Processing mechanism for electronic chip

Abstract

The invention relates to the technical field of electronic chip packaging, in particular to an electronic chip processing mechanism which comprises a dispensing mechanism and a conveying mechanism, the dispensing mechanism is arranged above the conveying mechanism, the conveying mechanism comprises a supporting assembly and a transmission assembly, the transmission assembly is installed on the supporting assembly, a plurality of packaging boxes are arranged on the transmission assembly, and the packaging boxes are arranged on the supporting assembly. The packaging box is located below the dispensing mechanism, a containing space is formed in the packaging box, the two temperature control telescopic plate sets are oppositely arranged and arranged on the tops of the two opposite side walls of the packaging box correspondingly, and the two temperature control telescopic plate sets are used for oppositely stretching and abutting against each other to seal the containing space when heated. The electronic chip is dried after being dispensed in the packaging box, and the electronic chip does not need to be transferred to other drying equipment after being dispensed, so that the electronic chip is prevented from being polluted in the transfer process, and the packaging yield is improved.

Description

Technical Field

[0001] The invention relates to the technical field of electronic chip packaging, and in particular to a processing mechanism for electronic chips. Background Art

[0002] Traditional electronic chip processing mechanisms need to load the electronic chips on a packaging table, apply glue to them, and then transfer them to a drying device for drying. This will cause the electronic chips to encounter dust and other pollution sources in the air during the transfer process, thereby causing the electronic chips to be contaminated and affecting the yield rate of the electronic chips. At the same time, it takes a certain amount of time to transfer the electronic chips from the gluing device to the drying device, which affects the packaging efficiency of the electronic chips. Summary of the invention

[0003] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0004] A processing mechanism for electronic chips comprises a glue dispensing mechanism and a conveying mechanism, wherein the glue dispensing mechanism is arranged above the conveying mechanism, the conveying mechanism comprises a supporting assembly and a transmission assembly, the transmission assembly is mounted on the supporting assembly, a plurality of packaging boxes are arranged on the transmission assembly, the packaging box is located below the glue dispensing mechanism, a storage space is formed inside the packaging box, a heating plate, a vacuum suction cup, two heat conducting plates and two temperature-controlled telescopic plate groups are arranged inside the packaging box, the heating plate is arranged on the bottom surface of the storage space, the vacuum suction cup is arranged at the center of the surface of the heating plate, the two heat conducting plates are respectively embedded in the opposite side walls of the packaging box, the two temperature-controlled telescopic plate groups are arranged oppositely and respectively arranged on the tops of the opposite side walls of the packaging box, and the two temperature-controlled telescopic plate groups are used to extend toward each other and abut against each other when heated to close the storage space.

[0005] In the prior art, when the electronic chip is glued and packaged, it is necessary to load the electronic chip on the packaging table and glue it before transferring it to the drying equipment for drying. This will cause the electronic chip to encounter dust and other pollution sources in the air during the transfer process, thereby causing the electronic chip to be contaminated and affecting the yield rate of the electronic chip. At the same time, it takes a certain amount of time for the electronic chip to be transferred from the glue application to the drying equipment, thereby affecting the packaging efficiency of the electronic chip. The present invention arranges a temperature control component in the packaging box to control the heating and cooling of the packaging box, and controls the expansion and contraction of the temperature control telescopic protection plate group by connecting the heating plate with the memory metal to perform the glue application and drying of the electronic chip. At the same time, the heat transfer plate with one end being insulated is connected to the thermal switch bimetallic strip, so that the temperature in the packaging box completely dries the glue on the electronic chip, and the temperature of the bimetallic strip reaches a critical value and bends to disconnect the circuit. At this time, the memory metal is no longer subjected to the heat transmitted by the heat transfer plate, and the memory metal loses heat and begins to shorten, thereby controlling the telescopic plate connected thereto to achieve the effect of controlling the shortening of the temperature control telescopic plate group. At the same time, the vacuum suction cup seals the electronic chip when the packaging box is drying it. The storage space in the packaging box is a closed space, and the vacuum suction cup forms a negative pressure in the storage space. When the temperature-controlled telescopic plate group is shortened, the air outside the storage space flows rapidly into the storage space to quickly cool the temperature in the box. Thereafter, the packaging box moves to the top of the material table as the track rotates, and receives the induction switch signal of the vacuum suction cup on the material table. The vacuum suction cup temporarily disconnects the circuit, and the electronic chip moves from the vacuum suction cup into the material picking space of the material table. The present invention uses the above device to automate the process of gluing and drying the electronic chip without the need for transfer, thereby improving the packaging efficiency of the electronic chip and preventing the electronic chip from being contaminated during the transfer process, thereby improving the packaging yield of the electronic chip.

[0006] Furthermore, a heating wire is provided in the heating plate, and the heating wire is connected to the circuit by the temperature control component. The upper parts of the opposite side walls of the packaging box are concavely provided with strip grooves, the two strip grooves are arranged opposite to each other, and the strip grooves extend along the width direction of the corresponding side walls, and one end of each temperature-controlled telescopic plate group is fixedly connected to the corresponding strip groove, and the two ends of each strip groove are vertically provided with a connected slide groove, the slide groove is opened at the upper part of the inner side wall of the strip groove, and the two ends of each slide groove are respectively vertically connected to the two strip grooves, and the two sides of the temperature-controlled telescopic plate group are respectively slidably arranged in the two slide grooves; the sum of the lengths of the temperature-controlled telescopic plate group after extension is equal to the length of the glue dispensing guide space, the temperature-controlled telescopic plate group protrudes into the slide grooves located at the two ends of the blind groove, and the width of the temperature-controlled telescopic plate group is greater than the width of the glue dispensing guide space, thereby ensuring that the temperature-controlled telescopic plate group can completely cover the glue dispensing guide space when extended, and completely seal the storage space, so that the heat generated by the heating plate does not escape outward, so that the temperature in the packaging box rises rapidly, the glue on the electronic chip is quickly dried, and the packaging efficiency of the electronic chip is improved.

[0007] Furthermore, the temperature-controlled telescopic plate group is composed of a telescopic plate group and a memory metal. The telescopic plate group includes a first telescopic plate, a second telescopic plate and a third telescopic plate, all of which are hollow inside. The volume of the cavity of the third telescopic plate is larger than the volume of the cavity of the second telescopic plate, and the volume of the cavity of the second telescopic plate is larger than the volume of the cavity of the first telescopic plate. The third telescopic plate is slidably sleeved on the second telescopic plate, and the second telescopic plate is slidably sleeved on the first telescopic plate. The first telescopic plate and the second telescopic plate are both provided with anti-dropping clips at the farthest ends away from the strip groove. The first telescopic plate is fixed in the strip groove, and the memory metal is inserted into the cavity. The first telescopic plate is connected to the second telescopic plate cavity, and a supporting side wall is formed on the side of the third telescopic plate away from the strip groove. One end of the memory metal is fixedly connected in the corresponding strip groove, and the other end protrudes into the cavity of the third telescopic plate and extends to the supporting side wall of the third telescopic plate.

[0008] Furthermore, one end of each memory metal is fixedly connected in the strip groove and vertically connected to the heat conducting plate. The heat conducting plate includes a heat absorbing plate and a heat transfer plate vertically connected to the heat absorbing plate. The heat transfer plate extends downward in a direction perpendicular to the strip groove. The upper end of each heat transfer plate is fixedly connected to the end of the corresponding memory metal. The heat absorbing plate is vertically arranged at the lower end of the heat transfer plate. The heat absorbing plate is parallel to the heating plate and extends to the bottom center of the storage space. The heat absorbing plate is located below the heating plate, and the top surface of the heat absorbing plate contacts the bottom surface of the heating plate. The heat absorbing plate is located below the heating plate and can quickly transfer the heat of the heating plate to the memory metal through the heat transfer plate. After the electronic chip is glued, the elongation of the memory metal is controlled by the heat transfer of the heat conducting plate, and then the storage space of the temperature control telescopic plate combination is controlled, so that the storage space of the sealed packaging box is quickly raised in the packaging box. One end of the memory metal is fixed in the blind groove and connected to the heat transfer plate below. The heat generated by the heating wire in the heating plate can be transferred to the memory metal. At the same time, the other end of the memory metal is connected to the temperature control telescopic plate combination. The farthest end is connected, the temperature-controlled telescopic plate group is composed of three telescopic plates of different sizes which are sequentially arranged, and the two telescopic plates close to the blind groove are cavity-shaped, and the third telescopic plate farthest from the blind groove is closed. The farthest end of the memory metal is fixedly connected to the third telescopic plate. The elongation and shortening of the memory metal is controlled by whether the temperature control component transfers heat to the memory metal, and then the elongation and shortening of the telescopic plate group are controlled. When the temperature in the packaging box dries the glue of the electronic chip, the bimetallic strip is bent by heat to disconnect the circuit, and the memory metal is shortened without being subjected to heat transfer. One end of the memory metal is fixed in the blind groove, and the other end is fixedly connected to the active end of the temperature-controlled telescopic plate group, thereby shortening the temperature-controlled telescopic plate group. When the glue dispensing is completed, the bimetallic strip cools and straightens the connecting circuit, the electric heating wire is heated, and the heat transfer plate transfers heat to the memory metal. The memory metal is heated and elongated, driving the telescopic plate group to elongate. At this time, the temperature-controlled telescopic plate group completely covers the glue dispensing guide space, and at the same time seals the storage space to prevent the heat generated by the heating plate from escaping outward, and the packaging box quickly heats up to dry the glue of the electronic chip.

[0009] Furthermore, the temperature control component is connected to the heat transfer plate through the bimetallic strip of the thermal switch. After the temperature control component is powered on, the bimetallic strip is heated and heated, and then the heat transfer plate is used to heat the memory metal. After the bimetallic strip is heated, it bends and disconnects the circuit, so that the memory metal gradually cools down, drives the temperature control telescopic plate group to condense, and then the abutting side walls of the two temperature control telescopic plate groups move away from each other to form a glue dispensing guide space. After the temperature control component is powered off, the bimetallic strip gradually cools down and straightens, and then the circuit is connected again to heat up. The heat transfer plate conducts heat to make the memory metal straighten when heated, and the temperature control telescopic plate group stretches to seal the glue dispensing guide space; the bimetallic strip is connected to the bimetallic strip through the insulating end of the heat transfer plate. When the glue of the electronic chip in the packaging box is dried, the bimetallic strip of the temperature control component is bent by the heat transferred by the heat transfer plate and then disconnects the circuit and stops heating. When the packaging box enters the bottom of the glue dispensing mechanism and the glue dispensing is completed, the bimetallic strip of the temperature control component is cooled down, straightens the connecting circuit and starts heating.

[0010] Furthermore, the vacuum suction cup is located at the exact center of the bottom of the storage space, and a negative pressure adsorption surface is formed on the vacuum suction cup, and the negative pressure adsorption surface is located directly below the glue dispensing guide space; the vacuum suction cup forms a negative pressure adsorption surface to fix the electronic chip on the vacuum suction cup and is located directly below the glue dispensing mechanism, ensuring that the glue dispensing mechanism can accurately dispense glue to the electronic chip.

[0011] Furthermore, the support assembly includes two base plates and two support frames respectively connected to the two base plates, each support frame includes two support plates, and the two support plates are respectively vertically fixed to the opposite sides of the corresponding base plates, and an arc-shaped support surface is formed on the top of each support plate.

[0012] Furthermore, the transmission assembly includes two transmission wheels and a crawler track. The two transmission wheels are respectively arranged at the top ends of two support frames. Circular support wheels are provided on both sides of the transmission wheels. The two support wheels are respectively arranged on two arc-shaped support surfaces at the top ends of the corresponding support frames. The crawler track is arranged on the two transmission wheels, and the inner side of the crawler track is movably connected to the two transmission wheels. A plurality of packaging boxes are provided on the outer side of the crawler track.

[0013] Furthermore, a material table is provided below the outer side of the crawler belt, and the opposite ends of the material table are respectively fixed on two supporting frames. A material receiving space is formed on the upper surface of the material table, and a buffer layer is provided at the bottom of the material receiving space. A vacuum suction cup induction switch is provided in the material table. When the electronic chip in the packaging box is dried, the packaging box is placed above the material table under the drive of the crawler belt. At this time, the temperature-controlled telescopic plate group is opened, and the vacuum suction cup temporarily stops adsorption after receiving the vacuum suction cup induction switch signal. The electronic chip enters the material picking space in the material table from the packaging box to complete the packaging of the electronic chip.

[0014] Furthermore, after the temperature-controlled telescopic sealing plate is heated and stretched, it can seal the glue dispensing guide space, so that the storage space forms a closed environment, and the vacuum suction cup is activated in the packaging box to form a negative pressure space in the storage space relative to the external space; when the electronic chip is glued, the temperature-controlled telescopic plate group seals the storage space, and the vacuum suction cup forms a negative pressure space in the storage space. After the electronic chip is dried, the temperature-controlled telescopic plate group is opened, and a pressure difference is formed between the storage space and the external space. The air in the external space quickly enters the storage space, thereby quickly cooling the packaging box.

[0015] The beneficial effects of the present invention are as follows:

[0016] 1. By dispensing glue in the packaging box, the packaging process does not need to be transferred to other drying equipment, avoiding contamination during the transfer of electronic chips, and improving the packaging yield of electronic chips. Automated packaging is achieved by integrating the dispensing mechanism and the conveying mechanism; the dispensing mechanism is arranged above the conveying mechanism to achieve seamless connection between the dispensing and drying processes, thereby improving the packaging efficiency and the yield of electronic chips.

[0017] 2. Accurate temperature control and automatic sealing are achieved through the temperature-controlled telescopic plate group and memory metal: the temperature-controlled telescopic plate group seals the glue-dispensing guide space after being heated, so that the heat in the packaging box does not escape and heats up quickly. The memory metal connects the heating plate and the temperature-controlled telescopic plate group to achieve temperature sensing and automatic sealing and opening.

[0018] 3. The electronic chip is fixed and automatically picked up through the vacuum suction cup and the material table: the vacuum suction cup forms a negative pressure in the packaging box, fixes the electronic chip and quickly cools the packaging box. The material table and the vacuum suction cup induction switch cooperate to realize automatic material picking and improve production efficiency.

[0019] 4. Temperature sensing and circuit control are achieved through heat conduction plate and thermal switch: the heat conduction plate transfers heat to the memory metal, and the thermal switch senses temperature changes to switch the circuit on and off, achieving precise temperature control and automatic switching of the circuit.

[0020] 5. The smooth movement and stable support of the packaging box are achieved through the transmission system and support components: the crawler is connected to the transmission wheel to ensure the smooth movement of the packaging box on the support component, ensuring the continuity and stability of the packaging process. At the same time, multiple packaging boxes are designed to achieve batch processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention will be further described below in conjunction with the accompanying drawings.

[0022] Figure 1 It is a schematic diagram of an embodiment of the present invention;

[0023] Figure 2 It is a schematic diagram of the temperature control telescopic plate combination;

[0024] Figure 3 This is a schematic diagram of the memory metal after stretching;

[0025] Figure 4 yes Figure 3 Enlarged view of point A in the middle;

[0026] Figure 5 It is a schematic diagram of the storage space in the packaging box;

[0027] Figure 6 This is a schematic diagram of a memory metal plug-in temperature control telescopic plate assembly;

[0028] Figure 7 Schematic diagram of the heat conducting plate structure;

[0029] Figure 8 This is a schematic diagram of the temperature control component circuit disconnection;

[0030] Fig. 9 It is a schematic diagram of the temperature control component circuit connection.

[0031] In the figure: 1. Glue dispensing mechanism; 2. Conveying mechanism; 3. Support assembly; 4. Transmission assembly; 5. Packaging box; 6. Glue dispensing guide space; 7. Storage space; 8. Heating plate; 9. Vacuum suction cup; 10. Heat conducting plate; 101. Heat transfer plate; 102. Heat absorbing plate; 11. Temperature control telescopic plate group; 12. Memory metal; 13. First telescopic plate; 14. Second telescopic plate; 15. Third telescopic plate; 16. Heating wire; 17. Negative pressure adsorption surface; 18. Bottom plate; 19. Support frame; 20. Arc-shaped support surface; 21. Transmission wheel; 22. Support wheel; 23. Track; 24. Material table. DETAILED DESCRIPTION

[0032] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0033] Example 1: Please refer to Figures 1 to 9The embodiment of the present invention provides a processing mechanism for electronic chips, including a dispensing mechanism 1 and a conveying mechanism 2. The dispensing mechanism 1 is arranged above the conveying mechanism 2. The conveying mechanism 2 includes a supporting assembly 3 and a transmission assembly 4. The transmission assembly 4 is installed on the supporting assembly 3. A plurality of packaging boxes 5 are arranged on the transmission assembly 4. The packaging box 5 is located below the dispensing mechanism 1. A storage space 7 is formed in the packaging box 5. A heating plate 8, a vacuum suction cup 9, two heat conducting plates 10 and two temperature-controlled telescopic plate groups 11 are arranged inside the packaging box 5. The heating plate 8 is arranged on the bottom surface of the storage space 7. The vacuum suction cup 9 is arranged at the center of the surface of the heating plate 8. The two heat conducting plates 10 are respectively embedded in the opposite side walls of the packaging box 5. The two temperature-controlled telescopic plate groups 11 are arranged opposite to each other and are respectively arranged on the top of the opposite side walls of the packaging box 5. The two temperature-controlled telescopic plate groups 11 are used to extend toward each other and abut against each other when heated to close the storage space 7.

[0034] According to the prior art, when electronic chips are packaged with glue, the electronic chips need to be loaded on a packaging table, glued and then transferred to a drying device for drying. This will cause the electronic chips to encounter dust and other pollution sources in the air during the transfer process, thereby causing the electronic chips to be contaminated and affecting the yield rate of the electronic chips. At the same time, it takes a certain amount of time to transfer the electronic chips from the glue application to the drying equipment, thereby affecting the packaging efficiency of the electronic chips. The present invention arranges a temperature control component in the packaging box 5 to control the heating and cooling of the packaging box 5, controls the expansion and contraction of the temperature-controlled telescopic protection plate group 11 by connecting the heating plate 8 with the memory metal 12, thereby performing the dispensing and drying of the electronic chip, and at the same time, through the connection of the heat transfer plate 101 with one end being insulated and the thermal switch bimetallic strip, the temperature in the packaging box 5 causes the glue on the electronic chip to be completely dried, and the temperature of the bimetallic strip reaches a critical value and bends, thereby disconnecting the circuit. At this time, the memory metal 12 is no longer subjected to the heat transmitted by the heat transfer plate 101, and the memory metal 12 loses heat and begins to shorten, thereby controlling the telescopic plate connected thereto to achieve the effect of controlling the shortening of the temperature-controlled telescopic plate group 11. At the same time, the vacuum suction cup 9 is in the packaging box 5 when drying the electronic chip. The storage space 7 in the packaging box 5 is a closed space, and the vacuum suction cup 9 forms a negative pressure in the storage space 7. When the temperature-controlled telescopic plate group 11 is shortened, the air outside the storage space 7 flows rapidly into the storage space 7 to quickly cool the temperature in the box. Thereafter, the packaging box 5 moves to the top of the material table 24 as the track 23 rotates, and receives the induction switch signal of the vacuum suction cup 9 on the material table 24. The vacuum suction cup 9 temporarily disconnects the circuit, and the electronic chip moves out of the vacuum suction cup 9 and enters the material picking space of the material table 24. The present invention uses the above device to automate the process of dispensing and drying the electronic chip without the need for transfer, thereby improving the packaging efficiency of the electronic chip and preventing the electronic chip from being contaminated during the transfer process, thereby improving the packaging yield of the electronic chip.

[0035] A heating wire 16 is provided in the heating plate 8, and the heating wire 16 is connected to the circuit by the temperature control component. The upper parts of the opposite side walls of the packaging box 5 are concavely provided with strip grooves 25, and the two strip grooves 25 are arranged opposite to each other. The strip grooves 25 extend along the width direction of the corresponding side walls. One end of each temperature-controlled telescopic plate group 11 is fixedly connected to the corresponding strip groove 25, and both ends of each strip groove 25 are vertically provided with connecting slide grooves, which are opened at the upper part of the inner side wall of the strip groove 25. The two ends of each slide groove are respectively vertically connected to the two strip grooves 25, and the two sides of the temperature-controlled telescopic plate group 11 are respectively It is slidably arranged in two slide grooves; the sum of the lengths of the temperature-controlled telescopic plate group 11 after extension is equal to the length of the glue dispensing guide space 6, the temperature-controlled telescopic plate group 11 protrudes into the slide grooves located at both ends of the blind groove, and the width of the temperature-controlled telescopic plate group 11 is greater than the width of the glue dispensing guide space 6, thereby ensuring that the temperature-controlled telescopic plate group 11 can completely cover the glue dispensing guide space 6 when extended, and completely seal the storage space 7, so that the heat generated by the heating plate 8 does not escape to the outside, so that the temperature inside the packaging box 5 rises rapidly, and the glue on the electronic chip is quickly dried, thereby improving the packaging efficiency of the electronic chip.

[0036] The temperature control telescopic plate group 11 is composed of a telescopic plate group and a memory metal 12. The telescopic plate group includes a first telescopic plate 13, a second telescopic plate 14 and a third telescopic plate 15, all of which are hollow inside. The volume of the cavity of the third telescopic plate 15 is larger than the volume of the cavity of the second telescopic plate 14. The volume of the cavity of the second telescopic plate 14 is larger than the volume of the cavity of the first telescopic plate 13. The third telescopic plate 15 is slidably sleeved on the second telescopic plate 14, and the second telescopic plate 14 is slidably sleeved on the first telescopic plate 13. The first telescopic plate 13 and the second telescopic plate 14 are both provided with anti-slipping devices at the farthest ends away from the strip groove 25. The first telescopic plate 13 is fixed in the strip groove 25, the memory metal 12 is inserted into the cavity, the first telescopic plate 13 is connected to the second telescopic plate 14 cavity, and the third telescopic plate 15 is formed with a supporting side wall on the side away from the strip groove 25. One end of the memory metal 12 is fixedly connected to the corresponding strip groove 25, and the other end protrudes into the cavity of the third telescopic plate 15 and extends to the supporting side wall of the third telescopic plate 15; one end of the memory metal 12 is fixed in the blind groove and connected to the heat transfer plate 101 below, so that the heat generated by the heating wire 16 in the heating plate 8 can be transferred to the memory metal 12. At the same time, the other end of the memory metal 12 is connected to the farthest end of the temperature control telescopic plate group 11. The temperature control telescopic plate group 11 is composed of three telescopic plates of different sizes, and the two telescopic plates close to the blind groove are cavity-shaped, and the third telescopic plate 15 far away from the blind groove is closed. The farthest end of the memory metal 12 is fixedly connected to the third telescopic plate 15. The elongation and shortening of the memory metal 12 are controlled by whether the temperature control component transfers heat to the memory metal 12, and then the elongation and shortening of the telescopic plate group are controlled. When the temperature in the packaging box 5 dries the glue of the electronic chip, the bimetallic strip is bent by heat to disconnect the circuit, and the memory The metal 12 is not shortened by heat transfer, one end of the memory metal 12 is fixed in the blind groove, and the other end is fixedly connected to the movable end of the temperature-controlled telescopic plate group 11, thereby shortening the temperature-controlled telescopic plate group 11. After the dispensing is completed, the bimetallic strip cools and straightens the connecting line, the heating wire is heated, and the heat transfer plate 101 transfers heat to the memory metal 12. The memory metal 12 is heated and elongated, driving the telescopic plate group to elongate. At this time, the temperature-controlled telescopic plate group 11 completely covers the dispensing guide space 6 and seals the storage space 7 to prevent the heat generated by the heating plate 8 from escaping outward. The packaging box 5 quickly heats up and dries the glue of the electronic chip.

[0037] One end of each memory metal 12 is fixedly connected in the strip groove 25 and vertically connected to the heat conducting plate 10. The heat conducting plate 10 includes a heat absorbing plate 102 and a heat transfer plate 101 vertically connected to the heat absorbing plate. The heat transfer plate 101 extends downward in a direction perpendicular to the strip groove 25. The upper end of each heat transfer plate 101 is fixedly connected to the end of the corresponding memory metal 12. The heat absorbing plate 102 is vertically arranged at the lower end of the heat transfer plate 101. The heat absorbing plate 102 is parallel to the heating plate 8 and faces the storage space. 7 extends from the bottom center, the heat absorbing plate 102 is located below the heating plate 8, and the top surface of the heat absorbing plate 102 contacts the bottom surface of the heating plate 8; the heat absorbing plate 102 is located below the heating plate 8 and can quickly transfer the heat of the heating plate 8 to the memory metal 12 through the heat transfer plate 101. After the electronic chip is glued, the heat transfer of the heat conducting plate 10 is used to control the elongation of the memory metal 12, thereby controlling the temperature control telescopic plate group 11 to close, and the storage space 7 of the sealing box 5 is sealed, causing the inside of the sealing box 5 to rise rapidly.

[0038] The temperature control component is connected to the heat transfer plate 8 through the bimetallic strip of the thermal switch. After the temperature control component is powered on, the bimetallic strip is heated and heated, and then the heat transfer plate 101 is used to heat the memory metal 12. After the bimetallic strip is heated, it bends and disconnects the circuit, so that the memory metal 12 gradually cools down, drives the temperature control telescopic plate group 11 to condense, and then the abutting side walls of the two temperature control telescopic plate groups 11 move away from each other to form a glue dispensing guide space 6. After the temperature control component is powered off, the bimetallic strip gradually cools down and straightens, and then the circuit is connected again to heat up. The heat transfer plate conducts heat to make the memory metal 12 straighten when heated, and the temperature control telescopic plate group 11 extends to seal the glue dispensing guide space 6; the bimetallic strip is connected to the insulating end of the heat transfer plate 101. When the glue of the electronic chip in the packaging box 5 is dried, the bimetallic strip of the temperature control component is bent by the heat transferred by the heat transfer plate 101 and then disconnects the circuit and stops heating. When the packaging box 5 enters the bottom of the glue dispensing mechanism 1 and the glue dispensing is completed, the bimetallic strip of the temperature control component is cooled down, straightens the connecting circuit and starts heating.

[0039] The vacuum suction cup 9 is located at the center of the bottom of the storage space 7, and a negative pressure adsorption surface 17 is formed on the vacuum suction cup 9, and the negative pressure adsorption surface 17 is located directly below the glue dispensing guide space 6; the vacuum suction cup 9 forms a negative pressure adsorption surface 17 to fix the electronic chip on the vacuum suction cup 9 and is located directly below the glue dispensing mechanism 1 to ensure that the glue dispensing mechanism 1 can accurately dispense glue on the electronic chip.

[0040] The support assembly 3 includes two base plates 18 and two support frames 19 respectively connected to the two base plates 18. Each support frame 19 includes two support plates, which are vertically fixed to the opposite sides of the corresponding base plates 18. An arc-shaped support surface 20 is formed on the top of each support plate.

[0041] The transmission assembly 4 includes two transmission wheels 21 and a crawler track 23. The two transmission wheels 21 are respectively arranged at the top ends of the two support frames 19. Circular support wheels 22 are arranged on both sides of the transmission wheels 21. The two support wheels 22 are respectively arranged on the two arc-shaped support surfaces 20 at the top ends of the corresponding support frames 19. The crawler track 23 is sleeved on the two transmission wheels 21, and the inner side of the crawler track 23 is movably connected to the two transmission wheels 21. The outer side of the crawler track 23 is provided with multiple packaging boxes 5.

[0042] A material table 24 is provided below the outer side of the crawler belt 23, and the opposite ends of the material table 24 are respectively fixed on two support frames 19. A material receiving space is formed on the upper surface of the material table 24, and a buffer layer is provided at the bottom of the material receiving space. A vacuum suction cup induction switch is provided in the material table 24. When the electronic chip in the packaging box 5 is dried, the packaging box 5 is placed above the material table 24 under the drive of the crawler belt 23. At this time, the temperature-controlled telescopic plate group 11 is opened, and the vacuum suction cup 9 receives the induction switch signal of the vacuum suction cup 9 and temporarily stops adsorption. The electronic chip enters the material taking space in the material table 24 from the packaging box 5 to complete the packaging of the electronic chip.

[0043] After the temperature-controlled telescopic sealing plate 11 is heated and stretched, it can seal the glue dispensing guide space 6, so that the storage space 7 forms a closed environment, and the vacuum suction cup 9 is started in the packaging box 5 to form a negative pressure space in the storage space 7 relative to the external space; when the electronic chip is glued, the temperature-controlled telescopic plate group 11 seals the storage space 7, and the vacuum suction cup 9 forms a negative pressure space in the storage space 7. After the electronic chip is dried, the temperature-controlled telescopic plate group 11 is opened, and a pressure difference is formed between the storage space 7 and the external space. The air in the external space quickly enters the storage space 7, thereby quickly cooling the packaging box 5.

[0044] Example 2: Comparative Example 1, another embodiment of the present invention is that the dispensing mechanism 1 is a mechanism that can perform X-axis and Y-axis movement, and is provided with multiple dispensing heads. The packaging box 5 is provided with multiple vacuum suction cups 9. When the packaging box 5 is located below the dispensing mechanism 1, the multiple dispensing heads of the dispensing mechanism 1 can dispense glue for multiple electronic chips on the multiple vacuum suction cups 9 in the packaging box 5. After the dispensing is completed, the track 23 drives the packaging box 5 to rotate above the material table 24. At this time, the multiple vacuum suction cups 9 in the packaging box 5 receive the vacuum suction cup induction switch signal, and the multiple vacuum suction cups 9 temporarily stop adsorbing the electronic chip, and the electronic chip enters the material picking space of the material table 24 from the packaging box 5 at the same time. In this embodiment, multiple electronic chips can be dispensed and packaged at the same time, which greatly improves the packaging efficiency of electronic chips.

[0045] For example, it is particularly important that, in one embodiment, the upper part of the supporting side wall of one third telescopic plate 15 is concavely provided with a strip groove, and the lower part is provided with an arched elastic sheet, and the lower part of the supporting side wall of the other third telescopic plate 15 is concavely provided with a strip groove, and the upper part is provided with an arched elastic sheet. The two arched elastic sheets are respectively pressed into the strip groove of the supporting side wall on the opposite side. The end of the memory metal 12 is movably inserted in the supporting side wall and located in the arched elastic sheet, and the memory metal 12 is provided with an anti-slip protrusion at the adjacent end, and the anti-slip protrusion is used to prevent the end of the memory metal 12 from slipping out of the space area surrounded by the arched elastic sheet, that is, to prevent the end of the memory metal 12 from detaching from the supporting side wall. The arched elastic sheet extends along the length direction of the supporting side wall and is parallel to the length direction of the strip groove 25. The middle part of the lower side of the arched elastic sheet on the upper side and the middle part of the upper side of the arched elastic sheet on the lower side are both provided with an air-blocking adhesive layer.

[0046] After the end of the memory metal 12 is heated and stretched and drives the temperature-controlled telescopic plate group 11 to stretch to the maximum, the end of the memory metal 12 is stretched and drives the two abutting side walls to abut each other, and further, the end of the memory metal 12 abuts against the arched elastic sheet and slightly deforms so that the arched elastic sheet fits tightly against the bottom wall of the corresponding strip groove. In this process, the air-blocking adhesive layers of the two upper and lower arched elastic sheets pass over each other and adhere to each other's side walls. At this point, two sealed areas at the upper and lower strip grooves and two air-leakage-proof areas of the two air-blocking adhesive layers are formed, thereby preventing gas from entering the accommodating space 7 and improving the sealing effect.

[0047] The above-mentioned embodiments only express several embodiments of the present invention, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be based on the attached claims.

Claims

1. A processing mechanism for electronic chips, characterized in that: The invention comprises a dispensing mechanism (1) and a conveying mechanism (2), wherein the dispensing mechanism (1) is arranged above the conveying mechanism (2), the conveying mechanism (2) comprises a supporting assembly (3) and a transmission assembly (4), the transmission assembly (4) is mounted on the supporting assembly (3), a plurality of packaging boxes (5) are arranged on the transmission assembly (4), the packaging box (5) is located below the dispensing mechanism (1), a storage space (7) is formed in the packaging box (5), and a heating plate (8), a vacuum suction cup (9), two The invention relates to a heat conducting plate (10) and two temperature-controlled telescopic plate groups (11), wherein the heating plate (8) is arranged on the bottom surface of the storage space (7), the vacuum suction cup (9) is arranged at the center of the surface of the heating plate (8), the two heat conducting plates (10) are respectively embedded in the opposite side walls of the packaging box (5), the two temperature-controlled telescopic plate groups (11) are arranged opposite to each other and are respectively arranged on the top of the opposite side walls of the packaging box (5), and the two temperature-controlled telescopic plate groups (11) are used to extend toward each other and abut against each other when heated to close the storage space (7).

2. The electronic chip processing mechanism according to claim 1, characterized in that: A heating wire (16) is arranged in the heating plate (8), and the heating wire (16) is connected to the circuit by the temperature control component. The upper parts of the opposite side walls of the packaging box (5) are both concavely provided with strip grooves (25), and the two strip grooves (25) are arranged opposite to each other. The strip grooves (25) extend along the width direction of the corresponding side walls. One end of each temperature control telescopic plate group (11) is fixedly connected in the corresponding strip groove (25), and both ends of each strip groove (25) are vertically provided with connecting slide grooves, which are opened in the upper part of the inner side wall of the strip groove (25). The two ends of each slide groove are respectively vertically connected to the two strip grooves (25), and the two sides of the temperature control telescopic plate group (11) are respectively slidably arranged in the two slide grooves.

3. The electronic chip processing mechanism according to claim 1, characterized in that: The temperature control telescopic plate group (11) is composed of a telescopic plate group and a memory metal (12). The telescopic plate group includes a first telescopic plate (13), a second telescopic plate (14) and a third telescopic plate (15), all of which are hollow inside. The volume of the cavity of the third telescopic plate (15) is larger than the volume of the cavity of the second telescopic plate (14). The volume of the cavity of the second telescopic plate (14) is larger than the volume of the cavity of the first telescopic plate (13). The third telescopic plate (15) is slidably mounted on the second telescopic plate (14). The second telescopic plate (14) is slidably mounted on the first telescopic plate (13). The telescopic plate (13) and the second telescopic plate (14) are both provided with anti-dropping clamps at the farthest ends away from the strip groove (25); the first telescopic plate (13) is fixed in the strip groove (25); the memory metal (12) is inserted into the cavity; the first telescopic plate (13) and the second telescopic plate (14) are connected in the cavity; a supporting side wall is formed on one side of the third telescopic plate (15) away from the strip groove (25); one end of the memory metal (12) is fixedly connected in the corresponding strip groove (25); the other end protrudes into the cavity of the third telescopic plate (15) and extends to the supporting side wall of the third telescopic plate (15).

4. The electronic chip processing mechanism according to claim 3, characterized in that: One end of each memory metal (12) is fixedly connected in the strip groove (25) and vertically connected to the heat conducting plate (10); the heat conducting plate (10) comprises a heat absorbing plate (102) and a heat transfer plate (101) vertically connected to the heat absorbing plate; the heat transfer plate (101) extends downward in a direction vertical to the strip groove (25); the upper end of each heat transfer plate (101) is fixedly connected to the end of the corresponding memory metal (12); the heat absorbing plate (102) is vertically arranged at the lower end of the heat transfer plate (101); the heat absorbing plate (102) is parallel to the heating plate (8) and extends toward the bottom center of the storage space (7); the heat absorbing plate (102) is located below the heating plate (8); and the top surface of the heat absorbing plate (102) is in contact with the bottom surface of the heating plate (8).

5. The electronic chip processing mechanism according to claim 2, characterized in that: The temperature control component is connected to the heat transfer plate (8) via a bimetallic strip of a thermal switch. When the temperature control component is powered on, the bimetallic strip is heated and heated, and then the heat transfer plate (101) is used to heat the memory metal (12). When the bimetallic strip is heated to a preset temperature value, it bends and disconnects the circuit, thereby causing the memory metal (12) to gradually cool down, driving the temperature control telescopic plate group (11) to condense, thereby causing the abutting side walls of the two temperature control telescopic plate groups (11) to move away from each other to form a glue dispensing guide space (6) between the two. After the temperature control component is powered off, the bimetallic strip gradually cools down and becomes straight, and then the circuit is connected again to increase the temperature. The heat is conducted through the heat transfer plate (101) so that the memory metal (12) is heated and straightened, and the temperature control telescopic plate group (11) is extended to close the glue dispensing guide space (6).

6. The electronic chip processing mechanism according to claim 2, characterized in that: A negative pressure adsorption surface (17) is formed on the vacuum suction cup (9), and the negative pressure adsorption surface (17) is located directly below the glue dispensing guide space (6).

7. The electronic chip processing mechanism according to claim 1, characterized in that: The support assembly (3) comprises two base plates (18) and two support frames (19) respectively connected to the two base plates (18). Each support frame (19) comprises two support plates. The two support plates are respectively vertically fixed to opposite sides of the corresponding base plate (18). An arc-shaped support surface (20) is formed on the top of each support plate.

8. The electronic chip processing mechanism according to claim 1, characterized in that: The transmission assembly (4) comprises two transmission wheels (21) and a crawler belt (23). The two transmission wheels (21) are respectively arranged at the top ends of two support frames (19). Circular support wheels (22) are arranged on both sides of the transmission wheels (21). The two support wheels (22) are respectively arranged on two arc-shaped support surfaces (20) at the top ends of the corresponding support frames (19). The crawler belt (23) is sleeved on the two transmission wheels (21), and the inner side of the crawler belt (23) is movably connected to the two transmission wheels (21). The outer side of the crawler belt (23) is provided with a plurality of packaging boxes (5).

9. The electronic chip processing mechanism according to claim 1, characterized in that: A material platform (24) is provided below the outer side of the crawler (23), and opposite ends of the material platform (24) are respectively fixed on two support frames (19). A material receiving space is formed in a concave shape on the upper surface of the material platform (24), and a buffer layer is provided at the bottom of the material receiving space. A vacuum suction cup induction switch is provided inside the material platform (24).

10. The electronic chip processing mechanism according to claim 6, characterized in that: After the temperature-controlled telescopic plate group (11) is heated and stretched, it can seal the dispensing guide space (6), so that the storage space (7) forms a closed environment, and the vacuum suction cup (9) is activated in the packaging box (5) so that the storage space (7) forms a negative pressure space relative to the external space.

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