Display module, preparation method thereof and display device

Abstract

The invention provides a display module, a preparation method thereof and a display device.The preparation method of the display module comprises the steps that a to-be-processed display module is obtained, the to-be-processed display module comprises a display area and a frame area located on the periphery of the display area, and the to-be-processed display module further comprises a bonding area and an edge area; the bonding area is located on one side of the frame area close to the display area, and the edge area is located on one side of the frame area away from the display area. And forming a cutting channel in an area between the bonding area and the edge area. And a blocking dam is formed between the cutting channel and the bonding area. According to the preparation method of the display module, the problem of signal line short circuit caused by cutting can be solved by arranging the blocking dam, so that the cutting yield is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular, to a display module and a preparation method thereof, and a display device. Background Art

[0002] In the preparation process of the display module, because it involves a high-temperature process, the substrate of the motherboard used to form the display module is usually made of high-temperature resistant materials. Therefore, in the subsequent cutting process, the motherboard needs to be cut with high energy, which will cause the edge of the substrate to melt and produce carbonization. At the same time, the broken leads will also produce metal debris at the cutting point. Under the influence of carbonization, there is a short circuit problem between the leads, which reduces the cutting yield. Therefore, how to improve the cutting yield in the display module process has become an urgent problem to be solved. Summary of the invention

[0003] The present disclosure provides a display module and a preparation method thereof, and a display device. By setting a blocking dam between a cutting path and a bonding area, the risk of a short circuit between a bonding terminal and a display module is reduced, thereby improving the cutting yield in the display module manufacturing process.

[0004] A first aspect of the present disclosure provides a method for preparing a display module, the method comprising: obtaining a display module to be processed, wherein the display module to be processed comprises a display area and a frame area located outside the display area, the display module to be processed further comprises a bonding area and an edge area, the bonding area is located on a side of the frame area close to the display area, and the edge area is located on a side of the frame area away from the display area; forming a cutting path in the area between the bonding area and the edge area; and forming a blocking dam between the cutting path and the bonding area.

[0005] In the above solution, the barrier dam between the bonding area and the cutting path can prevent the film material in the subsequent process, such as the bonding process, from overflowing into the cutting path, thereby reducing the risk of signal short circuit problems.

[0006] In a specific embodiment of the first aspect of the present disclosure, the method for preparing the display module further includes: forming an anisotropic conductive adhesive film layer in a bonding area of ​​the display module to be processed; and bonding the structure to be bonded to the bonding area.

[0007] In the above scheme, during the formation of the anisotropic conductive film layer, it is difficult to overflow into the cutting path due to the blocking of the blocking dam, thereby reducing the risk of signal short circuit caused by the bonding terminal and the conductive layer being connected through the anisotropic conductive film layer when the cutting path is cut to the conductive layer.

[0008] Optionally, in a direction perpendicular to the display module to be processed, the height of the anisotropic conductive adhesive film layer is less than or equal to the height of the blocking dam, so that the blocking dam can prevent the anisotropic conductive adhesive from overflowing into the cutting path.

[0009] Optionally, in a direction perpendicular to the display module to be processed, the height of the anisotropic conductive adhesive film layer is less than the height of the blocking dam, so that the blocking dam can effectively prevent the anisotropic conductive adhesive from overflowing into the cutting path.

[0010] Optionally, in a cross section perpendicular to the display module to be processed and perpendicular to the extension direction of the barrier dam, the cross section of the barrier dam is in the shape of a regular trapezoid. In this way, the barrier dam can not only effectively prevent the anisotropic conductive adhesive from overflowing into the cutting path, but also improve its own impact resistance. At the same time, the processing technology of the barrier dam with a regular trapezoidal cross section is mature, which reduces the production difficulty and processing cost.

[0011] In a specific implementation of the first aspect of the present disclosure, in the extension direction of the scribe line, the length of the barrier dam is greater than or equal to the length of the anisotropic conductive adhesive film layer.

[0012] In the above solution, by setting the relative lengths of the barrier dam and the anisotropic conductive adhesive film layer in the extending direction of the cutting street, the cutting street can be protected more effectively to prevent the anisotropic conductive adhesive from overflowing into the cutting street.

[0013] In a specific embodiment of the first aspect of the present disclosure, after the step of forming an anisotropic conductive adhesive film layer in the bonding area of ​​the display module to be processed and before the step of bonding the structure to be bonded to the bonding area, the preparation method also includes: heating the display module to be processed to change the blocking dam from a solid state to a liquid state, and the liquid blocking dam flows into the cutting path to fill the cutting path to form a filling layer.

[0014] In the above solution, the barrier dam flowing toward the cutting street eventually forms a filling layer, which can isolate other film layers, such as anisotropic conductive adhesive film layers, from direct contact with the film layer exposed by the cutting street.

[0015] Optionally, a heat pressing method is used to bond the structure to be bonded to the bonding area, and the temperature of the heat pressing method is greater than the temperature of the heat treatment of the display module to be treated.

[0016] In a specific embodiment of the first aspect of the present disclosure, the material of the barrier dam includes a hot-melt insulating material.

[0017] In the above solution, the filling layer formed by the barrier dam can play a good role in physical insulation, thereby preventing the signal short circuit problem caused by the cutting path cutting into the conductive layer.

[0018] In a specific embodiment of the first aspect of the present disclosure, a display module to be processed includes a substrate and a conductive connector and a lead located on the surface of the substrate, an anisotropic conductive adhesive film layer is located on the side of the conductive connector and the lead facing away from the substrate, one end of the lead is connected to the conductive connector, and the other end of the lead extends away from the conductive connector to an edge area of ​​the display module to be processed, wherein in the step of forming a cutting path in the area between the bonding area and the edge area, the preparation method includes: cutting the lead in a direction perpendicular to the extension direction of the lead to form a cutting path.

[0019] In the above solution, the cutting path cuts off the lead wire, which can improve the problem of carbonization of the edge of the display module to be processed and metal debris after the lead wire is cut, which leads to the signal path.

[0020] Optionally, the display module also includes an array film layer, which is arranged between the substrate and the conductive connector and the lead. In the step of cutting the lead to form a cutting path, the cutting depth is greater than the thickness of the lead and less than the sum of the thickness of the lead and the thickness of the array film layer.

[0021] Optionally, the array film layer includes a conductive layer, and the cutting path is cut to a surface of the conductive layer facing away from the substrate, or is cut into the conductive layer, or penetrates the conductive layer.

[0022] Optionally, the conductive layer is a semiconductor conductive layer.

[0023] In a specific implementation of the first aspect of the present disclosure, the lead is cut by laser cutting.

[0024] In the above scheme, laser cutting is easy to control, which is beneficial to improving cutting accuracy.

[0025] Optionally, the laser is a pulsed laser.

[0026] Optionally, the pulse laser is a picosecond pulse laser or a green laser or an ultraviolet laser.

[0027] The second aspect of the present disclosure provides a display module, which includes a display area and a frame area located outside the display area. The display module also includes a bonding area and an edge area. The bonding area is located on the frame area and on a side close to the display area, and the edge area is located on the frame area and on a side away from the display area. A cutting path is formed in the area between the bonding area and the edge area. The display module includes a substrate, a filling layer and an anisotropic conductive film layer. The filling layer is located on the substrate, and the filling layer fills and covers the cutting path. The anisotropic conductive film layer covers the surface of the filling layer on one side away from the substrate, and at least part of the anisotropic conductive film layer is located in the bonding area.

[0028] In the above scheme, the filling layer isolates the anisotropic conductive film layer from entering the cutting path and directly contacts the film layer in the cutting path, thereby preventing the cutting path from cutting to the conductive layer and causing the anisotropic conductive film layer to connect the conductive layer and the bonding terminal, resulting in a signal short circuit.

[0029] In a specific embodiment of the second aspect of the present disclosure, the display module further comprises at least one conductive connector, a lead and a conductive layer. The conductive connector is located between the substrate and the anisotropic conductive film layer. The lead is located between the substrate and the anisotropic conductive film layer, one end of the lead is connected to the conductive connector, and the other end of the lead extends to the cutting path and ends at the cutting path. The conductive layer is located between the substrate and the lead, wherein the cutting path is located on the surface of the conductive layer facing away from the substrate and is adjacent to the conductive layer or located in the conductive layer or passes through the conductive layer.

[0030] In the above scheme, the cutting path in the display module is formed by shift cutting, which can solve the problem of carbonization of the edge of the display module and short circuit of the lead at the carbonization point, and the filling layer located in the cutting path can improve the problem of shift cut cutting to the conductive layer that may occur after the shift cut process, resulting in short circuit of the channel in the display module.

[0031] Optionally, the material of the filling layer includes hot-melt insulating material.

[0032] Optionally, a plurality of conductive connectors are provided, and the plurality of conductive connectors include bonding electrodes for bonding circuit structures and detection terminals for electrical performance detection.

[0033] A third aspect of the present disclosure provides a display device, which includes a display module obtained by the preparation method in the first aspect or includes the display module in the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A schematic diagram of a method for preparing a display module provided in accordance with an embodiment of the present disclosure.

[0035] Figure 2 A schematic flow chart of a method for preparing a display module provided in accordance with an embodiment of the present disclosure.

[0036] Figure 3 A schematic diagram of a method for preparing a display module provided in accordance with an embodiment of the present disclosure.

[0037] Figure 4 A schematic diagram of a process for forming an anisotropic conductive film layer in a bonding area provided by an embodiment of the present disclosure.

[0038] Figure 5A cross-sectional schematic diagram of a display module to be processed provided in one embodiment of the present disclosure.

[0039] Figure 6 A cross-sectional schematic diagram of a display module to be processed provided in one embodiment of the present disclosure.

[0040] Figure 7 A cross-sectional schematic diagram of a display module to be processed provided in one embodiment of the present disclosure.

[0041] Figure 8 A schematic plan view of a display module to be processed provided in one embodiment of the present disclosure.

[0042] Fig. 9 A schematic plan view of a display module to be processed provided in one embodiment of the present disclosure.

[0043] Fig.10 A cross-sectional schematic diagram of a display module to be processed provided in another embodiment of the present disclosure.

[0044] Fig.11 A cross-sectional schematic diagram of a display module to be processed provided in one embodiment of the present disclosure.

[0045] Fig.12 A cross-sectional schematic diagram of a display module to be processed provided in another embodiment of the present disclosure.

[0046] Fig.13 A cross-sectional schematic diagram of a display module to be processed provided in another embodiment of the present disclosure.

[0047] Fig.14 A schematic diagram of a method for preparing a display module provided in accordance with an embodiment of the present disclosure.

[0048] Fig.15 A cross-sectional schematic diagram of a display module provided by an embodiment of the present disclosure.

[0049] Reference numerals:

[0050] 100-display module to be processed; AA-display area; BZ-frame area; BB-bonding area; C-cutting road; E-edge area; 110-blocking dam; 111-filling layer; 120-anisotropic conductive film layer; 130-structure to be bonded; 140-substrate; 150-conductive connector; 160-lead; 170-array film layer; 171-conductive layer; 171a-semiconductor conductive layer; H1-height of anisotropic conductive film layer; L1-length of anisotropic conductive film layer; H2-height of blocking dam; L2-length of blocking dam;

[0051] 200-Encapsulation layer. DETAILED DESCRIPTION

[0052] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0053] In the industrial mass production of display modules, due to the complexity and numerous links of the production process, various factors that affect the electrical performance of the motherboard of the display module may appear. Therefore, it is necessary to test the electrical performance of the motherboard of the prepared display module to ensure the product quality of the display module finally prepared. Generally speaking, in order to test the electrical performance of the motherboard of the above-mentioned display module, a detection terminal for electrical performance detection and a lead connected from the detection terminal are set in the area corresponding to each single panel (multiple single panels constitute the motherboard of the display module). The part of the lead is usually on the cutting path. Therefore, when the motherboard of the display module is cut, the lead located on the cutting path is usually cut off. Then, after the lead is cut, some problems may arise, such as the broken lead may produce metal debris at the cutting position, so that the leads near the cutting position on the cut single panel are fused together, thereby causing a short circuit between the leads; or the cutting edge of the substrate of the motherboard of the display module is melted and carbonized under the influence of high energy, affecting the leads at the cutting position, resulting in problems such as short circuit of the signal line.

[0054] In order to improve this problem, Shift Cut is applied to the cutting process of the motherboard of the display module. After the motherboard of the display module is cut once, Shift Cut is performed by retracting the cutting edge by a certain distance. The retracted distance is determined according to the actual situation, and is generally a value obtained on the basis of avoiding the influence of carbonization and other problems on the leads. However, due to the continuous changes in the stacking and structure of the display module, this Shift Cut method also has shortcomings. For example, there is a problem that Shift Cut cuts to the conductive layer, resulting in a signal short circuit, thereby affecting the quality of the display module.

[0055] In view of this, the embodiments of the present disclosure provide a display module and a preparation method thereof, and a display device. The preparation method of the display module includes obtaining a display module to be processed, wherein the display module to be processed includes a display area and a frame area located outside the display area, and the display module to be processed also includes a bonding area and an edge area, wherein the bonding area is located on a side of the frame area close to the display area, and the edge area is located on a side of the frame area away from the display area. A cutting path is formed in the area between the bonding area and the edge area. And a blocking dam is formed between the cutting path and the bonding area. In this way, the blocking dam provided between the cutting path and the bonding area is used to prevent the film layer in the subsequent process from entering the cutting path and contacting with the film layer cut by the cutting path, such as the conductive layer, thereby reducing the probability of a signal line short circuit problem even if there is a shift cut to the conductive layer of the display module to be processed.

[0056] In the following, the preparation method of the display module and the display module according to at least one embodiment of the present disclosure are described in conjunction with the accompanying drawings. In addition, as shown in the accompanying drawings, in at least one embodiment of the present disclosure, a spatial rectangular coordinate system is established with the surface where the display module is located as a reference to define the positions of each film layer in the display module. In the spatial rectangular coordinate system, the X-axis and the Z-axis are parallel to the surface where the display module is located, and the Y-axis is perpendicular to the surface where the display module is located.

[0057] like Figure 1 As shown, a method for preparing a display module provided by at least one embodiment of the present disclosure includes the following steps:

[0058] Step S100: Obtain a display module 100 to be processed, the display module 100 to be processed includes a display area AA and a frame area BZ located outside the display area AA, the display module 100 to be processed also includes a bonding area BB and an edge area E, the bonding area BB is located on the frame area BZ and close to the display area AA, and the edge area E is located on the frame area BZ and away from the display area AA. Specifically, the display module 100 to be processed is a flexible display module, and the bonding area BB can be bent relative to the display area AA along the edge of the flexible display module, such as the short side, at a preset path and preset angle, and bent to the non-light-emitting side of the display module, thereby facilitating the realization of a narrow frame of the display module.

[0059] Step S200: forming a cutting path C in the area between the bonding area BB and the edge area E.

[0060] Exemplarily, the display module 100 to be processed includes a display area AA and a frame area BZ arranged around the display area AA. The frame area BZ is located outside the display area AA and is not used to realize the display function. It is mainly used to set the electrical modules of the display module, such as the driver chip, the flexible circuit board, the power management module, and the signal interface module, etc. In order to realize the narrow frame effect of the display module, the film layer of the frame area BZ is also thinned or removed. Figure 1 It can be seen that the film thickness of the border area BZ of the display module is less than the film thickness of the display area AA, which can be achieved by cutting the buffer layer and the planar layer.

[0061] The display module 100 to be processed further includes a bonding area BB and an edge area E, wherein the bonding area BB is located on the side of the frame area BZ close to the display area AA, and the edge area E is located on the side of the frame area BZ away from the display area AA. In addition, in the method for preparing the display module, a cutting path C is formed in the area between the bonding area BB and the edge area E by cutting, for example, Shift Cut. For example, in the method for preparing the display module, a motherboard of the display module is cut into a plurality of independent single-piece panels using a first laser. At this time, the independent single-piece panels may have problems such as short circuit of the leads 160 at the cutting location due to the carbonization problem of the cutting edge mentioned above. Therefore, the independent single-piece panels are subjected to a second cutting, i.e., Shift Cut, to obtain the display module 100 to be processed having a cutting path C.

[0062] Step S300: forming a barrier dam 110 between the scribe line C and the bonding area BB.

[0063] For example, on the display module 100 to be processed, a blocking dam 110 is formed in the area between the cutting path C and the bonding area BB. The blocking dam 110 can prevent the film layer in the direction from the bonding area BB to the display area AA from flowing into the cutting path C during the manufacturing process. In this way, when the cutting path C cuts to the conductive layer of the display module 100 to be processed, the problem of signal short circuit caused by the film layer entering the cutting path C in the subsequent process such as the bonding process is also improved. In addition, the blocking dam 110 can be formed by any one of a photolithography process, a printing process or a deposition process, which will not be described in detail here.

[0064] It should be noted that the embodiment of the present disclosure does not limit the specific structure of the display module 100 to be processed. It can be obtained by cutting the motherboard of the display module once and then shift cutting as described above during the preparation process of the display module, or it can be obtained in other ways. The present disclosure does not make any specific limitations on the cutting path C on the display module 100 to be processed. For example, the cutting path C can be set to have neat edges, that is, the edge of the cutting path has no obvious jagged or curved shape. For another example, the cutting path C can be set to have a uniformly distributed width in the extension direction of the cutting path. In addition, the blocking dam 110 in the display module 100 to be processed in the present disclosure is not limited to the blocking dam 110 formed between the bonding area BB and the cutting path C in the above example, and can also include other types of blocking dams 110, such as the blocking dam 110 surrounding the display area AA of the display module 100 to be processed. All of the above can be designed according to actual needs and will not be elaborated here.

[0065] In the method for preparing a display module provided in the embodiment of the present disclosure, the method for preparing a display module further includes forming an anisotropic conductive film layer 120 in the bonding area BB of the display module to be processed 100, wherein the anisotropic conductive film layer is referred to as an ACF layer, and bonding the structure to be bonded 130 to the bonding area BB.

[0066] For example, Figure 2 and Figure 3 As shown, a method for preparing a display module is provided, and the preparation method comprises the following steps:

[0067] Step S100: obtaining a display module 100 to be processed, wherein the display module 100 to be processed includes a bonding area BB and an edge area E. The description of the display module 100 to be processed can refer to the above embodiment, and will not be repeated here.

[0068] Step S200: forming a cutting path C in the area between the bonding area BB and the edge area E. The description of this step can refer to the above embodiment and will not be repeated here.

[0069] Step S300: forming a barrier dam 110 between the cutting street C and the bonding area BB. The description of forming the barrier dam 110 can refer to the above embodiment and will not be repeated here.

[0070] Step S400 : forming an anisotropic conductive film layer 120 , ie, an ACF layer, in the bonding area BB of the display module 100 to be processed.

[0071] Exemplary, combined Figure 3 and Figure 4 As shown, the step of forming an anisotropic conductive adhesive film layer 120 in the bonding area BB of the display module 100 to be processed may include the following steps:

[0072] Step S401: Clean the bonding area BB. For example, use a corresponding cleaning agent and cleaning tool to clean the bonding area BB of the display module 100 to be processed, then rinse with deionized water and dry to make the bonding area BB surface clean and free of dust, oil and other impurities, thereby improving the bonding strength.

[0073] Step S402: Apply anisotropic conductive adhesive in the bonding area BB. Specifically, it can be completed by any of screen printing, dispensing, and spraying, which will not be described in detail here. In this step, the blocking dam 110 set between the bonding area BB and the cutting path C can prevent the anisotropic conductive adhesive, i.e., ACF, from flowing into the cutting path C, thereby reducing the risk of the anisotropic conductive adhesive overflowing into the cutting path C after the chip is bonded, and connecting the conductive layer 171 cut by the cutting path C to the structure to be bonded 130, thereby improving the problem of signal short circuit.

[0074] Step S403: curing the anisotropic conductive adhesive to form the anisotropic conductive adhesive film layer 120. Specifically, the anisotropic conductive adhesive can be cured by heat curing or light curing to form the anisotropic conductive adhesive film layer 120, which will not be described in detail herein.

[0075] Step S500: Bond the structure to be bonded 130 to the bonding area BB.

[0076] For example, the step of bonding the structure to be bonded 130 to the bonding area BB may include the following steps:

[0077] First, the structure 130 to be bonded, such as an integrated circuit (IC) or a flexible printed circuit (FPC), is accurately placed on the anisotropic conductive film layer 120 on the bonding area BB, ensuring that the pins of the IC or FPC, i.e., the IC Pin or the FPC Pin, are aligned with the panel pins, i.e., the Panel Pin, in the bonding area BB. Then, a pre-pressing operation is performed to make the IC or the FPC initially contact and bond with the anisotropic conductive film layer 120, and to discharge the air and excess glue between the chip or the flexible printed circuit and the anisotropic conductive film layer 120. After the pre-pressing operation, formal bonding is performed. Specifically, according to a preset bonding method, such as hot pressing bonding, ultrasonic bonding, etc., appropriate pressure, temperature, and time are applied to soften the conductive particles in the anisotropic conductive film layer 120 at high temperature and form a conductive path, and at the same time, the chip and the bonding area BB are firmly bonded together. In addition, the parameters in the pre-pressing operation and the formal bonding, such as pressure, time, temperature, etc., can be adjusted according to the characteristics of the anisotropic conductive adhesive and the characteristics of the structure 130 to be bonded, which will not be elaborated here.

[0078] In the method for preparing a display module provided by at least one embodiment of the present disclosure, in a direction perpendicular to the display module 100 to be processed, the height of the anisotropic conductive adhesive film layer 120 is less than or equal to the height of the blocking dam 110 .

[0079] For example, Figure 5As shown, in the method for preparing the display module, the barrier dam 110 is formed between the bonding area BB and the cutting line C of the display module 100 to be processed, and the height H1 of the barrier dam is the height of the barrier dam 110 in the direction perpendicular to the display module 100 to be processed. In the step after the barrier dam 110 is formed, an anisotropic conductive adhesive film layer 120 is formed on the bonding area BB of the display module 100 to be processed, and the coating thickness of the anisotropic conductive adhesive film layer 120, i.e., the height H2 of the anisotropic conductive adhesive film layer, is controlled based on the height H1 of the barrier dam, so that the height H2 of the anisotropic conductive adhesive film layer is less than the height H1 of the barrier dam. In this way, the barrier dam 110 can effectively prevent the coated anisotropic conductive adhesive from overflowing into the cutting line C on the other side of the barrier dam 110.

[0080] For example, Figure 6 As shown, in the method for manufacturing the display module, the height H2 of the anisotropic conductive adhesive film layer is equal to the height H1 of the blocking dam. Other descriptions can refer to the above embodiments and will not be repeated here.

[0081] In the method for preparing a display module provided by at least one embodiment of the present disclosure, in a cross section perpendicular to the display module 100 to be processed and perpendicular to the extension direction of the barrier dam 110 , the cross section of the barrier dam 110 is a regular trapezoid.

[0082] For example, Figure 7 As shown, the blocking dam 110 formed between the bonding area BB and the cutting path C of the display module 100 to be processed has a cross-sectional shape perpendicular to the thickness direction of the display module 100 to be processed, so that the cross-sectional shape of the right trapezoid makes the contact area between the wider bottom of the blocking dam 110 and the display module 100 to be processed larger, which can provide more stable support and better sealing, which helps to prevent the bonding material such as anisotropic conductive adhesive from leaking from the bonding area BB to the cutting path C. At the same time, when impacted by external force, the wider bottom of the blocking dam 110 can withstand greater pressure, while the gradually narrowing top can reduce stress concentration and reduce the risk of damage to the blocking dam 110 due to impact. In addition, the manufacturing and assembly process of the blocking dam 110 with a right trapezoidal cross-sectional shape is relatively mature, thereby improving production efficiency.

[0083] In the method for preparing the display module provided in the embodiment of the present disclosure, Figure 8As shown, referring to the schematic plan view of the display module 100 to be processed, in the extension direction of the cutting line C, the length L2 of the blocking dam is greater than or equal to the length L1 of the anisotropic conductive film layer. That is to say, in the process of forming the blocking dam 110 in step S200, the length of the bonding area BB of the display module in the Z direction can be referred to to control the length of the blocking dam 110 in the Z direction, so that the length L2 of the blocking dam is greater than or equal to the length L1 of the anisotropic conductive film layer.

[0084] In the preparation method of the display module provided in the embodiment of the present disclosure, the display module 100 to be processed includes a substrate 140 and a conductive connector 150 and a lead 160 located on the surface of the substrate 140, one end of the lead 160 is connected to the conductive connector 150, and the other end of the lead 160 extends to the edge area E of the display module 100 to be processed, wherein a cutting path C is formed between the bonding area BB and the edge area E of the display module 100 to be processed, including cutting the lead 160 along a direction perpendicular to the extension direction of the lead 160.

[0085] For example, Fig. 9 and Fig.10 As shown, in the display module manufacturing method, the display module 100 to be processed includes a substrate 140 and a plurality of conductive connecting members 150 and a plurality of leads 160 located on the substrate 140. The anisotropic conductive film layer 120 is located on the side of the conductive connecting members 150 and the leads 160 away from the substrate 140.

[0086] The substrate 140 may be a flexible substrate 140, such as PI (Polyimide) and / or PET (Polyethylene Terephthalate) film. The flexible substrate 140 may be melted and carbonized more seriously after being cut from the motherboard of the display module, which may more easily lead to a short circuit defect after the leads 160 adjacent to the cut position are welded.

[0087] The conductive connector 150 may be at least one of a detection terminal and a bonding terminal, one end of which may be respectively connected to the circuit to be tested and the pixel driving circuit in the driving circuit layer of the display module 100 to be processed, and the other end of which is connected to the lead 160, and the other end of the lead 160 extends to the edge area E of the display module 100 to be processed. Specifically, in the step of forming a cutting path C in the area between the bonding area BB and the edge area E, the preparation method cuts the lead 160 in a direction perpendicular to the extension direction of the lead 160 to form the cutting path C. At this time, the cutting path C is formed on the display module 100 to be processed, that is, the other end of the lead 160 extends to the cutting path C.

[0088] Based on the structure of the display module 100 to be processed, the embodiment of the present disclosure further defines the step of forming the cutting line C in the method for preparing the display module.

[0089] For example, Fig.11 , Fig.12 and Fig.13 As shown, in the method for preparing a display module provided by at least one embodiment of the present disclosure, the display module also includes an array film layer 170, and the array film layer 170 is arranged between the substrate 140 and the conductive connector 150 and the lead 160. In the step of cutting the lead 160 to form a cutting line C, the cutting depth is greater than the thickness of the lead 160 and less than the sum of the thickness of the lead 160 and the thickness of the array film layer 170. In other words, the step of cutting the lead 160 does not cut off the substrate 140 of the display module 100 to be processed.

[0090] In addition to the above structure, in the method for preparing a display module provided in at least one embodiment of the present disclosure, the array film layer 170 of the display module 100 to be processed further includes a conductive layer 171, and the conductive layer 171 is located between the substrate 140 and the lead 160. There are many design schemes for the relationship between the cutting line C and the conductive layer 171, for example, Fig.11 As shown, the cutting line C cuts to the surface of the conductive layer 171 facing away from the substrate 140, exposing the surface of the conductive layer 171 facing away from the substrate 140, which has the risk of contacting with the ACF layer. Fig.12 As shown in FIG. 1 , the cutting line C cuts into the conductive layer 171, exposing the side surface of the conductive layer 171. Fig.13 As shown, the cutting line C penetrates the conductive layer 171, that is, exposes the side surface of the conductive layer 171. In this way, the various design schemes between the cutting line C and the conductive layer 171 reduce the difficulty of forming the cutting line process and save production costs.

[0091] In the method for manufacturing a display module provided by at least one embodiment of the present disclosure, the conductive layer 171 is a semiconductor conductive layer 171 a .

[0092] Exemplarily, the semiconductor conductive layer 171a is an a-Si (amorphous silicon) layer, which is located on the substrate 140 and mainly plays the role of regulating electrical properties. For example, the a-Si conductive layer has certain conductivity and uniformity, and can evenly distribute the current input from the power supply or drive circuit to each pixel point. For the current input from the local power supply or drive chip, the a-Si conductive layer can also play a diffusion role. In addition, the a-Si conductive layer also plays an important role in accurately controlling and stabilizing the pixel voltage. Since the a-Si conductive layer is fully conductive, when the anisotropic conductive glue overflows and enters the cutting path C, it will cause the ACF layer to connect the bonding terminal and the a-Si conductive layer after the bonding process, resulting in a signal short circuit problem. The blocking dam 110 in the present disclosure reduces the risk of anisotropic conductive glue overflowing into the cutting path C, thereby reducing the risk of the above-mentioned signal short circuit problem.

[0093] It should be noted that the structure of the display module 100 to be processed is not limited to the structure in the above example. For example, the display module 100 to be processed may also include a light emitting device layer located on the substrate 140 and an encapsulation layer 200 on the side away from the substrate 140. Fig.15 All of the above can be designed according to actual needs and will not be elaborated here.

[0094] In the method for preparing the display module provided by the embodiment of the present disclosure, after forming the anisotropic conductive adhesive film layer 120 in the bonding area BB, before bonding the structure to be bonded 130 to the bonding area BB, the method further includes heating the display module to be processed 100 to convert the blocking dam 110 from a solid state to a liquid state, and the liquid blocking dam 110 flows into the cutting road C to fill the cutting road C. In at least one embodiment, the material of the blocking dam 110 includes a hot-melt insulating material.

[0095] For example, Fig.14 As shown, a method for preparing a display module is provided, and the preparation method comprises the following steps:

[0096] Step S100: obtaining a display module 100 to be processed, wherein the display module 100 to be processed includes a bonding area BB and an edge area E.

[0097] Step S200: forming a cutting path C in the area between the bonding area BB and the edge area E. The description of this step can refer to the above embodiment and will not be repeated here.

[0098] Step S300: forming a barrier dam 110 between the scribe line C and the bonding area BB.

[0099] Step S400 : forming an anisotropic conductive adhesive film layer 120 in the bonding area BB of the display module 100 to be processed.

[0100] Step S410 : heating the display module 100 to be processed, so that the barrier dam 110 changes from solid to liquid, and the liquid barrier dam 110 flows into the cutting street C to fill the cutting street C. For example, the material of the barrier dam 110 is a hot-melt insulating material.

[0101] In the process from step S400 to step S410, after the anisotropic conductive adhesive film layer 120 is formed in the bonding area BB of the display module 100 to be processed, the display module 100 to be processed is heated. At this time, the heating temperature causes the blocking dam 110 formed by the hot-melt insulating material to be transformed from a solid state to a liquid state, and the liquid blocking dam 110 is filled into the cutting path C. In this way, the blocking dam 110 can prevent the ACF from overflowing into the cutting path C during the preparation of the ACF layer when it is solid. When the blocking dam 110 is heated to a liquid state, it fills the cutting path C, and after cooling, a filling layer 111 is formed in the cutting path C, which plays a role of physical insulation protection. In this way, it can prevent the film layer from overflowing into the cutting path C during the subsequent preparation process, thereby improving the quality of the display module. Furthermore, in the display module 100 to be processed, the heating temperature allows the anisotropic conductive film layer 120 to be transformed into a flowable state after forming the filling layer 111 on the blocking dam 110, and to cover the side of the filling layer 111 away from the substrate 140. The heating temperature of this step is controlled to control the fluidity of the anisotropic conductive film layer 120, thereby reducing the risk of overflow.

[0102] Step S500: Bond the structure to be bonded 130 to the bonding area BB.

[0103] The specific operations of step S100, step S200, step S300, step S400 and step S500 in the above example can refer to the above embodiment and will not be described in detail here.

[0104] In the method for preparing a display module provided by at least one embodiment of the present disclosure, in step S500, the structure to be bonded 130 is bonded to the bonding area BB by using a hot pressing method, and the temperature of the hot pressing method is higher than the temperature of the heat treatment of the display module to be processed 100. In this way, while completing the bonding process, the quality of the filling layer 111 formed in the above steps is not affected.

[0105] In the method for manufacturing a display module provided by an embodiment of the present disclosure, laser cutting is used in the step of cutting the lead 160 to form a cutting path C. Specifically, laser parameters can be set so that the energy of the laser in the step of cutting the lead 160 is sufficient to cut the lead 160, but insufficient to cut the film layer below the lead 160, such as the substrate 140 or the conductive layer 171, thereby improving the problem of signal short circuit.

[0106] In the method for preparing a display module provided in at least one embodiment of the present disclosure, the laser is a pulsed laser. Pulsed laser is discontinuous, and compared with continuous laser, the energy of pulsed laser is easier to control, thereby improving the cutting accuracy.

[0107] In the method for preparing a display module provided in at least one embodiment of the present disclosure, the pulse laser is a picosecond pulse laser.

[0108] Exemplarily, the picosecond pulse laser may include a picosecond green laser or a picosecond ultraviolet laser, the precision of which is easier to control and is more conducive to improving the cutting accuracy. In addition, the pulse width of the picosecond laser makes it equivalent to "cold" burning when cutting the display module 100 to be processed, and no hot melt will be generated, thereby reducing the risk of carbonization or short circuit problems after the lead 160 melts.

[0109] The present disclosure also provides a display module, such as Fig.15 As shown, the display module includes a display area AA and a frame area BZ located outside the display area AA, and the display module also includes a bonding area BB and an edge area E. The bonding area BB is located on the side of the BZ frame area close to the display area AA, and the edge area E is located on the side of the frame area BZ away from the display area AA, and a cutting path C is formed in the area between the bonding area BB and the edge area E. The display module includes a substrate 140, a filling layer 111, and an anisotropic conductive film layer 120, i.e., an ACF layer. The filling layer 111 is located on the substrate 140, and the filling layer 111 fills and covers the cutting path C. The anisotropic conductive film layer 120 covers the surface of the filling layer 111 away from the substrate 140, and at least part of the anisotropic conductive film layer 120 is located in the bonding area BB. A bonding structure is bonded on the surface of the anisotropic conductive film layer 120 away from the substrate 140, and an encapsulation layer 200 is provided on the surface of the bonding structure away from the substrate 140.

[0110] In the display module provided in the embodiment of the present disclosure, Fig.15 As shown, the display module further includes at least one conductive connector 150, a lead 160 and a conductive layer 171. The conductive connector 150 is located between the substrate 140 and the anisotropic conductive film layer 120. The lead 160 is located between the substrate 140 and the anisotropic conductive film layer 120, one end of the lead 160 is connected to the conductive connector 150, and the other end of the lead 160 extends to the cutting line C and ends at the cutting line C. The conductive layer 171 is located between the substrate 140 and the lead 160, wherein the cutting line C is located on the surface of the conductive layer 171 away from the substrate 140 and is adjacent to the conductive layer 171, or is located in the conductive layer 171, or passes through the conductive layer 171, and the details can be referred to Fig.11 , Fig.12 and Fig.13 The description of the above embodiments will not be repeated here.

[0111] In the display module provided by at least one embodiment of the present disclosure, the material of the filling layer 111 includes a hot-melt insulating material.

[0112] In the display module provided in at least one embodiment of the present disclosure, the conductive connector 150 includes a plurality of conductive connectors 150, and the plurality of conductive connectors 150 include bonding electrodes for bonding circuit structures and detection terminals for electrical performance detection. The introduction of the conductive connector 150 can refer to the above embodiments and will not be repeated here.

[0113] It should be noted that the structure of the display module disclosed in the present invention is not limited to the above examples. For example, other functional film layers such as a touch function layer may be provided on the surface of the encapsulation layer 200 of the display module facing away from the substrate 140. The material of the filling layer 111 is not limited to hot-melt insulating materials, but may also be other composite materials or mixed materials including hot-melt insulating materials. In addition, the present disclosure does not specifically introduce the structure of the specific film layers of the display module, such as the driving function layer, the light-emitting function layer, etc. These can be designed according to the requirements of the display module and will not be elaborated here.

[0114] The present disclosure also provides a display device, which includes a display module obtained by the method for preparing the display module in the above embodiment or includes the display module in the above embodiment. The method for preparing the display module and the structure of the display module can refer to the description of the above embodiment, and will not be repeated here.

[0115] In an embodiment of the present disclosure, the display device may be an organic light emitting diode display device, a liquid crystal display device, an electronic paper display device, or the like.

[0116] For example, the display device in the embodiments of the present disclosure may be any product or component with a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a laptop computer, a navigator, or the like.

[0117] It should be noted that the embodiments of the present disclosure do not describe all structures of the above-mentioned display device. To realize the necessary functions of the display device, those skilled in the art may set other structures according to specific application scenarios.

[0118] The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, etc. made within the spirit and principles of the present disclosure should be included in the protection scope of the present disclosure.

Claims

1. A method for preparing a display module, characterized in that: include: Acquire a display module to be processed, wherein the display module to be processed comprises a display area and a frame area located outside the display area, and the display module to be processed further comprises a bonding area and an edge area, wherein the bonding area is located on a side of the frame area close to the display area, and the edge area is located on a side of the frame area away from the display area; forming a scribe line in a region between the bonding region and the edge region; and A barrier dam is formed between the scribe line and the bonding area.

2. The method for preparing a display module according to claim 1, characterized in that: Also includes: forming an anisotropic conductive adhesive film layer in the bonding area of ​​the display module to be processed; Bonding the structure to be bonded to the bonding area; Preferably, in a direction perpendicular to the display module to be processed, the height of the anisotropic conductive adhesive film layer is less than or equal to the height of the blocking dam; Preferably, in a direction perpendicular to the display module to be processed, the height of the anisotropic conductive adhesive film layer is smaller than the height of the blocking dam; Preferably, in a cross section perpendicular to the display module to be processed and perpendicular to the extending direction of the barrier dam, the cross section of the barrier dam is in the shape of a regular trapezoid.

3. The method for preparing a display module according to claim 2, characterized in that: In the extending direction of the cutting street, the length of the blocking dam is greater than or equal to the length of the anisotropic conductive adhesive film layer.

4. The method for preparing a display module according to claim 2, characterized in that: After the step of forming an anisotropic conductive adhesive film layer in the bonding area of ​​the display module to be processed and before the step of bonding the structure to be bonded to the bonding area, the preparation method further comprises: The display module to be processed is heated to change the blocking dam from a solid state to a liquid state, and the liquid blocking dam flows into the cutting road to fill the cutting road to form a filling layer; Preferably, the structure to be bonded is bonded to the bonding area by using a hot pressing method, and the temperature of the hot pressing method is greater than the temperature of the heat treatment of the display module to be processed.

5. The method for preparing a display module according to claim 4, characterized in that: The material of the barrier dam includes a hot-melt insulating material.

6. The method for preparing a display module according to any one of claims 2 to 5, characterized in that: The display module to be processed includes a substrate and a conductive connection member and a lead located on the surface of the substrate, the anisotropic conductive film layer is located on a side of the conductive connection member and the lead away from the substrate, one end of the lead is connected to the conductive connection member, and the other end of the lead extends to the edge area of ​​the display module to be processed in a direction away from the conductive connection member, wherein in the step of forming a cutting path in the area between the bonding area and the edge area, the preparation method includes: Cutting the lead wire along a direction perpendicular to an extending direction of the lead wire to form the cutting path; Preferably, the display module further comprises an array film layer, the array film layer is arranged between the substrate and the conductive connection member and the lead, and in the step of cutting the lead to form the cutting path, the cutting depth is greater than the thickness of the lead and less than the sum of the thickness of the lead and the thickness of the array film layer; Preferably, the array film layer comprises a conductive layer, and the cutting path cuts to a surface of the conductive layer facing away from the substrate, or cuts into the conductive layer, or penetrates through the conductive layer; Preferably, the conductive layer is a semiconductor conductive layer.

7. The method for preparing a display module according to claim 6, characterized in that: Cutting off the lead wire by laser cutting; Preferably, the laser is a pulsed laser; Preferably, the pulse laser is a picosecond pulse laser.

8. A display module, characterized in that: The display module includes a display area and a frame area located outside the display area, and the display module also includes a bonding area and an edge area, wherein the bonding area is located on a side of the frame area close to the display area, and the edge area is located on a side of the frame area away from the display area, and a cutting path is formed in the area between the bonding area and the edge area, and the display module includes: substrate; a filling layer, located on the substrate, wherein the filling layer fills and covers the cutting path; and The anisotropic conductive film layer covers a surface of the filling layer that is away from the substrate, and at least a portion of the anisotropic conductive film layer is located in the bonding area.

9. The display module according to claim 8, characterized in that: Also includes: At least one conductive connecting member, located between the substrate and the anisotropic conductive adhesive film layer; A lead wire is located between the substrate and the anisotropic conductive film layer, one end of the lead wire is connected to the conductive connector, and the other end of the lead wire extends toward the cutting path and stops at the cutting path; as well as A conductive layer, located between the substrate and the lead, wherein the cutting path is located on a surface of the conductive layer away from the substrate and adjacent to the conductive layer, or is located in the conductive layer, or passes through the conductive layer; Preferably, the filling layer comprises a hot-melt insulating material; Preferably, a plurality of the conductive connecting members are provided, and the plurality of the conductive connecting members include bonding electrodes for bonding circuit structures and detection terminals for detecting electrical properties.

10. A display device, characterized in that: A display module obtained by the preparation method according to any one of claims 1 to 7 or a display module according to claim 8 or 9.

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