Photoelectric detector assembly and balanced photoelectric detector

Abstract

The invention provides a photoelectric detector assembly and a balanced photoelectric detector. The photoelectric detector assembly comprises an optical conduction assembly, a fixing piece and a photoelectric chip. The optical conduction assembly comprises a plurality of optical fibers, each optical fiber comprises an input end and an output end which are oppositely arranged, the input end is used for inputting an optical signal, and the output end is used for outputting the optical signal. The fixing piece is provided with a plurality of through holes, the output end of each optical fiber is inserted into the corresponding through hole and fixed to the fixing piece, and optical signals output by the output ends can be emitted out of the fixing piece. And the photoelectric chip is used for receiving optical signals output by the output ends of the plurality of optical fibers. According to the photoelectric detector assembly provided by the invention, the optical signals of the plurality of optical fibers are emitted into different receiving areas of the same photoelectric chip, so that the matching degree of the plurality of optical fiber lines is improved. Meanwhile, the optical fibers are inserted into the fixing pieces with the through holes so as to fix the multiple optical fibers, and the fixing mode is simple and firm.

Description

Technical Field

[0001] The present application belongs to the field of light detection technology, and specifically relates to a photoelectric detector assembly and a balanced photoelectric detector. Background Art

[0002] A balanced photodetector is a detector based on the photoelectric effect and differential circuit principles. A balanced photodetector can convert optical signals into electrical signals through the photoelectric effect, and amplify and reduce the noise of the electrical signals through differential circuits to obtain a signal with a high signal-to-noise ratio. A balanced photodetector generally includes multiple optical fiber lines, but it is difficult to match multiple optical fiber lines. Summary of the invention

[0003] In view of this, the first aspect of the present application provides a photoelectric detector assembly, the photoelectric detector assembly comprising: The optical transmission component comprises a plurality of optical fibers, each of the optical fibers comprises an input end and an output end which are arranged opposite to each other, the input end is used to input an optical signal, and the output end is used to output the optical signal; A fixing member, provided with a plurality of through holes, wherein the output end of each optical fiber is inserted into the through hole and fixed to the fixing member, and the optical signal outputted by the output end can be emitted from the fixing member; An optoelectronic chip is used to receive optical signals output from the output ends of the multiple optical fibers.

[0004] The photoelectric detector assembly provided in the first aspect of the present application improves the matching degree of multiple optical fiber lines by allowing the optical signals of multiple optical fibers to be emitted into different receiving areas of the same optoelectronic chip. At the same time, the optical fibers are inserted into a fixing member with a through hole to fix the multiple optical fibers, and the fixing method is simple and firm.

[0005] The fixing member has an output surface for emitting the optical signal, and an angle between the output surface and a plane perpendicular to the axial direction of the fixing member is an acute angle.

[0006] Wherein, the angle between the output surface and a plane perpendicular to the axial direction of the fixing member is 4°~13°.

[0007] The output surface includes an inclined surface and a reference surface bent and connected to the inclined surface, the angle between the inclined surface and a plane perpendicular to the axial direction of the fixing member is an acute angle, and the reference surface is perpendicular to the axial direction of the fixing member.

[0008] Wherein, the fixing member further includes an input surface, the input surface and the output surface are respectively arranged at two opposite ends of the fixing member, and the inclined surface is closer to the input surface than the reference surface.

[0009] The optical fiber includes a core, and the optical fiber also includes a middle portion located between the input end and the output end, and the input end and the middle portion also include a protective layer arranged on the outer periphery of the core.

[0010] The multiple optical fibers are arranged in a straight line, the optoelectronic chip has a receiving surface, the receiving surface is used to receive the optical signal, and the angle between the receiving surface and a plane perpendicular to the axial direction of the fixing member is an acute angle.

[0011] Wherein, the angle between the receiving surface and a plane perpendicular to the axial direction of the fixing member is 4°~13°.

[0012] The optoelectronic chip has a receiving surface for receiving the optical signal, the receiving surface is arranged on one side of the output surface, and the plane where the output surface is located intersects with the plane where the receiving surface is located.

[0013] In which, the photodetector assembly also includes a tube socket, the output surface, the receiving surface, and the tube socket are stacked in sequence; the output surface includes a first surface and a second surface that are arranged opposite to each other, the receiving surface includes a third surface located on the same side as the first surface, and a fourth surface located on the same side as the second surface; the first surface is closer to the tube socket than the second surface, and the fourth surface is closer to the tube socket than the third surface.

[0014] Wherein, the receiving surface has multiple incident points, and the multiple incident points are the positions where the multiple optical signals are irradiated on the optoelectronic chip. Along the arrangement direction of the multiple incident points, the receiving surface has a first end and a second end, and the distance between the first end and the fixing member is the same as the distance between the second end and the fixing member.

[0015] Wherein, the photoelectric detector assembly also includes a packaging assembly, the packaging assembly includes a tube seat, the tube seat has an inclined groove, the angle between the bottom surface of the inclined groove and the plane perpendicular to the axial direction of the fixing member is an acute angle, and the photoelectric chip is fixed to the bottom surface of the inclined groove so that the angle between the receiving surface and the plane perpendicular to the axial direction of the fixing member is an acute angle.

[0016] Wherein, the photoelectric detector assembly also includes a packaging assembly, which includes a tube seat and a fixing block, wherein the fixing block is fixed to one side of the tube seat, and the photoelectric chip is fixed to a side of the fixing block away from the tube seat, and the angle between a side of the fixing block facing the photoelectric chip and a plane perpendicular to the axial direction of the fixing member is an acute angle, so that the angle between the receiving surface of the photoelectric chip and the plane perpendicular to the axial direction of the fixing member is an acute angle.

[0017] Wherein, the photoelectric detector assembly includes a connecting assembly, and the connecting assembly includes a first connecting member and an adhesive member. The fixing member is fixed in the first connecting member, and the inner wall of at least one end of the first connecting member has a glue groove. The adhesive member is arranged in the glue groove, and one side of the adhesive member is bonded to the fixing member, and the other side is bonded to the first connecting member.

[0018] The second aspect of the present application provides a balanced photodetector, which includes a differential component and a photodetector component as provided in the first aspect of the present application, wherein the differential component is electrically connected to the photodetector component, and the differential component is used to differentially process the electrical signal output by the photodetector component.

[0019] The balanced photodetector provided in the second aspect of the present application adopts the photodetector assembly provided in the first aspect of the present application, so that the matching degree between multiple optical fiber lines of the balanced photodetector is high, the electrical signal obtained after differential processing is stable, the common mode rejection ratio of the balanced photodetector is improved, and the stability of the arrangement of multiple optical fibers is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the implementation modes of the present application, the drawings required for use in the implementation modes of the present application will be described below.

[0021] Figure 1 Schematic diagram of a photodetector assembly in one embodiment of the present application.

[0022] Figure 2 for Figure 1 A partial cross-sectional schematic diagram of the photodetector assembly is shown.

[0023] Figure 3 for Figure 2 A partial enlarged view of the photodetector assembly is shown.

[0024] Figure 4 for Figure 1 A partial cross-sectional schematic diagram of the photodetector assembly shown in another perspective.

[0025] Figure 5 for Figure 4 A partial enlarged view of the photodetector assembly is shown.

[0026] Figure 6 for Figure 1 Schematic diagram of the optical path of the photodetector assembly shown.

[0027] Figure 7 for Figure 1 A schematic diagram of the optical path of the photodetector assembly from another perspective is shown.

[0028] Figure 8 This is a schematic diagram of the optoelectronic chip and the socket in cooperation with each other in one embodiment of the present application.

[0029] Fig. 9 for Figure 8 The top view of the optoelectronic chip and the tube holder is shown.

[0030] Fig.10 It is a schematic diagram of the fixing member, the optoelectronic chip, and the socket when they are matched in one embodiment of the present application.

[0031] Fig.11 for Fig.10 A partial enlarged view of the fixing shown.

[0032] Fig.12 Schematic diagram of a fixing member in one embodiment of the present application.

[0033] Fig.13 FIG. 1 is a schematic diagram of an optical fiber in one embodiment of the present application.

[0034] Fig.14 It is a schematic diagram of the cooperation of a fixing member, an optoelectronic chip, and a socket in another embodiment of the present application.

[0035] Fig.15 for Fig.14 A partial enlarged view of the fixing member and the optoelectronic chip is shown.

[0036] Fig.16 It is a schematic diagram of the three-dimensional structure of a fixing member, an optoelectronic chip, and a tube seat in one embodiment of the present application.

[0037] Fig.17 It is a schematic diagram of an exploded view of an optoelectronic chip and a socket in one embodiment of the present application.

[0038] Fig.18 This is a schematic diagram of the cooperation between the optoelectronic chip and the socket in another embodiment of the present application.

[0039] Fig.19 FIG. 1 is a schematic diagram of a balanced photodetector according to an embodiment of the present application.

[0040] Description of reference numerals: photodetector assembly-1, balanced photodetector-2, differential assembly-3, light transmission assembly-10, optical fiber-11, output end-110, input end-111, middle part-112, fiber core-113, protective layer-114, adapter-12, fixing member-20, through hole-21, output surface-200, first surface-2001, second surface-2002, inclined surface-2003, reference surface-2004, input surface-201 , optoelectronic chip-30, receiving surface-300, first end-3001, second end-3002, third surface-3003, fourth surface-3004, injection point-301, packaging component-40, tube seat-41, inclined groove-410, tube cap-42, fixing block-43, wire-44, pin-45, connecting component-50, first connecting part-51, glue coating groove-510, second connecting part-52, third connecting part-53, lens-60. DETAILED DESCRIPTION

[0041] The following are preferred implementations of the present application. It should be noted that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application, and these improvements and modifications are also considered to be within the scope of protection of the present application.

[0042] Before introducing the technical solutions provided by this application, the technical problems in the related technologies are introduced in detail.

[0043] Balanced photodetectors are mainly used to detect light signals and convert them into electrical signals with a high signal-to-noise ratio. They are currently widely used in various optical fields, such as biomedical imaging, optical communications, lidar, quantum communications, etc. The principle of balanced photodetectors is mainly based on the photoelectric effect and differential circuits. The photoelectric effect refers to the phenomenon that light energy can be converted into electrical energy after photons interact with matter. Photodetectors use the photoelectric effect to convert light signals into electrical signals. However, due to the low energy conversion efficiency of the photoelectric effect, the electrical signal output by the detector is small. In order to improve the sensitivity of the detector, a differential circuit is required to amplify the electrical signal and reduce the noise.

[0044] A differential circuit is a circuit that can perform differential operations on two input signals. A balanced photodetector uses a differential circuit to amplify and reduce the noise of the detector's electrical signal, thereby improving the detector's sensitivity and anti-interference ability. In a balanced photodetector, two photodetectors receive an optical signal and a reference signal respectively, and then the two signals are differentially operated through a differential circuit to obtain a high-sensitivity and low-noise electrical signal output. However, a balanced photodetector generally includes multiple optical fiber lines, and multiple optical fiber lines require chips with highly consistent photoelectric effects to ensure that each optical fiber line can generate the same electrical signal when receiving the same optical signal. At the same time, it is also necessary to ensure that the response efficiency and optical path length between multiple lines are the same, which makes matching difficult.

[0045] At the same time, some balanced photodetectors also use fiber arrays to enhance the matching degree of multiple optical fibers. However, the production of fiber arrays is complex, with high precision requirements and low yield, which makes the cost of using fiber arrays high. At the same time, fiber arrays usually use ceramic sintered shells, and the production process of the airtight cover of the fiber array is complex, which makes the cost of fiber arrays high when used in balanced photodetectors.

[0046] In view of this, in order to solve the above problems, the present application provides a photodetector assembly. Please refer to Figure 1-Figure 9 , Fig.13 , Figure 1 Schematic diagram of a photodetector assembly in one embodiment of the present application. Figure 2 for Figure 1 A partial cross-sectional schematic diagram of the photodetector assembly is shown. Figure 3 for Figure 2 A partial enlarged view of the photodetector assembly is shown. Figure 4 for Figure 1 A partial cross-sectional schematic diagram of the photodetector assembly shown in another perspective. Figure 5 for Figure 4 A partial enlarged view of the photodetector assembly is shown. Figure 6 for Figure 1 Schematic diagram of the optical path of the photodetector assembly shown. Figure 7 for Figure 1 A schematic diagram of the optical path of the photodetector assembly from another perspective is shown. Figure 8 This is a schematic diagram of the optoelectronic chip and the socket in cooperation with each other in one embodiment of the present application. Fig. 9 for Figure 8 The top view of the optoelectronic chip and the tube holder is shown. Fig.13 FIG. 1 is a schematic diagram of an optical fiber in one embodiment of the present application.

[0047] The photodetector assembly 1 provided in this embodiment includes a light transmission assembly 10, a fixing member 20, and an optoelectronic chip 30. The light transmission assembly 10 includes a plurality of optical fibers 11, each of which includes an input end 111 and an output end 110 arranged opposite to each other, the input end 111 is used to input an optical signal, and the output end 110 is used to output the optical signal. The fixing member 20 is provided with a plurality of through holes 21, the output end 110 of each optical fiber 11 is inserted into the through hole 21 and fixed to the fixing member 20, and the optical signal output by the output end 110 can be emitted from the fixing member 20. The optoelectronic chip 30 is used to receive the optical signals output by the output ends 110 of the plurality of optical fibers 11.

[0048] The photodetector assembly 1 provided in this embodiment is mainly used to receive optical signals and convert optical signals into electrical signals. The photodetector assembly 1 includes an optical transmission assembly 10, a fixing member 20, and an optoelectronic chip 30. The optical transmission assembly 10 is used to receive optical signals and transmit optical signals to the optoelectronic chip 30. The optical transmission assembly 10 includes a plurality of optical fibers 11 and a plurality of adapters 12, and the optical fibers 11 are used to transmit optical signals. Each optical fiber 11 includes an input end 111 and an output end 110 that are relatively arranged, and the input end 111 is used to input optical signals, and the output end 110 is used to output optical signals. In other words, each optical fiber 11 has an input end 111 and an output end 110, and the optical signal enters the optical fiber 11 from the input end 111 of the optical fiber 11 and is emitted from the output end 110 of the optical fiber 11.

[0049] The optoelectronic chip 30 is mainly used to receive optical signals and convert them into electrical signals. In this embodiment, one optoelectronic chip 30 is used to receive optical signals output from the output ends 110 of multiple optical fibers 11. In other words, the optical signals output from the output ends 110 of multiple optical fibers 11 are all received by the same optoelectronic chip 30. That is to say, the optoelectronic chip 30 has multiple receiving areas, each receiving area receives an optical signal output from an optical fiber 11.

[0050] As can be seen from the above content, in the related art, the optoelectronic chips of multiple optical fiber lines are separately set, that is, each optical fiber line uses an optoelectronic chip, so that the optoelectronic effects of multiple optical fiber lines have certain differences, and the matching is more difficult. In this embodiment, the optical signals of multiple optical fiber 11 lines are all received by the same optoelectronic chip 30, that is, the optical signals of multiple optical fibers 11 pass through the same optoelectronic chip 30, so that the optoelectronic effect of each optical fiber 11 path is the same, and the response efficiency is also the same, thereby making the matching degree of multiple optical fiber 11 paths better and the output electrical signals more stable.

[0051] The fixing member 20 is used to limit and fix the output end 110 of the optical fiber 11 so as to limit the direction in which the optical signal is emitted from the output end 110 of the optical fiber 11. The fixing member 20 is provided with a plurality of through holes 21, and the output end 110 of each optical fiber 11 is inserted into the through hole 21 and fixed to the fixing member 20. In other words, the fixing member 20 has a plurality of through holes 21 that penetrate the fixing member 20 in the axial direction, and the output end 110 of each optical fiber 11 is inserted into a through hole 21 and fixed to the inner wall of the through hole 21. For example, when the number of optical fibers 11 is two, the fixing member 20 has two through holes 21, wherein the output end 110 of one optical fiber 11 is inserted into one through hole 21, and the output end 110 of another optical fiber 11 is inserted into another through hole 21. Optionally, the fixing form between the output end 110 of the optical fiber 11 and the fixing member 20 includes but is not limited to gluing, welding, etc. Optionally, the extension directions of the plurality of through holes 21 are the same, so that the directions of the optical signals emitted from the output ends 110 of the plurality of optical fibers 11 are the same. Optionally, the material of the fixing member 20 includes but is not limited to glass, ceramic and other materials.

[0052] As can be seen from the above content, some balanced photodetectors also use fiber arrays to enhance the matching degree of multiple optical fibers. However, the production of fiber arrays is complex, the precision requirements are high, and the yield rate is low, which makes the cost of using fiber arrays high. At the same time, fiber arrays usually use a ceramic sintered shell, and the process of making the airtight cover of the fiber array is complex, which makes the cost of fiber arrays high when used in balanced photodetectors. In this embodiment, a fixing member 20 with a lower material price is used to fix the optical fiber 11, so that the cost of using the fixing member 20 is lower. At the same time, compared with the base and cover plate of the optical fiber array to fix the optical fiber 11, in this embodiment, an axial through hole 21 is opened in the fixing member 20, and the optical fiber 11 is inserted into the through hole 21 and fixed. The method of fixing the optical fiber 11 to the fixing member 20 is simpler and firmer, thereby avoiding the optical fiber 11 from shaking at will, thereby causing the optical path to change, and the optoelectronic chip 30 cannot receive the optical signal.

[0053] The optical signal outputted by the output end 110 can be emitted from the fixing member 20. In other words, when the output end 110 does not completely penetrate the through hole 21, the optical signal outputted by the output end 110 can continue to pass through the through hole 21 and be emitted from one side of the fixing member 20. When the end of the output end 110 is flush with the through hole 21 or the end of the output end 110 protrudes from the through hole 21, the optical signal can be emitted directly from the output end 110 without passing through the through hole 21.

[0054] In summary, this embodiment makes the optical signals of multiple optical fibers 11 enter different receiving areas of the same optoelectronic chip 30, so that the photoelectric effect and response efficiency of the paths of multiple optical fibers 11 are the same, thereby improving the matching degree of the lines of multiple optical fibers 11. At the same time, the optical fibers 11 are inserted into the fixing member 20 with the through hole 21 to fix the multiple optical fibers 11. The fixing method is simple and firm, which prevents the optical fiber 11 from shaking easily, resulting in the optical signal emitted from the output end 110 not being irradiated on the optoelectronic chip 30 and unable to be received by the optoelectronic chip 30.

[0055] Optionally, the photodetector assembly 1 in this embodiment further includes a plurality of lenses 60, and a plurality of optical signals are converged to the optoelectronic chip 30 after being converged by the plurality of lenses 60, thereby making the optical signals received by the optoelectronic chip 30 more concentrated and improving the intensity of the optical signals received by the optoelectronic chip 30.

[0056] Please refer to Figure 10-12 , Fig.10 It is a schematic diagram of the fixing member, the optoelectronic chip, and the socket when they are matched in one embodiment of the present application. Fig.11 for Fig.10 A partial enlarged view of the fixing shown. Fig.12 Schematic diagram of a fixing member in one embodiment of the present application. In this embodiment, the fixing member 20 has an output surface 200 for emitting the optical signal, and the angle between the output surface 200 and a plane perpendicular to the axial direction of the fixing member 20 is an acute angle.

[0057] The fixing member 20 has an output surface 200 for emitting optical signals. In other words, the fixing member 20 has an input surface 201 and an output surface 200 that are arranged opposite to each other. The through holes 21 are provided on the input surface 201 and the output surface 200. The side where the plurality of optical fibers 11 are inserted is the input surface 201, and the side where the optical signals of the plurality of optical fibers 11 are emitted is the output surface 200. The output surface 200 is perpendicular to the axial direction of the fixing member 20 ( Fig.10 The angle between the planes in the C direction ( Fig.10 ∠A) is an acute angle. In other words, the output surface 200 is not perpendicular to the axial direction of the fixing member 20, nor is it parallel to or coincident with the axial direction of the fixing member 20. Instead, it is set at an angle with the plane perpendicular to the axial direction of the fixing member 20, and the angle is an acute angle. That is to say, relative to the horizontal plane, the output surface 200 has a certain inclination angle, and the inclination angle is an acute angle.

[0058] Specifically, when the optoelectronic chip 30 is disposed on one side of the output surface 200 of the fixing member 20, the optical signal is emitted from the output surface 200 and directly enters the optoelectronic chip 30. At this time, most of the optical signals entering the optoelectronic chip 30 are absorbed by the optoelectronic chip 30 and converted into electrical signals, but a small amount of optical signals are still reflected back to the output surface 200 of the fixing member 20 by the optoelectronic chip 30. When the output surface 200 is perpendicular to the axial direction of the fixing member 20, the optical signal will be reflected back to the optoelectronic chip 30 by the output surface 200, thereby causing optical reflection oscillation, which affects the electrical signal output by the optoelectronic chip 30.

[0059] This embodiment can make the angle between the output surface 200 and the direction in which the light signal is emitted ( Fig.10 ∠A) is an acute angle, so that when part of the light signal is reflected back to the output surface 200 by the optoelectronic chip 30, the light signal reflected by the output surface 200 can be prevented from being reflected back to the optoelectronic chip 30, that is, light reflection oscillation is prevented between the output surface 200 and the optoelectronic chip 30, thereby making the electrical signal output by the optoelectronic chip 30 more stable.

[0060] Please refer again Figure 10-12 In this embodiment, the angle between the output surface 200 and a plane perpendicular to the axial direction of the fixing member 20 is 4° to 13°.

[0061] From the above content, it can be known that the output surface 200 is perpendicular to the axial direction of the fixing member 20 ( Fig.10 The angle between the planes in the C direction ( Fig.10 ∠A) is an acute angle. On this basis, the present embodiment can make the angle between the output surface 200 and the plane perpendicular to the axial direction of the fixing member 20 be 4°~13°. When the angle between the output surface 200 and the plane perpendicular to the axial direction of the fixing member 20 is less than 4°, the inclination angle of the output surface 200 is too small, and the optical signal reflected by the output surface 200 will still be reflected to the optoelectronic chip 30, thereby causing light reflection oscillation between the output surface 200 and the optoelectronic chip 30, affecting the electrical signal output by the optoelectronic chip 30. When the angle between the output surface 200 and the plane perpendicular to the axial direction of the fixing member 20 is greater than 13°, the inclination angle of the optical fiber 11 of the output surface 200 is too large, which reduces the optical signal passing through the output end 110 of the optical fiber 11, thereby reducing the intensity of the optical signal, and further affecting the output of the electrical signal.

[0062] In summary, this embodiment makes the angle between the output surface 200 and the plane perpendicular to the axial direction of the fixing member 20 be 4° to 13°, which not only avoids the occurrence of light reflection oscillation between the output surface 200 and the optoelectronic chip 30 due to the inclination angle being too small, but also avoids the occurrence of the decrease of the optical signal output from the output end 110 of the optical fiber 11 due to the inclination angle being too large, so that the transmission effect of the optical signal and the effect of converting the optical signal into the electrical signal are better.

[0063] Please refer again Figure 10-12 In this embodiment, the output surface 200 includes an inclined surface 2003 and a reference surface 2004 bent and connected to the inclined surface 2003. The angle between the inclined surface 2003 and the plane perpendicular to the axial direction of the fixing member 20 is an acute angle, and the reference surface 2004 is perpendicular to the axial direction of the fixing member 20.

[0064] From the above content, it can be known that the angle between the output surface 200 and the plane in the axial direction of the fixing member 20 is an acute angle. On this basis, the output surface 200 can include an inclined surface 2003 and a reference surface 2004 in this embodiment. The inclined surface 2003 is the main surface of the output surface 200. The inclined surface 2003 is perpendicular to the plane in the axial direction of the fixing member 20 ( Fig.10 The angle between the planes in the C direction ( Fig.10 ∠A) is an acute angle. In other words, the inclined surface 2003 is the surface that prevents light reflection oscillation between the output surface 200 and the optoelectronic chip 30 in the above content. The reference surface 2004 is an auxiliary surface, which is mainly used to assist in the processing of the inclination angle of the fixing member 20. The inclined surface 2003 is bent and connected to the reference surface 2004. In other words, the inclined surface 2003 is connected to the reference surface 2004, but the inclined surface 2003 and the reference surface 2004 are not in the same plane. The reference surface 2004 is perpendicular to the axial direction of the fixing member 20, and is mainly used to provide a reference horizontal plane during the processing of the fixing member 20, so that the angle control when processing the inclined inclined surface 2003 is more accurate.

[0065] Please refer again Figure 10-12 In this embodiment, the fixing member 20 further includes an input surface 201 , and the input surface 201 and the output surface 200 are respectively arranged at opposite ends of the fixing member 20 , and the inclined surface 2003 is closer to the input surface 201 than the reference surface 2004 .

[0066] As can be seen from the above content, the output surface 200 includes an inclined surface 2003 for reflecting optical signals and a reference surface 2004 for providing a processing reference horizontal surface. On this basis, the present embodiment can make the fixing member 20 further include an output surface 200, and the output surface 200 and the input surface 201 are respectively arranged at opposite ends of the fixing member 20, and the inclined surface 2003 is closer to the input surface 201 than the reference surface 2004. In other words, the fixing member 20 has an input surface 201 and an output surface 200 arranged opposite to each other, and the through hole 21 is opened on the input surface 201 and the output surface 200. The side where the multiple optical fibers 11 are inserted is the input surface 201, and the side where the optical signals of the multiple optical fibers 11 are emitted is the output surface 200.

[0067] The inclined surface 2003 is closer to the input surface 201 than the reference surface 2004. In other words, the reference surface 2004 is farther away from the input surface 201 than the inclined surface 2003, that is, the horizontal reference surface 2004 is farther away from the other side of the fixing member 20 than the inclined inclined surface 2003. In other words, the reference surface 2004 is further outward, so that during the process of processing the fixing member 20, the processing equipment can more conveniently find the horizontal reference surface 2004, that is, the processing equipment only needs to cut along the inclined surface 2003 to complete the processing of the fixing member 20, avoiding the processing equipment from cutting in the horizontal direction, thereby making the processing of the fixing member 20 more convenient.

[0068] Please refer again Figure 2 , Fig.13 In this embodiment, the optical fiber 11 includes a core 113 , and the optical fiber 11 also includes a middle portion 112 located between the input end 111 and the output end 110 , and the input end 111 and the middle portion 112 also include a protective layer 114 arranged on the outer peripheral side of the core 113 .

[0069] From the above content, it can be known that the optical fiber 11 can be inserted into the through hole 21 and fixed to the fixing member 20. In this embodiment, the optical fiber 11 includes a core 113, which is the main part of the optical fiber 11 for transmitting optical signals. The optical fiber 11 also includes a middle part 112 located between the input end 111 and the output end 110. The input end 111 and the middle part 112 also include a protective layer 114 arranged on the outer peripheral side of the core 113. The protective layer 114 is used to protect the optical fiber 11. In other words, the optical fiber 11 of the input end 111 and the middle part 112 also has a protective layer 114 sleeved on the core 113.

[0070] That is to say, the optical fiber 11 at the output end 110 has only the core 113 but no protective layer 114, that is, only the core 113 at the output end 110 is inserted into the through hole 21. Usually, the core 113 is made of quartz, which has a relatively high hardness, and the protective layer 114 is usually made of a relatively soft material, which is arranged on the outer peripheral side of the core 113 to protect the core 113. In this embodiment, only the core 113 with a relatively hard material is inserted into the through hole 21, and the protective layer 114 with a relatively soft material does not enter the through hole 21, so that the optical fiber 11 will not shake in the through hole 21, that is, the transmission accuracy of the optical signal is higher and the transmission effect is more stable.

[0071] Please refer to Figure 14-15 , Fig.14 It is a schematic diagram of the cooperation of a fixing member, an optoelectronic chip, and a socket in another embodiment of the present application. Fig.15 for Fig.14In this embodiment, the plurality of optical fibers 11 are arranged in a straight line, the optoelectronic chip 30 has a receiving surface 300, the receiving surface 300 is used to receive the optical signal, and the angle between the receiving surface 300 and the plane perpendicular to the axial direction of the fixing member 20 is an acute angle.

[0072] The optical fibers 11 are arranged in a straight line. In other words, the optical fibers 11 extend in the same direction and are arranged in a row. The optoelectronic chip 30 has a receiving surface 300, which is used to receive optical signals. In other words, the optical signals of the optical fibers 11 are all irradiated on a side of the optoelectronic chip 30 that absorbs optical signals. The receiving surface 300 is perpendicular to the axial direction of the fixing member 20 ( Fig.14 The angle between the planes in the C direction ( Fig.14 In other words, the receiving surface 300 and the axial direction of the fixing member 20 are neither perpendicular nor parallel nor coincident, but the receiving surface 300 and the axial direction of the fixing member 20 are arranged at an angle, and the angle is an acute angle.

[0073] Specifically, when the optoelectronic chip 30 is disposed on one side of the output surface 200 of the fixing member 20, the optical signal is emitted from the output surface 200 and directly enters the optoelectronic chip 30. At this time, most of the optical signals entering the optoelectronic chip 30 are absorbed by the optoelectronic chip 30 and converted into electrical signals, but there is still a small amount of optical signals that are not absorbed by the optoelectronic chip 30. When the receiving surface 300 is perpendicular to the axial direction of the fixing member 20, the small amount of optical signals will be reflected back to the output surface 200 by the receiving surface 300, thereby causing optical reflection oscillation and affecting the electrical signal output by the optoelectronic chip 30.

[0074] This embodiment can make the angle between the receiving surface 300 of the optoelectronic chip 30 and the plane perpendicular to the axial direction of the fixing member 20 an acute angle, thereby avoiding the light signal reflected by the receiving surface 300 of the optoelectronic chip 30 from being reflected back to the output surface 200, thereby avoiding the generation of light reflection oscillation between the output surface 200 and the optoelectronic chip 30, and improving the stability of the electrical signal output by the optoelectronic chip 30.

[0075] Please refer again Figure 14-15 In this embodiment, the angle between the receiving surface 300 and a plane perpendicular to the axial direction of the fixing member 20 is 4° to 13°.

[0076] From the above content, it can be seen that the angle between the receiving surface 300 of the optoelectronic chip 30 and the plane perpendicular to the axial direction of the fixing member 20 is an acute angle. On this basis, this embodiment can make the receiving surface 300 and the plane perpendicular to the axial direction of the fixing member 20 ( Fig.14 The angle between the planes in the C direction ( Fig.14The angle of ∠B) is 4°~13°. When the angle between the receiving surface 300 and the plane perpendicular to the axial direction of the fixing member 20 is less than 4°, the receiving surface 300 is tilted at a too small angle, so that the optical signal reflected by the receiving surface 300 will still be reflected to the output surface 200, thereby causing optical reflection oscillation. When the angle between the receiving surface 300 and the plane perpendicular to the axial direction of the fixing member 20 is greater than 13°, the receiving surface 300 is tilted at a too large angle, so that the efficiency of the receiving surface 300 in receiving optical signals is reduced.

[0077] In summary, this embodiment makes the angle between the receiving surface 300 of the optoelectronic chip 30 and the plane perpendicular to the axial direction of the fixing member 20 4° to 13°, which not only avoids the light reflection oscillation between the output surface 200 and the optoelectronic chip 30 caused by the inclination angle of the receiving surface 300 being too small, but also avoids the efficiency of the receiving surface 300 receiving the optical signal being reduced due to the inclination angle of the receiving surface 300 being too large, thereby improving the transmission effect of the optical signal and the effect of converting the optical signal into the electrical signal.

[0078] Please refer again Figure 14-15 In this embodiment, the receiving surface 300 is disposed on one side of the output surface 200 , and the plane where the output surface 200 is located intersects with the plane where the receiving surface 300 is located.

[0079] From the above content, it can be known that the output surface 200 is perpendicular to the axial direction of the fixing member 20 ( Fig.14 The receiving surface 300 is arranged at an angle with the plane perpendicular to the axial direction of the fixing member 20 (in the C direction), and the receiving surface 300 is also arranged at an angle with the plane perpendicular to the axial direction of the fixing member 20. On this basis, in this embodiment, the receiving surface 300 can be arranged on one side of the output surface 200, and the plane where the output surface 200 is located intersects with the plane where the receiving surface 300 is located. In other words, the receiving surface 300 is arranged at an angle with the output surface 200, that is, the receiving surface 300 is not parallel to the output surface 200.

[0080] When the receiving surface 300 is parallel to the output surface 200, a small amount of light signal that is not completely absorbed by the receiving surface 300 will be reflected back to the output surface 200. This small amount of light signal will be reflected back to the receiving surface 300 by the output surface 200, thereby causing light reflection oscillation between the output surface 200 and the optoelectronic chip 30, affecting the stability of the electrical signal output of the optoelectronic chip 30. In this embodiment, the output surface 200 and the receiving surface 300 are arranged at an angle to each other on the basis of inclination, that is, the output surface 200 and the receiving surface 300 are not parallel, thereby avoiding light reflection oscillation between the output surface 200 and the optoelectronic chip 30, affecting the stability of the electrical signal output of the optoelectronic chip 30.

[0081] Please refer again Figure 14-15In this embodiment, the photodetector assembly 1 also includes a tube socket 41, the output surface 200, the receiving surface 300, and the tube socket 41 are stacked in sequence; the output surface 200 includes a first surface 2001 and a second surface 2002 that are relatively arranged, the receiving surface 300 includes a third surface 3003 located on the same side as the first surface 2001, and a fourth surface 3004 located on the same side as the second surface 2002; the first surface 2001 is closer to the tube socket 41 than the second surface 2002, and the fourth surface 3004 is closer to the tube socket 41 than the third surface 3003.

[0082] From the above content, it can be known that the output surface 200 of the fixing member 20 and the receiving surface 300 of the optoelectronic chip 30 are perpendicular to the axial direction of the fixing member 20 ( Fig.14 In this embodiment, the photodetector assembly 1 further includes a tube base 41, and the tube base 41, the output surface 200, and the receiving surface 300 are sequentially stacked. In other words, the tube base 41, the output surface 200, and the receiving surface 300 are correspondingly arranged, and the receiving surface 300 is arranged between the tube base 41 and the output surface 200.

[0083] The output surface 200 includes a first surface 2001 and a second surface 2002 that are arranged opposite to each other. In other words, the first surface 2001 is arranged on one side of the output surface 200, and the other side of the output surface 200 is the second surface 2002. The receiving surface 300 includes a third surface 3003 located on the same side as the first surface 2001, and a fourth surface 3004 located on the same side as the second surface 2002. In other words, the first surface 2001 of the output surface 200 and the third surface 3003 of the receiving surface 300 are located on the same side of the multiple optical signals, and the second surface 2002 of the output surface 200 and the fourth surface 3004 of the receiving surface 300 are located on the other side of the multiple optical signals. That is to say, Fig.15 As shown, the output surface 200 on the left is the first surface 2001 , the output surface 200 on the right is the second surface 2002 , the receiving surface 300 on the left is the third surface 3003 , and the receiving surface 300 on the right is the fourth surface 3004 .

[0084] The first surface 2001 is closer to the tube base 41 than the second surface 2002, and the fourth surface 3004 is closer to the tube base 41 than the third surface 3003. In other words, when the first surface 2001 is close to the tube base 41, the third surface 3003 located on the same side as the first surface 2001 is away from the tube base 41. Fig.15As shown, when the receiving surface 300 tilts upward from left to right, the output surface 200 tilts downward from left to right. When the receiving surface 300 tilts downward from left to right, the output surface 200 tilts upward from left to right. That is, the tilting directions of the receiving surface 300 and the output surface 200 are opposite, so that the angle between the receiving surface 300 and the output surface 200 is larger, thereby avoiding light reflection oscillation between the optoelectronic chip 30 and the output surface 200.

[0085] Please refer to Figure 2 , Fig.16 , Fig.16 The three-dimensional structure diagram of the fixing member, optoelectronic chip, and socket in one embodiment of the present application is shown in FIG. In this embodiment, the receiving surface 300 has a plurality of incident points 301, and the plurality of incident points 301 are positions where the plurality of optical signals are irradiated on the optoelectronic chip 30. Along the arrangement direction of the plurality of incident points 301, the receiving surface 300 has a first end 3001 and a second end 3002, and the distance between the first end 3001 and the fixing member 20 is the same as the distance between the second end 3002 and the fixing member 20.

[0086] The receiving surface 300 has a plurality of incident points 301, which are positions where a plurality of optical signals are irradiated onto the optoelectronic chip 30. In other words, the incident points 301 where the optical signals outputted by the plurality of optical fibers 11 arranged in a straight line are irradiated onto the optoelectronic chip 30 are also arranged in a straight line, and the straight line where the plurality of incident points 301 are located divides the receiving surface 300 into two parts. Along the arrangement direction of the plurality of incident points 301, the receiving surface 300 has a first end 3001 and a second end 3002. In other words, the intersection points of the straight line where the plurality of incident points 301 are located and the opposite sides of the receiving surface 300 are the first end 3001 and the second end 3002, respectively.

[0087] The distance between the first end 3001 and the fixing member 20 is the same as the distance between the second end 3002 and the fixing member 20. In other words, when the receiving surface 300 is tilted, the distance between the first end 3001 and the fixing member 20 needs to be kept equal to the distance between the second end 3002 and the fixing member 20. That is to say, when the receiving surface 300 is tilted, it can only be tilted with the straight line where the multiple injection points 301 are located as the axis. In this way, the distances between the multiple injection points 301 and the fixing member 20 are the same, that is, the optical paths of the optical signals are the same, thereby making the matching degree between the multiple optical fiber 11 lines better.

[0088] It can be seen from the above content that the angle between the receiving surface 300 and the plane perpendicular to the axial direction of the fixing member 20 is an acute angle. The present application proposes two methods of achieving the inclination of the receiving surface 300, which will be described in detail below.

[0089] Please refer to Fig.17 , Fig.17Schematic diagram of the exploded view of the optoelectronic chip and the socket in one embodiment of the present application. In this embodiment, the photodetector assembly 1 further includes a packaging assembly 40, the packaging assembly 40 includes a socket 41, the socket 41 has an inclined groove 410, the bottom surface of the inclined groove 410 and the plane perpendicular to the axial direction of the fixing member 20 form an acute angle, the optoelectronic chip 30 is fixed to the bottom surface of the inclined groove 410, so that the receiving surface 300 and the plane perpendicular to the axial direction of the fixing member 20 form an acute angle.

[0090] In one embodiment, the photodetector assembly 1 further includes a packaging assembly 40, which is used to package the photoelectric chip 30. The packaging assembly 40 includes a tube seat 41, which is used to carry various parts, and the tube seat 41 has an inclined groove 410. The bottom surface of the inclined groove 410 is perpendicular to the axial direction of the fixing member 20 ( Fig.17 The angle between the planes in the C direction ( Fig.17 ∠B) is an acute angle, and the optoelectronic chip 30 is fixed to the bottom surface of the inclined groove 410. In other words, the inclination direction of the optoelectronic chip 30 is the same as the inclination direction of the bottom surface of the inclined groove 410, so that the angle between the receiving surface 300 and the axial direction perpendicular to the fixing member 20 is an acute angle.

[0091] That is, the optoelectronic chip 30 is fixed to the bottom surface of the inclined groove 410 to achieve the inclination of the optoelectronic chip 30, that is, the receiving surface 300 is also inclined at the same angle. By providing the inclined groove 410 on the stem 41 and fixing the optoelectronic chip 30 to the bottom surface of the inclined groove 410 to achieve the inclination of the receiving surface 300 of the optoelectronic chip 30, the operating cost of the inclination of the receiving surface 300 is reduced.

[0092] Please refer to Fig.18 , Fig.18 This is a schematic diagram of the cooperation between the optoelectronic chip and the tube holder in another embodiment of the present application. In this embodiment, the photodetector assembly 1 also includes a packaging assembly 40, the packaging assembly 40 includes a tube holder 41 and a fixing block 43, the fixing block 43 is fixed to one side of the tube holder 41, the optoelectronic chip 30 is fixed to a side of the fixing block 43 away from the tube holder 41, and the angle between the side of the fixing block 43 facing the optoelectronic chip 30 and the plane perpendicular to the axial direction of the fixing member 20 is an acute angle, so that the angle between the receiving surface 300 of the optoelectronic chip 30 and the plane perpendicular to the axial direction of the fixing member 20 is an acute angle.

[0093] In another embodiment, the photodetector assembly 1 includes a packaging assembly 40 for packaging the optoelectronic chip 30. The packaging assembly 40 includes a tube seat 41 and a fixing block 43. The tube seat 41 is used to carry various parts, and the fixing block 43 is used to fix the optoelectronic chip 30 to the tube seat 41. The fixing block 43 is fixed to one side of the tube seat 41, and the optoelectronic chip 30 is fixed to the side of the fixing block 43 facing away from the tube seat 41. In other words, the optoelectronic chip 30, the fixing block 43, and the tube seat 41 are stacked and fixed in sequence. The side of the fixing block 43 facing the optoelectronic chip 30 is perpendicular to the axial direction of the fixing member 20 ( Fig.18 The angle between the planes in the C direction ( Fig.18 ∠B) is an acute angle, so that the angle between the receiving surface 300 of the optoelectronic chip 30 and the plane perpendicular to the axial direction of the fixing member 20 is an acute angle. In other words, the angle between the surface of the fixing block 43 used to fix the optoelectronic chip 30 and the plane perpendicular to the axial direction of the fixing member 20 is an acute angle, so that the receiving surface 300 of the optoelectronic chip 30 fixed thereon is also inclined in the same direction.

[0094] That is, the optoelectronic chip 30 is fixed to the surface of the inclined fixing block 43, thereby achieving the inclination of the optoelectronic chip 30, that is, the receiving surface 300 is also inclined at the same angle. By making the surface of the fixing block 43 used for fixing the optoelectronic chip 30 an inclined surface, the receiving surface 300 of the optoelectronic chip 30 fixed thereon is also inclined, thereby reducing the operating cost of the inclination of the receiving surface 300.

[0095] Please refer again Figure 2 , Figure 3 , Fig. 9 In this embodiment, the photodetector assembly 1 includes a connecting assembly 50, and the connecting assembly 50 includes a first connecting member 51 and an adhesive member. The fixing member 20 is fixed in the first connecting member 51. The inner wall of at least one end of the first connecting member 51 has a glue groove 510. The adhesive member is arranged in the glue groove 510. One side of the adhesive member is bonded to the fixing member 20, and the other side is bonded to the first connecting member 51.

[0096] In this embodiment, the photodetector assembly 1 further includes a connection assembly 50 and a packaging assembly 40. The connection assembly 50 is mainly used to fix the fixing member 20 and the optoelectronic chip 30. The connection assembly 50 includes a first connection member 51 and an adhesive member (the adhesive member is not shown in the figure), and the fixing member 20 is fixed in the first connection member 51. The inner wall of at least one end of the first connection member 51 has a glue groove 510, and the adhesive member is arranged in the glue groove 510, and one side of the adhesive member is bonded to the fixing member 20, and the other side is bonded to the first connection member 51. In other words, the first connection member 51 is sleeved on the fixing member 20, and the first connection member 51 and the fixing member 20 are fixed by adhesive bonding. And the two ends of the first connection member 51 face one side of the fixing member 20, that is, the inner wall of the two ends of the first connection member 51 has a glue groove 510, and the adhesive member is arranged in the glue groove 510 and the adhesive member simultaneously connects the first connection member 51 and the fixing member 20, so that the first connection member 51 and the fixing member 20 are fixed more firmly.

[0097] Optionally, the photodetector assembly 1 further includes a packaging assembly 40, the packaging assembly 40 includes a tube seat 41 and a tube cap 42, and the tube seat 41 and the tube cap 42 together constitute a packaging space for accommodating components such as the optoelectronic chip 30. The connecting assembly 50 also includes a second connecting member 52 and a third connecting member 53, wherein the third connecting member 53 is used to fix the connecting tube cap 42. The second connecting member 52 is used to adjust the relative position between the first connecting member 51 and the third connecting member 53, thereby indirectly adjusting the relative position between the fixing member 20 and the optoelectronic chip 30, that is, to allow the optical signal to stably irradiate the receiving area of ​​the optoelectronic chip 30.

[0098] Further optionally, the packaging component 40 also includes a plurality of wires 44 and a plurality of pins 45 , the wires 44 are used to electrically connect the optoelectronic chip 30 and the pins 45 , and the pins 45 are used to transmit electrical signals to other components.

[0099] Optionally, the photoelectric detector assembly 1 further includes a protective cover, which is sleeved on the connecting assembly 50 to protect the connecting assembly 50. Further optionally, the material of the protective cover includes but is not limited to a heat shrink tube, a rubber tube, etc.

[0100] Please refer to Fig.19 , Fig.19 Schematic diagram of a balanced photodetector in one embodiment of the present application. This embodiment provides a balanced photodetector 2, the balanced photodetector 2 includes a differential component 3 and a photodetector component 1 as provided in the above embodiment of the present application, the differential component 3 is electrically connected to the photodetector component 1, and the differential component 3 is used to differentially process the electrical signal output by the photodetector component 1.

[0101] The balanced photodetector provided in this embodiment includes a differential component 3 and a photodetector component 1 as provided in the above embodiment of the present application. The photodetector component 1 is electrically connected to the differential component 3, wherein the photodetector component 1 is used to receive an optical signal and convert the optical signal into an electrical signal. The differential component 3 is used to perform differential processing on the electrical signal transmitted from the photodetector component 1, thereby outputting a stable electrical signal with a high signal-to-noise ratio. By adopting the photodetector component 1 provided in the above embodiment of the present application, the matching degree between the multiple optical fibers 11 lines of the balanced photodetector 2 is high, and the electrical signal obtained after differential processing is stable, which improves the common mode rejection ratio of the balanced photodetector 2 and improves the stability of the arrangement of the multiple optical fibers 11.

[0102] In the description of the present application, it is necessary to understand that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0103] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0104] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0105] The above describes the contents provided by the implementation methods of the present application in detail, and describes and illustrates the principles and implementation methods of the present application. These descriptions are only used to help understand the method and its core ideas of the present application. However, the contents of this specification should not be construed as limiting the present application, and those skilled in the art may make various changes and modifications to the present application without departing from the spirit and scope of the present application. These modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents.

Claims

1. A photodetector assembly, characterized in that: The photodetector assembly comprises: The optical transmission component comprises a plurality of optical fibers, each of the optical fibers comprises an input end and an output end which are arranged opposite to each other, the input end is used to input an optical signal, and the output end is used to output the optical signal; A fixing member, provided with a plurality of through holes, wherein the output end of each optical fiber is inserted into the through hole and fixed to the fixing member, and the optical signal outputted by the output end can be emitted from the fixing member; An optoelectronic chip is used to receive optical signals output from the output ends of the multiple optical fibers.

2. The photodetector assembly according to claim 1, wherein: The fixing member has an output surface for emitting the optical signal, and an angle between the output surface and a plane perpendicular to the axial direction of the fixing member is an acute angle.

3. The photodetector assembly according to claim 2, wherein: The angle between the output surface and a plane perpendicular to the axial direction of the fixing member is 4° to 13°.

4. The photodetector assembly according to claim 2, wherein: The output surface includes an inclined surface and a reference surface bent and connected to the inclined surface, the angle between the inclined surface and a plane perpendicular to the axial direction of the fixing member is an acute angle, and the reference surface is perpendicular to the axial direction of the fixing member.

5. The photodetector assembly according to claim 4, wherein: The fixing member further includes an input surface, wherein the input surface and the output surface are respectively arranged at two opposite ends of the fixing member, and the inclined surface is closer to the input surface than the reference surface.

6. The photodetector assembly of claim 1, wherein: The optical fiber includes a core, and the optical fiber also includes a middle portion located between the input end and the output end. The input end and the middle portion also include a protective layer arranged on the outer periphery of the core.

7. The photodetector assembly of claim 1, wherein: The multiple optical fibers are arranged in a straight line, the optoelectronic chip has a receiving surface, the receiving surface is used to receive the optical signal, and the angle between the receiving surface and a plane perpendicular to the axial direction of the fixing member is an acute angle.

8. The photodetector assembly of claim 7, wherein: The angle between the receiving surface and a plane perpendicular to the axial direction of the fixing member is 4° to 13°.

9. The photodetector assembly of claim 3, wherein: The optoelectronic chip has a receiving surface for receiving the optical signal, the receiving surface is arranged on one side of the output surface, and the plane where the output surface is located intersects with the plane where the receiving surface is located.

10. The photodetector assembly of claim 9, wherein: The photodetector assembly also includes a tube socket, the output surface, the receiving surface, and the tube socket are stacked in sequence; the output surface includes a first surface and a second surface that are arranged opposite to each other, the receiving surface includes a third surface located on the same side as the first surface, and a fourth surface located on the same side as the second surface; the first surface is closer to the tube socket than the second surface, and the fourth surface is closer to the tube socket than the third surface.

11. The photodetector assembly of claim 7, wherein: The receiving surface has a plurality of incident points, which are positions where the optical signals irradiate the optoelectronic chip. Along the arrangement direction of the plurality of incident points, the receiving surface has a first end and a second end, and the distance between the first end and the fixing member is the same as the distance between the second end and the fixing member.

12. The photodetector assembly of claim 7, wherein: The photoelectric detector assembly also includes a packaging assembly, which includes a tube seat, and the tube seat has an inclined groove, and the angle between the bottom surface of the inclined groove and the plane perpendicular to the axial direction of the fixing member is an acute angle, and the photoelectric chip is fixed to the bottom surface of the inclined groove so that the angle between the receiving surface and the plane perpendicular to the axial direction of the fixing member is an acute angle.

13. The photodetector assembly of claim 7, wherein: The photoelectric detector assembly also includes a packaging assembly, which includes a tube seat and a fixing block, wherein the fixing block is fixed to one side of the tube seat, and the photoelectric chip is fixed to a side of the fixing block facing away from the tube seat, and the angle between a side of the fixing block facing the photoelectric chip and a plane perpendicular to the axial direction of the fixing member is an acute angle, so that the angle between the receiving surface of the photoelectric chip and the plane perpendicular to the axial direction of the fixing member is an acute angle.

14. The photodetector assembly of claim 1, wherein: The photoelectric detector assembly includes a connecting assembly, which includes a first connecting member and an adhesive member. The fixing member is fixed in the first connecting member. The inner wall of at least one end of the first connecting member has a glue groove. The adhesive member is arranged in the glue groove. One side of the adhesive member is bonded to the fixing member, and the other side is bonded to the first connecting member.

15. A balanced photodetector, characterized in that: The balanced photodetector includes a differential component and a photodetector component as described in any one of claims 1 to 14, wherein the differential component is electrically connected to the photodetector component, and the differential component is used for differentially processing an electrical signal output by the photodetector component.

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