TR assembly based on SIP

Abstract

The invention discloses a TR assembly based on SIP, and belongs to the technical field of active phased array radars. Wherein the component circuit comprises a radio frequency unit, a power management unit and a logic management unit, the radio frequency unit comprises a transceiving branch and a power division network, the transceiving branch is provided with four independent transceiving channels, one end of the power division network is connected with an external radio frequency interface, the other end of the power division network is connected with the four transceiving branches, and each transceiving branch is connected with an antenna port; the input ends of the power management unit and the logic management unit are connected with the low-frequency interface, the output end of the power management unit is connected with each electric component of the assembly circuit, and the output end of the logic management unit is connected with and controls the power management unit and the radio frequency unit; components arranged on different layers of the substrate are connected through the vertical interconnection structures of the electrical connecting pieces, and different layers of the substrate are connected through the vertical interconnection structures. The multifunctional four-channel miniaturized TR assembly provided by the invention has the advantages of ultra wide band, low port standing wave and selectable dual power.

Description

Technical Field

[0001] The present application belongs to the technical field of active phased array radar, and in particular, relates to a TR component based on SIP. Background Art

[0002] TR components are the basis of active phased array radar antennas and are also the core components of active phased array radars. Its weight, volume, performance, quality, cost and reliability directly affect the overall performance of the radar system. With the development of modern radar technology, active phased array radars have been widely used in military and civilian fields due to their significant advantages such as fast scanning, high reliability and multi-target tracking. In order to meet the needs of these advanced applications, the high integration of TR components has become an inevitable trend in the development of active phased array radars.

[0003] Highly integrated TR components can not only reduce the transmission loss between the components and the antenna elements, but can also be installed in the aperture of the active phased array radar antenna by directly connecting to the antenna elements, thereby improving the overall performance of the system. For active phased array radar antennas carried on platforms such as satellites, aircraft and ships, lightness and thinness are one of their important design requirements. These platforms have strict restrictions on the weight and thickness of the antenna array. Therefore, TR components must meet the aperture adaptation requirements through highly integrated technology.

[0004] However, as electronic devices develop towards high performance and miniaturization, the key factor for further improvement is no longer the performance of individual components themselves, but the optimization of the overall configuration. At present, most TR components adopt a planar circuit layout, that is, all circuits from receiving / transmitting signal input to signal output are distributed on the same layer of circuit board. Although this structure simplifies the circuit layout and production process, the distance from signal input to output is long, resulting in a larger overall thickness of the antenna system and a relatively heavy weight, making it difficult to achieve advanced antenna forms such as conformal. Summary of the invention

[0005] Aiming to overcome the deficiencies in the prior art, the present application provides a SIP-based TR component, which adopts a three-dimensional circuit layout with a multi-layer structure, decomposes the traditional planar circuit into multi-layer circuits, each layer of circuits realizes different circuit functions, and connects the multi-layer circuits into a whole through vertical interconnection technology, thereby saving plane area and volume, reducing weight, and improving integration.

[0006] The technical solution is as follows:

[0007] A TR component based on SIP, comprising a box body, a substrate arranged on the box body and a circulator, wherein the substrate adopts at least three layers of PCB boards, and both sides of the box body are provided with an external radio frequency interface and a low frequency interface of a horizontal configuration;

[0008] The component circuit includes a radio frequency unit, a power management unit and a logic management unit. The radio frequency unit includes a transceiver branch and a power division network. The transceiver branch is provided with four independent transceiver channels. The power division network is used to divide the transmission signal into four equal parts and combine the four-way power of the reception signal. One end of the power division network is connected to an external radio frequency interface, and the other end is connected to four transceiver branches. Each transceiver branch is connected to an antenna port. The input ends of the power management unit and the logic management unit are both connected to a low-frequency interface. The output end of the power management unit is connected to various power-consuming components of the component circuit. The output end of the logic management unit is connected to and controls the power management unit and the radio frequency unit.

[0009] The transceiver branch includes a receiving front-end circuit, a transmitting final circuit and a transceiver common link;

[0010] The components of the receiving front-end circuit and the transmitting final circuit of the transceiver branch are arranged on the box body, and the components of the remaining component circuits are arranged on the substrate. The components arranged on different layers of the substrate are connected through the vertical interconnection structure of the electrical connector, and different layers of the substrate are connected through the vertical interconnection structure.

[0011] According to further technical improvements, the substrate includes a first PCB board, a second PCB board and a third PCB board, and the components of the remaining component circuits form a three-dimensional stacking structure through the second PCB board, the third PCB and electrical connectors to form a SIP module, and the SIP module is connected to the first PCB board.

[0012] According to a further technical improvement, the electrical connector includes a dam, a frame, a copper pillar and a solder ball.

[0013] According to a further technical improvement, the first PCB board is connected to the second PCB board through solder balls, and the second PCB board is connected to the third PCB board through copper pillars and dams.

[0014] As a further technical improvement, the receiving front-end circuit adopts a double-balanced structure, and the input signal is divided into two signals through an input Langer bridge. Each signal passes through a limiter and a high-power resistor, and then is combined through an output Langer bridge. The combined signal is output from the output port.

[0015] Further technical improvement, the transmitting final stage circuit includes a transmitting final stage dual-mode amplifier circuit and a transmitting final stage dual modulation circuit, the transmitting final stage dual modulation circuit supplies power to the gate and drain of the transistor of the transmitting final stage dual-mode amplifier circuit, the transmitting final stage dual-mode amplifier circuit is used to realize high-power output or low-power output of transmission, the drain modulation of the transmitting final stage dual modulation circuit is used to realize the rising or falling edge of the RF output signal, and the gate modulation is used to realize that only one of the two high-power amplifiers works normally at the same time, and at the same time, the two amplifiers are clamped off in the receiving state.

[0016] As a further technical improvement, the transmitting final-stage dual-mode amplifier circuit adopts a dual-mode amplifier structure. After the transmitting signal passes through the driving amplifier, the amplified signal is amplified in the final stage by selecting a high-power output mode or a low-power output mode through two switches, and is finally transmitted to the antenna port for output through a single-loop isolator and a single-loop circulator.

[0017] As a further technical improvement, the transmitting final stage dual modulation circuit includes a negative voltage protection circuit, a modulation circuit, a fast amplification circuit and a logic gate, and the logic gate includes an AND gate and a NOT gate for controlling the logic operation of the signal.

[0018] Further technical improvement, the power management unit is provided with a power supply voltage stabilizing circuit, the power management unit is provided with a power supply voltage stabilizing circuit, the power supply voltage stabilizing circuit includes a first voltage stabilizing circuit, a second voltage stabilizing circuit and a third voltage stabilizing circuit, the low voltage positive electricity is outputted +Vcc through the second power supply voltage stabilizing circuit, and the low noise amplifier and the low voltage pulse modulation circuit on the common link of transmission and reception are powered, the low voltage negative electricity is generated -Vee through the third power supply voltage stabilizing circuit, and the switch, the digital control delay device, the digital control phase shifter and the digital control attenuator are powered, and the +Vcc and -Vee are then used to power the gate and drain of the transmitting final stage dual-mode amplifier circuit through the transmitting final stage dual modulation circuit.

[0019] As a further technical improvement, the logic management unit includes an interface protection circuit, a transceiver control circuit, a logic control circuit and a phase shift / attenuation / delay control circuit.

[0020] The technical solution has at least the following technical effects:

[0021] The TR component has four independent transceiver channels, each of which can independently complete the complete transmission and reception functions, and at the same time realize the digital controlled phase shift, digital controlled attenuation and digital controlled delay of microwave signals through the common transceiver link. It has efficient power management and logic control system, adopts a multi-layer circuit three-dimensional layout form, decomposes the traditional planar circuit into multi-layer circuits, each layer of circuit realizes different circuit functions, and uses vertical interconnection technology to connect the multi-layer circuits into a whole, saving the plane area and volume, reducing the weight, and improving the integration, realizing an ultra-wideband, low port standing wave, dual power optional multifunctional four-channel miniaturized TR component, realizing the miniaturization and high integration of TR components.

[0022] It should be understood that the foregoing general description and the following detailed description are exemplary only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0024] Figure 1 This is a schematic diagram of the structure of a TR component according to an embodiment of the present application;

[0025] Figure 2 This is a schematic diagram of a radio frequency unit according to an embodiment of the present application;

[0026] Figure 3 This is a principle block diagram of a receiving and transmitting branch according to an embodiment of the present application;

[0027] Figure 4 A receiving front-end circuit diagram of an embodiment of the present application;

[0028] Figure 5 This is a transmission final stage dual-mode amplifier circuit diagram of an embodiment of the present application;

[0029] Figure 6 This is a transmission final stage dual modulation circuit diagram of an embodiment of the present application;

[0030] Figure 7 A schematic diagram of a power management unit according to an embodiment of the present application;

[0031] Figure 8 This is a low voltage driving circuit diagram of an embodiment of the present application.

[0032] Description of reference numerals:

[0033] 1. First PCB board; 2. Second PCB board; 3. Third PCB board; 4. Box body; 5. Copper pillar; 6. Frame; 7. Circulator; 8. RF unit; 81. Transmitting and receiving common link; 82. Receiving front-end circuit; 83. Transmitting final stage dual-mode amplification circuit; 84. Transmitting final stage dual modulation circuit; 841. Negative power protection circuit; 842. Modulation circuit; 843. Fast discharge circuit; 9. Solder ball; 10. Power management unit; 111. Low voltage drain modulation circuit; 112. First switch driving circuit; 113. Second switch driving circuit; 114. First voltage stabilizing circuit; 115. Second voltage stabilizing circuit; 116. Third voltage stabilizing circuit; 11. Dam; 12. SIP module. DETAILED DESCRIPTION

[0034] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0035] In order to effectively reduce the thickness and weight of the active phased array antenna to meet the needs of developing conformal phased array antennas, a multi-layer circuit stereoscopic layout is adopted to decompose the traditional planar circuit into multi-layer circuits, each layer of circuits realizes different circuit functions, and the multi-layer circuits are connected into a whole using vertical interconnection technology. An embodiment of the present application is based on a multi-chip component and a three-dimensional structure to provide an X-band ultra-wideband, low port standing wave, dual-power optional multifunctional four-channel miniaturized TR component, which realizes ultra-wideband, working bandwidth 6GHz; low port standing wave.

[0036] like Figure 1 As shown, the SIP-based TR component of this embodiment is provided with four independent channels, any channel includes complete receiving function and transmitting function, and contains a circulator inside, which is used for isolating the receiving signal and the transmitting signal in each channel, and preferably, the circulator is a dual-ring circulator. The TR component is provided with four independent and identical receiving and transmitting channels, which improves the flexibility and application range of the TR component.

[0037] In this embodiment, a box body, a first PCB board 1, a SIP module 12, a partition wall, a circulator, a conductive rubber strip, and a cover plate are provided in sequence from bottom to top. A multi-core connector and an SMP module 12 are also installed in the box body. There is also a second PCB board 2 under the SIP module 12, and there is also a heat sink on the side of the multi-core connector close to the second PCB board 2.

[0038] The RF interface and low-frequency interface of the TR component are both horizontally configured. The internal circuit realizes vertical communication of signals, power supply and control signals through the coaxial vertical interconnection structure of solder balls 9, copper pillars 5 and PCB substrate. The receiving double-balanced structure circuit of the transceiver branch, the transmitting final dual-mode amplification circuit and the double-ring isolator are installed on the box body 4. The circuits of the remaining TR components are three-dimensionally stacked through the second PCB board 2, the third PCB board 3, the dam 11, the frame 6 and the copper pillar 5 to form a SIP module 12. The SIP module 12 is connected to the first PCB board 1 through solder balls 9 to realize signal communication. The internal circuit adopts a three-dimensional stacked stereoscopic architecture, and three PCB boards of different planes are connected together through three vertical interconnection models to form a spatial three-dimensional structure, which realizes the miniaturization and high integration of the TR component and reduces the volume and weight of the component.

[0039] The component circuit includes a radio frequency unit 8, a power management unit 10 and a logic management unit. The input ends of the power management unit and the logic management unit are both connected to the low-frequency interface, the output end of the power management unit is connected to the various power-consuming components of the TR component circuit, and the output end of the logic management unit is connected to and controls the power management unit and the radio frequency unit. The power management unit 10 includes negative voltage monitoring, power supply voltage regulation and power supply pulse modulation circuits, which are used to provide a stable power supply for the internal circuit of the component. The logic management unit includes interface protection, transceiver control, logic control and phase shift / attenuation / delay control circuits, which are used to realize the control function of the component. The radio frequency unit 8 is used to realize functions such as radio frequency signal amplification, phase shift, and switching, and plays a leading role in the performance indicators of the TR component; the power pipeline unit 10 provides voltage bias and command control for the normal operation of the radio frequency unit 8, and provides guarantee for the normal synchronous operation of the TR component.

[0040] The radio frequency unit 8 is provided with a transmitting and receiving branch and a power division network, such as Figure 2 As shown, the transceiver branch is provided with four independent transceiver channels. One end of the power division network is connected to the external RF interface (collection port), and the other end is connected to the four transceiver branches. Each transceiver branch is connected to an antenna port. The power division network is a 1-to-4 equal power divider, which is distributed on the surface layer, inner layer of the first PCB board 1 and the surface layer of the second PCB board 2. The RF signal is connected through the solder ball vertical interconnection structure, the copper column vertical interconnection structure and the coaxial vertical interconnection structure inside the PCB substrate, completing the functions of 4-equal division of the transmission excitation signal and 4-way power combination of the receiving signal.

[0041] like Figure 3The schematic diagram of the transceiver branch is shown. The transceiver branch is used to complete the final saturation amplification of the transmission signal of each channel, perform low-noise amplification on the received signal, realize the phase shift, attenuation and delay of the transceiver signal, and the transceiver switching function. The transceiver branch is provided with four independent transceiver channels, each of which has its own receiving and transmitting functions. The transceiver branch includes a receiving link, a transmitting link and a transceiver common link 81, and the transceiver common link 81 is used to realize the digital control phase shift, digital control attenuation, digital control delay and transceiver switching of the microwave signal. The transmitting link is used to complete the driving amplification and final saturation amplification output of the excitation signal, and can select high output or low power output according to the control instruction; the receiving link has a limiting protection function and performs low noise amplification on the received signal.

[0042] Preferably, the receiving link is a receiving front-end circuit, and the transmitting link is a transmitting final-stage circuit; the receiving front-end circuit adopts a double-balanced structure, has a limiting protection function, and improves the load-pulling resistance and power-resistance capability of the component, can better balance high-gain matching and low-noise matching, and optimizes the antenna port standing wave in the power-off state; the transmitting final-stage circuit adopts a dual-mode amplification architecture and a dual-modulation circuit, and the transmitting final-stage circuit includes a transmitting final-stage dual-mode amplification circuit and a transmitting final-stage dual-modulation circuit, and the transmitting final-stage dual-modulation circuit supplies power to the gate and drain of the transistor of the transmitting final-stage dual-mode amplification circuit. The transmitting final stage dual-mode amplifier circuit is used to realize high-power output or low-power output of the transmission. The drain modulation of the transmitting final stage dual modulation circuit ensures the rising / falling edge of the RF output signal. The gate modulation of the transmitting final stage dual modulation circuit realizes the laingge high-power amplifier and only one of them works normally at the same time. At the same time, the two amplifiers are clamped off in the receiving state to optimize the output port matching and realize low-end matching. The transmitting and receiving public link 81 realizes digitally controlled phase shifting, digitally controlled attenuation, digitally controlled delay of microwave signals and the transmitting and receiving switching work can realize digitally controlled phase shifting / attenuation / delay of the transmitting and receiving signals.

[0043] like Figure 2 and Figure 3As shown, when the TR component is in the transmitting state, the transmitting excitation signal is input from the collection port and evenly distributed to each transmitting branch through the power division network; the transmitting signal passes through the digital control delay device, the single-pole double-throw switch K1 and the single-pole double-throw switch K3, that is, the single-pole double-throw switch K1 and the single-pole double-throw switch K3 are switched to the TX1 branch, enter the common link 81 for transmission and reception, and pass through the low noise amplifier LNA3 signal amplification, the digital control phase shifter (to realize the digital control phase shift function), the low noise amplifier LNA4 signal amplification, the digital control attenuator (to realize the digital control attenuation function), and the low noise amplifier LNA5 signal amplification in sequence; then, the signal is switched to TX2 through the single-pole double-throw switch K2; after the transmitting signal passes through the driving amplifier DPA, the amplified signal selects the high power output mode HPA1 or the low power output mode HPA2 through the switch K5 and the switch K6 for the final amplification, and is finally sent to the antenna port for output through the single-loop isolator and the single-loop circulator. When the transmission is in high-power output mode, the single-pole double-throw switch K5 and the single-pole double-throw switch K6 are switched to HPA1, HPA1 works normally, HPA2 is cut off, and the transmission signal is finally sent to the antenna port output through the single-loop isolator and the single-loop circulator; when the transmission is in low-power output mode, the single-pole double-throw switch K5 and the single-pole double-throw switch K6 are switched to HPA2, HPA2 works normally, HPA1 is cut off, and the final stage saturation output of the transmission signal is realized, and the transmission signal is finally sent to the antenna port output through the single-loop isolator and the single-loop circulator.

[0044] When the TR component is in receiving state, the echo signal received at the antenna input port enters the receiving front-end circuit through the single-loop circulator; the received signal enters the input Langer bridge and is divided into two paths, and each path passes through the limiter L1, the low noise amplifier LNA1 and the limiter L2, the low noise amplifier LNA2 for limiting protection and low noise amplification; then, the signals of the two paths are combined and output through the output Langer bridge; the single-pole double-throw switch K3 is switched to the RX mode, so that the received signal can enter the common link for transmission and reception, and the signal is sequentially amplified by the low noise amplifier LNA3 signal, the digitally controlled phase shifter, the low noise amplifier LNA4 amplification, the digitally controlled attenuator, and the low noise amplifier LNA5 signal amplification; next, the signal passes through the switch K2, the switch K4, and the switch K1, that is, the switch K2 and the switch K4 are switched to the RX1 mode, the switch K1 is switched to the RX2, and the digitally controlled delay device (to realize the digitally controlled delay function) enters the power division network; finally, the received signal is combined through the power division network and sent to the aggregation port for output.

[0045] In a preferred embodiment, the first load is a 50 ohm load and the second load is a 50 ohm load, which are used to absorb unused energy and maintain impedance matching; the single-loop isolator and the single-loop circulator are used to isolate the transmit and receive signals to prevent reverse signal interference; HPA1 and HPA2 are high power amplifiers, respectively, which are used to amplify the transmit signal, and one of them is selected to work according to the control signal.

[0046] like Figure 4 As shown, the receiving front-end circuit 82 adopts a double-balanced structure, has a limiting protection function, and improves the load-pulling resistance and power-resistance capacity of the components, can better balance high-gain matching and low-noise matching, and optimize the antenna port standing wave in the power-off state. The receiving front-end circuit 82 divides the input signal into two signals with a phase difference of 180 degrees by using an input Langer bridge. Each signal passes through a limiter and a 50-ohm high-power resistor to limit the signal amplitude and absorb unused energy to maintain impedance matching. The two signals are then combined through the output Langer bridge, and the combined signal is output from the output port. This balanced structure can not only effectively suppress the image frequency signal, improve the selectivity and signal-to-noise ratio of the receiver, but also provide good isolation performance to ensure low-noise amplification and high-gain matching of the received signal.

[0047] like Figure 5 As shown, the transmitting final stage dual-mode amplifier circuit 83 adopts a dual-mode amplifier structure, and adopts transistors VD1, VD2, and VD3 to realize dual-mode amplification. By controlling the voltages of VG1 and VG2, the working mode can be switched, and by changing the bias of the transistors, an optional high-power output or low-power output mode can be realized. The output passes through an isolator to optimize the standing wave of the antenna port and improve the load-pulling resistance of the component. When high-power output is required, VG1 and VG2 provide a higher voltage to put the amplifier into high-power mode; and when low-power output is required, their voltage may be reduced to put the amplifier into low-power mode. VD1, VD2, and VD3 play an auxiliary control and protection role to prevent excessive current from damaging the circuit.

[0048] like Figure 6 As shown, the transmitting final stage dual modulation circuit 84 can simultaneously control the gate and drain of the transistor to optimize the working efficiency and stability of the transistor. Wherein, T is the transmitting modulation pulse signal, R is the receiving modulation pulse signal, and K is the high / low power switching signal. When R is at a high level, the receiving channel works, and the outputs of VG1 and VG2 are set to -Vee at the same time, the transmitting final stage amplifier is cut off, and the matching of the output port of the transmitting final stage amplifier is optimized, thereby optimizing the standing wave of the antenna port; when R is at a low level, the receiving channel does not work, when K is at a high level, the output of VG1 is set to -Vg, the output of VG2 is set to -Vee, the high power amplifier HPA1 outputs normally, and the low power amplifier HPA2 is cut off, when K is at a low level, the output of VG1 is set to -Vee, the output of VG2 is set to -Vg, HPA1 is cut off, and HPA2 is cut off and outputs normally.

[0049] like Figure 7The schematic diagram of the power management unit shown in FIG. 1 shows that the power management unit 10 is used to process the input of the power supply and pulse signal from the low-frequency interface accordingly, and complete the functions of negative voltage protection, power supply voltage regulation, switch drive and power supply pulse modulation. The power management unit 10 is provided with a power supply voltage regulation circuit, and its main function is to complete the adjustment of the external input power supply, i.e., low-voltage positive electricity and low-voltage negative electricity, and provide the required voltage for the internal components of the component.

[0050] The power supply voltage regulator circuit includes a first voltage regulator circuit 114, a second voltage regulator circuit 115, and a third voltage regulator circuit 116; wherein, the low voltage positive electricity is outputted as +Vcc1 through the first power supply voltage regulator circuit 114 to provide voltage for the logic management unit; the low voltage positive electricity is outputted as +Vcc2 through the second power supply voltage regulator circuit to power the low noise amplifier LNA3, the low noise amplifier LNA4, the low noise amplifier LNA5 and the low voltage pulse modulation circuit on the common link of transmission and reception; the low voltage negative electricity is generated as -Vee through the third power supply voltage regulator circuit 116 to provide power for switches K1 to K6, digitally controlled delay devices, digitally controlled phase shifters and digitally controlled attenuators; +Vcc1 and -Vee are then used to power the gate and drain of the transmitting final stage dual-mode amplifying circuit 8 through the transmitting final stage dual modulation circuit 84.

[0051] The pulse modulation circuit realizes the time-sharing power-on of the receiving and transmitting amplification circuits by controlling the FET switch tube, ensures the isolation of the receiving and transmitting states, improves the power efficiency of the components, and avoids the self-excitation phenomenon between the receiving and transmitting loops. The pulse modulation circuit includes a low-voltage drain modulation circuit and a transmitting final stage dual modulation circuit 84. The low-voltage drain modulation circuit realizes the power supply of the low-noise amplifier LNA1 and the low-noise amplifier LNA2 in the receiving link and the power supply of the driving amplifier DPA in the transmitting link; the transmitting final stage dual modulation circuit 84 realizes the gate and drain power supply of the transmitting final stage dual-mode amplification circuit 83.

[0052] like Figure 6 , Figure 8As shown, the transmitting final stage dual modulation circuit 84 mainly includes the following parts: first, the negative voltage protection circuit 841 is composed of a resistor R1, a resistor R2, a diode D1, a control signal EN and a transmitting modulation pulse signal T, which provides negative voltage protection to prevent the circuit from having a reverse voltage situation; in the high-voltage positive part, the MOSFET driver plays the role of a switch to control the on and off of the high-voltage positive; the fast discharge circuit 843 can quickly release the stored energy when needed to reduce energy loss; the operational amplifier is used to process analog signals, such as gain control and signal amplification. The logic gate composed of the NOT gate and the AND gate is responsible for controlling the logical operation of the signal, such as inversion and combination; the transistor is used as a current amplifier to amplify the input signal. The modulation circuit 842 is used to change the frequency, amplitude or phase of the signal to transmit more information. Finally, the voltage regulator diode is used to maintain a stable voltage, which can ensure the stable operation of the circuit even if the input voltage fluctuates.

[0053] The logic management unit includes an interface protection circuit, a transceiver control circuit, a logic control circuit and a phase shift / attenuation / delay control circuit, which are used to perform corresponding processing on the control signal input from the low-frequency interface to complete functions such as interface protection, transceiver control, logic control and phase shift / attenuation / delay control.

[0054] The interface protection circuit realizes the current drive and protection of the control signal through the bus driver. When a component fails, the component's requirements for the external control signal drive level remain unchanged and will not affect the normal operation of other components. The logic control circuit converts the serial input control signal into parallel data through serial-to-parallel conversion chips, registers, buffers, logic gates and other devices, and outputs the corresponding control signal to realize channel chip selection, RF standby control, transceiver control, digital control attenuation control, digital control phase shift control and digital control delay control for each channel.

[0055] In summary, the TR component has four independent transceiver channels, each of which can independently complete the complete transmission and reception functions, and at the same time realize the digital controlled phase shift, digital controlled attenuation and digital controlled delay of microwave signals through the common transceiver link. It has an efficient power management and logic control system, adopts a multi-layer circuit three-dimensional layout form, decomposes the traditional planar circuit into multi-layer circuits, each layer of circuits realizes different circuit functions, and uses vertical interconnection technology to connect the multi-layer circuits into a whole, saving the plane area and volume, reducing the weight, and improving the integration. It realizes an ultra-wideband, low port standing wave, dual power optional multifunctional four-channel miniaturized TR component, which can realize digital controlled phase shift / attenuation / delay of transceiver signals, improves the overall performance and reliability of the component, and realizes the miniaturization and high integration of the TR component.

[0056] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the application herein applied. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that the present application does not apply for. The specification and embodiments are considered to be exemplary only, and the true scope and spirit of the present application are indicated by the appended claims.

[0057] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A TR component based on SIP, characterized in that: It includes a box body, a substrate arranged on the box body, and a circulator, wherein the substrate adopts at least three layers of PCB boards, and both sides of the box body are provided with external radio frequency interfaces and low-frequency interfaces in a horizontal configuration; The component circuit includes a radio frequency unit, a power management unit and a logic management unit. The radio frequency unit includes a transceiver branch and a power division network. The transceiver branch is provided with four independent transceiver channels. The power division network is used to divide the transmission signal into four equal parts and combine the four-way power of the reception signal. One end of the power division network is connected to an external radio frequency interface, and the other end is connected to four transceiver branches. Each transceiver branch is connected to an antenna port. The input ends of the power management unit and the logic management unit are both connected to a low-frequency interface. The output end of the power management unit is connected to various power-consuming components of the component circuit. The output end of the logic management unit is connected to and controls the power management unit and the radio frequency unit. The transceiver branch includes a receiving front-end circuit, a transmitting final circuit and a transceiver common link; The components of the receiving front-end circuit and the transmitting final circuit of the transceiver branch are arranged on the box body, and the components of the remaining component circuits are arranged on the substrate. The components arranged on different layers of the substrate are connected through the vertical interconnection structure of the electrical connector, and different layers of the substrate are connected through the vertical interconnection structure.

2. The SIP-based TR component according to claim 1, characterized in that: The substrate includes a first PCB board, a second PCB board and a third PCB board. The components of the remaining component circuits form a three-dimensional stacking structure through the second PCB board, the third PCB and electrical connectors to form a SIP module. The SIP module is connected to the first PCB board.

3. The SIP-based TR component according to claim 2, characterized in that: The electrical connector includes a dam, a frame, a copper column and a solder ball.

4. The SIP-based TR component according to claim 3, characterized in that: The first PCB board is connected to the second PCB board through solder balls, and the second PCB board is connected to the third PCB board through copper pillars and dams.

5. The SIP-based TR component according to claim 1, characterized in that: The receiving front-end circuit adopts a double-balanced structure, and divides the input signal into two signals through an input Langer bridge. After each signal passes through a limiter and a high-power resistor, it is combined through an output Langer bridge, and the combined signal is output from the output port.

6. The SIP-based TR component according to claim 1, characterized in that: The transmitting final stage circuit includes a transmitting final stage dual-mode amplifier circuit and a transmitting final stage dual modulation circuit. The transmitting final stage dual modulation circuit supplies power to the gate and drain of the transistor of the transmitting final stage dual-mode amplifier circuit. The transmitting final stage dual-mode amplifier circuit is used to realize high-power output or low-power output of transmission. The drain modulation of the transmitting final stage dual modulation circuit is used to realize the rising or falling edge of the radio frequency output signal. The gate modulation of the transmitting final stage dual modulation circuit is used to realize that only one of the two high-power amplifiers works normally at the same time, and the two amplifiers are clamped off in the receiving state.

7. The SIP-based TR component according to claim 6, characterized in that: The transmitting final-stage dual-mode amplifier circuit adopts a dual-mode amplifier structure. After the transmitting signal passes through the driving amplifier, the amplified signal is selected through two switches to perform a final-stage amplification in a high-power output mode or a low-power output mode, and is finally transmitted to the antenna port for output through a single-loop isolator and a single-loop circulator.

8. The SIP-based TR component according to claim 6, characterized in that: The transmitting final stage dual modulation circuit comprises a negative voltage protection circuit, a modulation circuit, a fast amplification circuit and a logic gate. The logic gate comprises an AND gate and a NOT gate for controlling the logic operation of a signal.

9. The SIP-based TR component according to claim 1, characterized in that: The power management unit is provided with a power supply voltage stabilizing circuit, which includes a first voltage stabilizing circuit, a second voltage stabilizing circuit and a third voltage stabilizing circuit. The low-voltage positive electricity is outputted as +Vcc through the second power supply voltage stabilizing circuit to power the low-noise amplifier and the low-voltage pulse modulation circuit on the common link for transmission and reception. The low-voltage negative electricity is generated as -Vee through the third power supply voltage stabilizing circuit to power the switch, the digitally controlled delay device, the digitally controlled phase shifter and the digitally controlled attenuator. The +Vcc and -Vee are then used to power the gate and drain of the transmitting final-stage dual-mode amplifier circuit through the transmitting final-stage dual-modulation circuit.

10. The SIP-based TR component according to claim 1, characterized in that: The logic management unit comprises an interface protection circuit, a transceiver control circuit, a logic control circuit, and a digitally controlled phase shift, digitally controlled attenuation, and digitally controlled delay control circuit.

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