 3: Silver Plating Preparation According to the process requirements, the plating solution required for electroplating silver is accurately prepared, and the plating solution includes 60-180g / L silver nitrate, 6-14% thiosulfate or ammonia water, 1-2% acetate or borate, 0.4-0.6% brightener, 0.3-0.5% leveler and 0.2-0.4% wetting agent; Step 4: Silver plating operation Place the laser pump source chip base pretreated in step 2 into the electroplating tank, keep a certain distance from the anode, and use the low-temperature silver plating solution in step 3. During the electroplating process, the silver ions in the plating solution are reduced to metallic silver under the action of the current and deposited on the surface of the bottom plate to form a coating. The current density is between 0.03-0.2A / dm², and the plating solution temperature is between 10-15°C. By adjusting parameters such as current density, plating time and plating solution temperature, the thickness and uniformity of the coating can be controlled. Step 5: Cleaning after silver plating After the electroplating is completed, the laser pump source chip base is taken out of the electroplating tank and cleaned several times with a cleaning agent to remove the electroplating solution and impurities remaining on the surface. The cleaning agent includes a surfactant, a chelating agent, a corrosion inhibitor, a pH regulator, a dispersant, a defoaming agent and a co-solvent; Step 6: Drying Put the cleaned laser pump source chip base into a drying device for drying to remove surface moisture. The drying device can be a hot air dryer, a vacuum dryer or an infrared dryer. Step 7: Surface coating The surface of the laser pump source chip base that has been dried can be coated with a protective agent using a spraying device for protection treatment to further improve the corrosion resistance and aesthetics of the coating; Step 8: Packaging The laser pump source chip base is packaged using packaging equipment and moisture-proof and shock-proof packaging materials to protect the silver-plated layer from contamination and damage; Step 9: Quality Check Use optical microscope, X-ray fluorescence analyzer, coating thickness gauge, hardness tester, corrosion resistance tester and gloss meter to check the quality of the silver coating to ensure it meets the requirements.

[0019] When using the process of this technical solution, the steps are as follows: Step 1: Material cleaning First, a rotary cleaning machine is used to clean the laser pump source chip base in all directions, and a cleaning liquid is added to the rotary cleaning machine so that it can remove surface grease, oxides and other pollutants with low damage, and the cleaning liquid uses any one or more of alkyl glycoside, fatty acid methyl ester ethoxylate, phosphate, carbonate, nano-silicon dioxide, nano-silver, protease, lipase, ethanol and isopropanol; Step 2: Surface activation treatment The cleaned materials are immersed in the activation solution to remove the surface oxide layer through chemical reaction and increase the surface activity, providing favorable conditions for the subsequent silver plating process. The activation solution can be dilute sulfuric acid. When dilute sulfuric acid is used, the concentration range of dilute sulfuric acid is between 2% and 8%, and the immersion time is between 5 seconds and 2 minutes; Step 3: Silver Plating Preparation According to the process requirements, the plating solution required for electroplating silver is accurately prepared, and the plating solution includes 60-180g / L silver nitrate, 6-14% thiosulfate or ammonia water, 1-2% acetate or borate, 0.4-0.6% brightener, 0.3-0.5% leveler and 0.2-0.4% wetting agent; Step 4: Silver plating operation Place the laser pump source chip base pretreated in step 2 into the electroplating tank, keep a certain distance from the anode, use the low-temperature silver plating solution in step 3, during the electroplating process, the silver ions in the plating solution are reduced to metallic silver under the action of the current, and deposited on the surface of the bottom plate to form a coating, the current density is between 0.03-0.2A / dm², the plating solution temperature is between 10-15℃, and the thickness and uniformity of the coating are controlled by adjusting parameters such as current density, plating time and plating solution temperature. The specific range of the plating time depends on the required coating thickness, current density and plating solution efficiency, and the plating time is between 8 minutes and 1 hour; Step 5: Cleaning after silver plating After the electroplating is completed, the laser pump source chip base is taken out of the electroplating tank and cleaned several times with a cleaning agent to remove the electroplating solution and impurities remaining on the surface. The cleaning agent includes a surfactant, a chelating agent, a corrosion inhibitor, a pH regulator, a dispersant, a defoaming agent and a co-solvent; Step 6: Drying Put the cleaned laser pump source chip base into a drying device for drying to remove surface moisture. The drying device can be a hot air dryer, a vacuum dryer or an infrared dryer. The drying temperature of the drying device is generally not too high, between 50°C and 80°C, and the drying time is between 20 minutes and 3 hours. Step 7: Surface coating The surface of the laser pump source chip base after the drying can be coated with a protective agent by spraying equipment to further improve the corrosion resistance and aesthetics of the coating. The spraying equipment can be a spray gun or a spraying robot. For large or complex-shaped laser pump source chip bases, a dip coating pool can be used for batch dip coating. The silver plating protective agent includes an organic silicon polymer, a preservative, a diluent, a leveling agent or a defoaming agent. Step 8: Packaging The laser pump source chip base is packaged using packaging equipment and moisture-proof and shock-proof packaging materials to protect the silver-plated layer from contamination and damage; Step 9: Quality Check Use optical microscope, X-ray fluorescence analyzer, coating thickness gauge, hardness tester, corrosion resistance tester and gloss meter to check the quality of the silver coating to ensure it meets the requirements.

[0020] When using the process of this technical solution, the steps are as follows: Step 1: Material cleaning First, a rotary cleaning machine is used to clean the laser pump source chip base in all directions, and a cleaning liquid is added to the rotary cleaning machine so that it can remove surface grease, oxides and other pollutants with low damage, and the cleaning liquid uses any one or more of alkyl glycoside, fatty acid methyl ester ethoxylate, phosphate, carbonate, nano-silicon dioxide, nano-silver, protease, lipase, ethanol and isopropanol; Step 2: Surface activation treatment The cleaned materials are immersed in the activation solution to remove the surface oxide layer through chemical reaction and increase the surface activity, providing favorable conditions for the subsequent silver plating process. The activation solution can be dilute hydrochloric acid. When dilute hydrochloric acid is used, the concentration range of dilute hydrochloric acid is between 2% and 4%, and the immersion time is between 4 seconds and 3 minutes. Step 3: Silver Plating Preparation According to the process requirements, the plating solution required for electroplating silver is accurately prepared, and the plating solution includes 60-180g / L silver nitrate, 6-14% thiosulfate or ammonia water, 1-2% acetate or borate, 0.4-0.6% brightener, 0.3-0.5% leveler and 0.2-0.4% wetting agent; Step 4: Silver plating operation Place the laser pump source chip base pretreated in step 2 into the electroplating tank, keep a certain distance from the anode, use the low-temperature silver plating solution in step 3, during the electroplating process, the silver ions in the plating solution are reduced to metallic silver under the action of the current, and deposited on the surface of the bottom plate to form a coating, the current density is between 0.03-0.2A / dm², the plating solution temperature is between 10-15℃, and the thickness and uniformity of the coating are controlled by adjusting parameters such as current density, plating time and plating solution temperature. The specific range of the plating time depends on the required coating thickness, current density and plating solution efficiency, and the plating time is between 8 minutes and 1 hour; Step 5: Cleaning after silver plating After the electroplating is completed, the laser pump source chip base is taken out of the electroplating tank and cleaned several times with a cleaning agent to remove the electroplating solution and impurities remaining on the surface. The cleaning agent includes a surfactant, a chelating agent, a corrosion inhibitor, a pH regulator, a dispersant, a defoaming agent and a co-solvent; Step 6: Drying Put the cleaned laser pump source chip base into a drying device for drying to remove surface moisture. The drying device can be a hot air dryer, a vacuum dryer or an infrared dryer. The drying temperature of the drying device is generally not too high, between 50°C and 80°C, and the drying time is between 20 minutes and 3 hours. Step 7: Surface coating The surface of the laser pump source chip base that has been dried can be coated with a protective agent using a spraying device for protective treatment to further improve the corrosion resistance and aesthetics of the coating. A dense chemical conversion film, including a chromate conversion film or a phosphate conversion film, can be formed on the silver-plated surface by a chemical method. This conversion film can improve the corrosion resistance and adhesion of the coating. Step 8: Packaging The laser pump source chip base is packaged using packaging equipment and moisture-proof and shock-proof packaging materials to protect the silver-plated layer from contamination and damage; Step 9: Quality Check Use optical microscope, X-ray fluorescence analyzer, coating thickness gauge, hardness tester, corrosion resistance tester and gloss meter to check the quality of the silver coating to ensure it meets the requirements.

[0021] When using the process of this technical solution, the steps are as follows: Step 1: Material cleaning First, a rotary cleaning machine is used to clean the laser pump source chip base in all directions, and a cleaning liquid is added to the rotary cleaning machine so that it can remove surface grease, oxides and other pollutants with low damage, and the cleaning liquid uses any one or more of alkyl glycoside, fatty acid methyl ester ethoxylate, phosphate, carbonate, nano-silicon dioxide, nano-silver, protease, lipase, ethanol and isopropanol; Step 2: Surface activation treatment The cleaned materials are immersed in an activation solution to remove the surface oxide layer through chemical reaction and increase the surface activity, thereby providing favorable conditions for the subsequent silver plating process. The activation solution can be dilute sulfuric acid. When dilute sulfuric acid is used, the concentration range of the dilute sulfuric acid is between 2% and 8%, and the immersion time is between 5 seconds and 2 minutes. The activation solution can also be dilute hydrochloric acid. When dilute hydrochloric acid is used, the concentration range of the dilute hydrochloric acid is between 2% and 4%, and the immersion time is between 4 seconds and 3 minutes. Step 3: Silver Plating Preparation According to the process requirements, the plating solution required for electroplating silver is accurately prepared, and the plating solution includes 60-180g / L silver nitrate, 6-14% thiosulfate or ammonia water, 1-2% acetate or borate, 0.4-0.6% brightener, 0.3-0.5% leveler and 0.2-0.4% wetting agent; Step 4: Silver plating operation Place the laser pump source chip base pretreated in step 2 into the electroplating tank, keep a certain distance from the anode, use the low-temperature silver plating solution in step 3, during the electroplating process, the silver ions in the plating solution are reduced to metallic silver under the action of the current, and deposited on the surface of the bottom plate to form a coating, the current density is between 0.03-0.2A / dm², the plating solution temperature is between 10-15℃, and the thickness and uniformity of the coating are controlled by adjusting parameters such as current density, plating time and plating solution temperature. The specific range of the plating time depends on the required coating thickness, current density and plating solution efficiency, and the plating time is between 8 minutes and 1 hour; Step 5: Cleaning after silver plating After the electroplating is completed, the laser pump source chip base is taken out of the electroplating tank and cleaned several times with a cleaning agent to remove the electroplating solution and impurities remaining on the surface. The cleaning agent includes a surfactant, a chelating agent, a corrosion inhibitor, a pH regulator, a dispersant, a defoaming agent and a co-solvent; Step 6: Drying Put the cleaned laser pump source chip base into a drying device for drying to remove surface moisture. The drying device can be a hot air dryer, a vacuum dryer or an infrared dryer. The drying temperature of the drying device is generally not too high, between 50°C and 80°C, and the drying time is between 20 minutes and 3 hours. Step 7: Surface coating The surface of the laser pump source chip base that has been dried can be coated with a protective agent using a spraying device for protective treatment to further improve the corrosion resistance and aesthetics of the coating. A layer of metal or alloy film, including titanium, chromium or nickel, is deposited on the silver-plated surface. The PVD film has excellent wear resistance, corrosion resistance and decorative properties, and can significantly improve the service life and aesthetics of the silver-plated base plate. Step 8: Packaging The laser pump source chip base is packaged using packaging equipment and moisture-proof and shock-proof packaging materials to protect the silver-plated layer from contamination and damage; Step 9: Quality Check Use optical microscope, X-ray fluorescence analyzer, coating thickness gauge, hardness tester, corrosion resistance tester and gloss meter to check the quality of the silver coating to ensure it meets the requirements.

[0022] When using the process of this technical solution, the steps are as follows: Step 1: Material cleaning First, a rotary cleaning machine is used to clean the laser pump source chip base in all directions, and a cleaning liquid is added to the rotary cleaning machine so that it can remove surface grease, oxides and other pollutants with low damage, and the cleaning liquid uses any one or more of alkyl glycoside, fatty acid methyl ester ethoxylate, phosphate, carbonate, nano-silicon dioxide, nano-silver, protease, lipase, ethanol and isopropanol; Step 2: Surface activation treatment The cleaned materials are immersed in the activation solution to remove the surface oxide layer through chemical reaction and increase the surface activity, providing favorable conditions for the subsequent silver plating process. The activation solution can be dilute sulfuric acid. When dilute sulfuric acid is used, the concentration range of dilute sulfuric acid is between 2% and 8%, and the immersion time is between 5 seconds and 2 minutes; Step 3: Silver Plating Preparation According to the process requirements, the plating solution required for electroplating silver is accurately prepared, and the plating solution includes 60-180g / L silver nitrate, 6-14% thiosulfate or ammonia water, 1-2% acetate or borate, 0.4-0.6% brightener, 0.3-0.5% leveler and 0.2-0.4% wetting agent; Step 4: Silver plating operation Place the laser pump source chip base pretreated in step 2 into the electroplating tank, keep a certain distance from the anode, use the low-temperature silver plating solution in step 3, during the electroplating process, the silver ions in the plating solution are reduced to metallic silver under the action of the current, and deposited on the surface of the bottom plate to form a coating, the current density is between 0.03-0.2A / dm², the plating solution temperature is between 10-15℃, and the thickness and uniformity of the coating are controlled by adjusting parameters such as current density, plating time and plating solution temperature. The specific range of the plating time depends on the required coating thickness, current density and plating solution efficiency, and the plating time is between 8 minutes and 1 hour; Step 5: Cleaning after silver plating After the electroplating is completed, the laser pump source chip base is taken out of the electroplating tank and cleaned several times with a cleaning agent to remove the electroplating solution and impurities remaining on the surface. The cleaning agent includes a surfactant, a chelating agent, a corrosion inhibitor, a pH regulator, a dispersant, a defoaming agent and a co-solvent; Step 6: Drying Put the cleaned laser pump source chip base into a drying device for drying to remove surface moisture. The drying device can be a hot air dryer, a vacuum dryer or an infrared dryer. The drying temperature of the drying device is generally not too high, between 50°C and 80°C, and the drying time is between 20 minutes and 3 hours. Step 7: Surface coating The surface of the laser pump source chip base that has been dried can be coated with a protective agent using a spraying device for protective treatment to further improve the corrosion resistance and aesthetics of the coating. The spraying device can use a spray gun or a spraying robot. For large or complex-shaped laser pump source chip bases, a dip coating pool can be used for batch dip coating. The silver-plated protective agent includes an organic silicon polymer, a preservative, a diluent, a leveling agent or a defoaming agent. A chemical method can also be used to form a dense chemical conversion film on the silver-plated surface, including a chromate conversion film or a phosphate conversion film. This conversion film can improve the corrosion resistance and adhesion of the coating. At the same time, a metal or alloy film can be deposited on the silver-plated surface, including titanium, chromium or nickel. The PVD film has excellent wear resistance, corrosion resistance and decorative properties, and can significantly improve the service life and aesthetics of the silver-plated base. Step 8: Packaging The laser pump source chip base is packaged using packaging equipment and moisture-proof and shock-proof packaging materials to protect the silver-plated layer from contamination and damage; Step 9: Quality Check Use optical microscope, X-ray fluorescence analyzer, coating thickness gauge, hardness tester, corrosion resistance tester and gloss meter to check the quality of the silver coating to ensure it meets the requirements.

Claims

1. A low-damage laser pump source chip base electroplating silver plating process, characterized in that: The steps are as follows: Step 1: Material cleaning First, use a rotary cleaning machine to clean the laser pump source chip base in all directions. Add cleaning fluid to the rotary cleaning machine to remove surface grease, oxides and other contaminants while minimizing damage. Step 2: Surface activation treatment The cleaned materials are immersed in the activation solution to remove the surface oxide layer through chemical reaction and increase the surface activity, providing favorable conditions for the subsequent silver plating process. The activation solution can be dilute sulfuric acid. When dilute sulfuric acid is used, the concentration range of dilute sulfuric acid is between 2% and 8%, and the immersion time is between 5 seconds and 2 minutes; Step 3: Silver Plating Preparation According to the process requirements, the plating solution required for electroplating silver is accurately prepared, and the plating solution includes 60-180g / L silver nitrate, 6-14% thiosulfate or ammonia water, 1-2% acetate or borate, 0.4-0.6% brightener, 0.3-0.5% leveler and 0.2-0.4% wetting agent; Step 4: Silver plating operation Place the laser pump source chip base pretreated in step 2 into the electroplating tank, keep a certain distance from the anode, use the low-temperature silver plating solution in step 3, during the electroplating process, the silver ions in the plating solution are reduced to metallic silver under the action of the current, and deposited on the surface of the bottom plate to form a coating, the current density is between 0.03-0.2A / dm², the plating solution temperature is between 10-15℃, and the thickness and uniformity of the coating are controlled by adjusting parameters such as current density, plating time and plating solution temperature; Step 5: Cleaning after silver plating After the electroplating is completed, the laser pump source chip base is taken out of the electroplating tank and cleaned several times with a cleaning agent to remove the electroplating solution and impurities remaining on the surface. The cleaning agent includes a surfactant, a chelating agent, a corrosion inhibitor, a pH regulator, a dispersant, a defoaming agent and a co-solvent; Step 6: Drying Put the cleaned laser pump source chip base into a drying device for drying to remove surface moisture. The drying device can be a hot air dryer, a vacuum dryer or an infrared dryer. Step 7: Surface coating The surface of the laser pump source chip base that has been dried can be coated with a protective agent using a spraying device for protection treatment to further improve the corrosion resistance and aesthetics of the coating; Step 8: Packaging The laser pump source chip base is packaged using packaging equipment and moisture-proof and shock-proof packaging materials to protect the silver-plated layer from contamination and damage; Step 9: Quality Check Use optical microscope, X-ray fluorescence analyzer, coating thickness gauge, hardness tester, corrosion resistance tester and gloss meter to check the quality of the silver coating to ensure it meets the requirements.

2. The low-damage laser pump source chip base electroplating silver plating process according to claim 1, characterized in that: The cleaning solution in step 1 is any one or more of alkyl glycoside, fatty acid methyl ester ethoxylate, phosphate, carbonate, nano-silicon dioxide, nano-silver, protease, lipase, ethanol and isopropanol.

3. The low-damage laser pump source chip base electroplating silver plating process according to claim 1, characterized in that: The activation solution in step 2 can also be diluted hydrochloric acid. When using diluted hydrochloric acid, the concentration range of the diluted hydrochloric acid is between 2% and 4%, and the immersion time is between 4 seconds and 3 minutes.

4. The low-damage laser pump source chip base electroplating silver plating process according to claim 1, characterized in that: The specific range of the electroplating time in step 4 depends on the required coating thickness, current density and plating solution efficiency, and the electroplating time is between 8 minutes and 1 hour.

5. The low-damage laser pump source chip base electroplating silver plating process according to claim 1, characterized in that: The drying temperature of the drying equipment in step six is ​​generally not too high, and is between 50°C and 80°C, and the drying time is between 20 minutes and 3 hours.

6. The low-damage laser pump source chip base electroplating silver plating process according to claim 1, characterized in that: The spraying equipment in step seven can be a spray gun or a spraying robot. For large or complex-shaped laser pump source chip bases, a dip coating pool can be used for batch dip coating.

7. The low-damage laser pump source chip base electroplating silver plating process according to claim 1, characterized in that: The silver plating protective agent in step seven includes an organic silicon polymer, a preservative, a diluent, a leveling agent or a defoaming agent.

8. The low-damage laser pump source chip base electroplating silver plating process according to claim 1, characterized in that: In step seven, a chemical method can also be used to form a dense chemical conversion film on the silver-plated surface, including a chromate conversion film or a phosphate conversion film. This conversion film can improve the corrosion resistance and adhesion of the coating.

9. The low-damage laser pump source chip base electroplating silver plating process according to claim 1, characterized in that: In step seven, a layer of metal or alloy film, including titanium, chromium or nickel, can also be deposited on the silver-plated surface. The PVD film has excellent wear resistance, corrosion resistance and decorative properties, which can significantly improve the service life and aesthetics of the silver-plated base plate.

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