Multi-wavelength laser packaging device and detection equipment

Abstract

The invention relates to the technical field of optoelectronic devices, in particular to a multi-wavelength laser packaging device and detection equipment, and the multi-wavelength laser packaging device comprises a substrate, a box dam and a light-transmitting material which are sequentially arranged from bottom to top; the multi-wavelength laser packaging device further comprises a reflection component and a plurality of laser chips. The center of the reflection component is arranged at the center of the bottom of a cavity formed by the box dam, and the laser chips are symmetrically arranged on the two sides of the reflection component. The plurality of laser chips are used for emitting laser with at least one wavelength to irradiate an incidence point of the reflecting component; and the reflecting component is used for reflecting laser emitted by each laser chip, emitting the laser to the outside through the light-transmitting material, and converging the laser at a preset fixed distance from the chip. Different-wavelength lasers emitted by a plurality of integrated laser chips are converged at a fixed distance through the reflecting component, so that simultaneous detection of multi-wavelength lasers is realized, and portable design is facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of optoelectronic devices, and in particular to a multi-wavelength laser packaging device and detection equipment. Background Art

[0002] Laser chips are generally divided into edge-emitting lasers and vertical cavity surface-emitting lasers. Edge-emitting lasers are generally packaged in a transistor outline (TO). Vertical cavity surface-emitting lasers are generally packaged in a ceramic substrate. Existing laser packaging methods are generally suitable for the application of independent laser devices. For some low-power, multi-chip integrated applications, the existing packaging methods cannot meet the application requirements. For example, when different chips with multiple wavelengths are involved, multiple independent laser devices may need to be used.

[0003] The above contents are only used to assist in understanding the technical solution of the present invention and do not constitute an admission that the above contents are prior art. Summary of the invention

[0004] The main purpose of the present invention is to provide a multi-wavelength laser packaging device and a detection device, aiming to solve the technical problem in the prior art that independent laser devices cannot realize the simultaneous application of multiple wavelengths.

[0005] To achieve the above object, the present invention provides a multi-wavelength laser packaging device, the multi-wavelength laser packaging device comprising: a substrate, a dam and a light-transmitting material arranged in sequence from bottom to top; The multi-wavelength laser package device further comprises: a reflective component and a plurality of laser chips; The center of the reflective component is arranged at the center of the bottom of the cavity formed by the dam, and every two laser chips are symmetrically arranged on both sides of the reflective component, and the distance from each laser chip to the incident point on the reflective component is the same; A plurality of the laser chips are used to emit laser light of at least one wavelength to irradiate the incident point of the reflective component; The reflective component is used to reflect the laser light emitted by each laser chip, emit it to the outside through the light-transmitting material, and converge it at a preset fixed distance from the chip.

[0006] Optionally, the multi-wavelength laser package device further comprises: electrode structures having twice the number of the laser chips; Two electrode structures are correspondingly arranged for each laser chip. The laser chip is arranged on the upper part of at least one electrode structure. The electrode structure is electrically connected to the corresponding laser chip. The electrode structure also passes through the substrate and is connected to an external power supply.

[0007] Optionally, the reflective member is a polyhedral pyramid structure, and the number of side faces of the reflective member is not less than the number of the laser chips; The side surface of the reflective component is provided with a reflective coating; The height of the reflective component is lower than the height of the dam and higher than the height of the laser chip; The inclination angle of the reflective member is set within a preset inclination angle range.

[0008] Optionally, the height of the incident point of the laser emitted by the laser chip onto the reflective member is set within a preset ratio range of the side height of the reflective member; The distance between the incident points of the two symmetrically arranged laser chips on the reflective component and the inclination angle of the reflective component construct a first mapping relationship according to the preset fixed distance of the test probe, and the distance between the incident points and the inclination angle are set according to the first mapping relationship.

[0009] Optionally, a groove of a preset depth is provided at a contact portion between the substrate and the reflective member; After the reflective member is arranged in the groove with a preset depth, the height of the incident point of the laser emitted by the laser chip onto the reflective member is arranged within a preset ratio range of the side height of the reflective member.

[0010] Optionally, there are two laser chips, and the two laser chips are symmetrically arranged on both sides of the reflective component, and the lasers emitted by the two laser chips are located on the same straight line.

[0011] Optionally, two side surfaces of the reflective component close to the laser chip are inclined reflective surfaces, and the two inclined reflective surfaces of the reflective component are connected to the dam; The reflective member is formed integrally with the dam.

[0012] Optionally, the number of the laser chips is four, the reflective component is a quadrangular pyramid structure, including four inclined reflective surfaces, the four laser chips are respectively arranged corresponding to the four inclined reflective surfaces of the reflective component, the inclination angles of the four inclined reflective surfaces are the same, and the common center of gravity of the four laser chips is located at the center of the reflective component.

[0013] Optionally, the horizontal width of the inclined reflection surface at the incident point of the laser chip and the distance from the laser chip to the incident point are set according to the divergence angle of the laser chip.

[0014] In addition, to achieve the above-mentioned purpose, the present invention further provides a detection device, which includes the multi-wavelength laser packaging device as described above.

[0015] One or more technical solutions proposed in this application have at least the following technical effects: The present invention provides a multi-wavelength laser packaging device and detection equipment, the multi-wavelength laser packaging device includes: a substrate, a dam and a light-transmitting material arranged in sequence from bottom to top; the multi-wavelength laser packaging device also includes: a reflective component and a plurality of laser chips; the center of the reflective component is arranged at the bottom center of the cavity formed by the dam, and every two laser chips are symmetrically arranged on both sides of the reflective component; the plurality of laser chips are used to emit lasers of at least one wavelength to irradiate the incident point of the reflective component; the reflective component is used to reflect the lasers emitted by each of the laser chips, emit them to the outside through the light-transmitting material, and converge at a preset fixed distance from the chip. By integrating a plurality of laser chips and setting a packaging chip with a reflective component, the emitted lasers of different wavelengths can converge at a fixed distance for detection after being reflected by the reflective component. A single probe detection of multi-wavelength lasers is realized, which is conducive to portable design. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0017] Figure 1 It is a schematic structural diagram of a first embodiment of a multi-wavelength laser packaging device of the present invention; Figure 2 A schematic diagram of laser transmission in the first embodiment of the multi-wavelength laser packaging device of the present invention; Figure 3 It is a schematic structural diagram of a second embodiment of a multi-wavelength laser packaging device of the present invention; Figure 4 This is a schematic diagram of the structure of a chip viewed from above in the second embodiment of the multi-wavelength laser packaging device of the present invention; Figure 5 It is a schematic diagram of a top view of the structure in which the chip is integrated in the second embodiment of the multi-wavelength laser packaging device of the present invention; Figure 6 It is a structural schematic diagram of the groove arrangement in the second embodiment of the multi-wavelength laser packaging device of the present invention; Figure 7 It is a schematic structural diagram of a third embodiment of a multi-wavelength laser packaging device of the present invention; Figure 8 A schematic top view of the structure of the multi-faceted cone arrangement of the reflective component in the third embodiment of the multi-wavelength laser packaging device of the present invention; Fig. 9 It is a schematic structural diagram of an embodiment of the detection device of the present invention.

[0018] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0019] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0022] In addition, the descriptions of "first", "second", etc. in the present invention are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0023] The main solution of the embodiment of the present invention is: the multi-wavelength laser packaging device includes: a substrate, a dam and a light-transmitting material arranged in sequence from bottom to top; the multi-wavelength laser packaging device also includes: a reflective component and a plurality of laser chips. The center of the reflective component is arranged at the center of the bottom of the cavity formed by the dam, and every two laser chips are symmetrically arranged on both sides of the reflective component, and the distance from each laser chip to the incident point on the reflective component is the same; the plurality of laser chips are used to emit laser light of at least one wavelength to irradiate the incident point of the reflective component; the reflective component is used to reflect the laser light emitted by each laser chip, emit it to the outside through the light-transmitting material, and converge at the test probe 80 at a preset fixed distance from the chip.

[0024] Laser chips are generally divided into edge-emitting lasers and vertical cavity surface-emitting lasers. Edge-emitting lasers are generally packaged in a transistor outline (TO). Vertical cavity surface-emitting lasers are generally packaged in a ceramic substrate. Existing laser packaging methods are generally suitable for the application of independent laser devices.

[0025] For some low-power, multi-chip integrated applications, the existing packaging methods cannot meet the application requirements. Taking the application of water quality detection as an example, the current development trend of spectral detection equipment is miniaturization and portability. Laser packaged devices are suitable for the development and application of equipment due to their small size and high brightness. The principle of spectral detection is that after the test light passes through the water body, the test probe 80 tests the absorbance of the water body, and then calculates the dissolved matter content in the water. For different dissolved substances in the water quality, the use of spectral detection will involve chips with multiple luminous wavelengths. When different chips with multiple wavelengths are involved, multiple independent laser devices are required for collection and detection, which is not conducive to detection and carrying.

[0026] In a solution provided by the present application, by integrating multiple laser chips and providing a packaged chip with a reflective component, lasers of different wavelengths emitted can be reflected by the reflective component and converged at a fixed distance for detection. Single probe detection of multi-wavelength lasers is realized, which is conducive to portable design.

[0027] Based on this, the embodiment of the present application provides a multi-wavelength laser packaging device, referring to Figure 1 , Figure 1 FIG. 1 is a schematic diagram of the structure of the first embodiment of the multi-wavelength laser packaging device of the present invention. Figure 1 As shown, in this embodiment, the multi-wavelength laser package device includes: a substrate 10, a dam 20 and a light-transmitting material 30 arranged in sequence from bottom to top. The multi-wavelength laser package device also includes: a reflective component 40 and a plurality of laser chips 50.

[0028] The center of the reflective component 40 is set at the bottom center of the cavity formed by the dam 20 , and every two laser chips 50 are symmetrically arranged on both sides of the reflective component 40 , and each laser chip 50 has an incident point on the reflective component 40 .

[0029] It should be noted that the substrate 10 may be a bottom plane substrate that carries the components of the overall chip, the laser chip 50 and the reflective component 40 are disposed at the bottom of the cavity formed by the dam 20, and the reflective component 40 and the laser chip 50 are both disposed on the substrate 10. Both the substrate 10 and the dam 20 may be made of metal, ceramic or silicon.

[0030] The laser chip 50 may be an electronic chip capable of emitting laser light of one wavelength, and multiple laser chips may be used, each of which has the capability of emitting laser light of a different wavelength. The reflective member 40 may be a structure capable of adjusting the optical path, and may be made of materials such as metal and silicon. The reflective ability of light may be improved by preparing a reflective coating on the contact reflective surface of the laser.

[0031] It should be noted that the multiple laser chips 50 can be used to emit lasers of at least one wavelength to irradiate the incident point of the reflective component 40; the reflective component 40 can be used to reflect the lasers emitted by each of the laser chips, emit them to the outside through the light-transmitting material, and converge at a preset fixed distance from the chip.

[0032] It should be understood that the reflective component 40 has multiple reflective surfaces corresponding to multiple laser chips 50, and the multiple laser chips 50 are symmetrical with each other according to the center of the reflective component 40, and the inclination angle of each reflective surface is the same. The distance from the laser chip to the incident point on the reflective component is the same. If there is no reflective component in the middle, the lasers emitted by each laser chip will converge to one point (i.e., the center position of the reflective component). Therefore, after being reflected by the reflective component 40, the lasers emitted by the multiple laser chips 50 will be emitted to the outside through the light-transmitting material 30 and converge at the test probe at a preset fixed distance from the chip.

[0033] The test probe may be a functional element for collecting, receiving and processing laser light, and the preset fixed distance may be the distance from the test probe to the chip, or more precisely, the distance from the laser chip to the plane where the incident point on the reflective member is located to the test probe. The laser light reflected by the reflective member 40 will converge at a point at a preset fixed distance, so that the test probe can collect and receive laser light of different wavelengths.

[0034] Figure 1Taking two laser chips as an example, more laser chips can be set to emit lasers of different wavelengths to meet different detection experiment requirements. The reflective component 40 can be set to a polyhedral cone structure, and the number of sides of the reflective component is not less than the number of laser chips. For example, when the multi-wavelength laser packaging device includes two laser chips, the laser chips can be symmetrically arranged on both sides of the reflective component. When the laser chip is a hexahedral cone, the laser chip can be arranged facing the first side and the fourth side corresponding to the hexahedral cone. When the multi-wavelength laser packaging device includes three laser chips, the laser chip can be centrally symmetrically arranged on the three sides of the reflective component. When the laser chip is a hexahedral cone, the laser chip can be arranged facing the second side, the fourth side and the sixth side of the hexahedral cone. The height of the reflective component 40 needs to be lower than the height of the dam and higher than the height of the laser chip. To ensure that the chip can be packaged in a seam and realize the reflection function of the laser. As in the packaging method of this embodiment, the distance between the incident points of the two laser chips irradiated on the reflective component can be less than 3mm, that is, less than the center distance of a general independent packaging device.

[0035] Reference Figure 2 , Figure 2 The figure is a schematic diagram of the transmission of the laser in the first embodiment of the multi-wavelength laser packaging device of the present invention. The height of the incident point of the laser emitted by the laser chip onto the reflective component is set within a preset ratio range of the side height of the reflective component. The inclination angle of the reflective component is set within a preset inclination angle range.

[0036] It should be understood that the height of the incident point should be within a preset proportional range (e.g. 1 / 3 to 2 / 3) of the height of the reflective component to avoid the problem of poor reflection effect caused by the unevenness of the two ends of the reflective surface due to the manufacturing process of the reflective surface when the incident point is located at both ends of the reflective surface of the reflective component.

[0037] In a possible implementation, the inclination angle of the reflective component (i.e., the angle between the emitting surface and the plane) is set within a preset inclination angle range (e.g., 30 to 60 degrees). The inclination angle cannot be too large, otherwise the light cannot be reflected; nor can it be too small, because laser emission has a certain divergence angle, and a small inclination angle is likely to cause the divergence of the reflected light. By adjusting the inclination angle of the reflective component, the laser can be reflected within a range at a preset fixed distance so that the laser sampling device can receive the reflected laser.

[0038] Furthermore, the distance between the incident points of the two symmetrically arranged laser chips on the reflective component and the inclination angle of the reflective component are used to construct a first mapping relationship according to the preset fixed distance of the test probe, that is, Tan 2θ=2L / W; wherein θ is the inclination angle of the reflective component, L is the preset fixed distance, and W is the distance between the two incident points. By adjusting the inclination angle of the reflective component, the laser can be accurately reflected at the preset fixed distance, and the distance of the incident point and the corresponding inclination angle can be set according to the actual preset fixed distance according to the first mapping relationship.

[0039] In this embodiment, the multi-wavelength laser packaging device includes: a substrate, a dam and a light-transmitting material arranged in sequence from bottom to top; the multi-wavelength laser packaging device also includes: a reflective component and a plurality of laser chips; the center of the reflective component is arranged at the center of the bottom of the cavity formed by the dam, and every two laser chips are symmetrically arranged on both sides of the reflective component; the plurality of laser chips are used to emit lasers of at least one wavelength to irradiate the incident point of the reflective component; the reflective component is used to reflect the lasers emitted by each of the laser chips, emit them to the outside through the light-transmitting material, and converge at a preset fixed distance from the chip. By integrating a plurality of laser chips and providing a packaged chip with a reflective component, the emitted lasers of different wavelengths can converge at a fixed distance for detection after being reflected by the reflective component. A single probe detection of multi-wavelength lasers is realized, which is conducive to portable design.

[0040] Reference Figure 3 and Figure 4 , Figure 3 It is a schematic structural diagram of a second embodiment of a multi-wavelength laser packaging device of the present invention; Figure 4 This is a schematic diagram of the structure of the chip in the second embodiment of the multi-wavelength laser packaging device of the present invention from a top view. In this embodiment, the same or similar contents as those of the first embodiment can be referred to the above introduction and will not be described in detail later.

[0041] The multi-wavelength laser package device further includes: electrode structures 60 twice the number of the laser chips; two electrode structures 60 are provided for each laser chip 50, thereby forming a complete power supply circuit. The laser chip 50 is provided on the top of at least one electrode structure 60, and the electrode structure 60 is electrically connected to the corresponding laser chip 50. The electrode structure 60 also passes through the substrate 10 and is connected to an external power supply (not shown in the figure). The power supply signal of the external power supply is transmitted to the laser chip 50 through the bottom electrode under the substrate to power the laser emission.

[0042] In a possible implementation, when there are two laser chips 50, the two side surfaces of the reflective component 40 close to the laser chip 50 are inclined reflective surfaces, and the two inclined reflective surfaces of the reflective component 40 are connected to the dam 20; the reflective component 40 is formed integrally with the dam 20. Figure 5 , Figure 5 The second embodiment of the multi-wavelength laser packaging device of the present invention is a schematic diagram of the top view of the integrated chip. The reflective member 40 and the dam 20 are directly formed by etching and other processes, and a reflective coating is provided on the inclined reflective surface, thereby simplifying the chip processing difficulty.

[0043] Furthermore, due to the low height of some laser chips, the height of the incident point cannot be within a preset ratio range (e.g., 1 / 3 to 2 / 3) of the height of the reflective component. The contact portion between the substrate and the reflective component may be provided with a groove 70 of a preset depth; after the reflective component is provided with the groove of the preset depth, the height of the incident point of the laser emitted by the laser chip irradiating the reflective component is set within a preset ratio range of the side height of the reflective component. Figure 6 , Figure 6 This is a schematic diagram of the structure of the groove arrangement in the second embodiment of the multi-wavelength laser packaging device of the present invention. By setting a groove with a preset depth, the incident angle is avoided at the bottom of the reflective component when the chip height is low, and the concentration of the light emission is regulated. The depth of the groove can be specifically set according to the height of the laser chip and the reflective component. For example, the groove depth can be set to 100um~1000um.

[0044] Reference Figure 7 , Figure 7 FIG. 1 is a schematic diagram of the structure of the third embodiment of the multi-wavelength laser packaging device of the present invention. Figure 7 As shown, in this embodiment, the same or similar contents as those in the above embodiment can be referred to the above introduction and will not be described in detail later.

[0045] In this embodiment, the number of the laser chips 50 may be four, the reflective component 40 is a quadrangular pyramid structure, including four inclined reflective surfaces, the four laser chips are respectively arranged corresponding to the four inclined reflective surfaces of the reflective component, the four inclined reflective surfaces have the same inclination angle, and the common center of gravity of the four laser chips is located at the center of the reflective component. The lasers emitted by the four laser chips converge at one point in the absence of a reflective component. The convergence point is located at the center of the reflective component.

[0046] It should be noted that each laser chip also has two electrode structures 60 to form a power supply circuit, and a total of eight electrode structures 60 are provided. The specific shape of the electrode structure can be adjusted according to the remaining space in the cavity, and is not specifically limited here.

[0047] Reference Figure 8 , Figure 8 FIG. 1 is a schematic top view of the structure of the multi-faceted cone arrangement of the reflective component in the third embodiment of the multi-wavelength laser packaging device of the present invention. Figure 8 As shown, the reflective member 40 can be set to any polyhedral pyramid structure, and the number of inclined reflective surfaces of the reflective member is not less than the number of the laser chips 50. Assume that the number of laser chips is 2 and the number of reflective surfaces is 6, and the two laser chips are arranged on two opposite sides of the hexagonal pyramid. To improve the reflection efficiency, the horizontal width of the inclined reflective surface at the incident point of the laser chip and the distance from the laser chip to the incident point are set according to the divergence angle of the laser chip.

[0048] Specifically, it can be calculated according to the formula: X>Y* tan a / 2; where X is the horizontal width of the incident point of the laser chip, Y is the distance from the laser chip to the corresponding incident point, and a is the divergence angle of the laser chip. Since the laser chip will have a certain divergence when emitting laser light, the angle containing most of the laser power is the divergence angle. In order to reflect the laser within the angle to improve the reflection efficiency, the horizontal width of the incident point should be set to meet the above formula.

[0049] In addition, in order to achieve the above-mentioned purpose, the embodiment of the present invention also provides a detection device. Fig. 9 , Fig. 9 This is a schematic diagram of the structure of an embodiment of the detection device of the present invention. Since the detection device includes the multi-wavelength laser packaging device, it has at least all the beneficial effects brought by the technical solution of the above embodiment, which will not be described one by one here.

[0050] The detection device can be a spectroscopy detection device for water quality detection. After the emitted laser passes through the water body, the test probe 80 tests the absorbance of the water body, and then calculates the dissolved matter content in the water. By using the lasers of multiple different wavelengths emitted by the multi-wavelength laser package device 90 of the present invention, different dissolved matters in the water quality can be detected, coaxial light emission is achieved, and single probe detection is easy to achieve, which is conducive to the portable and miniaturized design of the device.

[0051] The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A multi-wavelength laser packaging device, characterized in that: The multi-wavelength laser packaging device comprises: a substrate, a dam and a light-transmitting material arranged in sequence from bottom to top; The multi-wavelength laser package device further comprises: a reflective component and a plurality of laser chips; The center of the reflective component is arranged at the center of the bottom of the cavity formed by the dam, and every two laser chips are symmetrically arranged on both sides of the reflective component; A plurality of the laser chips are used to emit laser light of at least one wavelength to irradiate the incident point of the reflective component; The reflective component is used to reflect the laser light emitted by each of the laser chips, emit it to the outside through the light-transmitting material, and converge it at a preset fixed distance from the laser chip.

2. The multi-wavelength laser package device according to claim 1, characterized in that: The multi-wavelength laser package device further includes: electrode structures having twice the number of the laser chips; Two electrode structures are correspondingly arranged for each laser chip. The laser chip is arranged on the upper part of at least one electrode structure. The electrode structure is electrically connected to the corresponding laser chip. The electrode structure also passes through the substrate and is connected to an external power supply.

3. The multi-wavelength laser package device according to claim 1, characterized in that: The reflective component is a polyhedral pyramid structure, and the number of side faces of the reflective component is not less than the number of the laser chips; The side surface of the reflective component is provided with a reflective coating; The height of the reflective component is lower than the height of the dam and higher than the height of the laser chip; The inclination angle of the reflective member is set within a preset inclination angle range.

4. The multi-wavelength laser package device according to claim 3, characterized in that: The height of the incident point of the laser emitted by the laser chip onto the reflective member is set within a preset ratio range of the side height of the reflective member; The distance between the incident points of the two symmetrically arranged laser chips on the reflective component and the inclination angle of the reflective component construct a first mapping relationship according to the preset fixed distance of the test probe, and the distance between the incident points and the inclination angle are set according to the first mapping relationship.

5. The multi-wavelength laser package device according to claim 4, characterized in that: A groove of a preset depth is provided at a contact position between the substrate and the reflective member; After the reflective member is arranged in the groove with a preset depth, the height of the incident point of the laser emitted by the laser chip onto the reflective member is arranged within a preset ratio range of the side height of the reflective member.

6. The multi-wavelength laser package device according to claim 1, characterized in that: There are two laser chips, which are symmetrically arranged on both sides of the reflective component, and the lasers emitted by the two laser chips are located on the same straight line.

7. The multi-wavelength laser package device according to claim 6, characterized in that: Two side surfaces of the reflective component close to the laser chip are inclined reflective surfaces, and the two inclined reflective surfaces of the reflective component extend to the dam; The reflective member is formed integrally with the dam.

8. The multi-wavelength laser package device according to claim 1, characterized in that: There are four laser chips, and the reflective component is a quadrangular pyramid structure, including four inclined reflective surfaces. The four laser chips are respectively arranged corresponding to the four inclined reflective surfaces of the reflective component, and the inclination angles of the four inclined reflective surfaces are the same. The common center of gravity of the four laser chips is located at the center of the reflective component.

9. The multi-wavelength laser package device according to claim 8, characterized in that: The horizontal width of the inclined reflection surface at the incident point of the laser chip and the distance from the laser chip to the incident point are set according to the divergence angle of the laser chip.

10. A detection device, characterized in that: The detection device comprises the multi-wavelength laser package device according to any one of claims 1 to 9.

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