Radio frequency module, radio frequency communication equipment and carrier aggregation regulation and control method

By designing a reconstructible matching circuit structure in the RF module and dynamically adjusting the input impedance of the signal link, the problem of fixed frequency bands and limited bandwidth of the carrier aggregation method in the prior art is solved, and the implementation of multiple carrier aggregation scenarios High efficiency performance guarantee.

CN119402158APending Publication Date: 2025-02-07ZHEJIANG STARSHINE SEMICON CO LTD
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Patent Information

Application Number
CN202411511498.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-28
Publication Date
2025-02-07

AI Technical Summary

Technical Problem

The carrier aggregation method of existing RF modules has problems such as fixed frequency bands and limited bandwidth of matching networks, which leads to the inability to guarantee the performance of different signal links at the same time in multiple carrier aggregation scenarios.

Method used

A radio frequency module is designed that includes at least three signal links, each signal link having a different frequency band range, and a reconfigurable matching circuit structure is provided in each signal link. When multiple signal links jointly complete carrier aggregation, the state of the reconstructed matching circuit structure can be adjusted dynamically to ensure high impedance matching in different carrier aggregation scenarios.

Benefits of technology

It realizes high impedance matching of signal links in multiple carrier aggregation scenarios, broadens bandwidth, guarantees circuit performance, and does not need to increase the number of branches, and the chip area is almost not increased.

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Abstract

The invention discloses a radio frequency module, a radio frequency communication device and a carrier aggregation regulation and control method, and relates to the technical field of radio frequency, the radio frequency module comprises at least three signal links, and at least parts of frequency band ranges which can be passed by the signal links are not overlapped; each signal link can be selectively connected to the same antenna interface through a selection switch; in each signal link, a matching network is arranged between the selection switch and the filter; the matching network in at least one signal link is of a reconfigurable matching circuit structure, so that when the signal link provided with the reconfigurable matching circuit structure and other different signal links jointly complete carrier aggregation, the states of the reconfigurable matching circuit structure can be different, the topological structures of the reconfigurable matching circuit structure can be different, and therefore, the communication efficiency of the signal link is improved. The input impedance of the signal link provided with the reconfigurable matching circuit structure in different carrier aggregation scenes can be dynamically adjusted, the bandwidth is effectively expanded, and the performance of the circuit in various carrier aggregation scenes is guaranteed.
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Description

Technical Field

[0001] The present application relates to the field of radio frequency technology, and in particular to a radio frequency module, a radio frequency communication device and a carrier aggregation control method. Background Art

[0002] RF module refers to RF front-end module (back-end is often discrete devices). Previously, since the use of discrete devices in the RF front-end can also meet the needs of some manufacturers, there has been a clear distinction between high-end equipment using RF modules and low-end equipment using discrete devices. RF modules can provide higher integration and high performance. In the 5G era, due to the sharp increase in the number of RF components in a single product, the area occupied by discrete device solutions exceeds the acceptable limit, and the debugging time will be longer. Therefore, RF front-end modularization has become a development trend in the mobile communication market. RF modules are divided into FEMiD (integrated switch, filter and duplexer), PAMiD (integrated multi-mode multi-band power amplifier PA and FEMiD), LPAMiD (integrated PAMiD and low noise amplifier LNA), DiFEM (integrated RF switch and filter), LFEM (integrated RF switch, low noise amplifier LNA and filter), etc. The design and manufacturing level of filters and other devices is the basis for module product development.

[0003] In practical applications, RF modules (such as DiFEM, LFEM or L-PAMiD) usually need to support multiple carrier aggregation (CA) application scenarios to achieve higher terminal data transmission rates. Carrier aggregation technology combines multiple independent carrier signal links to form a larger "virtual" carrier, thereby improving bandwidth, data transmission rate and capacity.

[0004] The existing carrier aggregation method of the RF module is to design a matching network between the antenna switch (Antenna Switch Module, ASM) and the filter in the selected signal link so that the impedance of the signal link in the corresponding carrier aggregation frequency band is high impedance, so that the signals in different signal links will not interfere with each other, and good carrier aggregation performance is achieved. However, the problem with the prior art is that once the implementation method of the matching network is selected, the carrier aggregation frequency band that it effectively covers is fixed and the bandwidth is limited. When there are many carrier aggregation scenarios that need to be supported simultaneously and the frequency span range is large, different signal links cannot be guaranteed at the same time, or different signal links may be severely deteriorated at the same time. Summary of the invention

[0005] To solve the above technical problems, an embodiment of the present application provides a radio frequency module, a radio frequency communication device and a carrier aggregation control method, so that when a signal link in the radio frequency module completes carrier aggregation together with other different signal links, the matching network in the signal link can be in different states and have different topological structures, and the input impedance of the signal link is adjusted so that the signal link has high impedance in the frequency band corresponding to other signal links that complete carrier aggregation with the signal link, thereby improving the carrier aggregation performance.

[0006] To achieve the above objectives, the present application provides the following technical solutions:

[0007] A radio frequency module, comprising at least three signal links, wherein the frequency bands through which the signal links can pass at least partially do not overlap;

[0008] Each of the signal links at least comprises a selection switch and a filter, and each of the signal links can be selectively connected to the same antenna interface through the selection switch;

[0009] In each of the signal links, a matching network is arranged between the selection switch and the filter; the matching network in at least one of the signal links is a reconfigurable matching circuit structure, and when the signal link provided with the reconfigurable matching circuit structure completes carrier aggregation together with other different signal links, the state of the reconfigurable matching circuit structure is different.

[0010] Optionally, the reconfigurable matching circuit structure includes:

[0011] A series capacitor located on the corresponding signal link;

[0012] a first switch connected in parallel with the series capacitor;

[0013] and a parallel capacitor and a second switch connected between one end of the series capacitor and a ground terminal, wherein the parallel capacitor and the second switch are connected in series.

[0014] Optionally, the at least three signal links include an intermediate frequency signal link and a low intermediate frequency signal link; the intermediate frequency signal link can pass through a frequency band range of 1805 MHz-2200 MHz, including endpoint values; the low intermediate frequency signal link can pass through a frequency band range of 1400 MHz-1800 MHz, including endpoint values;

[0015] The matching network in the low intermediate frequency signal link is a fixed matching network, and the matching network in the intermediate frequency signal link is the reconfigurable matching circuit structure;

[0016] When the intermediate frequency signal link and the low intermediate frequency signal link jointly complete carrier aggregation, the selection switch in the intermediate frequency signal link is closed, the selection switch in the low intermediate frequency signal link is closed, and in the reconfigurable matching circuit structure, both the first switch and the second switch are closed.

[0017] Optionally, the at least three signal links include an intermediate frequency signal link and a high frequency signal link; the intermediate frequency signal link can pass through a frequency band range of 1805 MHz-2200 MHz, including endpoint values; the high frequency signal link can pass through a frequency band range of 2300 MHz-2690 MHz, including endpoint values;

[0018] The matching network in the high-frequency signal link is a fixed matching network, and the matching network in the intermediate-frequency signal link is the reconfigurable matching circuit structure;

[0019] When the intermediate frequency signal link and the high frequency signal link jointly complete carrier aggregation, the selection switch in the intermediate frequency signal link is closed, the selection switch in the high frequency signal link is closed, and in the reconfigurable matching circuit structure, the first switch and the second switch are both disconnected.

[0020] Optionally, the at least three signal links include an intermediate frequency signal link, a low intermediate frequency signal link, and a high frequency signal link; the intermediate frequency signal link may pass through a frequency band range of 1805 MHz-2200 MHz, including endpoint values; the low intermediate frequency signal link may pass through a frequency band range of 1400 MHz-1800 MHz, including endpoint values; the high frequency signal link may pass through a frequency band range of 2300 MHz-2690 MHz, including endpoint values;

[0021] The matching network in the low intermediate frequency signal link is a fixed matching network, the matching network in the high frequency signal link is a fixed matching network, and the matching network in the intermediate frequency signal link is the reconfigurable matching circuit structure;

[0022] When the intermediate frequency signal link, the low intermediate frequency signal link and the high frequency signal link jointly complete carrier aggregation, the selection switch in the intermediate frequency signal link is closed, the selection switch in the low intermediate frequency signal link is closed, the selection switch in the high frequency signal link is closed, and in the reconfigurable matching circuit structure, the first switch is closed and the second switch is open.

[0023] A radio frequency communication device comprises the radio frequency module described in any one of the above items.

[0024] A method for regulating carrier aggregation is applied to a radio frequency module, wherein the radio frequency module comprises at least three signal links, and the frequency bands through which the signal links can pass at least partially do not overlap; each of the signal links comprises at least a selection switch and a filter, and each of the signal links can be selectively connected to the same antenna interface through the selection switch; in each of the signal links, a matching network is arranged between the selection switch and the filter;

[0025] The carrier aggregation control method includes:

[0026] When one of the signal links in the radio frequency module completes carrier aggregation together with other different signal links, the matching network in the signal link is regulated to be in different states.

[0027] Optionally, when one of the signal links in the radio frequency module completes carrier aggregation together with other different signal links, regulating the matching network in the signal link to be in different states includes:

[0028] When the intermediate frequency signal link and the low intermediate frequency signal link in the RF module jointly complete carrier aggregation, the state of the matching network in the intermediate frequency signal link is regulated so that the matching network in the intermediate frequency signal link is connected to a parallel capacitor between the intermediate frequency signal link and the ground.

[0029] Optionally, when one of the signal links in the radio frequency module completes carrier aggregation together with other different signal links, regulating the matching network in the signal link to be in different states includes:

[0030] When the intermediate frequency signal link and the high frequency signal link in the RF module jointly complete carrier aggregation, the state of the matching network in the intermediate frequency signal link is regulated so that the matching network in the intermediate frequency signal link is connected to a series capacitor to the intermediate frequency signal link.

[0031] Optionally, when one of the signal links in the radio frequency module completes carrier aggregation together with other different signal links, regulating the matching network in the signal link to be in different states includes:

[0032] When the intermediate frequency signal link in the RF module completes carrier aggregation together with the low intermediate frequency signal link and the high frequency signal link, the state of the matching network in the intermediate frequency signal link is regulated so that the matching network in the intermediate frequency signal link neither connects a series capacitor to the intermediate frequency signal link nor connects a parallel capacitor between the intermediate frequency signal link and the ground.

[0033] Compared with the prior art, the above technical solution has the following advantages:

[0034] The radio frequency module provided in the embodiment of the present application includes at least three signal links, and the frequency band ranges that can be passed by each signal link are at least partially non-overlapping; each signal link includes at least a selection switch and a filter, and each signal link can be selectively connected to the same antenna interface through the selection switch; in each signal link, a matching network is arranged between the selection switch and the filter; the matching network in at least one signal link is a reconfigurable matching circuit structure, so that when a signal link provided with a reconfigurable matching circuit structure completes carrier aggregation together with other different signal links, the state of the reconfigurable matching circuit structure can be different, so that the topological structure of the reconfigurable matching circuit structure can be different, thereby dynamically adjusting the input impedance of the signal link provided with a reconfigurable matching circuit structure in different carrier aggregation scenarios, so that the signal link has a high impedance in the frequency band corresponding to other signal links that complete carrier aggregation with the signal link, and will not interfere with the frequency band corresponding to other signal links that complete carrier aggregation with the signal link, effectively widening the bandwidth, ensuring the performance of the circuit in multiple carrier aggregation scenarios, without increasing the number of branches, and the chip area will hardly increase.

[0035] It can be seen that the RF module provided in the embodiment of the present application has high flexibility and functionality, better carrier aggregation performance, and is simple to implement, does not affect the performance of existing branches, and has low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0037] Figure 1 A structural block diagram of a radio frequency module provided in an embodiment of the present application;

[0038] Figure 2 A topological structure diagram of a reconfigurable matching circuit structure in the radio frequency module provided in an embodiment of the present application;

[0039] Figure 3 A schematic diagram of the switching state of a reconfigurable matching circuit structure in an intermediate frequency signal link when an intermediate frequency signal link and a low intermediate frequency signal link jointly complete carrier aggregation in a radio frequency module provided in an embodiment of the present application;

[0040] Figure 4 for Figure 3 Schematic diagram of the impedance of the intermediate frequency signal link in the frequency band corresponding to the low intermediate frequency signal link under the situation shown;

[0041] Figure 5 for Figure 3 A comparison diagram of the gain performance of the low intermediate frequency signal link in the illustrated case with the prior art;

[0042] Figure 6 for Figure 3 A comparison of the noise performance of the low-IF signal link in the illustrated case with the prior art;

[0043] Figure 7 A schematic diagram of the switch state of a reconfigurable matching circuit structure in an intermediate frequency signal link when the intermediate frequency signal link and the high frequency signal link jointly complete carrier aggregation in the radio frequency module provided in an embodiment of the present application;

[0044] Figure 8 for Figure 7 Schematic diagram of the impedance of the intermediate frequency signal link in the frequency band corresponding to the high frequency signal link under the situation shown;

[0045] Fig. 9 for Figure 7 A comparison diagram of the gain performance of the high frequency signal link in the illustrated case with the prior art;

[0046] Fig.10 for Figure 7 A comparison of the noise performance of the high frequency signal link in the illustrated case with the prior art;

[0047] Fig.11 In the radio frequency module provided in an embodiment of the present application, when the intermediate frequency signal link, the low intermediate frequency signal link and the high frequency signal link jointly complete carrier aggregation, a schematic diagram of the switch state of the reconfigurable matching circuit structure in the intermediate frequency signal link;

[0048] Fig.12 for Fig.11 Schematic diagram of the impedance of the intermediate frequency signal link in the frequency band corresponding to the intermediate and low frequency signal links and in the frequency band corresponding to the high frequency signal link under the situation shown;

[0049] Fig.13 for Fig.11 A comparison diagram of the gain performance of the low intermediate frequency signal link in the illustrated case with the prior art;

[0050] Fig.14 for Fig.11 A comparison diagram of the gain performance of the high frequency signal link in the illustrated case with the prior art;

[0051] Fig.15 for Fig.11 A comparison of the noise performance of the low-IF signal link in the illustrated case with the prior art;

[0052] Fig.16 for Fig.11 A comparison of the noise performance of the high-frequency signal link in the illustrated case with the prior art. DETAILED DESCRIPTION

[0053] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0054] In the following description, many specific details are set forth to facilitate a full understanding of the present application, but the present application may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0055] As described in the background technology section, the carrier aggregation method of the existing RF module is to design a matching network between the antenna switch (Antenna Switch Module, ASM) and the filter in the selected signal link so that the impedance of the signal link in the corresponding carrier aggregation frequency band is high impedance, so that the signals in different signal links will not interfere with each other, and good carrier aggregation performance is achieved. However, the problem with the prior art is that once the implementation method of the matching network is selected, the carrier aggregation frequency band that it effectively covers is fixed and the bandwidth is limited. When there are many carrier aggregation scenarios that need to be supported simultaneously and the frequency span range is large, different signal links cannot be guaranteed at the same time, or different signal links may be severely deteriorated at the same time.

[0056] In view of this, an embodiment of the present application provides a radio frequency module. Figure 1 A structural block diagram of a radio frequency module provided in an embodiment of the present application is shown. Figure 1 As shown, the RF module includes at least three signal links 10, and the frequency bands that can be passed by each signal link 10 are at least partially non-overlapping; that is, the frequency bands that can be passed by each signal link 10 do not overlap with each other, or, even if the frequency bands that can be passed by two signal links 10 overlap, they are only partially overlapped, and there is still a part that does not overlap, that is, each signal link 10 has an independent frequency band that can be passed. In this way, when two or more signal links jointly complete carrier aggregation, the bandwidth, data transmission rate and capacity can be improved.

[0057] like Figure 1As shown, in the RF module, each signal link 10 includes at least a selection switch K0 and a filter FT, and each signal link 10 can be selectively connected to the same antenna interface ANT through the selection switch K0, that is, when the selection switch K0 in any signal link 10 is closed, the signal link 10 is connected to the antenna interface ANT, and when the selection switches K0 in multiple signal links 10 are closed, the multiple signal links 10 are simultaneously connected to the same antenna interface ANT; when the selection switch K0 in any signal link 10 is disconnected, the signal link 10 is not connected to the antenna interface ANT.

[0058] It should be noted that Figure 1 The RF receiving module L-DiFEM is used as an example for demonstration. Each signal link 10 may also include a low noise amplifier LNA, and the output end OUT of each signal link 10 outputs the signal received from the antenna interface ANT. However, the application scope of the RF module of this application is not limited to L-DiFEM, but should also cover many transmitting or receiving RF modules with carrier aggregation requirements including DiFEM, L-FEM and L-PAMiD.

[0059] like Figure 1 As shown, in each signal link 10 of the radio frequency module, a matching network MN is arranged between the selection switch K0 and the filter FT.

[0060] Figure 1 In the RF module shown, there are a total of n signal links 10, each signal link 10 includes a selection switch K0, a matching network MN, a low noise amplifier LNA, an output terminal OUT, etc., wherein the numbers after the selection switch K0, the matching network MN, the low noise amplifier LNA and the output terminal OUT represent the serial number of the signal link 10.

[0061] As described in the background technology section, in existing RF modules, once the matching network in each signal link is selected, the carrier aggregation frequency band it effectively covers is fixed and has limited bandwidth. For example, the matching network of the second signal link is designed so that when the second signal link and the first signal link complete carrier aggregation together, the second signal link is high impedance in the frequency band corresponding to the first signal link. However, if there is a need to complete carrier aggregation between the second signal link and the third signal link, the matching network in the second signal link can no longer make the second signal link high impedance in the frequency band corresponding to the third signal link. In this way, the performance of the third signal link cannot be guaranteed, and even the performance of the second and third signal links are seriously deteriorated.

[0062] The RF module provided in the embodiment of the present application designs the matching network MN in at least one signal link 10 as a reconfigurable matching circuit structure. In this way, when a signal link 10 provided with a reconfigurable matching circuit structure completes carrier aggregation together with other different signal links 10, the state of the reconfigurable matching circuit structure can be different, so that the topology structure of the reconfigurable matching circuit structure can be different. Therefore, for different carrier aggregation scenarios, the topology structure of the reconfigurable matching circuit structure can be dynamically controlled, and then, the input impedance of the signal link 10 provided with a reconfigurable matching circuit structure in different carrier aggregation scenarios can be dynamically adjusted, so that the signal link 10 has a high impedance in the frequency band corresponding to other signal links 10 that complete carrier aggregation with the signal link 10, and will not interfere with the frequency band corresponding to other signal links 10 that complete carrier aggregation with the signal link 10, thereby effectively widening the bandwidth and ensuring the performance of the circuit in various carrier aggregation scenarios.

[0063] For example, when a signal link 10 provided with a reconfigurable matching circuit structure completes carrier aggregation together with one or more other signal links 10, the reconfigurable matching circuit structure is in a first state, so that the signal link 10 provided with a reconfigurable matching circuit structure has a high impedance in the frequency band corresponding to the other one or more signal links 10 in the common carrier aggregation; when a signal link 10 provided with a reconfigurable matching circuit structure completes carrier aggregation together with one or more other signal links 10, the reconfigurable matching circuit structure is in a second state, so that the signal link 10 provided with a reconfigurable matching circuit structure has a high impedance in the frequency band corresponding to the other one or more signal links 10 in the common carrier aggregation, thereby ensuring the performance of the circuit in these two carrier aggregation scenarios.

[0064] It can be understood that in the RF module provided in the embodiment of the present application, the matching network MN in one signal link 10 can be a reconfigurable matching circuit structure, the matching networks MN in multiple signal links 10 can be a reconfigurable matching circuit structure, or the matching networks MN in each signal link 10 can all be reconfigurable matching circuit structures, depending on the specific circumstances.

[0065] It should be emphasized that the RF module provided in the embodiment of the present application only needs to design the matching network MN in at least one signal link 10 as a reconfigurable matching circuit structure, without increasing the number of branches of the selection switch, thereby solving the problem of deterioration in performance of other signal links caused by reduced signal link isolation and reduced signal link transmission performance due to switching carrier aggregation scenarios; in addition, since there is no need to increase the number of branches, it is only necessary to design the matching network MN on the existing branches as a reconfigurable matching circuit structure, and the area of ​​the chip will hardly increase, thereby reducing costs while improving system performance.

[0066] It can be seen that the RF module provided in the embodiment of the present application has high flexibility and functionality, better carrier aggregation performance, and is simple to implement, does not affect the performance of existing branches, and has low cost.

[0067] Optionally, in some embodiments of the present application, such as Figure 2 As shown, the reconfigurable matching circuit structure includes: a series capacitor Cs located on the corresponding signal link 10, a first switch K1 connected in parallel with the series capacitor Cs, and a parallel capacitor Csh and a second switch K2 connected between one end of the series capacitor Cs and the ground, and the parallel capacitor Csh and the second switch K2 are connected in series.

[0068] It should be noted that the branch where the parallel capacitor Csh and the second switch K2 are located can be connected between any end of the series capacitor Cs and the ground. Figure 2 It only shows the situation that the branch where the parallel capacitor Csh and the second switch K2 are located is connected to one end of the series capacitor Cs and the ground.

[0069] It should also be noted that in the branch where the parallel capacitor Csh and the second switch K2 are connected in series, the second switch K2 can be located on the side of the parallel capacitor Csh close to the ground terminal, or on the side of the parallel capacitor Csh close to the signal link 10, depending on the specific situation.

[0070] It is understandable that if Figure 2 As shown, when the first switch K1 is disconnected, the series capacitor Cs is connected in series to the signal link 10; when the first switch K1 is closed, the series capacitor Cs is short-circuited. When the second switch K2 is closed, the signal link 10 is grounded through the parallel capacitor Csh; when the second switch K2 is disconnected, the branch connected in series with the parallel capacitor Csh and the second switch K2 is disconnected from the signal link 10. In this way, the switching state of the first switch K1 and the second switch K2 can be controlled for different carrier aggregation scenarios, so that the reconfigurable matching circuit structure is in different states and has different topological structures, thereby dynamically controlling the impedance of the corresponding signal link in the corresponding carrier aggregation frequency band, effectively expanding the bandwidth, and ensuring the performance of the circuit in more carrier aggregation scenarios. In addition, the implementation method is simple and effective.

[0071] Optionally, the series capacitor Cs and the parallel capacitor Csh may be highly integrated SOI capacitors, and the first switch K1 and the second switch K2 may be highly integrated switches, thereby further reducing the impact on chip area.

[0072] The inventors have found that the matching network in the existing RF module uses a fixed matching network, which is particularly prominent in the carrier aggregation application scenario related to the intermediate frequency MB. For example, in 4G / 5G applications, the intermediate frequency MB (1805MHz-2200MHz) frequency band (such as B66, B3) is required to complete carrier aggregation with the high frequency HB (2300MHz-2690MHz) frequency band (such as B7, B41), and is required to complete carrier aggregation with the low intermediate frequency MLB (1400MHz-1800MHz) frequency band (such as B32 / 75 / 76). In this case, the matching network of the intermediate frequency MB signal link needs to support a bandwidth of more than 1200MHz. If the existing technology is used, the performance of the high-frequency HB signal link and the low intermediate frequency MLB signal link under carrier aggregation may not be guaranteed at the same time, or may be severely deteriorated at the same time.

[0073] Based on this, Figure 2 Based on the reconfigurable matching circuit structure shown, optionally, in some embodiments of the present application, as Figure 1 As shown, at least three signal links 10 in the RF module include an intermediate frequency signal link 11 and a low intermediate frequency signal link 12; the frequency band range that the intermediate frequency signal link 11 can pass is 1805MHz-2200MHz, including the endpoint value; the frequency band range that the low intermediate frequency signal link 12 can pass is 1400MHz-1800MHz, including the endpoint value; the matching network MN in the low intermediate frequency signal link 12 is a fixed matching network, and the matching network MN in the intermediate frequency signal link 11 is Figure 2 Thus, when the intermediate frequency signal link 11 and the low intermediate frequency signal link 12 jointly complete carrier aggregation, the selection switch K0 in the intermediate frequency signal link 11 is closed, and the selection switch K0 in the low intermediate frequency signal link 12 is closed. At this time, in the reconfigurable matching circuit structure of the intermediate frequency signal link 11, as shown in FIG. Figure 3 As shown, the first switch K1 and the second switch K2 are both closed, so that the series capacitor Cs is short-circuited by the closed first switch K1, and the intermediate frequency signal chain 11 is grounded through the parallel capacitor Csh.

[0074] Figure 4 It shows that when the intermediate frequency signal link 11 and the low intermediate frequency signal link 12 jointly complete the carrier aggregation, and the reconfigurable matching circuit structure in the intermediate frequency signal link 11 adopts Figure 3 When the switch is in the switching state shown, the impedance of the intermediate frequency signal link 11 in the frequency band corresponding to the low intermediate frequency signal link 12 shows that the impedance of the intermediate frequency signal link 11 in the frequency band corresponding to the low intermediate frequency signal link 12 is high impedance (close to the right side of the Smith chart), thereby improving the performance of the intermediate frequency signal link 11 and the low intermediate frequency signal link 12 to jointly complete carrier aggregation.

[0075] Figure 5 The gain performance of the low intermediate frequency signal link 12 (specifically the B32 / 75 / 76 frequency band) in the carrier aggregation scenario is shown in which the low intermediate frequency signal link 12 (specifically the B32 / 75 / 76 frequency band) provided with a fixed matching network and the intermediate frequency signal link 11 (specifically the B66 / B3 frequency band) provided with a reconfigurable matching circuit structure jointly completes the carrier aggregation scenario. Figure 5 This application is marked as MLB. Figure 6 The figure shows the noise performance of the low intermediate frequency signal link 12 (specifically the B32 / 75 / 76 frequency band) in the carrier aggregation scenario where the low intermediate frequency signal link 12 (specifically the B32 / 75 / 76 frequency band) provided with a fixed matching network and the intermediate frequency signal link 11 (specifically the B66 / B3 frequency band) provided with a reconfigurable matching circuit structure are jointly completed. Figure 6 In this application, MLB is marked. Figure 5 and Figure 6 The gain performance and noise performance of the low intermediate frequency signal link (specifically the B32 / 75 / 76 frequency band) and the intermediate frequency signal link (specifically the B66 / B3 frequency band) in the carrier aggregation scenario are also shown. Figure 5 and Figure 6 It is marked as the prior art MLB. It can be seen that compared with the prior art, the present application sets a reconfigurable matching circuit structure in the intermediate frequency signal chain 12 to make the performance of the low intermediate frequency signal chain 11 better, with a higher (flatter) gain and a lower noise coefficient.

[0076] Optionally, in other embodiments of the present application, Figure 1 As shown, at least three signal links 10 in the RF module include an intermediate frequency signal link 11 and a high frequency signal link 13; the frequency band range that the intermediate frequency signal link 11 can pass is 1805MHz-2200MHz, including endpoint values; the frequency band range that the high frequency signal link 13 can pass is 2300MHz-2690MHz, including endpoint values; the matching network in the high frequency signal link 13 is a fixed matching network, and the matching network in the intermediate frequency signal link 11 is a reconfigurable matching circuit structure; in this way, when the intermediate frequency signal link 12 and the high frequency signal link 13 jointly complete carrier aggregation, the selection switch K0 in the intermediate frequency signal link 11 is closed, and the selection switch K0 in the high frequency signal link 13 is closed. At this time, in the reconfigurable matching circuit structure of the intermediate frequency signal link 11, as shown Figure 7 As shown, the first switch K1 and the second switch K2 are both disconnected, so that the series capacitor Cs is connected in series to the intermediate frequency signal chain 10 , and the parallel capacitor Csh is disconnected from the intermediate frequency signal chain 10 .

[0077] Figure 8It shows that when the intermediate frequency signal link 11 and the high frequency signal link 13 jointly complete the carrier aggregation, and the reconfigurable matching circuit structure in the intermediate frequency signal link 11 adopts Figure 7 When the switch is in the switching state shown, the impedance of the intermediate frequency signal link 11 in the frequency band corresponding to the high frequency signal link 13 shows that the impedance of the intermediate frequency signal link 11 in the frequency band corresponding to the high frequency signal link 13 is high impedance (close to the right side of the Smith chart), thereby improving the performance of the intermediate frequency signal link 11 and the high frequency signal link 13 in jointly completing carrier aggregation.

[0078] Fig. 9 The figure shows the gain performance of the high frequency signal link 13 (specifically the B7 frequency band) in the carrier aggregation scenario where the high frequency signal link 13 (specifically the B7 frequency band) provided with a fixed matching network and the intermediate frequency signal link 11 (specifically the B66 / B3 frequency band) provided with a reconfigurable matching circuit structure jointly complete the carrier aggregation scenario. Fig. 9 The mark in this application is HB. Fig.10 The figure shows the noise performance of the high-frequency signal link 13 (specifically the B7 frequency band) in the carrier aggregation scenario where the high-frequency signal link 13 (specifically the B7 frequency band) provided with a fixed matching network and the intermediate frequency signal link 11 (specifically the B66 / B3 frequency band) provided with a reconfigurable matching circuit structure are jointly completed. Fig.10 In the reference HB of this application. Fig. 9 and Fig.10 It also shows the gain performance and noise performance of the high-frequency signal link 13 (specifically the B7 frequency band) in the carrier aggregation scenario where the high-frequency signal link 13 (specifically the B7 frequency band) and the intermediate frequency signal link (specifically the B66 / B3 frequency band) both have fixed matching networks. Fig. 9 and Fig.10 It is marked as prior art HB. It can be seen that compared with the prior art, the present application sets a reconfigurable matching circuit structure in the intermediate frequency signal chain 12 to make the performance of the low intermediate frequency signal chain 11 better, with higher (flatter) gain and lower noise coefficient.

[0079] Optionally, in some further embodiments of the present application, Figure 1As shown, at least three signal links 10 in the RF module include an intermediate frequency signal link 11, a low intermediate frequency signal link 12 and a high frequency signal link 13; the frequency band range that the intermediate frequency signal link 11 can pass is 1805MHz-2200MHz, including the endpoint value; the frequency band range that the low intermediate frequency signal link 12 can pass is 1400MHz-1800MHz, including the endpoint value; the frequency band range that the high frequency signal link 13 can pass is 2300MHz-2690MHz, including the endpoint value; the matching in the low intermediate frequency signal link 12 The network is a fixed matching network, the matching network in the high-frequency signal link 13 is a fixed matching network, and the matching network in the intermediate frequency signal link 11 is a reconfigurable matching circuit structure; in this way, when the intermediate frequency signal link 11, the low intermediate frequency signal link 12 and the high frequency signal link 13 jointly complete the carrier aggregation, the selection switch K0 in the intermediate frequency signal link 11 is closed, the selection switch K0 in the low intermediate frequency signal link 12 is closed, and the selection switch K0 in the high frequency signal link 13 is closed. At this time, in the reconfigurable matching circuit structure of the intermediate frequency signal link 11, as shown in FIG. Fig.11 As shown, the first switch K1 is closed and the second switch K2 is opened, so that the series capacitor Cs is short-circuited and the parallel capacitor Csh is disconnected, that is, at this time, no additional capacitor device of the series capacitor Cs and the parallel capacitor Csh is added to the intermediate frequency signal chain 10.

[0080] Fig.12 It shows that when the intermediate frequency signal link 11, the low intermediate frequency signal link 12 and the high frequency signal link 13 jointly complete the carrier aggregation, and the reconfigurable matching circuit structure in the intermediate frequency signal link 11 adopts Fig.11 When the switch is in the switching state shown, the impedance of the intermediate frequency signal link 11 in the frequency band corresponding to the low intermediate frequency signal link 12 and the impedance of the high frequency signal link 13 are shown. It can be seen that the impedance of the intermediate frequency signal link 11 in the frequency band corresponding to the low intermediate frequency signal link 12 is high impedance (close to the right side of the Smith chart), and the impedance of the intermediate frequency signal link 11 in the frequency band corresponding to the high frequency signal link 13 is high impedance (close to the right side of the Smith chart), thereby improving the performance of the intermediate frequency signal link 11, the low intermediate frequency signal link 12 and the high frequency signal link 13 to jointly complete carrier aggregation.

[0081] Fig.13 The figure shows the gain performance of the low intermediate frequency signal link 12 (specifically the B32 frequency band) in the carrier aggregation scenario, which is completed by the low intermediate frequency signal link 12 (specifically the B32 / 75 / 76 frequency band) provided with a fixed matching network, the high frequency signal link 13 (specifically the B7 frequency band) provided with a fixed matching network, and the intermediate frequency signal link 11 (specifically the B66 frequency band) provided with a reconfigurable matching circuit structure. Fig.13 In the application marked as MLB, for comparison, Fig.13It also shows the gain performance of the low intermediate frequency signal link 12 (specifically the B32 frequency band) in the carrier aggregation scenario jointly completed by the low intermediate frequency signal link (specifically the B32 / 75 / 76 frequency band), the intermediate frequency signal link (specifically the B66 / B3 frequency band) and the high frequency signal link (specifically the B7 frequency band) all of which are equipped with fixed matching networks, which is marked as the prior art MLB. Fig.14 The figure shows the gain performance of the high-frequency signal link 13 (specifically the B7 frequency band) in the carrier aggregation scenario, which is completed by the low-intermediate-frequency signal link 12 (specifically the B32 / 75 / 76 frequency band) provided with a fixed matching network, the high-frequency signal link 13 (specifically the B7 frequency band) provided with a fixed matching network, and the intermediate-frequency signal link 11 (specifically the B66 frequency band) provided with a reconfigurable matching circuit structure. Fig.14 The mark in this application is HB, for comparison, Fig.14 It also shows the gain performance of the high-frequency signal link 13 (specifically the B7 frequency band) in the carrier aggregation scenario where the low-intermediate-frequency signal link (specifically the B32 / 75 / 76 frequency band), the intermediate-frequency signal link (specifically the B66 / B3 frequency band) and the high-frequency signal link (specifically the B7 frequency band) are all equipped with fixed matching networks. Fig.14 It is marked as prior art HB. It can be seen that compared with the prior art, the present application sets a reconfigurable matching circuit structure in the intermediate frequency signal chain 12 so that the low intermediate frequency signal chain 11 has a higher (flatter) gain and the gain of the high frequency signal chain 13 is more balanced.

[0082] Fig.15 It shows the noise performance of the low intermediate frequency signal link 12 (specifically the B32 frequency band) in the carrier aggregation scenario, which is jointly completed by the low intermediate frequency signal link 12 (specifically the B32 / 75 / 76 frequency band) provided with a fixed matching network, the high frequency signal link 13 (specifically the B7 frequency band) provided with a fixed matching network, and the intermediate frequency signal link 11 (specifically the B66 frequency band) provided with a reconfigurable matching circuit structure. Fig.15 In the application marked as MLB, for comparison, Fig.15 It also shows the noise performance of the low intermediate frequency signal link 12 (specifically the B32 frequency band) in the carrier aggregation scenario jointly completed by the low intermediate frequency signal link (specifically the B32 / 75 / 76 frequency band), the intermediate frequency signal link (specifically the B66 / B3 frequency band) and the high frequency signal link (specifically the B7 frequency band) all of which are equipped with fixed matching networks, which is marked as the prior art MLB. Fig.16It shows that the high-frequency signal link 13 (specifically the B7 frequency band) is equipped with a fixed matching network, the low-intermediate-frequency signal link 12 (specifically the B32 / 75 / 76 frequency band), the high-frequency signal link 13 (specifically the B7 frequency band) equipped with a fixed matching network, and the intermediate-frequency signal link 11 (specifically the B66 frequency band) equipped with a reconfigurable matching circuit structure jointly complete the noise performance in the carrier aggregation scenario. Fig.16 The mark in this application is HB, for comparison, Fig.16 It also shows the noise performance of the high-frequency signal link 13 (specifically the B7 frequency band) in the carrier aggregation scenario where the low-intermediate-frequency signal link (specifically the B32 / 75 / 76 frequency band), the intermediate-frequency signal link (specifically the B66 / B3 frequency band) and the high-frequency signal link (specifically the B7 frequency band) are all equipped with fixed matching networks. Fig.16 It is marked as prior art HB. It can be seen that compared with the prior art, the present application sets a reconfigurable matching circuit structure in the intermediate frequency signal chain 12 so that the low intermediate frequency signal chain 11 has a lower noise coefficient, and the noise coefficient of the high frequency signal chain 13 is comparable to that of the prior art.

[0083] It should be noted that in the above embodiments, the matching network in the low intermediate frequency signal link 12 is set as a fixed matching network. This is because the low intermediate frequency signal link 12 is usually required to perform carrier aggregation with the intermediate frequency signal link 11. If the low intermediate frequency signal link 12 needs to perform carrier aggregation with other signal links other than the intermediate frequency signal link 11, the matching network in the low intermediate frequency signal link 12 can also be set as a reconfigurable matching circuit structure.

[0084] Similarly, in the above embodiments, the matching network in the high-frequency signal link 13 is also set to a fixed matching network. This is because the high-frequency signal link 13 is usually also required to perform carrier aggregation with the intermediate frequency signal link 11. If the high-frequency signal link 13 needs to perform carrier aggregation with other signal links other than the intermediate frequency signal link 11, the matching network in the high-frequency signal link 13 can also be set to a reconfigurable matching circuit structure.

[0085] It should also be noted that Figure 2 The reconfigurable matching circuit structure shown is a convenient and effective topological structure, but the reconfigurable matching circuit structure in the present application is not limited to this one. Based on the understanding of the inventive concept of the present application, technical personnel in this field can set the reconfigurable matching circuit structure to different topological structures according to needs, so that when a signal link 10 with a reconfigurable matching circuit structure completes carrier aggregation together with other different signal links 10, the reconfigurable matching circuit structure has different states, or has different topological structures, which effectively widens the bandwidth and ensures the performance of the circuit in various carrier aggregation scenarios.

[0086] In practical applications, such as Figure 1 As shown, the RF module may also include a third switch K3 located between the i-th signal link and the i+1-th signal link (1≤i≤n-1), and between the n-th signal link and the ground. The number after the third switch K3 is its serial number, so as to play a discharge role, effectively protect the safety of people and equipment, prevent the hazards of lightning strikes and static electricity, and improve the stability and reliability of the circuit.

[0087] Accordingly, an embodiment of the present application further provides a radio frequency communication device, including the radio frequency module provided by any of the above embodiments. Since the radio frequency module has been introduced in detail in the above embodiments, it will not be repeated here.

[0088] Based on the same inventive concept, the embodiment of the present application also provides a method for regulating carrier aggregation, which is applied to a radio frequency module, such as Figure 1 As shown, the radio frequency module includes at least three signal links 10, and the frequency bands through which the signal links 10 can pass are at least partially non-overlapping; each signal link 10 includes at least a selection switch K0 and a filter FT, and each signal link 10 can be selectively connected to the same antenna interface ANT through the selection switch K0; in each signal link 10, a matching network MN is provided between K0 and the filter FT; the control method of carrier aggregation includes:

[0089] S100: When a signal link 10 in the radio frequency module completes carrier aggregation together with other different signal links 10, the matching network in the signal link 10 is adjusted to be in different states.

[0090] It can be understood that when a signal link 10 in the RF module completes carrier aggregation together with other different signal links 10, the matching network in the signal link 10 is adjusted to be in different states, that is, the matching network in the signal link is a reconfigurable matching circuit structure, and has different topological structures in different states. Therefore, for different carrier aggregation scenarios, the topological structure of the reconfigurable matching circuit structure can be dynamically controlled, and then, the input impedance of the signal link 10 provided with the reconfigurable matching circuit structure in different carrier aggregation scenarios is dynamically adjusted, so that the signal link 10 has a high impedance in the frequency band corresponding to other signal links 10 that complete carrier aggregation with the signal link 10, and will not interfere with the frequency band corresponding to other signal links 10 that complete carrier aggregation with the signal link 10, thereby effectively widening the bandwidth and ensuring the performance of the circuit in various carrier aggregation scenarios.

[0091] As mentioned above, the matching network in the existing RF module uses a fixed matching network, which is particularly prominent in the carrier aggregation application scenario related to the intermediate frequency MB. For example, in 4G / 5G applications, the intermediate frequency MB (1805MHz-2200MHz) frequency band (such as B66, B3) is required to complete carrier aggregation with the high frequency HB (2300MHz-2690MHz) frequency band (such as B7, B41), and is required to complete carrier aggregation with the low intermediate frequency MLB (1400MHz-1800MHz) frequency band (such as B32 / 75 / 76). In this case, the matching network of the intermediate frequency MB signal link needs to support a bandwidth of more than 1200MHz. If the existing technology is used, the performance of the high-frequency HB signal link and the low intermediate frequency MLB signal link under carrier aggregation may not be guaranteed at the same time, or may be severely deteriorated at the same time.

[0092] Based on this, optionally, in some embodiments of the present application, in step S100, when a signal link 10 in the RF module completes carrier aggregation together with other different signal links 10, regulating the matching network in the signal link 10 to be in different states includes:

[0093] S110: Figure 1 and Figure 3 As shown, when the intermediate frequency signal link 11 and the low intermediate frequency signal link 12 in the RF module jointly complete carrier aggregation, the state of the matching network in the intermediate frequency signal link 11 is regulated so that the matching network in the intermediate frequency signal link 11 is connected to a parallel capacitor Csh between the intermediate frequency signal link 11 and the ground.

[0094] In this way, the impedance of the intermediate frequency signal link 11 in the frequency band corresponding to the low intermediate frequency signal link 12 is high impedance, thereby improving the performance of the intermediate frequency signal link 11 and the low intermediate frequency signal link 12 in jointly completing carrier aggregation.

[0095] Optionally, in some other embodiments of the present application, in step S100, when a signal link 10 in the RF module completes carrier aggregation together with other different signal links 10, regulating the matching network in the signal link 10 to be in different states includes:

[0096] S120: Figure 1 and Figure 7 As shown, when the intermediate frequency signal link 12 and the high frequency signal link 13 in the RF module jointly complete carrier aggregation, the state of the matching network in the intermediate frequency signal link 12 is regulated so that the matching network in the intermediate frequency signal link 12 connects a series capacitor Cs to the intermediate frequency signal link 12.

[0097] In this way, the impedance of the intermediate frequency signal link 11 in the frequency band corresponding to the high frequency signal link 13 is high impedance, thereby improving the performance of the intermediate frequency signal link 11 and the high frequency signal link 13 in jointly completing carrier aggregation.

[0098] Optionally, in some further embodiments of the present application, in step S100, when a signal link 10 in the RF module completes carrier aggregation together with other different signal links 10, regulating the matching network in the signal link 10 to be in different states includes:

[0099] S130: Figure 1 and Fig.11 As shown, when the intermediate frequency signal link 11 in the RF module completes carrier aggregation together with the low intermediate frequency signal link 12 and the high frequency signal link 13, the state of the matching network in the intermediate frequency signal link 11 is regulated so that the matching network in the intermediate frequency signal link 11 neither connects a series capacitor to the intermediate frequency signal link 12 nor connects a parallel capacitor between the intermediate frequency signal link 12 and the ground.

[0100] In this way, the impedance of the intermediate frequency signal link 11 in the frequency band corresponding to the low intermediate frequency signal link 12 is high impedance, and the impedance of the intermediate frequency signal link 11 in the frequency band corresponding to the high frequency signal link 13 is high impedance, thereby improving the performance of the intermediate frequency signal link 11, the low intermediate frequency signal link 12 and the high frequency signal link 13 in jointly completing carrier aggregation.

[0101] The various parts in this manual are described in a combination of parallel and progressive ways. Each part focuses on the differences from other parts, and the same or similar parts between the various parts can be referenced to each other.

[0102] With respect to the above description of the disclosed embodiments, the features described in the embodiments in this specification may be replaced or combined with each other, so that professionals in the field can implement or use the present application. Various modifications to these embodiments will be apparent to professionals in the field, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A radio frequency module, characterized in that: At least three signal links are included, and the frequency bands through which the signal links can pass are at least partially non-overlapping; Each of the signal links at least comprises a selection switch and a filter, and each of the signal links can be selectively connected to the same antenna interface through the selection switch; In each of the signal links, a matching network is arranged between the selection switch and the filter; the matching network in at least one of the signal links is a reconfigurable matching circuit structure, and when the signal link provided with the reconfigurable matching circuit structure completes carrier aggregation together with other different signal links, the state of the reconfigurable matching circuit structure is different.

2. The radio frequency module according to claim 1, characterized in that: The reconfigurable matching circuit structure comprises: A series capacitor located on the corresponding signal link; a first switch connected in parallel with the series capacitor; and a parallel capacitor and a second switch connected between one end of the series capacitor and a ground terminal, wherein the parallel capacitor and the second switch are connected in series.

3. The radio frequency module according to claim 2, characterized in that: The at least three signal links include an intermediate frequency signal link and a low intermediate frequency signal link; the intermediate frequency signal link may pass through a frequency band range of 1805 MHz-2200 MHz, including the endpoint values; the low intermediate frequency signal link may pass through a frequency band range of 1400 MHz-1800 MHz, including the endpoint values; The matching network in the low intermediate frequency signal link is a fixed matching network, and the matching network in the intermediate frequency signal link is the reconfigurable matching circuit structure; When the intermediate frequency signal link and the low intermediate frequency signal link jointly complete carrier aggregation, the selection switch in the intermediate frequency signal link is closed, the selection switch in the low intermediate frequency signal link is closed, and in the reconfigurable matching circuit structure, both the first switch and the second switch are closed.

4. The radio frequency module according to claim 2, characterized in that: The at least three signal links include an intermediate frequency signal link and a high frequency signal link; the intermediate frequency signal link can pass through a frequency band range of 1805MHz-2200MHz, including the endpoint values; the high frequency signal link can pass through a frequency band range of 2300MHz-2690MHz, including the endpoint values; The matching network in the high-frequency signal link is a fixed matching network, and the matching network in the intermediate-frequency signal link is the reconfigurable matching circuit structure; When the intermediate frequency signal link and the high frequency signal link jointly complete carrier aggregation, the selection switch in the intermediate frequency signal link is closed, the selection switch in the high frequency signal link is closed, and in the reconfigurable matching circuit structure, the first switch and the second switch are both disconnected.

5. The radio frequency module according to claim 2, characterized in that: The at least three signal links include an intermediate frequency signal link, a low intermediate frequency signal link and a high frequency signal link; the intermediate frequency signal link can pass through a frequency band range of 1805MHz-2200MHz, including the endpoint value; the low intermediate frequency signal link can pass through a frequency band range of 1400MHz-1800MHz, including the endpoint value; the high frequency signal link can pass through a frequency band range of 2300MHz-2690MHz, including the endpoint value; The matching network in the low intermediate frequency signal link is a fixed matching network, the matching network in the high frequency signal link is a fixed matching network, and the matching network in the intermediate frequency signal link is the reconfigurable matching circuit structure; When the intermediate frequency signal link, the low intermediate frequency signal link and the high frequency signal link jointly complete carrier aggregation, the selection switch in the intermediate frequency signal link is closed, the selection switch in the low intermediate frequency signal link is closed, the selection switch in the high frequency signal link is closed, and in the reconfigurable matching circuit structure, the first switch is closed and the second switch is open.

6. A radio frequency communication device, characterized in that: A radio frequency module comprising any one of claims 1 to 5.

7. A method for regulating carrier aggregation, characterized in that: Applied to a radio frequency module, the radio frequency module includes at least three signal links, and the frequency bands through which the signal links can pass are at least partially non-overlapping; each of the signal links includes at least a selection switch and a filter, and each of the signal links can be selectively connected to the same antenna interface through the selection switch; In each of the signal links, a matching network is provided between the selection switch and the filter; The carrier aggregation control method includes: When one of the signal links in the radio frequency module completes carrier aggregation together with other different signal links, the matching network in the signal link is regulated to be in different states.

8. The method for controlling carrier aggregation according to claim 7, characterized in that: When one of the signal links in the radio frequency module completes carrier aggregation together with other different signal links, regulating the matching network in the signal link to be in different states includes: When the intermediate frequency signal link and the low intermediate frequency signal link in the RF module jointly complete carrier aggregation, the state of the matching network in the intermediate frequency signal link is regulated so that the matching network in the intermediate frequency signal link is connected to a parallel capacitor between the intermediate frequency signal link and the ground.

9. The method for controlling carrier aggregation according to claim 7, characterized in that: When one of the signal links in the radio frequency module completes carrier aggregation together with other different signal links, regulating the matching network in the signal link to be in different states includes: When the intermediate frequency signal link and the high frequency signal link in the RF module jointly complete carrier aggregation, the state of the matching network in the intermediate frequency signal link is regulated so that the matching network in the intermediate frequency signal link is connected to a series capacitor to the intermediate frequency signal link.

10. The method for controlling carrier aggregation according to claim 7, characterized in that: When one of the signal links in the radio frequency module completes carrier aggregation together with other different signal links, regulating the matching network in the signal link to be in different states includes: When the intermediate frequency signal link in the RF module completes carrier aggregation together with the low intermediate frequency signal link and the high frequency signal link, the state of the matching network in the intermediate frequency signal link is regulated so that the matching network in the intermediate frequency signal link neither connects a series capacitor to the intermediate frequency signal link nor connects a parallel capacitor between the intermediate frequency signal link and the ground.